An electronic device provided herein includes a substrate, a circuit layer, a first insulating layer, a first reflective layer, a second insulating layer, a second reflective layer. The circuit layer is disposed on the substrate. The first insulating layer is disposed on the circuit layer. The first reflective layer is disposed on the first insulating layer. The second insulating layer is disposed on the first reflective layer. The second reflective layer is disposed on the second insulating layer. The second reflective layer includes a plurality of reflective sub-layers, and a portion of the first reflective layer is disposed corresponding to a gap between two adjacent ones of the plurality of reflective sub-layers.
Disclosed are a medical image display method and an electronic device. The medical image display method includes the following steps: receiving a plurality of medical reference images corresponding to a plurality of image sources in different formats; performing image co-registration and image segmentation based on the medical reference images to generate at least one co-registered image mask; performing image overlay according to the at least one co-registered image mask and at least one of the medical reference images to generate an overlay image; and displaying a medical image according to the overlay image.
An electronic device includes a power source, a light source and a driver. The power source includes a control signal end and an output end. The light source is electrically connected to the output end. The driver is electrically connected to the control signal end, and the driver includes: a signal source, and a signal conversion circuit. The signal conversion circuit is electrically connected to the signal source and the control signal end, wherein the signal conversion circuit includes a switch, the switch includes a control end, and the signal source is electrically connected to the control end of the switch.
A display device is provided. The display device is disposed under a windshield. The bottom of the windshield has a first arc-shaped edge. The display device includes a display panel to project a display image onto the windshield. The display panel is flat. The display panel has a second arc-shaped edge adjacent to the first arc-shaped edge. The first arc-shaped edge has a first radius of curvature, represented by Rs1. The second arc-shaped edge has a second radius of curvature, represented by Rd1. The ratio of the first radius of curvature to the second radius of curvature is greater than or equal to 0.1 and less than or equal to 10.
An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a seed layer, and a conductor layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a through hole, and the through hole has a sidewall connected to the first surface and the second surface. The seed layer is disposed on the first surface, the second surface, and the sidewall. The conductor layer is disposed on the seed layer, and a roughness of a surface of the seed layer is greater than or equal to 1 nm and less than or equal to 1 μm.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
An electronic device includes: a housing, a first restraining holder, a second restraining holder and at least one protruding rib structure. The housing includes a first surface. The first restraining holder, the second restraining holder and at least part of the protruding rib structure are arranged on the first surface, and at least part of the protruding rib structure is disposed between the first restraining holder and the second restraining holder.
An electronic device includes a substrate, a first active layer, a second active layer, an insulating layer and a metal line. The first active layer is disposed on the substrate and includes a first end. The second active layer is disposed on the substrate and includes a second end, wherein the second end is adjacent to the first end. The insulating layer is disposed on the first active layer and the second active layer. The metal line is disposed on the insulating layer. In a cross-sectional view of the electronic device, the insulating layer includes a first opening, and a portion of the metal line is disposed in the first opening and overlapped with the first end, and in a top view of the electronic device, the first end has an edge, a portion of the edge is arc-shaped and located between the first opening and the second end.
An electronic device includes a substrate and a first switching element. The substrate has a peripheral circuit area. The first switching element is disposed in the peripheral circuit area and includes a first transistor and a second transistor. A first gate of the first transistor is connected to a second gate of the second transistor. A projection area of a semiconductor layer of the first transistor and a semiconductor layer of the second transistor to the substrate is within a projection area of the first gate and the second gate to the substrate.
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
An electronic device includes a plurality of electronic units. Each electronic unit includes a pixel circuit and a plurality of tunable circuits. The plurality of tunable circuits is coupled to the pixel circuit. and includes at least one scan transistor, a plurality of de-multiplexer transistors, a plurality of bias transistors, at least one bias-enable transistor and a plurality of storage capacitors. The plurality of de-multiplexer transistors is coupled to the at least one scan transistor. The plurality of bias transistors is coupled to the plurality of de-multiplexer transistors. The at least one bias-enable transistor is coupled to the plurality of bias transistors. The plurality of storage capacitors is coupled to a data line through the at least one scan transistor and the plurality of de-multiplexer transistors, and is coupled to at least one bias voltage line through the plurality of bias transistors and the at least one bias-enable transistor.
The disclosure provides a display panel including a substrate, a first electrode layer, a second electrode layer, and a spacer. The first electrode layer is located on the active layer, and the first electrode layer includes a first gate and a second gate. The second electrode layer is located on the substrate. The second electrode layer has first portion overlapping the first gate, a second portion overlapping the second gate, and a first necking portion connecting the first portion of the second electrode layer and the second portion of the second electrode layer. The spacer overlaps the first necking portion of the second electrode layer.
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
An electronic device is provided. The electronic device includes a plurality of electronic units. Each of the plurality of electronic units includes a pixel circuit and a plurality of tunable circuits. The plurality of tunable circuits is coupled to the pixel circuit. The pixel circuit includes at least one scan transistor a plurality of de-multiplexer transistors, a plurality of bias transistors, and a storage capacitor. The plurality of de-multiplexer transistors is coupled to the at least one scan transistor. The plurality of bias transistors is coupled to the plurality of de-multiplexer transistors. The storage capacitor is coupled to a data line through the at least one scan transistor.
H01Q 23/00 - Antennas with active circuits or circuit elements integrated within them or attached to them
H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
H01Q 3/28 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture varying the amplitude
An electronic device is provided. The electronic device includes a laminated substrate. The laminated substrate includes a substrate having a first surface and a second surface opposite the first surface; a first optical adjustment layer disposed on the first surface; a dielectric layer disposed on the first optical adjustment layer; and an ink layer disposed on the second surface. The first optical adjustment layer includes at least one of a metal material, a semiconductor material, semi-transparent ink and a transparent conductive material.
A display device includes a first substrate, a plurality of light-emitting units, and a plurality of color filter units. The light-emitting units are disposed on the first substrate and include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit emit light of different colors respectively. The color filter units are disposed on the light-emitting units and include a first color filter unit, a second color filter unit, and a third color filter unit. The first color filter unit, the second color filter unit, and the third color filter unit overlap the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit respectively. The first color filter unit, the second color filter unit, and the third color filter unit include a scattering particle.
An electronic device includes a substrate, a circuit layer, a first electronic element and a first insulating structure. The substrate includes a first main structure, a second main structure adjacent to the first main structure, a first connecting structure connecting the first main structure and the second main structure, and a first space disposed between the first main structure and the second main structure, wherein a first edge of the first main structure is overlapped with a part of a boundary of the first space. The circuit layer has a first semiconductor. The first electronic element is electrically connected to the first semiconductor. The first insulating structure includes a first groove. In a top view, at least a part of the first groove of the first insulating structure is disposed between the first edge of the first main structure and the first electronic element.
An electronic device includes a substrate, a first signal line, a first dummy conductive pattern, and a sensing device. The substrate includes a first region, a second region, and a display region. The second region is located between the first region and the display region. The first signal line and the first dummy conductive pattern are disposed on the substrate. The first signal line includes a first portion extending along a first direction and a second portion extending along a second direction different from the first direction, and the first portion and the second portion correspond to the second region. The first dummy conductive pattern corresponds to the second region and is electrically disconnected to the first signal line. The sensing device is overlapped with the first region.
