An electronic device includes: a first reflective panel having a first display side and including a first display layer; a second reflective panel having a second display side and including a second display layer; and a photoelectric conversion unit disposed between the first display layer and the second display layer, wherein the photoelectric conversion unit is used to receive external light and convert the external light into electrical energy to provide the electrical energy to the first reflective panel and the second reflective panel, wherein the first display side and the second display side face different directions respectively.
An electronic device includes: a first substrate including a cavity having a first bottom surface; a photonic die disposed in the cavity and having a second bottom surface facing the first bottom surface; a connection element disposed between the first bottom surface and the second bottom surface; and a first waveguide disposed corresponding to the photonic die and configured to receive an optical signal from the photonic die, wherein a roughness of the first bottom surface of the first substrate is different from a roughness of the second bottom surface of the photonic die.
An electronic device includes a backlight module, a light modulating panel, a lens structure and a display panel. The backlight module includes light emitting units. The light modulating panel has pixels. The light modulating panel includes a substrate and a light modulating panel medium layer. The lens structure is disposed on the light modulating panel and includes lenses, wherein at least one lens corresponds to at least two pixels. The display panel is disposed on the lens structure. One of the lenses has a protruding surface, a first geometric optical distance L1 is included between the protruding surface and the light modulating panel medium layer, the one of the lenses has a focal length LF and a field of view at focal point FOV, wherein the first geometric optical distance L1, the focal length LF and the field of view at focal point FOV satisfy:
An electronic device includes a backlight module, a light modulating panel, a lens structure and a display panel. The backlight module includes light emitting units. The light modulating panel has pixels. The light modulating panel includes a substrate and a light modulating panel medium layer. The lens structure is disposed on the light modulating panel and includes lenses, wherein at least one lens corresponds to at least two pixels. The display panel is disposed on the lens structure. One of the lenses has a protruding surface, a first geometric optical distance L1 is included between the protruding surface and the light modulating panel medium layer, the one of the lenses has a focal length LF and a field of view at focal point FOV, wherein the first geometric optical distance L1, the focal length LF and the field of view at focal point FOV satisfy:
0.5
≤
L
1
/
LF
≤
0.8
,
and
45
∘
≤
FOV
≤
7
0
∘
.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
A display system includes a host and a display module coupled to the host. The host includes a transmission interface. The display module includes a display panel and an optical structure layer disposed on the display panel. The optical structure layer includes at least an anti-glare layer. The display module has a specular component include (SCI) and a specular component exclude (SCE). The specular component exclude (SCE) is greater than 0.6 times the specular component include (SCI). The display module has a first luminance at a viewing angle of 0 degree and a second luminance at a viewing angle of 40 degrees. The second luminance is greater than half of the first luminance.
The present disclosure provides a transistor including a semiconductor and a plurality of gate electrodes overlapping with the semiconductor. The semiconductor includes a plurality of channel regions, at least one of middle regions, a first and a second regions, and a first lightly doped region. Each of the channel regions overlaps with one of the gate electrodes. One of the at least one of middle regions is disposed between the neighboring two of the channel regions. The first and the second regions are located at opposite two ends of the semiconductor. The first lightly doped region is disposed between the first region and one of the channel regions adjacent to the first region.
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
A display module has a first region, and includes a display panel, a light source structure and a light source controller. The light source structure is configured to provide light to the display panel and includes a first portion, wherein the first portion is corresponding to the first region. The light source controller is electrically connected to the light source structure and configured to provide a first signal to the first portion of the light source structure. The first region has a first brightness curve, the first brightness curve includes a first brightness and a second brightness, the first brightness is a brightness in a direction parallel to a normal direction of the display panel, the second brightness is a brightness at an angle with respect to the normal direction that is not equal to 0 degrees, and the second brightness is greater than the first brightness.
nD-HI Technologies Lab, Inc. (Taiwan, Province of China)
Bridge Semiconductor Corporation (Taiwan, Province of China)
Inventor
Tong, Ho-Ming
Chuang, Chih-Chao
Chien, Chun-Yu
Lin, Wen-Chiang
Abstract
A package device includes a substrate, an embedded module, a first circuit structure, a second circuit structure, an electronic unit, and a connecting piece. The embedded module is disposed in an opening of the substrate and includes embedded components and metal stack layers. First sides of at least two of the embedded components are located on a same plane, and second sides thereof have different heights. The metal stack layers are disposed on the second sides of the embedded components. Sides of the metal stack layers relatively away from the embedded components are aligned with each other. The first and second circuit structures are respectively disposed on a first and a second surfaces of the substrate and are respectively electrically connected to the embedded components and the metal stack layers. The electronic unit and the connecting piece are respectively electrically connected to the first and the second circuit structures.
A display device includes a substrate, a first light-emitting unit, and a first lens. The first light-emitting unit is disposed on the substrate and configured to emit a first light beam. The first lens is disposed on the first light-emitting unit and configured to receive at least a portion of the first light beam. In a cross-sectional view of the display device, the first light-emitting unit has a first width W1, the first lens has a second width W2, the first lens has a height L, the first lens has a radius of curvature R, a distance between the first lens and the first light-emitting unit is T, and the display device satisfies:
A display device includes a substrate, a first light-emitting unit, and a first lens. The first light-emitting unit is disposed on the substrate and configured to emit a first light beam. The first lens is disposed on the first light-emitting unit and configured to receive at least a portion of the first light beam. In a cross-sectional view of the display device, the first light-emitting unit has a first width W1, the first lens has a second width W2, the first lens has a height L, the first lens has a radius of curvature R, a distance between the first lens and the first light-emitting unit is T, and the display device satisfies:
T
(
W
2
-
W
1
)
/
2
≤
57.29
+
2
*
(
R
-
L
)
W
2
1
-
114.58
*
(
R
-
L
)
W
2
;
0.1
μ
m
≦
(
W
2
-
W
1
)
/
2
≦
30
μ
m
;
and
R
≧
L
.
InnoCare Optoelectronics Corporation (Taiwan, Province of China)
Inventor
Chen, Wen-Chi
Liu, Pei-Chih
Lin, Cheng-Hsiao
Huang, Sheng-Feng
Lin, Hsin-Hung
Abstract
An electronic device including a substrate, a first conductive layer, a first insulation layer, a second conductive layer, a second insulation layer, a third conductive layer, and a third insulation layer is provided. The first conductive layer is disposed on the substrate. The first insulation layer is disposed on the first conductive layer and includes a first opening. The second conductive layer is disposed on the first insulation layer and electronically connected to the first conductive layer through the first opening. The second insulation layer is disposed on the second conductive layer and includes a second opening. The third conductive layer is disposed on the second insulation layer and electronically connected to the second conductive layer through the second opening. The second opening does not overlap the first opening.
nD-HI Technologies Lab, Inc. (Taiwan, Province of China)
Inventor
Wu, Shu-Hsien
Chuang, Chih-Chao
Chu, Ching-Yu
Ku, Shu-Fen
Tong, Ho-Ming
Abstract
An electronic device including a composite circuit stack is provided. The composite circuit stack includes a core substrate, at least one first heat transfer element, a first redistribution layer, a driving module, and an encapsulation layer. The at least one first heat transfer element is embedded in the core substrate. The first redistribution layer is disposed on the core substrate. The driving module is disposed on the first redistribution layer. The encapsulation layer surrounds the driving module.
