- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
Patent holdings for IPC class H01L 25/18
Total number of patents in this class: 9638
10-year publication summary
|
430
|
461
|
611
|
736
|
876
|
934
|
1068
|
1024
|
1083
|
1081
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 148649 |
956 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 45023 |
633 |
| Mitsubishi Electric Corporation | 46765 |
574 |
| Intel Corporation | 46703 |
415 |
| Micron Technology, Inc. | 26395 |
400 |
| Rohm Co., Ltd. | 6536 |
373 |
| Murata Manufacturing Co., Ltd. | 24928 |
341 |
| Fuji Electric Co., Ltd. | 5235 |
337 |
| Kioxia Corporation | 10450 |
249 |
| Yangtze Memory Technologies Co., Ltd. | 2890 |
180 |
| Denso Corporation | 24692 |
172 |
| SK Hynix Inc. | 11607 |
166 |
| Samsung Display Co., Ltd. | 35888 |
147 |
| Sandisk Technologies Inc. | 4906 |
129 |
| Sony Semiconductor Solutions Corporation | 10756 |
110 |
| Sumitomo Electric Industries, Ltd. | 15705 |
102 |
| Shindengen Electric Manufacturing Co., Ltd. | 829 |
92 |
| Hitachi, Ltd. | 15632 |
86 |
| Hitachi Automotive Systems, Ltd. | 3955 |
86 |
| Qualcomm Incorporated | 87191 |
80 |
| Other owners | 4010 |