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
16.
3D PRINTING DEVICE, LIGHT CONTROL MODULE AND OPERATION METHOD OF 3D PRINTING DEVICE
A 3D printing device includes a light control module, a light source module, and a receiving slot. The light source module provides a light beam to the light control module. The receiving slot receives a photo-curing material. The light control module is between the light source module and the receiving slot. The photo-curing material is cured by the light beam. The light control module includes first and second substrates, a dielectric layer, and a polarizing element. The first substrate has outer and inner surfaces opposite to each other. The second substrate is opposite to the first substrate. The dielectric layer is between the inner surface of the first substrate and the second substrate. The polarizing element is on the outer surface of the first substrate. A polarization degree of the polarizing element for a light beam having a wavelength range of 375 nm to 405 nm is 98% to 100%.
B29C 64/129 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
An electronic device includes a substrate, pixels, a second sensing unit, a first driving unit and a second driving unit. Each pixel includes a display unit including a self-luminous element and a first sensing unit. The second sensing unit overlaps at least one of the pixels. In a first mode, the first driving unit outputs a first signal to the display unit. In a second mode, the first driving unit outputs a second signal to the second sensing unit, receives a third signal from the second sensing unit, and outputs a fourth signal to the second driving unit according to the third signal. In a third mode, the second driving unit outputs a fifth signal to the first sensing unit according to the fourth signal, and the first sensing unit transmits a sixth signal to the first driving unit.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
G06V 40/10 - Human or animal bodies, e.g. vehicle occupants or pedestriansBody parts, e.g. hands
H04N 25/616 - Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
An electronic device is provided. The electronic device includes a sensing pixel. The sensing pixel includes a photosensitive element, a first transistor, a second transistor, and a third transistor. A control terminal of the first transistor is electrically connected to a read signal line. A control terminal of the second transistor is electrically connected to the photosensitive element. A first terminal of the second transistor is electrically connected to a first voltage. A second terminal of the second transistor is electrically connected to a first terminal of the first transistor. A third terminal of the second transistor is electrically connected to a second voltage. A first terminal of the third transistor is electrically connected to a reset voltage. A second terminal of the third transistor is electrically connected to the photosensitive element. A control terminal of the third transistor is electrically connected to a reset signal line.
An electronic device is provided. The second transistor, the third transistor, the first capacitor and the current driving element are coupled to the first transistor. The fourth transistor writes first and second data to a control terminal of the third transistor and a control terminal of the first transistor according to first and second pulses of a first scanning signal. The second capacitor is coupled to the third transistor and a sweep signal. In a light-emitting period, the second transistor transmits a voltage signal to a first terminal of the first transistor according to an enabling signal and causes the current driving element to emit light. After the third transistor is turned on according to the sweep signal, the voltage signal is transmitted to the control terminal of the first transistor to turn off the first transistor and cause the current driving element to stop emitting light.
An electronic device having an active region and a non-active region is provided and includes an electronic component, a first gate driving circuit, at least one first output control component and a first control circuit. The electronic component is disposed in the active region, and the first gate driving circuit, the first output control component and the first control circuit are disposed in the non-active region. The first gate driving circuit is coupled to the electronic component. The first output control component includes a control terminal, a first terminal and a second terminal, wherein the control terminal of the first output control component is coupled to the first control circuit, the first terminal of the first output control component is coupled to the first gate driving circuit, and the second terminal of the at least one first output control component is coupled to the electronic component.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
A method for displaying an image includes the following steps. A display panel and a control circuit are provided, wherein the control circuit is electrically connected to the display panel. During a detection period, the control circuit provides a plurality of gate testing voltages to the display panel, wherein the plurality of gate testing voltages include a maximum testing voltage, an operation voltage and a failure testing voltage, the maximum testing voltage is higher than the operation voltage, the operation voltage is higher than the failure testing voltage, and the time point at which the maximum testing voltage appears is earlier than the time point at which the failure testing voltage appears. During a working period, the control circuit outputs at least one image signal to the display panel according to the operation voltage.
A calculation system has a receiving unit, a calculation unit, a determination unit, and an output unit. The receiving unit of the calculation system is used to receive data of historically returned products. The calculation unit of the calculation system is used to calculate the number of each returned product in the next time period based on the data of the historically returned products. The determination unit of the calculation system is used to select the returned products with repair benefits in the next time period, and to calculate the quantity of each material required for repairing the returned products with repair benefits in the next time period, so as to generate data of the quantity of each material. The output unit of the calculation system is used to output the data of the quantity of each material.
A process management system is provided by the present disclosure. The process management system includes a receiving unit, a calculating unit, a comparing unit and an output unit. The receiving unit is used for receiving a real-time data of a machine, wherein the real-time data includes at least one parameter value. The calculating unit is used for calculating and generating at least one contribution value of the real-time data, wherein the at least one contribution value is calculated from the at least one parameter value. The comparing unit is used for comparing the at least one contribution value and at least one controlled contribution value of at least one controlled data to generate at least one comparing value. The output unit is used for outputting at least one comparing result to which the at least one comparing value corresponds.
G05B 19/418 - Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
An electronic device includes a substrate, a plurality of transistors disposed on the substrate, a light emitting unit disposed on at least one of the plurality of transistors, a first insulating layer disposed on the light emitting unit and an optical unit. The first insulating layer has a first opening and a second opening, and the optical unit is disposed in the first opening. In a top view of the electronic device, the first opening is overlapped with at least a portion of the light emitting unit, and the second opening is overlapped with at least a portion of at least one of the plurality of transistors.
The display device provided in the disclosure includes a circuit substrate, a plurality of light-emitting units, a light collection layer, a light adjustment layer, and a color filter layer. The light-emitting units are disposed on the circuit substrate. The light collection layer is disposed on the light-emitting units and includes a plurality of penetrating portions and a plurality of reflecting portions disposed around the penetrating portions. The penetrating portions respectively overlap with the light-emitting units. The light adjustment layer is disposed on the light collection layer. The color filter layer is disposed on the light adjustment layer and includes a plurality of color filter units respectively overlapping with the penetrating portions.
A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes an electronic unit, an encapsulation layer, a circuit structure, a protective layer, a first heat conducting element, and a second heat conducting element. The encapsulation layer surrounds the electronic unit and has a first side and a second side opposite to each other. The circuit structure is disposed on the first side of the encapsulation layer and electronically connected to the electronic unit. The protective layer is disposed on the second side of the encapsulation layer. The first heat conducting element is disposed on the protective layer. The second heat conducting element is disposed on the first heat conducting element. A thermal conductivity of the second heat conducting element is different from a thermal conductivity of the first heat conducting element.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 25/11 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass
A display device is provided and includes a substrate, a first light-emitting unit emitting a first color light, a second light-emitting unit emitting a second color light, a first color filter disposed on the first light-emitting unit, and a second color filter disposed on the second light-emitting unit. The first light-emitting unit and the second light-emitting unit are disposed on the substrate. The first color filter has a first width, a first distance is between the first color filter and the first light-emitting unit, the second color filter has a second width, and a second distance is between the second color filter and the second light-emitting unit. The first width, the second width, the first distance, and the second distance satisfy an equation: tan−1 [(W1/2)/D1] >tan−1 [(W2/2)/D2], wherein W1 represents the first width, W2 represents the second width, D1 represents the first distance, and D2 represents the second distance.
