- All sections
- H - Electricity
- H10B - Electronic memory devices
- H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
Patent holdings for IPC class H10B 80/00
Total number of patents in this class: 2009
10-year publication summary
|
0
|
0
|
0
|
0
|
0
|
3
|
139
|
710
|
964
|
182
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 151303 |
779 |
| Micron Technology, Inc. | 27172 |
179 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46560 |
109 |
| Kioxia Corporation | 10521 |
103 |
| SK Hynix Inc. | 11894 |
95 |
| Yangtze Memory Technologies Co., Ltd. | 3050 |
78 |
| Intel Corporation | 46579 |
52 |
| Sandisk Technologies Inc. | 5184 |
44 |
| JPMorgan Chase Bank, N.A., AS The Agent | 2657 |
34 |
| Qualcomm Incorporated | 88742 |
30 |
| Monolithic 3D Inc. | 324 |
29 |
| Adeia Semiconductor Bonding Technologies Inc. | 515 |
20 |
| International Business Machines Corporation | 61906 |
19 |
| Advanced Micro Devices, Inc. | 5893 |
18 |
| Cxmt Corporation | 295 |
16 |
| Nanya Technology Corporation | 2739 |
15 |
| Changxin Memory Technologies, Inc. | 4924 |
15 |
| Huawei Technologies Co., Ltd. | 117973 |
14 |
| Macronix International Co., Ltd. | 2527 |
14 |
| Semiconductor Energy Laboratory Co., Ltd. | 11602 |
13 |
| Other owners | 333 |