An electronic device includes a substrate, and a first electronic component, a second electronic component, a first switch transistor and a shared electric pad arranged on the substrate. The first switch transistor is coupled to the first electronic component and the second electronic component. The shared electric pad is coupled to the first electronic component and the second electronic component respectively through the first switch transistor. When the first switch transistor is on, the electrical properties of the first electronic component and the second electronic component can be measured from the shared electric pad. When the first switch transistor is off, the electrical properties of the first electronic component and the second electronic component cannot be measured from the shared electric pad.
G09G 3/00 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques
G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p. ex. utilisant des diodes électroluminescentes [LED] organiques, p. ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent
An electronic device includes a first substrate, a first conducting layer disposed on the first substrate, a first insulating layer disposed on the first conducting layer, a second conducting layer disposed on the first conducting layer, and a second insulating layer disposed on the first insulating layer. The second conducting layer includes a first conductive portion electrically connected to the first conducting layer through a first opening of the first insulating layer. The second insulating layer includes protruding patterns protruding from a surface of the first insulating layer. The protruding patterns include a first protruding pattern and a second protruding pattern separated from each other in a top view. In the top view, the first opening is disposed between the first protruding pattern and the second protruding pattern along a first direction, and the first conductive portion is spaced apart from the first protruding pattern and the second protruding pattern.
B32B 3/22 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche discontinue, c.-à-d. soit continue et percée de trous, soit réellement constituée d'éléments individuels caractérisés par une couche interne formée d'éléments individuels de pièces espacées
B32B 3/02 - Caractérisés par des caractéristiques de forme en des endroits déterminés, p. ex. au voisinage des bords
B32B 3/06 - Caractérisés par des caractéristiques de forme en des endroits déterminés, p. ex. au voisinage des bords pour lier les couches ensembleCaractérisés par des caractéristiques de forme en des endroits déterminés, p. ex. au voisinage des bords pour attacher le produit à quelque chose d'autre p. ex. à un support
B32B 3/08 - Caractérisés par des caractéristiques de forme en des endroits déterminés, p. ex. au voisinage des bords caractérisés par des éléments ajoutés à des endroits déterminés
B32B 3/26 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes
B32B 3/30 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes caractérisés par une couche comportant des retraits ou des saillies, p. ex. des gorges, des nervures
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
B32B 9/04 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes comprenant une telle substance comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
G02F 1/1333 - Dispositions relatives à la structure
G02F 1/1339 - JointsÉléments d'espacementScellement des cellules
H01Q 1/38 - Forme structurale pour éléments rayonnants, p. ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
H01Q 1/50 - Association structurale d'antennes avec commutateurs de terre, dispositions de descente d'antennes ou parafoudres
H01Q 3/44 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier les caractéristiques électriques ou magnétiques des dispositifs de réflexion, de réfraction ou de diffraction associés à l'élément rayonnant
H01Q 21/06 - Réseaux d'unités d'antennes, de même polarisation, excitées individuellement et espacées entre elles
An electronic device includes a substrate and a sensing structure disposed on the substrate. The sensing structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The first conductive layer includes a plurality of connection units, and the second conductive layer includes a plurality of sensing units. One of the plurality of connection units includes a plurality of first segments, and one of the plurality of sensing units includes a plurality of second segments. The first conductive layer has a first overlapping region where one of the plurality of first segments crosses and overlaps one of the plurality of second segments, and a non-overlapping region where one of the plurality of first segments does not overlap one of the plurality of second segments. A first width of the first overlapping region is greater than a width of the non-overlapping region.
An electronic device includes: a first substrate; a second substrate disposed adjacent to the first substrate, wherein a tiling gap is between the first substrate and the second substrate; a plurality of light emitting elements respectively disposed on the first substrate and the second substrate; a cover layer disposed on the first substrate and the second substrate and covering the plurality of light emitting elements; and a low transmittance film disposed on the cover layer, wherein the low transmittance film and the tiling gap are overlapped in a normal direction of the electronic device.
H10H 29/855 - Moyens de mise en forme du champ optique, p. ex. lentilles
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H10H 29/14 - Dispositifs intégrés comprenant au moins un composant émetteur de lumière à semi-conducteurs couvert par le groupe comprenant plusieurs composants émetteurs de lumière à semi-conducteurs
H10H 29/45 - Affichages LED à matrice active comprenant deux substrats, chacun d’eux comprenant des dispositifs actifs, p. ex. affichages comprenant des matrices LED et un circuit de commande sur des substrats différents
A display device includes a first panel having a first display portion. The first panel includes first units disposed in the first display portion. The first unit includes a pixel region including a first sub-pixel region, a second sub-pixel region, a third sub-pixel region, a fourth sub-pixel region, a fifth sub-pixel region and a sixth sub-pixel region, wherein the first sub-pixel region is electrically connected to the second sub-pixel region, the third sub-pixel region is electrically connected to the fourth sub-pixel region, and the fifth sub-pixel region is electrically connected to the sixth sub-pixel region. The first sub-pixel region, the third sub-pixel region and the fifth sub-pixel region have an arrangement sequence in a first direction, and the second sub-pixel region, the fourth sub-pixel region and the sixth sub-pixel region have the arrangement sequence in a direction opposite to the first direction.
H10H 29/34 - Affichages LED à matrice active caractérisés par la géométrie ou l’agencement des sous-pixels à l’intérieur d’un pixel, p. ex. la disposition relative des sous-pixels RGB
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
A display device includes a circuit substrate, a pixel definition layer, a light-emitting chip, and an underfill layer. The pixel definition layer is disposed on the circuit substrate and includes an aperture. The light-emitting chip is disposed in the aperture and electrically connected to the circuit substrate. The light-emitting chip includes a light-emitting diode, a filling layer, and a reflective layer. The filling layer surrounds the light-emitting diode. The reflective layer is disposed on a side surface of the filling layer. The underfill layer is disposed between the light-emitting chip and the pixel definition layer.
H10H 29/37 - Structures au niveau du pixel, p. ex. bords entre les LED
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
A reflective electronic device includes a first panel and a second panel. The first panel includes first and second substrates, a second substrate, a first cholesteric liquid crystal layer, a first insulation layer having a first opening, and a first main spacer having a second main surface and a first main thickness. The second panel includes third and fourth substrates, a second cholesteric liquid crystal layer, a second insulation layer having a second opening, and a second main spacer having a fourth main surface and a second main thickness. The second main surface is disposed in the first opening. The fourth main surface is disposed in the second opening. The second main thickness is greater than the first main thickness.
G02F 1/137 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des cristaux liquides, p. ex. cellules d'affichage individuelles à cristaux liquides caractérisés par l'effet électro-optique ou magnéto-optique, p. ex. transition de phase induite par un champ, effet d'orientation, interaction entre milieu récepteur et matière additive ou diffusion dynamique
A display device includes a display panel and an anti-reflective film. The anti-reflective film is disposed on the display panel. The anti-reflective film includes a first high refractive index layer and a first low refractive index layer stacked in sequence. A thickness of the first high refractive index layer is greater than a thickness of the first low refractive index layer. Under irradiation of a CIE standard illuminant D65 light source, a reflected light of the display device satisfies the following conditions in the CIE L*a*b* color space: 0≥a*≥−6 and 0≥b*≥−6. The display device of the disclosure may reduce reflectivity of ambient light or improve visual effects.
The disclosure provides an electronic device including a substrate, a semiconductor, a first conductive layer, a second conductive layer, a first insulating layer, and a second insulating layer. The semiconductor is disposed on the substrate. The first conductive layer is disposed on the semiconductor. The second conductive layer is disposed on the first conductive layer. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second insulating layer is disposed between the first conductive layer and the semiconductor. The second conductive layer is electrically connected to the first conductive layer through a first via penetrating the first insulating layer and electrically connected to the semiconductor through a second via penetrating the first insulating layer and the second insulating layer. A width of the first via is less than a width of the second via.
