- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
Patent holdings for IPC class H01L 23/36
Total number of patents in this class: 3744
10-year publication summary
|
300
|
237
|
299
|
335
|
297
|
255
|
267
|
216
|
236
|
228
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 46757 |
236 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44638 |
136 |
| Mitsubishi Materials Corporation | 2473 |
119 |
| Fuji Electric Co., Ltd. | 5233 |
99 |
| Rohm Co., Ltd. | 6538 |
96 |
| Samsung Electronics Co., Ltd. | 148584 |
92 |
| Kyocera Corporation | 14013 |
79 |
| Denka Company Limited | 2648 |
79 |
| Dexerials Corporation | 1948 |
75 |
| Intel Corporation | 46760 |
73 |
| Murata Manufacturing Co., Ltd. | 24907 |
60 |
| Hitachi Astemo, Ltd. | 6378 |
59 |
| Denso Corporation | 24663 |
55 |
| Panasonic Intellectual Property Management Co., Ltd. | 32219 |
52 |
| International Business Machines Corporation | 61651 |
47 |
| Sumitomo Electric Industries, Ltd. | 15693 |
45 |
| Shin-Etsu Chemical Co., Ltd. | 5743 |
39 |
| Sumitomo Bakelite Co., Ltd. | 1509 |
39 |
| Micron Technology, Inc. | 26365 |
35 |
| Hitachi Automotive Systems, Ltd. | 3955 |
33 |
| Other owners | 2196 |