- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
Patent holdings for IPC class H01L 23/36
Total number of patents in this class: 3822
10-year publication summary
|
237
|
299
|
335
|
297
|
255
|
269
|
219
|
236
|
267
|
36
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 47338 |
244 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46560 |
143 |
| Mitsubishi Materials Corporation | 2468 |
119 |
| Fuji Electric Co., Ltd. | 5314 |
101 |
| Rohm Co., Ltd. | 6675 |
97 |
| Samsung Electronics Co., Ltd. | 151303 |
95 |
| Kyocera Corporation | 14185 |
81 |
| Denka Company Limited | 2674 |
79 |
| Dexerials Corporation | 1971 |
76 |
| Intel Corporation | 46579 |
74 |
| Murata Manufacturing Co., Ltd. | 25241 |
61 |
| Hitachi Astemo, Ltd. | 6386 |
59 |
| Denso Corporation | 24991 |
57 |
| Panasonic Intellectual Property Management Co., Ltd. | 32968 |
52 |
| International Business Machines Corporation | 61906 |
47 |
| Sumitomo Electric Industries, Ltd. | 15967 |
45 |
| Sumitomo Bakelite Co., Ltd. | 1521 |
42 |
| Shin-Etsu Chemical Co., Ltd. | 5856 |
40 |
| Micron Technology, Inc. | 27172 |
35 |
| Hitachi Automotive Systems, Ltd. | 3954 |
33 |
| Other owners | 2242 |