A display device comprising a display unit, a processing unit and a light control unit is provided. The display unit is configured to display images. The processing unit is electrically connected to the display unit. The light control unit is electrically connected to the processing unit and configured to control an emitting light angle. The light control unit comprises a backlight unit, a mono cell array and a light control array. The mono cell array is disposed on the backlight unit and comprises a first mono cell and a second mono cell adjacent to the first mono cell. The light control array is disposed on the mono cell array and comprising a plurality of light control elements. The first mono cell overlaps one of the plurality of light control elements.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes a substrate including first and second surfaces opposite to each other in a first direction, a cavity, and a through-hole penetrating the first and second surfaces, a bonding element disposed in the cavity, a first electronic unit disposed in the cavity and bonded onto the substrate through the bonding element, a conductive element disposed in the through-hole and electrically connected to the first electronic unit, a circuit structure disposed on the first surface of the substrate and electrically connected to the first electronic unit and the conductive element, and a connection element disposed on the conductive element, wherein a reflow temperature of the bonding element is higher than a reflow temperature of the connection element.
An electronic device includes: a frame including an accommodation space and a frame groove arranged to be adjacent to the accommodation space; a signal connection element disposed in the frame groove; and a modulation module disposed in the accommodation space. The modulation module includes: a first carrier board; a second carrier board corresponding to the first carrier board; an electromagnetic wave receiving element disposed on at least one of the first carrier board and the second carrier board; and an electromagnetic wave adjusting element disposed between the first carrier board and the second carrier board. The electromagnetic wave receiving element is electrically connected to the signal connection element in the frame groove.
G02F 1/03 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels or Kerr effect
G02F 1/00 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics
An electronic device includes a substrate, a first electronic component, a second electronic component, a first drive circuit, a second drive circuit, and a first control circuit. The first electronic component and the second electronic component are arranged in a first area of the substrate. The first drive circuit and the second drive circuit are arranged in a second area of the substrate. The first drive circuit is coupled to the first electronic component. The second drive circuit is coupled to the second electronic component. The first control circuit is arranged in the second area of the substrate and is coupled to the first drive circuit and the second drive circuit. The first control circuit includes a first judgment transistor, a second judgment transistor, a first input control transistor, a second input control transistor, a first reset transistor, and a first capacitor.
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
A test device includes a flexible detecting film and a supporting layer. The supporting layer supports the flexible detecting film. The flexible detecting film includes at least one probe and at least one first component, the first component overlaps the probe, the first component is disposed between the probe and the supporting layer, the flexible detecting film includes an organic material, and an elongation ratio of the organic material is greater than an elongation ratio of the supporting layer.
An electronic device has a substrate, a plurality of transistors, a first lens unit, and a second lens unit. The plurality of transistors are arranged on the substrate, and each transistor has a channel. The first lens unit and the second lens unit are arranged on the substrate. The quantity of channels of the plurality of transistors that overlap with the first lens unit is different from the quantity of channels of the plurality of transistors that overlap with the second lens unit.
H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
A stretchable electronic device includes a first reflective panel. The first reflective panel includes a first substrate having at least one first opening, a second substrate opposite to the first substrate, a first liquid crystal layer disposed between the first substrate and the second substrate, a first frame glue disposed between the first substrate and the second substrate and adjacent to the first liquid crystal layer, and a first material layer disposed in the at least one first opening. A material of the first material layer is different from a material of the first substrate.
An electronic device including a substrate, a first organic layer, a first electronic element, a second organic layer and a first lens is disclosed. The substrate includes a connection portion and at least two main portions, and the connection portion is connected to the at least two main portions. The first organic layer is disposed on one of the at least two main portions and includes a first opening. The first electronic element is disposed in the first opening. The second organic layer is disposed on the first organic layer and covers the first electronic element. The first lens is disposed on the second organic layer.
An electronic device includes a privacy panel. The privacy panel includes a first substrate, a first alignment layer and a first electrode layer. The first alignment layer is disposed on the first substrate. The first electrode layer is disposed between the first substrate and the first alignment layer. At a wavelength of 550 nm, a refractive index of the first electrode layer is between 1.7 and 2.1.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
A display device including a first light-emitting unit, a second light-emitting unit, a first conductive wire, a first redundant pad, and a second redundant pad is provided. The first conductive wire is electrically connected to the first light-emitting unit and the second light-emitting unit. The first redundant pad is electrically connected to the first conductive wire. The second redundant pad is electrically connected to the first conductive wire. The first light-emitting unit has a first electrode and a second electrode, and the second light-emitting unit has a third electrode and a fourth electrode. The first conductive wire is electrically connected to the second electrode and the third electrode, and the second electrode and the third electrode have different polarities.
A detection device includes: a substrate assembly; a cover assembly disposed on the substrate assembly, wherein the substrate assembly and the cover assembly together form a first cavity and a second cavity; a first electrode disposed in the first cavity; a second electrode disposed in the second cavity; a connecting pipe connecting the first cavity and the second cavity; an inflow pipe connecting the first cavity or the second cavity; and an outflow pipe connecting the first cavity or the second cavity.
An electronic device installed on a vehicle with a windshield includes a display module, a cleaning module, and a dust collection module. The display module includes a light-emitting unit and a cover layer. The light-emitting unit is adapted to emit a light beam. The cover layer is disposed on the light-emitting unit and overlaps the light-emitting unit. The windshield is opposite to the display module. The light beam penetrates the cover layer and is incident on the windshield, allowing the human eye to observe a virtual image formed behind the windshield. The cleaning module and the dust collection module are disposed on two opposite sides of the display module. At least a portion of the cleaning module is adjacent to the cover layer, the dust collection module has an opening, and the opening is adjacent to the cover layer.
An electronic device includes a substrate having a surface, a first conducting layer disposed on the surface of the substrate, a second conducting layer disposed on the first conducting layer, a first electronic component disposed on the first conducting layer and electrically connected to the first conducting layer, and a second electronic component disposed on the second conducting layer and electrically connected to the second conducting layer. The second conducting layer is disposed between the first conducting layer and the second electronic component. In a cross-section view, the first electronic component is overlapped with the second conducting layer along a direction parallel to the surface of the substrate.
A display device includes: a display panel including: a first substrate; a second substrate disposed opposite to the first substrate; and a light modulation element disposed between the first substrate and the second substrate; a backlight module disposed corresponding to the display panel, wherein the backlight module includes at least one optical film; and a support plate disposed between the display panel and the backlight module; wherein the first substrate has a first thickness, the second substrate has a second thickness, the support plate has a third thickness, and the third thickness is greater than or equal to a sum of the first thickness and the second thickness.
The present disclosure provides an electronic device including an electronic unit including a first conductive pad, a protective layer disposed on the electronic unit, a packaging layer surrounding the electronic unit and the protective layer, a conductive component disposed in the protective layer and overlapped with the first conductive pad, a bonding component disposed on the conductive component and overlapped with the first conductive pad, and an external component disposed on the bonding component and including a second conductive pad overlapped with the first conductive pad. The external component is electrically connected to the first conductive pad through the bonding component.
