A method for forming a plated through-hole structure includes filling a first through- hole in a substrate with a composition having a coefficient of thermal expansion of less than 50 ppm/°C. The composition is disposed on the interior surface of the first through-hole from the first opening to the second opening. The method further includes forming a second through-hole in the first through-hole filled with the composition. The second through-hole has a diameter less than a diameter of the first through-hole. The method further includes plating the interior surface of the second through-hole to provide the plated through-hole structure. The method can provide plated through-hole structures exhibiting good adhesion to metal and providing a reliable electrical connection.
A method for forming a plated through-hole structure includes filling a first through-hole in a substrate with a composition having a coefficient of thermal expansion of less than 50 ppm/° C. The composition is disposed on the interior surface of the first through-hole from the first opening to the second opening. The method further includes forming a second through-hole in the first through-hole filled with the composition. The second through-hole has a diameter less than a diameter of the first through-hole. The method further includes plating the interior surface of the second through-hole to provide the plated through-hole structure. The method can provide plated through-hole structures exhibiting good adhesion to metal and providing a reliable electrical connection.
The invention relates to a method for producing a metal-ceramic substrate (1), comprising: - providing at least one metal layer (10) - providing a ceramic element (30), and - joining the at least one metal layer (10) to a joining surface on an outer face of the ceramic element (30), wherein the at least one metal layer (10) and the ceramic element (30) extend along a main plane of extent (HSE) and are arranged one above the other in a stacking direction (S) running perpendicular to the main plane of extent (HSE), wherein the joining surface has a roughness that is greater than 0.5 µm, preferably greater than 1.0 µm, and particularly preferably greater than 1.5 µm.
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
PHOTOCURABLE COMPOSITIONS FOR STEREOLITHOGRAPHY, METHOD OF FORMING THE COMPOSITIONS, STEREOLITHOGRAPHY METHODS USING THE COMPOSITIONS, POLYMER COMPONENTS FORMED BY THE STEREOLITHOGRAPHY METHODS, AND A DEVICE INCLUDING THE POLYMER COMPONENTS
A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
B29C 64/106 - Procédés de fabrication additive n’utilisant que des matériaux liquides ou visqueux, p. ex. dépôt d’un cordon continu de matériau visqueux
B29K 33/00 - Utilisation de polymères d'acides non saturés ou de leurs dérivés comme matière de moulage
B29K 35/00 - Utilisation de polymères d'acides polycarboxyliques non saturés comme matière de moulage
B33Y 70/00 - Matériaux spécialement adaptés à la fabrication additive
B33Y 80/00 - Produits obtenus par fabrication additive
C08F 20/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
A waveguide antenna system, includes: an electromagnetic, EM, transition portion having a transition region having a signal feed interface and an open waveguide section, the EM transition portion configured to couple EM energy from the signal feed interface to a guided waveguide mode of EM energy to the open waveguide section via the transition region; and a leaky waveguide antenna portion configured and disposed to radiate electromagnetic energy received from the open waveguide section; wherein the EM transition portion is electromagnetically coupled to the leaky waveguide antenna portion, the EM transition portion being configured to support a transfer of electromagnetic energy from a signal feed structure to the leaky waveguide antenna portion.
Carrier substrate (1) for electrical components (4), comprising:
a heat sink (20), and
a ceramic element (71), wherein the ceramic element (71) is bonded to the heat sink (20) at least in sections,
wherein a bonding layer free of solder material is formed in the manufactured carrier substrate (1) between the heat sink (20) and the ceramic element (71), and
wherein a adhesion agent layer of the bonding layer has a sheet resistance which is greater than 5 ohm/sq, more preferably greater than 10 ohm/sq and most preferably greater than 20 ohm/sq.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H01S 5/024 - Dispositions pour la gestion thermique
7.
Metal-ceramic substrate and method for producing a metal ceramic substrate
A metal-ceramic substrate (1) provided as a printed circuit board for attaching electrical components, comprising
a component metallization (10) and a backside metallization (20), and
a ceramic element (30) arranged along a stacking direction (S) between the component metallization (10) and the backside metallization (20),
wherein the component metallization (10) comprises a first metal section (11) and a second metal section (12), the first metal section (11) and the second metal section (12) being separated from each other by an isolation section (15), and
wherein the backside metallization (20) has a material weakening (25), in particular a material recess, which is arranged to be congruent with the isolation section (15) when viewed in the stacking direction (S).
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
8.
METHOD FOR PRODUCING AND/OR HANDLING A METAL-CERAMIC SUBSTRATE, A METAL-CERAMIC SUBSTRATE, A SYSTEM FOR PRODUCING METAL-CERAMIC SUBSTRATES AND DATABASE FOR METAL-CERAMIC SUBSTRATES
The invention relates to a method for producing and/or handling metal-ceramic substrates (1, 10), comprising: - providing a metal layer (12) and a ceramic layer (11) - connecting the metal layer (12) to the ceramic layer (11) to produce a metal-ceramic substrate (1, 10), - determining a surface quality in a partial section, preferably in a defined partial section, of a surface of the metal layer (12), the ceramic layer (11) and/or the metal-ceramic substrate (1, 10), and - using the determined surface quality as an identifier (21, 22, 23).
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
The invention relates to a heat sink element (1) for an electric power module (10), comprising - a main body having a first end face (S) which, in the installed state, faces a surface to be cooled, and having a second end face (S2) opposite the first end face (S1), and - a cooling channel (30, 30') which is embedded in the main body between the first end face (S1) and the second end face (S2), wherein: the cooling channel (30, 30') has a supply portion (31), a redirecting portion (32), and a discharge portion (33); the cooling channel (30, 30') is designed, in order to form a general flow path, to conduct a cooling medium in the supply portion (31) in the direction of the first end face (S1), to transfer it in the redirecting portion (32) into the discharge portion (33), and to conduct it in the discharge portion (33) in the direction of the second end face (S2); and at least one transverse-flow portion (50) which connects the supply portion (31) and the discharge portion (33) is formed between the redirecting portion (32) and the second end face (S2).
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
10.