The present disclosure provides a method for controlling an optical system in a vehicle, which includes providing an optical structure with a top region, a middle region and a bottom region, defining a first light condition and a second light condition measured at different times, wherein the top region has a first light transmittance difference ΔT1 between the first light condition and the second light condition, and the middle region has a second light transmittance difference ΔT2 between the first light condition and the second light condition, the bottom region has a third light transmittance difference ΔT3 between the first light condition and the second light condition, wherein the following equation is satisfied: |ΔT1| > |ΔT2| or |ΔT1| > |ΔT3|.
nD-HI Technologies Lab, Inc. (Taiwan, Province of China)
Inventor
Tong, Ho-Ming
Chien, Chun-Yu
Chuang, Chih-Chao
Chu, Ching-Yu
Wu, Shu-Hsien
Abstract
An electronic device includes a heat dissipation component, a through hole, a package structure, a heat dissipation cover, and a connecting component. The through hole extends through the heat dissipation component. The package structure is disposed on a first surface of the heat dissipation component, and includes a circuit structure and an electronic unit. The circuit structure includes a metal layer, and a thermal conductivity of the heat dissipation component is different from a thermal conductivity of the metal layer. The electronic unit is disposed on the circuit structure and is electrically connected to the circuit structure. The heat dissipation cover is attached to the package structure. The connecting component electrically connects the circuit structure of the package structure, and extends through the through hole of the heat dissipation component beyond the second surface of the heat dissipation component.
A semiconductor package is provided. The semiconductor package includes a first die, a first interconnection layer, and an encapsulation layer. The first die includes a first portion and a second portion. The first portion has a first surface and the second portion has a second surface. The first interconnection layer is disposed on the second surface. The encapsulation layer surrounds the first die and the first interconnection layer. In a cross-sectional view, the first portion has a first width at the first surface, and the second portion has a second width at the interface between the first portion and second portion. In addition, the second width is greater than the first width.
An electronic device includes a substrate, a first electronic element and a connection layer. The substrate includes a first surface and a second surface opposite to the first surface, wherein the first surface has a cavity, and a bottom of the cavity includes a plurality of first concaves. The first electronic element is disposed in the cavity. The connection layer is disposed in the cavity and contacts the first electronic element. At least a portion of the connection layer is disposed between the plurality of first concaves and the first electronic element.
An electronic device is provided and includes a substrate, a plurality of electronic units, a first wire, a bonding pad, a probe pad, and a cover plate. The substrate includes an active region and a peripheral region. The electronic units are disposed in the active region. The first wire is disposed on the substrate and electrically connected to one of the plurality of electronic units. The bonding pad is disposed in the peripheral region and electrically connected to the first wire. The probe pad is disposed in the peripheral region and electrically connected to the first wire. The cover plate is disposed opposite to the substrate, and the cover plate is bonded to the substrate to form a cavity. The electronic units and the probe pad are disposed in the cavity, and the bonding pad is disposed outside the cavity.
An electronic device is provided, which includes: a substrate having a first surface; an electronic component disposed on the substrate and having a second surface; a conductive material disposed between the electronic component and the substrate, and electrically connected to the electronic component and the substrate; a first optical component disposed on the substrate and the electronic component and having a third surface; and a first adhesive disposed between the substrate and the first optical component, wherein there is a first distance between the second surface and the first surface, there is a second distance between the third surface and the first surface through a center point of the second surface, and the first distance and the second distance satisfy the following equation: T1×1.5
A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.
An electronic device includes: a first substrate; a second substrate including at least one transistor; a color filter layer disposed between the first substrate and the second substrate, wherein the color filter layer includes a light shielding unit and a plurality of color filter units adjacent to the light shielding unit, and the plurality of color filter units includes a first color filter unit, a second color filter unit and a third color filter unit; and a first layer disposed between the first substrate and the color filter layer and configured to reduce reflectivity, wherein the first layer and the light shielding unit are overlapped in a cross-sectional view, wherein the first layer and at least one of the first color filter unit, the second color filter unit and the third color filter unit are overlapped in the cross-sectional view.
An electronic device is provided. The electronic device includes a substrate, a first semiconductor element, and a second semiconductor element. The first semiconductor element is disposed on the substrate. The first semiconductor element includes a first polarity direction. The second semiconductor element is disposed on the substrate and is adjacent to the first semiconductor element. The second semiconductor element includes a second polarity direction. The first polarity direction and the second polarity direction are different. In the disclosure, the problem of chromatic aberration of the electronic device at different viewing angles is improved.
An electronic device is provided and includes a substrate, a circuit layer disposed on the substrate, a first metal mesh unit including a plurality of first mesh openings, a second metal mesh unit including a plurality of second mesh openings, a first sub-pixel generating a first color light, a second sub-pixel generating a second color light, a third sub-pixel. The first metal mesh unit, the second metal mesh unit, the first sub-pixel, the second sub-pixel, and the third sub-pixel are disposed on the circuit layer. The second color light is different from the first color light in color. The first sub-pixel and the second sub-pixel are overlapped with one of the first mesh openings, and the third sub-pixel is overlapped with one of the second mesh openings. The first metal mesh unit and the second metal mesh unit are different in mesh pattern.
InnoCare Optoelectronics Corporation (Taiwan, Province of China)
Inventor
Lin, Cheng-Hsiao
Lin, Hsin-Hung
Liu, Pei-Chih
Huang, Sheng-Feng
Abstract
An electronic device including a substrate, multiple pixel structures, a control element and a control line respectively disposed on the substrate is provided. The pixel structures include a first pixel structure and a second pixel structure arranged in a first direction. The control element is coupled to the first pixel structure and the second pixel structure, wherein the control element overlaps a portion of the first pixel structure and a portion of the second pixel structure in a normal direction of the substrate. The control line is coupled to the control element, wherein the control line extends toward a second direction. X% of a projection area of the control element in the normal direction of the substrate overlaps with the first pixel structure, and 1-X% of a projection area of the control element in the normal direction of the substrate overlaps with the second pixel structure, wherein X% is 40%-60%.
H04N 25/46 - Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
H04N 25/443 - Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array by reading pixels from selected 2D regions of the array, e.g. for windowing or digital zooming
H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
A manufacturing method of an electronic device includes: providing a substrate; performing a laser modification step on the substrate to form modified regions; performing a first inspection step on the substrate by a first equipment, the first inspection step including providing a first light to pass through the substrate, so as to obtain a first phase difference and calculate a first stress value; performing a perforation step on the substrate to form through holes in the modified regions; and performing a second inspection step on the substrate by the first equipment, the second inspection step including providing a second light to pass through the substrate, so as to obtain a second phase difference and calculate a second stress value. The substrate has a first temperature during the first inspection step, and the substrate has a second temperature different from the first temperature during the second inspection step.
