- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
Patent holdings for IPC class H01L 23/427
Total number of patents in this class: 1990
10-year publication summary
|
156
|
182
|
198
|
215
|
132
|
142
|
129
|
146
|
157
|
78
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 46313 |
76 |
| The Furukawa Electric Co., Ltd. | 3712 |
70 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 49027 |
60 |
| International Business Machines Corporation | 62847 |
58 |
| Samsung Electronics Co., Ltd. | 159298 |
55 |
| Murata Manufacturing Co., Ltd. | 25981 |
53 |
| NEC Corporation | 37491 |
50 |
| Microsoft Technology Licensing, LLC | 54661 |
45 |
| Asia Vital Components Co., Ltd. | 433 |
39 |
| Siemens AG | 23913 |
37 |
| Mitsubishi Electric Corporation | 48409 |
33 |
| Denso Corporation | 25799 |
31 |
| Toyota Motor Corporation | 36327 |
30 |
| Qualcomm Incorporated | 93712 |
28 |
| Fujitsu Limited | 16807 |
27 |
| Dai Nippon Printing Co., Ltd. | 4267 |
23 |
| Raytheon Company | 8447 |
21 |
| Nidec Corporation | 2820 |
21 |
| Huawei Technologies Co., Ltd. | 125107 |
20 |
| Google LLC | 44850 |
18 |
| Other owners | 1195 |