The present invention includes a radio frequency power amplifier (RF PA) system-in-a-package (SiP) device including a substrate comprising one or more inductors, capacitors, and thin film resistors wherein the one or more are formed in, on, or about the substrate; an opening in the substrate comprising an iron core, wherein the iron core is formed in the substrate after the formation is create a RF PA SiP in the substrate; and one or more connectors, vias, resistors, capacitors, or other integrated circuits devices connected to create the RF PA SiP.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/08 - ContainersSeals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
The present invention includes a method of creating high Q empty Vertical Quasi-Coax Resonator devices and/or system with low loss, mechanically and thermally stabilized in photo-definable glass ceramic substrate. The photo-definable glass-ceramic process enables high-performance, high-quality, and/or low- cost structures. Compact low loss Vertical Quasi-Coax Resonator Structures are a cornerstone technological requirement for high-frequency systems, in particular, for portable systems.
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
The present invention includes a ceramic phase capacitor device and a method of making the same, wherein the ceramic phase capacitor is formed in or on a photosensitive glass substrate comprising: a first capacitor electrode formed in or one the photosensitive glass substrate; a glass-crystalline dielectric formed in situ from the photosensitive glass substrate adjacent to the first capacitor electrode; and a second capacitor electrode formed in or one the photosensitive glass substrate adjacent to the glass-crystalline dielectric and opposite the first electrode.
H01G 4/012 - Form of non-self-supporting electrodes
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
2xyy, and SiN structures for encapsulation of a substrate to isolate the constituents of the substrate from contaminating semiconductor material and/or semiconductor devices.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
5.
Impedence Matching Conductive Structure for High Efficiency RF Circuits
The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
C03C 4/04 - Compositions for glass with special properties for photosensitive glass
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
The present invention includes a method for creating a system-in-package in or on photodefinable glass including; providing a photodefinable glass substrate; masking a design layout comprising one or more structures to form one or more integrated lumped element devices as the system-in-package on or in a photodefinable glass substrate; transforming at least a portion of the photodefinable glass substrate to form a glass-crystalline substrate; etching the glass-crystalline substrate to formone or more channels in the glass-crystalline substrate; depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate to enable electroplating of copper; and electroplating the copper to fill the one or more channels and to deposit copper on the surface of the photodefinable glass to form the one or more integrated lumped element devices.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
C03C 3/095 - Glass compositions containing silica with 40% to 90% silica by weight containing rare earths
C03C 4/04 - Compositions for glass with special properties for photosensitive glass
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
C03C 17/10 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
An apparatus of one or more electronic devices in or on a photodefinable glass substrate includes: the photodefinable glass substrate; the one or more electronic devices disposed in or on the photodefinable glass substrate; one or more overmolding openings in the photodefinable glass substrate; and a layer of overmolding material filling the one or more overmolding openings and covering at least a portion of the one or more electronic devices.
The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.
The present invention includes a radio frequency power amplifier (RF PA) system-in-a-package (SiP) device including a substrate comprising one or more inductors, capacitors, and thin film resistors wherein the one or more are formed in, on, or about the substrate; an opening in the substrate comprising an iron core, wherein the iron core is formed in the substrate after the formation is create a RF PA SiP in the substrate; and one or more connectors, vias, resistors, capacitors, or other integrated circuits devices connected to create the RF PA SiP.
The present invention includes a method of making a thermal management and signal control structure comprising forming in a substrate heat conductive vias and control vias, power vias, and ground vias, wherein the heat conductive vias and the control vias, power vias, and vias are aligned to a first metal plate on a first side of the substrate, wherein the control vias, power vias, and ground vias are surrounded by a glass layer; forming a second metal plate on a second side of the substrate, wherein the second metal plate is connected to the heat conductive vias; and forming a pad on each of the control vias, power vias, and ground vias, wherein each pad is configured to electrically connect the thermal management and signal control structure to at least one of: a printed circuit board, an integrated circuit, or a power management unit.
