- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/08 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
Patent holdings for IPC class H05K 3/08
Total number of patents in this class: 38
10-year publication summary
|
1
|
4
|
0
|
1
|
5
|
3
|
1
|
2
|
4
|
1
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Toyobo Co., Ltd. | 2499 |
3 |
| Panasonic Corporation | 20093 |
2 |
| Panasonic Electric Works Co., Ltd. | 719 |
2 |
| FUJIFILM Corporation | 29424 |
2 |
| DIC Corporation | 3802 |
2 |
| V Technology Co., Ltd. | 384 |
2 |
| ICD Co., Ltd. | 5 |
2 |
| Sumitomo Electric Industries, Ltd. | 15511 |
1 |
| Ford Global Technologies, LLC | 20605 |
1 |
| Kyocera Corporation | 13846 |
1 |
| LG Innotek Co., Ltd. | 7659 |
1 |
| Asahi Glass Company, Limited | 2781 |
1 |
| Ibiden Co., Ltd. | 1711 |
1 |
| The Furukawa Electric Co., Ltd. | 3660 |
1 |
| FUJIFILM SonoSite, Inc. | 439 |
1 |
| Hitachi Zosen Corporation | 617 |
1 |
| M-solv Ltd. | 46 |
1 |
| Marubun Corporation | 29 |
1 |
| Nippon Electric Glass Co., Ltd. | 2459 |
1 |
| Partron Co., Ltd. | 141 |
1 |
| Other owners | 10 |