- All sections
- H - Electricity
- H10N - Electric solid-state devices not otherwise provided for
- H10N 30/063 - Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
Patent holdings for IPC class H10N 30/063
Total number of patents in this class: 63
10-year publication summary
|
0
|
0
|
2
|
2
|
4
|
9
|
5
|
16
|
21
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46560 |
8 |
| Koninklijke Philips N.V. | 25344 |
3 |
| Sumitomo Chemical Company, Limited | 9053 |
3 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10976 |
3 |
| Magnecomp Corporation | 201 |
3 |
| Niterra Co., Ltd. | 1351 |
3 |
| Seiko Epson Corporation | 19806 |
2 |
| Murata Manufacturing Co., Ltd. | 25241 |
2 |
| Kyocera Corporation | 14185 |
2 |
| Suncall Corporation | 192 |
2 |
| Taiyo Yuden Co., Ltd. | 2015 |
2 |
| LG Display Co., Ltd. | 14067 |
1 |
| Canon Inc. | 41645 |
1 |
| FUJIFILM Corporation | 30016 |
1 |
| Texas Instruments Incorporated | 19553 |
1 |
| Massachusetts Institute of Technology | 10178 |
1 |
| Konica Minolta, Inc. | 8963 |
1 |
| Rohm Co., Ltd. | 6675 |
1 |
| The Regents of the University of Michigan | 4836 |
1 |
| Boe Technology Group Co., Ltd. | 42451 |
1 |
| Other owners | 21 |