A laminate includes a first outer copper layer; a second outer copper layer; a multilayer construct having at least three polymer films disposed between the first and second outer copper layers. Adjacent ones of the at least three polymer layers have dissimilar dielectric constant, Dk, values, dissimilar thicknesses, or preferably both dissimilar Dk values and dissimilar thicknesses. Adjacent ones of the first and second outer copper layers, and the at least three polymer layers, are bonded to each other. Each polymer film of the at least three polymer films has a voltage breakdown strength equal to or greater than 200 kV/mm, or equal to or greater than 5 kV at a film thickness of 25 micrometers.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 37/04 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
The invention relates to a method for dividing a metal-ceramic substrate (10), in particular a metal-ceramic substrate (10) provided in the form of a large metal-ceramic card, wherein the metal-ceramic substrate (10) is preferably divided into individual metal-ceramic substrates (1), comprising: - providing a metal-ceramic substrate (10), wherein the metal-ceramic substrate (10) comprises at least one metal layer (21) and a ceramic element (20), - forming a predetermined break line (7), in particular by removing ceramic material from the ceramic element (20), - locally heating the ceramic element (20) in the region of the predetermined break line (7), in particular by means of laser light (15), and - cooling the heated region of the predetermined break line (7) in order to separate the ceramic element (20) along the predetermined break line (7).
An electromagnetic, EM, device (1000) configured to be operational at a defined center frequency, f, having a free space wavelength, λ, is disclosed. The EM device includes: an integrated circuit, IC, chip (2000); and, a DRA subarray (3000) integrally arranged with and disposed on the IC chip (2000). The DRA subarray (3000) includes a plurality of DRAs (3100), that can resonate at the same frequency, f, defining a unit cell (3200) having an overall footprint (3300) of equal to or less than λ/2 in both x and y directions of an orthogonal x-y-z coordinate system, as observed in a plan view of the EM device (1000), where the z-direction is a direction of vertical extension of each DRA (3100′) of the plurality of DRAs (3100).
Printed circuit board (100) for electrical components (5) and/or conductor paths (4), comprising:
a base body (2) which extends along a main extension plane (HSE), and
an insert (1) which is integrated into the base body (2) in the assembled state,
Printed circuit board (100) for electrical components (5) and/or conductor paths (4), comprising:
a base body (2) which extends along a main extension plane (HSE), and
an insert (1) which is integrated into the base body (2) in the assembled state,
wherein the insert (1) is a metal-ceramic substrate (10), the metal-ceramic substrate (1) being covered, in particular surrounded, at least partially by an insulating element (8) on a side surface (SF) facing the base body (2) in the assembled state.
An electromagnetic, EM, device (1000) configured to be operational at a defined center frequency, f, having a free space wavelength, X, is disclosed. The EM device includes: an integrated circuit, IC, chip (2000); and, a DRA subarray (3000) integrally arranged with and disposed on the IC chip (2000). The DRA subarray (3000) includes a plurality of DRAs (3100), that can resonate at the same frequency, f, defining a unit cell (3200) having an overall footprint (3300) of equal to or less than X /2 in both x and y directions of an orthogonal x-y-z coordinate system, as observed in a pian view of the EM device (1000), where the z-direction is a direction of vertical extension of each DRA (3100') of the plurality of DRAs (3100).
An electromagnetic, EM, device (1000) configured to be operational at a defined center frequency, f, having a free space wavelength, X, is disclosed. The EM device (1000) includes: a plurality of dielectric resonator antennas, DRAs, that can resonate at the same frequency, f, (3100) forming a unit cell (3200) having an overall footprint of equal to or less than X /2 in both x and y directions of an orthogonal x-y-z coordinate system, as observed in a plan view of the EM device (1000), where the z-direction is a direction of vertical extension of each DR A (3100') of the plurality of DRAs (3100), the unit cell (3200) defining a DRA subarray (3000).
An electromagnetic, EM, device (1000) configured to be operational at a defined center frequency, f, having a free space wavelength, λ, is disclosed. The EM device (1000) includes: a plurality of dielectric resonator antennas, DRAs, that can resonate at the same frequency, f, (3100) forming a unit cell (3200) having an overall footprint of equal to or less than λ/2 in both x and y directions of an orthogonal x-y-z coordinate system, as observed in a plan view of the EM device (1000), where the z-direction is a direction of vertical extension of each DRA (3100′) of the plurality of DRAs (3100), the unit cell (3200) defining a DRA subarray (3000).
A metal-ceramic substrate (1) as a carrier for electrical components, in particular in the form of a printed circuit board, comprising
a ceramic element (20) and
at least one metal layer (10, 20), wherein the at least one metal layer (10) and the ceramic element (30) extend along a main extension plane (HSE) and are arranged on top of one another along a stacking direction(S) running perpendicular to the main extension plane (HSE),
wherein a bonding layer (12) is formed in the manufactured metal-ceramic substrate (1) between the at least one metal layer (10, 20) and the ceramic element (30), and
wherein a bonding agent layer of the bonding layer (12) has a sheet resistance which is greater than 5 ohm/sq, more preferably greater than 10 ohm/sq and most preferably greater than 20 ohm/sq, wherein an interconnection (15) is formed in the ceramic element (30).
A curable composition includes an alkenyl-containing component including an alkenyl-diterminated polyorganosiloxane; a hydride-containing component including a hydride-substituted polyorganosiloxane; and optionally, a polyhedral oligomeric silsesquioxane. At least a portion of the alkenyl-diterminated polyorganosiloxane, the hydride-substituted polyorganosiloxane, the polyhedral oligomeric silsesquioxane, or a combination thereof include phenyl pendant groups, and the curable composition has a particular phenyl content. Cured compositions, including compressible foams, made from the curable composition and methods of making the cured compositions are also disclosed.
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 50/24 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries from their environment, e.g. from corrosion
15.
PLATED THROUGH-HOLE STRUCTURES AND METHOD FOR THE MANUFACTURE THEREOF
A method for forming a plated through-hole structure includes filling a first through- hole in a substrate with a composition having a coefficient of thermal expansion of less than 50 ppm/°C. The composition is disposed on the interior surface of the first through-hole from the first opening to the second opening. The method further includes forming a second through-hole in the first through-hole filled with the composition. The second through-hole has a diameter less than a diameter of the first through-hole. The method further includes plating the interior surface of the second through-hole to provide the plated through-hole structure. The method can provide plated through-hole structures exhibiting good adhesion to metal and providing a reliable electrical connection.
A method for forming a plated through-hole structure includes filling a first through-hole in a substrate with a composition having a coefficient of thermal expansion of less than 50 ppm/° C. The composition is disposed on the interior surface of the first through-hole from the first opening to the second opening. The method further includes forming a second through-hole in the first through-hole filled with the composition. The second through-hole has a diameter less than a diameter of the first through-hole. The method further includes plating the interior surface of the second through-hole to provide the plated through-hole structure. The method can provide plated through-hole structures exhibiting good adhesion to metal and providing a reliable electrical connection.