An electronic device includes a support substrate, a plurality of first substrates, a plurality of semiconductor elements and a plurality of adhesive layers. The first substrates are disposed on the support substrate. The semiconductor elements are disposed on at least one of the first substrates. The adhesive layers are disposed between the support substrate and the first substrates. Two adjacent ones of the first substrates are separated from each other by a first gap defining a first distance, and two adjacent ones of the adhesive layers are separated from each other by a second gap defining a second distance. The first distance is different from the second distance.
An electronic device is provided, which includes a substrate, a first wire, a second wire, a first semiconductor element, and a second semiconductor element. The first wire is disposed on the substrate and extends along a first direction. The second wire is disposed on the substrate and extends along a second direction different from the first direction. The first semiconductor element is overlapped with the first wire. The second semiconductor element is adjacent to the first semiconductor element. The first semiconductor element has a first portion and a second portion separated from each other along the first direction by a first distance, the second semiconductor element has a third portion and a fourth portion separated from each other along the first direction by a second distance, and the second distance is less than the first distance. The second wire is at least partially overlapped with the second semiconductor element.
H10D 89/60 - Dispositifs intégrés comprenant des dispositions pour la protection électrique ou thermique, p. ex. circuits de protection contre les décharges électrostatiques [ESD].
H10D 86/40 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT]
12.
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device includes a circuit substrate, a first semiconductor element, a second semiconductor element, and a connection element. The circuit substrate includes a first pad. The first semiconductor element is disposed on the circuit substrate and includes a second pad and a third pad. The second semiconductor element is disposed on the circuit substrate. The connection element is disposed on the circuit substrate and electrically connects the first semiconductor element and the second semiconductor element. The connection element includes a fourth pad. The second pad is bonded to the first pad through a conductive material, and the third pad is directly bonded to the fourth pad.
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
An electronic device includes a first electronic unit, a molding layer and a circuit structure. The molding layer surrounds the first electronic unit. The circuit structure is disposed at a side of the molding layer and electrically connected to the first electronic unit. The circuit structure includes a first portion and a second portion disposed between the first portion and the first electronic unit in a normal direction of the electronic device. The first portion includes a first insulating layer, the second portion includes a second insulating layer and a third insulating layer, the second insulating layer is disposed between the first insulating layer and the third insulating layer, the third insulating layer is disposed between the second insulating layer and the molding layer, and a dielectric loss of the second insulating layer is less than dielectric losses of the first insulating layer and the third insulating layer.
An electronic device of the disclosure includes a first substrate, a circuit layer, a plurality of electronic units, and a circular polarizer. The first substrate has a first surface. The circuit layer is disposed on the first surface. The plurality of electronic units are disposed on the first surface and electrically connected to the circuit layer. The circular polarizer includes a phase retardation film and a linear polarizing film disposed on the phase retardation film, and the linear polarizing film includes a functional region and a redundant region. In a normal direction of the first surface, the redundant region is overlapped with the plurality of electronic units, and the functional region is overlapped with an area of the first substrate not covered by the plurality of electronic units.
An electronic device includes a substrate, a through hole, a first electronic unit, a second electronic unit, a circuit structure, and a third electronic unit. The substrate has a first surface, a second surface opposite the first surface, a first cavity, and a second cavity. A sidewall of the first cavity is connected to the first surface, and a sidewall of the second cavity is connected to the first surface. The through hole extends through the substrate, and a sidewall of the through hole is connected to the first surface and the second surface. The first electronic unit is disposed in the first cavity. The second electronic unit is disposed in the second cavity. The circuit structure is disposed on the first electronic unit and the second electronic unit. The bottom surfaces of the first and second cavities have a roughness ranging from 0 to 2 micrometers.
H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p. ex. marques de repérage, schémas de test
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
An operation method for an electronic device includes steps of: providing a first transistor having a first end and a second end; providing a power consuming device electrically connected to the first end of the first transistor; and providing a signal source electrically connected to the second end of the first transistor, wherein, in a frame time including a writing period and an output period, the signal source provides a high voltage level during the output period, and the signal source provides a low voltage level during the writing period.
H03K 17/56 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs
17.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of an electronic device including the following steps is provided. A carrier is provided, wherein the carrier has a base layer and a temporary adhesive layer disposed on the base layer. A first sub-perforation substrate disposed on a platform is provided. A first laminating step is performed to laminate the base layer to the first sub-perforation substrate through the temporary adhesive layer to form a substrate structure. A second sub-perforation substrate is provided, and the second sub-perforation substrate is laminated to the first sub-perforation substrate. When performing the first laminating step, position along a normal direction of the platform, the carrier moves from a first position to a second position, and a distance between the first position and the platform is greater than a distance between the second position and the platform. The electronic device is also provided.
A display device includes a circuit substrate, first and second light emitting units disposed on the circuit substrate, and first and second light collection structures. The first light collection structure corresponds to the first light emitting unit, and the second light collection structure corresponds to the second light emitting unit. In a top-view direction, there is a first distance between the first light emitting unit and the first light collection structure, there is a second distance between the second light emitting unit and the second light collection structure, the first light collection structure has a first diameter, and the first distance, the second distance and the first diameter satisfy: |C1−C2|≤⅕×D1, where C1 represents the first distance, C2 represents the second distance, D1 represents the first diameter, and C1 and C2 are each not equal to zero.
H10H 29/855 - Moyens de mise en forme du champ optique, p. ex. lentilles
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
An electronic device includes a substrate having an active area, plural scan lines, plural data lines, plural first transistors, and plural second transistors. The scan lines and the data lines are disposed on the substrate, and are intersected to form plural pixels arranged in an array and disposed in the active area. The first transistors are disposed corresponding to the pixels of the active area, wherein each of the first transistors includes a first semiconductor. The second transistors are disposed corresponding to the pixels of the active area and alternately arranged with the first transistors, wherein each of the second transistors includes a second semiconductor. A material of the first semiconductor is different from that of the second semiconductor, and a distance between two adjacent first semiconductors is greater than that between two adjacent data lines.
H10D 86/40 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT]
H10D 86/60 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT] les transistors TFT étant dans des matrices actives
20.
Electronic Device with Improved Electrical Property
An electronic device includes: a first insulating layer; a first metal bump disposed on the first insulating layer; a second insulating layer disposed on the first metal bump; a metal layer, wherein the first insulating layer is disposed between the second insulating layer and the metal layer; a second metal bump disposed between the metal layer and the first insulating layer, wherein the second metal bump electrically connects to the first metal bump; a third insulating layer disposed between the second metal bump and the first insulating layer, wherein the third insulating layer includes an opening exposing a portion of the second metal bump; and a fourth insulating layer disposed between the third insulating layer and the first insulating layer, wherein a portion of the fourth insulating layer extends and is disposed in the opening to contact the second metal bump.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
An electronic device includes a substrate, and a plurality of sensor units, a first sub-pixel, a second sub-pixel, a third sub-pixel and a signal line, all of which are disposed on the substrate. The second sub-pixel is adjacent to the first sub-pixel. In a top view of the electronic device, the first sub-pixel and the second sub-pixel are arranged along a first direction, and at least one of the sensor units is disposed between the first sub-pixel and the second sub-pixel. The third sub-pixel is adjacent to the second sub-pixel. In the top view, the second sub-pixel and the third sub-pixel are arranged along a second direction. The signal line is configured to transmit a touch signal. In the top view, the signal line is disposed between the second sub-pixel and the third sub-pixel, and is not overlapped with the at least one of the sensor units.
An electronic device includes: a first substrate; an element layer disposed on the first substrate and including an active area and a peripheral area surrounding the active area; a first bonding pad disposed on the peripheral area of the element layer; a second substrate disposed opposite to the first substrate; a second bonding pad disposed on the second substrate and including a first part and a second part surrounding the first part; and a bonding material disposed between the first part of the second bonding pad and the first bonding pad and between the second part of the second bonding pad and the first bonding pad.
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
An electronic device includes a first substrate, a second substrate, a light modulation layer, a first electrode layer, a second electrode layer, a photoelectric conversion component and a driving circuit. The second substrate is disposed opposite to the first substrate. The light modulation layer is disposed between the first substrate and the second substrate. The first electrode layer is disposed between the first substrate and the light modulation layer. The second electrode layer is disposed between the second substrate and the light modulation layer. The photoelectric conversion component is disposed between the first substrate and the second substrate. The driving circuit is disposed between the first substrate and the second substrate. The driving circuit is electrically connected to the photoelectric conversion component, and is electrically connected to the first electrode layer and the second electrode layer, respectively.