HEAT SINK ELEMENT FOR A POWER MODULE, POWER MODULE, AND METHOD FOR PRODUCING SUCH A HEAT SINK ELEMENT
The invention relates to a heat sink element (1) for an electric power module (10), said heat sink element comprising: - a main body having a first end face (S1), which, when installed, faces a surface to be cooled, and a second end face (S2) opposite the first end face (S1), and - a cooling channel (30, 30') which is embedded into the main body between the first end face (S1) and the second end face (S2), wherein the cooling channel (30, 30') has a feed portion (31), a redirection portion (32), and a discharge portion (33), wherein the cooling channel (30, 30') is designed to form a general flow path to allow a cooling medium to be conveyed in the feed portion (31) in the direction of the first end face (S1), transferred in the redirection portion (32) to the discharge portion (33), and conveyed in the discharge portion (33) in the direction of the second end face (S2), wherein the feed portion (31) has a first flow cross-section (Q1) measured perpendicular to a flow direction (S), and the redirection portion (32) has a second flow cross-section (Q2) measured perpendicular to the flow direction (S), wherein the ratio of the second flow cross-section (Q2) to the first flow cross-section (Q1) is less than 0.5, preferably less than 0.4, and particularly preferably less than 0.3.
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
11.
POWER MODULE AND METHOD FOR PRODUCING SUCH A POWER MODULE
The invention relates to a power module (10) comprising a heat sink element (1), the power module comprising - a ceramic element (25), - a component metallisation (20), and - the heat sink element (1), wherein the ceramic element (25), the component metallisation (20) and the heat sink element (1) each extend substantially along a plane running parallel to a main extension plane (HSE) and are arranged one above the other in a stacking direction (S) running perpendicular to the main extension plane (HSE), wherein the ceramic element (25) is arranged between the component metallisation (20) and the heat sink element (25), wherein the component metallisation (20) has a first thickness (D1) measured in the stacking direction (S), and the heat sink element (1) has a second thickness (D2) measured in the stacking direction (S), wherein the ratio of the first thickness (D1) to the second thickness (D2) is less than 0.4, preferably less than 0.3, and particularly preferably less than 0.2, wherein the heat sink element (1) is designed such that the flexural deformation of the power module (10) is five times smaller, preferably eight times smaller, and particularly preferably ten times smaller than that of a reference power module with dimensions corresponding to the power module (10), wherein the reference power module has a solid heat sink element (1).
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H01L 23/367 - Refroidissement facilité par la forme du dispositif
12.
COMPRESSIBLE SILICONE FOAM AND METHOD FOR THE MANUFACTURE THEREOF
A curable composition for preparing a compressible silicone foam includes an alkenyl-containing component including an alkenyl-diterminated polyorganosiloxane, an alkenyl-substituted MQ polyorganosiloxane, and an alkenyl-substituted copolyorganosiloxane, and a hydride-containing component comprising a hydride-substituted polyorganosiloxane. The curable composition includes a cure catalyst; a filler composition; and a blowing agent. Compressible foams made from the curable composition and methods of making compressible foams from the curable composition are also disclosed.
C08J 9/06 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable par un agent chimique de gonflage
A curable composition for preparing a compressible silicone foam includes an alkenyl-containing component including an alkenyl-diterminated polyorganosiloxane, an alkenyl-substituted MQ polyorganosiloxane, and an alkenyl-substituted copolyorganosiloxane, and a hydride-containing component comprising a hydride-substituted polyorganosiloxane. The curable composition includes a cure catalyst; a filler composition; and a blowing agent. Compressible foams made from the curable composition and methods of making compressible foams from the curable composition are also disclosed.
C08J 9/00 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement
C08J 9/12 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable par un agent physique de gonflage
C08J 9/14 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable par un agent physique de gonflage organique
An combination of an open trough waveguide antenna (TWO A) and lens fixedly attached to the TWGA. The combination of the TWGA and lens provides an antenna assembly that is suitable for use in a radio frequency antenna applications.. The lens has a dielectric medium, and a plurality of non-conductive filler particles dispersed in the dielectric medium. The lens has a relative dielectric constant (Dk) of equal to or less than 2; the lens has a thickness, T, of equal to or greater than 5 microns, and equal to or less than 500 microns.
H01Q 15/10 - Dispositifs de réfraction ou diffraction, p. ex. lentille, prisme concernant un réseau de discontinuité d'impédance tridimensionnel, p. ex. trous dans une surface conductrice ou disques conducteurs formant diélectrique artificiel
H01Q 13/22 - Fente longitudinale dans la paroi limite du guide d'onde ou d'une ligne de transmission
H01Q 19/06 - Combinaisons d'éléments actifs primaires d'antennes avec des dispositifs secondaires, p. ex. avec des dispositifs quasi optiques, pour donner à une antenne une caractéristique directionnelle désirée utilisant des dispositifs de réfraction ou de diffraction, p. ex. lentilles
An combination of an open trough waveguide antenna (TWGA) and lens fixedly attached to the TWGA. The combination of the TWGA and lens provides an antenna assembly that is suitable for use in a radio frequency antenna applications. The lens has a dielectric medium, and a plurality of non-conductive filler particles dispersed in the dielectric medium. The lens has a relative dielectric constant (Dk) of equal to or less than 2; the lens has a thickness, T, of equal to or greater than 5 microns, and equal to or less than 500 microns.
H01Q 15/08 - Dispositifs de réfraction ou diffraction, p. ex. lentille, prisme constitués par une matière diélectrique solide
H01Q 19/06 - Combinaisons d'éléments actifs primaires d'antennes avec des dispositifs secondaires, p. ex. avec des dispositifs quasi optiques, pour donner à une antenne une caractéristique directionnelle désirée utilisant des dispositifs de réfraction ou de diffraction, p. ex. lentilles
16.
METAL-CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE
rhmaxmax, where the first grains (15) have a mean grain form factor, preferably determined as the arithmetic mean value, of less than 0.5, preferably less than 0.4 and more preferably less than 0.3, and where the first grains are oriented isotropically in the ceramic element.
C04B 35/581 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure d'aluminium
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
17.