A method of making capacitive device in or on a photodefinable glass substrate comprising: a first electrode comprising: one or more copper columns each with patterned or textured surfaces; and one or more rows of a Resistor Inductor Diode (RLD)in contact with the one or more copper columns, wherein the one or more rows of the RLD are tied together in parallel; a dielectric material in contact with the one or more copper columns and in contact with the one or more rows of the RLD; and a second electrode comprising: one or more copper columns each with patterned or textured surfaces; and one or more rows or columns of the RLD in contact with the one or more copper columns, wherein the one or more rows or columns of the RLD are tied together in parallel.
The present invention includes a ceramic phase capacitor device and a method of making the same, wherein the ceramic phase capacitor is formed in or on a photosensitive glass substrate comprising: a first capacitor electrode formed in or one the photosensitive glass substrate; a glass-crystalline dielectric formed in situ from the photosensitive glass substrate adjacent to the first capacitor electrode; and a second capacitor electrode formed in or one the photosensitive glass substrate adjacent to the glass-crystalline dielectric and opposite the first electrode.
The present invention includes a ceramic phase capacitor device and a method of making the same, wherein the ceramic phase capacitor is formed in or on a photosensitive glass substrate comprising: a first capacitor electrode formed in or one the photosensitive glass substrate; a glass-crystalline dielectric formed in situ from the photosensitive glass substrate adjacent to the first capacitor electrode; and a second capacitor electrode formed in or one the photosensitive glass substrate adjacent to the glass-crystalline dielectric and opposite the first electrode.
The present invention includes a method of creating high temperature mechanically and thermally stabilized PCB fabrication on a photo-definable glass substrate or photosensitive glass substrate.
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
The present invention includes a method for creating a system-in-package in or on photodefinable glass including: providing a photodefinable glass substrate; masking a design layout comprising one or more structures to form one or more integrated lumped element devices as the system-in-package on or in a photodefinable glass substrate; transforming at least a portion of the photodefinable glass substrate to form a glass-crystalline substrate; etching the glass-crystalline substrate to form one or more channels in the glass-crystalline substrate; depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate to enable electroplating of copper; and electroplating the copper to fill the one or more channels and to deposit copper on the surface of the photodefinable glass to form the one or more integrated lumped element devices.
H03H 7/46 - Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
H01P 5/12 - Coupling devices having more than two ports
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
C03C 17/10 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
C03B 32/02 - Thermal crystallisation, e.g. for crystallising glass bodies into glass-ceramic articles
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C25D 5/02 - Electroplating of selected surface areas
The present invention includes a method of creating high Q empty substrate integrated waveguide devices and/or system with low loss, mechanically and thermally stabilized in photodefinable glass ceramic substrate. The photodefinable glass ceramic process enables high performance, high quality, and/or low-cost structures. Compact low loss RF empty substrate integrated waveguide devices are a cornerstone technological requirement for RF systems, in particular, for portable systems.
C03C 3/095 - Glass compositions containing silica with 40% to 90% silica by weight containing rare earths
C03C 14/00 - Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.
A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
A capacitor comprising a plurality of metal pillars onto which a compound nanoform structure is electroplated, wherein the compound nanoform structure comprises first nanoforms of a first size and second nanoforms of a second size, wherein the first size is greater than the second size, to increase the surface area of the metal pillars; a dielectric layer disposed on the metal pillars and nanoforms; and a conductive layer disposed on the dielectric lay er.
H01C 17/12 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques by sputtering
The present invention includes a method of fabricating an integrated RF power condition capacitor with a capacitance greater than or equal to 1 nf and less than 1 mm2, and a device made by the method.
