- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/8256 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using technologies not covered by one of groups , or
Patent holdings for IPC class H01L 21/8256
Total number of patents in this class: 57
10-year publication summary
|
10
|
8
|
5
|
2
|
1
|
5
|
5
|
10
|
5
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48760 |
19 |
| International Business Machines Corporation | 62769 |
7 |
| Intel Corporation | 46449 |
5 |
| Samsung Electronics Co., Ltd. | 158842 |
3 |
| Tokyo Electron Limited | 13920 |
3 |
| Qualcomm Incorporated | 93172 |
2 |
| United Microelectronics Corp. | 4516 |
2 |
| Pragmatic Semiconductor Limited | 120 |
2 |
| Hon Hai Precision Industry Co., Ltd. | 4018 |
1 |
| Semiconductor Energy Laboratory Co., Ltd. | 11890 |
1 |
| Shenzhen China Star Optoelectronics Technology Co., Ltd. | 8470 |
1 |
| Tsinghua University | 6245 |
1 |
| Guangdong Dongbond Technology Co., Ltd | 2 |
1 |
| Institute of Microelectronics, Chinese Academy of Sciences | 1472 |
1 |
| Nanyang Technological University | 2231 |
1 |
| Pragmatic Printing Limited | 61 |
1 |
| Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences | 316 |
1 |
| United Silicon Carbide, Inc. | 51 |
1 |
| The University of Chicago | 1504 |
1 |
| University of Delaware | 371 |
1 |
| Other owners | 2 |