An electronic device and a manufacturing method of thereof are provided. The method includes providing a carrier and electronic components disposed thereon, the electronic components include first and second electronic components; providing a circuit substrate including serial pad combinations, one serial pad combination includes first to fourth pads, the second pad is electrically connected to the third pad; picking up the first and second electronic components simultaneously; transferring the first and second electronic components onto the circuit substrate simultaneously. The first electronic component is correspondingly disposed on the first and second pads, the second electronic component is correspondingly disposed on the third and fourth pads, the first and second electronic components are connected in series with each other. The electronic device and the method thereof reduce the number of transfers of electronic components to be connected in series or improve the utilization rate of the electronic components on the carrier.
A display device comprises a substrate, a circuit layer, a plurality of light-emitting elements, and an encapsulation layer is provided. The circuit layer is disposed on the substrate. The plurality of light-emitting elements are disposed on the circuit layer. The encapsulation layer is disposed on the substrate and covers the plurality of light-emitting elements. The encapsulation layer has a first surface and a second surface, wherein the first surface of the encapsulation layer is away from the substrate and corresponds to the plurality of light-emitting elements, and the second surface of the encapsulation layer is away from the substrate and corresponds to at least part of a space between the two adjacent light-emitting elements. A difference between the first surface and the second surface is greater than or equal to 0.4 μm and less than or equal to 25 μm.
The disclosure provides a manufacturing method of an electronic device, including the following steps. A substrate is provided. A conductive layer is formed on the substrate. An insulating layer is formed on the conductive layer. The insulating layer is patterned to form a first opening and a second opening. A first electronic element is disposed in the first opening and the first electronic element is electrically connected to the conductive layer. A second electronic element is disposed in the second opening and the second electronic element is electrically connected to the conductive layer. The first electronic element and the second electronic element have different functions.
A package device includes a substrate and a metal structure. The substrate has a first region and a second region surrounding the first region. The metal structure is disposed on the substrate and includes a signal pattern and a shielding component. The shielding component includes a first shielding component and a second shielding component. The signal pattern and the first shielding component are disposed in the first region, while the second shielding component is disposed in the second region. The first shielding component and the second shielding component are isolated from each other. Along a direction perpendicular to a normal direction of the substrate, a dimension of the second shielding component gradually increases with increasing distance from an edge of the substrate.
An electronic device include a substrate, a driving circuit disposed on the substrate, a first shielding pattern, a second shielding pattern, a first organic layer, and a conductive layer. The first shielding pattern is disposed on the driving circuit and includes a first opening. The first organic layer is disposed on the first shielding pattern and includes a second opening overlapping the first opening. The conductive layer is electrically connected with the driving circuit via the first opening and the second opening. The second shielding pattern is disposed in the first opening and the second opening.
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/133 - Constructional arrangementsOperation of liquid crystal cellsCircuit arrangements
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
An electronic device includes a substrate, a first metal layer, a semiconductor layer and a second metal layer. The first metal layer is disposed on the substrate. The semiconductor layer is disposed on the substrate, and includes a first channel area, a connection area and a second channel area, wherein the first channel area and the second channel area overlap with the first metal layer, and the connection area connects the first channel area and the second channel area. The second metal layer is disposed on the semiconductor layer, and includes a first pattern and a second pattern, wherein the first pattern is electrically connected to the first channel area, and the second pattern is electrically connected to the second channel area. The first channel area has a first width, the second channel area has a second width, and the first width is different from the second width.
H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
An augmented reality electronic device includes a display device, a light adjusting component, and a waveguide including a light entrance part and a light exit part. The light adjusting component includes a panel, a first phase retardation plate, and a second phase retardation plate, wherein the first phase retardation plate is disposed on a first side of the panel, and the second phase retardation plate is disposed on a second side of the panel. A light generated by the display device enters the waveguide at the light entrance part and is emitted from the waveguide at the light exit part, and the light adjusting component is disposed corresponding to the light exit part. The waveguide is disposed adjacent to the first side of the panel. The first side has a first reflectivity, the second side has a second reflectivity, and the first reflectivity is greater than the second reflectivity.
nD-HI Technologies Lab, Inc. (Taiwan, Province of China)
Inventor
Tong, Ho-Ming
Chien, Chun-Yu
Chuang, Chih-Chao
Chu, Ching-Yu
Wu, Shu-Hsien
Abstract
An electronic device includes a core layer, a first circuit structure, a second circuit structure, an electronic unit, and a connecting component. The core layer includes a conductive through via, an embedding portion, and a peripheral heat-dissipating portion surrounding the embedding portion. The conductive through via passes through the core layer and extends to the upper surface and the lower surface. The first circuit structure is disposed on an upper surface of the core layer and is electrically connected to the conductive through via. The second circuit structure is disposed on a lower surface of the core layer and is electrically connected to the conductive through via. The electronic unit is disposed on the first circuit structure and is electrically connected to the first circuit structure. The connecting component is disposed on the second circuit structure and is electrically connected to the second circuit structure.
H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
H10D 80/30 - Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups , e.g. assemblies comprising integrated circuit processor chips
A display device is provided with a first panel including multiple first electrodes and multiple second electrodes intersecting with each other to define multiple pixels, and a cholesteric liquid crystal layer disposed between the first electrodes and the second electrodes. The pixels operate through a plurality of phases, and at least one of the phases is a low wave phase. Wherein, when one of the pixels operates in the low wave phase at a first temperature, one of the first electrodes is applied with a first voltage waveform, and one of the second electrodes is applied with a second voltage waveform, and the cholesteric liquid crystal layer corresponding to the one of the multiple pixels receives a first voltage difference, which is not equal to zero. Wherein, when the one of the pixels operates in the low wave phase at a second temperature different from the first temperature, the cholesteric liquid crystal layer corresponding to the one of the pixels receives a second voltage difference to present substantially same brightness as presented at the first temperature, and the first voltage difference is different from the second voltage difference.
G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
G09G 3/36 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source using liquid crystals
In an electronic device, a shielding layer is disposed on a substrate and has at least one first through hole, a first insulating layer is disposed on the light shielding layer and has a second through hole, a semiconductor layer is disposed on the substrate, an organic insulating material is disposed on the first insulating layer, at least a portion of the organic insulating material is disposed in the second through hole, and a second insulating layer is disposed on the first insulating layer and has at least one third through hole, wherein a minimum distance between the substrate and the light shielding layer is less than a minimum distance between the substrate and the second insulating layer. A number of the first through hole(s) is different from a number of the third through hole(s).
An electronic device is proposed. The electronic device includes a first transistor, a second transistor, a third transistor, a fourth transistor, a first capacitor, a second capacitor, and a tunable component. The second transistor is coupled to the control terminal of the first transistor. The first capacitor is coupled between the first terminal of the first transistor and the second transistor. The second capacitor is coupled between the control terminal of the first transistor and the second transistor. The first capacitor and the second capacitor are connected in series between the first terminal and the control terminal of the first transistor. The third transistor is coupled to a first node between the second capacitor and the control terminal of the first transistor, and configured to receive a first voltage. The fourth transistor is coupled to a second node between the second capacitor and the second transistor.