The invention relates to a method for producing a metal-ceramic substrate (1), comprising: - providing at least one metal layer (10) - providing a ceramic element (30), and - joining the at least one metal layer (10) to a joining surface on an outer face of the ceramic element (30), wherein the at least one metal layer (10) and the ceramic element (30) extend along a main plane of extent (HSE) and are arranged one above the other in a stacking direction (S) running perpendicular to the main plane of extent (HSE), wherein the joining surface has a roughness that is greater than 0.5 µm, preferably greater than 1.0 µm, and particularly preferably greater than 1.5 µm.
09 - Scientific and electric apparatus and instruments
41 - Education, entertainment, sporting and cultural services
Goods & Services
Downloadable webinars and videos in the fields of advanced material solutions, foam materials, materials selection, product design using foam materials, and product testing Non-downloadable webinars and videos in the fields of advanced material solutions, foam materials, materials selection, product design using foam materials, and product testing; Educational services, namely, webinars and videos in the fields of advanced material solutions, foam materials, materials selection, product design using foam materials, and product testing
09 - Scientific and electric apparatus and instruments
41 - Education, entertainment, sporting and cultural services
Goods & Services
Downloadable webinars and videos in the fields of advanced material solutions, sealing and gasketing enclosures Non-downloadable webinars and videos in the fields of advanced material solutions, sealing and gasketing enclosures; educational services, namely, webinars and videos in the fields of advanced material solutions, sealing and gasketing enclosures
20.
PHOTOCURABLE COMPOSITIONS FOR STEREOLITHOGRAPHY, METHOD OF FORMING THE COMPOSITIONS, STEREOLITHOGRAPHY METHODS USING THE COMPOSITIONS, POLYMER COMPONENTS FORMED BY THE STEREOLITHOGRAPHY METHODS, AND A DEVICE INCLUDING THE POLYMER COMPONENTS
A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.
A waveguide antenna system, includes: an electromagnetic, EM, transition portion having a transition region having a signal feed interface and an open waveguide section, the EM transition portion configured to couple EM energy from the signal feed interface to a guided waveguide mode of EM energy to the open waveguide section via the transition region; and a leaky waveguide antenna portion configured and disposed to radiate electromagnetic energy received from the open waveguide section; wherein the EM transition portion is electromagnetically coupled to the leaky waveguide antenna portion, the EM transition portion being configured to support a transfer of electromagnetic energy from a signal feed structure to the leaky waveguide antenna portion.
Carrier substrate (1) for electrical components (4), comprising:
a heat sink (20), and
a ceramic element (71), wherein the ceramic element (71) is bonded to the heat sink (20) at least in sections,
wherein a bonding layer free of solder material is formed in the manufactured carrier substrate (1) between the heat sink (20) and the ceramic element (71), and
wherein a adhesion agent layer of the bonding layer has a sheet resistance which is greater than 5 ohm/sq, more preferably greater than 10 ohm/sq and most preferably greater than 20 ohm/sq.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
A metal-ceramic substrate (1) provided as a printed circuit board for attaching electrical components, comprising
a component metallization (10) and a backside metallization (20), and
a ceramic element (30) arranged along a stacking direction (S) between the component metallization (10) and the backside metallization (20),
wherein the component metallization (10) comprises a first metal section (11) and a second metal section (12), the first metal section (11) and the second metal section (12) being separated from each other by an isolation section (15), and
wherein the backside metallization (20) has a material weakening (25), in particular a material recess, which is arranged to be congruent with the isolation section (15) when viewed in the stacking direction (S).
H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
24.
METHOD FOR PRODUCING AND/OR HANDLING A METAL-CERAMIC SUBSTRATE, A METAL-CERAMIC SUBSTRATE, A SYSTEM FOR PRODUCING METAL-CERAMIC SUBSTRATES AND DATABASE FOR METAL-CERAMIC SUBSTRATES
The invention relates to a method for producing and/or handling metal-ceramic substrates (1, 10), comprising: - providing a metal layer (12) and a ceramic layer (11) - connecting the metal layer (12) to the ceramic layer (11) to produce a metal-ceramic substrate (1, 10), - determining a surface quality in a partial section, preferably in a defined partial section, of a surface of the metal layer (12), the ceramic layer (11) and/or the metal-ceramic substrate (1, 10), and - using the determined surface quality as an identifier (21, 22, 23).
The invention relates to a heat sink element (1) for an electric power module (10), comprising - a main body having a first end face (S) which, in the installed state, faces a surface to be cooled, and having a second end face (S2) opposite the first end face (S1), and - a cooling channel (30, 30') which is embedded in the main body between the first end face (S1) and the second end face (S2), wherein: the cooling channel (30, 30') has a supply portion (31), a redirecting portion (32), and a discharge portion (33); the cooling channel (30, 30') is designed, in order to form a general flow path, to conduct a cooling medium in the supply portion (31) in the direction of the first end face (S1), to transfer it in the redirecting portion (32) into the discharge portion (33), and to conduct it in the discharge portion (33) in the direction of the second end face (S2); and at least one transverse-flow portion (50) which connects the supply portion (31) and the discharge portion (33) is formed between the redirecting portion (32) and the second end face (S2).
H01L 23/367 - Cooling facilitated by shape of device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/373 - Cooling facilitated by selection of materials for the device
26.
HEAT SINK ELEMENT FOR A POWER MODULE, POWER MODULE, AND METHOD FOR PRODUCING SUCH A HEAT SINK ELEMENT
The invention relates to a heat sink element (1) for an electric power module (10), said heat sink element comprising: - a main body having a first end face (S1), which, when installed, faces a surface to be cooled, and a second end face (S2) opposite the first end face (S1), and - a cooling channel (30, 30') which is embedded into the main body between the first end face (S1) and the second end face (S2), wherein the cooling channel (30, 30') has a feed portion (31), a redirection portion (32), and a discharge portion (33), wherein the cooling channel (30, 30') is designed to form a general flow path to allow a cooling medium to be conveyed in the feed portion (31) in the direction of the first end face (S1), transferred in the redirection portion (32) to the discharge portion (33), and conveyed in the discharge portion (33) in the direction of the second end face (S2), wherein the feed portion (31) has a first flow cross-section (Q1) measured perpendicular to a flow direction (S), and the redirection portion (32) has a second flow cross-section (Q2) measured perpendicular to the flow direction (S), wherein the ratio of the second flow cross-section (Q2) to the first flow cross-section (Q1) is less than 0.5, preferably less than 0.4, and particularly preferably less than 0.3.
H01L 23/367 - Cooling facilitated by shape of device
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
27.
