- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/98 - Assembly of devices consisting of solid state components formed in or on a common substrateAssembly of integrated circuit devices
Patent holdings for IPC class H01L 21/98
Total number of patents in this class: 311
10-year publication summary
|
9
|
12
|
6
|
16
|
14
|
25
|
15
|
9
|
18
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Vuereal Inc. | 321 |
42 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10970 |
21 |
| Qualcomm Incorporated | 88095 |
19 |
| Micron Technology, Inc. | 26703 |
8 |
| Tessera, Inc. | 601 |
8 |
| Texas Instruments Incorporated | 19521 |
7 |
| Huawei Technologies Co., Ltd. | 116616 |
7 |
| Invensas Corporation | 610 |
6 |
| Soitec | 1045 |
6 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46308 |
5 |
| Nederlandse Organisatie voor Toegepast-natuurwetenschappelijk Onderzoek TNO | 2393 |
5 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 361 |
5 |
| International Business Machines Corporation | 61840 |
4 |
| Robert Bosch GmbH | 43097 |
4 |
| Raytheon Company | 8459 |
4 |
| STATS ChipPAC Pte. Lte. | 1554 |
4 |
| X-Celeprint Limited | 121 |
4 |
| Apple Inc. | 56633 |
3 |
| Siemens AG | 24304 |
3 |
| Intel Corporation | 46510 |
3 |
| Other owners | 143 |