- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
Patent holdings for IPC class H01L 23/50
Total number of patents in this class: 2143
10-year publication summary
|
155
|
216
|
214
|
179
|
144
|
153
|
130
|
150
|
102
|
5
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46344 |
197 |
| Rohm Co., Ltd. | 6609 |
130 |
| Intel Corporation | 46508 |
106 |
| Mitsubishi Electric Corporation | 47175 |
74 |
| Samsung Electronics Co., Ltd. | 150129 |
70 |
| Qualcomm Incorporated | 88159 |
61 |
| Renesas Electronics Corporation | 5916 |
53 |
| International Business Machines Corporation | 61843 |
45 |
| Denso Corporation | 24879 |
43 |
| Texas Instruments Incorporated | 19516 |
39 |
| Boe Technology Group Co., Ltd. | 42114 |
37 |
| Micron Technology, Inc. | 26743 |
32 |
| Murata Manufacturing Co., Ltd. | 25144 |
29 |
| Fuji Electric Co., Ltd. | 5296 |
29 |
| STATS ChipPAC Pte. Lte. | 1549 |
25 |
| Skyworks Solutions, Inc. | 3829 |
20 |
| Infineon Technologies AG | 8291 |
19 |
| SK Hynix Inc. | 11762 |
18 |
| Mediatek Inc. | 5274 |
18 |
| Monolithic 3D Inc. | 320 |
18 |
| Other owners | 1080 |