- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
Patent holdings for IPC class H01L 21/301
Total number of patents in this class: 1978
10-year publication summary
|
116
|
84
|
132
|
167
|
126
|
123
|
126
|
124
|
149
|
51
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Lintec Corporation | 2004 |
362 |
| Hamamatsu Photonics K.K. | 4601 |
153 |
| Nitto Denko Corporation | 8465 |
131 |
| The Furukawa Electric Co., Ltd. | 3700 |
119 |
| Resonac Corporation | 3210 |
87 |
| Hitachi Chemical Company, Ltd. | 2268 |
62 |
| Applied Materials, Inc. | 20036 |
57 |
| Tokyo Seimitsu Co., Ltd. | 389 |
54 |
| Towa Corporation | 323 |
53 |
| Yamaha Hatsudoki Kabushiki Kaisha | 2213 |
42 |
| Tokyo Electron Limited | 13523 |
39 |
| Mitsui Chemicals Tohcello, Inc. | 243 |
34 |
| Mitsuboshi Diamond Industrial Co., Ltd. | 146 |
30 |
| Showa Denko Materials Co., Ltd. | 624 |
29 |
| Disco Corporation | 1932 |
28 |
| Denki Kagaku Kogyo Kabushiki Kaisha | 601 |
25 |
| Sumitomo Bakelite Co., Ltd. | 1518 |
24 |
| Denka Company Limited | 2700 |
23 |
| Mitsubishi Electric Corporation | 47602 |
21 |
| Rohm Co., Ltd. | 6747 |
21 |
| Other owners | 584 |