An electronic device includes a substrate, a semiconductor layer, a first electrode, a second electrode, an insulator and a dielectric layer. The semiconductor layer is disposed on the substrate. The first electrode is electrically connected to the semiconductor layer. The second electrode is electrically connected to the semiconductor layer. The insulator is disposed between the first electrode and the second electrode, and the insulator has a first opening. The dielectric layer is disposed on the semiconductor layer, and the dielectric layer has a second opening and a third opening. The second electrode is electrically connected to the semiconductor layer through the first opening and the second opening, and the first electrode is electrically connected to the semiconductor layer through the third opening.
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
An electronic device comprises a panel, an optical layer and a light module. The optical structure layer is disposed on the panel, and comprises a plurality of silicon dioxide particles. The light module is configured to provide light to the panel, and a viewing angle corresponding to half of intensity of the light is greater than 40 degrees and less than 70 degrees. A glossiness of the electronic device is less than 5 GU, and a reflectivity of specular component included of the electronic device is less than 3%.
An electronic device includes: a backlight module including: a light guide plate; a plurality of light sources disposed adjacent to a light incident side of the light guide plate and arranged along a first direction; a first optical element disposed on the light guide plate and having a plurality of first prism structures, wherein at least one of the plurality of first prism structures extends along the first direction, and the plurality of the prism structures face the light guide plate.
An electronic device includes a first substrate, a circuit layer, at least one electronic unit, a second substrate, a reflective layer and an optical layer. The circuit layer is disposed on the first substrate. The electronic unit is disposed above the first substrate and electrically connected to the circuit layer. The second substrate is disposed opposite to the first substrate and includes at least one light transmission area and at least one light reflection area. The light transmission area is located next to the light reflection area, and the light transmission area is arranged corresponding to the electronic unit. The reflective layer is disposed at one side of the second substrate close to the first substrate, and is located corresponding to the light reflection area. The optical layer is disposed between the second substrate and the electronic unit, and is located at least corresponding to the light transmission area.
H10H 29/45 - Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
An electronic device includes a substrate, and a plurality of sub-pixels, a plurality of thin film transistors, and at least one data line, all of which are disposed on the substrate. The sub-pixels are arranged along a first direction and a second direction different from the first direction. One of the sub-pixels is coupled to at least one of the thin film transistors and has a first width in the first direction and a second width in the second direction. The data line extends along the second direction, is electrically coupled to the thin film transistor, and has a curved portion. The thin film transistor includes a gate and a semiconductor layer, a portion of the semiconductor layer overlapped with the gate is defined as a first channel region, and the second width is at least twice a length of the first channel region in the second direction.
An electronic circuit is provided. The electronic circuit includes a first transistor, a second transistor, a first compensation transistor, and a second compensation transistor. The first compensation transistor includes a first terminal, a second terminal, and a third terminal. The first terminal of the first compensation transistor is coupled to the second terminal of the first compensation transistor and a first connection node between the first transistor and the second transistor. The third terminal of the first compensation transistor receives one of a scan signal and a reset signal. The second compensation transistor includes a first terminal, a second terminal, and a third terminal. The second terminal of the second compensation transistor is coupled to the first connection node. The third terminal of the second compensation transistor receives a reference low voltage signal.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
G09G 3/3225 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
22.
OPTICAL SUBSTRATE AND MANUFACTURING METHOD THEREOF
An optical substrate and a manufacturing method thereof are provided. The optical substrate includes a base layer, a bank layer, a wavelength conversion unit, and a first encapsulating layer. The bank layer is disposed on the base layer and includes a first bank portion separated from an edge of the base layer. The wavelength conversion unit is disposed on the base layer and is adjacent to a side of the first bank portion away from the edge. The first encapsulating layer is disposed on the bank layer, the wavelength conversion unit, and a portion of the base layer not covered by the bank layer and the wavelength conversion unit. In the optical substrate and the manufacturing method thereof provided by the embodiments of the disclosure, infiltration of water vapor may be reduced or reliability may be improved.
An electronic device includes an electronic unit, an integrated circuit, a first transistor and a second transistor. The integrated circuit is used to provide a sweep signal. The first transistor includes a first semiconductor, a first terminal electrically connected to a power source, a second terminal electrically connected to the electronic unit, and a first control terminal. The second transistor includes a second semiconductor, a third terminal configured to receive the sweep signal, a fourth terminal electrically connected to the first control terminal of the first transistor, and a second control terminal configured to receive a switch signal. The first transistor has a first channel width-to-length ratio, the second transistor has a second channel width-to-length ratio, of the first channel width-to-length ratio to the second channel width-to-length ratio is greater than or equal to 0.03 and less than or equal to 80.5.
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
24.
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
A method for manufacturing an electronic device includes steps as follows. A substrate is provided. A first mask is provided on a first surface of the substrate. The first mask is patterned to form a first opening in the first mask, and the first opening exposes a corresponding portion of the substrate. A light source including a first energy is provided to the corresponding portion of the substrate to perform a first modification step, so as to form a first modified region in the substrate. Another light source including a second energy is provided to the corresponding portion of the substrate to perform a second modification step, so as to form a second modified region in the substrate. The second modified region at least partially overlaps the first modified region.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An electronic device includes: a substrate; a scan line disposed on the substrate and used to output a first signal; a first data line disposed on the substrate and intersecting with the scan line, wherein the first data line is used to output a second signal; a first sub-pixel disposed on the substrate and receiving the first signal and the second signal; and a second sub-pixel disposed on the substrate and receiving the first signal and the second signal, wherein a color of the first sub-pixel is the same as a color of the second sub-pixel.
H10H 29/49 - Interconnections, e.g. wiring lines or terminals
H10H 29/34 - Active-matrix LED displays characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels
H10K 59/131 - Interconnections, e.g. wiring lines or terminals
An electronic device including a first substrate, a second substrate, a display medium layer, a color filter layer, and a viewing-angle barrier layer is provided. The second substrate is disposed opposite to the first substrate and includes a first surface facing the first substrate and a second surface facing away from the first substrate. The display medium layer is disposed between the first substrate and the second substrate. The color filter layer is disposed between the display medium layer and the second substrate. The viewing-angle barrier layer contacts one of the first surface and the second surface. In a normal direction of the first surface, a thickness of the second substrate is less than a thickness of the first substrate.
A light-emitting device is provided. The light-emitting device includes a display panel including a substrate and a plurality of scan lines disposed on the substrate and extending in a first direction, a backlight module disposed under the display panel, and an optical film disposed above the backlight module and including a plurality of light-blocking portions and a plurality of light-transmission portions which are arranged alternately. The light blocking portions extend in a second direction, and the first direction and the second direction are not parallel.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
H10K 59/50 - OLEDs integrated with light modulating elements, e.g. with electrochromic elements, photochromic elements or liquid crystal elements
An electronic device includes a display unit, a foldable region, a touch unit, and a line. The display unit includes a substrate. The display unit is foldable and has a folding axis. The foldable region is capable of being folded along the folding axis and is overlapped with the substrate. The touch unit is disposed on the display unit. The line is electrically connected to the touch unit and is at least partially located within the foldable region. The line includes a plurality of curve shapes defining an edge of the line in a top view direction of the electronic device.