An electronic device includes a first substrate, a semiconductor element, a first inorganic layer, a first electrode, a second electrode and a conductive element. The first inorganic layer is disposed between the first substrate and the semiconductor element. The first inorganic layer has a first surface adjacent to the semiconductor element, a second surface opposite to the first surface, and a through-hole penetrating from the first surface to the second surface. The first electrode is disposed between the first substrate and the first inorganic layer. The second electrode has a first portion disposed on the second surface of the first inorganic layer, and a second portion disposed in the through-hole of the first inorganic layer. The conductive element is disposed between the first electrode and the second electrode. Moreover, in a cross-sectional view of the electronic device, the first portion of the second electrode has a rounded corner.
H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/042 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
An electronic device includes an electronic unit and a connection structure disposed on the electronic unit. The electronic unit includes an electronic element and a conductive pad electrically connected to the electronic element. The connection structure includes a first pad electrically connected to the conductive pad, a second pad electrically connected to the first pad, and a first polymer surrounding the first pad and the second pad. The first pad includes a first portion, a second portion, and a third portion. The first portion is in contact with the conductive pad, the second portion connects the first portion, and the third portion connects the second portion and extends outwardly with respect to the first portion. The third portion has a first edge adjacent to the conductive pad, and at least a portion of the first edge is inclined toward the conductive pad.
An electronic device has multiple pixel areas, which are divided into multiple first regions and multiple second regions. The electronic device includes a first panel, a second panel, multiple first filter units, and multiple second filter units. The first panel includes a first cholesteric liquid crystal layer for reflecting a first color light. The second panel is disposed at one side of the first panel and includes a second cholesteric liquid crystal layer for reflecting a second color light. The first filter units and the second filter units are disposed between the first cholesteric liquid crystal layer and the second cholesteric liquid crystal layer. The first filter units are respectively located in the first regions, and the second filter units are respectively located in the second regions. The first filter units and the second filter units are configured to absorb lights of different colors.
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/133 - Constructional arrangementsOperation of liquid crystal cellsCircuit arrangements
G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
An electronic device, including an electronic unit, a package layer, a circuit structure, and a first heat dissipation layer, is provided. The package layer surrounds the electronic unit. The circuit structure is disposed on the package layer and is electrically connected to the electronic unit. The first heat dissipation layer is disposed on the package layer and is opposite to the circuit structure. The circuit structure includes a conductive portion and an insulative portion surrounding the conductive portion. The first heat dissipation layer includes a first volume, the conductive portion includes a second volume, and the first volume is greater than or equal to the second volume.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/367 - Cooling facilitated by shape of device
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
32.
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
An electronic device and a method for manufacturing the same are provided. The electronic device includes an electronic unit, an encapsulation layer, a circuit structure, and a first heat-conducting assembly is provided. The encapsulation layer surrounds the electronic unit and has a first side and a second side opposite to each other. The circuit structure is disposed on the first side of the encapsulation layer and is electrically connected to the electronic unit. The first heat-conducting assembly is disposed on the second side of the encapsulation layer. Viewing in a top view, the first heat-conducting assembly has a first area, the electronic unit has a second area, and a ratio of the first area to the second area is greater than or equal to 1 and less than 9.8.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/367 - Cooling facilitated by shape of device
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
An electronic device includes a substrate, a layer overlapped with the substrate and having a first side and a second side opposite to the first side, a sensor unit disposed between the substrate and the layer, a first blocking layer disposed on the first side, and a second blocking layer disposed on the sensor unit. The layer includes flexible material. The second side is disposed between the sensor unit and the first side, and the first side is between the first blocking layer and the second side. The first blocking layer has a first opening, and the second blocking layer has a second opening. A width of the first opening is smaller than a width of the second opening.
An electronic device is provided, including a substrate, an electronic component, and a circuit. The electronic component is disposed on the substrate. The circuit is disposed on the substrate and coupled to the electronic component. The circuit includes a first transistor, a first conductive line, a second transistor, a second conductive line, a third conductive line, and a fourth conductive line. The first transistor includes a first semiconductor and a first gate that overlaps with the first semiconductor. The first conductive line is coupled to the first gate of the first transistor. The second transistor includes a second semiconductor and a second gate that overlaps with the second semiconductor. The second semiconductor is different from the first semiconductor in material. The second conductive line is disposed adjacent to the first conductive line and is coupled to the second gate of the second transistor.
An electronic device, including a substrate, a plurality of light emitting elements, two adjacent first protrusions, another two adjacent first protrusions and two adjacent second protrusions. The plurality of light emitting elements are disposed on a first surface of the substrate. The two adjacent first protrusions are disposed on the first surface and separated by a first distance. The another two adjacent first protrusions are disposed on the first surface and separated by a second distance, wherein at least one of the plurality of light emitting elements is disposed between the another two adjacent first protrusions. The two adjacent second protrusions and the two adjacent first protrusions are respectively disposed on opposite sides of the substrate. The first distance is less than the second distance, and at least one of the two adjacent second protrusions is not overlapped with the two adjacent first protrusions.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H10K 102/00 - Constructional details relating to the organic devices covered by this subclass
A package device is provided and includes a substrate and a conductive element. The substrate includes a through hole, a first portion, and a second portion, wherein the through hole penetrates the first portion and the second portion, and a first thickness of the first portion is less than a second thickness of the second portion. The conductive element is disposed in the through hole, wherein the first portion of the substrate includes compressive stress, and the second portion of the substrate includes tensile stress.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/66 - Testing or measuring during manufacture or treatment
An electronic device has a data line, a first scan line, a second scan line, a first electronic unit, a second electronic unit, a first circuit unit, and a second circuit unit. The first circuit unit is used to drive the first electronic unit and includes a first time-interleaved circuit. The second circuit unit is adjacent to the first circuit unit and is used to drive the second electronic unit, and includes a second time-interleaved circuit. The data line is coupled to the first circuit unit and the second circuit unit, the first scan line is coupled to the first time-interleaved circuit, and the second scan line is coupled to the second time-interleaved circuit.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
38.
Inventory quantity calculation system for estimating inventory quantities
An inventory quantity calculation system includes a receiving unit, a calculation unit, and an output unit. The receiving unit receives historical beginning-of-period stock quantity estimates, historical end-of-period stock quantity estimates, historical end-of-period actual stock quantities, and historical estimated shipment quantities. Based on the received historical beginning-of-period stock quantity estimates, historical end-of-period stock quantity estimates, historical end-of-period actual stock quantities, and historical estimated shipment quantities, the calculation unit determines a decision value and calculates a first stock quantity estimate and a second stock quantity estimate for the end of the next time period. The output unit outputs the first stock quantity estimate, the second stock quantity estimate, or a third stock quantity estimate based on the decision value. The third stock quantity estimate is calculated based on the first stock quantity estimate and the second stock quantity estimate.