G09G 3/3291 - Details of drivers for data electrodes in which the data driver supplies a variable data voltage for setting the current through, or the voltage across, the light-emitting elements
G09G 3/3266 - Details of drivers for scan electrodes
A flexible electronic device including a first flexible layer, an electronic component layer, a polarization layer, an anti-reflective layer, a support layer, a first adhesive layer and a second adhesive layer. The electronic component layer is disposed on the first flexible layer. The polarization layer is disposed at one side of the electronic component layer away from the first flexible layer. The anti-reflective layer is disposed at one side of the polarization layer away from the electronic component layer. The support layer is disposed at one side of the first flexible layer away from the electronic component layer. The first adhesive layer is disposed between the first flexible layer and the support layer, and the second adhesive layer is disposed between the anti-reflective layer and the polarization layer. The thickness of the first adhesive layer is greater than the thickness of the second adhesive layer.
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
35.
COMPOSITE CIRCUIT LAMINATE AND MANUFACTURING METHOD THEREOF
nD-HI Technologies Lab, Inc. (Taiwan, Province of China)
Inventor
Chu, Ching-Yu
Chuang, Chih-Chao
Ku, Shu-Fen
Yu, Szu-Yen
Tong, Ho-Ming
Abstract
A composite circuit laminate including a first redistribution layer, a second redistribution layer, and a core composite layer is provided. The second redistribution layer is disposed opposite to the first redistribution layer. The core composite layer is located between the first redistribution layer and the second redistribution layer. The core composite layer at least includes a first core sublayer, a second core sublayer, and a third core sublayer. The first core sublayer, the second core sublayer, and the third core sublayer have unequal physical properties. A manufacturing method of the composite circuit laminate is also provided.
An electronic device includes a substrate, a first organic portion, a first opening, a second organic portion, a second opening, a third organic portion and a first element. In a cross-section view, the first organic portion, the first opening, the second organic portion, the second opening and the third organic portion are disposed on the substrate and arranged in a first direction, the first opening is located between the first organic portion and the second organic portion, the second opening is located between the second organic portion and the third organic portion, the second organic portion is located between the first organic portion and the third organic portion, and a width of the first opening and a width of the second opening are less than a width of the second organic portion in the first direction. The first element is overlapped with the first opening.
A manufacturing method of an electronic device includes the following steps. A substrate is provided. A confinement region of the substrate is defined. An electronic element is bonded on the substrate. An underfill layer is formed on the substrate, wherein a thickness of the underfill layer is not greater than a height from a surface of the substrate to an upper surface of the electronic element.
An electronic device includes: a substrate; a polymer material layer disposed on a first surface of the substrate, wherein the polymer material layer comprises a first portion, a second portion, a third portion, a first opening disposed between the first portion and the second portion, and a second opening disposed between the second portion and the third portion; a first light emitting unit disposed on the first surface, wherein at least a part of the first light emitting unit is disposed in the first opening; and a second light emitting unit disposed on the first surface and adjacent to the first light emitting unit, wherein at least a part of the second light emitting unit is disposed in the second opening, wherein in a cross-sectional view, the second portion comprises a second surface away from the first surface, and the second surface comprises a curved shape.
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
H10H 20/814 - Bodies having reflecting means, e.g. semiconductor Bragg reflectors
H10H 20/853 - Encapsulations characterised by their shape
An image capture system including an image sensor, a lens element, a first light projection unit, a second light projection unit and a control unit is provided. The lens element is disposed in front of the image sensor. The control unit is coupled to the image sensor, the first light projection unit and the second light projection unit. A first recording timing of the image sensor is synchronized with a turn-on timing of the first light projection unit to obtain a first image, and a second recording timing of the image sensor is synchronized with a turn-on timing of the second light projection unit to obtain a second image. An image generation method is also provided.
An electronic device includes a first substrate, a plurality of electronic units, a reflective layer and a reflectivity matching layer. The first substrate has an active area and a peripheral area. The electronic units are disposed on the first substrate and located within the active area. The reflective layer is disposed above the first substrate and relatively overlaps the active area of the first substrate, and the reflective layer has a plurality of openings relatively overlapping the electronic units, respectively. The reflectivity matching layer is disposed above the first substrate and relatively overlaps the peripheral area of the first substrate.
H10H 29/45 - Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
H10H 29/855 - Optical field-shaping means, e.g. lenses
H10K 59/127 - Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
An electronic device is provided and includes a covering layer and a flexible substrate structure. The covering layer includes a first region and a second region. The flexible substrate structure is disposed under the covering layer and includes a first portion corresponding to the first region and a second portion corresponding to the second region, wherein an absolute value of a Gaussian curvature of the first region of the covering layer is less than an absolute value of a Gaussian curvature of the second region of the covering layer, wherein a length of the second portion of the flexible substrate structure is configured to expand in a direction transverse to a stretching direction.
This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.
A detection device detects an output electromagnetic wave signal passing through a test object. The detection device includes an electromagnetic wave signal generating unit, an output element, a receiving element and a measuring unit. The electromagnetic wave signal generating unit is used for generating an initial electromagnetic wave signal. The output element is used for outputting the initial electromagnetic wave signal. The receiving element is used for receiving the output electromagnetic wave signal. The measuring unit is used for measuring the value of the output electromagnetic wave signal.
The disclosure provides an electronic device, including: a circuit substrate, an inorganic light emitting unit, and an opaque layer. The circuit substrate includes an optical sensor. The inorganic light emitting unit is disposed on the circuit substrate and is configured to emit a light. The opaque layer is disposed on the circuit substrate, including a first opening through which a portion of the light is transmitted to the optical sensor.
An electronic device includes a plurality of sensing pixel circuits is provided. At least one of the sensing pixel circuits includes a photoelectric sensing element, a first transistor device, a second transistor device, and a third transistor device. A second end of the first transistor device is coupled to a data line, and a control end of the first transistor device is coupled to a first scan line. A read signal is transmitted on the first scan line, and the read signal includes a first period and a second period. The read signal turns on the first transistor device during the first period and the second period. A data voltage of the data line is at a first level during the first period, and the data voltage of the data line is at a second level during the second period.
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
G06K 7/10 - Methods or arrangements for sensing record carriers by electromagnetic radiation, e.g. optical sensingMethods or arrangements for sensing record carriers by corpuscular radiation
An electrode structure includes a first electrode, a first insulating layer disposed on the first electrode, and a second electrode disposed on the first insulating layer. A third electrode is disposed on the first insulating layer and surrounds the second electrode, wherein the second electrode and the third electrode are in a same layer. A conductive layer is overlapped with the first electrode and the second electrode. An area of the conductive layer is greater than an area of the second electrode.
A manufacturing method of an electronic device includes: providing a substrate; forming a through hole penetrating the substrate; providing a seed layer, the seed layer extending into the through hole; performing a first coating step to form a first coating on a surface of the seed layer, the first coating filling a portion of the through hole; and performing a second coating step to form a second coating on a portion of the surface of the seed layer, the second coating filling another portion of the through hole and connected to the first coating. A current density used in the first coating step is greater than a current density used in the second coating step.