SUPPORT SUBSTRATE AND METHOD FOR PRODUCING A SUPPORT SUBSTRATE
The invention relates to a support substrate (1), in particular a metal-ceramic substrate, as a support for electric components in the form of a printed circuit board, comprising: - at least one metal layer (10) and - an insulation element (30), in particular a ceramic element, a glass element, a glass-ceramic element, and/or a high temperature-resistant plastic element, wherein the at least one metal layer (10) and the insulation element (30) extend along a main extension plane (HSE) and are arranged one over the other along a stacking direction (S) which runs perpendicularly to the main extension plane (HSE). A binding layer (12) is formed between the at least one metal layer (10) and the insulation element (30) in the completed support substrate (1), and a contact layer (13) of the binding layer (12) - comprises preferably a titanium-nitrogen compound and/or a titanium-silicon compound and - has a first thickness, which is measured in the stacking direction (S) and which is averaged over a plurality of measurement points within one or more specified surfaces (F) that run/runs parallel to the main extension plane (HSE), said thickness equaling less than 900 nm, preferably less than 700 nm, preferably less than 500 nm.
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
18.
THERMAL MANAGEMENT SHEET, METHOD OF MANUFACTURE, AND ARTICLES USING THE SAME
A method of forming a thermal management sheet for a battery including cured polyurethane foam, the method including combining an active hydrogen-containing component including a polyol and an isocyanate component including a polyisocyanate to form an uncured polyurethane foam; and curing the uncured polyurethane foam to form the cured polyurethane foam, wherein the uncured polyurethane foam includes, based on a total weight of the uncured polyurethane foam, 3 to 68 weight percent of sodium borate, 0.1 to 7 weight percent of surfactant, and 0.001 to 9 weight percent of catalyst, wherein the cured polyurethane foam has a density of 12 to 35 pounds per cubic foot, and wherein the cured polyurethane foam has a thickness of 1 to 30 millimeters.
C08G 18/76 - Polyisocyanates ou polyisothiocyanates cycliques aromatiques
C08J 9/00 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement
C08J 9/30 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement par mélange de gaz dans des compositions liquides ou des plastisols, p. ex. par fabrication de mousse à l'aide d'air
H01M 50/211 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules en forme de poche
19.
THERMAL MANAGEMENT SHEET, METHOD OF MANUFACTURE, AND ARTICLES USING THE SAME
A method of forming a thermal management sheet for a battery including cured polyurethane foam, the method including combining an active hydrogen-containing component including a polyol and an isocyanate component including a polyisocyanate to form an uncured polyurethane foam; and curing the uncured polyurethane foam to form the cured polyurethane foam, wherein the uncured polyurethane foam includes, based on a total weight of the uncured polyurethane foam, 3 to 68 weight percent of sodium borate, 0.1 to 7 weight percent of surfactant, and 0.001 to 9 weight percent of catalyst, wherein the cured polyurethane foam has a density of 12 to 35 pounds per cubic foot, and wherein the cured polyurethane foam has a thickness of 1 to 30 millimeters.
C08L 75/06 - Polyuréthanes à partir des polyesters
H01M 10/653 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des matériaux électriquement isolants ou thermiquement conducteurs
20.
MULTILAYER CONDUCTOR, METHODS FOR THE MANUFACTURE THEREOF, AND ASSEMBLY COMPRISING THE MULTILAYER CONDUCTOR
A multilayer conductor includes a conductor layer and a dielectric layer on the conductor layer. The dielectric layer includes a polymer composition having a dissipation factor (Df) of less than 0.001 and includes a cyclic olefin copolymer, a transoctenamer rubber, syndiotactic polystyrene, a polymethylpentene olefin copolymer, or a combination thereof. The materials described herein can advantageously provide an improved adhesive strength between the conductor and the dielectric layer. Methods for the manufacture of the multilayer conductor are also described. The multilayer conductor can be useful in the preparation of magnetic selfresonant structures.
H01B 3/44 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines vinyliquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires résines acryliques
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
21.
MULTILAYER CONDUCTOR, METHODS FOR THE MANUFACTURE THEREOF, AND ASSEMBLY COMPRISING THE MULTILAYER CONDUCTOR
A multilayer conductor includes a conductor layer and a dielectric layer on the conductor layer. The dielectric layer includes a polymer composition having a dissipation factor (Df) of less than 0.001 and includes a cyclic olefin copolymer, a transoctenamer rubber, syndiotactic polystyrene, a polymethylpentene olefin copolymer, or a combination thereof. The materials described herein can advantageously provide an improved adhesive strength between the conductor and the dielectric layer. Methods for the manufacture of the multilayer conductor are also described. The multilayer conductor can be useful in the preparation of magnetic self-resonant structures.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
22.
TRILAYER POLYMER ADHESIVE FILM, METHOD OF BONDING PATTERNED SUBSTRATES, MULTILAYER CONDUCTOR, AND METHOD OF FORMING A MULTILAYER CONDUCTOR
A trilayer polymer film includes a core layer and first and second outer layers on opposing surfaces of the core layer. The compositions of each of the layers is as described herein, wherein the first outer layer and the second outer layer each independently include a fluoropolymer having a melting temperature that is at least 15°C less than a melting temperature of the core layer. The core layer comprising polytetrafluoroethylene, a perfluoroalkoxy polymer, or a fluorinated ethylene propylene polymer. The film can be useful in the preparation of multilayer conductors and magnetic self-resonant structures.
A trilayer polymer film includes a core layer and first and second outer layers on opposing surfaces of the core layer. The compositions of each of the layers is as described herein, wherein the first outer layer and the second outer layer each independently include a fluoropolymer having a melting temperature that is at least 15° C. less than a melting temperature of the core layer. The film can be useful in the preparation of multilayer conductors and magnetic self-resonant structures.
C09J 7/24 - Matières plastiquesMatières plastiques métallisées à base de composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone
C09J 127/12 - Adhésifs à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un halogèneAdhésifs à base de dérivés de tels polymères non modifiés par un post-traitement chimique contenant des atomes de fluor
H01B 1/12 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques substances organiques
24.