An electronic device is provided. The electronic device includes a substrate, a thin-film transistor layer, a first passivation layer, an organic layer, a metal layer, and a light-emitting element. The thin-film transistor layer is disposed on the substrate. The first passivation layer is disposed on the thin-film transistor layer, and includes an opening or a recess. The organic layer is disposed on the first passivation layer. The organic layer includes a first portion and a second portion separated from the first portion by a space. The metal layer is disposed on the thin-film transistor layer, and the metal layer corresponds to the opening or the recess and the space. The light-emitting element is in contact with the metal layer. The metal layer is in direct contact with the first passivation layer. In a cross-sectional view, the organic layer and the metal layer do not overlap.
An electronic device is provided. The substrate includes an active area and a peripheral area surrounding the active area. The first signal transmission signal line and the control signal line are disposed in the peripheral area. The first common voltage lines are disposed in the active area. The first switch components are coupled between the first common voltage lines and the first signal transmission line. In a display mode, the circuit board provides a first voltage to the first switch components through the control line, and the first common voltage lines are coupled to the first signal transmission line. In a sensing mode, the driving chip provides a sensing signal to the first common voltage lines, the circuit board provides a second voltage to the first switch components through the control line, and the first common voltage lines are not coupled to the first signal transmission line.
A display device includes a backlight module, a light adjustment unit disposed on the backlight module, and a display unit disposed on the light adjustment unit, The light adjustment unit includes a first substrate, a second substrate disposed corresponding to the first substrate, a liquid crystal layer disposed between the first substrate and the second substrate, and a first electrode layer disposed between the first substrate and the liquid crystal layer and including multiple first patterns. Each first pattern has a first width, and two adjacent first patterns of the multiple first patterns have a first distance. A ratio of the first width to the first distance is greater than or equal to 0.5 and smaller than or equal to 7.5, and a phase retardation of the liquid crystal layer is greater than or equal to 500 nm and smaller than or equal to 2700 nm.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
An electronic device including a substrate, at least two adjacent gate lines, at least two adjacent data lines, a semiconductor layer and a metal layer is provided. The at least two adjacent gate lines are disposed on the substrate, and extend along a first direction. The at least two adjacent data lines are disposed on the substrate, and are intersected with the at least two adjacent gate lines. The semiconductor layer is disposed on the substrate. The metal layer is disposed between the substrate and the semiconductor layer, wherein the metal layer is overlapped with the at least two adjacent data lines and the at least two adjacent gate lines.
An electronic device includes: a back plate; a support module disposed on the back plate; and an adhesive layer disposed between the back plate and the support module, wherein the support module includes a base and a support unit disposed on the base, and the base is fixed to the back plate by the adhesive layer; wherein the base includes a side surface and a bottom surface adjacent to the back plate, the side surface includes a first curved and a second curved, and a curvature of the first curved is different from a curvature of the second curved; wherein the bottom surface includes two parts with different widths.
An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of the electronic device includes: providing a substrate; performing a hole-forming process on the substrate to form a through hole in the substrate; performing a first inspection step to the substrate to obtain a first inspection result; and determining whether a condition of the through hole is abnormal based on the first inspection result. A through hole rework process is performed on the substrate when the condition of the through hole is determined to be abnormal, and the through hole rework process includes performing a rework direction determining step to determine whether the substrate needs to be flipped during performing the through hole rework process.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An electronic device includes a second substrate disposed relative to a first substrate, a first light-emitting unit disposed between the first substrate and the second substrate, a first microstructure on the first surface of the first light-emitting unit and the first surface away from the first substrate, and an adhesive layer disposed between the second substrate and the first surface of the first light-emitting unit. There is a first gap between the adhesive layer and the first microstructure.
H10H 20/855 - Optical field-shaping means, e.g. lenses
H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
H10H 29/37 - Pixel-defining structures, e.g. banks between the LEDs
H10H 29/45 - Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
An electronic device including a base structure, a first conductive layer, a first insulating layer, a first electronic element, a second insulating layer and a second electronic element is provided. The first conductive layer comprising a first conductive part and a second conductive part is disposed on the base structure. The first insulating layer is disposed on the first conductive layer, and comprises a first hole exposing at least portion of the first conductive part. The second insulating layer comprising a second hole is disposed between the first insulating layer and the first electronic element. The second electronic element is electrically connected to the second conductive part. The first electronic element is electrically connected to the first conductive part through the second hole and the first hole. A first width of the first hole is different from a second width of the second hole.
A vehicle and a driving method thereof are provided. The vehicle is configured to provide a first image and a second image with a projection distance respectively to a first position and a second position. The vehicle includes a windshield and a display device. The display device is configured to generate a plurality of first light beams and a plurality of second light beams to be projected on a side of the windshield and to present the first image and the second image on another side of the windshield.
A manufacturing method of an electronic device includes providing a first substrate, wherein the first substrate includes a circuit layer; cutting the first substrate; forming a wire on a first surface which is exposed after cutting the first substrate and on a second surface of the first substrate, wherein the first surface is adjacent to the second surface, and the wire is electrically connected to the circuit layer; disposing an electronic element on the circuit layer; bonding the first substrate after cutting and a second substrate to form an electronic module; and disposing a driving element on the second surface of the first substrate to be electrically connected to the wire.
H10H 29/02 - Manufacture or treatment using pick-and-place processes
H10H 29/45 - Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
H10H 29/49 - Interconnections, e.g. wiring lines or terminals
An electronic device is provided. The electronic device includes a flexible panel, a supporting sheet disposed under the flexible panel, and a heat sink disposed under the supporting sheet. The flexible panel has a foldable region and a non-foldable region. The supporting sheet includes a foldable portion overlapping the foldable region, and the foldable portion includes a plurality of strip parts and a plurality of edge parts. Each of the edge parts is connected to an end of at least two of the strip parts, and in a top view, a top end of the edge parts is not aligned with a top end of at least one portion of the non-foldable region. The heat sink includes a gap and a separation portion adjacent to the gap, and in the non-folded state, one of the edge parts overlaps the gap of the heat sink.
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
An electronic device includes a substrate, a light-emitting unit, a first diffusion element, a first prism film, a second prism film and a protecting layer. The light-emitting unit is disposed on the substrate. The first diffusion element is disposed on the light-emitting unit. The first prism film is disposed on the first diffusion element. The second prism film is disposed between the first prism film and the first diffusion element. The protecting layer is disposed on the substrate and covers an upper surface of the light-emitting unit. The protecting layer contacts the first diffusion element.
An electronic device is proposed. The electronic device includes a first transistor, a second transistor, a third transistor, a fourth transistor, a first capacitor, a second capacitor, and a tunable component. The second transistor is coupled to the control terminal of the first transistor. The first capacitor is coupled between the first terminal of the first transistor and the second transistor. The second capacitor is coupled between the control terminal of the first transistor and the second transistor. The first capacitor and the second capacitor are connected in series between the first terminal and the control terminal of the first transistor. The third transistor is coupled to a first node between the second capacitor and the control terminal of the first transistor, and configured to receive a first voltage. The fourth transistor is coupled to a second node between the second capacitor and the second transistor.
