- All sections
- H - Electricity
- H01S - Devices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate lightdevices using stimulated emission of electromagnetic radiation in wave ranges other than optical
- H01S 5/02345 - Wire-bonding
Patent holdings for IPC class H01S 5/02345
Total number of patents in this class: 324
10-year publication summary
|
1
|
4
|
15
|
40
|
55
|
63
|
53
|
42
|
46
|
4
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Nichia Corporation | 3796 |
43 |
| Kyocera Sld Laser, Inc. | 301 |
27 |
| Ams-osram International GmbH | 1168 |
16 |
| Rohm Co., Ltd. | 6678 |
15 |
| Lumentum Operations LLC | 909 |
12 |
| Hisense Laser Display Co., Ltd. | 431 |
12 |
| Sony Semiconductor Solutions Corporation | 11052 |
10 |
| Mitsubishi Electric Corporation | 47352 |
8 |
| OSRAM OLED GmbH | 1757 |
8 |
| FUJIFILM Business Innovation Corp. | 7774 |
8 |
| Kyocera Corporation | 14186 |
7 |
| Hisense Broadband Multimedia Technologies Co., Ltd. | 491 |
5 |
| Sumitomo Electric Device Innovations, Inc. | 460 |
5 |
| Apple Inc. | 57166 |
4 |
| Sumitomo Electric Industries, Ltd. | 15967 |
4 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46613 |
4 |
| Hamamatsu Photonics K.K. | 4565 |
4 |
| OSRAM Opto Semiconductors GmbH | 3277 |
4 |
| The Furukawa Electric Co., Ltd. | 3710 |
4 |
| Excelitas Technologies Corp. | 324 |
4 |
| Other owners | 120 |