LOW DENSITY CAST SILICONE FOAM AND PREPARATION THEREOF
A curable composition for preparing a low density cast silicone foam includes a first part and a second part. The first part includes particular amounts of an alkenyl-terminated polyorganosiloxane; an alkenyl-substituted copolyorganosiloxane; an alkenyl-substituted MQ polyorganosiloxane; a cure catalyst; an inorganic filler; and a chemical blowing agent. The second part includes a hydride-substituted polyorganosiloxane. The resulting silicone foams advantageously have a density of less than 240 kg/m3; and a closed cell content of at least 50%. Cured silicone foams and methods for the manufacture thereof are also described.
C08G 77/20 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
C08G 77/08 - Procédés de préparation caractérisés par les catalyseurs utilisés
C08G 77/12 - Polysiloxanes contenant du silicium lié à l'hydrogène
C08G 77/16 - Polysiloxanes contenant du silicium lié à des groupes contenant de l'oxygène à des groupes hydroxyle
C08J 9/00 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement
C08J 9/06 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable par un agent chimique de gonflage
C08J 9/12 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable par un agent physique de gonflage
C08J 9/14 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable par un agent physique de gonflage organique
A curable composition for preparing a low density cast silicone foam includes a first part and a second part. The first part includes particular amounts of an alkenyl-terminated polyorganosiloxane; an alkenyl-substituted copolyorganosiloxane; an alkenyl-substituted MQ polyorganosiloxane; a cure catalyst; an inorganic filler; and a chemical blowing agent. The second part includes a hydride-substituted polyorganosiloxane. The resulting silicone foams advantageously have a density of less than 240 kg/m3; and a closed cell content of at least 50%. Cured silicone foams and methods for the manufacture thereof are also described.
C08J 9/06 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable par un agent chimique de gonflage
A method of producing an inductive coil assembly includes: forming N(i) layers, (i) being an integer from 1 to M, N(i) being an i-th layer, and N(M) being a maximum number of N(i) layers; each N(i) layer includes: an (i) instance of a first conductor having a thickness (x)T bonded to a first side of an (i) instance of a ceramic; an (i) instance of a second conductor having a thick (y)T bonded to the second side of the (i) instance of the ceramic; stacking and registering the N(1) to N(M) layers, such that for (i=1 to M-1), an instance of the first conductor of an N(i+1) layer is disposed adjacent an instance of the second conductor of an N(i) layer; stacking and registering a third conductor having a thickness (y)T with the first conductor of the N(1) layer, and a fourth conductor having a thickness (x)T with the second conductor of the corresponding N(M) layer; and, bonding the third conductor to the first conductor of the N(1) layer, and the fourth conductor to the second conductor of the N(M) layer; wherein x and y are each equal to or greater than 0 and equal to or less than 1.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
A method of producing an inductive coil assembly includes forming N(i) layers, (i) being an integer from 1 to M, N(i) being an i-th layer, and N(M) being a maximum number of N(i) layers; stacking and registering the N(1) to N(M) layers such that for (i=1 to M−1), an instance of the first conductor of an N(i+1) layer is adjacent an instance of the second conductor of an N(i) layer; stacking and registering a third conductor having a thickness with the first conductor of the N(1) layer, and a fourth conductor having a thickness with the second conductor of the corresponding N(M) layer; and bonding the third conductor to the first conductor of the N(1) layer, and the fourth conductor to the second conductor of the N(M) layer.
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
A metatarsal guard includes a base layer, an elastomeric polyurethane foam layer on the base layer, and a puncture resistant layer on the elastomer foam layer on a side opposite the base layer. Advantageously, the metatarsal guard is flexible and capable of providing top-of-foot protection to the metatarsal region of a foot. The metatarsal guard is formed by a molding process. A safety shoe or boot having improved protection for the metatarsal region of a wearer's foot is also disclosed.
The invention relates to a cooling device (1) for cooling an assembly of electrical or electrical components (4, 4'), in particular laser diodes, having a main body (2), wherein the main body (2) has a component region (BB) with a first connection region (A1) on an outer side, on which connection region a first component (4) can be mounted, and a second connection region (A2), on which a second component (4) can be mounted, wherein the first connection region (A1) and the second connection region (A2) are offset in height relative to one another in an offset direction (V), wherein the main body (2) has a cooling duct system, wherein the cooling duct system comprises a first cooling portion (41) for cooling the first connection region (A1) and a second cooling portion (42) for cooling the second connection region (A2), wherein the first cooling portion (41) and the second cooling portion (42) are designed in such a way that a first cooling effect of the first cooling portion (41) on the first connection region (A1) and a second cooling effect of the second cooling portion (42) on the second connection region (A2) deviate from a mean value of the first cooling effect and the second cooling effect by less than 15%, preferably less than 10% and particularly preferably less than 5% of the mean value of the first cooling effect and the second cooling effect.
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Electronic circuit material, namely, an insulating dielectric substrate material which is clad on one or both sides with a conductor layer for use in fabricating electronic circuits; electronic circuit material, namely a dialectric substrate with a conductive layer for the manufacture of electronic circuits.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Microporous plastic material used in the manufacture of
synthetic shoes and parts thereof; microporous plastic
material, namely, foams for use in further manufacture;
microporous plastic material, namely, foams used in the
manufacture of various products, namely, insoles for shoes,
thermal insulation material, luggage cases. Insulating materials made of polyurethane foam with varying
amounts of bio-based polyols and recycled materials;
polyurethane foam made of varying amounts of bio-based
polyols and recycled materials for insulation purposes;
unprocessed and semi-processed rubber, gutta-percha, gum,
asbestos, mica and substitutes for all these materials;
plastics and resins in extruded form for use in manufacture;
packing, stopping and insulating materials; flexible pipes,
tubes and hoses, not of metal; polymeric foam material in
sheet and roll form; plastic material in sheet and roll
form.
32.
METAL-CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE
A metal-ceramic substrate, which can be used as a circuit board and comprises - a ceramic element and - at least one component metallization bonded to the ceramic element, wherein: the component metallization is structured in order to form conductor tracks; the ceramic element comprises magnesium oxide; and a magnesium oxide proportion is greater than 60 wt.-%, preferably greater than 80% and especially preferably greater than 95 wt.-%.
