- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/045 - ContainersSeals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
Patent holdings for IPC class H01L 23/045
Total number of patents in this class: 36
10-year publication summary
|
3
|
0
|
5
|
3
|
4
|
2
|
2
|
0
|
0
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 46267 |
3 |
| Mitsubishi Electric Corporation | 45128 |
3 |
| SCHOTT AG | 1679 |
3 |
| Fujitsu Limited | 18408 |
2 |
| Samsung Electronics Co., Ltd. | 140622 |
1 |
| Siemens AG | 24606 |
1 |
| Micron Technology, Inc. | 25961 |
1 |
| Hitachi Metals, Ltd. | 2008 |
1 |
| Texas Instruments Incorporated | 19457 |
1 |
| Applied Materials, Inc. | 17987 |
1 |
| Infineon Technologies Austria AG | 2085 |
1 |
| Kyocera Corporation | 13445 |
1 |
| Panasonic Intellectual Property Management Co., Ltd. | 30119 |
1 |
| Lenovo (Singapore) Pte. Ltd. | 2768 |
1 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10720 |
1 |
| Omron Corporation | 7177 |
1 |
| Rambus Inc. | 2338 |
1 |
| OSRAM Opto Semiconductors GmbH | 3329 |
1 |
| Shinko Electric Industries Co., Ltd. | 1199 |
1 |
| Advanced Bionics, LLC | 69 |
1 |
| Other owners | 9 |