POWER MODULE AND METHOD FOR PRODUCING SUCH A POWER MODULE
The invention relates to a power module (10) comprising a heat sink element (1), the power module comprising - a ceramic element (25), - a component metallisation (20), and - the heat sink element (1), wherein the ceramic element (25), the component metallisation (20) and the heat sink element (1) each extend substantially along a plane running parallel to a main extension plane (HSE) and are arranged one above the other in a stacking direction (S) running perpendicular to the main extension plane (HSE), wherein the ceramic element (25) is arranged between the component metallisation (20) and the heat sink element (25), wherein the component metallisation (20) has a first thickness (D1) measured in the stacking direction (S), and the heat sink element (1) has a second thickness (D2) measured in the stacking direction (S), wherein the ratio of the first thickness (D1) to the second thickness (D2) is less than 0.4, preferably less than 0.3, and particularly preferably less than 0.2, wherein the heat sink element (1) is designed such that the flexural deformation of the power module (10) is five times smaller, preferably eight times smaller, and particularly preferably ten times smaller than that of a reference power module with dimensions corresponding to the power module (10), wherein the reference power module has a solid heat sink element (1).
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/367 - Cooling facilitated by shape of device
28.
COMPRESSIBLE SILICONE FOAM AND METHOD FOR THE MANUFACTURE THEREOF
A curable composition for preparing a compressible silicone foam includes an alkenyl-containing component including an alkenyl-diterminated polyorganosiloxane, an alkenyl-substituted MQ polyorganosiloxane, and an alkenyl-substituted copolyorganosiloxane, and a hydride-containing component comprising a hydride-substituted polyorganosiloxane. The curable composition includes a cure catalyst; a filler composition; and a blowing agent. Compressible foams made from the curable composition and methods of making compressible foams from the curable composition are also disclosed.
C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
A curable composition for preparing a compressible silicone foam includes an alkenyl-containing component including an alkenyl-diterminated polyorganosiloxane, an alkenyl-substituted MQ polyorganosiloxane, and an alkenyl-substituted copolyorganosiloxane, and a hydride-containing component comprising a hydride-substituted polyorganosiloxane. The curable composition includes a cure catalyst; a filler composition; and a blowing agent. Compressible foams made from the curable composition and methods of making compressible foams from the curable composition are also disclosed.
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
C08J 9/14 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
An combination of an open trough waveguide antenna (TWO A) and lens fixedly attached to the TWGA. The combination of the TWGA and lens provides an antenna assembly that is suitable for use in a radio frequency antenna applications.. The lens has a dielectric medium, and a plurality of non-conductive filler particles dispersed in the dielectric medium. The lens has a relative dielectric constant (Dk) of equal to or less than 2; the lens has a thickness, T, of equal to or greater than 5 microns, and equal to or less than 500 microns.
H01Q 15/10 - Refracting or diffracting devices, e.g. lens, prism comprising three-dimensional array of impedance discontinuities, e.g. holes in conductive surfaces or conductive discs forming artificial dielectric
H01Q 13/22 - Longitudinal slot in boundary wall of waveguide or transmission line
H01Q 19/06 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
An combination of an open trough waveguide antenna (TWGA) and lens fixedly attached to the TWGA. The combination of the TWGA and lens provides an antenna assembly that is suitable for use in a radio frequency antenna applications. The lens has a dielectric medium, and a plurality of non-conductive filler particles dispersed in the dielectric medium. The lens has a relative dielectric constant (Dk) of equal to or less than 2; the lens has a thickness, T, of equal to or greater than 5 microns, and equal to or less than 500 microns.
H01Q 15/08 - Refracting or diffracting devices, e.g. lens, prism formed of solid dielectric material
H01Q 19/06 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
32.
METAL-CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE
rhmaxmax, where the first grains (15) have a mean grain form factor, preferably determined as the arithmetic mean value, of less than 0.5, preferably less than 0.4 and more preferably less than 0.3, and where the first grains are oriented isotropically in the ceramic element.
C04B 35/581 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on aluminium nitride
The invention relates to a support substrate (1), in particular a metal-ceramic substrate, as a support for electric components in the form of a printed circuit board, comprising: - at least one metal layer (10) and - an insulation element (30), in particular a ceramic element, a glass element, a glass-ceramic element, and/or a high temperature-resistant plastic element, wherein the at least one metal layer (10) and the insulation element (30) extend along a main extension plane (HSE) and are arranged one over the other along a stacking direction (S) which runs perpendicularly to the main extension plane (HSE). A binding layer (12) is formed between the at least one metal layer (10) and the insulation element (30) in the completed support substrate (1), and a contact layer (13) of the binding layer (12) - comprises preferably a titanium-nitrogen compound and/or a titanium-silicon compound and - has a first thickness, which is measured in the stacking direction (S) and which is averaged over a plurality of measurement points within one or more specified surfaces (F) that run/runs parallel to the main extension plane (HSE), said thickness equaling less than 900 nm, preferably less than 700 nm, preferably less than 500 nm.
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
34.
THERMAL MANAGEMENT SHEET, METHOD OF MANUFACTURE, AND ARTICLES USING THE SAME
A method of forming a thermal management sheet for a battery including cured polyurethane foam, the method including combining an active hydrogen-containing component including a polyol and an isocyanate component including a polyisocyanate to form an uncured polyurethane foam; and curing the uncured polyurethane foam to form the cured polyurethane foam, wherein the uncured polyurethane foam includes, based on a total weight of the uncured polyurethane foam, 3 to 68 weight percent of sodium borate, 0.1 to 7 weight percent of surfactant, and 0.001 to 9 weight percent of catalyst, wherein the cured polyurethane foam has a density of 12 to 35 pounds per cubic foot, and wherein the cured polyurethane foam has a thickness of 1 to 30 millimeters.
C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
C08J 9/30 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof by mixing gases into liquid compositions or plastisols, e.g. frothing with air
A method of forming a thermal management sheet for a battery including cured polyurethane foam, the method including combining an active hydrogen-containing component including a polyol and an isocyanate component including a polyisocyanate to form an uncured polyurethane foam; and curing the uncured polyurethane foam to form the cured polyurethane foam, wherein the uncured polyurethane foam includes, based on a total weight of the uncured polyurethane foam, 3 to 68 weight percent of sodium borate, 0.1 to 7 weight percent of surfactant, and 0.001 to 9 weight percent of catalyst, wherein the cured polyurethane foam has a density of 12 to 35 pounds per cubic foot, and wherein the cured polyurethane foam has a thickness of 1 to 30 millimeters.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
36.
MULTILAYER CONDUCTOR, METHODS FOR THE MANUFACTURE THEREOF, AND ASSEMBLY COMPRISING THE MULTILAYER CONDUCTOR
A multilayer conductor includes a conductor layer and a dielectric layer on the conductor layer. The dielectric layer includes a polymer composition having a dissipation factor (Df) of less than 0.001 and includes a cyclic olefin copolymer, a transoctenamer rubber, syndiotactic polystyrene, a polymethylpentene olefin copolymer, or a combination thereof. The materials described herein can advantageously provide an improved adhesive strength between the conductor and the dielectric layer. Methods for the manufacture of the multilayer conductor are also described. The multilayer conductor can be useful in the preparation of magnetic selfresonant structures.
H01B 3/44 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes vinyl resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes acrylic resins
H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
37.