C04B 35/04 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base d'oxyde de magnésium, d'oxyde de calcium ou de mélanges d'oxydes dérivés de la dolomite à base d'oxyde de magnésium
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
33.
PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND A METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A PROCESS
A process for producing a metal-ceramic substrate (1) for use as a circuit board, comprising - providing a silicon wafer (40), preferably a doped or non-doped silicon wafer (40, - nitriding the silicon wafer (40) in order to produce a silicon nitride layer (31), - bonding a metal layer (10) to the silicon nitride layer (31), and - structuring the metal layer (10) in order to form a metallized layer.
C04B 35/591 - Céramiques fines obtenues par frittage par réaction
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
34.
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A METHOD
The invention relates to a method for producing a metal-ceramic substrate (1), which is designed as a printed circuit board, having the steps of: - providing a starting block (2) which comprises silicon, - separating (104) a wafer (4) from the starting block (2), in particular from the completely nitrided, partially nitrided, or non-nitrided starting block (2), - nitriding (105a) the wafer (4), if the wafer (4) has a first density, and/or the starting block (2), if the starting block (2) has a first density, - carrying out at least one sintering step (105b) in order to set a second density in the nitrided wafer (4) and/or the nitrided starting block (2), wherein the second density is greater than the first density, and - connecting (107) a metal layer (10) to the nitrided and sintered wafer (30) in order to form a metal-ceramic substrate (1).
C04B 35/584 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base de non oxydes à base de borures, nitrures ou siliciures à base de nitrure de silicium
C04B 35/591 - Céramiques fines obtenues par frittage par réaction
C04B 35/626 - Préparation ou traitement des poudres individuellement ou par fournées
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
09 - Appareils et instruments scientifiques et électriques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Electronic circuit material, namely, a dielectric substrate clad on one or both sides with a conductive layer for fabricating electronic circuits Electronic circuit material, namely, an insulating dielectric substrate material which is clad on one or both sides with a conductor layer for use in fabricating electronic circuits
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Microporous plastic material used in the manufacture of
synthetic shoes and parts thereof; microporous plastic
material, namely, foams for use in further manufacture;
microporous plastic material, namely, foams used in the
manufacture of various products, namely, insoles for shoes,
thermal insulation material, luggage cases. Insulating materials made of polyurethane foam with varying
amounts of bio-based polyols and recycled materials;
polyurethane foam made of varying amounts of bio-based
polyols and recycled materials for insulation purposes;
unprocessed and semi-processed rubber, gutta-percha, gum,
asbestos, mica and substitutes for all these materials;
plastics and resins in extruded form for use in manufacture;
packing, stopping and insulating materials; flexible pipes,
tubes and hoses, not of metal; polymeric foam material in
sheet and roll form; plastic material in sheet and roll
form.
37.
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, CERAMIC ELEMENT AND METAL LAYER FOR SUCH A METHOD, AND METAL-CERAMIC SUBSTRATE PRODUCED BY SUCH A METHOD
A method for producing a metal-ceramic substrate (1), comprising – providing at least one first metal layer (10) for forming a component metallization and a ceramic element (30), – bonding the at least one first metal layer (10) to the ceramic element (30) by means of a direct bonding method, more particularly a DCB method or a DAB method, to form a common first bonding layer (12) between the ceramic element (30) and the at least one metal layer (10), a first agent for promoting formation of spinel being provided in a region intended for the formation of the first bonding layer (12) in order to improve adhesive strength between the at least one first metal layer (10) and the ceramic element (30) for the bonding by means of the direct bonding method.
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
38.
Y-TYPE HEXAFERRITE, METHOD OF MANUFACTURE, AND USES THEREOF
A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of
A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of
Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22
A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of
Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22
or
A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of
Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22
or
Ban-xSrxCo2-yCuyNizTizFe(m-2z)O22
A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of
Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22
or
Ban-xSrxCo2-yCuyNizTizFe(m-2z)O22
wherein 2≤n≤2.4. 0≤x≤1, 0.1≤y≤1, 0
H01F 1/34 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites
H01F 1/34 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites
C04B 35/26 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base de ferrites
H01F 1/36 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites sous forme de particules
H01F 1/37 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites sous forme de particules dans un liant
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
40.
METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC SUBSTRATE PRODUCED USING A METHOD OF THIS TYPE
A method of manufacturing a metal-ceramic substrate (1), comprising:
providing a ceramic element (30) and at least one metal layer (10), wherein the ceramic element (30) and the at least one metal layer (10) extend along a main extension plane (HSE); and
bonding the ceramic element (30) to the at least one metal layer (10) to form a metal-ceramic substrate (1), in particular by means of a direct metal bonding process, hot isostatic pressing and/or a soldering process,
wherein a structuring, preferably for forming an isolation of metal sections (10′), and/or a recess, preferably for forming a solder stop, is realized in the at least one metal layer (10) by means of a laser process and a chemical process, in particular an etching process.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
41.
METHOD FOR MACHINING A METAL-CERAMIC SUBSTRATE, SYSTEM FOR SUCH A METHOD AND METAL-CERAMIC SUBSTRATES PRODUCED USING SUCH A METHOD
A method of processing a metal-ceramic substrate (1), including
providing a metal-ceramic substrate (1), wherein the metal-ceramic substrate (1) comprises at least one metal layer (21) and one ceramic element (11), which extend along a main extension plane (HSE) and are arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE), and
forming a recess (15), in particular a through recess (15), in the metal-ceramic substrate (1) by processing by means of laser light (10), in particular of an ultrashort pulse (UKP) laser.
B23K 26/382 - Enlèvement de matière par perçage ou découpage par perçage
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
B23K 26/082 - Systèmes de balayage, c.-à-d. des dispositifs comportant un mouvement relatif entre le faisceau laser et la tête du laser
B23K 103/00 - Matières à braser, souder ou découper
B23K 103/18 - Matériaux comportant des matières différentes
42.