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
G09G 3/3266 - Details of drivers for scan electrodes
G09G 3/3291 - Details of drivers for data electrodes in which the data driver supplies a variable data voltage for setting the current through, or the voltage across, the light-emitting elements
An electronic device includes a substrate, a circuit layer, a semiconductor chip, and a sensing element. The circuit layer is disposed on the substrate. The semiconductor chip is disposed over the substrate and the circuit layer, and is electrically connected to the circuit layer. The semiconductor chip includes a semiconductor die, an underfill layer surrounding the semiconductor die, a reflective layer arranged around the underfill layer, and a transparent conductive layer arranged on the semiconductor die and electrically connected to the circuit layer. The sensing element is at least partially overlapped with the substrate.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H10H 20/841 - Reflective coatings, e.g. dielectric Bragg reflectors
An electronic device, which has a plurality of display areas and a transmissive area surrounding the display areas, includes a first substrate, multiple light-emitting units, multiple first optical units, a first encapsulating layer, and a second encapsulating layer. The light-emitting units are arranged on the first substrate and disposed in the display areas, respectively. The first optical units are disposed in the display areas, respectively, and located above the light-emitting units, respectively. The first encapsulating layer is arranged on the light-emitting units and located between the light-emitting units and the first optical units. The second encapsulating layer is disposed on the first optical units. The first encapsulating layer contacts the second encapsulating layer in the transmissive area, so that the first optical units are enclosed in a plurality of spaces formed by the first encapsulating layer and the second encapsulating layer.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H10H 29/37 - Pixel-defining structures, e.g. banks between the LEDs
A display device is provided. The display device includes a display unit having a circuit area and a plurality of transparent areas. The display unit includes a plurality of signal lines located in the circuit area, a plurality of pixel circuits electrically connected to the signal lines and located in the circuit area, a plurality of light-emitting elements driven by the pixel circuits and located in the circuit area, and an encapsulation layer located in the circuit area and the plurality of transparent areas. At least one of the plurality of transparent areas is enclosed by the circuit area. A first thickness of the encapsulation layer located in the circuit area is different from a second thickness of the encapsulation layer located in the at least one of the plurality of transparent areas.
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
G09F 9/33 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
An electronic device is provided, including a first region, a second region, and a third region between the first and second regions; an upper substrate corresponding to the first, second, and third regions; a first light-emitting element corresponding to the first region; and a second light-emitting element corresponding to the second region. A first brightness viewing angle of the electronic device corresponds to the first region, a second brightness viewing angle of the electronic device corresponds to the second region, and the first brightness viewing angle is smaller than the second brightness viewing angle. Each of the first brightness viewing angle and the second brightness viewing angle is defined as an angle corresponding to when an intensity in an intensity-angle distribution is about 50% of a peak intensity. A grayscale value of the third region is lower than grayscale values of the first region and the second region.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/133 - Constructional arrangementsOperation of liquid crystal cellsCircuit arrangements
G02F 1/1334 - Constructional arrangements based on polymer-dispersed liquid crystals, e.g. microencapsulated liquid crystals
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/29 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the position or the direction of light beams, i.e. deflection
An electronic device includes a substrate, a light emitting unit disposed on the substrate and used to emit a light, a microlens disposed corresponding to the light emitting unit and used to concentrate the light, and a light absorbing layer. The light absorbing layer defines a light channel located between the light emitting unit and the microlens, and the light channel is used to guide the light to the microlens. A length of the light channel is greater than or equal to 60% of a distance between the light emitting unit and the microlens.
An electronic device includes a reflective panel and an optical sensing element. The reflective panel includes a first cholesteric liquid crystal for reflecting light of first color, and a first color filter layer disposed under the first cholesteric liquid crystal, wherein the first color filter layer includes a first opening. The optical sensing element is disposed under the reflective panel, wherein, in a top-view direction, the optical sensing element overlaps with the first opening of the first color filter layer.
G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
G02F 1/133 - Constructional arrangementsOperation of liquid crystal cellsCircuit arrangements
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
An electronic device is provided. The electronic device includes electronic unit rows and a gate driver. The gate driver is disposed between any two adjacent rows of the electronic unit rows. The gate driver includes a first output stage and a second output stage. The first output stage includes a first logic circuit and a first amplifier. The first amplifier receives a first signal from the first logic circuit and outputs a first gate signal to a first row among the electronic unit rows according to the first signal. The second output stage includes a second logic circuit and a second amplifier. The second amplifier receives a second signal from the second logic circuit and outputs a second gate signal to a second row among the electronic unit rows according to the second signal.
A driving method of an electronic device includes: providing an electronic device including a panel, a partition-driven backlight module, and an privacy-adjustable element, wherein the privacy-adjustable element is disposed on one side of the partition-driven backlight module, the panel is disposed on one side of the privacy-adjustable element, and the privacy-adjustable element is capable of being switched to a privacy mode or a sharing mode; and providing a detector for detecting a brightness of ambient light or a contrast of the electronic device, wherein, when the privacy-adjustable element is switched to the sharing mode, the partition-driven backlight module turns on a partition dimming function, wherein, when the privacy-adjustable element is switched to the privacy mode, the partition-driven backlight module turns on or off the partition dimming function according to the brightness of ambient light or the contrast of the electronic device.
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
An electronic device includes a substrate, a first data line, a second data line, a touch signal line, and first and second pixels. The substrate has first pads and second pads. The first data line is electrically connected to one of the first pads. The second data line is electrically connected to another one of the first pads. The touch signal line is electrically connected to one of the second pads. The first data line and the second data line respectively control a signal of the first pixel and a signal of the second pixel. The touch signal line is overlapped with the first data line and the second data line. A width of a portion of the touch signal line overlapped with the first data line is different from a width of a portion of the touch signal line not overlapped with the first data line.
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H01L 23/00 - Details of semiconductor or other solid state devices
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
A waveguide device includes a waveguide structure, an electronic element, and a driving circuit. The waveguide structure includes a first conductive layer, a second conductive layer above the first conductive layer, an insulation layer between the first and second conductive layers, and a via array in the insulation layer and including first vias and at least one second via. The first vias are arranged in a first direction and on two opposite sides of the insulation layer in a second direction crossing the first direction. The first via includes a hollow portion and a conductive portion. The second via is between the two adjacent first vias in the first direction and penetrates the first and second conductive layers. The electronic element is on the waveguide structure and electrically connected to the second conductive layer. The driving circuit is under the waveguide structure and electrically connected to the electronic element.