An electronic device including a substrate, a plurality of semiconductor components, a cover layer and a functional unit is provided. The substrate has a plurality of first side surfaces. The plurality of semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least two of the first side surfaces and at least two of the second side surfaces, wherein a thickness of the functional unit close to an upper surface of the cover layer is less than the thickness of the functional unit close to a lower surface of the cover layer.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H10H 29/24 - Ensembles de plusieurs dispositifs comprenant au moins un composant émetteur de lumière à semi-conducteurs couvert par le groupe comprenant plusieurs dispositifs émetteurs de lumière à semi-conducteurs
An electronic device includes a flexible substrate, a circuit layer, a first electronic unit and a second electronic unit. The flexible substrate includes a main portion and a curve portion connected to the main portion. The circuit layer is disposed on the flexible substrate, and includes a first pad disposed on the main portion and a second pad disposed on the curve portion. The first electronic unit is bonded on the first pad. The second electronic unit is bonded on the second pad. An area of the second pad is different from an area of the first pad.
H10H 29/49 - Interconnexions, p. ex. lignes de câblage ou bornes
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H10H 29/02 - Fabrication ou traitement utilisant des procédés de saisie et placement
H10H 29/34 - Affichages LED à matrice active caractérisés par la géométrie ou l’agencement des sous-pixels à l’intérieur d’un pixel, p. ex. la disposition relative des sous-pixels RGB
An electronic device includes: a first electronic unit; a first transistor electrically connected to the first electronic unit and including a first polysilicon semiconductor; a first insulating layer disposed on the first polysilicon semiconductor; an oxide metal layer disposed on the first insulating layer; a second transistor electrically connected to the first electronic unit and the first transistor and including a first oxide semiconductor; and a second insulating layer disposed between the metal oxide layer and the first oxide semiconductor, wherein the oxide metal layer includes a first pattern overlapping with the first polysilicon semiconductor and a second pattern overlapping with the first oxide semiconductor, a thickness of the second insulating layer between the second pattern and the first oxide semiconductor is greater than or equal to 1000 Å and less than or equal to 8000 Å.
An electronic device includes a driving circuit having first, second, third, and fourth transistors. At least one of the second, third, and fourth transistors includes a conductive layer, a gate, and a semiconductor layer, with the conductive layer overlapping the gate in a normal direction. A temperature sensor detects the temperature of the driving circuit. A control chip receives the detected temperature and provides a first signal based thereon. The conductive layer receives the first signal to adjust a threshold bias voltage of the at least one of the second, third, and fourth transistors.
H10D 86/60 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT] les transistors TFT étant dans des matrices actives
G09G 3/00 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques
H10D 86/40 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT]
An optical system including a display is provided. The display emits a collimated light from a surface, and comprises a plurality of light-emitting units and a collimator. The collimator comprises a plurality of collimating units, and the plurality of collimating units collimate an emitting light emitting from the plurality of light-emitting units, wherein at least one of the plurality of collimating units has a first side and a second side, and an absolute value of a slope of the first side is different from an absolute value of a slope of the second side.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H10H 20/851 - Moyens de conversion de la longueur d’onde
H10H 20/855 - Moyens de mise en forme du champ optique, p. ex. lentilles
An electronic device is provided. The electronic device includes a substrate, a voltage source, and a differential amplifier. The voltage source is disposed on the substrate. The voltage source is configured to output a first bandgap reference voltage and a second bandgap reference voltage. The differential amplifier is disposed on the substrate, and electrically connected to a voltage source. The differential amplifier includes a first sub amplifier, a second sub amplifier, and a third sub amplifier. The first sub amplifier is configured to receive the first bandgap reference voltage. The second sub amplifier is configured to receive the second bandgap reference voltage. The third sub amplifier is electrically connected to the first sub amplifier and the second sub amplifier. The first bandgap reference voltage is lower than the second bandgap reference voltage.
G05F 1/56 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu utilisant des dispositifs à semi-conducteurs en série avec la charge comme dispositifs de réglage final
30.
Electronic device and display device with backup signal generation
An electronic device has a substrate, a first scan driving element, a first scan line, and a first switch element. The substrate has an active area and a peripheral area adjacent to the active area. The first scan driving element is arranged in a first region of the peripheral area. The first scan line is electrically connected to the first scan driving element. The first switch element is arranged in the peripheral area and electrically connected to the first scan line. When the electronic device is under a first condition, the first scan driving element provides a first scan signal to the first scan line. When the electronic device is under a second condition, the first switch element is turned on to transmit a second scan signal to the first scan line.
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
A conductive membrane for testing, including: a circuit structure including a first metal layer and a second metal layer disposed on the first metal layer; a protrusion portion disposed on the circuit structure and protruding from the circuit structure; and an insulating layer disposed surrounding the first metal layer and the second metal layer, wherein the protrusion portion and the second metal layer are overlapped, and at least part of the insulating layer is disposed between the second metal layer and the protrusion portion.
A light emitting device is provided. The light emitting device includes a backplate, a reflection layer, a circuit board, a plurality of light emitting units, and a film. The backplate includes a side portion and a bottom portion connecting to the side portion. The reflection layer is disposed on the side portion and the bottom portion. The circuit board is disposed on the bottom portion. The plurality of light emitting units are disposed on the circuit board. The film is disposed on the plurality of light emitting units. The pitch between two adjacent ones of the plurality of light emitting units is greater than the optical distance between the film and the circuit board. The ratio of the optical distance to the pitch of adjacent two of the plurality of light emitting units ranges from 0.1 to 0.7.
An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, multiple light emitting elements, and a light absorbing layer. The light emitting elements are disposed on the substrate. One of the light emitting elements has at least one lateral surface. The light absorbing layer is disposed on the substrate and is located between two adjacent light emitting elements, and the light absorbing layer contacts the at least one lateral surface.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
An electronic device is provided. The electronic device includes an electronic unit and a circuit structure. The circuit structure is electrically connected to the electronic unit. The circuit structure includes a first conductive layer, a first insulating layer and a first heat dissipation element. The first insulating layer is disposed between the first conductive layer and the electronic unit. The first heat dissipation element is in contact with the first conductive layer. Moreover, a heat transfer coefficient of the first dissipation element is greater than a heat transfer coefficient of the first insulating layer and less than a heat transfer coefficient of the first conductive layer.
An electronic device includes: a first light-transmitting element; a second light-transmitting element disposed opposite to the first light-transmitting element; and a switchable light control element disposed between the first light-transmitting element and the second light-transmitting element; wherein a first chamber is between the first light-transmitting element and the switchable light control element, a second chamber is between the second light-transmitting element and the switchable light control element, and the switchable light control element includes at least one of a light absorption switching element and a light scattering switching element.
G02F 1/1333 - Dispositions relatives à la structure
E06B 3/66 - Blocs comprenant plusieurs panneaux de verre ou analogues qui sont espacés et fixés les uns aux autres de façon permanente, p. ex. le long des bords
E06B 3/67 - Blocs comprenant plusieurs panneaux de verre ou analogues qui sont espacés et fixés les uns aux autres de façon permanente, p. ex. le long des bords caractérisés par des aménagements ou des dispositifs additionnels pour l'isolation thermique ou acoustique
G02F 1/1339 - JointsÉléments d'espacementScellement des cellules
36.
DRIVING SUBSTRATE WITH OVERLAPPED METAL LAYERS AND SEMICONDUCTOR LAYER
A driving substrate is provided. The driving substrate includes a substrate and a first metal layer disposed thereon. The first metal layer has a first portion, a second portion, and a third portion, in a top view, the first portion and the second portion are arranged along a first direction, and the third portion extends along the first direction and is connected between the first portion and the second portion. In a second direction perpendicular to the first direction, a width of the third portion is less than both a width of the first portion and a width of the second portion. The driving substrate includes a second metal layer disposed on the substrate and overlapped with the first portion and the second portion; and a semiconductor disposed on the substrate. The first metal layer, the second metal layer, and the semiconductor are overlapped with each other.