18H HEXAFERRITE, METHOD OF MANUFACTURE, AND USES THEREOF
H01F 1/34 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites
H01F 1/36 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites sous forme de particules
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
H01Q 7/06 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre avec un noyau en matière ferromagnétique
C04B 35/26 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base de ferrites
H01F 1/37 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites sous forme de particules dans un liant
C04B 35/26 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base de ferrites
C04B 35/626 - Préparation ou traitement des poudres individuellement ou par fournées
An antenna includes: a substrate having a magnetodielectric material; and, an electromagnetic, EM, radiator having an electrically conductive material disposed on an upper surface of the substrate, the EM radiator including a plurality of chamfered sides extending contiguously from one another to define an octagon-shaped EM radiator.
An antenna includes: a substrate having a magnetodielectric material; and, an electromagnetic, EM, radiator having an electrically conductive material disposed on an upper surface of the substrate, the EM radiator including a plurality of chamfered sides extending contiguously from one another to define an octagon-shaped EM radiator.
Printed circuit board (100) for electrical components (5) and/or conducting paths (4), comprising
a base body (2) extending along a main extension plane (HSE), and
an insert (1) integrated in the base body (2),
wherein the insert (1) comprises a metal-ceramic substrate (15), an electrical and/or electronic component (5), and an encapsulation (10) enclosing at least the electrical and/or electronic component (5).
A method for machining a metal-ceramic substrate (1), in particular for producing a predetermined breaking point, comprising:
providing a metal-ceramic substrate (1) and
forming a predetermined breaking point (7) in the metal-ceramic substrate (1) wherein the predetermined breaking point (7) has along a direction (V) thereof at least a first portion (A1) having a first depth (T1) and at least a second portion (A2) having a second depth (T2), wherein a second depth (T2) is realized, which is different from the first depth (T1).
A dielectric polarizer for electromagnetic applications, includes: a monolithic body of Dk material having a plurality of linear elongated ribs disposed parallel with each other; wherein each rib of the plurality of linear elongated ribs has a cross section x-z profile relative to an orthogonal X-Y-Z coordinate system; wherein the Y-direction of the coordinate system is oriented in a direction of elongation of the plurality of linear elongated ribs; wherein the Z-direction of the coordinate system is oriented in a direction of propagation of an EM wave through the uniformly spaced apart plurality of linear elongated ribs; wherein the monolithic body has an overall thickness dimension, T, aligned in the Z-direction, that extends from a first side to a second side of the body; wherein adjacent ones of the plurality of linear elongated ribs are monolithically connected to each other by a plurality of connecting bridges.
H01P 1/17 - Dispositifs auxiliaires pour faire tourner le plan de polarisation pour produire une rotation continue du plan de polarisation, p. ex. une polarisation circulaire
H01Q 15/12 - Dispositifs de réfraction ou diffraction, p. ex. lentille, prisme fonctionnant également comme filtre polarisant
A dielectric polarizer for electromagnetic applications, includes: a monolithic body of Dk material having a plurality of linear elongated ribs disposed parallel with each other; wherein each rib of the plurality of linear elongated ribs has a cross section x-z profile relative to an orthogonal X-Y-Z coordinate system; wherein the Y-direction of the coordinate system is oriented in a direction of elongation of the plurality of linear elongated ribs; wherein the Z-direction of the coordinate system is oriented in a direction of propagation of an EM wave through the uniformly spaced apart plurality of linear elongated ribs; wherein the monolithic body has an overall thickness dimension, T, aligned in the Z-direction, that extends from a first side to a second side of the body; wherein adjacent ones of the plurality of linear elongated ribs are monolithically connected to each other by a plurality of connecting bridges.
A dielectric structure useful for shaping electromagnetic, EM, phase wavefronts, includes: a body having a monolithic construct; the body having a height dimension, H, from a proximal end to a distal end equal to or less than 60% of an overall outside dimension, D, of the body at the distal end, the distal end being disposed a distance away from the proximal end along a z-axis of an orthogonal x-y-z coordinate system, the distal end forming an electromagnetic aperture of the structure; the body having a sidewall between the proximal end and the distal end that forms and defines an interior cavity that is open at the proximal end, and closed at the distal end, the sidewall having a plurality of structural disruptions around an enclosing boundary of the interior cavity, the plurality of structural disruptions disposed and configured to reduce electromagnetic reflections.
H01Q 15/08 - Dispositifs de réfraction ou diffraction, p. ex. lentille, prisme constitués par une matière diélectrique solide
H01Q 17/00 - Dispositifs pour absorber les ondes rayonnées par une antenneCombinaisons de tels dispositifs avec des éléments ou systèmes d'antennes actives
52.
DIELECTRIC STRUCTURE USEFUL FOR SHAPING ELECTROMAGNETIC PHASE WAVEFRONTS
A dielectric structure useful for shaping electromagnetic, EM, phase wavefronts, includes: a body having a monolithic construct; the body having a height dimension, H, from a proximal end to a distal end equal to or less than 60% of an overall outside dimension, D, of the body at the distal end, the distal end being disposed a distance away from the proximal end along a z-axis of an orthogonal x-y-z coordinate system, the distal end forming an electromagnetic aperture of the structure; the body having a sidewall between the proximal end and the distal end that forms and defines an interior cavity that is open at the proximal end, and closed at the distal end, the sidewall having a plurality of structural disruptions around an enclosing boundary of the interior cavity, the plurality of structural disruptions disposed and configured to reduce electromagnetic reflections.
An electromagnetic device includes: a substrate comprising an elongated aperture having an overall length, L, and an overall width, W, as observed in a plan view of the device, where L is greater than W; a dielectric medium comprising a dielectric material other than air disposed on the substrate substantially covering the aperture, the dielectric medium having a cross sectional boundary, as viewed in the plan view of the device, that is symmetrical with respect to an in-plane axis of reflection of the dielectric medium; wherein the device is configured such that a line perpendicular to the overall length L of the elongated aperture and passing through a center point of the elongated aperture is not any in-plane axis of reflection.