Provided is an electronic device, which includes a substrate, a via, a conductive element and a circuit structure. The via penetrates through the substrate and includes a first via and a second via. The conductive element is disposed in the via and includes a first conductive element and a second conductive element. The first conductive element is disposed in the first via. The second conductive element is disposed in the second via. The circuit structure is disposed on the substrate and is electrically connected to the conductive element. In a first direction, there is a first spacing between the two adjacent first conductive elements. There is a second spacing between the two adjacent second conductive elements. The first spacing is greater than the second spacing.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An electronic device includes: a back board; and a circuit board arranged on the back board; wherein the back board has a protrusion, the circuit board has an opening, and the opening is arranged corresponding to the protrusion.
An electronic device includes: a substrate; a first transistor disposed on the substrate and having a first operating voltage; and a second transistor disposed on the substrate and having a second operating voltage. The first transistor includes a first semiconductor layer, a first gate, and a first insulating structure. The first insulating structure is disposed between the first semiconductor layer and the first gate. The second transistor includes a second semiconductor layer, a second gate, and a second insulating structure. The second insulating structure is disposed between the second semiconductor layer and the second gate. The first operating voltage is higher than the second operating voltage, and a thickness of the first insulating structure is greater than a thickness of the second insulating structure.
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10B 12/00 - Dynamic random access memory [DRAM] devices
H10N 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups
An electronic device is provided. The electronic device includes a substrate, a driving circuit, a diode, an optical layer, a light shielding element and an inorganic layer. The driving circuit is disposed on the substrate. The diode is disposed on the substrate and electrically connected to the driving circuit. The optical layer is disposed on the diode and comprising a first curved surface. The light shielding element is disposed on the substrate and adjacent to the optical layer. The inorganic layer is disposed on the substrate. Moreover, the inorganic layer overlaps the optical layer and the light shielding element. The inorganic layer includes a second curved surface overlapping the first curved surface.
H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
H10H 20/812 - Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
H10H 20/825 - Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
The present disclosure provides an electronic device and a method for manufacturing the same, in which the method includes the following steps. A substrate structure is provided, wherein the substrate structure includes a first substrate and a second substrate. A first anti-warpage layer is provided on at least one side of the substrate structure. A first circuit structure is formed on the first substrate. A packaging structure is formed on the first circuit structure, wherein the first substrate is disposed between the first circuit structure and the second substrate, and the coefficient of thermal expansion of the first substrate is greater than the coefficient of thermal expansion of the second substrate.
An electronic device includes a substrate, a first metal layer, a first insulating layer, a second metal layer, a third metal layer, an electronic component, a chip on film pad, and a flexible printed circuit pad. The substrate includes a first side and a second side. The first metal layer is disposed on the substrate. The first insulating layer is disposed on the first metal layer. The second metal layer is disposed on the first insulating layer. The third metal layer is disposed on the second metal layer. At least one portion of the third metal layer is configured to form at least one portion of an electrostatic discharge protection circuit. The electronic component includes a first terminal electrically connected to at least another portion of the third metal layer.
H10D 89/60 - Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
An electronic device includes a first substrate structure, a first circuit structure and a package structure. The first circuit structure is disposed on a surface of the first substrate structure, and the first circuit structure includes a first substructure. The package structure is disposed on the first circuit structure and electrically connected with the first circuit structure. The first substructure has a first coefficient of thermal expansion, the package structure has a second coefficient of thermal expansion, and a ratio of the second coefficient of thermal expansion to the first coefficient of thermal expansion is greater than or equal to 0.8 and less than or equal to 1.5.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An electronic device is provided. The electronic device includes a substrate and a light-shielding layer. The light-shielding layer is disposed on the substrate. The light-shielding layer has an aperture region. The light-shielding layer has a plurality of openings in the aperture region and at least two of the plurality of openings have different areas. The plurality of openings have an aperture ratio in the aperture region, and the aperture ratio is greater than 0% and less than or equal to 20%. Moreover, the aperture ratio is as shown in the following formula: the aperture ratio (%)=a total area of the plurality of openings/(the total area of the plurality of openings+a total area of the light-shielding layer)×100%.
An electronic device including a substrate, a circuit layer, an optical filter layer and a medium layer is disclosed. The circuit layer is disposed on the substrate and includes a signal line. The optical filter layer is disposed on the circuit layer and includes a plurality of optical filter patterns. One of the optical filter patterns includes a first arc corner and a second arc corner, and the first arc corner and the second arc corner are adjacent to the signal line. The optical filter layer is disposed between the circuit layer and the medium layer. A curvature radius of the first arc corner is different from a curvature radius of the second arc corner.
An electronic device includes a substrate, a first circuit layer, a first semiconductor die, a second circuit layer, and first conductive elements. The first circuit layer includes first pads. The second circuit layer includes second pads. The first conductive elements are between the first circuit layer and the second circuit layer. Each of the first conductive elements is electrically connected to one of the first pads and one of the second pads. Each of the first conductive elements includes a first portion adjacent to the first pad, a second portion adjacent to the second pad, and a middle portion between the first portion and the second portion. The first conductive elements include first-type conductive elements and second-type conductive elements. Each of the first-type conductive elements has a maximum width at the middle portion, and each of second-type conductive elements has a maximum width at the first portion.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/03 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes
An electronic device is provided. The electronic device includes a panel and a super retardation film. The super retardation film is disposed on the panel. When the panel displays a white screen, a spectrum measured on a light emitting surface of the panel has a first main wave. A first peak of the first main wave is greater than or equal to 580 nm and less than or equal to 680 nm, the first main wave has a first full width at half maximum range, and the first full width at half maximum range is greater than or equal to 15 nm.
An electronic device and a vehicle using the same are provided. The electronic device includes a display panel. The display panel is switched between a share mode and a privacy mode. In the privacy mode, a first light emission brightness measured at a first viewing angle is lower than a second light emission brightness measured at a normal line of the display panel, and a third light emission brightness measured at a second viewing angle is higher than the second light emission brightness.
B60R 11/02 - Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the likeArrangement of controls thereof
B60K 35/215 - Output arrangements, i.e. from vehicle to user, associated with vehicle functions or specially adapted therefor using visual output, e.g. blinking lights or matrix displays characterised by the combination of multiple visual outputs, e.g. combined instruments with analogue meters and additional displays
B60N 2/01 - Arrangement of seats relative to one another
B60R 11/00 - Arrangements for holding or mounting articles, not otherwise provided for
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/139 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering based on orientation effects in which the liquid crystal remains transparent
A three-dimensional image display method is provided. The three-dimensional image display method includes following steps: obtaining first volume data and defining a plurality of coordinates of a plurality of voxels in the first volume data in a display device coordinate system to generate second volume data; obtaining two first eye coordinates and converting the two first eye coordinates to the display device coordinate system to generate two second eye coordinates; calculating a plurality of ray paths corresponding to a plurality of pixels of the display device; matching the ray paths with the two second eye coordinates to determine a plurality of ray casting paths; re-defining at least one portion of the plurality of ray casting paths, ; determining a plurality of sampling data corresponding to the pixels according to the second volume data and the ray casting paths to generate display data.
An electronic device includes at least one electronic unit. Each of the at least one electronic unit includes a first light-emitting device, an adjustment device and a suspension device. The adjustment device is connected to the first light-emitting device for adjusting a position state of the first light-emitting device. The suspension device is connected to the adjustment device.