H01C 17/12 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques by sputtering
H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
The present invention includes a method of making a slotted waveguide antenna structure with a matched ground plane comprising: forming in a photosensitive glass substrate a coaxial-to-coplanar waveguide (CPW) section connected to a power divider, an emission cavity area for the slotted antenna and one or more vias; depositing a metal ground plane to a first surface of the photosensitive glass substrate; depositing a copper layer on the photosensitive glass substrate with a pattern of slots that form a slot antenna above the emission cavity; forming one or more glass pillars in the emission cavity under the slot antenna; etching away the photosensitive glass in the emission cavity while retaining the one or more glass pillars; connecting a micro coaxial connector to the coaxial-to-coplanar waveguide (CPW) section; and one or more solder bumps at the vias that connect to the ground plane, to form a slotted antenna.
The present invention includes a method for creating an annular capacitor adjacent to via or imbedded metal structure allowing for device to be made in close proximity to the via connecting to a ground plane. The annular capacitor in close proximity to the metal filled via or imbedded metal structure allows the construction of capacitors, filters, or active devices enabling a smaller RF device and/or to shunt a signal to the integrated ground plane. This reduces the RF, Electronic noise and results in a reduced device size.
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
27.
Heterogenous integration for RF, microwave and MM wave systems in photoactive glass substrates
The present invention includes a method for creating a system in a package with integrated lumped element devices and active devices on a single chip/substrate for heterogeneous integration system-on-chip (HiSoC) in photo-definable glass, comprising: masking a design layout comprising one or more electrical passive and active components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass.
H01L 23/051 - ContainersSeals characterised by the shape the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
The present invention includes a method of creating high temperature mechanically and thermally stabilized PCB fabrication on a photo-definable glass substrate or photosensitive glass substrate.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
The present invention includes a method of creating high temperature mechanically and thermally stabilized PCB fabrication on a photo-definable glass substrate or photosensitive glass substrate.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
C03C 4/04 - Compositions for glass with special properties for photosensitive glass
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
C03C 3/095 - Glass compositions containing silica with 40% to 90% silica by weight containing rare earths
A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01S 5/32 - Structure or shape of the active regionMaterials used for the active region comprising PN junctions, e.g. hetero- or double- hetero-structures
A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.
H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
H01S 5/32 - Structure or shape of the active regionMaterials used for the active region comprising PN junctions, e.g. hetero- or double- hetero-structures
35.
GLASS BASED EMPTY SUBSTRATE INTEGRATED WAVEGUIDE DEVICES
The present invention includes a method of creating high Q empty substrate integrated waveguide devices and/or system with low loss, mechanically and thermally stabilized in photodefmable glass ceramic substrate. The photodefmable glass ceramic process enables high performance, high quality, and/or low-cost structures. Compact low loss RF empty substrate integrated waveguide devices are a cornerstone technological requirement for RF systems, in particular, for portable systems.
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
Disclosed is a high Q empty substrate integrated waveguide (ESIW) device or system with low loss, mechanically and thermally stabilized in a photodefinable glass ceramic substrate. In one aspect the ESIW has a lower cut-off frequency than a printed circuit board waveguide device at the same frequency. In another aspect the ESIW has a higher peak power handling capability than a printed circuit ESIW.
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
37.
GLASS BASED EMPTY SUBSTRATE INTEGRATED WAVEGUIDE DEVICES
The present invention includes a method of creating high Q empty substrate integrated waveguide devices and/or system with low loss, mechanically and thermally stabilized in photodefmable glass ceramic substrate. The photodefmable glass ceramic process enables high performance, high quality, and/or low-cost structures. Compact low loss RF empty substrate integrated waveguide devices are a cornerstone technological requirement for RF systems, in particular, for portable systems.
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
38.
2D and 3D inductors fabricating photoactive substrates
A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
39.
2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates
The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
40.
HETEROGENOUS INTEGRATION FOR RF, MICROWAVE AND MM WAVE SYSTEMS IN PHOTOACTIVE GLASS SUBSTRATES
The present invention includes a method for creating a system in a package with integrated lumped element devices and active devices on a single chip/substrate for heterogeneous integration system-on-chip (HiSoC) in photo-definable glass, comprising: masking a design layout comprising one or more electrical passive and active components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass- crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass.