A thermally insulating multilayer sheet for preventing thermal runaway includes a nonporous elastomeric barrier layer having a first and a second opposed surface; a flexible foam layer disposed on the first surface of the barrier layer; and a flame retardant component, wherein the flame retardant component is distributed within the flexible foam layer, contacts a surface of the flexible foam layer, or both.
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
B32B 5/18 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par le fait qu'une des couches contient un matériau sous forme de mousse ou essentiellement poreux
B32B 25/04 - Produits stratifiés composés essentiellement de caoutchouc naturel ou synthétique comprenant du caoutchouc comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B32B 25/16 - Produits stratifiés composés essentiellement de caoutchouc naturel ou synthétique comprenant des polydiènes ou poly-halodiènes
B32B 25/18 - Produits stratifiés composés essentiellement de caoutchouc naturel ou synthétique comprenant du caoutchouc butyle ou halo-butyle
C08J 5/12 - Fixation d'un matériau macromoléculaire préformé au même matériau ou à un autre matériau compact, tel que du métal, du verre, du cuir, p. ex. en utilisant des adhésifs
Proposed is an electronics module (100), in particular a power electronics module, comprising - a metal-ceramic substrate (1) which serves as a carrier and has a ceramic element (10) and a primary component metallization (21) and preferably a cooling side metallization (20), - an insulation layer (40) which is directly or indirectly connected to the primary component metallization (21), and - a secondary component metallization (22), said secondary component metallization being connected to the side of the insulation layer (40) which faces away from the ceramic element (10) and in particular being insulated with respect to the primary component metallization (21) by the insulation layer (40), wherein the ceramic element (10) has a first size (L, D) and the insulation layer (40) has a second size (L1, D1), and wherein, to form an island-like insulation layer (40) on the primary component metallization (21), a ratio of the second size (L1, ID1) to the first size (L, D) has a value that is less than 0.4, preferably less than 0.22 and particularly preferably less than 0.15 or even less than 0.1, and wherein, as viewed in a direction running perpendicularly to the main plane of extent (HSE), an outer side (A) of the secondary component metallization (22) and an outer side (A) of the first component metallization (21) end substantially at a common height.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
An antenna includes a substrate and an electromagnetic, EM, radiator. The substrate includes a magnetodielectric material. The EM radiator includes an electrically conductive material disposed on an upper surface of the substrate. The EM radiator further includes a root, and a pair of forks that are contiguous with and extend from the root along a first axis. The pair of forks are separated from one another by a slot in the electrically conductive material of the EM radiator to define a fork-shaped EM radiator. The root includes a bridge portion extending between the pair of forks in a direction of a second axis perpendicular to the first axis to electrically connect together the pair of forks.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Microporous plastic material, namely, foams for use in further manufacture; low-density polyurethane with varying amounts of bio-based polyols and recycled materials Unprocessed and semi-processed rubber, gutta-percha, gum, asbestos, mica; plastics and resins in extruded form for use in manufacture; packing materials of rubber or plastics; flexible pipes, tubes and hoses, not of metal; insulating materials; Polymeric foam materials sold in sheet and roll form, for use by third party manufacturers; Plastic material in extruded sheet and roll form for use in production; Microporous plastic material, namely, foams for use in the manufacture of synthetic shoes and parts thereof; microporous plastic material, namely, foams used in the manufacture of various products, namely, insoles for shoes, thermal insulation material, luggage cases
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Microporous plastic material, namely, foams for use in further manufacture; low-density polyurethane with varying amounts of bio-based polyols and recycled materials Unprocessed and semi-processed rubber, gutta-percha, gum, asbestos, mica; plastics and resins in extruded form for use in manufacture; packing materials of rubber or plastics; flexible pipes, tubes and hoses, not of metal; insulating materials; Polymeric foam materials sold in sheet and roll form, for use by third party manufacturers; Plastic material in extruded sheet and roll form for use in production; Microporous plastic material, namely, foams for use in the manufacture of synthetic shoes and parts thereof; microporous plastic material, namely, foams used in the manufacture of various products, namely, insoles for shoes, thermal insulation material, luggage cases
61.
Photocurable compositions for stereolithography, method of forming the compositions, stereolithography methods using the compositions, polymer components formed by the stereolithography methods, and a device including the polymer components
A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.
C08F 2/46 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire
B29C 64/106 - Procédés de fabrication additive n’utilisant que des matériaux liquides ou visqueux, p. ex. dépôt d’un cordon continu de matériau visqueux
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08F 20/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
C08G 61/04 - Composés macromoléculaires contenant uniquement des atomes de carbone dans la chaîne principale de la molécule, p. ex. polyxylylènes uniquement des atomes de carbone aliphatiques
A substrate includes a monolithic structure formed from a dielectric material having a first side, a second side, and an intermediate region between the first side and the second side, and the intermediate region has a lattice structure of the dielectric material having a plurality of interstitial spaces between the dielectric material of the lattice structure. The lattice structure extends between and monolithically connects with the first side and the second side, wherein at least one of the first side and the second side has a substantially solid surface suitably configured to support one or more of electronic circuit imaging, electroplating, metal deposition, or, vias between the first side and the second side.
In an aspect, a method of forming a coating on a busbar comprises cold spraying a powder comprising a plurality of metal particles onto the busbar at a velocity sufficiently high to cause the plurality of metal particles to deform upon contact with the busbar thereby forming the coating on the busbar; wherein the plurality of metal particles comprises greater than or equal to 50 weight percent of at least one of nickel, tin, silver, zinc, or copper based on the total weight of the metal particles; and wherein the coating has an average thickness of greater than or equal to 10 micrometers. In another aspect, a coated busbar is formed by cold spraying.
In an aspect, a method of forming a coating on a busbar comprises cold spraying a powder comprising a plurality of metal particles onto the busbar at a velocity sufficiently high to cause the plurality of metal particles to deform upon contact with the busbar thereby forming the coating on the busbar; wherein the plurality of metal particles comprises greater than or equal to 50 weight percent of at least one of nickel, tin, silver, zinc, or copper based on the total weight of the metal particles; and wherein the coating has an average thickness of greater than or equal to 10 micrometers. In another aspect, a coated busbar is formed by cold spraying.