F21V 21/008 - Suspending from a cable or suspension line
F16M 11/04 - Means for attachment of apparatusMeans allowing adjustment of the apparatus relatively to the stand
F16M 11/10 - Means for attachment of apparatusMeans allowing adjustment of the apparatus relatively to the stand allowing pivoting around a horizontal axis
F16M 13/02 - Other supports for positioning apparatus or articlesMeans for steadying hand-held apparatus or articles for supporting on, or attaching to, an object, e.g. tree, gate, window-frame, cycle
G09F 9/302 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
An electronic device applied to a vehicle includes a first substrate, a second substrate, a first electronic element disposed on the first substrate, a second electronic element disposed on the second substrate, a sensing element, and a cover disposed on the sensing element. The first substrate and the second substrate are separated by a gap. The sensing element is disposed on the first electronic element and overlaps the gap. The cover has a curved surface overlapping the gap.
An electronic device includes a control unit, a circuit structure, a sensing element and an emitting element. The circuit structure is disposed on the control unit, the sensing element is embedded in the circuit structure, and the emitting element is disposed on the circuit structure. A minimum distance between the sensing element and the control unit is less than a minimum distance between the emitting element and the control unit.
An electronic device is provided by the present disclosure and includes an electronic structure, a cover structure, and a second adhesive. The cover structure is adhered to the electronic structure and includes a first substrate, a second substrate, and a first adhesive. The first adhesive is disposed between the first substrate and the second substrate. The second adhesive is disposed between the electronic structure and the cover structure, and the first substrate is disposed between the first adhesive and the second adhesive. The electronic structure includes an electronic layer and a substrate structure, and the electronic layer is disposed between the substrate structure and the cover structure. The substrate structure includes a third substrate, a third adhesive, and a fourth substrate. The third adhesive is disposed between the third substrate and the fourth substrate, and the third substrate is disposed between the third adhesive and the electronic layer.
B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
An electronic device including a substrate, an insulation layer, a first organic portion, a shielding structure, and a first optical unit is provided. The insulation layer is disposed on the substrate and includes a first opening. The first organic portion is disposed in the first opening of the insulation layer. The shielding structure is disposed on the insulation layer and includes a retaining wall and a first opening. The first optical unit is disposed in the first opening of the shielding structure. The retaining wall of the shielding structure overlaps with the first opening of the insulation layer.
An electronic device includes an electronic component, a packaging layer, a circuit structure and a bonding component. The packaging layer surrounds the electronic component. The circuit structure is electrically connected to the electronic component, wherein the circuit structure includes a conductive pattern. The bonding component is disposed in a recess of the conductive pattern and overlaps the conductive pattern. The conductive pattern includes a first portion, a second portion and a third portion, the third portion is connected to the first portion and the second portion, the bonding component overlaps the third portion, and a width of the first portion is different from a width of the second portion.
An electronic substrate and a method of manufacturing the same are provided. The electronic substrate includes a substrate, a transistor, a data line, and a conductive element. The transistor is disposed on the substrate, and the transistor includes an active layer, a source, a drain, and a gate disposed on the active layer, in which the active layer is disposed between the source and the drain and overlaps the gate, and the active layer, the source, and the drain are formed of a semiconductor material layer. The data line is disposed on the substrate and electrically connected to the transistor. The conductive element is disposed on the data line and the semiconductor material layer and electrically connected to the data line and the source.
A driving method for a display device, which has sub-pixels, scan lines and data lines, includes the steps of: receiving a frame data including multiple sub-pixel grayscale values corresponding to the sub-pixels; calculating an absolute difference value between a first sub-pixel grayscale value and a second sub-pixel grayscale value, wherein the first sub-pixel is electrically connected with a data line and one of two scan lines, the second sub-pixel is electrically connected with the data line and the other one of the two scan lines; and, when the absolute difference value is greater than or equal to a first threshold, adjusting at least one of the sub-pixel grayscale values of the first and second sub-pixels, wherein an absolute difference value between the adjusted sub-pixel grayscale values of the first and second sub-pixels is smaller than the absolute difference value between the first and second sub-pixel grayscale values.
G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
73.
DRIVING METHOD FOR DRIVER OF ELECTRONIC DEVICE AND DRIVER
A driving method for a driver of an electronic device includes steps of: receiving a plurality of frame data including a plurality of sub-pixel data, each sub-pixel data including a plurality of row sub-pixel data, wherein each row sub-pixel data corresponds to a portion of a plurality of sub-pixels corresponding to one of the plurality of scan lines; and performing calculation and comparison to determine whether one of the plurality of frame data is a critical frame data or a non-critical frame data, wherein, when P consecutive frame data is critical frame data, and P is greater than or equal to a threshold, the driver is switched from a first driving state to a second driving state, or maintained in the second driving state.
G09G 3/3291 - Details of drivers for data electrodes in which the data driver supplies a variable data voltage for setting the current through, or the voltage across, the light-emitting elements
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
74.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of an electronic device is provided by the present disclosure. The manufacturing method includes providing a target substrate, and disposing a circuit structure on the target substrate. The process of providing the target substrate includes following steps: (a) providing a base layer; (b) performing a flattening step on the base layer, and then measuring a first thickness variation of the base layer; (c) disposing two planarization layers respectively at two sides of the base layer to form the target substrate; and (d) measuring a second thickness variation of the target substrate, wherein the second thickness variation is less than the first thickness variation.
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
A display device includes a first panel having a first display portion. The first panel includes first units disposed in the first display portion. The first unit includes a pixel region including a first sub-pixel region, a second sub-pixel region, a third sub-pixel region, a fourth sub-pixel region, a fifth sub-pixel region and a sixth sub-pixel region, wherein the first sub-pixel region is electrically connected to the second sub-pixel region, the third sub-pixel region is electrically connected to the fourth sub-pixel region, and the fifth sub-pixel region is electrically connected to the sixth sub-pixel region. The first sub-pixel region, the third sub-pixel region and the fifth sub-pixel region have an arrangement sequence in a first direction, and the second sub-pixel region, the fourth sub-pixel region and the sixth sub-pixel region have the arrangement sequence in a direction opposite to the first direction.
H10H 29/34 - Active-matrix LED displays characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
An electronic device includes: a first substrate; a second substrate disposed adjacent to the first substrate, wherein a tiling gap is between the first substrate and the second substrate; a plurality of light emitting elements respectively disposed on the first substrate and the second substrate; a cover layer disposed on the first substrate and the second substrate and covering the plurality of light emitting elements; and a low transmittance film disposed on the cover layer, wherein the low transmittance film and the tiling gap are overlapped in a normal direction of the electronic device.
H10H 29/855 - Optical field-shaping means, e.g. lenses
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
H10H 29/45 - Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
An electronic device includes a substrate, and a first electronic component, a second electronic component, a first switch transistor and a shared electric pad arranged on the substrate. The first switch transistor is coupled to the first electronic component and the second electronic component. The shared electric pad is coupled to the first electronic component and the second electronic component respectively through the first switch transistor. When the first switch transistor is on, the electrical properties of the first electronic component and the second electronic component can be measured from the shared electric pad. When the first switch transistor is off, the electrical properties of the first electronic component and the second electronic component cannot be measured from the shared electric pad.
