- All sections
- H - Electricity
- H10N - Electric solid-state devices not otherwise provided for
- H10N 30/02 - Forming enclosures or casings
Patent holdings for IPC class H10N 30/02
Total number of patents in this class: 90
10-year publication summary
|
0
|
0
|
0
|
4
|
19
|
11
|
17
|
18
|
7
|
3
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Seiko Epson Corporation | 19809 |
6 |
| Akoustis Technologies Corp. | 129 |
6 |
| Tune Holdings Corp. | 123 |
6 |
| X-Celeprint Limited | 123 |
5 |
| Vermes Microdispensing GmbH | 66 |
3 |
| Sonicmems (Zhengzhou) Technology Co.,Ltd. | 20 |
3 |
| FUJIFILM Corporation | 30010 |
2 |
| Murata Manufacturing Co., Ltd. | 25214 |
2 |
| United Microelectronics Corp. | 4369 |
2 |
| W. L. Gore & Associates, Inc. | 2718 |
2 |
| Boe Technology Group Co., Ltd. | 42421 |
2 |
| Kureha Corporation | 1042 |
2 |
| Nagase Chemtex Corporation | 205 |
2 |
| PI Ceramic GmbH | 23 |
2 |
| University of Maryland, Baltimore County | 269 |
2 |
| W.L. Gore & Associates GmbH | 225 |
2 |
| TDK Electronics AG | 987 |
2 |
| Rf360 Singapore Pte. Ltd. | 203 |
2 |
| Qualcomm Incorporated | 88555 |
1 |
| Koninklijke Philips N.V. | 25323 |
1 |
| Other owners | 35 |