MULTILAYER CONDUCTOR, METHODS FOR THE MANUFACTURE THEREOF, AND ASSEMBLY COMPRISING THE MULTILAYER CONDUCTOR
A multilayer conductor includes a conductor layer and a dielectric layer on the conductor layer. The dielectric layer includes a polymer composition having a dissipation factor (Df) of less than 0.001 and includes a cyclic olefin copolymer, a transoctenamer rubber, syndiotactic polystyrene, a polymethylpentene olefin copolymer, or a combination thereof. The materials described herein can advantageously provide an improved adhesive strength between the conductor and the dielectric layer. Methods for the manufacture of the multilayer conductor are also described. The multilayer conductor can be useful in the preparation of magnetic self-resonant structures.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
38.
TRILAYER POLYMER ADHESIVE FILM, METHOD OF BONDING PATTERNED SUBSTRATES, MULTILAYER CONDUCTOR, AND METHOD OF FORMING A MULTILAYER CONDUCTOR
A trilayer polymer film includes a core layer and first and second outer layers on opposing surfaces of the core layer. The compositions of each of the layers is as described herein, wherein the first outer layer and the second outer layer each independently include a fluoropolymer having a melting temperature that is at least 15°C less than a melting temperature of the core layer. The core layer comprising polytetrafluoroethylene, a perfluoroalkoxy polymer, or a fluorinated ethylene propylene polymer. The film can be useful in the preparation of multilayer conductors and magnetic self-resonant structures.
A trilayer polymer film includes a core layer and first and second outer layers on opposing surfaces of the core layer. The compositions of each of the layers is as described herein, wherein the first outer layer and the second outer layer each independently include a fluoropolymer having a melting temperature that is at least 15° C. less than a melting temperature of the core layer. The film can be useful in the preparation of multilayer conductors and magnetic self-resonant structures.
C09J 7/24 - PlasticsMetallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
C09J 127/12 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenAdhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances organic substances
40.
LOW DENSITY CAST SILICONE FOAM AND PREPARATION THEREOF
A curable composition for preparing a low density cast silicone foam includes a first part and a second part. The first part includes particular amounts of an alkenyl-terminated polyorganosiloxane; an alkenyl-substituted copolyorganosiloxane; an alkenyl-substituted MQ polyorganosiloxane; a cure catalyst; an inorganic filler; and a chemical blowing agent. The second part includes a hydride-substituted polyorganosiloxane. The resulting silicone foams advantageously have a density of less than 240 kg/m3; and a closed cell content of at least 50%. Cured silicone foams and methods for the manufacture thereof are also described.
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/16 - Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
C08J 9/14 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
A curable composition for preparing a low density cast silicone foam includes a first part and a second part. The first part includes particular amounts of an alkenyl-terminated polyorganosiloxane; an alkenyl-substituted copolyorganosiloxane; an alkenyl-substituted MQ polyorganosiloxane; a cure catalyst; an inorganic filler; and a chemical blowing agent. The second part includes a hydride-substituted polyorganosiloxane. The resulting silicone foams advantageously have a density of less than 240 kg/m3; and a closed cell content of at least 50%. Cured silicone foams and methods for the manufacture thereof are also described.
C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
A method of producing an inductive coil assembly includes: forming N(i) layers, (i) being an integer from 1 to M, N(i) being an i-th layer, and N(M) being a maximum number of N(i) layers; each N(i) layer includes: an (i) instance of a first conductor having a thickness (x)T bonded to a first side of an (i) instance of a ceramic; an (i) instance of a second conductor having a thick (y)T bonded to the second side of the (i) instance of the ceramic; stacking and registering the N(1) to N(M) layers, such that for (i=1 to M-1), an instance of the first conductor of an N(i+1) layer is disposed adjacent an instance of the second conductor of an N(i) layer; stacking and registering a third conductor having a thickness (y)T with the first conductor of the N(1) layer, and a fourth conductor having a thickness (x)T with the second conductor of the corresponding N(M) layer; and, bonding the third conductor to the first conductor of the N(1) layer, and the fourth conductor to the second conductor of the N(M) layer; wherein x and y are each equal to or greater than 0 and equal to or less than 1.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
A method of producing an inductive coil assembly includes forming N(i) layers, (i) being an integer from 1 to M, N(i) being an i-th layer, and N(M) being a maximum number of N(i) layers; stacking and registering the N(1) to N(M) layers such that for (i=1 to M−1), an instance of the first conductor of an N(i+1) layer is adjacent an instance of the second conductor of an N(i) layer; stacking and registering a third conductor having a thickness with the first conductor of the N(1) layer, and a fourth conductor having a thickness with the second conductor of the corresponding N(M) layer; and bonding the third conductor to the first conductor of the N(1) layer, and the fourth conductor to the second conductor of the N(M) layer.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
A metatarsal guard includes a base layer, an elastomeric polyurethane foam layer on the base layer, and a puncture resistant layer on the elastomer foam layer on a side opposite the base layer. Advantageously, the metatarsal guard is flexible and capable of providing top-of-foot protection to the metatarsal region of a foot. The metatarsal guard is formed by a molding process. A safety shoe or boot having improved protection for the metatarsal region of a wearer's foot is also disclosed.
The invention relates to a cooling device (1) for cooling an assembly of electrical or electrical components (4, 4'), in particular laser diodes, having a main body (2), wherein the main body (2) has a component region (BB) with a first connection region (A1) on an outer side, on which connection region a first component (4) can be mounted, and a second connection region (A2), on which a second component (4) can be mounted, wherein the first connection region (A1) and the second connection region (A2) are offset in height relative to one another in an offset direction (V), wherein the main body (2) has a cooling duct system, wherein the cooling duct system comprises a first cooling portion (41) for cooling the first connection region (A1) and a second cooling portion (42) for cooling the second connection region (A2), wherein the first cooling portion (41) and the second cooling portion (42) are designed in such a way that a first cooling effect of the first cooling portion (41) on the first connection region (A1) and a second cooling effect of the second cooling portion (42) on the second connection region (A2) deviate from a mean value of the first cooling effect and the second cooling effect by less than 15%, preferably less than 10% and particularly preferably less than 5% of the mean value of the first cooling effect and the second cooling effect.
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Electronic circuit material, namely, an insulating dielectric substrate material which is clad on one or both sides with a conductor layer for use in fabricating electronic circuits; electronic circuit material, namely a dialectric substrate with a conductive layer for the manufacture of electronic circuits.
01 - Chemical and biological materials for industrial, scientific and agricultural use
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Microporous plastic material used in the manufacture of
synthetic shoes and parts thereof; microporous plastic
material, namely, foams for use in further manufacture;
microporous plastic material, namely, foams used in the
manufacture of various products, namely, insoles for shoes,
thermal insulation material, luggage cases. Insulating materials made of polyurethane foam with varying
amounts of bio-based polyols and recycled materials;
polyurethane foam made of varying amounts of bio-based
polyols and recycled materials for insulation purposes;
unprocessed and semi-processed rubber, gutta-percha, gum,
asbestos, mica and substitutes for all these materials;
plastics and resins in extruded form for use in manufacture;
packing, stopping and insulating materials; flexible pipes,
tubes and hoses, not of metal; polymeric foam material in
sheet and roll form; plastic material in sheet and roll
form.
