An electronic device is provided, which comprises: a substrate comprising an active region and a peripheral region; a common conductive line disposed corresponding to the peripheral region of the substrate; and a scan line disposed on the substrate, wherein the scan line is electrically connected to a first static discharge conductive line through a first electrostatic protection circuit in the peripheral region, wherein the common conductive line is electrically separated from the first static discharge conductive line; wherein in a top view of the substrate, there is a first distance between the common conductive line and the first static discharge conductive line, and the first distance is greater than or equal to 1.5 μm and less than or equal to 12 mm.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
2.
ELECTRONIC DEVICE AND DRIVING METHOD FOR ELECTRONIC DEVICE
An electronic device and a driving method for an electronic device are provided. The electronic device includes a sensor, a controller, a driving circuit, and at least one electronic unit. The sensor senses an ambient temperature to provide ambient temperature information. The controller receives the ambient temperature information. The driving circuit drives the at least one electronic unit according to a driving signal. The driving circuit generates different driving signals according to different ambient temperature information.
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
A display device includes a plurality of pixels and a de-multiplexer. The plurality of pixels are electrically connected to a plurality of data signal lines and a scan signal line, and configured to receive a scan signal through the scan signal line. The de-multiplexer includes a plurality of switch transistors electrically connected to the plurality of pixels through the plurality of data signal lines. The plurality of switch transistors are controlled by a plurality of clock signals. A period of a scan waveform of the scan signal is at least partially overlapped with a period of one of the plurality of clock signals with a last clock waveform. The period of the scan waveform of the scan signal is started after a start of the last clock waveform.
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern including a conductive pattern, and the conductive pattern is formed of the conductive layer. The conductive pattern comprises a plurality of sub-portions arranged along at least one direction, and sizes of the plurality of sub-portions increase sequentially along the at least one direction.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
An electronic device is provided. The electronic device includes a substrate, a first optical film and a second optical film. The first optical film is disposed on the substrate, and the first optical film includes an engaging portion. The second optical film is disposed on the substrate and having an upper surface and a lower surface opposite to each other, and the second optical film is in mutual interference with the engaging portion of the first optical film. The engaging portion includes a first portion, a second portion and an engaging structure, and the first portion and second portion are disposed on opposite sides of the engaging structure, and one of the first portion and the second portion is disposed on the upper surface of the second optical film and the other one is disposed below the lower surface of the second optical film.
A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.
H10K 77/10 - Substrats, p. ex. substrats flexibles
H10K 102/00 - DISPOSITIFS ÉLECTRIQUES À L’ÉTAT SOLIDE ORGANIQUES - Détails de structure relatifs aux dispositifs organiques couverts par la présente sous-classe
An electronic device includes a substrate, two adjacent transistors, a scan line, and two adjacent metal elements. The two adjacent transistors are disposed on the substrate and arranged along a first direction. A first transistor of the two adjacent transistors includes a first active element and a first conductive element electrically connected to the first active element. The two adjacent metal elements are disposed on the substrate and spaced apart from each other along the first direction. In a cross section view along a normal direction of the electronic device, a distance between the first active element and the substrate is greater than a distance between one of the two adjacent metal elements and the substrate. Projections of the first conductive element and the first active element on the substrate are located between projections of the two adjacent metal elements on the substrate.
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
H01L 23/552 - Protection contre les radiations, p.ex. la lumière
An electronic component includes a first electronic unit including a plurality of pads, a first conductive layer, a second conductive layer, a first insulating layer having a first thickness, a second insulating layer having a second thickness, a second electronic unit, and a solder ball. The first conductive layer is disposed between the first electronic unit and the second conductive layer, and electrically connected to at least one of the pads through a conductive via. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second conductive layer is disposed between the first insulating layer and the second insulating layer. The first thickness is different from the second thickness. The second conductive layer is disposed between the first conductive layer and the second electronic unit. The second conductive layer is electrically connected to the second electronic unit through the solder ball.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
An electronic device includes an insulating substrate, an insulating layer, a first connecting element and a second connecting element. The insulating substrate includes a first via hole and a second via hole. The light-emitting unit is disposed on the insulating substrate. The insulating layer is disposed on the insulating substrate, wherein the light-emitting unit is not overlapped with the insulating layer. The first connecting element is electrically connected to and overlapped with the light-emitting unit, wherein the first connecting element is disposed in the first via hole of the insulating substrate. The second connecting element is electrically connected to and overlapped with the light-emitting unit, wherein the second connecting element is disposed in the second via hole of the insulating substrate.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
A circuit structure is provided. The circuit structure includes an insulating layer, a conductive pad and a solder pad. The insulating layer has a first surface and a second surface opposite to the first surface. The conductive pad is disposed on the first surface of the insulating layer. The solder pad is disposed on the second surface of the insulating layer. The solder pad is coupled to the conductive pad. The insulating layer has a recess region on the second surface.
An electronic device includes: a semiconductor layer; a first layer disposed on the semiconductor layer, including at least one of oxygen atoms and nitrogen atoms and having a first maximum thickness; a second layer, wherein the first layer is disposed between the second layer and the semiconductor layer, and the second layer has a second maximum thickness; and a third layer, wherein the second layer is disposed between the first layer and the third layer, the third layer has a third maximum thickness, and the second maximum thickness and the third maximum thickness are greater than the first maximum thickness, wherein the first layer comprises a first position and a second position, the first position is closer to the semiconductor layer than the second position, and a first oxygen atomic percentage at the first position is less than a second oxygen atomic percentage at the second position.
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/22 - Surfaces irrégulières ou rugueuses, p.ex. à l'interface entre les couches épitaxiales
H01L 33/32 - Matériaux de la région électroluminescente contenant uniquement des éléments du groupe III et du groupe V de la classification périodique contenant de l'azote
H01L 33/38 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les électrodes ayant une forme particulière
H01L 33/46 - Revêtement réfléchissant, p.ex. réflecteur de Bragg en diélectriques
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
An antenna device is provided. The antenna device includes a first substrate, a plurality of phase shifters, a second substrate, a plurality of patches and an insulating layer. The plurality of phase shifters are disposed on the first substrate. The second substrate is disposed on the first substrate. The plurality of patches are disposed between the first substrate and the second substrate. The insulating layer is disposed between the plurality of phase shifters and the second substrate. Moreover, a thickness of the insulating layer is greater than or equal to 5 μm and less than or equal to a thickness of the second substrate.
G02F 1/1333 - Dispositions relatives à la structure
G02F 1/1337 - Orientation des molécules des cristaux liquides induite par les caractéristiques de surface, p.ex. par des couches d'alignement
H01Q 3/36 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante faisant varier la phase par des moyens électriques avec des déphaseurs variables
An electronic device is provided. The electronic device includes a substrate, a plurality of first signal lines, a plurality of first driving lines, and a plurality of first conductive lines. The substrate includes an active area. The first signal lines, the first driving lines, and the first conductive lines are disposed in the active area. One end of one of the first driving lines is electrically connected to one of the first signal lines through a through hole. One of the first conductive lines is located in an extension line of the one of the first driving lines. There is a space between an end of the one of the first conductive lines and the end of the one of the first driving lines.
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
14.
DISPLAY DEVICE AND METHOD FOR OPERATING DISPLAY DEVICE
The present disclosure provides a display device and a method for operating the display device. The display device includes a night vision mode and a normal mode, and the display device includes a plurality of visible light display units and a plurality of invisible light display units. The method includes driving the visible light display units and turning off the invisible light display units in the normal mode, and driving the invisible light display units and turning off the visible light display units in the night vision mode.
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
A backlight device includes a substrate, a light emitting component, a first optical film, a second optical film and a third optical film. The light emitting component is disposed on the substrate. The first optical film is disposed on the substrate, and includes a first prism structure extending along a first direction. The second optical film is disposed on the first optical film, and includes a second prism structure extending along a second direction. The third optical film is disposed on the second optical film, and includes a third prism structure extending along a third direction. An included angle between the first direction and the second direction is substantially between 30 degrees and 150 degrees, and the second direction is substantially parallel to the third direction.
