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2025
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G/S
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Semiconductors; integrated circuits; microchips; microprocessors; sensors, namely, image sensors,... |
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Invention
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Semiconductor devices and methods of manufacturing semiconductor devices.
A method of making a s... |
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Invention
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Short-circuit detector for electronic fuse circuit.
An electronic fuse that includes a clamp cir... |
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Invention
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Stacked power terminals in a power electronics module.
A module includes a power circuit enclose... |
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Invention
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Power circuit module.
A circuit module includes a substrate with a patterned metal surface. The ... |
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Invention
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Diodes with schottky contact including localized surface regions.
In some aspects, the technique... |
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Invention
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Sic mosfet semiconductor packages and related methods.
A semiconductor package is disclosed. Spe... |
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Invention
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Integration of semiconductor device assemblies with thermal dissipation mechanisms.
In a general... |
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Invention
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Semiconductor devices having die support structures and related methods.
Various implementations... |
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Invention
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Die sidewall coatings and related methods.
Various implementations of a method of forming a semi... |
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Invention
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Low stress asymmetric dual side module.
Implementations of semiconductor packages may include a ... |
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Invention
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Module with substrate recess for conductive-bonding component.
In one general aspect, an apparat... |
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Invention
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Semiconductor device assemblies with wettable die attach area and associated methods.
An assembl... |
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Invention
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Device package having a cavity with sloped sidewalls. A semiconductor device package (100, 200a, ... |
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Invention
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Leadframe spacer for double-sided power module.
A semiconductor device module may include a lead... |
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2024
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Invention
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Temperature sensing within an electronic component.
Apparatuses disclosed herein are configured ... |
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Invention
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Sic layer transfer via remote epitaxy.
A method for structure fabrication with silicon carbide (... |
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Invention
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Device package having a cavity with sloped sidewalls.
A semiconductor device package may include... |
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Invention
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Method and system for concealing packet loss in a communication system.
A method is disclosed. T... |
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Invention
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Static self-calibration for indirect time-of-flight cameras.
Systems, devices, and methods are d... |
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Invention
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Compact semiconductor packaging using a leadless discrete component. An illustrative apparatus in... |
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Invention
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Cooler assembly for electronic modules. An illustrative cooler assembly (100) may include an inle... |
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Invention
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Intelligent power management system and method for monitoring battery integrity.
A battery monit... |
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Invention
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Sintering for semiconductor device assemblies. In a general aspect, a method (500) includes coupl... |
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Invention
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Switching device with passive overcurrent protection. A switching device includes a semiconductor... |
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Invention
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Global shutter image sensor with parasitic light leakage correction.
Global shutter image sensor... |
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Invention
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Overlapping reticle placement for lithographic fabrication of a die.
An illustrative die may inc... |
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Invention
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Approach to deinterleave parallel row reads in image sensors.
The technology involves imaging de... |
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Invention
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Silicon photomultiplier linearity improvement using bias current.
Silicon photomultiplier linear... |
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Invention
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Sensor fan-out packaging.
A sensor package may include a radiation transmitting substrate. A sen... |
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Invention
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Colloidal quantum dots on a matrix of silicon photomultiplier microcells.
The technology employs... |
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Invention
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Image sensors with integrated visible and infrared light pixels.
Image sensors, imaging systems,... |
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Invention
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Managing the growth of silicon carbide crystals.
SiC substrates are in demand for high power app... |
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Invention
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Compact semiconductor packaging using a leadless discrete component.
An illustrative apparatus m... |
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Invention
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Cooler assembly for electronic modules.
An illustrative cooler assembly may include an inlet, an... |
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Invention
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Single-die galvanic isolation using silicon-on-insulator and deep trenches.
A semiconductor die ... |
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Invention
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Semiconductor image sensor package and methods of producing.
In a general aspect, a semiconducto... |
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Invention
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Physical layer collision avoidance (plca) coordinator redundancy.
Methods and network interfaces... |
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Invention
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Adaptive gain for image sensors.
Image sensors and methods for reading out image sensors. The im... |
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Invention
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Reset gate for photodiode.