48.
METAL-CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE
A metal-ceramic substrate, which can be used as a circuit board and comprises - a ceramic element and - at least one component metallization bonded to the ceramic element, wherein: the component metallization is structured in order to form conductor tracks; the ceramic element comprises magnesium oxide; and a magnesium oxide proportion is greater than 60 wt.-%, preferably greater than 80% and especially preferably greater than 95 wt.-%.
C04B 35/04 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite based on magnesium oxide
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
49.
PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND A METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A PROCESS
A process for producing a metal-ceramic substrate (1) for use as a circuit board, comprising - providing a silicon wafer (40), preferably a doped or non-doped silicon wafer (40, - nitriding the silicon wafer (40) in order to produce a silicon nitride layer (31), - bonding a metal layer (10) to the silicon nitride layer (31), and - structuring the metal layer (10) in order to form a metallized layer.
The invention relates to a method for producing a metal-ceramic substrate (1), which is designed as a printed circuit board, having the steps of: - providing a starting block (2) which comprises silicon, - separating (104) a wafer (4) from the starting block (2), in particular from the completely nitrided, partially nitrided, or non-nitrided starting block (2), - nitriding (105a) the wafer (4), if the wafer (4) has a first density, and/or the starting block (2), if the starting block (2) has a first density, - carrying out at least one sintering step (105b) in order to set a second density in the nitrided wafer (4) and/or the nitrided starting block (2), wherein the second density is greater than the first density, and - connecting (107) a metal layer (10) to the nitrided and sintered wafer (30) in order to form a metal-ceramic substrate (1).
C04B 35/584 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on silicon nitride
C04B 35/591 - Fine ceramics obtained by reaction sintering
C04B 35/626 - Preparing or treating the powders individually or as batches
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Electronic circuit materials for use in fabricating electronic circuits, namely, a dielectric substrate material clad on one side with a copper-clad layer sold as a unit and a dielectric substrate material clad on both sides with a copper-clad layer sold as a unit; electronic circuit materials for use in fabricating electronic circuits, namely, an insulating dielectric substrate material clad on one side with a copper-clad layer sold as a unit and an insulating dielectric substrate material clad on both sides with a copper-clad layer sold as a unit
01 - Chemical and biological materials for industrial, scientific and agricultural use
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Microporous plastic material used in the manufacture of
synthetic shoes and parts thereof; microporous plastic
material, namely, foams for use in further manufacture;
microporous plastic material, namely, foams used in the
manufacture of various products, namely, insoles for shoes,
thermal insulation material, luggage cases. Insulating materials made of polyurethane foam with varying
amounts of bio-based polyols and recycled materials;
polyurethane foam made of varying amounts of bio-based
polyols and recycled materials for insulation purposes;
unprocessed and semi-processed rubber, gutta-percha, gum,
asbestos, mica and substitutes for all these materials;
plastics and resins in extruded form for use in manufacture;
packing, stopping and insulating materials; flexible pipes,
tubes and hoses, not of metal; polymeric foam material in
sheet and roll form; plastic material in sheet and roll
form.
53.
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, CERAMIC ELEMENT AND METAL LAYER FOR SUCH A METHOD, AND METAL-CERAMIC SUBSTRATE PRODUCED BY SUCH A METHOD
A method for producing a metal-ceramic substrate (1), comprising – providing at least one first metal layer (10) for forming a component metallization and a ceramic element (30), – bonding the at least one first metal layer (10) to the ceramic element (30) by means of a direct bonding method, more particularly a DCB method or a DAB method, to form a common first bonding layer (12) between the ceramic element (30) and the at least one metal layer (10), a first agent for promoting formation of spinel being provided in a region intended for the formation of the first bonding layer (12) in order to improve adhesive strength between the at least one first metal layer (10) and the ceramic element (30) for the bonding by means of the direct bonding method.
A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of
A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of
Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22
A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of
Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22
or
A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of
Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22
or
Ban-xSrxCo2-yCuyNizTizFe(m-2z)O22
A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of
Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22
or
Ban-xSrxCo2-yCuyNizTizFe(m-2z)O22
wherein 2≤n≤2.4. 0≤x≤1, 0.1≤y≤1, 0
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
H01F 1/36 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
H01F 1/37 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
H01F 3/08 - Cores, yokes or armatures made from powder
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
56.
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC SUBSTRATE PRODUCED USING A METHOD OF THIS TYPE
A method of manufacturing a metal-ceramic substrate (1), comprising:
providing a ceramic element (30) and at least one metal layer (10), wherein the ceramic element (30) and the at least one metal layer (10) extend along a main extension plane (HSE); and
bonding the ceramic element (30) to the at least one metal layer (10) to form a metal-ceramic substrate (1), in particular by means of a direct metal bonding process, hot isostatic pressing and/or a soldering process,
wherein a structuring, preferably for forming an isolation of metal sections (10′), and/or a recess, preferably for forming a solder stop, is realized in the at least one metal layer (10) by means of a laser process and a chemical process, in particular an etching process.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
57.
METHOD FOR MACHINING A METAL-CERAMIC SUBSTRATE, SYSTEM FOR SUCH A METHOD AND METAL-CERAMIC SUBSTRATES PRODUCED USING SUCH A METHOD
A method of processing a metal-ceramic substrate (1), including
providing a metal-ceramic substrate (1), wherein the metal-ceramic substrate (1) comprises at least one metal layer (21) and one ceramic element (11), which extend along a main extension plane (HSE) and are arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE), and
forming a recess (15), in particular a through recess (15), in the metal-ceramic substrate (1) by processing by means of laser light (10), in particular of an ultrashort pulse (UKP) laser.
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
H01F 1/36 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
H01F 3/08 - Cores, yokes or armatures made from powder
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
H01F 1/37 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
C04B 35/626 - Preparing or treating the powders individually or as batches
An antenna includes: a substrate having a magnetodielectric material; and, an electromagnetic, EM, radiator having an electrically conductive material disposed on an upper surface of the substrate, the EM radiator including a plurality of chamfered sides extending contiguously from one another to define an octagon-shaped EM radiator.
An antenna includes: a substrate having a magnetodielectric material; and, an electromagnetic, EM, radiator having an electrically conductive material disposed on an upper surface of the substrate, the EM radiator including a plurality of chamfered sides extending contiguously from one another to define an octagon-shaped EM radiator.
Printed circuit board (100) for electrical components (5) and/or conducting paths (4), comprising
a base body (2) extending along a main extension plane (HSE), and
an insert (1) integrated in the base body (2),
wherein the insert (1) comprises a metal-ceramic substrate (15), an electrical and/or electronic component (5), and an encapsulation (10) enclosing at least the electrical and/or electronic component (5).