A display device including a substrate, an active element, a light emitting element, a color conversion element, and a light blocking element is provided. The active element containing a channel is disposed on the substrate. The light emitting element is configured to be driven by the active element to emit a first light. The first light emitted from the light emitting element passes through the color conversion element to be converted into a second light which then passes through the substrate, and the channel of the active element is protected by the light blocking element from at least a majority of the second light.
H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]
H10K 59/12 - Affichages à OLED à matrice active [AMOLED]
H10K 59/124 - Couches isolantes formées entre les éléments TFT et les éléments OLED
H10K 59/126 - Blindage, p. ex. moyens de blocage de la lumière sur les TFT
H10K 71/00 - Fabrication ou traitement spécialement adaptés aux dispositifs organiques couverts par la présente sous-classe
An electronic device having a first region, a second region, and a third region set between the first region and the second region is provided. The electronic device includes a substrate, a first signal line disposed on the substrate, and a second signal line disposed on the substrate. The first signal line has two portions disposed in the third region and the two portions of the first signal line extends along two directions respectively. The second signal line has two portions disposed in the third region, the two portions of the second signal line extends along two directions respectively, and at least one of the first signal line and the second signal line is configured to transmit a gate signal. In the third region, the first signal line crosses the second signal line.
A method for manufacturing an electronic device includes following steps: providing a substrate structure having a plurality of recesses, wherein each of the plurality of recesses has a first portion and a second portion connected to the first portion, and an area of the first portion is greater than an area of the second portion; providing a plurality of electronic units to the plurality of recesses; detecting a location of at least one of the plurality of electronic units, so as to determine whether the at least one of the plurality of electronic units is disposed in one of the second portions of the plurality of recesses; and positioning the at least one of the plurality of electronic units in the one of the second portions of the plurality of recesses when the at least one of the plurality of electronic units is disposed in a defective location.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
Electronic devices are provided. The electronic device includes a substrate, a plurality of switching elements, a first sensing signal line, and a second sensing signal line. The substrate has a peripheral area. The plurality of switching elements is disposed on the substrate and is disposed in the peripheral area. The first sensing signal line is disposed on the substrate and is electrically connected to a first number of the plurality of switching elements. The second sensing signal line is disposed on the substrate and is electrically connected to a second number of the plurality of switching elements. Wherein, the plurality of switching elements is electrically connected to a common signal line, and the first number is different from the second number.
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
20.
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
An electronic device includes an electronic unit having a first side and a second side; an encapsulation layer surrounding the electronic unit and having a plurality of openings exposing the second side of the electronic unit; a first circuit structure disposed on the first side of the electronic unit and electrically connected to the electronic unit; a second circuit structure disposed on the second side of the electronic unit; a via penetrating the encapsulation layer and electrically connecting the first circuit structure to the second circuit structure; and a heat dissipation layer disposed on the second side of the electronic unit, wherein the heat dissipation layer contacts the electronic unit through the plurality of openings.
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/58 - Dispositions électriques structurelles non prévues ailleurs pour dispositifs semi-conducteurs
An electronic device includes a first substrate, a second substrate overlapped with the first substrate and having a first side and a second side opposite to the first side, a sensor unit disposed between the first substrate and the second substrate, a first blocking layer disposed on the first side, and a second blocking layer disposed on the sensor unit. The second side is disposed between the sensor unit and the first side. The first blocking layer has a first opening, and the second blocking layer has a second opening. A width of the first opening is smaller than a width of the second opening.
A light emitting device is provided and includes a substrate, a plurality of light emitting elements, an intermediate layer, a partition wall, a light conversion element, and a layer. The light emitting elements is disposed on the substrate. The intermediate layer is disposed on the light emitting elements. The partition wall is disposed on the intermediate layer, wherein the partition wall includes a plurality of partition elements. The light conversion element is disposed between two of the partition elements, wherein the light conversion element corresponds to one of the light emitting elements. The layer is disposed between the intermediate layer and the light conversion element, wherein the layer is in contact with a sidewall of the partition wall.
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
A projection system includes a display system, a first medium and a second medium. The display system is configured to emit a light to plan to display an image at a predetermined image forming position. The display system is disposed in the first medium having a first refractive index Ni. The predetermined image forming position is located in the second medium having a second refractive index N2. The second medium has a first side and a second side, a distance FR is included between the first side and the second side, a first distance Li is included between the predetermined image forming position and the display system, a second distance L2 is included between the display system and the second medium, the light has a brightness BS before the light entering the second medium, the light has an attenuation β in the second medium, and the distance FR satisfies:
A projection system includes a display system, a first medium and a second medium. The display system is configured to emit a light to plan to display an image at a predetermined image forming position. The display system is disposed in the first medium having a first refractive index Ni. The predetermined image forming position is located in the second medium having a second refractive index N2. The second medium has a first side and a second side, a distance FR is included between the first side and the second side, a first distance Li is included between the predetermined image forming position and the display system, a second distance L2 is included between the display system and the second medium, the light has a brightness BS before the light entering the second medium, the light has an attenuation β in the second medium, and the distance FR satisfies:
(
L
1
-
L
2
)
cot
[
sin
-
1
(
N
1
N
2
×
1
2
)
]
≤
FR
≤
100
×
log
β
3
0
0
B
S
.
G02B 30/50 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p.ex. des effets stéréoscopiques l’image étant construite à partir d'éléments d'image répartis sur un volume 3D, p.ex. des voxels
An electronic apparatus has a first region and a second region adjacent to the first region. The electronic apparatus includes a first light-emitting assembly including a plurality of first light-emitting units in the first region. The electronic apparatus includes a second light-emitting assembly disposed adjacent to the first light-emitting assembly. The second light-emitting assembly includes a plurality of second light-emitting units in the second region. A third region is included in the first region, a fourth region is included in the second region, and the third region is adjacent to the fourth region. The difference in percentage between the average brightness in the third region and the average brightness in the fourth region is less than the difference in percentage between the average brightness in the first region and the average brightness in the second region.
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
G09G 3/36 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice en commandant la lumière provenant d'une source indépendante utilisant des cristaux liquides
A substrate assembly includes a substrate, a drain, a second drain, a first insulating layer, a first electrode, a second electrode, an electrode layer and a spacer. The first insulating layer disposed on the first drain and the second drain, having a first contact hole and a second contact hole. The first electrode disposed on the first insulating layer and electrically connected to the first drain via the first contact hole, the second electrode disposed on the first insulating layer and electrically connected to the second drain via the second contact hole. The spacer disposed on the first electrode and the second electrode, a first portion of the spacer is disposed in the first contact hole, a second portion of the spacer is disposed in the second contact hole, and the first portion and the second portion are continuous, in a top view, the spacer includes an arc shape.
An electronic device is provided. The electronic device includes a first layer, a second layer, a circuit layer, and a display medium layer. The second layer is disposed opposite to the first layer. The circuit layer is formed on the first layer. The display medium layer is disposed between the first layer and the second layer. The first layer has a first light transmission chromaticity coordinates (x1, y1) on the CIE 1931 xy chromaticity coordinates, the second layer has a second light transmission chromaticity coordinates (x2, y2) on the CIE 1931 xy chromaticity coordinates, and x1≥x2 or y1≥y2.
An electronic device includes a wafer, a redistribution layer and a multi-layer insulating structure. The redistribution layer is disposed on the wafer. The multi-layer insulating structure is disposed between the wafer and the redistribution layer. The multi-layer insulating structure includes a first layer and a second layer. A Young's modulus of the first layer is different from a Young's modulus of the second layer.
