- All sections
- H - Electricity
- H03K - Pulse technique
- H03K 19/0175 - Coupling arrangementsInterface arrangements
Patent holdings for IPC class H03K 19/0175
Total number of patents in this class: 2066
10-year publication summary
|
158
|
158
|
163
|
127
|
115
|
105
|
101
|
93
|
90
|
59
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Texas Instruments Incorporated | 19647 |
88 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48490 |
59 |
| Samsung Electronics Co., Ltd. | 158156 |
57 |
| Rohm Co., Ltd. | 6843 |
57 |
| Qualcomm Incorporated | 92563 |
53 |
| Altera Corporation | 2475 |
53 |
| Intel Corporation | 47100 |
50 |
| Xilinx, Inc. | 3941 |
47 |
| Micron Technology, Inc. | 27709 |
44 |
| Socionext Inc. | 1597 |
42 |
| SK Hynix Inc. | 12534 |
38 |
| Renesas Electronics Corporation | 5866 |
35 |
| Sony Semiconductor Solutions Corporation | 11648 |
33 |
| Semiconductor Energy Laboratory Co., Ltd. | 11842 |
30 |
| Rambus Inc. | 2250 |
30 |
| Apple Inc. | 58936 |
23 |
| Panasonic Corporation | 18951 |
21 |
| NXP USA, Inc. | 4401 |
20 |
| Denso Corporation | 25607 |
19 |
| Mitsubishi Electric Corporation | 48097 |
18 |
| Other owners | 1249 |