- All sections
- H - Electricity
- H10N - Electric solid-state devices not otherwise provided for
- H10N 30/063 - Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
Patent holdings for IPC class H10N 30/063
Total number of patents in this class: 49
10-year publication summary
0
|
0
|
0
|
2
|
2
|
4
|
9
|
5
|
16
|
9
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 42804 |
7 |
Commissariat à l'énergie atomique et aux energies alternatives | 10912 |
3 |
Magnecomp Corporation | 201 |
3 |
Koninklijke Philips N.V. | 24804 |
2 |
Murata Manufacturing Co., Ltd. | 24542 |
2 |
Kyocera Corporation | 13831 |
2 |
Suncall Corporation | 187 |
2 |
Taiyo Yuden Co., Ltd. | 1940 |
2 |
LG Display Co., Ltd. | 13518 |
1 |
Canon Inc. | 39960 |
1 |
Seiko Epson Corporation | 19367 |
1 |
Texas Instruments Incorporated | 19460 |
1 |
Sumitomo Chemical Company, Limited | 9047 |
1 |
Rohm Co., Ltd. | 6459 |
1 |
Boe Technology Group Co., Ltd. | 41217 |
1 |
Aker Technology Co., Ltd. | 6 |
1 |
FUJIFILM SonoSite, Inc. | 437 |
1 |
The Hong Kong Polytechnic University | 470 |
1 |
Nanyang Technological University | 2013 |
1 |
Newsouth Innovations Pty Limited | 592 |
1 |
Other owners | 14 |