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
A display device is provided, which includes a first substrate, a second, a liquid-crystal layer, a first line, a second line and a patterned electrode. The patterned electrode includes a main portion with a cross shape, the patterned electrode is divided by the main portion into a first sub-portion, a second sub-portion, a third sub-portion and a fourth sub-portion. The first sub-portion includes a first edge extending along the second direction. The second sub-portion includes a second edge extending along the second direction. The third sub-portion includes a third edge extending along the second direction. The fourth sub-portion includes a fourth edge extending along the second direction. Each of the first edge, the second edge, the third edge and the fourth edge has a closed area.
An electronic device is provided. The electronic device includes a first substrate and a plurality of light-emitting elements disposed on the first substrate. The plurality of light-emitting elements include a contact pad; an intermediate substrate disposed on the contact pad; and a light-emitting unit disposed on the intermediate substrate. The electronic device further includes a second substrate and a first thin-film transistor array disposed on the second substrate for driving at least a portion of the plurality of light-emitting elements. The light-emitting unit is electrically connected to the contact pad through a via hole that penetrates the intermediate substrate.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/10 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés
H01L 25/13 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
An electronic device includes a carrier, a first electronic element, and a first connecting element. The carrier has a first bonding pad, a first conductive layer, a second conductive layer and an insulating layer with a via. The first conductive layer is disposed between the first bonding pad and the insulating layer, and electrically connected to the second conductive layer through the via. The first electronic element is disposed on the carrier and has a substrate. The first connecting element is disposed between the top surface of the first bonding pad and the first electronic element and electrically connected to the first bonding pad and the first electronic element. The substrate has a through hole which is overlapped with the first bonding pad and the first connecting element. A minimum distance between the through hole and the via is greater than zero.
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 23/498 - Connexions électriques sur des substrats isolants
An electronic device is provided. The electronic device includes an electronic component, an encapsulating layer, a circuit structure, a bonding element and a first auxiliary pad. The encapsulating layer surrounds the electronic component. The circuit structure is electrically connected to the electronic component. The circuit structure has a connection part. The bonding element overlaps with the connection part and is electrically connected to the electronic component. The first auxiliary pad is disposed in the circuit structure. In addition, the connection part is disposed between the first auxiliary pad and the bonding element, and the connection part overlaps with the first auxiliary pad. Moreover, the intrinsic stress of the first auxiliary pad is between +800 MPa and −1000 MPa.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
An electronic device includes: a backlight module; a panel disposed on the backlight module; a viewing angle control element disposed between the backlight module and the panel; and a light modulation element disposed between the panel and the viewing angle control element. The light modulation element has a plurality of prism structures, and at least one of the plurality of prism structures includes a first bottom angle and a second bottom angle. The first bottom angle is larger than the second bottom angle, and a ratio of the first bottom angle to the second bottom angle satisfies 1
An electronic device includes a backlight module. The backlight module includes a light guide plate and a light pattern adjustment component disposed on the light guide plate. The side of the light pattern adjustment component that is adjacent to the light guide plate has a plurality of prismatic structures, and the side of the light pattern adjustment component that is away from the light guide plate has a plurality of structural unit rows. Each of the structural unit rows includes a plurality of structural units, and the angle between the arrangement direction of the structural units in one of the structural unit rows and the extension direction of one of the prismatic structures is within a range of 10-80°.
A display device is provided. The display device includes a display module for displaying pictures and a viewing angle control module adjacent to the display module. The viewing angle control module includes a first substrate, a second substrate opposite to the first substrate, a viewing angle control medium disposed between the first substrate and the second substrate, and a touch layer disposed between the viewing angle control medium and the first substrate. The touch layer includes a bridge electrode and first touch electrodes disposed on the first substrate, and an insulation layer disposed between the bridge electrode and the first touch electrodes. The insulation layer has openings, and the first touch electrodes are electrically connected to the bridging electrode through the openings.
G02F 1/1333 - Dispositions relatives à la structure
G02F 1/13 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p.ex. commutation, ouverture de porte ou modulation; Optique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des cristaux liquides, p.ex. cellules d'affichage individuelles à cristaux liquides
G02F 1/1339 - Dispositions relatives à la structure Éléments d'espacement; Scellement des cellules
A display system includes a host, a storage module and a display module coupled to the host. The host includes a transmission interface. The host communicates with a database via the transmission interface. The storage module stores the ownership information of the digital data. The host accesses the digital data from the database according to the ownership information, and the display module displays the digital data. The display module includes a display panel and an optical structure layer disposed on the display panel. The glossiness of the optical structure layer is 4 GU-35 GU, and the specular component include is 3%-6%.
An electronic device includes a substrate, a first electronic unit, a second electronic unit, a first buffer layer, and a second buffer layer. The first electronic unit is disposed on the substrate. The second electronic unit is disposed on the substrate and adjacent to the first electronic unit. The first buffer layer is disposed on the first electronic unit and has a first curved bottom surface. The second buffer layer is disposed on the second electronic unit and has a second curved bottom surface. The width of the first curved bottom surface is different from the width of the second curved bottom surface.
H01L 27/15 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants semi-conducteurs avec au moins une barrière de potentiel ou une barrière de surface, spécialement adaptés pour l'émission de lumière
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 33/22 - Surfaces irrégulières ou rugueuses, p.ex. à l'interface entre les couches épitaxiales
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
H01L 33/46 - Revêtement réfléchissant, p.ex. réflecteur de Bragg en diélectriques
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H10K 50/854 - Dispositifs pour extraire la lumière des dispositifs comprenant des moyens de diffusion
H10K 50/856 - Dispositifs pour extraire la lumière des dispositifs comprenant des moyens réfléchissants
H10K 50/86 - Dispositions pour améliorer le contraste, p. ex. en empêchant la réflexion de la lumière ambiante
H10K 59/12 - Affichages à OLED à matrice active [AMOLED]
H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords
H10K 59/127 - Affichages à OLED à matrice active [AMOLED] comprenant deux substrats, p. ex. un affichage comprenant une matrice OLED et un circuit de commande de TFT sur des substrats différents
H10K 59/173 - Affichages à OLED à matrice passive comprenant des bords ou des masques d'ombre
H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]
H10K 71/00 - Fabrication ou traitement spécialement adaptés aux dispositifs organiques couverts par la présente sous-classe
An electronic device is provided. The electronic device includes a substrate and a first light-emitting element disposed on the substrate and configured to emit a first light of a first color. The first light-emitting element includes a first p-type semiconductor layer and a first ohmic contact electrode disposed between the substrate and the first p-type semiconductor layer. The electronic device also includes a second light-emitting element disposed on the substrate and configured to emit a second light of a second color different from the first color. The second light-emitting element includes a second p-type semiconductor layer and a second ohmic contact electrode disposed between the substrate and the second p-type semiconductor layer. The area of the first ohmic contact electrode and the area of the second ohmic contact electrode are different.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 33/36 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les électrodes
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
An electronic device includes a light guide plate, a back plate, a plurality of light sources, an optical film and a buffer member. The back plate accommodates the light guide plate and includes a bottom plate, a side plate, a bending portion and a first notch portion, wherein a side of the bending portion and a side of the bottom plate are respectively connected to opposite sides of the side plate, the bending portion is overlapped with the bottom plate, the first notch portion is adjacent to the bending portion, and the first notch portion is overlapped with the bottom plate. The light sources are disposed between the bottom plate and the bending portion. The optical film is disposed on the light guide plate and is separated from the bending portion. The buffer member is overlapped with the first notch portion and the light guide plate.
An electronic device includes a substrate, a first pixel, a second pixel, and a first light blocking structure. The first pixel, the second pixel, and the first light blocking structure are disposed on the substrate. The first light blocking structure includes a first unit, a second unit, and a third unit. The first unit and the second unit are separated from each other by a first pitch. The first pixel has a first exposed part between the first unit and the second unit and having a first maximum length. The second unit and the third unit are separated from each other by a second pitch. The second pixel has a second exposed part between the second unit and the third unit and having a second maximum length greater than the first maximum length. An area of the first pixel is less than that of the second pixel.
