- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
Patent holdings for IPC class H05K 3/38
Total number of patents in this class: 1506
10-year publication summary
|
124
|
109
|
134
|
113
|
119
|
116
|
93
|
94
|
60
|
41
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| JX Nippon Mining & Metals Corporation | 1461 |
54 |
| Sumitomo Electric Industries, Ltd. | 16305 |
44 |
| LG Innotek Co., Ltd. | 8453 |
35 |
| Mitsubishi Materials Corporation | 2468 |
35 |
| Sumitomo Electric Printed Circuits, Inc. | 337 |
35 |
| Kyocera Corporation | 14335 |
34 |
| Mitsui Mining & Smelting Co., Ltd. | 1100 |
33 |
| Atotech Deutschland GmbH | 524 |
32 |
| Murata Manufacturing Co., Ltd. | 25722 |
26 |
| DIC Corporation | 3961 |
24 |
| Ibiden Co., Ltd. | 1661 |
23 |
| Denka Company Limited | 2712 |
21 |
| Toshiba Materials Co., Ltd. | 564 |
19 |
| Shinko Electric Industries Co., Ltd. | 1230 |
18 |
| The Furukawa Electric Co., Ltd. | 3701 |
16 |
| MEC Company Ltd. | 92 |
16 |
| FUJIFILM Corporation | 30512 |
15 |
| Panasonic Intellectual Property Management Co., Ltd. | 33911 |
15 |
| Namics Corporation | 482 |
15 |
| NGK Insulators, Ltd. | 5232 |
14 |
| Other owners | 982 |