An electronic device includes a substrate, a first signal line disposed on the substrate, first and second electronic units, first and second transistors, and a first connecting element. The first and second electronic units are disposed on the substrate and electrically connected to the first signal line. The first transistor is disposed on the substrate and has a first control element, a first conductive element, and a first semiconductor. The second transistor is disposed on the substrate and has a second control element, a second conductive element, and a second semiconductor. The first connecting element is electrically connected to the first control element and the second control element. The first semiconductor overlaps with the first control element and is disposed between the substrate and the first control element. The second semiconductor overlaps with the second control element and is disposed between the substrate and the second control element.
H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
H10H 29/49 - Interconnections, e.g. wiring lines or terminals
An electronic device comprising a substrate, a first conductive layer, a first insulating layer, a second conductive layer and a conductive pattern is provided. The first conductive layer is disposed on the substrate, and comprises a first electrode and a second electrode. The first insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the first insulating layer, and comprises a third electrode and a fourth electrode, wherein in a normal direction of the substrate, the first electrode overlaps the third electrode to form a first capacitor, and the second electrode overlaps the fourth electrode to form a second capacitor. The conductive pattern overlaps a gap between the first capacitor and the second capacitor in the normal direction.
An electronic device includes a substrate, a driving element, a conductive layer, and an electronic element is provided. The driving element is disposed on the substrate. The conductive layer is disposed on the substrate, wherein along a first direction, there is a first distance between the driving element and a first side of the conductive layer extended along a second direction, and there is a second distance between the driving element and a second side of the conductive layer extended along the second direction, wherein the first distance is different from the second distance. The electronic element is disposed on the conductive layer and electrically connected to the driving element through a first conductive line. In a top view, the first conductive line is overlapped with the first side of the conductive layer and the second side of the conductive layer.
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
A display device including a substrate, a light-shielding layer disposed on the substrate, a plurality of light-emitting elements, a plurality of optical filter elements, an organic material disposed on the light-emitting elements, and a plurality of spacers disposed on the substrate is provided. The first light-shielding layer defines a plurality of openings, and the light-emitting elements are disposed in the openings. The optical filter elements respectively overlap the light-emitting elements. One of the light-emitting elements comprises a light-emitting area, and one of the spacers does not overlap the light-emitting area.
An electronic device includes a display panel unit and a functional panel unit. The display panel unit has a display region and a non-display region adjacent to the display region. The display panel unit includes a first light shielding element disposed in the non-display region. The functional panel unit is disposed on the display panel unit and has an active region and a non-active region adjacent to the active region. The functional panel unit includes a second light shielding element disposed in the non-active region. In a cross-sectional direction of the electronic device, a width of the first light shielding element is greater than a width of the second light shielding element.
G09G 3/02 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes by tracing or scanning a light beam on a screen
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G09G 3/36 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source using liquid crystals
Electronic device is provided. The electronic device includes a substrate, an electronic element, a heat sink, a circuit board, a first conductive element, and a first heat dissipation element. The substrate has a first surface and a second surface opposite to each other. The electronic element is disposed on the first surface of the substrate. The heat sink is disposed on the electronic element. The circuit board is disposed on the second surface of the substrate. The first conductive element penetrates the substrate and electrically connects the electronic element and the circuit board. The first heat dissipation element penetrates the substrate and the circuit board, wherein the first heat dissipation element thermally exchanges with the heat sink.
A detection device includes a detection module, a delivery module and a control module. The delivery module includes a delivery pipeline assembly, a gas pump assembly connected to the detection module via the delivery pipeline assembly, and a liquid pump assembly connected to the detection module via the delivery pipeline assembly. The control module is electrically connected to the delivery module for controlling the gas pump assembly and the liquid pump assembly.
InnoCare Optoelectronics Corporation (Taiwan, Province of China)
Inventor
Lin, Hsin-Hung
Liu, Pei-Chih
Huang, Sheng-Feng
Abstract
An electronic device includes a substrate, a pixel unit, a first chip on film and a second chip on film. The substrate has a first side and a second side opposite to each other. The pixel unit is disposed on the substrate. The first chip on film is disposed on the first side and is electrically connected to the pixel unit through a first wire. The second chip on film is disposed on the first side and is electrically connected to the pixel unit through a second wire. The first chip on film and the second chip on film respectively have different functions. The first chip on film at least partially overlaps the second chip on film.
A light-emitting module is provided. The light-emitting module includes a backplane, a light-emitting element, and a reflector. The light-emitting element is disposed on the backplane and adjacent to the light-emitting element. The reflector has a plurality of light-absorbing elements. The reflector includes a light-absorbing region, and the light-absorbing elements are located in the light-absorbing region. Light emitted by the light-emitting element has a beam angle between 45 degrees and 90 degrees.
An electronic device having a display area and a non-display area includes a substrate; a first transistor including a first semiconductor layer and disposed in the non-display area; a second transistor including a second semiconductor layer and a gate electrode and disposed in the display area, wherein a material of the first semiconductor layer is different from a material of the second semiconductor layer; a barrier layer overlapping the gate electrode of the second transistor; and an organic layer disposed on the first transistor and the second transistor, wherein the organic layer includes a first portion disposed in the non-display area and a second portion disposed in the display area. A minimum distance from the substrate to the first portion is a first distance, a minimum distance from the substrate to the second portion is a second distance, and the first distance is different from the second distance.
H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
58.
ELECTRONIC DEVICE AND A METHOD FOR MANUFACTURING THE SAME
Provided are an electronic device and a method for manufacturing the same. The electronic device includes a substrate including first and second surfaces opposite to each other in a first direction and including a cavity and a through hole penetrating the first and second surfaces, a first electronic unit disposed in the cavity, a conductive element disposed in the through hole and electrically connected to the first electronic unit and including a seed layer pattern and a conductive pillar extending from the seed layer pattern along the first direction, and a circuit structure disposed on the first surface of the substrate and electrically connected to the first electronic unit and the conductive element.
An electronic device includes a reflective panel, a transmittance switching element and a light absorbing element. The reflective panel has a first side and a second side opposite to each other. The transmittance switching element is disposed on the first side of the reflective panel. The light absorbing element is disposed on the second side of the reflective panel. The reflective panel includes at least one cholesteric liquid crystal layer, and the at least one cholesteric liquid crystal layer is used to reflect visible light in a reflective state.
G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
G02F 1/157 - Structural association of cells with optical devices, e.g. reflectors or illuminating devices
60.
SWITCHABLE OPTICAL ELEMENT AND SWITCHABLE DISPLAY DEVICE
A switchable optical element including a first substrate, a second substrate, a switching medium, multiple lenses, and multiple spacers is provided. The second substrate is opposite to the first substrate. The switching medium is disposed between the first substrate and the second substrate. The lenses are disposed on the second substrate. The spacers are disposed between the lenses and the first substrate. In a cross-sectional direction of the switchable optical element, at least one of the spacers is disposed corresponding to at least one of the lenses. A switchable display device is also provided.