A tunable device is provided. The tunable device includes a plurality of tunable units. Each of the plurality of tunable units includes a driving circuit and a frequency tunable circuit. The frequency tunable circuit includes a tunable component. The control terminal of the tunable component is coupled to the driving circuit, and the driving circuit and the frequency tunable circuit are isolated in terms of a tuned frequency of the frequency tunable circuit.
An electronic device includes a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, a third metal layer, a third insulating layer, a fourth metal layer, a fourth insulating layer and a conductive structure. The first insulating layer is disposed on the first metal layer. The second metal layer is disposed on the first insulating layer. The second insulating layer is disposed on the second metal layer. The third metal layer is disposed on the second insulating layer. The third insulating layer is disposed on the third metal layer. The fourth metal layer is disposed on the third insulating layer. The fourth insulating layer is disposed on the fourth metal layer. The conductive structure is disposed on and electrically connected to the fourth insulating layer. A chemical resistance of the first insulating layer is greater than a chemical resistance of the fourth insulating layer.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
An electronic structure includes a substrate, a plurality of electronic units disposed on the substrate, a circuit structure electrically connected with at least one of the plurality of electronic units, and a support element disposed under the substrate. The substrate has a first flat part and a curved part connected with the first flat part. At least two adjacent ones of the plurality of electronic units on the first flat part have a first pitch. A least another two adjacent ones of the plurality of electronic units on the curved part have a second pitch different from the first pitch. In a normal direction of the first flat part, at least a portion of the circuit structure overlaps a region between the at least two adjacent ones of the plurality of electronic units on the first flat part. The circuit structure is disposed under the support element.
An electronic device includes a light scattering switching element, a light absorbing switching element and a thermal insulation layer. The light absorbing switching element is disposed opposite to the light scattering switching element. The thermal insulation layer is disposed between the light scattering switching element and the light absorbing switching element, wherein the thermal conductivity of the thermal insulation layer is less than 50×10−3 W·m−1·K−1.
An electronic device and a manufacturing method thereof are provided in the present disclosure. The electronic device includes a circuit structure, a plurality of electronic components and a structural unit. The circuit structure includes a plurality of conductive layers and at least one insulating layer. The plurality of conductive layers are electrically interconnected via a plurality of through holes in the at least one insulating layer. The plurality of electronic components are electrically connected to the circuit structure and are overlapped with the circuit structure. The structural unit is disposed adjacent to the plurality of electronic components. In a top view of the electronic device, at least a portion of the structural unit is disposed between adjacent two of the electronic components.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
An electronic device includes a substrate, a plurality of connecting pads, a plurality of conductive portions overlapped with the plurality of connecting pads, a plurality of conductive lines, a semiconductor component, and a bonding material. The semiconductor component is disposed on at least one of the plurality of connecting pads and includes an electrode. In a cross-sectional view, a first portion of the bonding material is disposed between the electrode and the at least one of the plurality of connecting pads, a second portion of the bonding material contacts a lateral surface of the electrode, and a boundary between the bonding material and the at least one of the plurality of connecting pads is irregular.
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 25/13 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
An electronic device is provided. The electronic device includes a first substrate, a second substrate, a first functional circuit, a second functional circuit, a circuit assembly, semiconductor units and a circuit substrate. The first functional circuit is disposed on the first substrate. The second functional circuit is disposed on the second substrate. The semiconductor units are disposed on the circuit assembly. The first substrate and the second substrate are disposed on the circuit substrate. The first functional circuit and the second functional circuit are different in function and are coupled to the circuit assembly.
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
G09G 3/3266 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] - Détails des circuits de commande pour les électrodes de balayage
G09G 3/3275 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] - Détails des circuits de commande pour les électrodes de données
An electronic device applied to a vehicle includes a cover and an electronic unit attached to the cover. The cover has a curved surface which has a first region with a first Gaussian curvature not equal to zero and a second region with a second Gaussian curvature, wherein the cover is a part of the vehicle, and an absolute value of the first Gaussian curvature is different from an absolute value of the second Gaussian curvature. The electronic unit includes a substrate, a first electronic element, and a second electronic element. The first electronic element is disposed between the first region of the curved surface and the substrate, the second electronic element is disposed between the second region of the curved surface and the substrate, and a projection area of the first electronic element is different from a projection area of the second electronic element.
An electronic device is provided. The electronic device includes a plurality of electronic units. Each of the plurality of electronic units includes a pixel circuit and a tunable component. The tunable component is coupled to the pixel circuit. The pixel circuit includes a storage capacitor, a first scan transistor and a second scan transistor. The first scan transistor is coupled to the storage capacitor. The second scan transistor is coupled to the storage capacitor.
H01Q 3/22 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier l'orientation suivant la variation de fréquence de l'onde rayonnée
An electronic device includes a substrate and an electronic structure. The substrate includes a first opening, and the substrate has a first side and a second side opposite to the first side. The electronic structure is disposed on the first side of the substrate. The electronic structure includes a first insulating layer and a conductive layer. In a cross-sectional view, the first opening includes a first width on the first side of the substrate, a second width on the second side of the substrate, and a third width disposed between the first width and the second width. The first width of the first opening is greater than the third width of the first opening. The second width of the first opening is greater than the third width of the first opening.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
A lighting device includes a lighting unit including a light emitting element and a light converting element. The light emitting element includes an organic light emitting material, and the light converting element includes quantum dots. The lighting unit emits an output light having a light spectrum, the light spectrum in a range from 520 nm to 780 nm has a main peak, and the light spectrum in a range from 400 nm to 470 nm has a sub peak with a maximum intensity at a first wavelength. A first sub peak integral is an integral of the light spectrum calculated from the first wavelength minus 20 nm to the first wavelength, an intensity integral of a main wave comprising the main peak in the light spectrum is calculated from 521 nm to 780 nm, and a ratio of the first sub peak integral to the intensity integral is in a range from 0.05% to 2%.
F21V 8/00 - Utilisation de guides de lumière, p.ex. dispositifs à fibres optiques, dans les dispositifs ou systèmes d'éclairage
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p.ex. des polariseurs ou des réflecteurs
H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]
The present disclosure provides an electronic device, and the electronic device includes a first substrate, a first circuit layer, a touch sensing element, a touch sensing circuit, a bio-feature sensing element, a second substrate, a second circuit layer, a bio-feature sensing circuit, a plurality of pixels and a blocking layer. The touch sensing element overlaps with the first substrate and includes a plurality of touch sensing electrodes. The touch sensing circuit is coupled to the touch sensing element through the first circuit layer. The second circuit layer is overlapped with the second substrate. The bio-feature sensing circuit is coupled to the bio-feature sensing element through the second circuit layer, wherein a distance between the second side edge of the second substrate and the bio-feature sensing circuit is less than a distance between the first side edge of the substrate and the touch sensing circuit.
An electronic includes a substrate, at least one driving unit, a first signal line and a second signal line. The substrate has a first side edge extending in a first extension direction and a second side edge extending in a second extension direction. The first side edge and the second side edge are curved in a normal direction of a projection surface of a top surface of the substrate. A curvature of the first side edge is different from a curvature of the second side edge, and the curvatures of the first side edge and the second side edge are not equal to zero. The first signal line and the second signal line are disposed on the substrate. The first signal line is electrically connected to the at least one driving unit, and a curvature of the first signal line is different from a curvature of the second signal line.
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
G09F 9/30 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels dans lesquels le ou les caractères désirés sont formés par une combinaison d'éléments individuels
A circuit substrate with multiple voltage input ports. A substrate has an active area and a peripheral area surrounding the active area. A signal transmitting structure is disposed on the active area and the peripheral area. A conductive structure is disposed on the peripheral area, and is electrically connected to the signal transmitting structure. The conductive structure includes first conductive wiring, second conductive wiring, and converging wiring. At the first end of the converging wiring, the converging wiring receives a first signal from the first conductive wiring, and receives a second signal from the second conductive wiring. The converging wiring outputs a third signal to the signal transmitting structure through its second end. The third signal is a common voltage.