H10D 86/60 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT] les transistors TFT étant dans des matrices actives
G02F 1/1362 - Cellules à adressage par une matrice active
G02F 1/1368 - Cellules à adressage par une matrice active dans lesquelles l'élément de commutation est un dispositif à trois électrodes
H10D 86/40 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT]
An electronic device includes a substrate, a first signal line, an insulating layer, and a metal layer. The first signal line is disposed on the substrate. The insulating layer is disposed on the substrate. The metal layer is disposed on the substrate. At least a portion of the metal layer overlapping the first signal line and the insulating layer, wherein the insulating layer is disposed between the first signal line and the metal layer, the metal layer comprises at least one of a low-reflection metal material layer, and the metal layer has a thickness less than 5000 Å.
G06F 1/18 - Installation ou distribution d'énergie
H10D 86/40 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT]
H10D 86/60 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT] les transistors TFT étant dans des matrices actives
A display device for projecting light to an object includes a substrate having a first region overlapping a first curved surface of the object and a second region overlapping a second curved surface of the object, light-emitting elements disposed on the substrate, and a light adjusting layer disposed on the light-emitting elements. The light-emitting elements include a first light-emitting element disposed in the first region and a second light-emitting element disposed in the second region. The light adjusting layer includes a first light-adjusting element enabling the first light-emitting element to emit a first emitted light with a first light-emitting direction and a second light-adjusting element enabling the second light-emitting element to emit a second emitted light with a second light-emitting direction. An included angle between the second light-emitting direction and a normal direction of the substrate is greater than that between the first light-emitting direction and the normal direction.
An electronic device includes a plurality of light-emitting units disposed on a substrate, an encapsulation layer disposed on the substrate, and a plurality of patterns disposed on the substrate. Wherein at least one of the plurality of patterns includes a first part and a second part, and the first part and the second part are different in shape.
H10K 59/50 - OLED intégrées avec des éléments de modulation de lumière, p. ex. avec des éléments électrochromes, des éléments photochromes ou des éléments à cristaux liquides
G02F 1/13 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des cristaux liquides, p. ex. cellules d'affichage individuelles à cristaux liquides
G02F 1/1333 - Dispositions relatives à la structure
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p. ex. des polariseurs ou des réflecteurs
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H10H 29/14 - Dispositifs intégrés comprenant au moins un composant émetteur de lumière à semi-conducteurs couvert par le groupe comprenant plusieurs composants émetteurs de lumière à semi-conducteurs
H10K 59/12 - Affichages à OLED à matrice active [AMOLED]
H10K 59/131 - Interconnexions, p. ex. lignes de câblage ou bornes
An electronic device includes: a first substrate; a second substrate opposite to the first substrate; a light modulation layer disposed between the first substrate and the second substrate; and an antenna structure having a first electrode and a second electrode, wherein the first electrode is disposed on a surface of the first substrate away from the light modulation layer, the second electrode is disposed between the first substrate and the light modulation layer, and the second electrode is used to receive a ground voltage.
E06B 9/24 - Écrans ou autres dispositifs protecteurs contre la lumière, notamment contre la lumière solaireÉcrans similaires pour protection de l'intimité ou pour des raisons esthétiques
An electronic device has a dimming area and an antenna area, and includes: a first substrate; a second substrate opposite to the first substrate; a first light modulation layer disposed between the first substrate and the second substrate and located in the dimming area; and a first antenna electrode disposed on a side of the first substrate adjacent to the first light modulation layer and located in the antenna area, wherein the first light modulation layer includes a liquid crystal material.
H01Q 21/28 - Combinaisons d'unités ou systèmes d'antennes sensiblement indépendants et n’interagissant pas entre eux
G02F 1/1339 - JointsÉléments d'espacementScellement des cellules
G02F 1/1347 - Disposition de couches ou de cellules à cristaux liquides dans lesquelles un faisceau lumineux est modifié par l'addition des effets de plusieurs couches ou cellules
H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
H01Q 1/38 - Forme structurale pour éléments rayonnants, p. ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant
H01Q 1/42 - Enveloppes non intimement mécaniquement associées avec les éléments rayonnants, p. ex. radome
42.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
A manufacturing method of an electronic device includes following steps: (a) providing an electronic panel, wherein the electronic panel includes a first substrate and a plurality of electronic elements, and the plurality of electronic elements are bonded on the first substrate; (b) inspecting the electronic panel, wherein when the electronic panel is determined to be a defective product, perform following step (c) to step (f); (c) debonding the plurality of electronic elements from the first substrate; (d) transferring the plurality of electronic elements to a temporary substrate; (e) transferring the plurality of electronic elements from the temporary substrate to a second substrate; and (f) bonding the plurality of electronic elements on the second substrate.
An electronic device includes a base, a data line disposed on the base, a scan line disposed on the base and crossing the data line, an optical sensing element configured to sense a light and generate a signal, a signal line electrically connected to the optical sensing element and configured to transmit the signal, and a touch line disposed on the base. In a top view direction of the electronic device, the scan line at least partially overlaps the touch line.
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
G09F 9/30 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels dans lesquels le ou les caractères désirés sont formés par une combinaison d'éléments individuels
G09G 3/3208 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p. ex. utilisant des diodes électroluminescentes [LED] organiques, p. ex. utilisant des diodes électroluminescentes organiques [OLED]
An electronic device includes a panel and an optical structure. The optical structure layer is disposed on the panel and comprising a first layer, a second layer and a third layer, wherein the second layer is disposed between the first layer and the third layer, the first layer is disposed between the second layer and the panel, the first layer and the second layer have different optical properties. Wherein a gloss of the electronic device is smaller than or equal to 10GU. Wherein a reflectivity of a specular component excluded (SCE) reflection light of the electronic device is greater than or equal to 0.6 times the reflectivity of the specular component included (SCI) reflection light of the electronic device.
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
A display panel including a flexible substrate base, a plurality of light-emitting units, and a circuit board are provided. A border of the flexible substrate base comprises a first part and a second part connected to the first part. The flexible substrate base includes a dummy region including an outer edge and an inner edge and a region surrounded by the dummy region and the first part of the border of the flexible substrate base. The region includes a display region and a peripheral region. The light-emitting units are disposed on the flexible substrate base and in the display region. The peripheral circuit is disposed on the flexible substrate base and in the peripheral region and electrically connected to the light-emitting units. The circuit board is electrically connected to the peripheral circuit, wherein the circuit board is overlapped with the first part of the border of the flexible substrate base.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H10H 20/857 - Interconnexions, p. ex. grilles de connexion, fils de connexion ou billes de soudure
An electronic device includes a supporting board, a substrate, a semiconductor element, a spacer, a gap and a filler. The substrate is disposed on the supporting board. The semiconductor element is disposed on the substrate. The spacer is disposed along a periphery of the supporting board. The gap is disposed between the substrate and the spacer in a cross-section view. The filler is disposed on the supporting board. The filler covers the substrate and the gap.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H10H 20/854 - Encapsulations caractérisées par leurs matériaux, p. ex. résines époxy ou silicone
H10H 20/857 - Interconnexions, p. ex. grilles de connexion, fils de connexion ou billes de soudure
A shaking device is used for placing a container assembly, and includes: at least one engagement unit including: a body; and a latching element disposed on the body, wherein the at least one engagement unit engages with the container assembly through the latching element; a spindle, wherein the at least one engagement unit is fixed on the spindle; and a driving element coupled with the spindle, wherein the driving element drives the spindle to drive the at least one engagement unit to rotate or swing.
A cover return method is provided for a syringe, and includes: providing the syringe, wherein the syringe is fixed on a first clamping element and has a needle head; providing a needle cover, wherein the needle cover is fixed on a second clamping element and has an accommodating space; providing an adjusting element, wherein, when the first clamping element and the second clamping element are close to each other so that the needle head is adjacent to the needle cover, the adjusting element adjusts an extension direction of the needle head to be toward an extension direction of the accommodating space; and the first clamping element and the second clamping element continuing to be close to each other so that the needle head is inserted into the accommodating space of the needle cover.