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
An electronic device includes first and second substrates, a display medium layer, a plurality of gate lines, a plurality of data lines, and first and second spacer groups. The display medium layer has a minimum thickness and a maximum thickness. The first and second spacer groups are adjacently disposed along a first direction and have a same spacer arrangement. The first and second spacer groups respectively include first and second spacing units overlapped with a first gate line. In the first direction, a distance between the first and second spacing units is less than a reference dimension m, m=k*y*[ln(t*d)+t/y], wherein k is equal to the minimum thickness divided by the maximum thickness, y is a size of a sub-pixel in a second direction, t is a thickness of the first substrate, and d is the minimum thickness.
A transparent display device and a manufacturing method of a tiled display device are provided. The transparent display device includes a substrate, a plurality of units, and a first alignment mark. The substrate has a display region. The units are disposed in the display region and repeatedly arranged in a first direction and in a second direction, and each of the units includes a pixel region and a transparent region, in which each of the units includes at least one light-emitting element corresponding to the pixel region. The first alignment mark is disposed in the display region and formed of at least two pattern layers, in which at least one of the pattern layers includes metal, and in a top-view direction, the first alignment mark is disposed in one of the units.
Disclosed is a reconfigurable surface configured to modulate a phase of an electromagnetic wave. The reconfigurable surface includes a first substrate, a plurality of modulating units, and a ground signal layer. The plurality of modulating units are disposed on the first substrate. One of the plurality of modulating units includes a first electrode, a second electrode, and a modulating medium. The first electrode is disposed on the first substrate. The second electrode is disposed adjacent to the first electrode. The modulating medium is located between the first electrode and the second electrode. The ground signal layer is disposed under the first substrate. A manufacturing method of a reconfigurable surface is also provided.
H01Q 15/00 - Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
H01Q 3/44 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the electric or magnetic characteristics of reflecting, refracting, or diffracting devices associated with the radiating element
64.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of an electronic device includes: providing a substrate having a first surface and a second surface opposite to the first surface; forming a through hole penetrating the substrate, a side wall of the through hole being connected with the first surface and the second surface; forming a first protective layer on the first surface, the second surface and the side wall; forming a conductive layer on the first protective layer such that a portion of the conductive layer is disposed in the through hole; performing a thinning step to remove another portion of the conductive layer; and performing an inspection on the substrate to obtain a thickness variation value of the substrate, the thickness variation value being less than or equal to 20 micrometers.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
65.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of an electronic device including following steps is provided. A substrate having a first surface and a second surface facing each other is provided. A plurality of localized regions of the substrate are modified. A first etching step is performed to form a plurality of holes in the localized regions. A second etching step is performed to form a plurality of through holes from the holes. Along a normal direction of the substrate, each of the holes has a first depth, each of the through holes has a second depth, and the first depth and the second depth satisfy a following equation (a): 0.5*T2≤T1≤T2, where T1 is the first depth, and T2 is the second depth.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
66.
ELECTRONIC PRINTING DEVICE AND METHOD FOR PRODUCING METAL PRINT ITEM
An electronic printing device is provided. The electronic printing device includes a print board, a cathode board, a storage tank and an electrolyte. The cathode board is disposed opposite to the print board. The print board and the electrolyte are disposed in the storage tank, and the electrolyte includes metal ions, wherein the print board includes a substrate, a print unit and a sensing line. The substrate includes an active region and a border region, and the active region is adjacent to the border region. The print unit is disposed on the substrate within the active region, wherein the print unit includes print electrode. The sensing line is disposed on the substrate, and is electrically connected to the print electrode, wherein the sensing line at least partially overlaps with the active region.
The disclosure provides a display device and a driving method thereof. The display device includes a substrate, a plurality of pixels, a first gate driver, a second gate driver, and a control circuit. The plurality of pixels are disposed on the substrate. The first gate driver has a first output terminal coupled to the plurality of pixels. The second gate driver has a second output terminal commonly coupled to the plurality of pixels. The control circuit is electrically coupled to the first gate driver for selectively disabling the first gate driver. When the first gate driver is disabled, the first output terminal is in a floating state.
A method for manufacturing an electronic device includes providing substrate; performing first modification step on at least portion of substrate; generating first side-incident light to introduce first side-incident light into interior of substrate; inspecting substrate after first modification step to acquire detection information related to state of substrate; and based on detection information, determining whether rework process is required.
An electronic device includes a circuit substrate, a first substrate, an electronic element, a drive unit, and an internal electrical connection structure. The first substrate overlaps the circuit substrate. The electronic element is disposed on the first substrate. The drive unit is disposed on the first substrate and electrically connected to the electronic element. The internal electrical connection structure is disposed between the circuit substrate and the first substrate and includes a first conductive terminal and a second conductive terminal, in which the first conductive terminal and the second conductive terminal are electrically connected to the first substrate and the circuit substrate, respectively.
An electronic device includes a first substrate, an electronic unit, a phase retardation layer, and a polarizing layer. The electronic unit is disposed on the first substrate. The phase retardation layer is disposed at one side of the electronic unit away from the first substrate, and includes a first portion and a second portion disposed adjacent to each other. The first portion has a first fast axis, and the second portion has a second fast axis. The polarizing layer is disposed at one side of the phase retardation layer away from the electronic unit, and has a transmission axis. The included angle between the first fast axis and the transmission axis is different from the included angle between the second fast axis and the transmission axis, or the phase retardation of the first portion is different from the phase retardation of the second portion.
Provided is a manufacturing method of an electronic device including the following steps. A substrate is provided, where the substrate has a first surface and a second surface opposite to each other. A through hole penetrating the substrate is formed. A build-up structure on the first surface and the second surface of the substrate is formed. The build-up structure disposed on the first surface and the second surface is simultaneously cut, so that the build-up structure forms a first groove and a second groove respectively. An electronic device is also provided.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
72.
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
nD-HI Technologies Lab, Inc. (Taiwan, Province of China)
Inventor
Wu, Shu-Hsien
Wu, Tsung-Yuan
Chuang, Chih-Chao
Tong, Ho-Ming
Yu, Szu-Yen
Abstract
Provided are an electronic device and a method for manufacturing the same. The electronic device includes at least one electronic unit and a connection substrate. The connection substrate is electrically connected to the electronic unit and includes a first base structure and a second base structure disposed between the first base structure and the electronic unit. The first base structure includes a first insulation layer and a first heat dissipation structure disposed in the first insulation layer, and the second base structure includes a second insulation layer and a second heat dissipation structure disposed in the second insulation layer. A thickness of the first insulation layer is greater than a thickness of the second insulation layer, and the first heat dissipation structure overlaps with the second heat dissipation structure.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/367 - Cooling facilitated by shape of device
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
An electronic device including at least one electronic component, a first circuit chip, a glass substrate, a first conductive line and a second conductive line. The glass substrate has a first surface, a second surface opposite to the first surface and at least one conductive via extending from the first surface to the second surface, wherein the first circuit chip is electrically connected to the at least one electronic component through the at least one conductive via and configured to control the at least one electronic component. The first conductive line and the second conductive line are arranged on the glass substrate, wherein the first conductive line is electrically connected to the at least one electronic component, and the second conductive line is electrically connected to the first circuit chip, wherein the first conductive line is electrically connected to the second conductive line through the at least one conductive via.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
nD-HI Technologies Lab, Inc. (Taiwan, Province of China)
Inventor
Tong, Ho-Ming
Chuang, Chih-Chao
Wu, Shu-Hsien
Yu, Szu-Yen
Chu, Ching-Yu
Abstract
A composite circuit laminate is provided. The composite circuit laminate includes a first redistribution layer and a second redistribution layer. The first redistribution layer includes at least one first pad and at least one second pad. The second redistribution layer is disposed opposite to the first redistribution layer. The second redistribution layer includes at least one third pad. When the at least one first pad is bonded to the at least one third pad, the at least one first pad is electrically connected to the at least one third pad to transmit electrical signals. The at least one second pad has a functional material.