Display devices are provided. The display device includes a substrate, a plurality of light-emitting elements, a back plate, and a carrier. The substrate has a first thermal expansion coefficient. The plurality of light-emitting elements is disposed on the substrate. The back plate is disposed corresponding to the substrate and has a second thermal expansion coefficient. The carrier is disposed between the substrate and the back plate and has a third thermal expansion coefficient. The absolute value of the difference between the third thermal expansion coefficient and the first thermal expansion coefficient is less than or equal to the absolute value of the difference between the third thermal expansion coefficient and the second thermal expansion coefficient.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement
A display device for controlling a privacy region is provided. The display device includes a display unit configured to display images; a touch unit electrically connected to the display unit, wherein the privacy region is determined by the touch unit; and a light control unit electrically connected to the touch unit and configured to control an emitting light angle of the privacy region.
G02F 1/13 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p.ex. commutation, ouverture de porte ou modulation; Optique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des cristaux liquides, p.ex. cellules d'affichage individuelles à cristaux liquides
An electronic device includes a light emitting structure that includes a light emitting surface. The light emitting surface includes a first region and a second region arranged along a first direction. The light emitting structure outputs a first light in the first region and outputs a second light in the second region. The first light has a first normal brightness in a first orthogonal direction perpendicular to the first direction and a first oblique brightness in a first inclined direction, and the first orthogonal direction and the first inclined direction form a first acute included angle. The second light has a second normal brightness in a second orthogonal direction and a second oblique brightness in a second inclined direction, and the second orthogonal direction and the second inclined direction form a second acute included angle. The first normal brightness and the second normal brightness are different.
G09G 3/34 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice en commandant la lumière provenant d'une source indépendante
G02F 1/1333 - Dispositions relatives à la structure
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p.ex. des polariseurs ou des réflecteurs
G02F 1/13363 - Association structurelle de cellules avec des dispositifs optiques, p.ex. des polariseurs ou des réflecteurs Éléments à biréfringence, p.ex. pour la compensation optique
G02F 1/1339 - Dispositions relatives à la structure Éléments d'espacement; Scellement des cellules
A method of manufacturing a light emitting device is provided, the method at least includes the following steps: a substrate is provided, a light emitting unit is bonded on the substrate, an insulating layer is formed on the substrate so that at least a part of the light emitting unit is enclosed by the insulating layer, and a collimator corresponding to the light emitting unit is formed on the substrate after the insulating layer is formed.
An electronic device includes a base, another base, a first circuit board, a first layer, a second circuit board and a second layer. The another base overlapped with the base. The first circuit board overlapped with the base. The first circuit board includes a first bonding region. The second circuit board overlapped with the another base. The second circuit board includes a second bonding region. The first layer is overlapped with the first bonding region. The first bonding region is disposed between the first layer and the base. The second layer is overlapped with the second bonding region. The second bonding region is disposed between the second layer and the another base. The first layer and the second layer are at least partially overlapped.
A touch display device includes a substrate, a display layer disposed on the substrate, an insulating layer disposed on the display layer, and a touch electrode layer directly contacting the insulating layer. The display layer includes a plurality of display units and a barrier portion disposed between adjacent ones of the display units. The insulating layer is disposed between the display layer and a mesh structure of the touch electrode layer. A portion of the mesh structure is overlapped with the barrier portion. The insulating layer includes a first layer, a second layer, and a third layer, and the second layer formed of organic insulating material is disposed between the first layer and the third layer which are formed of inorganic insulating materials. In the second layer, a first thickness corresponding to the display units is greater than a second thickness corresponding to the barrier portion.
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p.ex. des polariseurs ou des réflecteurs
G06F 1/16 - TRAITEMENT ÉLECTRIQUE DE DONNÉES NUMÉRIQUES - Détails non couverts par les groupes et - Détails ou dispositions de structure
G06F 3/041 - Numériseurs, p.ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
G09G 3/36 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice en commandant la lumière provenant d'une source indépendante utilisant des cristaux liquides
H10K 50/86 - Dispositions pour améliorer le contraste, p. ex. en empêchant la réflexion de la lumière ambiante
H10K 59/35 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des sous-pixels rouge-vert-bleu [RVB]
H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]
An electronic device is provided. The electronic device includes a substrate, a material layer, a first metal layer, and a second metal layer. The material layer is disposed on the substrate, wherein a material of the material layer includes polysilicon, amorphous silicon, or indium gallium zinc oxide. The first metal layer is disposed on the material layer, wherein a first edge of the first metal layer includes a first curved portion. The second metal layer is disposed on the material layer, wherein a second edge of the second metal layer includes a second curved portion, and the second edge surrounds the first edge.
An electronic device includes: a substrate including a through hole; a connecting element disposed in the through hole; a first insulating layer disposed on the substrate and including a first via; a first conductive element disposed on the first insulating layer and electrically connected to the connecting element through the first via; a second conductive element and a third conductive element disposed on the first conductive element and separated from each other by a space; a second insulating layer disposed in the space; a fourth conductive element disposed under the substrate and electrically connected to the connecting element; and a semiconductor disposed between the substrate and the first insulating layer, wherein, in a cross-sectional view of the electronic device, at least one of the second conductive element and the third conductive element is not overlapping with the connecting element.
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p.ex. fils de connexion ou bornes
H01L 23/532 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées caractérisées par les matériaux
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
62.
HEATER DEVICE WITH MEMORY UNIT AND OPERATION METHOD THEREOF
An operation method of a heater device with a memory unit, wherein the heater device includes a plurality of heater circuits, each of the plurality of heater circuits includes a first transistor and a second transistor. In a burning mode, selectively turning on at least one of the first transistors according to a first signal, so that a first current generated by voltage signals coupled to two terminals of the first transistor passes through the memory unit. In a reading mode, sequentially turning on the first transistors to determine states of the memory units. In a heating mode, selectively turning on at least one of the second transistors according to a second signal, so that a second current generated by voltage signals coupled to two terminals of the second transistor passes through a heater.
B41J 2/045 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre caractérisés par le procédé de formation du jet en produisant à la demande des gouttelettes ou des particules séparées les unes des autres par pression, p.ex. à l'aide de transducteurs électromécaniques
An electronic device is provided. The electronic device includes a substrate and a plurality of units disposed on the substrate. A portion of the plurality of units includes a conductive layer and an insulating layer. The conductive layer has a first opening penetrating through the conductive layer. The insulating layer is disposed on the conductive layer and includes a second opening penetrating through the insulating layer. The first opening of the conductive layer and the second opening of the insulating layer are at least partially overlapped. Moreover, a width of the first opening of the conductive layer is greater than a width of the second opening of the insulating layer.
H01Q 1/36 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie
H01Q 3/44 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier les caractéristiques électriques ou magnétiques des dispositifs de réflexion, de réfraction ou de diffraction associés à l'élément rayonnant
An electronic device includes a substrate, visible light units, infrared light units, and a light sensor. The substrate includes a first area and a second area. The visible light units are disposed on the first substrate. The infrared light units are disposed on the first substrate and adjacent to the visible light units. A part of the infrared light units is disposed in the first area, and another part of the infrared light units is disposed in the second area. The light sensor is disposed between the first area and the second area and detects infrared light. The first area has a first infrared light unit density. The second area has a second infrared light unit density. The first infrared light unit density is different to the second infrared light unit density.
G09G 3/34 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice en commandant la lumière provenant d'une source indépendante
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
65.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
An electronic device includes a chip, a protection, a molding layer and a redistribution structure layer. The chip has an active surface and a first side surface connected to the active surface. The protection layer is disposed on the active surface of the chip and has a second side surface. The molding layer surrounds the chip and the protection layer. The redistribution structure layer is disposed on the molding layer, on the protection layer and electrically connected to the chip. The roughness of the first side surface is different from the roughness of the second side surface.
An electronic device includes an electronic component including a chip and a protective layer disposed on the active surface of the chip; an encapsulation layer surrounding the electronic component; and a circuit structure contacting the first surface of the encapsulation layer and electrically connecting the electronic component. The protective layer has a second surface away from the active surface, and a first step difference between the first surface and the second surface is between 1 and 10 μm.
