- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Patent holdings for IPC class H05K 3/02
Total number of patents in this class: 1126
10-year publication summary
|
108
|
93
|
101
|
85
|
108
|
83
|
59
|
51
|
50
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| JX Nippon Mining & Metals Corporation | 1526 |
35 |
| Avary Holding (Shenzhen) Co., Limited. | 283 |
27 |
| Ibiden Co., Ltd. | 1735 |
23 |
| International Business Machines Corporation | 60075 |
20 |
| Intel Corporation | 46097 |
20 |
| Mitsui Mining & Smelting Co., Ltd. | 1422 |
19 |
| Panasonic Intellectual Property Management Co., Ltd. | 29620 |
18 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 458 |
17 |
| HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 130 |
16 |
| LG Chem, Ltd. | 17632 |
13 |
| Unimicron Technology Corp. | 449 |
13 |
| Samsung Electro-mechanics Co., Ltd. | 5191 |
12 |
| Nitto Denko Corporation | 8073 |
12 |
| Shinko Electric Industries Co., Ltd. | 1186 |
11 |
| Resonac Corporation | 2392 |
11 |
| Taiwan Union Technology Corporation | 57 |
10 |
| Sumitomo Electric Industries, Ltd. | 14929 |
9 |
| Samsung Electronics Co., Ltd. | 138518 |
8 |
| Murata Manufacturing Co., Ltd. | 23648 |
8 |
| Toray Industries, Inc. | 6843 |
8 |
| Other owners | 816 |