- All sections
- H - Electricity
- H10B - Electronic memory devices
- H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
Patent holdings for IPC class H10B 80/00
Total number of patents in this class: 2844
10-year publication summary
|
0
|
0
|
0
|
0
|
2
|
3
|
153
|
732
|
969
|
962
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 159029 |
1052 |
| Micron Technology, Inc. | 27793 |
232 |
| Kioxia Corporation | 11017 |
163 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48861 |
159 |
| SK Hynix Inc. | 12667 |
156 |
| Yangtze Memory Technologies Co., Ltd. | 3400 |
105 |
| Intel Corporation | 46292 |
90 |
| Sandisk Technologies Inc. | 5485 |
77 |
| Qualcomm Incorporated | 93376 |
58 |
| Monolithic 3D Inc. | 342 |
34 |
| JPMorgan Chase Bank, N.A., AS The Agent | 2695 |
34 |
| Adeia Semiconductor Bonding Technologies Inc. | 615 |
29 |
| Advanced Micro Devices, Inc. | 6130 |
28 |
| Nanya Technology Corporation | 2961 |
24 |
| Cxmt Corporation | 433 |
24 |
| International Business Machines Corporation | 62805 |
23 |
| Yangtze Memory Technologies Holding Co., Ltd. | 43 |
19 |
| Applied Materials, Inc. | 20579 |
18 |
| Mediatek Inc. | 5522 |
18 |
| Huawei Technologies Co., Ltd. | 124837 |
17 |
| Other owners | 484 |