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
67.
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
An electronic device including a substrate and a plurality of control units is provided. The plurality of control units are disposed on the substrate, wherein each of the plurality of control units includes a transistor, an insulating layer, a first conductive layer, and a second conductive layer. The transistor includes a first electrode. The insulating layer is disposed on the transistor and has a through hole exposing the first electrode. The first conductive layer is disposed on the transistor, wherein a portion of the first conductive layer is overlapped with the insulating layer, and another portion of the first conductive layer is electrically connected to the first electrode via the through hole. The second conductive layer is at least partially overlapped with the first conductive layer and in direct contact with the first conductive layer. The electronic device provided by the disclosure has improved transmittance and yield.
Disclosed is an electronic device including a driving unit, a plurality of sub-pixel circuits and a plurality of control signal lines. Each of the plurality of sub-pixel circuits includes a first switching element and at least one light emitting element, and the sub-pixel circuits are electrically connected to the driving unit in parallel. The control signal lines are electrically connected to the sub-pixel circuits respectively.
G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent
A display device is provide. The display device is within a transportation device having a first seating area, including a display unit, a mechanical platform, and a mechanical shaft assembly. The mechanical platform is configured to correspond to the first seating area. The mechanical shaft assembly is disposed on the mechanical platform and including a first shaft portion, a second shaft portion, and a third shaft portion. The first shaft portion is connected to the display unit and driving the display unit to move along a horizontal direction. The second shaft portion is connected to an upper end of the display unit and driving the display unit to rotate around a second axis. The third shaft portion is connected to the second shaft portion and driving the display unit to rotate around a third axis.
B60R 11/02 - Autres aménagements pour tenir ou monter des objets pour postes radio, de télévision, téléphones, ou objets similaires; Disposition de leur commande
B60R 11/00 - Autres aménagements pour tenir ou monter des objets
An electronic device includes a back plate, a filling member, an adhesive layer and a panel. The back plate includes a bottom surface, at least two side walls, at least two extension portions and at least one corner. The filling member is disposed at the corner of the back plate. The adhesive layer is disposed on the filling member. The panel is disposed on the adhesive layer. There is a first distance between the bottom surface and one of the at least two extension portions, and a maximum distance between the bottom surface and the filling member is a second distance, where the second distance is greater than the first distance.
F21V 8/00 - Utilisation de guides de lumière, p.ex. dispositifs à fibres optiques, dans les dispositifs ou systèmes d'éclairage
H10K 59/80 - Dispositifs intégrés, ou ensembles de plusieurs dispositifs, comprenant au moins un élément organique émetteur de lumière couvert par le groupe - Détails de structure
71.
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
An electronic device is provided. The electronic device includes a chip, a protective layer, an encapsulation layer, and a circuit structure. The chip includes a base layer and at least one pad. The at least one pad is disposed on a first side of the base layer. The protective layer is disposed on the first side and has at least one opening. The at least one opening exposes a portion of the at least one pad. The encapsulation layer surrounds the chip and the protective layer. The circuit structure is disposed on the encapsulation layer and is electrically connected to the chip. The at least one pad has a concave surface. A portion of the circuit structure contacts the concave surface. A manufacturing method of the electronic device is also provided.
An electronic device includes a pixel circuit, a data line and two control signal lines. The pixel circuit includes a first sub-pixel circuit and a second sub-pixel circuit, in which a light color of the first sub-pixel circuit is different from a light color of the second sub-pixel circuit. The data line is electrically connected with the first sub-pixel circuit and the second sub-pixel circuit. The two control signal lines are respectively a first control signal line and a second control signal line. The first control signal line is electrically connected with the first sub-pixel circuit for controlling a light-emitting time of the first sub-pixel circuit, and the second control signal line is electrically connected with the second sub-pixel circuit for controlling a light-emitting time of the second sub-pixel circuit.
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent
An electronic device is provided. The electronic device includes a first substrate, a second substrate, a first transistor, a second transistor, a passivation layer, a conductive through hole, an electrode, and a shielding layer. The second substrate overlaps the first substrate. The first transistor is disposed on the first substrate. The second transistor is disposed on the second substrate. The passivation layer is disposed between the first substrate and the second substrate. The conductive through hole penetrates the passivation layer. The electrode is disposed between the first substrate and the second substrate and electrically connected to the first transistor through the conductive through hole. The shielding layer is disposed between the first transistor and the second transistor and overlaps the conductive through hole.
A phase-array antenna is provided. The phase-array antenna includes a plurality of antenna units arranged in an array. One of the plurality antenna units includes a substrate, a feeding line, a conductor and an active element. The feeding line is disposed on the substrate and has a signal transmitting end. The conductor is disposed on the substrate and has a signal receiving end. The active element is disposed on the substrate and includes an active layer. The signal transmitting end of the feeding line is apart from the signal receiving end of the conductor by 0.05 mm to 5 mm, and the active layer is apart from the feeding line by 1 mm to 200 mm.
H01Q 21/06 - Réseaux d'unités d'antennes, de même polarisation, excitées individuellement et espacées entre elles
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
H01Q 1/36 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie
H01Q 7/00 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre
The present disclosure provides an electronic device. The electronic device includes a substrate, a first circuitry, a first functional unit, a layer, an organic insulating layer, a second circuitry, and a second functional unit. The organic insulating layer is disposed on the layer. The first functional unit is driven by the first circuitry. A thickness of the organic insulating layer overlapped with an opening of the layer is greater than that of the organic insulating layer not overlapped with the opening. The second functional unit is driven by the second circuitry. A function of the first functional unit is different from a function of the second functional unit. A first portion of the second circuitry is overlapped with the first functional unit and a second portion of the second circuitry is overlapped with the second functional unit.
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
G09G 3/3208 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED]
This disclosure provides an electronic device including a substrate, a main electronic unit, an auxiliary electronic unit, a main working circuit and an auxiliary working circuit. The substrate has a first portion and a second portion bent with respect to the first portion, and the first portion includes a normal active region and a functional active region. The main electronic unit is disposed on the normal active region. The auxiliary electronic unit is disposed on the functional active region. The main working circuit is disposed on the first portion, and the main working circuit outputs a first driving signal to the main electronic unit according to a first data signal. The auxiliary working circuit is disposed on the second portion, and the auxiliary working circuit outputs a second driving signal to the auxiliary electronic unit according to a second data signal.
The disclosure provides an electronic device and a tiled electronic device. The electronic device includes a hybrid substrate. The hybrid substrate includes a first circuit substrate, multiple second circuit substrates, an interlayer, and multiple electrical connection units. The first circuit substrate has a first surface and a second surface. The multiple second circuit substrates are disposed on the first surface. The interlayer is disposed between the multiple second circuit substrates and the first circuit substrate. The multiple electrical connection units penetrate the multiple second circuit substrates respectively. At least one electrical connection unit among the plurality of electrical connection units includes a through hole and a conductive material disposed in the through hole. At least one electrical connection unit is electrically connected to the first circuit substrate. The electronic device and the tiled electronic device according to the disclosure can improve process yield or save costs.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
A sensing device includes: a substrate, a circuit layer and a plurality of sensing units. The circuit layer is disposed on the substrate, and includes a plurality of driving circuits. The sensing unit is disposed on the circuit layer, and includes a supporting part and a sensing part. The supporting part is electrically connected to one of the driving circuits. The sensing part is electrically connected to the supporting part, and is separated from the circuit layer by a cavity through the supporting part. In a normal direction of the substrate, at least part of the supporting part overlaps with the sensing part.
