- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/26 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including bulk negative resistance effect components
Patent holdings for IPC class H01L 27/26
Total number of patents in this class: 30
10-year publication summary
0
|
1
|
7
|
4
|
3
|
2
|
1
|
1
|
0
|
0
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 41068 |
3 |
HRL Laboratories, LLC | 1596 |
3 |
National Taiwan University | 1189 |
2 |
Research & Business Foundation Sungkyunkwan University | 1816 |
2 |
Panasonic Semiconductor Solutions Co., Ltd. | 857 |
2 |
Samsung Electronics Co., Ltd. | 140622 |
1 |
Qualcomm Incorporated | 82781 |
1 |
LG Electronics Inc. | 71505 |
1 |
NEC Corporation | 34721 |
1 |
Intel Corporation | 46267 |
1 |
Huawei Technologies Co., Ltd. | 108034 |
1 |
Commissariat à l'énergie atomique et aux energies alternatives | 10720 |
1 |
Hewlett Packard Enterprise Development LP | 10659 |
1 |
The Arizona Board of Regents on Behalf of the University of Arizona | 2092 |
1 |
IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) | 1290 |
1 |
Nanohmics, Inc. | 30 |
1 |
Parallel Wireless, Inc. | 523 |
1 |
Xronet Corporation | 8 |
1 |
France Telecom | 1386 |
1 |
Telefonaktiebolaget LM Ericsson (publ) | 27507 |
1 |
Other owners | 3 |