A manufacturing method of a package structure of an electronic device is provided. The manufacturing method includes the following. First, a carrier plate is provided. Next, an encapsulation structure is formed on the carrier plate, wherein the encapsulation structure comprises a semiconductor chip and an encapsulation layer and has a third surface and a fourth surface opposite to each other, wherein a pad is disposed on a surface of the semiconductor chip close to the carrier plate, and the encapsulation layer exposes the semiconductor chip, wherein the third surface of the encapsulation structure faces the carrier plate. Then, an anti-warpage structure is formed on the fourth surface of the encapsulation structure. After that, the carrier plate is removed. Then, a redistribution structure is formed on the third surface of the encapsulation structure.
An electronic device includes a stretchable substrate, plurality of first electronic units and a plurality of second electronic units. The stretchable substrate has a plurality of island portions and a plurality of bridge portions, and each of the bridge portions is connected to at least two of the island portions. The first electronic units are disposed on the island portions and configured to emit light. The second electronic units are disposed on the stretchable substrate, and each of the second electronic units includes a first pattern disposed on one of the island portions and a connection pattern disposed on one of the bridge portions. The second electronic units are configured to perform a sense function.
H10H 29/49 - Interconnections, e.g. wiring lines or terminals
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H10H 29/37 - Pixel-defining structures, e.g. banks between the LEDs
An electronic device includes a substrate, a first interposer and a plurality of package units. The first interposer is disposed on the substrate. The plurality of package units are disposed on the first interposer. Along a vertical direction, one of the plurality of package units sequentially includes a circuit structure, a first chip and a plurality of second chips. The circuit structure is disposed on the first interposer and electrically connected to the first interposer. The first chip is disposed on the circuit structure and electrically connected to the circuit structure. The plurality of second chips are disposed on the first chip and electrically connected to the circuit structure. The first chip overlaps at least two of the plurality of second chips, and the plurality of package units are electrically connected to the substrate through the first interposer.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
H01L 23/367 - Cooling facilitated by shape of device
H01L 25/03 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes
An electronic device is provided. The electronic device includes a substrate including a display area and a peripheral area surrounding the display area, and an electrostatic protection structure disposed in the peripheral area. The electrostatic protection structure includes a first metal layer, an insulating layer and a second metal layer. The first metal layer includes an adjacent first portion and a second portion. The insulating layer is disposed on the first metal layer. The second metal layer is disposed on the insulating layer and includes a third portion, a fourth portion and a connecting portion between the third portion and the fourth portion. In a schematic top view, the first portion overlaps the third portion. The second portion overlaps the fourth portion. The connecting portion does not overlap the first metal layer.
An electronic device includes a substrate, electronic elements, a layer, first bonding pads, a transistor and second bonding pads. The electronic elements are disposed on the substrate. The layer is disposed between the substrate and the electronic elements. The first bonding pads are disposed on a first side of the substrate. The transistor is electrically connected with at least one of the electronic elements. The second bonding pads are disposed on a second side of the substrate and separated from the first bonding pads. The first side is opposite to the second side, and a number of the first bonding pads is different from a number of the second bonding pads. At least one of the first bonding pads is overlapped with the at least one of the electronic elements, and another one of the first bonding pads is overlapped with the transistor.
A multi-layered structure disposed on a supporting entity is provided. The multi-layered structure includes a first layer, a first test mark, a second layer, and a second test mark. The first layer is disposed on the supporting entity. The first test mark is disposed on the supporting entity. The second layer is disposed on the first layer. The second test mark is disposed on the first layer, wherein one of the first layer and the second layer is a conductive layer, and the other of the first layer and the second layer is an insulating layer.
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
The disclosure provides a semiconductor chip including a first semiconductor element, a second semiconductor element, a filling layer, a transparent conductive layer and a first metal layer. The second semiconductor element is adjacent to the first semiconductor element. The filling layer wraps the first semiconductor element and the second semiconductor element. The transparent conductive layer is disposed on the filling layer. The transparent conductive layer electrically connects the first semiconductor element and the second semiconductor element. The first metal layer is disposed under the filling layer and includes a first portion and a second portion. The first portion is electrically connected to at least one of the first semiconductor element and the second semiconductor element. The second portion is disposed on a side surface of the filling layer. The semiconductor chip of the disclosure is adapted to reduce a defect rate or power consumption.
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
An electronic device including an identified pattern, a visible shielding structure, a first color unit, and a second color unit is provided. The identified pattern receives an invisible light. The visible light shielding structure is disposed on the identified pattern and includes a first portion overlapped with the identified pattern. The first color unit and the second color unit are overlapped with the first portion, in which a transmittance of the first color unit with respect to the invisible light is less than a transmittance of the second color unit with respect to the invisible light, and a first width of the first color unit is less than a second width of the second color unit.
A display device includes a display panel, a viewing angle control panel and a first polarizing plate. The display panel includes a data line, a scan line and a first electrode. The data line extends along a first direction. The scan line extends along a second direction and intersecting with the data line. The first electrode has a plurality of fingers, wherein the plurality of fingers are arranged along the first direction. The viewing angle control panel overlaps the display panel. The first polarizing plate is disposed on a surface opposite to a light-emitting surface of the display panel and having a first absorption axis, wherein the first absorption axis is parallel to the first direction.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
A light emitting device includes a substrate, a pixel circuit disposed on the substrate, a light-emitting unit disposed on the pixel circuit, and a first color filter layer and a second color filter layer disposed on the pixel circuit. The pixel circuit includes a first transistor and a second transistor. The light-emitting unit includes a portion corresponding to a first light-emitting region and an another portion corresponding to a second light-emitting region. The second color filter layer is different from the first color filter layer in color. In a cross-section view, the first light-emitting region corresponds to a first portion of the first color filter layer and the first transistor, and the second light-emitting region corresponds to a second portion of the second color filter layer and the second transistor. A projection length of the first portion is different from a projection length of the second portion.
An electronic device including a substrate, a semiconductor disposed on the substrate, and a conductive layer disposed on the semiconductor is provided. The conductive layer includes a first electrode, second electrode and a third electrode disposed on a same plane and spaced apart from each other. The first electrode is electrically connected to the semiconductor, and the second electrode surrounds the first electrode in a top view of the electronic device, wherein in a cross-sectional view of the electronic device, the third electrode is between the second electrode and the first electrode.
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
H01L 23/60 - Protection against electrostatic charges or discharges, e.g. Faraday shields
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10D 89/60 - Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
The electronic device includes a first substrate, an active device, a first conductive element, an insulating layer, a first support member, a second support member, and a package element. The active device is disposed on the first substrate and includes a gate and a semiconductor layer. The first conductive element is disposed on the first substrate and is a same layer of the gate of the active device. The insulating layer is disposed on the substrate. The first support member is disposed on the insulating layer and overlaps the first conductive element. The second conductive element is disposed on the first substrate. The second support member overlaps the second conductive element. The package element is disposed on the first substrate.