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
75.
ELECTRONIC DEVICE, INTERPOSER AND METHOD FOR MANUFACTURING THE SAME
nD-HI Technologies Lab, Inc. (Taiwan, Province of China)
Inventor
Tong, Ho-Ming
Chien, Chun-Yu
Chuang, Chih-Chao
Chu, Ching-Yu
Wu, Shu-Hsien
Wu, Tsung-Yuan
Abstract
The present disclosure provides an electronic device, an interposer and a method for manufacturing the same. The interposer includes a package structure including a plurality of connection units spaced apart from each other and arranged in an array, a first package layer surrounding the plurality of connection units, and a first circuit structure disposed at a first side of the first package layer and electrically connected to the plurality of connection units. Each connection unit includes a base layer and a first conductive element disposed in the base layer.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
76.
Three-dimensional display device and operation method thereof
A three-dimensional display device includes an eye tracking device, a display, and first and second processing units. The first processing unit calculates coordinates of left and right viewpoints based on left and right eye image data. The display includes light-emitting units for emitting light beams and light-splitting units for distributing the light beams to the left and right viewpoints. The second processing unit defines a crosstalk region based on an opening angle and optical paths of the light beams passing through the light-splitting units. The crosstalk region is simultaneously struck by a first light beam assigned to the left viewpoint and a second light beam assigned to the right viewpoint. The second processing unit compares preset gray levels of the first and second light beams and then determines corrected gray levels of the first and second light beams. An operation method of a three-dimensional display device is also provided.
H04N 13/125 - Improving the 3D impression of stereoscopic images by modifying image signal contents, e.g. by filtering or adding monoscopic depth cues for crosstalk reduction
H04N 13/305 - Image reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays using lenticular lenses, e.g. arrangements of cylindrical lenses
H04N 13/383 - Image reproducers using viewer tracking for tracking with gaze detection, i.e. detecting the lines of sight of the viewer's eyes
77.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
The present disclosure provides an electronic device and a manufacturing method thereof. The manufacturing method includes providing a substrate including at least one through hole, forming a seed layer extending into the through hole on the substrate, forming an insulating layer extending into the through hole and exposing a portion of the seed layer in the through hole on the seed layer, and forming a conductor layer on the portion of the seed layer.
A light emitting device includes a substrate, a first transistor, a first light emitting unit and a color conversion structure. The first transistor and the first light emitting unit are disposed on the substrate. The color conversion structure is disposed between the first transistor and the first light emitting unit, and has a first portion overlapped with the first light emitting unit and a second portion adjacent to the first portion. A light of the first light emitting unit passes through the first portion and the substrate, and the first light emitting unit is electrically connected to the first transistor through the second portion.
An electronic device includes: a substrate structure including: a substrate; a first conductive layer disposed on the substrate and including a first common electrode line extending along a first direction; a second conductive layer disposed on the first conductive layer and including a second common electrode line extending along a second direction different from the first direction, wherein the first common electrode line and the second common electrode line are partially overlapped in a normal direction of the substrate, the second common electrode line has a first part and a second part, and a width of the first part is greater than a width of the second part in the first direction; and a pixel electrode, wherein at least a part of the pixel electrode is disposed on the second conductive layer, and the pixel electrode and the second common electrode line are partially overlapped.
G02F 1/167 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
80.
Switching element with reduced effects from a sub-channel
A switching element has a gate and a semiconductor. The semiconductor includes a first region, a second region, and a third region. The first region is located between the second region and the third region. The first region includes at least one first subregion and a second subregion other than the at least one first subregion, and the at least one first subregion is adjacent to a side of the semiconductor. In a top view of the switching element, at least a portion of the first region overlaps with the gate. An ion concentration doped in the at least one first subregion is different from an ion concentration doped the second subregion.
An electronic device is provided. The electronic device includes a substrate, a first signal line, a plurality of transistors, and a second signal line. The substrate has the peripheral region. The first signal line is disposed on the substrate, and extends along a first direction. The first signal line is disposed in the peripheral region. The transistors are disposed on the substrate, and are arranged along the first direction. The transistors are disposed in the peripheral region. A first transistor of the transistors is electrically connected to the first signal line. The second signal line is disposed on the substrate, and extends along the first direction. The second signal line is disposed between the plurality of transistors and the first signal line. The second signal line is electrically connected to a gate of the first transistor through a first via. The first via is overlapped with the second signal line.
An electronic device includes a first mirror display unit, a second mirror display unit, and a reflective element. The first mirror display unit and the second mirror display unit are disposed adjacent to each other. The reflective element is disposed between the first mirror display unit and the second mirror display unit.
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
A display device has a first area and a second area, and includes: a first driving unit and a first power source arranged in a first peripheral sub-area, a second driving unit and a second power source arranged in a second peripheral sub-area, a first signal line and a second signal line arranged in the first area and the second area; a first display unit arranged in a first display sub-area and connected to the first driving unit via the first signal line; a second display unit arranged in a second display sub-area and connected to the second driving unit via the second signal line, a first discharge unit connected between the first power source and the first signal line, and a second discharge unit connected between the second power source and the second signal line, wherein the first power source and the second power source are electrically separated.
G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
84.
TRANSPARENT DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
A transparent display device and a manufacturing method thereof are provided. The transparent display device includes a substrate, a inorganic layer disposed on the substrate, a driving element layer disposed on the inorganic layer, a first organic layer disposed on the driving element layer, a second organic layer disposed on the first organic layer, and a light emitting element disposed on the second organic layer, wherein the first organic layer includes a side surface, and the second organic layer is disposed on the side surface of the first organic layer.