A method for machining a metal-ceramic substrate (1), in particular for producing a predetermined breaking point, comprising:
providing a metal-ceramic substrate (1) and
forming a predetermined breaking point (7) in the metal-ceramic substrate (1) wherein the predetermined breaking point (7) has along a direction (V) thereof at least a first portion (A1) having a first depth (T1) and at least a second portion (A2) having a second depth (T2), wherein a second depth (T2) is realized, which is different from the first depth (T1).
A dielectric polarizer for electromagnetic applications, includes: a monolithic body of Dk material having a plurality of linear elongated ribs disposed parallel with each other; wherein each rib of the plurality of linear elongated ribs has a cross section x-z profile relative to an orthogonal X-Y-Z coordinate system; wherein the Y-direction of the coordinate system is oriented in a direction of elongation of the plurality of linear elongated ribs; wherein the Z-direction of the coordinate system is oriented in a direction of propagation of an EM wave through the uniformly spaced apart plurality of linear elongated ribs; wherein the monolithic body has an overall thickness dimension, T, aligned in the Z-direction, that extends from a first side to a second side of the body; wherein adjacent ones of the plurality of linear elongated ribs are monolithically connected to each other by a plurality of connecting bridges.
A dielectric polarizer for electromagnetic applications, includes: a monolithic body of Dk material having a plurality of linear elongated ribs disposed parallel with each other; wherein each rib of the plurality of linear elongated ribs has a cross section x-z profile relative to an orthogonal X-Y-Z coordinate system; wherein the Y-direction of the coordinate system is oriented in a direction of elongation of the plurality of linear elongated ribs; wherein the Z-direction of the coordinate system is oriented in a direction of propagation of an EM wave through the uniformly spaced apart plurality of linear elongated ribs; wherein the monolithic body has an overall thickness dimension, T, aligned in the Z-direction, that extends from a first side to a second side of the body; wherein adjacent ones of the plurality of linear elongated ribs are monolithically connected to each other by a plurality of connecting bridges.
A dielectric structure useful for shaping electromagnetic, EM, phase wavefronts, includes: a body having a monolithic construct; the body having a height dimension, H, from a proximal end to a distal end equal to or less than 60% of an overall outside dimension, D, of the body at the distal end, the distal end being disposed a distance away from the proximal end along a z-axis of an orthogonal x-y-z coordinate system, the distal end forming an electromagnetic aperture of the structure; the body having a sidewall between the proximal end and the distal end that forms and defines an interior cavity that is open at the proximal end, and closed at the distal end, the sidewall having a plurality of structural disruptions around an enclosing boundary of the interior cavity, the plurality of structural disruptions disposed and configured to reduce electromagnetic reflections.
A dielectric structure useful for shaping electromagnetic, EM, phase wavefronts, includes: a body having a monolithic construct; the body having a height dimension, H, from a proximal end to a distal end equal to or less than 60% of an overall outside dimension, D, of the body at the distal end, the distal end being disposed a distance away from the proximal end along a z-axis of an orthogonal x-y-z coordinate system, the distal end forming an electromagnetic aperture of the structure; the body having a sidewall between the proximal end and the distal end that forms and defines an interior cavity that is open at the proximal end, and closed at the distal end, the sidewall having a plurality of structural disruptions around an enclosing boundary of the interior cavity, the plurality of structural disruptions disposed and configured to reduce electromagnetic reflections.
An electromagnetic device includes: a substrate comprising an elongated aperture having an overall length, L, and an overall width, W, as observed in a plan view of the device, where L is greater than W; a dielectric medium comprising a dielectric material other than air disposed on the substrate substantially covering the aperture, the dielectric medium having a cross sectional boundary, as viewed in the plan view of the device, that is symmetrical with respect to an in-plane axis of reflection of the dielectric medium; wherein the device is configured such that a line perpendicular to the overall length L of the elongated aperture and passing through a center point of the elongated aperture is not any in-plane axis of reflection.
A thermally insulating multilayer sheet for preventing thermal runaway includes a nonporous elastomeric barrier layer having a first and a second opposed surface; a flexible foam layer disposed on the first surface of the barrier layer; and a flame retardant component, wherein the flame retardant component is distributed within the flexible foam layer, contacts a surface of the flexible foam layer, or both.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
B32B 25/16 - Layered products essentially comprising natural or synthetic rubber comprising polydienes or poly-halodienes
B32B 25/18 - Layered products essentially comprising natural or synthetic rubber comprising butyl or halobutyl rubber
C08J 5/12 - Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
Proposed is an electronics module (100), in particular a power electronics module, comprising - a metal-ceramic substrate (1) which serves as a carrier and has a ceramic element (10) and a primary component metallization (21) and preferably a cooling side metallization (20), - an insulation layer (40) which is directly or indirectly connected to the primary component metallization (21), and - a secondary component metallization (22), said secondary component metallization being connected to the side of the insulation layer (40) which faces away from the ceramic element (10) and in particular being insulated with respect to the primary component metallization (21) by the insulation layer (40), wherein the ceramic element (10) has a first size (L, D) and the insulation layer (40) has a second size (L1, D1), and wherein, to form an island-like insulation layer (40) on the primary component metallization (21), a ratio of the second size (L1, ID1) to the first size (L, D) has a value that is less than 0.4, preferably less than 0.22 and particularly preferably less than 0.15 or even less than 0.1, and wherein, as viewed in a direction running perpendicularly to the main plane of extent (HSE), an outer side (A) of the secondary component metallization (22) and an outer side (A) of the first component metallization (21) end substantially at a common height.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
An antenna includes a substrate and an electromagnetic, EM, radiator. The substrate includes a magnetodielectric material. The EM radiator includes an electrically conductive material disposed on an upper surface of the substrate. The EM radiator further includes a root, and a pair of forks that are contiguous with and extend from the root along a first axis. The pair of forks are separated from one another by a slot in the electrically conductive material of the EM radiator to define a fork-shaped EM radiator. The root includes a bridge portion extending between the pair of forks in a direction of a second axis perpendicular to the first axis to electrically connect together the pair of forks.
01 - Chemical and biological materials for industrial, scientific and agricultural use
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Microporous plastic material, namely, foams for use in further manufacture; low-density polyurethane with varying amounts of bio-based polyols and recycled materials Unprocessed and semi-processed rubber, gutta-percha, gum, asbestos, mica; plastics and resins in extruded form for use in manufacture; packing materials of rubber or plastics; flexible pipes, tubes and hoses, not of metal; insulating materials; Polymeric foam materials sold in sheet and roll form, for use by third party manufacturers; Plastic material in extruded sheet and roll form for use in production; Microporous plastic material, namely, foams for use in the manufacture of synthetic shoes and parts thereof; microporous plastic material, namely, foams used in the manufacture of various products, namely, insoles for shoes, thermal insulation material, luggage cases
01 - Chemical and biological materials for industrial, scientific and agricultural use
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Microporous plastic material, namely, foams for use in further manufacture; low-density polyurethane with varying amounts of bio-based polyols and recycled materials Unprocessed and semi-processed rubber, gutta-percha, gum, asbestos, mica; plastics and resins in extruded form for use in manufacture; packing materials of rubber or plastics; flexible pipes, tubes and hoses, not of metal; insulating materials; Polymeric foam materials sold in sheet and roll form, for use by third party manufacturers; Plastic material in extruded sheet and roll form for use in production; Microporous plastic material, namely, foams for use in the manufacture of synthetic shoes and parts thereof; microporous plastic material, namely, foams used in the manufacture of various products, namely, insoles for shoes, thermal insulation material, luggage cases
77.
