- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Patent holdings for IPC class H05K 3/06
Total number of patents in this class: 1512
10-year publication summary
|
147
|
131
|
142
|
117
|
117
|
147
|
85
|
68
|
75
|
11
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| FUJIFILM Corporation | 30206 |
84 |
| Avary Holding (Shenzhen) Co., Limited. | 321 |
44 |
| Hitachi Chemical Company, Ltd. | 2279 |
38 |
| LG Innotek Co., Ltd. | 8136 |
34 |
| HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 156 |
27 |
| Unimicron Technology Corp. | 493 |
27 |
| JX Nippon Mining & Metals Corporation | 1469 |
26 |
| Resonac Corporation | 3167 |
26 |
| Samsung Electro-mechanics Co., Ltd. | 5805 |
24 |
| Ibiden Co., Ltd. | 1681 |
23 |
| Nitto Denko Corporation | 8447 |
22 |
| Asahi Kasei Kabushiki Kaisha | 2772 |
21 |
| LG Chem, Ltd. | 17805 |
18 |
| International Business Machines Corporation | 62148 |
17 |
| MEC Company Ltd. | 89 |
17 |
| Boe Technology Group Co., Ltd. | 42854 |
16 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 528 |
16 |
| Qing Ding Precision Electronics (Huaian) Co.,Ltd | 121 |
16 |
| 3m Innovative Properties Company | 17536 |
14 |
| Sumitomo Electric Industries, Ltd. | 16061 |
14 |
| Other owners | 988 |