A display device includes a display panel in a bent form. The display panel includes two first edges opposite to each other and surrounding a surrounding axis, two second edges opposite to each other, a display surface, and a back surface opposite to the display surface, wherein the two first edges and the two second edges surround the display surface and the back surface. A first flexible circuit board includes a circuit component disposed thereon for controlling the display panel to display image and is electrically connected to the display panel and contacts the back surface of the display panel through an adhesive layer.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs sous-groupes différents du même groupe principal des groupes , ou dans une seule sous-classe de ,
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
An electronic device including a first substrate, a first semiconductor, a second semiconductor and a shielding element is disclosed. The first substrate has a peripheral region. The first semiconductor is disposed on the first substrate and in the peripheral region. The second semiconductor is disposed on the first substrate and in the peripheral region, and the first semiconductor is electrically connected to the second semiconductor. The shielding element is disposed on the first substrate and in the peripheral region, and the shielding element overlaps the first semiconductor and the second semiconductor.
G02F 1/1362 - Cellules à adressage par une matrice active
G02F 1/1333 - Dispositions relatives à la structure
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p.ex. des polariseurs ou des réflecteurs
G02F 1/1368 - Cellules à adressage par une matrice active dans lesquelles l'élément de commutation est un dispositif à trois électrodes
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
H01L 29/66 - Types de dispositifs semi-conducteurs
H10K 50/80 - Dispositifs organiques émetteurs de lumière - Détails de structure
H10K 50/86 - Dispositions pour améliorer le contraste, p. ex. en empêchant la réflexion de la lumière ambiante
H10K 59/12 - Affichages à OLED à matrice active [AMOLED]
H10K 59/122 - Structures ou couches définissant le pixel, p. ex. bords
H10K 59/126 - Blindage, p. ex. moyens de blocage de la lumière sur les TFT
H10K 59/38 - Dispositifs spécialement adaptés à l'émission de lumière multicolore comprenant des filtres de couleur ou des supports changeant de couleur [CCM]
A display device, including a display panel, and an optical structure, is provided. The optical structure overlaps with the display panel. The optical structure includes at least two adjacent light shielding patterns, and the two adjacent light shielding patterns extend in a direction in a top view. In a cross section view, a pitch of the two adjacent light shielding patterns is less than a thickness of one of the two adjacent light shielding patterns.
G02B 30/29 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p.ex. des effets stéréoscopiques en fournissant des première et seconde images de parallaxe à chacun des yeux gauche et droit d’un observateur du type autostéréoscopique comprenant des réseaux lenticulaires caractérisés par la géométrie du réseau lenticulaire, p.ex. réseaux en biais, réseaux irréguliers ou réseaux de formes ou de tailles variables
G02B 30/28 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p.ex. des effets stéréoscopiques en fournissant des première et seconde images de parallaxe à chacun des yeux gauche et droit d’un observateur du type autostéréoscopique comprenant des réseaux lenticulaires comprenant des réseaux lenticulaires actifs
G02B 30/31 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p.ex. des effets stéréoscopiques en fournissant des première et seconde images de parallaxe à chacun des yeux gauche et droit d’un observateur du type autostéréoscopique comprenant des barrières de parallaxe comprenant des barrières actives de parallaxe
G02B 30/32 - Systèmes ou appareils optiques pour produire des effets tridimensionnels [3D], p.ex. des effets stéréoscopiques en fournissant des première et seconde images de parallaxe à chacun des yeux gauche et droit d’un observateur du type autostéréoscopique comprenant des barrières de parallaxe caractérisés par la géométrie de barrières de parallaxe, p.ex. barrières échelonnées, réseaux de parallaxes en biais ou réseaux de parallaxes de formes ou de tailles variables
An electronic device including a flexible substrate, a plurality of electronic elements, a plurality of wires and a plurality of electrical connection holes is disclosed. The electronic elements are disposed on the flexible substrate. Three adjacent ones of the electronic elements are arranged as a group to form an electronic unit, such that the plurality of electronic elements form a plurality of electronic units, and four adjacent ones of the electronic units form a unit region that is quadrilateral. The wires are disposed on the flexible substrate. The electrical connection holes are disposed on the flexible substrate. A density of the electrical connection holes in a peripheral portion of the unit region is greater than a density of the electrical connection holes in a central portion of the unit region.
A packaged chip and a backlight module including the same are provided. The packaged chip includes a base material, a chip, and a packaging layer. The base material includes a first electrode. The chip is disposed on the base material and is electrically connected with the first electrode. The packaging layer is disposed on the base material and surrounds the chip. The base material includes a surface. A first distance is between a top surface of the chip and the surface of the base material. The surface of the base material includes a coupling portion. In a cross-sectional direction, a height or a depth of the coupling portion is less than the first distance.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01L 25/13 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H10K 59/95 - Ensembles de plusieurs dispositifs comprenant au moins un élément organique émetteur de lumière comprenant uniquement des éléments organiques émetteurs de lumière
An electronic device includes a scan line disposed on a first substrate and extending along a first direction; a conductive element disposed on the first substrate and a portion of the conductive element extending along a second direction different from the first direction; and an active layer disposed between the conductive element and the first substrate. In a top view, the active layer includes a first connecting region electrically connected to the conductive element through a first via hole; a first overlapping region overlapping a portion of the scan line; first region disposed between the first connecting region and the first overlapping region, wherein the first region extends along the second direction and overlaps the portion of the conductive element; and a turning region between the first overlapping region and the first region.
G02F 1/1362 - Cellules à adressage par une matrice active
G02F 1/1368 - Cellules à adressage par une matrice active dans lesquelles l'élément de commutation est un dispositif à trois électrodes
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
An electronic device and an operating method thereof are provided. The electronic device includes a driving transistor and a preset transistor. The operating method includes the following steps: turning on the preset transistor, and providing a first voltage to a control terminal of the driving transistor; turning off the preset transistor, and providing a second voltage to the driving transistor, wherein the first voltage is greater than the second voltage; executing a sensing process; and executing a scan process to provide an output signal.
An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes forming a circuit substrate. Forming the circuit substrate includes providing a base material, wherein the base material has a first side and a second side opposite to each other. A contact pad is formed on the first side. An electronic element is provided. A conductive bump is formed on the contact pad, wherein the electronic element is bonded onto the circuit substrate via the conductive bump. A laser is applied to an area of the second side of the base material corresponding to the contact pad.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/14 - Supports, p.ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 23/552 - Protection contre les radiations, p.ex. la lumière
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
A display driving method and a display device are provided. The display driving method includes following steps: obtaining frame data of a current frame; driving a first pixel according to a first grayscale value corresponding to the first pixel in the frame data; determining whether a second grayscale value corresponding to a second pixel in the frame data is significantly different from the first grayscale value corresponding to the first pixel; obtaining a new second grayscale value when the second grayscale value is significantly different from the first grayscale value; and driving the second pixel according to the new second grayscale value. The display driving method and display device of the disclosure may achieve good display effects.
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
An electronic circuit is provided. The electronic circuit includes an electronic element, a driving transistor, a first emitting transistor, and at least one capacitor. A first terminal of the driving transistor is coupled to a power voltage. The power voltage is used to drive the electronic element via the driving transistor. A first terminal of the first emitting transistor is coupled to a second terminal of the driving transistor. A second terminal of the first emitting transistor is coupled to the electronic element. A first terminal of the at least one capacitor is coupled to a gate terminal of the driving transistor. When the electronic element is driven, a second terminal of the at least one capacitor receives the power voltage.
H03K 3/011 - Modifications du générateur pour compenser les variations de valeurs physiques, p.ex. tension, température
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
H01Q 23/00 - Antennes comportant des circuits ou des éléments de circuit actifs qui leur sont intégrés ou liés
89.
LIGHT-EMITTING DEVICE HAVING A SUBSTRATE WITH HIGH ACCURACY
A light-emitting device is provided, which includes a flexible substrate having a via, a top surface, and a bottom surface, a light-emitting unit having a first electrode and a second electrode, and disposed on the top surface, a thin film transistor electrically connected to the light-emitting unit, a circuit disposed on the bottom surface, a conductive layer disposed in the via, a barrier layer covering the conductive layer, another conductive layer electrically connected to and in contact with the conductive layer and disposed outside the via, and another barrier layer in contact with a top surface of the another conductive layer. The conductive layer and the another conductive layer are disposed on opposite sides of the flexible substrate. The circuit is electrically connected to the first electrode through the via and electrically connected to the first electrode through the thin film transistor.
