- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
Patent holdings for IPC class H01L 23/46
Total number of patents in this class: 485
10-year publication summary
|
33
|
32
|
37
|
56
|
28
|
44
|
47
|
59
|
58
|
24
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| International Business Machines Corporation | 62612 |
26 |
| Intel Corporation | 47063 |
21 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48214 |
21 |
| Frore Systems Inc. | 115 |
20 |
| Adeia Semiconductor Bonding Technologies Inc. | 591 |
18 |
| Fuji Electric Co., Ltd. | 5461 |
14 |
| Denso Corporation | 25495 |
13 |
| Hyundai Motor Company | 24578 |
12 |
| Kia Corporation | 12326 |
12 |
| Raytheon Company | 8456 |
10 |
| Mitsubishi Electric Corporation | 47943 |
8 |
| Robert Bosch GmbH | 44094 |
7 |
| Toyota Motor Corporation | 35578 |
6 |
| Micron Technology, Inc. | 27611 |
6 |
| Google LLC | 44448 |
6 |
| Samsung Electronics Co., Ltd. | 157300 |
5 |
| Siemens AG | 24050 |
5 |
| Infineon Technologies AG | 8398 |
4 |
| Rohm Co., Ltd. | 6811 |
4 |
| Danfoss Silicon Power GmbH | 166 |
4 |
| Other owners | 263 |