Photocurable compositions for stereolithography, method of forming the compositions, stereolithography methods using the compositions, polymer components formed by the stereolithography methods, and a device including the polymer components
A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.
C08G 61/04 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
A substrate includes a monolithic structure formed from a dielectric material having a first side, a second side, and an intermediate region between the first side and the second side, and the intermediate region has a lattice structure of the dielectric material having a plurality of interstitial spaces between the dielectric material of the lattice structure. The lattice structure extends between and monolithically connects with the first side and the second side, wherein at least one of the first side and the second side has a substantially solid surface suitably configured to support one or more of electronic circuit imaging, electroplating, metal deposition, or, vias between the first side and the second side.
In an aspect, a method of forming a coating on a busbar comprises cold spraying a powder comprising a plurality of metal particles onto the busbar at a velocity sufficiently high to cause the plurality of metal particles to deform upon contact with the busbar thereby forming the coating on the busbar; wherein the plurality of metal particles comprises greater than or equal to 50 weight percent of at least one of nickel, tin, silver, zinc, or copper based on the total weight of the metal particles; and wherein the coating has an average thickness of greater than or equal to 10 micrometers. In another aspect, a coated busbar is formed by cold spraying.
In an aspect, a method of forming a coating on a busbar comprises cold spraying a powder comprising a plurality of metal particles onto the busbar at a velocity sufficiently high to cause the plurality of metal particles to deform upon contact with the busbar thereby forming the coating on the busbar; wherein the plurality of metal particles comprises greater than or equal to 50 weight percent of at least one of nickel, tin, silver, zinc, or copper based on the total weight of the metal particles; and wherein the coating has an average thickness of greater than or equal to 10 micrometers. In another aspect, a coated busbar is formed by cold spraying.
C23C 24/08 - Coating starting from inorganic powder by application of heat or pressure and heat
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
H01R 4/00 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
81.
Y-TYPE HEXAFERRITE, METHOD OF MANUFACTURE, AND USES THEREOF
H01F 1/11 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
82.
Y-TYPE HEXAFERRITE, METHOD OF MANUFACTURE, AND USES THEREOF
In an aspect, a Co2Y-type ferrite includes oxides of at least Ba, La, Co, Me, Fe, and optionally Ca; wherein Me is at least Ni and optionally one or more of Zn, Cu, Mn, or Mg. A composite can include the Co2Y-type ferrite and a polymer. An article can include the Co2Y-type ferrite.
In an aspect, an M-type ferrite comprises an element Me comprising at least one of Ba, Sr, or Pb; an element Me′ comprising at least one of Ti, Zr, Ru, or Ir; and an element Me″ comprising at least one of In or Sc. In another aspect, a method of making the M-type ferrite can comprise milling ferrite precursor compounds comprising oxides of at least Co, Fe, Me, M3′, and Me″ to form an oxide mixture; wherein Me comprises at least one of Ba, Sr, or Pb; Me′ is at least one of Ti, Zr, Ru, or Ir; and Me″ is at least one of In or Sc; and calcining the oxide mixture in an oxygen or air atmosphere to form the ferrite.
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
84.
M-TYPE HEXAFERRITE COMPRISING A LOW DIELECTRIC LOSS CERAMIC
In an aspect, an M-type ferrite, comprises oxides of Me, Me′, Me″, Co, Ti, and Fe; wherein Me is at least one of Ba, Sr, or Pb; Me′ is at least one of Ti, Zr, Ru, or Ir; and Me″ is at least one of Mg or Ca. In another aspect, a method of making an M-type ferrite comprises milling ferrite precursor compounds comprising oxides of at least Co, Fe, Ti, Me, Me′, and Me″, to form an oxide mixture; wherein Me comprises at least one of Ba, Sr, or Pb; Me′ is at least one of Ti, Zr, Ru, or Ir; and Me″ is at least one of Mg or Ca; and calcining the oxide mixture in an oxygen or air atmosphere to form the M-type ferrite.
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
In an aspect, an R-type ferrite has the formula: Me′3Me2TiFe12O25, wherein Me′ is at least one of Ba2+ or Sr2+ and Me is at least one of Co2+, Mg2+, Cu2+, or Zn2+. In another aspect, a composite or an article comprises the R-type ferrite. In yet another aspect, a method of making a R-type ferrite comprises milling ferrite precursor compounds comprising oxides of at least Fe, Ti, Me, and Me′, to form an oxide mixture; wherein Me′ comprises at least one of Ba2+ or Sr2+; Me is at least one of Co2+, Mg2+, Cu2+, or Zn2+; and calcining the oxide mixture in an oxygen or air atmosphere to form the R-type ferrite.
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
In an aspect, a cap liner comprises a sintered fluoropolymer layer; and a backing layer; wherein the sintered fluoropolymer layer is in direct physical contact with the backing layer with no intervening layer located there between. In another aspect, a method of forming the cap liner of comprises plasma etching the sintered fluoropolymer layer to form a sintered plasma etched layer; and laminating the sintered plasma etched layer and the backing layer to form the cap liner.
B65D 41/04 - Threaded or like caps or cap-like covers secured by rotation
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
The invention relates to a printed circuit board (100) for electrical components (5) and/or conductor tracks (4), comprising - a base body (2) which extends along a main extension plane (HSE), and - an insert (1) which, in a mounted state, is integrated into the base body (2), wherein the insert (1) is a metal-ceramic substrate (10), wherein the metal-ceramic substrate (1) is at least in some sections covered, in particular surrounded, by an insulation element (8) on a side surface (SF) facing the main body (2) in the mounted state.
The present invention relates to a method for producing a metal-ceramic substrate (1) comprising: —providing a ceramic element (30) and at least one metal layer (10), wherein the ceramic element (30) and the at least one metal layer (10) extend along a main extension plane (HSE), —joining the ceramic element (30) to the at least one metal layer (10) to form a metal-ceramic substrate (1), in particular by means of a direct metal joining method, a hot isostatic pressing method and/or a soldering method, and —machining the at least one metal layer (10) by means of a machine tool (40) and/or laser light in order to define a geometry, at least in some portions, of a side face (15) of the at least one metal layer (10) not running parallel to the main extension plane (HSE).
