- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/043 - ContainersSeals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
Patent holdings for IPC class H01L 23/043
Total number of patents in this class: 172
10-year publication summary
|
21
|
17
|
19
|
15
|
15
|
11
|
12
|
7
|
8
|
2
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 45024 |
14 |
| Fuji Electric Co., Ltd. | 4999 |
13 |
| Apple Inc. | 53121 |
6 |
| Texas Instruments Incorporated | 19437 |
5 |
| Mediatek Inc. | 4843 |
5 |
| Samsung Electronics Co., Ltd. | 140010 |
4 |
| Kyocera Corporation | 13418 |
4 |
| Infineon Technologies Americas Corp. | 717 |
4 |
| Intel Corporation | 46219 |
3 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40893 |
3 |
| Semikron Elektronik GmbH & Co., KG | 149 |
3 |
| Amkor Technology Singapore Holding Pte.ltd. | 518 |
3 |
| Deere & Company | 7382 |
2 |
| NEC Corporation | 34608 |
2 |
| Fujitsu Limited | 18424 |
2 |
| Infineon Technologies AG | 8146 |
2 |
| Huawei Technologies Co., Ltd. | 107607 |
2 |
| Murata Manufacturing Co., Ltd. | 23844 |
2 |
| Samsung Electro-mechanics Co., Ltd. | 5239 |
2 |
| Raytheon Company | 8421 |
2 |
| Other owners | 89 |