- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/051 - ContainersSeals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
Patent holdings for IPC class H01L 23/051
Total number of patents in this class: 226
10-year publication summary
|
21
|
22
|
27
|
8
|
10
|
12
|
15
|
21
|
7
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Denso Corporation | 25513 |
21 |
| Infineon Technologies AG | 8400 |
15 |
| Hitachi Energy Ltd. | 2568 |
14 |
| ABB Schweiz AG | 7590 |
11 |
| Mitsubishi Electric Corporation | 47971 |
9 |
| Dynex Semiconductor Limited | 73 |
9 |
| Zhuzhou CRRC Times Semiconductor Co., Ltd. | 74 |
9 |
| Siemens AG | 24033 |
8 |
| Toyota Motor Corporation | 35680 |
8 |
| ABB Technology AG | 1224 |
7 |
| Semiconductor Components Industries, L.L.C. | 5264 |
6 |
| Hyundai Motor Company | 24602 |
5 |
| Fuji Electric Co., Ltd. | 5469 |
5 |
| GE Energy Power Conversion Technology Ltd | 437 |
5 |
| Hitachi Energy Switzerland AG | 299 |
5 |
| Hitachi Astemo, Ltd. | 6410 |
4 |
| Robert Bosch GmbH | 44128 |
3 |
| Infineon Technologies Austria AG | 2328 |
3 |
| Rohm Co., Ltd. | 6824 |
3 |
| Microsemi Corporation | 111 |
3 |
| Other owners | 73 |