The invention relates to a process for producing a metal-ceramic substrate (1), comprising: —providing a ceramic element (10), a metal ply (40) and at least one metal layer (30), —forming an ensemble (18) of the ceramic element (10), the metal ply (40) and the at least one metal layer (30), —forming a gas-tight container (30) surrounding the ceramic element (10), wherein the at least one metal layer (30) is arranged between the ceramic element (10) and the metal ply (40) in the container, and—forming the metal-ceramic substrate (1) by hot isostatic pressing.
The invention relates to a metal-ceramic substrate (1) as carrier for electric components, in particular in the form of a printed circuit board, comprising: - a ceramic element (20) and - at least one metal layer (10, 20), wherein the at least one metal layer (10) and the ceramic element (20) extend along a main extension plane (HSE) and are arranged one above the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein a binding layer (12) is formed between the at least one metal layer (10, 20) and the ceramic element (30) in the manufactured metal-ceramic substrate (1), and wherein an adhesion promoter layer of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq, preferably greater than 10 Ohm/sq, particularly preferably greater than 20 Ohm/sq, wherein a via (15) is formed in the ceramic element (30).
A thermally conductive phase-change composition includes a mixture of 5 to 25 weight percent thermoplastic polymer; 20 to 45 weight percent phase-change material; and 30 to 65 weight percent thermally conductive particles, wherein weight percent is based on the total weight of the composition and totals 100 weight percent, and wherein thermal conductivity of the composition is at least 3.0 W/m-K at a temperature below the transition temperature of the phase change material and thermal conductivity of the composition is at least 2.0 W/m-K at a temperature above the transition temperature of the phase change material, wherein thermal conductivity is determined in accordance with ASTM E1530. The phase-change compositions are reworkable and can be easily and cleanly removed from a device for maintenance and repair and repositioned without causing damage to the device.
In an aspect, a thermosettable composition comprises an imide extended compound and a reactive monomer that is free-radically crosslinkable with the reactive end groups of the imide extended compound to produce a crosslinked network. A thermoset composite can be derived from the thermosettable composition and a multilayer article can include the thermoset composite in the form of a layer. The article can be an antenna, a bond ply, a semiconductor substrate build-up/redistribution layer dielectric film, a circuit board, resin-coated-copper (RCC), or a flexible core.
In an aspect, a thermosettable composition comprises an imide extended compound and a reactive monomer that is free-radically crosslinkable with the reactive end groups of the imide extended compound to produce a crosslinked network. A thermoset composite can be derived from the thermosettable composition and a multilayer article can include the thermoset composite in the form of a layer. The article can be an antenna, a bond ply, a semiconductor substrate build-up/redistribution layer dielectric film, a circuit board, resin-coated-copper (RCC), or a flexible core.
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C09D 4/06 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/029 - Inorganic compoundsOnium compoundsOrganic compounds having hetero atoms other than oxygen, nitrogen or sulfur
A stereolithography method of manufacture of a polymer structure having a spatially gradient dielectric constant, including: providing a volume of a liquid, radiation-curable composition; irradiating a portion of the liquid, radiation-curable composition with activating radiation in a pattern to form a layer of the polymer structure; contacting the layer with the liquid, radiation-curable composition; irradiating the liquid, radiation-curable composition with activating radiation in a pattern to form a second layer on the first layer; and repeating the contacting and irradiating to form the polymer structure, wherein the polymer structure comprises a plurality of unit cells wherein each unit cell is integrally connected with an adjacent unit cell, each unit cell is defined by a plurality of trusses formed by the irradiation, wherein the trusses are integrally connected with each other at their respective ends, and the trusses of each unit cell are dimensioned to provide the spatially gradient dielectric constant.
B29C 64/124 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof
The invention relates to a carrier substrate (1) for electrical components (4), comprising: - a heat sink (20), and - a ceramic element (71), wherein the ceramic element (71) is bonded at least in some sections to the heat sink (20), wherein in the finished carrier substrate (1) a bonding layer without solder material is formed between the heat sink (20) and the ceramic element (71), and wherein an adhesion promoter layer of the bonding layer has a sheet resistance greater than 5 ohms/square, preferably greater than 10 ohms/square and particularly preferably greater than 20 ohms/square.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
96.
CARRIER ELEMENT FOR ELECTRICAL COMPONENTS, AND METHOD FOR PRODUCING A CARRIER ELEMENT OF THIS TYPE
The invention relates to a carrier element (1) for electrical components (4), wherein the carrier element (1) comprises a metal cooling body (20) for dissipating heat emitted by the electrical component during operation, wherein the cooling body (20) has a metal grain size distribution with an average grain size, wherein the average grain size is in the region of between 10 and 800 μm, preferably between 100 and 700 μm, and particularly preferably between 300 und 600 μm, characterised in that the cooling body (20) comprises an oxide-containing corrosion-protection layer (30) at least in sections.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
F28F 19/02 - Preventing the formation of deposits or corrosion, e.g. by using filters by using coatings, e.g. vitreous or enamel coatings
A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.
The invention relates to a process for producing a metal-ceramic substrate (1), comprising:
providing a ceramic element (10) and a metal layer,
providing a gas-tight container (25) that encloses the ceramic element (10), the container (25) preferably being formed from the metal layer or comprising the metal layer,
forming the metal-ceramic substrate (1) by connecting the metal layer to the ceramic element (10) by means of hot isostatic pressing, wherein, for the purpose of forming the metal-ceramic substrate (1), an active metal layer (15) or a contact layer comprising an active metal is arranged at least in some sections between the metal layer and the ceramic element (10) for supporting the connection of the metal layer to the ceramic element (10).
09 - Scientific and electric apparatus and instruments
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Circuit material in the nature of electrical circuit boards, electronic circuit cards, and electronic integrated circuits, in particular copper clad laminates circuit boards. Circuit materials in the nature of insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, namely bondplies for the production of circuit boards.
100.
Filled silicone foam layer, compositions and methods for their manufacture, and articles including the filled silicone foam layer
A very thin filled silicone foam layer is formed from a composition that includes a curable polysiloxane composition including an alkenyl-substituted polyorganosiloxane, a hydride-substituted polyorganosiloxane, and a cure catalyst; a plurality of expanded polymer microspheres having a largest dimension of less than the thickness of the foam; and a filler composition, wherein each component of the filler composition has a largest dimension of less than the thickness of the foam, the filler composition comprising a particulate ceramic filler, a particulate calcium carbonate filler, or a particulate aluminosilicate clay filler having a plate morphology, or a particulate aluminosilicate clay filler having a hollow tubular morphology, a particulate polymeric silsesquioxane filler, or a particulate methyl-phenyl MQ filler, or a plurality of glass microspheres, or a particulate paraffin wax, or a combination thereof; wherein the curable filled composition has a viscosity of less than 400,000 centiStokes, or 100,000 to 350,000 centiStokes.
C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
C08G 77/08 - Preparatory processes characterised by the catalysts used
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
C08J 9/32 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof from compositions containing microballoons, e.g. syntactic foams
C08K 3/013 - Fillers, pigments or reinforcing additives
G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
