- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
Patent holdings for IPC class H01L 23/46
Total number of patents in this class: 405
10-year publication summary
|
20
|
33
|
32
|
37
|
57
|
30
|
44
|
43
|
54
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| International Business Machines Corporation | 60075 |
22 |
| Intel Corporation | 46097 |
21 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40539 |
18 |
| Frore Systems Inc. | 93 |
18 |
| Denso Corporation | 23721 |
12 |
| Fuji Electric Co., Ltd. | 4956 |
12 |
| Raytheon Company | 8438 |
10 |
| Mitsubishi Electric Corporation | 44738 |
6 |
| Hyundai Motor Company | 20403 |
6 |
| Kia Corporation | 8070 |
6 |
| Adeia Semiconductor Bonding Technologies Inc. | 280 |
6 |
| Siemens AG | 24572 |
5 |
| Toyota Motor Corporation | 30345 |
5 |
| Micron Technology, Inc. | 25756 |
5 |
| Google LLC | 40754 |
5 |
| Samsung Electronics Co., Ltd. | 138518 |
4 |
| Robert Bosch GmbH | 41717 |
4 |
| Infineon Technologies AG | 8134 |
4 |
| Danfoss Silicon Power GmbH | 167 |
4 |
| Delta Design, Inc. | 52 |
4 |
| Other owners | 228 |