- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/043 - ContainersSeals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
Patent holdings for IPC class H01L 23/043
Total number of patents in this class: 176
10-year publication summary
|
17
|
19
|
15
|
15
|
11
|
12
|
8
|
8
|
9
|
6
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 48409 |
14 |
| Fuji Electric Co., Ltd. | 5541 |
14 |
| Apple Inc. | 59354 |
6 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 49027 |
6 |
| Texas Instruments Incorporated | 19622 |
5 |
| Mediatek Inc. | 5544 |
5 |
| Kyocera Corporation | 14479 |
4 |
| Samsung Electronics Co., Ltd. | 159298 |
3 |
| Infineon Technologies AG | 8429 |
3 |
| MACOM Technology Solutions Holdings, Inc. | 862 |
3 |
| Qorvo US, Inc. | 2433 |
3 |
| Semikron Elektronik GmbH & Co., KG | 127 |
3 |
| Sumitomo Electric Device Innovations, Inc. | 476 |
3 |
| Amkor Technology Singapore Holding Pte.ltd. | 483 |
3 |
| Deere & Company | 8198 |
2 |
| NEC Corporation | 37491 |
2 |
| Intel Corporation | 46313 |
2 |
| Fujitsu Limited | 16807 |
2 |
| Huawei Technologies Co., Ltd. | 125107 |
2 |
| Murata Manufacturing Co., Ltd. | 25981 |
2 |
| Other owners | 89 |