- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
Patent holdings for IPC class H01L 21/301
Total number of patents in this class: 1938
10-year publication summary
|
80
|
116
|
84
|
132
|
167
|
126
|
123
|
126
|
124
|
126
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Lintec Corporation | 2000 |
357 |
| Hamamatsu Photonics K.K. | 4461 |
157 |
| Nitto Denko Corporation | 8337 |
128 |
| The Furukawa Electric Co., Ltd. | 3702 |
119 |
| Resonac Corporation | 2944 |
73 |
| Hitachi Chemical Company, Ltd. | 2331 |
63 |
| Applied Materials, Inc. | 19031 |
57 |
| Tokyo Seimitsu Co., Ltd. | 375 |
57 |
| Towa Corporation | 312 |
51 |
| Tokyo Electron Limited | 13013 |
36 |
| Mitsui Chemicals Tohcello, Inc. | 244 |
34 |
| Disco Corporation | 1885 |
31 |
| Mitsuboshi Diamond Industrial Co., Ltd. | 149 |
31 |
| Yamaha Hatsudoki Kabushiki Kaisha | 2160 |
30 |
| Showa Denko Materials Co., Ltd. | 624 |
29 |
| Denki Kagaku Kogyo Kabushiki Kaisha | 624 |
26 |
| Sumitomo Bakelite Co., Ltd. | 1511 |
24 |
| Denka Company Limited | 2634 |
23 |
| Mitsubishi Electric Corporation | 46672 |
21 |
| Rohm Co., Ltd. | 6518 |
21 |
| Other owners | 570 |