- All sections
- H - Electricity
- H01C - Resistors
- H01C 13/02 - Structural combinations of resistors
Patent holdings for IPC class H01C 13/02
Total number of patents in this class: 135
10-year publication summary
|
13
|
14
|
10
|
14
|
14
|
12
|
6
|
6
|
7
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Rohm Co., Ltd. | 6385 |
20 |
| KOA Corporation | 403 |
10 |
| ABB AG | 333 |
4 |
| Integrated Device Technology, Inc. | 700 |
4 |
| Guangdong Fullde Electronics Co., Ltd. | 20 |
4 |
| Siemens AG | 24563 |
3 |
| Renesas Electronics Corporation | 6152 |
3 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40787 |
3 |
| Samsung Electro-mechanics Co., Ltd. | 5234 |
3 |
| Suncall Corporation | 178 |
3 |
| Samsung Electronics Co., Ltd. | 139798 |
2 |
| Lexmark International, Inc. | 1706 |
2 |
| Hamilton Sundstrand Corporation | 4751 |
2 |
| ABB S.p.A. | 451 |
2 |
| Cirrus Logic, Inc. | 1749 |
2 |
| KEMET Electronics Corporation | 337 |
2 |
| Maschinenfabrik Reinhausen GmbH | 745 |
2 |
| State Grid Corporation of China | 1349 |
2 |
| Tatsumi Ryoki Co., Ltd | 103 |
2 |
| Ripd IP Assets Ltd | 3 |
2 |
| Other owners | 58 |