- All sections
- H - Electricity
- H10N - Electric solid-state devices not otherwise provided for
- H10N 30/072 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
Patent holdings for IPC class H10N 30/072
Total number of patents in this class: 112
10-year publication summary
|
0
|
0
|
0
|
3
|
11
|
23
|
8
|
22
|
35
|
8
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Soitec | 989 |
30 |
| NGK Insulators, Ltd. | 4900 |
9 |
| Murata Manufacturing Co., Ltd. | 24260 |
7 |
| FUJIFILM Corporation | 29188 |
5 |
| Shin-Etsu Chemical Co., Ltd. | 5586 |
5 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10810 |
5 |
| FUJIFILM SonoSite, Inc. | 424 |
5 |
| Akoustis, Inc. | 164 |
4 |
| Skyworks Solutions, Inc. | 3658 |
4 |
| Sonicmems (Zhengzhou) Technology Co.,Ltd. | 18 |
3 |
| GM Global Technology Operations LLC | 14834 |
2 |
| Kyocera Corporation | 13630 |
2 |
| United Microelectronics Corp. | 4202 |
2 |
| Magnecomp Corporation | 198 |
2 |
| GE Precision Healthcare LLC | 5406 |
2 |
| Rf360 Singapore Pte. Ltd. | 169 |
2 |
| Sumitomo Electric Industries, Ltd. | 15292 |
1 |
| Seiko Epson Corporation | 19253 |
1 |
| Denso Corporation | 24069 |
1 |
| Applied Materials, Inc. | 18344 |
1 |
| Other owners | 19 |