A61M 5/32 - AiguillesParties constitutives des aiguilles relatives au raccordement de celles-ci à la seringue ou au manchonAccessoires pour introduire l'aiguille dans le corps ou l'y maintenirDispositifs pour la protection des aiguilles
An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, at least one electronic unit, an adhesive layer, an insulating layer, and a conductive structure. The substrate has at least one recess. The electronic unit is disposed in the recess, and the adhesive layer is disposed between the electronic unit and a bottom surface of the recess. The insulating layer is disposed on the electronic unit and the recess. The conductive structure is disposed on the insulating layer, and the conductive structure penetrates through the insulating layer to be electrically connected to the electronic unit.
An image processing method and a display system are provided. The image processing method includes following steps: receiving image data having angular profile data corresponding to a plurality of positions; processing the image data by performing at least one of filtering noise, image compensation, image modification, and image discontinuity reduction to generate a processed image data; and outputting the processed image data.
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p. ex. utilisant des diodes électroluminescentes [LED]
G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur
G06V 10/60 - Extraction de caractéristiques d’images ou de vidéos relative aux propriétés luminescentes, p. ex. utilisant un modèle de réflectance ou d’éclairage
A grasp device is used to grasp a container, and includes a main body, a first structure member and a moving member. The first structure member is fixed to the main body. The moving member is disposed on the main body. The first structure member and the moving member are used to contact a portion of the container. There is a first space between the moving member and the first structure member when the moving member is disposed at a first position. There is a second space between the moving member and the first structure member when the moving member is disposed at a second position, where a size of the second space is larger than a size of the first space.
An image recognition system for recognizing a plurality of containers includes an image capturing component, a barcode recognition module, a container feature recognition module and a comparison module. The image capturing component is used to acquire a plurality of images, wherein each of the plurality of images includes a picture of the plurality of containers at a different angle. The barcode recognition module is used to acquire a first comparison result by recognizing barcodes on the plurality of containers in the plurality of images. The container recognition module is used to acquire a second comparison result by recognizing appearance features of the plurality of containers in the plurality of images. The comparison module is used to generate a final comparison result by comparing the first comparison result with the second comparison result.
G06V 10/75 - Organisation de procédés de l’appariement, p. ex. comparaisons simultanées ou séquentielles des caractéristiques d’images ou de vidéosApproches-approximative-fine, p. ex. approches multi-échellesAppariement de motifs d’image ou de vidéoMesures de proximité dans les espaces de caractéristiques utilisant l’analyse de contexteSélection des dictionnaires
G06K 7/14 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation électromagnétique, p. ex. lecture optiqueMéthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire utilisant la lumière sans sélection des longueurs d'onde, p. ex. lecture de la lumière blanche réfléchie
An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of the electronic device includes: providing a substrate having a first surface and a second surface opposite to the first surface; forming a through hole penetrating the substrate, a side wall of the through hole connected with the first surface and the second surface; providing a first conductive layer on the substrate, the first conductive layer extending into the through hole; providing a second conductive layer on the first conductive layer, the second conductive layer extending into the through hole and having an original thickness; performing a thinning step to remove at least a portion of the second conductive layer; and performing an inspection step to obtain a first inspection result, and determining whether to continue subsequent steps according to the first inspection result.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
55.
CLAMPING DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
A clamping device is used to clamp a syringe and includes: a first fixing member and a second fixing member; a first pressing member and a second pressing member; and a first connecting member and a second connecting member, wherein two ends of the first connecting member are pivotally connected to the first fixing member and the first pressing member, respectively, and two ends of the second connecting member are pivotally connected to the second fixing member and the second pressing member, respectively, wherein the syringe includes a barrel and a handle and, when the first fixing member and the second fixing member approach to each other and contact the barrel of the syringe, the first pressing member and the second pressing member contact the handle of the syringe.
A61M 5/14 - Dispositifs de perfusion, p. ex. perfusion par gravitéPerfusion sanguineAccessoires à cet effet
A61M 5/145 - Perfusion sous pression, p. ex. utilisant des pompes utilisant des réservoirs sous pression, p. ex. au moyen de pistons
A61M 5/172 - Moyens pour commander l'écoulement des agents vers le corps ou pour doser les agents à introduire dans le corps, p. ex. compteurs de goutte-à-goutte électriques ou électroniques
An electronic device including an active region and a peripheral region, and includes: a substrate including a first border extending along a first direction; a first electrode layer disposed on the substrate; a first conductive glue and a second conductive glue disposed in the peripheral region; an insulating glue overlapped with the first conductive glue and the second conductive glue; a first element fixed on the first electrode layer through the first conductive glue and the insulating glue; and a second element fixed on the first electrode layer through the second conductive glue and the insulating glue; wherein the first conductive glue and the second conductive glue are separated by a space, and the insulating glue at least partially overlaps the space; a sum of lengths of the first conductive glue and the second conductive glue is less than a length of the insulating glue.
The disclosure provides a display method of an electronic device. The electronic device includes a display panel and a light source module. The light source module is disposed at a side of the display panel. The light source module includes a first group of light-emitting units and a second group of light-emitting units that are alternately arranged, wherein the first group of light-emitting units and the second group of light-emitting units emit a light alternately, and each of a plurality of display pixels is adapted to alternately receive the light from the first group of light-emitting units and the second group of light-emitting units.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
An electronic device includes a first semiconductor component, a second semiconductor component, an encapsulation layer, and a circuit layer. The encapsulation layer has a first side, and the encapsulation layer surrounds the first semiconductor component and the second semiconductor component. The circuit layer is disposed on the first side of the encapsulation layer. The encapsulation layer has a first thickness, and the first semiconductor component has a second thickness. The first thickness is greater than the second thickness. A difference between the first thickness and the second thickness is greater than half of the first thickness and less than three times the second thickness. In a top view, the encapsulation layer has a first area, the first semiconductor component has a second area, the second semiconductor component has a third area, and a sum of the second area and the third area is greater than half of the first area.
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
The disclosure provides a method of manufacturing an electronic device. The method of manufacturing the electronic device includes the following steps: providing a transparent carrier having an accommodation space, wherein the transparent carrier has a first mark; disposing a sample in the accommodation space of the transparent carrier, wherein the sample has a second mark; calculating an offset of the sample according to the first mark, the second mark, and a standard value; and forming a third mark on the sample or the transparent carrier according to the offset. The method of manufacturing of the electronic device of the disclosure may improve process yield or reliability.
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p. ex. marques de repérage, schémas de test
An electronic device includes an image capturing module and a processing module. The image capturing module is configured to capture a hand to obtain a first hand image. The processing module is configured to receive the first hand image, process the first hand image through an artificial intelligence model to generate a first hand landmark, and control the electronic device to enter the unlock mode according to a first gesture corresponding to the first hand landmark.
G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur
G06T 7/246 - Analyse du mouvement utilisant des procédés basés sur les caractéristiques, p. ex. le suivi des coins ou des segments
G06V 10/77 - Traitement des caractéristiques d’images ou de vidéos dans les espaces de caractéristiquesDispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p. ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]Séparation aveugle de source
G06V 40/20 - Mouvements ou comportement, p. ex. reconnaissance des gestes
An electronic device is provided. The electronic device includes a plurality of conductive elements, a first electronic unit and a protective layer. The first electronic unit is disposed between two adjacent first conductive elements of the plurality of conductive elements. A second conductive element of the plurality of conductive elements is disposed adjacent to one of the two adjacent first conductive elements of the plurality of conductive elements. The protective layer surrounds the plurality of conductive elements and the first electronic unit. Moreover, the one of the two adjacent first conductive elements has a first width, the second conductive element has a second width, and the second width is less than the first width.
H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p. ex. marques de repérage, schémas de test
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
An electronic device is provided. The electronic device includes an insulating layer, an organic layer, an adhesive layer, and a functional layer. The insulating layer has a through hole and a side surface adjacent to the through hole. The organic layer is disposed on the insulating layer. The adhesive layer is disposed on the organic layer. The functional layer is disposed on the adhesive layer. In a cross-sectional view of the electronic device, at the side surface of the insulating layer, a first thickness of the adhesive layer is greater than a first thickness of the organic layer.