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
H01L 23/528 - Layout of the interconnection structure
41.
ANNULAR CAPACITOR RF, MICROWAVE AND MM WAVE SYSTEMS
The present invention includes a method for creating an annular capacitor adjacent to via or imbedded metal structure allowing for device to be made in close proximity to the via connecting to a ground plane. The annular capacitor in close proximity to the metal filled via or imbedded metal structure allows the construction of capacitors, filters, or active devices enabling a smaller RF device and/or to shunt a signal to the integrated ground plane. This reduces the RF, Electronic noise and results in a reduced device size.
The present invention includes a method of making a device that eliminates a vertical transition from a substrate to a metal structure comprising: providing a lapped and polished substrate with at least one metal trench or via in the substrate having a transition between a surface of the substrate and a surface of the metal; coating or depositing on the substrate the same metal as the metal in the trench or via, wherein a thickness of the coated or deposited metal is at least twice the thickness of the transition; chemically-mechanically polishing at least 50% of the thickness of the coated or deposited metal; and using an etching process to etch the deposited material on the surface of to eliminate the vertical transition from the surface of the substrate to the metal trench or via.
H01L 21/70 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereofManufacture of integrated circuit devices or of specific parts thereof
The present invention includes a method for creating a system in a package with integrated lumped element devices and active devices on a single chip/substrate for heterogeneous integration system-on-chip (HiSoC) in photo-definable glass, comprising: masking a design layout comprising one or more electrical passive and active components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass- crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass.
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
H01L 23/528 - Layout of the interconnection structure
44.
ANNULAR CAPACITOR RF, MICROWAVE AND MM WAVE SYSTEMS
The present invention includes a method for creating an annular capacitor adjacent to via or imbedded metal structure allowing for device to be made in close proximity to the via connecting to a ground plane. The annular capacitor in close proximity to the metal filled via or imbedded metal structure allows the construction of capacitors, filters, or active devices enabling a smaller RF device and/or to shunt a signal to the integrated ground plane. This reduces the RF, Electronic noise and results in a reduced device size.
The present invention includes a device and method for making an RF circulator/isolator device comprising: a substrate comprising one or more conductive coils, wherein the one or more conductive coils are formed in, on, or about the substrate; an opening in the substrate comprising an iron core, wherein the iron core is formed in the substrate after the formation of the one or more conductive coils, wherein the iron core is positioned and shaped to create a circulator/isolator in the substrate; and one or more connectors, vias, resistors, capacitors, or other integrated circuits of devices connected to the conductive coils of the circulator/isolator.
C03C 3/095 - Glass compositions containing silica with 40% to 90% silica by weight containing rare earths
C03C 4/04 - Compositions for glass with special properties for photosensitive glass
C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
The present invention includes a method of making a slotted waveguide antenna structure with a matched ground plane comprising: forming in a photosensitive glass substrate a coaxial-to-coplanar waveguide (CPW) section connected to a power divider, an emission cavity area for the slotted antenna and one or more vias; depositing a metal ground plane to a first surface of the photosensitive glass substrate; depositing a copper layer on the photosensitive glass substrate with a pattern of slots that form a slot antenna above the emission cavity; forming one or more glass pillars in the emission cavity under the slot antenna; etching away the photosensitive glass in the emission cavity while retaining the one or more glass pillars; connecting a micro coaxial connector to the coaxial-to-coplanar waveguide (CPW) section; and one or more solder bumps at the vias that connect to the ground plane, to form a slotted antenna.
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
H01Q 13/18 - Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity
H01Q 13/20 - Non-resonant leaky-waveguide or transmission-line antennas Equivalent structures causing radiation along the transmission path of a guided wave
48.