A display device is provided. The display device includes a display panel, a first viewing angle control panel, and a second viewing angle control panel. The first viewing angle control panel overlaps the display panel and includes a first liquid-crystal layer. The second viewing angle control panel overlaps the display panel and the first viewing angle control panel and includes a second liquid-crystal layer. The first liquid-crystal layer is different from the second liquid-crystal layer, and the product of the first liquid-crystal birefringence value and the first liquid-crystal interlayer spacing is different from the product of the second liquid-crystal birefringence value and the second liquid-crystal interlayer spacing.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
An electronic device includes a plurality of scan lines including first and second scan lines, a first scan transmission line, a second scan transmission line, at least one first conductive pattern electrically connected in parallel to at least one of the first scan transmission line and the first scan line, and having a first area, and at least one second conductive pattern electrically connected in parallel to at least one of the second scan transmission line and the second scan line, and having a second area. The first and second scan transmission lines cross the scan lines to form a plurality of first and second intersections, respectively. A length of the first scan transmission line is greater than a length of the second scan transmission line, and the first area is greater than the second area.
H10K 59/131 - Interconnections, e.g. wiring lines or terminals
H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
H10H 29/49 - Interconnections, e.g. wiring lines or terminals
H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
Provided is an electronic device, which includes a substrate, a first electronic component, a second electronic component, a first switch element, a wire, and a first conductive pad. The first electronic component and the second electronic component are disposed on the substrate. The first switch element is disposed on the substrate. The wire is disposed on the substrate. The first conductive pad is disposed on the substrate. The first switch element is electrically connected to the first electronic component and the second electronic component through the wire and the first conductive pad.
A display device and an operating method for the display device are provided. The display device includes an image data circuit, a recognition circuit and a compensation circuit. The image data circuit outputs an image data. The recognition circuit receives the image data and recognizes the image data to generate a recognition result. The compensation circuit generates a compensation signal according to the recognition result, and compensates the image data according to the compensation signal.
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/0488 - Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
G06T 7/90 - Determination of colour characteristics
89.
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes a substrate including first and second surfaces opposite to each other in a first direction, a cavity, and a through-hole penetrating the first and second surfaces, a bonding element disposed in the cavity, a first electronic unit disposed in the cavity and bonded onto the substrate through the bonding element, a conductive element disposed in the through-hole and electrically connected to the first electronic unit, a circuit structure disposed on the first surface of the substrate and electrically connected to the first electronic unit and the conductive element, and a connection element disposed on the conductive element, wherein a reflow temperature of the bonding element is higher than a reflow temperature of the connection element.
A display device comprising a display unit, a processing unit and a light control unit is provided. The display unit is configured to display images. The processing unit is electrically connected to the display unit. The light control unit is electrically connected to the processing unit and configured to control an emitting light angle. The light control unit comprises a backlight unit, a mono cell array and a light control array. The mono cell array is disposed on the backlight unit and comprises a first mono cell and a second mono cell adjacent to the first mono cell. The light control array is disposed on the mono cell array and comprising a plurality of light control elements. The first mono cell overlaps one of the plurality of light control elements.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
An electronic device includes: a frame including an accommodation space and a frame groove arranged to be adjacent to the accommodation space; a signal connection element disposed in the frame groove; and a modulation module disposed in the accommodation space. The modulation module includes: a first carrier board; a second carrier board corresponding to the first carrier board; an electromagnetic wave receiving element disposed on at least one of the first carrier board and the second carrier board; and an electromagnetic wave adjusting element disposed between the first carrier board and the second carrier board. The electromagnetic wave receiving element is electrically connected to the signal connection element in the frame groove.
G02F 1/03 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels or Kerr effect
G02F 1/00 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics
A test device includes a flexible detecting film and a supporting layer. The supporting layer supports the flexible detecting film. The flexible detecting film includes at least one probe and at least one first component, the first component overlaps the probe, the first component is disposed between the probe and the supporting layer, the flexible detecting film includes an organic material, and an elongation ratio of the organic material is greater than an elongation ratio of the supporting layer.
An electronic device includes a substrate, a first electronic component, a second electronic component, a first drive circuit, a second drive circuit, and a first control circuit. The first electronic component and the second electronic component are arranged in a first area of the substrate. The first drive circuit and the second drive circuit are arranged in a second area of the substrate. The first drive circuit is coupled to the first electronic component. The second drive circuit is coupled to the second electronic component. The first control circuit is arranged in the second area of the substrate and is coupled to the first drive circuit and the second drive circuit. The first control circuit includes a first judgment transistor, a second judgment transistor, a first input control transistor, a second input control transistor, a first reset transistor, and a first capacitor.
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
An electronic device has a substrate, a plurality of transistors, a first lens unit, and a second lens unit. The plurality of transistors are arranged on the substrate, and each transistor has a channel. The first lens unit and the second lens unit are arranged on the substrate. The quantity of channels of the plurality of transistors that overlap with the first lens unit is different from the quantity of channels of the plurality of transistors that overlap with the second lens unit.
H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
A stretchable electronic device includes a first reflective panel. The first reflective panel includes a first substrate having at least one first opening, a second substrate opposite to the first substrate, a first liquid crystal layer disposed between the first substrate and the second substrate, a first frame glue disposed between the first substrate and the second substrate and adjacent to the first liquid crystal layer, and a first material layer disposed in the at least one first opening. A material of the first material layer is different from a material of the first substrate.
An electronic device including a substrate, a first organic layer, a first electronic element, a second organic layer and a first lens is disclosed. The substrate includes a connection portion and at least two main portions, and the connection portion is connected to the at least two main portions. The first organic layer is disposed on one of the at least two main portions and includes a first opening. The first electronic element is disposed in the first opening. The second organic layer is disposed on the first organic layer and covers the first electronic element. The first lens is disposed on the second organic layer.
An electronic device includes a privacy panel. The privacy panel includes a first substrate, a first alignment layer and a first electrode layer. The first alignment layer is disposed on the first substrate. The first electrode layer is disposed between the first substrate and the first alignment layer. At a wavelength of 550 nm, a refractive index of the first electrode layer is between 1.7 and 2.1.
G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
A display device including a first light-emitting unit, a second light-emitting unit, a first conductive wire, a first redundant pad, and a second redundant pad is provided. The first conductive wire is electrically connected to the first light-emitting unit and the second light-emitting unit. The first redundant pad is electrically connected to the first conductive wire. The second redundant pad is electrically connected to the first conductive wire. The first light-emitting unit has a first electrode and a second electrode, and the second light-emitting unit has a third electrode and a fourth electrode. The first conductive wire is electrically connected to the second electrode and the third electrode, and the second electrode and the third electrode have different polarities.
An electronic device includes a substrate having a surface, a first conducting layer disposed on the surface of the substrate, a second conducting layer disposed on the first conducting layer, a first electronic component disposed on the first conducting layer and electrically connected to the first conducting layer, and a second electronic component disposed on the second conducting layer and electrically connected to the second conducting layer. The second conducting layer is disposed between the first conducting layer and the second electronic component. In a cross-section view, the first electronic component is overlapped with the second conducting layer along a direction parallel to the surface of the substrate.
A detection device includes: a substrate assembly; a cover assembly disposed on the substrate assembly, wherein the substrate assembly and the cover assembly together form a first cavity and a second cavity; a first electrode disposed in the first cavity; a second electrode disposed in the second cavity; a connecting pipe connecting the first cavity and the second cavity; an inflow pipe connecting the first cavity or the second cavity; and an outflow pipe connecting the first cavity or the second cavity.