G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
An electronic device includes a first substrate, a first conducting layer disposed on the first substrate, a first insulating layer disposed on the first conducting layer, a second conducting layer disposed on the first conducting layer, and a second insulating layer disposed on the first insulating layer. The second conducting layer includes a first conductive portion electrically connected to the first conducting layer through a first opening of the first insulating layer. The second insulating layer includes protruding patterns protruding from a surface of the first insulating layer. The protruding patterns include a first protruding pattern and a second protruding pattern separated from each other in a top view. In the top view, the first opening is disposed between the first protruding pattern and the second protruding pattern along a first direction, and the first conductive portion is spaced apart from the first protruding pattern and the second protruding pattern.
B32B 3/22 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by an internal layer formed of separate pieces of material of spaced pieces
B32B 3/02 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
B32B 3/06 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers togetherLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for attaching the product to another member, e.g. to a support
B32B 3/08 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H01Q 1/50 - Structural association of antennas with earthing switches, lead-in devices or lightning protectors
H01Q 3/44 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the electric or magnetic characteristics of reflecting, refracting, or diffracting devices associated with the radiating element
H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
An electronic device includes a substrate and a sensing structure disposed on the substrate. The sensing structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The first conductive layer includes a plurality of connection units, and the second conductive layer includes a plurality of sensing units. One of the plurality of connection units includes a plurality of first segments, and one of the plurality of sensing units includes a plurality of second segments. The first conductive layer has a first overlapping region where one of the plurality of first segments crosses and overlaps one of the plurality of second segments, and a non-overlapping region where one of the plurality of first segments does not overlap one of the plurality of second segments. A first width of the first overlapping region is greater than a width of the non-overlapping region.
A display device includes a circuit substrate, a pixel definition layer, a light-emitting chip, and an underfill layer. The pixel definition layer is disposed on the circuit substrate and includes an aperture. The light-emitting chip is disposed in the aperture and electrically connected to the circuit substrate. The light-emitting chip includes a light-emitting diode, a filling layer, and a reflective layer. The filling layer surrounds the light-emitting diode. The reflective layer is disposed on a side surface of the filling layer. The underfill layer is disposed between the light-emitting chip and the pixel definition layer.
H10H 29/37 - Pixel-defining structures, e.g. banks between the LEDs
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
A reflective electronic device includes a first panel and a second panel. The first panel includes first and second substrates, a second substrate, a first cholesteric liquid crystal layer, a first insulation layer having a first opening, and a first main spacer having a second main surface and a first main thickness. The second panel includes third and fourth substrates, a second cholesteric liquid crystal layer, a second insulation layer having a second opening, and a second main spacer having a fourth main surface and a second main thickness. The second main surface is disposed in the first opening. The fourth main surface is disposed in the second opening. The second main thickness is greater than the first main thickness.
G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
A display device includes a display panel and an anti-reflective film. The anti-reflective film is disposed on the display panel. The anti-reflective film includes a first high refractive index layer and a first low refractive index layer stacked in sequence. A thickness of the first high refractive index layer is greater than a thickness of the first low refractive index layer. Under irradiation of a CIE standard illuminant D65 light source, a reflected light of the display device satisfies the following conditions in the CIE L*a*b* color space: 0≥a*≥−6 and 0≥b*≥−6. The display device of the disclosure may reduce reflectivity of ambient light or improve visual effects.
The disclosure provides an electronic device including a substrate, a semiconductor, a first conductive layer, a second conductive layer, a first insulating layer, and a second insulating layer. The semiconductor is disposed on the substrate. The first conductive layer is disposed on the semiconductor. The second conductive layer is disposed on the first conductive layer. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second insulating layer is disposed between the first conductive layer and the semiconductor. The second conductive layer is electrically connected to the first conductive layer through a first via penetrating the first insulating layer and electrically connected to the semiconductor through a second via penetrating the first insulating layer and the second insulating layer. A width of the first via is less than a width of the second via.
An electronic device includes a support substrate, a plurality of first substrates, a plurality of semiconductor elements and a plurality of adhesive layers. The first substrates are disposed on the support substrate. The semiconductor elements are disposed on at least one of the first substrates. The adhesive layers are disposed between the support substrate and the first substrates. Two adjacent ones of the first substrates are separated from each other by a first gap defining a first distance, and two adjacent ones of the adhesive layers are separated from each other by a second gap defining a second distance. The first distance is different from the second distance.
An electronic device is provided, which includes a substrate, a first wire, a second wire, a first semiconductor element, and a second semiconductor element. The first wire is disposed on the substrate and extends along a first direction. The second wire is disposed on the substrate and extends along a second direction different from the first direction. The first semiconductor element is overlapped with the first wire. The second semiconductor element is adjacent to the first semiconductor element. The first semiconductor element has a first portion and a second portion separated from each other along the first direction by a first distance, the second semiconductor element has a third portion and a fourth portion separated from each other along the first direction by a second distance, and the second distance is less than the first distance. The second wire is at least partially overlapped with the second semiconductor element.
H10D 89/60 - Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
86.
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device includes a circuit substrate, a first semiconductor element, a second semiconductor element, and a connection element. The circuit substrate includes a first pad. The first semiconductor element is disposed on the circuit substrate and includes a second pad and a third pad. The second semiconductor element is disposed on the circuit substrate. The connection element is disposed on the circuit substrate and electrically connects the first semiconductor element and the second semiconductor element. The connection element includes a fourth pad. The second pad is bonded to the first pad through a conductive material, and the third pad is directly bonded to the fourth pad.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
An electronic device includes a first electronic unit, a molding layer and a circuit structure. The molding layer surrounds the first electronic unit. The circuit structure is disposed at a side of the molding layer and electrically connected to the first electronic unit. The circuit structure includes a first portion and a second portion disposed between the first portion and the first electronic unit in a normal direction of the electronic device. The first portion includes a first insulating layer, the second portion includes a second insulating layer and a third insulating layer, the second insulating layer is disposed between the first insulating layer and the third insulating layer, the third insulating layer is disposed between the second insulating layer and the molding layer, and a dielectric loss of the second insulating layer is less than dielectric losses of the first insulating layer and the third insulating layer.
An electronic device of the disclosure includes a first substrate, a circuit layer, a plurality of electronic units, and a circular polarizer. The first substrate has a first surface. The circuit layer is disposed on the first surface. The plurality of electronic units are disposed on the first surface and electrically connected to the circuit layer. The circular polarizer includes a phase retardation film and a linear polarizing film disposed on the phase retardation film, and the linear polarizing film includes a functional region and a redundant region. In a normal direction of the first surface, the redundant region is overlapped with the plurality of electronic units, and the functional region is overlapped with an area of the first substrate not covered by the plurality of electronic units.
