Sonicmems (Zhengzhou) Technology Co.,Ltd.

China

 
Total IP 15
Total IP Rank # 100,945
IP Activity Score 2.1/5.0    17
IP Activity Rank # 49,503

Patents

Trademarks

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Last Patent 2025 - Ultrasonic sensing element assem...
First Patent 2018 - Ultrasonic module and method for...

Latest Inventions, Goods, Services

2023 Invention Ultrasonic sensing element assembly and ultrasonic sensing element. An ultrasonic sensing elemen...
Invention Wafer level ultrasonic device. A wafer level ultrasonic device includes a composite layer, a fir...
Invention Manufacturing method of wafer level ultrasonic device. A manufacturing method of a wafer level u...
Invention Piezoelectric micromachined ultrasonic transducer and piezoelectric micromachined ultrasonic tran...
Invention Package structure of piezoelectric micromachined ultrasonic transducer. A package structure of a...
2022 Invention Wafer level ultrasonic chip module having suspension structure. A wafer level ultrasonic chip mo...
2021 Invention Suspended piezoelectric ultrasonic transducer and manufacturing thereof. A suspended piezoelectr...
Invention Array-type ultrasonic sensor. An array-type ultrasonic sensor includes a semiconductor substrate,...
2020 Invention Wafer level ultrasonic device and manufacturing method thereof. A wafer level ultrasonic device i...
Invention Wafer scale ultrasonic sensing device and manufacturing method thereof. A wafer scale ultrasonic ...
Invention Integrated package structure for mems element and asic chip and method for manufacturing the same...
2019 Invention Wafer scale ultrasonic sensor assembly and method for manufacturing the same. A wafer scale ultra...
Invention Wafer level ultrasonic chip module and manufacturing method thereof. A wafer level ultrasonic chi...
Invention Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof. ...
2018 Invention Ultrasonic module and method for manufacturing the same. An ultrasonic module and a manufacturing...