An electronic device configured to switch between a share mode and a privacy mode includes a light emitting unit, a first viewing angle control unit, a lens array and a display unit. The first viewing angle control unit is disposed on the light emitting unit and includes a first region and a second region adjacent to the first region. The lens array is disposed on the first viewing angle control unit. The display unit is disposed on the lens array. In the privacy mode, a first voltage is provided to the first region of the first viewing angle control unit, a second voltage is provided to the second region of the first viewing angle control unit, and the first voltage is different from the second voltage.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
G02F 1/139 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering based on orientation effects in which the liquid crystal remains transparent
An electronic device includes a substrate, a first conductive wire, a plurality of semiconductors and a plurality of second conductive wires. The first conductive wire is configured to transmit a data signal and disposed on the substrate. The semiconductors are disposed on the substrate and overlapped with the first conductive wire. The semiconductors are separated from each other. The second conductive wires are configured to transmit a plurality of scan signals respectively and are disposed on the substrate. In a top view of the electronic device, one of the semiconductors overlaps with at least two of the second conductive wires.
An electronic device includes a substrate; a first signal line and a second signal line disposed on the top surface; a first conductive pattern having a first total width corresponding to a first signal voltage, disposed on the first side surface and electrically connected to the first signal line; and a second conductive pattern having a second total width corresponding to a second signal voltage, disposed on the second side surface and electrically connected to the second signal line, the second signal voltage higher than the first signal voltage so that the second total width is greater than the first total width; and a protection element at least partially overlapping at least one of the first conductive pattern and the second conductive pattern, at least one of the first conductive pattern and the second conductive pattern including at least one dummy sub-pattern and at least one sub-pattern.
G02F 1/1345 - Conductors connecting electrodes to cell terminals
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
A display device includes a first substrate, a first light-emitting unit, a first lens unit, a first prism unit, a first intermediate layer, and a second intermediate layer. The first light-emitting unit is disposed on the first substrate. The first lens unit is relatively disposed above the first light-emitting unit. The first prism unit is relatively disposed above the first lens unit. The first intermediate layer is disposed between the first lens unit and the first prism unit, and the second intermediate layer is disposed between the first light-emitting unit and the first lens unit.
An electronic device is provided. The electronic device includes a light-controlling structure, and the light-controlling structure includes a substrate, a first light-adjusting layer, and a second light-adjusting layer. The first light-adjusting layer is disposed on a first surface of the substrate, wherein the first light-adjusting layer has a first light-transmitting area. The second light-adjusting layer is disposed on the first light-adjusting layer, wherein the second light-adjusting layer has a second light-transmitting area, and the first light-transmitting area partially overlaps the second light-transmitting area. In a first direction, the first light-transmitting area has a first edge away from a first reference position, and the second light-transmitting area has a second edge away from the first reference position, a first offset is between the first edge and the second edge, and the first offset is greater than 0.
G02F 1/29 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the position or the direction of light beams, i.e. deflection
56.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of electronic device includes: (a) providing a circuit substrate including: a substrate; a plurality of electronic units disposed on the substrate; and a first bonding member disposed on the substrate, wherein the first bonding member surrounds the electronic units; (b) respectively disposing a plurality of cover plates on at least part of the electronic units, and disposing a bonding material on the first bonding member, wherein one of the cover plates includes a second bonding member and, in the top view direction of the circuit substrate, the second bonding member overlaps at least part of the first bonding member, and the bonding material does not overlap the second bonding member; and (c) melting the bonding material to allow part of the bonding material to flow in between the first bonding member and the second bonding member.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
A display device comprising a substrate, a scan line, a connection line, a semiconductor layer, a first pad, a second pad and a light emitting element. The scan line is disposed on the substrate. The connection line is electrically connected to the scan line. The semiconductor layer is disposed on the substrate and overlaps with the scan line. The first pad and the second pad are disposed on the substrate. The light emitting element is disposed on the first pad and the second pad, and is electrically connected to the semiconductor layer thought the first pad or the second pad. In a cross section view, the first pad has a first edge away from the second pad, the second pad has a second edge facing away the first pad, and a distance between the first edge and the second edge is longer than a width of the light emitting element.
H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
G09F 9/302 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
An electronic device comprising a substrate, an electronic element, a driving element, a plurality of first traces, a plurality of second traces and an electrostatic discharge protection element is provided. The substrate comprises a first surface and a second surface, wherein the first surface is opposite to the second surface. The electronic element is disposed on the first surface. The driving element is disposed on the second surface. The plurality of first traces are disposed on the first surface. The plurality of second traces are disposed on the second surface and are electrically connected to the driving element. The electrostatic discharge protection element is disposed on the first surface, and is electrically connected to the electronic element, wherein the electrostatic discharge protection element is electrically connected to the driving element through one of the plurality of first traces and one of the plurality of second traces.
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
G09G 5/00 - Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
An electronic device includes: a substrate having a surface; a first layer disposed on the surface; a second layer and a protruding structure disposed on the first layer; and a third layer disposed in a peripheral area between the substrate and a portion of the first layer. The portion of the first layer and the second layer are configured to transmit a signal. A first distance between the surface and a top surface of the first layer is less than a second distance between the surface and a top surface of the protruding structure along a normal direction of the substrate. The second distance is less than a third distance between the surface and a top surface of the second layer along the normal direction. The third layer is overlapped with the second layer and electrically connected to the second layer and the portion of the first layer.
An electronic device includes an electronic panel and at least one supporting plate. The electronic panel includes a substrate, an electronic component disposed on a first surface of the substrate, a first circuit substrate, and a second circuit substrate disposed under the substrate. The at least one supporting plate is disposed under the electronic panel and includes a first opening and a second opening. The first circuit substrate and the second circuit substrate respectively pass through the first opening and through the second opening.
A method for manipulating a three-dimensional image and a display module are provided. A three-dimensional image displays a plurality of objects. Different objects have different defined values. The method for manipulating the three-dimensional image includes the following steps: detecting a position of eyes of a user; determining a first coordinate point according to the position of the eyes; locating a first pointer position on a display, and generating a second coordinate point; generating a vector according to the first coordinate point and the second coordinate point, wherein the vector passes through the plurality of objects; determining a second pointer position on the vector according to changes in defined values of the plurality of objects on the vector; and operating on the object corresponding to the second pointer position.
A61B 3/113 - Objective types, i.e. instruments for examining the eyes independent of the patients perceptions or reactions for determining or recording eye movement
G06T 15/00 - 3D [Three Dimensional] image rendering
G06T 19/20 - Editing of 3D images, e.g. changing shapes or colours, aligning objects or positioning parts
62.
VEHICLE DISPLAY SYSTEM AND OPERATION METHOD THEREOF
A vehicle display system is provided. The vehicle display system includes a display for displaying images, a directional ambient-light sensor for detecting light intensities in different directions, and a processor electrically connected to the display and the directional ambient-light sensor. An operation method of a vehicle display system is also provided.
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/133 - Constructional arrangementsOperation of liquid crystal cellsCircuit arrangements
An electronic device including an electronic panel and a sensor is disclosed. The electronic panel has a first region, which includes a first element and a second element separated from each other by a first distance, and a second region, which includes a third element and a fourth element separated from each other by a second distance. Each of the first element and the second element has an emission region and a transmission region. The sensor overlaps the first region of the electronic panel, and the sensor is configured to receive a sense signal passing through the transmission region. A first ratio of the second distance to the first distance is ranged from 0.76 to 1.24, and a second ratio of an area of the transmission region to an area of the first element is ranged from 0.52 to 0.96.