An electronic device includes a circuit structure, a first electronic unit and an encapsulation layer. The first electronic unit is disposed on the circuit structure. The encapsulation layer surrounds the first electronic unit. The circuit structure includes at least one first insulating layer and at least one second insulating layer. The at least one first insulating layer is disposed between the first electronic unit and the at least one second insulating layer. A stiffness of the at least one first insulating layer is less than a stiffness of the at least one second insulating layer.
An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate and a first buffer layer. The substrate has a via. The substrate includes a first base layer and a second base layer. The first base layer includes a first sub via penetrating the first base layer. The second base layer is bonded to the first base layer. The second base layer includes a second sub via penetrating the second base layer. The first sub via and the second sub via overlap each other to define the via. The first buffer layer is disposed in the via. The first sub via has a pore size, the first sub via and the second sub via have an overlapping region, the overlapping region has an overlapping width, and a difference between the pore size and the overlapping width ranges from 0.01 micrometers to 5 micrometers.
An electronic device includes a substrate, a first conductive layer pattern, a second conductive layer pattern, a first opening, a dielectric layer, a third conductive layer pattern and a chip. The first conductive layer pattern is disposed on a surface of the substrate. The second conductive layer pattern is disposed on another surface of the substrate. The another surface is opposite to the surface. The first opening penetrates the surface and the another surface. The dielectric layer is disposed on the surface and covers the first conductive layer pattern. The third conductive layer pattern is disposed on the dielectric layer and electrically coupled to the first conductive layer pattern through a second opening penetrated the dielectric layer. The chip is disposed on the substrate and electrically coupled to the third conductive layer pattern through a first solder ball. The second opening tapers toward and misalign with the first opening.
H04B 1/66 - Détails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission pour réduire la largeur de bande des signauxDétails des systèmes de transmission, non couverts par l'un des groupes Détails des systèmes de transmission non caractérisés par le milieu utilisé pour la transmission pour améliorer l'efficacité de la transmission
H01B 1/12 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques substances organiques
H01B 13/32 - Remplissage ou revêtement avec un matériau imperméable
H04B 1/03 - Détails de structure, p. ex. boîtiers, enveloppes
66.
MEDICAL IMAGE DISPLAY METHOD AND ELECTRONIC DEVICE
Disclosed are a medical image display method and an electronic device. The medical image display method includes the following steps: receiving a plurality of medical reference images corresponding to a plurality of image sources in different formats; performing image co-registration and image segmentation based on the medical reference images to generate at least one co-registered image mask; performing image overlay according to the at least one co-registered image mask and at least one of the medical reference images to generate an overlay image; and displaying a medical image according to the overlay image.
An electronic device includes a power source, a light source and a driver. The power source includes a control signal end and an output end. The light source is electrically connected to the output end. The driver is electrically connected to the control signal end, and the driver includes: a signal source, and a signal conversion circuit. The signal conversion circuit is electrically connected to the signal source and the control signal end, wherein the signal conversion circuit includes a switch, the switch includes a control end, and the signal source is electrically connected to the control end of the switch.
An electronic device provided herein includes a substrate, a circuit layer, a first insulating layer, a first reflective layer, a second insulating layer, a second reflective layer. The circuit layer is disposed on the substrate. The first insulating layer is disposed on the circuit layer. The first reflective layer is disposed on the first insulating layer. The second insulating layer is disposed on the first reflective layer. The second reflective layer is disposed on the second insulating layer. The second reflective layer includes a plurality of reflective sub-layers, and a portion of the first reflective layer is disposed corresponding to a gap between two adjacent ones of the plurality of reflective sub-layers.
An electronic device includes: a housing, a first restraining holder, a second restraining holder and at least one protruding rib structure. The housing includes a first surface. The first restraining holder, the second restraining holder and at least part of the protruding rib structure are arranged on the first surface, and at least part of the protruding rib structure is disposed between the first restraining holder and the second restraining holder.
An electronic device includes a substrate, a first active layer, a second active layer, an insulating layer and a metal line. The first active layer is disposed on the substrate and includes a first end. The second active layer is disposed on the substrate and includes a second end, wherein the second end is adjacent to the first end. The insulating layer is disposed on the first active layer and the second active layer. The metal line is disposed on the insulating layer. In a cross-sectional view of the electronic device, the insulating layer includes a first opening, and a portion of the metal line is disposed in the first opening and overlapped with the first end, and in a top view of the electronic device, the first end has an edge, a portion of the edge is arc-shaped and located between the first opening and the second end.
An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a seed layer, and a conductor layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a through hole, and the through hole has a sidewall connected to the first surface and the second surface. The seed layer is disposed on the first surface, the second surface, and the sidewall. The conductor layer is disposed on the seed layer, and a roughness of a surface of the seed layer is greater than or equal to 1 nm and less than or equal to 1 μm.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
An electronic device includes a substrate and a first switching element. The substrate has a peripheral circuit area. The first switching element is disposed in the peripheral circuit area and includes a first transistor and a second transistor. A first gate of the first transistor is connected to a second gate of the second transistor. A projection area of a semiconductor layer of the first transistor and a semiconductor layer of the second transistor to the substrate is within a projection area of the first gate and the second gate to the substrate.
H10D 86/40 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT]
H10D 86/60 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT] les transistors TFT étant dans des matrices actives
A display device is provided. The display device is disposed under a windshield. The bottom of the windshield has a first arc-shaped edge. The display device includes a display panel to project a display image onto the windshield. The display panel is flat. The display panel has a second arc-shaped edge adjacent to the first arc-shaped edge. The first arc-shaped edge has a first radius of curvature, represented by Rs1. The second arc-shaped edge has a second radius of curvature, represented by Rd1. The ratio of the first radius of curvature to the second radius of curvature is greater than or equal to 0.1 and less than or equal to 10.
An electronic device is provided. The electronic device includes a plurality of electronic units. Each of the plurality of electronic units includes a pixel circuit and a plurality of tunable circuits. The plurality of tunable circuits is coupled to the pixel circuit. The pixel circuit includes at least one scan transistor a plurality of de-multiplexer transistors, a plurality of bias transistors, and a storage capacitor. The plurality of de-multiplexer transistors is coupled to the at least one scan transistor. The plurality of bias transistors is coupled to the plurality of de-multiplexer transistors. The storage capacitor is coupled to a data line through the at least one scan transistor.
H01Q 23/00 - Antennes comportant des circuits ou des éléments de circuit actifs qui leur sont intégrés ou liés
H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
H01Q 3/28 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante faisant varier l'amplitude
An electronic device includes a plurality of electronic units. Each electronic unit includes a pixel circuit and a plurality of tunable circuits. The plurality of tunable circuits is coupled to the pixel circuit. and includes at least one scan transistor, a plurality of de-multiplexer transistors, a plurality of bias transistors, at least one bias-enable transistor and a plurality of storage capacitors. The plurality of de-multiplexer transistors is coupled to the at least one scan transistor. The plurality of bias transistors is coupled to the plurality of de-multiplexer transistors. The at least one bias-enable transistor is coupled to the plurality of bias transistors. The plurality of storage capacitors is coupled to a data line through the at least one scan transistor and the plurality of de-multiplexer transistors, and is coupled to at least one bias voltage line through the plurality of bias transistors and the at least one bias-enable transistor.
G09G 3/00 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques
The disclosure provides a display panel including a substrate, a first electrode layer, a second electrode layer, and a spacer. The first electrode layer is located on the active layer, and the first electrode layer includes a first gate and a second gate. The second electrode layer is located on the substrate. The second electrode layer has first portion overlapping the first gate, a second portion overlapping the second gate, and a first necking portion connecting the first portion of the second electrode layer and the second portion of the second electrode layer. The spacer overlaps the first necking portion of the second electrode layer.