An electronic device includes a substrate, a through hole, a first electronic unit, a second electronic unit, a circuit structure, and a third electronic unit. The substrate has a first surface, a second surface opposite the first surface, a first cavity, and a second cavity. A sidewall of the first cavity is connected to the first surface, and a sidewall of the second cavity is connected to the first surface. The through hole extends through the substrate, and a sidewall of the through hole is connected to the first surface and the second surface. The first electronic unit is disposed in the first cavity. The second electronic unit is disposed in the second cavity. The circuit structure is disposed on the first electronic unit and the second electronic unit. The bottom surfaces of the first and second cavities have a roughness ranging from 0 to 2 micrometers.
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An operation method for an electronic device includes steps of: providing a first transistor having a first end and a second end; providing a power consuming device electrically connected to the first end of the first transistor; and providing a signal source electrically connected to the second end of the first transistor, wherein, in a frame time including a writing period and an output period, the signal source provides a high voltage level during the output period, and the signal source provides a low voltage level during the writing period.
H03K 17/56 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices
91.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of an electronic device including the following steps is provided. A carrier is provided, wherein the carrier has a base layer and a temporary adhesive layer disposed on the base layer. A first sub-perforation substrate disposed on a platform is provided. A first laminating step is performed to laminate the base layer to the first sub-perforation substrate through the temporary adhesive layer to form a substrate structure. A second sub-perforation substrate is provided, and the second sub-perforation substrate is laminated to the first sub-perforation substrate. When performing the first laminating step, position along a normal direction of the platform, the carrier moves from a first position to a second position, and a distance between the first position and the platform is greater than a distance between the second position and the platform. The electronic device is also provided.
A display device includes a circuit substrate, first and second light emitting units disposed on the circuit substrate, and first and second light collection structures. The first light collection structure corresponds to the first light emitting unit, and the second light collection structure corresponds to the second light emitting unit. In a top-view direction, there is a first distance between the first light emitting unit and the first light collection structure, there is a second distance between the second light emitting unit and the second light collection structure, the first light collection structure has a first diameter, and the first distance, the second distance and the first diameter satisfy: |C1−C2|≤⅕×D1, where C1 represents the first distance, C2 represents the second distance, D1 represents the first diameter, and C1 and C2 are each not equal to zero.
H10H 29/855 - Optical field-shaping means, e.g. lenses
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An electronic device includes a substrate having an active area, plural scan lines, plural data lines, plural first transistors, and plural second transistors. The scan lines and the data lines are disposed on the substrate, and are intersected to form plural pixels arranged in an array and disposed in the active area. The first transistors are disposed corresponding to the pixels of the active area, wherein each of the first transistors includes a first semiconductor. The second transistors are disposed corresponding to the pixels of the active area and alternately arranged with the first transistors, wherein each of the second transistors includes a second semiconductor. A material of the first semiconductor is different from that of the second semiconductor, and a distance between two adjacent first semiconductors is greater than that between two adjacent data lines.
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
94.
Electronic Device with Improved Electrical Property
An electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; a second insulating layer disposed on the first metal bump; a metal layer, wherein the first insulating layer is disposed between the second insulating layer and the metal layer; a second metal bump disposed between the metal layer and the first insulating layer, wherein the second metal bump electrically connects to the first metal bump; a third insulating layer disposed between the second metal bump and the first insulating layer, wherein the third insulating layer includes an opening exposing a portion of the second metal bump; and a fourth insulating layer disposed between the third insulating layer and the first insulating layer, wherein a portion of the fourth insulating layer extends and is disposed in the opening to contact the second metal bump.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 23/00 - Details of semiconductor or other solid state devices
An electronic device includes a substrate, and a plurality of sensor units, a first sub-pixel, a second sub-pixel, a third sub-pixel and a signal line, all of which are disposed on the substrate. The second sub-pixel is adjacent to the first sub-pixel. In a top view of the electronic device, the first sub-pixel and the second sub-pixel are arranged along a first direction, and at least one of the sensor units is disposed between the first sub-pixel and the second sub-pixel. The third sub-pixel is adjacent to the second sub-pixel. In the top view, the second sub-pixel and the third sub-pixel are arranged along a second direction. The signal line is configured to transmit a touch signal. In the top view, the signal line is disposed between the second sub-pixel and the third sub-pixel, and is not overlapped with the at least one of the sensor units.
An electronic device includes: a first substrate; an element layer disposed on the first substrate and including an active area and a peripheral area surrounding the active area; a first bonding pad disposed on the peripheral area of the element layer; a second substrate disposed opposite to the first substrate; a second bonding pad disposed on the second substrate and including a first part and a second part surrounding the first part; and a bonding material disposed between the first part of the second bonding pad and the first bonding pad and between the second part of the second bonding pad and the first bonding pad.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An electronic device includes a first substrate, a second substrate, a light modulation layer, a first electrode layer, a second electrode layer, a photoelectric conversion component and a driving circuit. The second substrate is disposed opposite to the first substrate. The light modulation layer is disposed between the first substrate and the second substrate. The first electrode layer is disposed between the first substrate and the light modulation layer. The second electrode layer is disposed between the second substrate and the light modulation layer. The photoelectric conversion component is disposed between the first substrate and the second substrate. The driving circuit is disposed between the first substrate and the second substrate. The driving circuit is electrically connected to the photoelectric conversion component, and is electrically connected to the first electrode layer and the second electrode layer, respectively.
An electronic device including a substrate, a plurality of semiconductor components, a cover layer and a functional unit is provided. The substrate has a plurality of first side surfaces. The plurality of semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least two of the first side surfaces and at least two of the second side surfaces, wherein a thickness of the functional unit close to an upper surface of the cover layer is less than the thickness of the functional unit close to a lower surface of the cover layer.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
An electronic device includes a flexible substrate, a circuit layer, a first electronic unit and a second electronic unit. The flexible substrate includes a main portion and a curve portion connected to the main portion. The circuit layer is disposed on the flexible substrate, and includes a first pad disposed on the main portion and a second pad disposed on the curve portion. The first electronic unit is bonded on the first pad. The second electronic unit is bonded on the second pad. An area of the second pad is different from an area of the first pad.
H10H 29/49 - Interconnections, e.g. wiring lines or terminals
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H10H 29/02 - Manufacture or treatment using pick-and-place processes
H10H 29/34 - Active-matrix LED displays characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels
An electronic device includes: a first electronic unit; a first transistor electrically connected to the first electronic unit and including a first polysilicon semiconductor; a first insulating layer disposed on the first polysilicon semiconductor; an oxide metal layer disposed on the first insulating layer; a second transistor electrically connected to the first electronic unit and the first transistor and including a first oxide semiconductor; and a second insulating layer disposed between the metal oxide layer and the first oxide semiconductor, wherein the oxide metal layer includes a first pattern overlapping with the first polysilicon semiconductor and a second pattern overlapping with the first oxide semiconductor, a thickness of the second insulating layer between the second pattern and the first oxide semiconductor is greater than or equal to 1000 Å and less than or equal to 8000 Å.