H01L 33/20 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les corps semi-conducteurs ayant une forme particulière, p.ex. substrat incurvé ou tronqué
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
An antenna device with an active area and a buffer element connected with the active area is provided, which includes a first substrate, and a second substrate facing and spaced with the first substrate in a distance. A plurality of electrodes are disposed on the first substrate and in the active area. A modulation material is filled in the active area. A conductive layer is disposed on the second substrate and in the active area and the buffer element, and comprises a plurality of slits in the active area. A plurality of spacers are disposed between the first substrate and the second substrate, wherein at least one of the plurality of spacers is located in the buffer element, and wherein the buffer element is configured to provide a space for adjusting the amount of the modulation material in the active area.
H01Q 1/36 - Forme structurale pour éléments rayonnants, p.ex. cône, spirale, parapluie
G02F 1/1339 - Dispositions relatives à la structure Éléments d'espacement; Scellement des cellules
H01Q 3/44 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier les caractéristiques électriques ou magnétiques des dispositifs de réflexion, de réfraction ou de diffraction associés à l'élément rayonnant
An electronic device includes a substrate, a first conductive structure, a second conductive structure, a first wire, and a second wire. The substrate includes a peripheral region. The first conductive structure is in the peripheral region and includes a first conductive layer and a second conductive layer. The first and the second conductive layer are arranged along a first direction. The second conductive structure is in the peripheral region and includes a third conductive layer. The first and the second conductive structure are arranged along a second direction, which is perpendicular to the first direction. The first wire is in the peripheral region and is electrically connected between the first and the third conductive layer. The second wire is in the peripheral region and is electrically connected to the second conductive layer. The first wire is adjacent to the second wire along the first direction.
A display device including a green sub-pixel, a red sub-pixel, and a blue sub-pixel is provided. The green sub-pixel includes a first driving transistor having a first channel width to length ratio being W1/L1. The red sub-pixel includes a second driving transistor having a second channel width to length ratio being W2/L2. The blue sub-pixel includes a third driving transistor having a third channel width to length ratio being W3/L3. W1/L1>W3/L3, and W2/L2>W3/L3.
H01L 27/12 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant autre qu'un corps semi-conducteur, p.ex. un corps isolant
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
93.
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
An electronic device and a manufacturing thereof are disclosed. The electronic device includes a first conductive layer, a first insulating layer, a second insulating layer, a second conductive layer, a plurality of semiconductor elements and a covering layer. The first insulating layer is disposed on the first conductive layer. In a cross-sectional view of the electronic device, the first insulating layer has two side-surfaces which are opposite to each other. The second insulating layer is disposed on the first insulating layer and in contact with the two side-surfaces of the first insulating layer. The second conductive layer is disposed on the second insulating layer and electrically connected to the first conductive layer. The plurality of semiconductor elements are disposed on the second conductive layer and electrically connected to the second conductive layer. The covering layer is disposed on the plurality of semiconductor elements.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p.ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes
H01L 21/56 - Capsulations, p.ex. couches de capsulation, revêtements
H01L 23/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Capsulations, p.ex. couches de capsulation, revêtements caractérisées par leur disposition
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des groupes principaux , ou dans une seule sous-classe de , , p.ex. circuit hybrides
H01L 33/54 - Encapsulations ayant une forme particulière
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
A pixel circuit includes a switching transistor, a first driving transistor, a second driving transistor, a first emission control transistor, a second emission control transistor, and a light emitting diode. The first driving transistor is coupled the switching transistor. The second driving transistor is coupled to the switching transistor. The first emission control transistor is coupled to the first driving transistor. The second emission control transistor is coupled to the second driving transistor. The light emitting diode is coupled to the first emission control transistor and the second emission control transistor.
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
An inspection method for electronic devices includes the steps of: providing an object under test; inspecting the object under test through an inspection system having an optical apparatus, including the steps of: using the optical apparatus to provide a first inspection light to inspect a first position of the object under test, and then receiving a first reflection light for being recorded in a controller; moving the optical apparatus; and using the optical apparatus to provide a second inspection light to inspect the first position of the object under test, and then receiving a second reflection light for being recorded in the controller; and determining whether there is an abnormality through the first reflection light and the second reflection light.
A display device includes a display panel, an optical structure layer, a driving unit, a timing control unit and a light sensing unit. The optical structure layer is disposed on the display panel. The driving unit is electrically connected to the display panel. The timing control unit is electrically connected to the driving unit. The light sensing unit is electrically connected to the timing control unit to provide a light sensing result to the timing control unit. The timing control unit is used to receive a first signal and provides a second signal and a third signal to the driving unit according to the light sensing result, and the driving unit drives the display panel according to the second signal and the third signal.
G09G 3/20 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice
G09G 3/32 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED]
G09G 3/3208 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED]
G09G 3/34 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice en commandant la lumière provenant d'une source indépendante
G09G 3/36 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice en commandant la lumière provenant d'une source indépendante utilisant des cristaux liquides
An electronic device is provided by the present disclosure. The electronic device includes a substrate, a plurality of light emitting elements disposed on the substrate, a cover layer disposed on the substrate and covering the plurality of light emitting elements, and a dam wall unit disposed between adjacent two of the plurality of light emitting elements. The dam wall unit includes a bottom surface adjacent to a top surface of the substrate, and a spacing is included between the bottom surface of the dam wall unit and the top surface of the substrate.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans le même sous-groupe des groupes , ou dans une seule sous-classe de , , p.ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes following steps: providing a substrate; bonding an electronic component to the substrate, wherein the electronic component is mainly driven by a reverse bias in an operating mode, and the electronic component is electrically connected in series with another electronic component; applying a forward bias to the electronic component, and determining whether the electronic component is normal or failed based on a light emitted by the another electronic component or thermal characteristics of the electronic component; and transporting the substrate configured with the electronic component determined to be normal to a next production site or repairing the electronic component determined to be failed.
An electronic device including a plurality of sensing pixel circuits is provided. At least one of the sensing pixel circuits includes a photoelectric sensing element, a first transistor device, a second transistor device, a third transistor device and a fourth transistor device. The fourth transistor device includes a first end, a second end and a control end. The first end of the fourth transistor device is coupled to a first end of the first transistor device. The second end of the fourth transistor device is coupled to a bias voltage. The control end of the fourth transistor device is coupled to a scan line. The fourth transistor device serves as a current sink in a pre-trap period.
G09G 3/3233 - Dispositions ou circuits de commande présentant un intérêt uniquement pour l'affichage utilisant des moyens de visualisation autres que les tubes à rayons cathodiques pour la présentation d'un ensemble de plusieurs caractères, p.ex. d'une page, en composant l'ensemble par combinaison d'éléments individuels disposés en matrice utilisant des sources lumineuses commandées utilisant des panneaux électroluminescents semi-conducteurs, p.ex. utilisant des diodes électroluminescentes [LED] organiques, p.ex. utilisant des diodes électroluminescentes organiques [OLED] utilisant une matrice active avec un circuit de pixel pour commander le courant à travers l'élément électroluminescent
G06K 7/10 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire
An electronic device is provided, which includes: a first substrate; a second substrate; a first polarizer, wherein the first substrate is disposed between the second substrate and the first polarizer; and a conductive adhesive disposed on the second substrate, wherein from a top view of the electronic device, a first portion of the conductive adhesive contacts the second substrate and extends along a first extending direction, a second portion of the conductive adhesive contacts the first substrate and extends along a second extending direction, the first extending direction and the second extending direction are different, a length of the second portion of the conductive adhesive along the second extending direction is greater than a length of the first portion of the conductive adhesive along the first extending direction, the first polarizer comprises an arc edge, and the arc edge is adjacent to the conductive adhesive.