G06F 3/041 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
An electronic device is provided. The electronic device includes a laminated substrate. The laminated substrate includes a substrate having a first surface and a second surface opposite the first surface; a first optical adjustment layer disposed on the first surface; a dielectric layer disposed on the first optical adjustment layer; and an ink layer disposed on the second surface. The first optical adjustment layer includes at least one of a metal material, a semiconductor material, semi-transparent ink and a transparent conductive material.
A display device includes a first substrate, a plurality of light-emitting units, and a plurality of color filter units. The light-emitting units are disposed on the first substrate and include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit emit light of different colors respectively. The color filter units are disposed on the light-emitting units and include a first color filter unit, a second color filter unit, and a third color filter unit. The first color filter unit, the second color filter unit, and the third color filter unit overlap the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit respectively. The first color filter unit, the second color filter unit, and the third color filter unit include a scattering particle.
H10H 29/855 - Moyens de mise en forme du champ optique, p. ex. lentilles
H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords
H10K 59/126 - Blindage, p. ex. moyens de blocage de la lumière sur les TFT
H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]
An electronic device includes a substrate, a circuit layer, a first electronic element and a first insulating structure. The substrate includes a first main structure, a second main structure adjacent to the first main structure, a first connecting structure connecting the first main structure and the second main structure, and a first space disposed between the first main structure and the second main structure, wherein a first edge of the first main structure is overlapped with a part of a boundary of the first space. The circuit layer has a first semiconductor. The first electronic element is electrically connected to the first semiconductor. The first insulating structure includes a first groove. In a top view, at least a part of the first groove of the first insulating structure is disposed between the first edge of the first main structure and the first electronic element.
An electronic device includes a substrate, a first signal line, a first dummy conductive pattern, and a sensing device. The substrate includes a first region, a second region, and a display region. The second region is located between the first region and the display region. The first signal line and the first dummy conductive pattern are disposed on the substrate. The first signal line includes a first portion extending along a first direction and a second portion extending along a second direction different from the first direction, and the first portion and the second portion correspond to the second region. The first dummy conductive pattern corresponds to the second region and is electrically disconnected to the first signal line. The sensing device is overlapped with the first region.
H10D 86/60 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT] les transistors TFT étant dans des matrices actives
H10D 86/40 - Dispositifs intégrés formés dans ou sur des substrats isolants ou conducteurs, p. ex. formés dans des substrats de silicium sur isolant [SOI] ou sur des substrats en acier inoxydable ou en verre caractérisés par de multiples transistors en couches minces [TFT]
81.
3D PRINTING DEVICE, LIGHT CONTROL MODULE AND OPERATION METHOD OF 3D PRINTING DEVICE
A 3D printing device includes a light control module, a light source module, and a receiving slot. The light source module provides a light beam to the light control module. The receiving slot receives a photo-curing material. The light control module is between the light source module and the receiving slot. The photo-curing material is cured by the light beam. The light control module includes first and second substrates, a dielectric layer, and a polarizing element. The first substrate has outer and inner surfaces opposite to each other. The second substrate is opposite to the first substrate. The dielectric layer is between the inner surface of the first substrate and the second substrate. The polarizing element is on the outer surface of the first substrate. A polarization degree of the polarizing element for a light beam having a wavelength range of 375 nm to 405 nm is 98% to 100%.
B29C 64/129 - Procédés de fabrication additive n’utilisant que des matériaux liquides ou visqueux, p. ex. dépôt d’un cordon continu de matériau visqueux utilisant des couches de liquide à solidification sélective caractérisés par la source d'énergie à cet effet, p. ex. par irradiation globale combinée avec un masque
An electronic device includes a substrate, pixels, a second sensing unit, a first driving unit and a second driving unit. Each pixel includes a display unit including a self-luminous element and a first sensing unit. The second sensing unit overlaps at least one of the pixels. In a first mode, the first driving unit outputs a first signal to the display unit. In a second mode, the first driving unit outputs a second signal to the second sensing unit, receives a third signal from the second sensing unit, and outputs a fourth signal to the second driving unit according to the third signal. In a third mode, the second driving unit outputs a fifth signal to the first sensing unit according to the fourth signal, and the first sensing unit transmits a sixth signal to the first driving unit.
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p. ex. utilisant des diodes électroluminescentes [LED]
G06F 3/041 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
G06F 3/044 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs
G06V 40/10 - Corps d’êtres humains ou d’animaux, p. ex. occupants de véhicules automobiles ou piétonsParties du corps, p. ex. mains
H04N 25/616 - Traitement du bruit, p. ex. détection, correction, réduction ou élimination du bruit impliquant une fonction d'échantillonnage corrélé, p. ex. l'échantillonnage double corrélé [CDS] ou l'échantillonnage triple
An electronic device is provided. The electronic device includes a sensing pixel. The sensing pixel includes a photosensitive element, a first transistor, a second transistor, and a third transistor. A control terminal of the first transistor is electrically connected to a read signal line. A control terminal of the second transistor is electrically connected to the photosensitive element. A first terminal of the second transistor is electrically connected to a first voltage. A second terminal of the second transistor is electrically connected to a first terminal of the first transistor. A third terminal of the second transistor is electrically connected to a second voltage. A first terminal of the third transistor is electrically connected to a reset voltage. A second terminal of the third transistor is electrically connected to the photosensitive element. A control terminal of the third transistor is electrically connected to a reset signal line.
An electronic device is provided. The second transistor, the third transistor, the first capacitor and the current driving element are coupled to the first transistor. The fourth transistor writes first and second data to a control terminal of the third transistor and a control terminal of the first transistor according to first and second pulses of a first scanning signal. The second capacitor is coupled to the third transistor and a sweep signal. In a light-emitting period, the second transistor transmits a voltage signal to a first terminal of the first transistor according to an enabling signal and causes the current driving element to emit light. After the third transistor is turned on according to the sweep signal, the voltage signal is transmitted to the control terminal of the first transistor to turn off the first transistor and cause the current driving element to stop emitting light.
An electronic device having an active region and a non-active region is provided and includes an electronic component, a first gate driving circuit, at least one first output control component and a first control circuit. The electronic component is disposed in the active region, and the first gate driving circuit, the first output control component and the first control circuit are disposed in the non-active region. The first gate driving circuit is coupled to the electronic component. The first output control component includes a control terminal, a first terminal and a second terminal, wherein the control terminal of the first output control component is coupled to the first control circuit, the first terminal of the first output control component is coupled to the first gate driving circuit, and the second terminal of the at least one first output control component is coupled to the electronic component.
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p. ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p. ex. utilisant des diodes électroluminescentes [LED]
A method for displaying an image includes the following steps. A display panel and a control circuit are provided, wherein the control circuit is electrically connected to the display panel. During a detection period, the control circuit provides a plurality of gate testing voltages to the display panel, wherein the plurality of gate testing voltages include a maximum testing voltage, an operation voltage and a failure testing voltage, the maximum testing voltage is higher than the operation voltage, the operation voltage is higher than the failure testing voltage, and the time point at which the maximum testing voltage appears is earlier than the time point at which the failure testing voltage appears. During a working period, the control circuit outputs at least one image signal to the display panel according to the operation voltage.
G09G 3/00 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques
G01R 19/165 - Indication de ce qu'un courant ou une tension est, soit supérieur ou inférieur à une valeur prédéterminée, soit à l'intérieur ou à l'extérieur d'une plage de valeurs prédéterminée
87.
Calculation system for calculating quantities of materials required for repairing returned products
A calculation system has a receiving unit, a calculation unit, a determination unit, and an output unit. The receiving unit of the calculation system is used to receive data of historically returned products. The calculation unit of the calculation system is used to calculate the number of each returned product in the next time period based on the data of the historically returned products. The determination unit of the calculation system is used to select the returned products with repair benefits in the next time period, and to calculate the quantity of each material required for repairing the returned products with repair benefits in the next time period, so as to generate data of the quantity of each material. The output unit of the calculation system is used to output the data of the quantity of each material.
