- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
Patent holdings for IPC class H01L 23/46
Total number of patents in this class: 483
10-year publication summary
|
32
|
32
|
37
|
55
|
28
|
43
|
46
|
56
|
58
|
29
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| International Business Machines Corporation | 62871 |
26 |
| Intel Corporation | 46342 |
21 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 49440 |
21 |
| Adeia Semiconductor Bonding Technologies Inc. | 622 |
20 |
| Frore Systems Inc. | 117 |
19 |
| Denso Corporation | 25909 |
14 |
| Fuji Electric Co., Ltd. | 5565 |
14 |
| Hyundai Motor Company | 25190 |
13 |
| Kia Corporation | 12927 |
13 |
| Raytheon Company | 8457 |
10 |
| Mitsubishi Electric Corporation | 48508 |
8 |
| Robert Bosch GmbH | 44427 |
7 |
| Toyota Motor Corporation | 36465 |
6 |
| Micron Technology, Inc. | 27932 |
6 |
| Google LLC | 44941 |
6 |
| Siemens AG | 23943 |
5 |
| Samsung Electronics Co., Ltd. | 159755 |
4 |
| Infineon Technologies AG | 8432 |
4 |
| Rohm Co., Ltd. | 6928 |
4 |
| Danfoss Silicon Power GmbH | 165 |
4 |
| Other owners | 258 |