- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/051 - ContainersSeals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
Patent holdings for IPC class H01L 23/051
Total number of patents in this class: 220
10-year publication summary
|
27
|
21
|
22
|
27
|
8
|
10
|
12
|
14
|
17
|
1
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Denso Corporation | 23769 |
21 |
| Infineon Technologies AG | 8137 |
13 |
| Hitachi Energy Ltd. | 2232 |
13 |
| ABB Schweiz AG | 6632 |
12 |
| Dynex Semiconductor Limited | 60 |
9 |
| Zhuzhou CRRC Times Semiconductor Co., Ltd. | 56 |
9 |
| Toyota Motor Corporation | 30455 |
8 |
| Siemens AG | 24565 |
7 |
| Mitsubishi Electric Corporation | 44851 |
7 |
| ABB Technology AG | 1272 |
7 |
| SiTime Corporation | 191 |
7 |
| Fuji Electric Co., Ltd. | 4980 |
5 |
| GE Energy Power Conversion Technology Ltd | 426 |
5 |
| Hitachi Energy Switzerland AG | 308 |
5 |
| Hyundai Motor Company | 20483 |
4 |
| Robert Bosch GmbH | 41786 |
3 |
| Infineon Technologies Austria AG | 2067 |
3 |
| Rohm Co., Ltd. | 6346 |
3 |
| Semiconductor Components Industries, L.L.C. | 5246 |
3 |
| Microsemi Corporation | 121 |
3 |
| Other owners | 73 |