HIGH EFFICIENCY COMPACT SLOTTED ANTENNA WITH A GROUND PLANE
The present invention includes a method of making a slotted waveguide antenna structure with a matched ground plane comprising: forming in a photosensitive glass substrate a coaxial-to-coplanar waveguide (CPW) section connected to a power divider, an emission cavity area for the slotted antenna and one or more vias; depositing a metal ground plane to a first surface of the photosensitive glass substrate; depositing a copper layer on the photosensitive glass substrate with a pattern of slots that form a slot antenna above the emission cavity; forming one or more glass pillars in the emission cavity under the slot antenna; etching away the photosensitive glass in the emission cavity while retaining the one or more glass pillars; connecting a micro coaxial connector to the coaxial-to-coplanar waveguide (CPW) section; and one or more solder bumps at the vias that connect to the ground plane, to form a slotted antenna.
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
H01Q 13/18 - Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity
H01Q 13/20 - Non-resonant leaky-waveguide or transmission-line antennas Equivalent structures causing radiation along the transmission path of a guided wave
The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
C03C 17/06 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with metals
C03C 4/04 - Compositions for glass with special properties for photosensitive glass
G02B 1/12 - Optical coatings produced by application to, or surface treatment of, optical elements by surface treatment, e.g. by irradiation
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome
H01Q 21/28 - Combinations of substantially independent non-interacting antenna units or systems
H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
H01Q 3/34 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means
The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
C03C 17/06 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with metals
C03C 4/04 - Compositions for glass with special properties for photosensitive glass
G02B 1/12 - Optical coatings produced by application to, or surface treatment of, optical elements by surface treatment, e.g. by irradiation
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome
H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
H01Q 3/34 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the phase by electrical means
H01Q 21/28 - Combinations of substantially independent non-interacting antenna units or systems
The present invention includes a method of fabricating an integrated RF power condition capacitor with a capacitance greater than or equal to 1 nf and less than 1 mm2, and a device made by the method.
The present invention includes a method of fabricating an integrated RF power condition capacitor with a capacitance greater than or equal to 1 nf and less than 1 mm2, and a device made by the method.
The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
H03H 3/00 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
H01P 1/205 - Comb or interdigital filtersCascaded coaxial cavities
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
H03H 3/00 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
H01Q 1/00 - Details of, or arrangements associated with, antennas
The present invention provides a method to fabricate an optical coupler comprising the steps of: preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide; masking a halftone design with variation in optical density to delineate an optical element in the glass; exposing the photosensitive glass substrate to an activating energy source; exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature; cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate; and etching the glass-crystalline substrate with an etchant solution to form the one or more optical elements.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
C03C 3/085 - Glass compositions containing silica with 40% to 90% silica by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
G02B 3/08 - Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
59.
3D capacitor and capacitor array fabricating photoactive substrates
The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.
The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
C03C 15/00 - Surface treatment of glass, not in the form of fibres or filaments, by etching
H01L 23/08 - ContainersSeals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
H01L 23/08 - ContainersSeals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors, antenna, resistors, capacitors, transmission lines and transformers) in photo definable glass ceramic substrates in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/528 - Layout of the interconnection structure
The present invention includes a device and method for making an RF circulator/isolator device comprising: a substrate comprising one or more conductive coils, wherein the one or more conductive coils are formed in, on, or about the substrate; an opening in the substrate comprising an iron core, wherein the iron core is formed in the substrate after the formation of the one or more conductive coils, wherein the iron core is positioned and shaped to create a circulator/isolator in the substrate; and one or more connectors, vias, resistors, capacitors, or other integrated circuits of devices connected to the conductive coils of the circulator/isolator.
The present invention includes a device and method for making an RF circulator/isolator device comprising: a substrate comprising one or more conductive coils, wherein the one or more conductive coils are formed in, on, or about the substrate; an opening in the substrate comprising an iron core, wherein the iron core is formed in the substrate after the formation of the one or more conductive coils, wherein the iron core is positioned and shaped to create a circulator/isolator in the substrate; and one or more connectors, vias, resistors, capacitors, or other integrated circuits of devices connected to the conductive coils of the circulator/isolator.
