- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/105 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
Patent holdings for IPC class H01L 27/105
Total number of patents in this class: 2406
10-year publication summary
|
185
|
203
|
242
|
221
|
163
|
112
|
93
|
56
|
4
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Semiconductor Energy Laboratory Co., Ltd. | 11896 |
241 |
| TDK Corporation | 7043 |
152 |
| NEC Corporation | 37532 |
149 |
| Micron Technology, Inc. | 27901 |
147 |
| Panasonic Corporation | 18616 |
93 |
| Samsung Electronics Co., Ltd. | 159473 |
91 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 49324 |
77 |
| Tohoku University | 3044 |
76 |
| Monolithic 3D Inc. | 342 |
69 |
| Sony Semiconductor Solutions Corporation | 11994 |
67 |
| Kabushiki Kaisha Toshiba, doing business as Toshiba Corporation | 6162 |
62 |
| SK Hynix Inc. | 12746 |
60 |
| Hitachi, Ltd. | 16221 |
55 |
| Kioxia Corporation | 11025 |
48 |
| Sony Corporation | 29887 |
41 |
| Changxin Memory Technologies, Inc. | 4933 |
36 |
| Tokyo Electron Limited | 13987 |
34 |
| Canon Anelva Corporation | 689 |
34 |
| National Institute of Advanced Industrial Science and Technology | 3791 |
32 |
| Renesas Electronics Corporation | 5846 |
28 |
| Other owners | 814 |