H10F 55/15 - Radiation-sensitive semiconductor devices covered by groups , or being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
64.
Electronic circuit having a floating gate structure
An electronic circuit has an output circuit and a first switching transistor. The output circuit has at least one first output transistor. The at least one first output transistor has a control end, a first end, and a second end. The first switching transistor has a control end, a first end, and a second end. The at least one first output transistor and the first switching transistor are complementary transistors. The first end of the first switching transistor is coupled to the control end of the at least one first output transistor. During a specific duration, the first switching transistor is turned off, while the control end of the at least one first output transistor is in a floating state.
A transparent display device comprising a transparent display panel and an optical layer is provided. The transparent display panel comprises a substrate, a light-emitting element, a transistor and a filling layer. The substrate has a first side and a second side. The light-emitting element is disposed on the first side. The transistor is disposed on the first side and is electrically connected to the light-emitting element. The filling layer is disposed on the first side and disposed on the light-emitting element, wherein the filling layer comprises a first portion, the first portion does not overlap the light-emitting element and the transistor. The optical layer is disposed on the second side and configuring to reflect or absorb an ultraviolet light waveband. A first minimum distance between the first portion and the optical layer is less than a second minimum distance between the light-emitting element and the optical layer.
The electronic device includes a substrate, and a first conductive layer disposed on the substrate. The first conductive layer has a first electrode unit and a second electrode unit adjacent to the first electrode unit. The second electrode unit is separated from the first electrode unit along a first direction. The electronic device includes a second conductive layer disposed on the substrate and having a first conductive portion, a second conductive portion and a third conductive portion. The first conductive portion is electrically connected to the second conductive portion and the first electrode unit, the second conductive portion is electrically connected to the second electrode unit, and the third conductive portion is electrically insulated from the first conductive portion and the second conductive portion. In a top view of the electrode device, the third conductive portion is disposed between the first conductive portion and the second conductive portion.
An electronic device is provided. The electronic device includes a reflective panel; a light-shielding element disposed on a side of the reflective panel away from a viewing side of the electronic device; and a material layer disposed on the side of the reflective panel away from the viewing side of the electronic device. The Young's modulus of the material layer is less than the Young's modulus of the light-shielding element.
An electronic device is provided and includes a carrier and a redistribution layer. The carrier includes an electronic component and an encapsulation structure surrounding the electronic component. The redistribution unit is disposed on the carrier and electrically connected with the electronic component. The redistribution unit includes a first isolation layer and a second isolation layer, in which the second isolation layer is farther from the electronic component than the first isolation layer, and a thickness of the first isolation layer is greater than a thickness of the second isolation layer.
An electronic device includes a substrate, an opposite substrate, a first metal layer, a first spacer and a second spacer. The opposite substrate is disposed corresponding to the substrate. The first metal layer is disposed on the substrate. The first metal layer includes a first conductive line and a second conductive line. The first spacer is disposed on the first metal layer and overlapped with the first conductive line. The second spacer is disposed on the first metal layer and overlapped with the second conductive line. The first spacer has a first height, the second spacer has a second height, and the first height is different from the second height. In a cross-sectional view of the electronic device, a top surface of the first spacer and a top surface of the second spacer are both concave.
An electronic device having a first light-emitting region, a second light-emitting region and a non-light-emitting region, comprising a first substrate body, a first light emitting unit, a second light emitting unit, a second substrate body and a first polymer element. The first light emitting unit is disposed on the first substrate body and in the first light-emitting region. The second light emitting unit is disposed on the first substrate body and in the second light-emitting region. The second substrate body is opposite to the first substrate body. The first polymer element is disposed between the first light-emitting unit and the second substrate body. The first polymer element has a first portion overlapping the first light-emitting unit and a second portion in the non-light-emitting region, and a thickness of the first portion of the first polymer element is less than a thickness of the second portion of the first polymer element.
H01L 25/13 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group
An electronic device, including a circuit substrate, a light-absorbing layer, and an electronic component, is provided. The light-absorbing layer is disposed on the circuit substrate, and the light-absorbing layer includes an opening. The electronic component is disposed in the opening and is electrically connected to the circuit substrate. In a cross-sectional view of the electronic device, a profile of a sidewall of the opening has at least one arc-shaped edge, and an inclination angle between an extension line of the sidewall of the opening and a horizontal line is between 75 degrees and 105 degrees.
A treatment sensing device includes a substrate, a diode, a first transistor and a second transistor. The diode is disposed on the substrate and includes a first end. The first transistor is disposed on the substrate and includes a first end and a second end, wherein the first end of the first transistor is electrically connected to the first end of the diode. The second transistor is disposed on the substrate and includes a first end and a second end, wherein the first end of the second transistor is electrically connected to the first end of the diode. When the diode is in a light-emitting mode, the second end of the first transistor provides a positive voltage to the diode. When the diode is in the sensing mode, the second end of the second transistor provides a ground voltage or a negative voltage to the diode.
H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
73.
INFORMATION QUERY SYSTEM AND INFORMATION QUERY METHOD
An information query system includes a receiving unit, a computing unit, and an output unit. The receiving unit is used to receive a query request, and the query request has a query value. The computing unit is used to select a plurality of data strings that match the query value from historical data. The plurality of data strings each have a first feature value and a second feature value. The first feature value is related to the query value. The output unit is used to output at least one second feature value and a proportion of the at least one second feature value.
An electronic device is provided. The electronic device includes a substrate, a through hole, a first circuit structure, and an electronic unit. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate and connects the first side to the second side. The first circuit structure is disposed on the first side and includes a first metal layer and a first dielectric layer. The first metal layer overlaps a first portion of the first side. The first dielectric layer overlaps a second portion of the first side. The first portion is connected to the second portion. The electronic unit is electrically connected to the first circuit structure. Moreover, a surface roughness of the first portion is lower than a surface roughness of the second portion.
The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes a first transparent substrate, a conductive element, a circuit structure, and an electronic unit. The first transparent substrate has a plurality of through holes. The conductive element is disposed in at least one of the plurality of through holes, wherein the conductive element includes a first portion and a second portion surrounded by the second portion. The circuit structure is disposed on the first transparent substrate. The electronic unit is disposed on the circuit structure and is electrically connected to the conductive element through the circuit structure. The surface of the first portion of the conductive element has a plurality of recesses, and at least one portion of the second portion of the conductive element is disposed in at least one of the plurality of recesses.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
An electronic device includes a photosensor and a display panel disposed on the photosensor. The display panel includes a first display region overlapping the photosensor and a second display region. The first display region includes first sub-pixels displaying a first color and second sub-pixels displaying a second color different from the first color. The second display region includes first sub-pixels displaying the first color and second sub-pixels displaying the second color. Along a first direction, a first gap between two adjacent first sub-pixels of the first display region is greater than a second gap between two adjacent first sub-pixels of the second display region. Along a second direction perpendicular to the first direction, a third gap between another two adjacent first sub-pixels of the first display region is greater than a fourth gap between another two adjacent first sub-pixels of the second display region.
