- All sections
- H - Electricity
- H10B - Electronic memory devices
- H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
Patent holdings for IPC class H10B 80/00
Total number of patents in this class: 2656
10-year publication summary
|
0
|
0
|
0
|
0
|
2
|
3
|
151
|
725
|
968
|
786
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 157557 |
1016 |
| Micron Technology, Inc. | 27626 |
213 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
145 |
| Kioxia Corporation | 10805 |
144 |
| SK Hynix Inc. | 12452 |
141 |
| Yangtze Memory Technologies Co., Ltd. | 3301 |
94 |
| Intel Corporation | 47102 |
84 |
| Sandisk Technologies Inc. | 5432 |
69 |
| Qualcomm Incorporated | 91997 |
52 |
| JPMorgan Chase Bank, N.A., AS The Agent | 2695 |
34 |
| Monolithic 3D Inc. | 332 |
30 |
| Adeia Semiconductor Bonding Technologies Inc. | 594 |
27 |
| Advanced Micro Devices, Inc. | 6122 |
26 |
| Cxmt Corporation | 419 |
24 |
| Nanya Technology Corporation | 2900 |
23 |
| International Business Machines Corporation | 62621 |
21 |
| Mediatek Inc. | 5316 |
18 |
| Huawei Technologies Co., Ltd. | 123282 |
17 |
| Yangtze Memory Technologies Holding Co., Ltd. | 36 |
16 |
| Etron Technology, Inc. | 184 |
15 |
| Other owners | 447 |