- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Patent holdings for IPC class H01L 23/467
Total number of patents in this class: 941
10-year publication summary
|
95
|
101
|
72
|
88
|
54
|
67
|
50
|
86
|
66
|
11
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| BorgWarner US Technologies LLC | 438 |
38 |
| Intel Corporation | 46680 |
30 |
| Siemens AG | 24200 |
26 |
| International Business Machines Corporation | 62220 |
22 |
| Mitsubishi Electric Corporation | 47602 |
21 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47319 |
17 |
| Huawei Technologies Co., Ltd. | 120098 |
16 |
| Microsoft Technology Licensing, LLC | 54242 |
14 |
| Google LLC | 43789 |
12 |
| Toyota Motor Corporation | 34633 |
11 |
| Micron Technology, Inc. | 27285 |
10 |
| Fuji Electric Co., Ltd. | 5390 |
10 |
| Frore Systems Inc. | 112 |
10 |
| Adeia Semiconductor Bonding Technologies Inc. | 550 |
10 |
| Samsung Electronics Co., Ltd. | 153845 |
9 |
| Dell Products L.P. | 16388 |
9 |
| Nidec Corporation | 2765 |
9 |
| Apple Inc. | 58074 |
7 |
| General Electric Company | 13831 |
7 |
| Fujitsu Limited | 16998 |
7 |
| Other owners | 646 |