A buried channel that partially covers a reset gate channel of a pixe... |
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Invention
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Low-offset high speed refernce buffer.
A reference buffer is disclosed. The reference buffer inc... |
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Invention
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High speed dynamic compartor.
A comparator is disclosed. The comparator includes an amplifier ci... |
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Invention
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Managing growth of silicon carbide crystals.
SiC substrates are in demand for high power applica... |
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Invention
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System and method for driving a hybrid switch.
A switch system includes a hybrid switch and a co... |
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Invention
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Fluid-cooled power module. Fluid-cooled power modules (90) are disclosed, in which high power sem... |
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Invention
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High photon rate spad device.
Systems, devices, and methods are described to determine an intens... |
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Invention
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C/o onsemi.
A 3D metal-insulator-metal (MIM) capacitor for CMOS image sensors. A MIM capacitor i... |
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Invention
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Sintering for semiconductor device assemblies.
In a general aspect, a method includes coupling a... |
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Invention
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Method of testing a power transistor.
A method can include closing a reset switch electrically c... |
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Invention
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Wirebonding systems and related methods.
An anvil for a wirebonding system may include a station... |
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Invention
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Switching device with passive overcurrent protection.
A switching device includes a semiconducto... |
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2021
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G/S
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Semiconductors, integrated circuits, microchips,
microprocessors, sensors, semiconductor packagi... |
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2015
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G/S
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Semiconductors and integrated circuits. |
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G/S
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Semiconductor devices and integrated circuits. |
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G/S
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Semiconductor devices and integrated circuits |
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2014
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G/S
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Semiconductor devices. Foundry services, namely, custom manufacture and assembly of semiconductor... |
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G/S
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Semiconductor devices |
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2008
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G/S
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Reference designs in the field of technical design of low-power products, namely computer boards,... |
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G/S
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Printed reference designs related to the technical design of
low-power products, namely, compute... |
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G/S
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Printed reference designs related to the technical design of
low-power products, namely computer... |
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G/S
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Cameras; photographic and optical sensors for cameras,
digital cameras, cellular phones and vide... |
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G/S
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Printed reference designs related to the technical design of low-power products, namely, computer... |
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G/S
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Image and optical sensors for use in cameras, digital cameras, cell telephones, mobile telephones... |
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2006
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G/S
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Integrated circuits. |
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G/S
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Integrated circuits |
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G/S
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Design of low-power products, namely computers,
semiconductors, microprocessors, power supplies,... |
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G/S
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Design of low-power products, namely, computers, semiconductors, microprocessors, power supplies,... |
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G/S
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semiconductor devices |
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2001
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G/S
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Semiconductors |
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2000
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G/S
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Semiconductors and parts therefor. Assembly of semiconductors for others; manufacture of semicond... |
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G/S
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Semiconductors and parts therefor Assembly of semiconductors for others; manufacture of semicondu... |
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G/S
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Semiconductors and parts therefor [ Assembly of semiconductors for others; manufacture of semicon... |
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G/S
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SEMICONDUCTORS, INTEGRATED CIRCUITS, TRANSISTORS FOR AUTOMOBILE STARTERS AND ALTERNATORS, IGBTS, ... |
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G/S
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transistors, namely metal-oxide silicon field effect transistors |
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1999
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G/S
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Assembly of semiconductors for others; manufacture of semiconductors to the specifications of oth... |
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G/S
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[ Semiconductors and parts therefor ] Assembly of semiconductors for others, and manufacture of s... |
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G/S
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Assembly of semiconductors for others; and manufacture of semiconductors to the specifications of... |
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G/S
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Semiconductors and parts therefor |
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G/S
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Semiconductors and parts therefore. Assembly of semiconductors for others, and manufacture of sem... |
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G/S
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Semiconductors and parts therefor, in Class 9. Storage and inventory of semiconductors and parts ... |
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G/S
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Semiconductors and parts therefore |
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G/S
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Assembly of semiconductors for others, and manufacture of semiconductors to the specifications of... |