The present invention provides a method to fabricate an optical coupler comprising the steps of: preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide; masking a halftone design with variation in optical density to delineate an optical element in the glass; exposing the photosensitive glass substrate to an activating energy source; exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature; cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate; and etching the glass-crystalline substrate with an etchant solution to form the one or more optical elements.
The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.
The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.
The invention relates to eliminating or dramatically reducing the mechanical distortion induced in photo-definable glass as a function of temperature and time processing during metallization that enable multi-layer and single layer photo-definable structures, that can contain electronic, photonic, or MEMS devices to create unique vertically integrated device or system level structures.
The invention relates to eliminating or dramatically reducing the mechanical distortion induced in photo-definable glass as a function of temperature and time processing during metallization that enable multi-layer and single layer photo-definable structures, that can contain electronic, photonic, or MEMS devices to create unique vertically integrated device or system level structures.
A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
71.
Photo-definable glass with integrated electronics and ground plane
The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors, antenna, resistors, capacitors, transmission lines and transformers) in photo definable glass ceramic substrates in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/528 - Layout of the interconnection structure
A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
73.
METHODS OF FABRICATING PHOTOACTIVE SUBSTRATES FOR MICRO-LENSES AND ARRAYS
A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising form one or more micro lens on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more a micro lens.
A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.
C03C 3/095 - Glass compositions containing silica with 40% to 90% silica by weight containing rare earths
B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
75.
Methods to fabricate a photoactive substrate suitable for microfabrication
A method of fabrication and device with holes for electrical conduction made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form the one or more depressions or through holes for electrical conduction in the device.
The present invention provides a method of forming one or more biological-binding areas on a substrate for biological-testing. The method includes activating at least a portion of a glass-ceramic substrate comprising glass and one or more metal containing compounds. The one or more metal containing compounds have a range of diameters that are less than about 300 nanometers in diameter and are spaced an average distance of at least one-half the midpoint of the diameter range apart. The one or more metals include compounds selected from metal oxides, metal nanoparticles, metal alloys, and atomic metals. The glass-ceramic substrate is heated to a temperature near the glass transformation temperature to form one or more metal nanoparticles in one or more ceramic biological-binding areas. The glass-ceramic substrate is etched to expose one or more metal. One or more biological molecules are contacted with one or more ceramic biological-binding areas to provide one or more biological testing areas with an increased binding area as compared to un-activated areas.
C40B 50/18 - Solid phase synthesis, i.e. wherein one or more library building blocks are bound to a solid support during library creationParticular methods of cleavage from the solid support using a particular method of attachment to the solid support
77.
Compositions and methods to fabricate a photoactive substrate suitable for shaped glass structures
This invention provides an inexpensive and rapid method for fabricating a high-anisotropic-etch ratio, shaped glass structures using a novel photosensitive glass composition. Structures of the photosensitive glass may include micro-channels, micro-optics, microposts, or arrays of hollow micro-needles. Furthermore, such shaped glass structures can be used to form a negative mold for casting the shape in other materials.
This invention provides an inexpensive and rapid method for fabricating a high-anisotropic-etch ratio, shaped glass structures using a novel photosensitive glass composition. Structures of the photosensitive glass may include micro-channels, micro-optics, microposts, or arrays of hollow micro-needles. Furthermore, such shaped glass structures can be used to form a negative mold for casting the shape in other materials.
09 - Scientific and electric apparatus and instruments
Goods & Services
Optical glass in the form of [plates, ]disks, cylinders, lenses, [prisms ]and mirror blanks for scientific purposes; [laboratory glassware; ]optical materials and components made of glass, glass ceramics and crystals for micro lithography applications, namely, biosensors