A process management system is provided by the present disclosure. The process management system includes a receiving unit, a calculating unit, a comparing unit and an output unit. The receiving unit is used for receiving a real-time data of a machine, wherein the real-time data includes at least one parameter value. The calculating unit is used for calculating and generating at least one contribution value of the real-time data, wherein the at least one contribution value is calculated from the at least one parameter value. The comparing unit is used for comparing the at least one contribution value and at least one controlled contribution value of at least one controlled data to generate at least one comparing value. The output unit is used for outputting at least one comparing result to which the at least one comparing value corresponds.
An electronic device includes a substrate, a plurality of transistors disposed on the substrate, a light emitting unit disposed on at least one of the plurality of transistors, a first insulating layer disposed on the light emitting unit and an optical unit. The first insulating layer has a first opening and a second opening, and the optical unit is disposed in the first opening. In a top view of the electronic device, the first opening is overlapped with at least a portion of the light emitting unit, and the second opening is overlapped with at least a portion of at least one of the plurality of transistors.
The display device provided in the disclosure includes a circuit substrate, a plurality of light-emitting units, a light collection layer, a light adjustment layer, and a color filter layer. The light-emitting units are disposed on the circuit substrate. The light collection layer is disposed on the light-emitting units and includes a plurality of penetrating portions and a plurality of reflecting portions disposed around the penetrating portions. The penetrating portions respectively overlap with the light-emitting units. The light adjustment layer is disposed on the light collection layer. The color filter layer is disposed on the light adjustment layer and includes a plurality of color filter units respectively overlapping with the penetrating portions.
H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]
91.
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes an electronic unit, an encapsulation layer, a circuit structure, a protective layer, a first heat conducting element, and a second heat conducting element. The encapsulation layer surrounds the electronic unit and has a first side and a second side opposite to each other. The circuit structure is disposed on the first side of the encapsulation layer and electronically connected to the electronic unit. The protective layer is disposed on the second side of the encapsulation layer. The first heat conducting element is disposed on the protective layer. The second heat conducting element is disposed on the first heat conducting element. A thermal conductivity of the second heat conducting element is different from a thermal conductivity of the first heat conducting element.
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 25/11 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
A display device is provided and includes a substrate, a first light-emitting unit emitting a first color light, a second light-emitting unit emitting a second color light, a first color filter disposed on the first light-emitting unit, and a second color filter disposed on the second light-emitting unit. The first light-emitting unit and the second light-emitting unit are disposed on the substrate. The first color filter has a first width, a first distance is between the first color filter and the first light-emitting unit, the second color filter has a second width, and a second distance is between the second color filter and the second light-emitting unit. The first width, the second width, the first distance, and the second distance satisfy an equation: tan−1 [(W1/2)/D1] >tan−1 [(W2/2)/D2], wherein W1 represents the first width, W2 represents the second width, D1 represents the first distance, and D2 represents the second distance.
An electronic device includes a first substrate, a semiconductor element, a first inorganic layer, a first electrode, a second electrode and a conductive element. The first inorganic layer is disposed between the first substrate and the semiconductor element. The first inorganic layer has a first surface adjacent to the semiconductor element, a second surface opposite to the first surface, and a through-hole penetrating from the first surface to the second surface. The first electrode is disposed between the first substrate and the first inorganic layer. The second electrode has a first portion disposed on the second surface of the first inorganic layer, and a second portion disposed in the through-hole of the first inorganic layer. The conductive element is disposed between the first electrode and the second electrode. Moreover, in a cross-sectional view of the electronic device, the first portion of the second electrode has a rounded corner.
H10F 39/00 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément couvert par le groupe , p. ex. détecteurs de rayonnement comportant une matrice de photodiodes
G06F 3/041 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
G06F 3/042 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens opto-électroniques
An electronic device includes an electronic unit and a connection structure disposed on the electronic unit. The electronic unit includes an electronic element and a conductive pad electrically connected to the electronic element. The connection structure includes a first pad electrically connected to the conductive pad, a second pad electrically connected to the first pad, and a first polymer surrounding the first pad and the second pad. The first pad includes a first portion, a second portion, and a third portion. The first portion is in contact with the conductive pad, the second portion connects the first portion, and the third portion connects the second portion and extends outwardly with respect to the first portion. The third portion has a first edge adjacent to the conductive pad, and at least a portion of the first edge is inclined toward the conductive pad.
An electronic device has multiple pixel areas, which are divided into multiple first regions and multiple second regions. The electronic device includes a first panel, a second panel, multiple first filter units, and multiple second filter units. The first panel includes a first cholesteric liquid crystal layer for reflecting a first color light. The second panel is disposed at one side of the first panel and includes a second cholesteric liquid crystal layer for reflecting a second color light. The first filter units and the second filter units are disposed between the first cholesteric liquid crystal layer and the second cholesteric liquid crystal layer. The first filter units are respectively located in the first regions, and the second filter units are respectively located in the second regions. The first filter units and the second filter units are configured to absorb lights of different colors.
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p. ex. des polariseurs ou des réflecteurs
G02F 1/133 - Dispositions relatives à la structureExcitation de cellules à cristaux liquidesDispositions relatives aux circuits
G02F 1/1347 - Disposition de couches ou de cellules à cristaux liquides dans lesquelles un faisceau lumineux est modifié par l'addition des effets de plusieurs couches ou cellules
An electronic device, including an electronic unit, a package layer, a circuit structure, and a first heat dissipation layer, is provided. The package layer surrounds the electronic unit. The circuit structure is disposed on the package layer and is electrically connected to the electronic unit. The first heat dissipation layer is disposed on the package layer and is opposite to the circuit structure. The circuit structure includes a conductive portion and an insulative portion surrounding the conductive portion. The first heat dissipation layer includes a first volume, the conductive portion includes a second volume, and the first volume is greater than or equal to the second volume.
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
97.
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
An electronic device and a method for manufacturing the same are provided. The electronic device includes an electronic unit, an encapsulation layer, a circuit structure, and a first heat-conducting assembly is provided. The encapsulation layer surrounds the electronic unit and has a first side and a second side opposite to each other. The circuit structure is disposed on the first side of the encapsulation layer and is electrically connected to the electronic unit. The first heat-conducting assembly is disposed on the second side of the encapsulation layer. Viewing in a top view, the first heat-conducting assembly has a first area, the electronic unit has a second area, and a ratio of the first area to the second area is greater than or equal to 1 and less than 9.8.
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
An electronic device includes a substrate, a layer overlapped with the substrate and having a first side and a second side opposite to the first side, a sensor unit disposed between the substrate and the layer, a first blocking layer disposed on the first side, and a second blocking layer disposed on the sensor unit. The layer includes flexible material. The second side is disposed between the sensor unit and the first side, and the first side is between the first blocking layer and the second side. The first blocking layer has a first opening, and the second blocking layer has a second opening. A width of the first opening is smaller than a width of the second opening.
An electronic device is provided, including a substrate, an electronic component, and a circuit. The electronic component is disposed on the substrate. The circuit is disposed on the substrate and coupled to the electronic component. The circuit includes a first transistor, a first conductive line, a second transistor, a second conductive line, a third conductive line, and a fourth conductive line. The first transistor includes a first semiconductor and a first gate that overlaps with the first semiconductor. The first conductive line is coupled to the first gate of the first transistor. The second transistor includes a second semiconductor and a second gate that overlaps with the second semiconductor. The second semiconductor is different from the first semiconductor in material. The second conductive line is disposed adjacent to the first conductive line and is coupled to the second gate of the second transistor.
An electronic device, including a substrate, a plurality of light emitting elements, two adjacent first protrusions, another two adjacent first protrusions and two adjacent second protrusions. The plurality of light emitting elements are disposed on a first surface of the substrate. The two adjacent first protrusions are disposed on the first surface and separated by a first distance. The another two adjacent first protrusions are disposed on the first surface and separated by a second distance, wherein at least one of the plurality of light emitting elements is disposed between the another two adjacent first protrusions. The two adjacent second protrusions and the two adjacent first protrusions are respectively disposed on opposite sides of the substrate. The first distance is less than the second distance, and at least one of the two adjacent second protrusions is not overlapped with the two adjacent first protrusions.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
G02F 1/1333 - Dispositions relatives à la structure
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides
H10K 102/00 - Détails de structure relatifs aux dispositifs organiques couverts par la présente sous-classe