G02F 1/1368 - Active matrix addressed cells in which the switching element is a three-electrode device
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
H04N 23/73 - Circuitry for compensating brightness variation in the scene by influencing the exposure time
An electronic device is provided, including a panel and a supporting sheet. The panel includes a foldable region with a folding axis. The supporting sheet is disposed under the panel, and includes a foldable portion and a first non-foldable portion. The foldable portion is overlapped with the foldable region. The first non-foldable portion is connected to the foldable portion, and includes a first part and a second part. The first part is located between the second part and the foldable portion. The first part has a first via, and the first part protrudes more in a first direction parallel to the folding axis with respect to the second part.
An electronic device includes a light emitting structure including a curved surface that includes a first region and a second region arranged along a first direction. The light emitting structure outputs a first light in the first region and outputs a second light in the second region. The first light has a first normal brightness in a first orthogonal direction perpendicular to the first direction and a first oblique brightness in a first inclined direction. The first orthogonal direction and the first inclined direction form a first acute included angle. The second light has a second normal brightness in a second orthogonal direction and a second oblique brightness in a second inclined direction. The second orthogonal direction and the second inclined direction form a second acute included angle. The first oblique brightness and the second oblique brightness are different.
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
An electronic device is provided, which includes a substrate, an electronic unit and a circuit layer. The substrate has a first surface and a second surface. The circuit layer includes a first wiring and a second wiring. The first wiring and the second wiring are separated from each other along a first direction. Both the second wiring and the first wiring have a plurality of turning portions. The numbers of the turning portions of the second wiring and the first wiring are greater than or equal to 2. When viewing along a normal direction of the second surface, the first wiring has two endpoints, and the second wiring has two endpoints. Along a second direction, a distance between the two endpoints of the first wiring is different from a distance between the two endpoints of the second wiring.
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10K 59/131 - Interconnections, e.g. wiring lines or terminals
80.
Three-dimensional display device and display method
Provided are a three-dimensional display device and a display method. An eye tracking device of the three-dimensional display device tracks a left eye position and a right eye position. A processor generates a plurality of views. A plurality of light splitting units of a display of the three-dimensional display device distribute a plurality of beams of light emitted by a plurality of light emitting units. The processor calculates opening angles and light paths of the plurality of beams of light emitted by the plurality of light emitting units passing through the plurality of light splitting units to generate viewpoints through which the plurality of beams of light pass. The processor performs a light intensity comparison and post-processing on views corresponding to the at least one of the plurality of left eye viewpoints and the at least one of the plurality of right eye viewpoints.
H04N 13/32 - Image reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays using arrays of controllable light sourcesImage reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays using moving apertures or moving light sources
H04N 13/383 - Image reproducers using viewer tracking for tracking with gaze detection, i.e. detecting the lines of sight of the viewer's eyes
An electronic device is provided. The electronic device includes a bonding point, an electrostatic discharge protection circuit and a scan transistor. The electrostatic discharge protection circuit is electrically connected to the bonding point. The scan transistor has a first terminal, a second terminal and a control terminal. The second terminal of the scan transistor is electrically connected to the bonding point and the electrostatic discharge protection circuit.
H10D 89/60 - Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
H10D 1/64 - Variable-capacitance diodes, e.g. varactors
An electronic device includes: a light scattering switching element including: a first substrate; a second substrate; a first light modulation layer disposed between the first and second substrates and including a positive cholesteric liquid crystal; a first alignment layer disposed between the first substrate and the first light modulation layer and vertically aligned; a second alignment layer disposed between the second substrate and the first light modulation layer and vertically aligned; a first electrode layer disposed between the first substrate and the first alignment layer; and a second electrode layer disposed between the second substrate and the second alignment layer, wherein the light scattering switching element is in a hazing state under an initial state, wherein when voltage is respectively applied to the first and second electrode layers to generate a vertical electric field, the light scattering switching element is in a transmitting state.
G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
A display device includes a color temperature sensor, a computing unit, a gamma unit and a display panel. The color temperature sensor is used to sense color temperature of ambient light, and output target white point information. The computing unit is coupled to the color temperature sensor for calculating adjustment factors corresponding to red, green and blue colors based on the target white point information. The gamma unit is coupled to the computing unit for receiving the adjustment factors and adjusting gamma curves corresponding to red, green and blue colors. The display panel includes a red sub-pixel, a green sub-pixel and a blue sub-pixel, wherein the display panel is coupled to the gamma unit for receiving an image signal, and providing data signal to the red sub-pixel, the green sub-pixel and the blue sub-pixel based on the gamma curves corresponding to red, green and blue colors.
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
G09G 3/3208 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
ABSTRACT OF DISCLOSURE
ABSTRACT OF DISCLOSURE
A display device includes a substrate, scan lines disposed on the substrate and extending along a first direction, data lines disposed on the substrate and extending along a second direction, and spacers. The scan lines and the data lines cross each other at crossing positions and form sub-pixel regions, and one of the sub-pixel regions has a sub-pixel width. The spacers are disposed on the crossing positions and arranged in a plurality of rows in the second direction. The spacers include a plurality of nth row spacers and a plurality of n+1th row spacers arranged along the first direction. The nth row spacers and the n+1th row spacers are staggered in the second direction. A first pitch is included between adjacent two of the spacers in one of the rows in the first direction, and the first pitch is 2-12 times the sub-pixel width.
A dual-sided display having a first surface and a second surface opposite to the first surface is provided. The dual-sided display includes a first display panel, a second display panel, and a backlight module. The first display panel is used to display an image on the first surface. The second display panel is used to display an image on the second surface. The backlight module is disposed between the first display panel and the second display panel to provide light sources for the first display panel and the second display panel. The backlight module includes a light guide plate, a light emitting element, and a peep-proof element. The light emitting element is used to provide the light sources and is disposed adjacent to one side of the light guide plate. The peep-proof element is used to adjust a light emission angle of a display light and is disposed between the light guide plate and the second display panel.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
An electronic device includes a display panel and a switchable panel overlapping with the display panel. The switchable panel includes a first substrate, a second substrate, a first conductive portion, a second conductive portion and a third conductive portion. The second substrate is disposed opposite to the first substrate. The first conductive portion extends along a first direction in a top view and is disposed between the first substrate and the second substrate. The second conductive portion extends along a second direction different from the first direction in the top view and is disposed between the first substrate and the second substrate. The third conductive portion extends along the second direction in the top view and is disposed between the first substrate and the second substrate. The second conductive portion and the third conductive portion are disposed outside an active area of the display panel.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
An electronic device includes: a first substrate, a first conductive line, a second conductive line and a first electronic unit. The first substrate has a peripheral area, a first side edge having a first extending direction and a second side edge having a second extending direction not parallel to the first extending direction. The first conductive line is disposed on the first substrate and in the peripheral area. The second conductive line is disposed on the first substrate and adjacent to the first conductive line. The first electronic unit is electrically connected to the first conductive line. Wherein, the first conductive line has a first section disposed between the second conductive line and the first side edge of the first substrate and a second section disposed between the second conductive line and the second side edge of the first substrate, and along a direction perpendicular to the first extending direction, a first distance between the first conductive line and the first side edge of the first substrate is greater than or equal to 50 μm and less than a second distance between the second conductive line and the first side edge of the first substrate.
