• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/8256 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using technologies not covered by one of groups , or

Patent holdings for IPC class H01L 21/8256

Total number of patents in this class: 57

10-year publication summary

10
8
5
2
1
5
5
10
5
0
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
48760
19
International Business Machines Corporation
62769
7
Intel Corporation
46449
5
Samsung Electronics Co., Ltd.
158842
3
Tokyo Electron Limited
13920
3
Qualcomm Incorporated
93172
2
United Microelectronics Corp.
4516
2
Pragmatic Semiconductor Limited
120
2
Hon Hai Precision Industry Co., Ltd.
4018
1
Semiconductor Energy Laboratory Co., Ltd.
11890
1
Shenzhen China Star Optoelectronics Technology Co., Ltd.
8470
1
Tsinghua University
6245
1
Guangdong Dongbond Technology Co., Ltd
2
1
Institute of Microelectronics, Chinese Academy of Sciences
1472
1
Nanyang Technological University
2231
1
Pragmatic Printing Limited
61
1
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
316
1
United Silicon Carbide, Inc.
51
1
The University of Chicago
1504
1
University of Delaware
371
1
Other owners 2