- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
Patent holdings for IPC class H05K 3/10
Total number of patents in this class: 2260
10-year publication summary
|
219
|
165
|
169
|
160
|
146
|
109
|
153
|
122
|
76
|
49
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ibiden Co., Ltd. | 1674 |
52 |
| FUJIFILM Corporation | 30562 |
50 |
| Fuji Corporation | 3664 |
50 |
| LG Innotek Co., Ltd. | 8498 |
45 |
| Samsung Electro-mechanics Co., Ltd. | 6118 |
34 |
| Avary Holding (Shenzhen) Co., Limited. | 330 |
34 |
| Nitto Denko Corporation | 8550 |
30 |
| Intel Corporation | 47069 |
29 |
| LG Chem, Ltd. | 17937 |
28 |
| Unimicron Technology Corp. | 504 |
28 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 549 |
24 |
| Apple Inc. | 58995 |
23 |
| Sumitomo Electric Industries, Ltd. | 16412 |
23 |
| Shinko Electric Industries Co., Ltd. | 1238 |
23 |
| HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 163 |
23 |
| International Business Machines Corporation | 62742 |
22 |
| Resonac Corporation | 3587 |
20 |
| Murata Manufacturing Co., Ltd. | 25785 |
19 |
| Samsung Electronics Co., Ltd. | 158337 |
18 |
| AmaTech Group Limited | 69 |
18 |
| Other owners | 1667 |