G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
A flexible electronic device includes a first flexible substrate, a circuit layer disposed on a first adhesive layer, a first support layer, a second support layer and a second adhesive layer. The circuit layer includes a driving circuit and electronic components electrically connected to the driving circuit. The first adhesive layer is disposed between the first flexible substrate and the first support layer. The second adhesive layer is disposed between the second support layer and the circuit layer. A Young's modulus of the first support layer is greater than that of the first adhesive layer, and a Young's modulus of the second support layer is greater than that of the second adhesive layer. A thickness of the first support layer is less than that of the first adhesive layer, and a thickness of the second support layer is less than that of the second support layer.
A switchable display system includes a display panel, an image source, a switching signal source, and a processing circuit. The display panel includes pixels containing a first pixel. The image source is used to provide image data. The switching signal source is used to provide a switching signal. The processing circuit is coupled to the display panel, an image source, and a switching signal source, stores a correction algorithm, and is used to drive the display panel to display a three-dimensional or two-dimensional image according to the switching signal. When the processing circuit drives the display panel to display the two-dimensional image according to the switching signal, the processing circuit switches a first brightness of the first pixel to a second brightness, which is determined based on brightness values in the image data of pixels of same color adjacent to the first pixel and weight values of the correction algorithm.
H04N 13/305 - Image reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays using lenticular lenses, e.g. arrangements of cylindrical lenses
An electronic device includes: a reflective polarizing element; an infrared light reflective element disposed opposite to the reflective polarizing element; a quarter wave plate disposed between the reflective polarizing element and the infrared light reflective element; and a light modulation element disposed between the quarter wave plate and the infrared light reflective element.
G02F 1/13363 - Birefringent elements, e.g. for optical compensation
G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
A light-emitting assembly is provided, which has a display area and a non-display area. The light-emitting assembly includes a plurality of reflection-reducing components, a reflective component and a light source. The reflective components are disposed in the non-display area. In a top view, two of the reflection-reducing components are separated by a gap at a corner of the light-emitting assembly. The reflective component is disposed in the display area. The reflective component is disposed between at least one of the reflection-reducing components and the light source in the top-view. The reflection-reducing component includes a first glue layer and a substrate layer disposed on the first glue layer. A ratio of a reflectivity of the reflection-reducing component to a reflectivity of the reflective component is greater than or equal to 3% and less than or equal to 85%.
An electronic device is provided. The electronic device includes: a frame, a base layer disposed on the frame, and a substrate disposed on the base layer. The substrate includes a plurality of transistors, a light-emitting area and an another area disposed between the light-emitting area and the frame. The electronic device emits a light through the light-emitting area. The electronic device includes a flexible film including a first portion. The flexible film is electronically connected to the substrate through the first portion, and the first portion of the flexible film is disposed between the another area and the frame. The electronic device also includes a first adhesive material, which connects at least a portion of the flexible film and at least a portion of the substrate.
The disclosure provides an electronic device, the electronic device includes a flexible substrate comprising a first curve region, wherein the first curve region has a Gauss curvature not equal to zero, the flexible substrate includes a first opening in the first curve region, and the first opening is overlapped with a first part of a boundary of the flexible substrate, a plurality of thin film transistors disposed on the flexible substrate, and a plurality of electronic units disposed on the flexible substrate and are electrically connected to the thin film transistors.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
H10K 59/124 - Insulating layers formed between TFT elements and OLED elements
An electronic device of the disclosure includes a plurality of electronic units. Each of the plurality of electronic units includes a pixel circuit and a plurality of tunable circuits. The plurality of tunable circuits is coupled to the pixel circuit. The pixel circuit includes at least one scan transistor, a plurality of de-multiplexer transistors, and a plurality of storage capacitors. The plurality of de-multiplexer transistors is coupled to the at least one scan transistor. The plurality of storage capacitors is coupled to a data line through the at least one scan transistor and the plurality of de-multiplexer transistors.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
Provided is an electronic device that includes a substrate, a gate driving element, a first switching element, a second switching element, and multiple electronic elements. The gate driving element is disposed on the substrate. The first switching element is disposed on the substrate and has a first gate drain capacitance. The second switching element is disposed on the substrate and has a second gate drain capacitance. In a first direction, a distance between the gate driving element and the first switching element is less than a distance between the gate driving element and the second switching element. The first gate drain capacitance is less than the second gate drain capacitance. The multiple electronic elements are arranged in the first direction. One of the multiple electronic elements is electrically connected to the first switching element and includes at least one variable capacitor, light emitting diode or solar cell.
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
An electronic device is provided. The electronic device includes a display panel and a cover lens. The display panel has an active area. The cover lens is disposed corresponding to the display panel. The cover lens includes a substrate, a first alignment mark, and a second alignment mark. The first alignment mark is disposed on a surface of the substrate and corresponds to a first position in the active area. The second alignment mark is disposed on the surface of the substrate and corresponds to a second position in the active area. The second position differs from the first position. Wherein, a transmittance of the first alignment mark in a first alignment region is 20% to 99%.
Disclosed is an electronic device adaptable for vehicles. The electronic device includes a first sensing device, a storage unit, a control unit and a display device. The first sensing device senses the first passenger and the second passenger sitting in the vehicle to obtain sensing information. The sensing information includes the first position of the first passenger and the second position of the second passenger. The storage unit stores storage information. The storage information includes a first permission corresponding to the first position and a second permission corresponding to the second position. The control unit determines that the first passenger has the first permission and determines that the second passenger has the second permission based on the sensing information and the storage information.
B60K 35/65 - Instruments specially adapted for specific vehicle types or users, e.g. for left- or right-hand drive
B60K 35/81 - Arrangements for controlling instruments for controlling displays
H04W 4/48 - Services specially adapted for particular environments, situations or purposes for vehicles, e.g. vehicle-to-pedestrians [V2P] for in-vehicle communication
A communication device and a driving method thereof are provided. The communication device includes a substrate, a plurality of scan lines, and a plurality of data lines. The plurality of scan lines are disposed on the substrate and divided into R scan line groups, where R is a positive integer greater than 1. A number of the plurality of data lines is R×S, S is a positive integer, and R scan lines are simultaneously turned on.
An electronic device and a manufacturing method thereof are provided. The electronic device includes a circuit substrate, a plurality of electronic components, a plurality of carriers, and a bonding layer. The circuit substrate includes a circuit layer. The plurality of electronic components are disposed on the circuit substrate. The circuit layer is electrically connected to at least one of the plurality of electronic components. The plurality of carriers are disposed on the circuit substrate. The bonding layer bonds the plurality of carriers to the circuit substrate. At least one gap is between the plurality of carriers. A width of the gap is Wg. An average width of the plurality of carriers is Wa. A width of the circuit substrate is Wc. The electronic device satisfies: Wa*2*10−4
An electronic device is provided. The electronic device includes a substrate, a through hole, a circuit structure, at least one electronic unit and at least one mark. The substrate has a first surface and a second surface opposite to the first surface. The through hole penetrates the substrate, and a side wall of the through hole connect the first surface and the second surface. The circuit structure is disposed on the substrate. The at least one electronic unit is disposed on the circuit structure and is electrically connected to the circuit structure. Moreover, the at least one mark is disposed between the first surface and the second surface. A method of manufacturing an electronic device is also provided.