C23C 24/08 - Revêtement à partir de poudres inorganiques en utilisant la chaleur ou une pression et la chaleur
C23C 28/02 - Revêtements uniquement de matériaux métalliques
C23C 30/00 - Revêtement avec des matériaux métalliques, caractérisé uniquement par la composition du matériau métallique, c.-à-d. non caractérisé par le procédé de revêtement
H01R 4/00 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c.-à-d. se touchant l'un l'autreMoyens pour réaliser ou maintenir de tels contactsConnexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation
65.
Y-TYPE HEXAFERRITE, METHOD OF MANUFACTURE, AND USES THEREOF
H01F 1/11 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs substances non métalliques, p. ex. ferrites sous forme de particules
H01F 1/34 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites
66.
Y-TYPE HEXAFERRITE, METHOD OF MANUFACTURE, AND USES THEREOF
In an aspect, a Co2Y-type ferrite includes oxides of at least Ba, La, Co, Me, Fe, and optionally Ca; wherein Me is at least Ni and optionally one or more of Zn, Cu, Mn, or Mg. A composite can include the Co2Y-type ferrite and a polymer. An article can include the Co2Y-type ferrite.
In an aspect, an M-type ferrite comprises an element Me comprising at least one of Ba, Sr, or Pb; an element Me′ comprising at least one of Ti, Zr, Ru, or Ir; and an element Me″ comprising at least one of In or Sc. In another aspect, a method of making the M-type ferrite can comprise milling ferrite precursor compounds comprising oxides of at least Co, Fe, Me, M3′, and Me″ to form an oxide mixture; wherein Me comprises at least one of Ba, Sr, or Pb; Me′ is at least one of Ti, Zr, Ru, or Ir; and Me″ is at least one of In or Sc; and calcining the oxide mixture in an oxygen or air atmosphere to form the ferrite.
H01F 1/34 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites
68.
M-TYPE HEXAFERRITE COMPRISING A LOW DIELECTRIC LOSS CERAMIC
In an aspect, an M-type ferrite, comprises oxides of Me, Me′, Me″, Co, Ti, and Fe; wherein Me is at least one of Ba, Sr, or Pb; Me′ is at least one of Ti, Zr, Ru, or Ir; and Me″ is at least one of Mg or Ca. In another aspect, a method of making an M-type ferrite comprises milling ferrite precursor compounds comprising oxides of at least Co, Fe, Ti, Me, Me′, and Me″, to form an oxide mixture; wherein Me comprises at least one of Ba, Sr, or Pb; Me′ is at least one of Ti, Zr, Ru, or Ir; and Me″ is at least one of Mg or Ca; and calcining the oxide mixture in an oxygen or air atmosphere to form the M-type ferrite.
H01F 1/34 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites
C04B 35/26 - Produits céramiques mis en forme, caractérisés par leur compositionCompositions céramiquesTraitement de poudres de composés inorganiques préalablement à la fabrication de produits céramiques à base d'oxydes à base de ferrites
In an aspect, an R-type ferrite has the formula: Me′3Me2TiFe12O25, wherein Me′ is at least one of Ba2+ or Sr2+ and Me is at least one of Co2+, Mg2+, Cu2+, or Zn2+. In another aspect, a composite or an article comprises the R-type ferrite. In yet another aspect, a method of making a R-type ferrite comprises milling ferrite precursor compounds comprising oxides of at least Fe, Ti, Me, and Me′, to form an oxide mixture; wherein Me′ comprises at least one of Ba2+ or Sr2+; Me is at least one of Co2+, Mg2+, Cu2+, or Zn2+; and calcining the oxide mixture in an oxygen or air atmosphere to form the R-type ferrite.
H01F 1/34 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux substances non métalliques, p. ex. ferrites
In an aspect, a cap liner comprises a sintered fluoropolymer layer; and a backing layer; wherein the sintered fluoropolymer layer is in direct physical contact with the backing layer with no intervening layer located there between. In another aspect, a method of forming the cap liner of comprises plasma etching the sintered fluoropolymer layer to form a sintered plasma etched layer; and laminating the sintered plasma etched layer and the backing layer to form the cap liner.
B65D 41/04 - Capuchons ou couvercles en forme de capuchons filetés ou similaires, fixés par rotation
B32B 27/06 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B32B 27/32 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyoléfines
B65D 53/06 - Étanchéité réalisée par matériaux liquides ou plastiques
71.
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
The invention relates to a printed circuit board (100) for electrical components (5) and/or conductor tracks (4), comprising - a base body (2) which extends along a main extension plane (HSE), and - an insert (1) which, in a mounted state, is integrated into the base body (2), wherein the insert (1) is a metal-ceramic substrate (10), wherein the metal-ceramic substrate (1) is at least in some sections covered, in particular surrounded, by an insulation element (8) on a side surface (SF) facing the main body (2) in the mounted state.
The present invention relates to a method for producing a metal-ceramic substrate (1) comprising: —providing a ceramic element (30) and at least one metal layer (10), wherein the ceramic element (30) and the at least one metal layer (10) extend along a main extension plane (HSE), —joining the ceramic element (30) to the at least one metal layer (10) to form a metal-ceramic substrate (1), in particular by means of a direct metal joining method, a hot isostatic pressing method and/or a soldering method, and —machining the at least one metal layer (10) by means of a machine tool (40) and/or laser light in order to define a geometry, at least in some portions, of a side face (15) of the at least one metal layer (10) not running parallel to the main extension plane (HSE).
B23K 26/402 - Enlèvement de matière en tenant compte des propriétés du matériau à enlever en faisant intervenir des matériaux non métalliques, p. ex. des isolants
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
B23K 26/38 - Enlèvement de matière par perçage ou découpage
73.
PROCESS FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND A METAL-CERAMIC SUBSTRATE PRODUCED USING SUCH A METHOD
The invention relates to a process for producing a metal-ceramic substrate (1), comprising: —providing a ceramic element (10), a metal ply (40) and at least one metal layer (30), —forming an ensemble (18) of the ceramic element (10), the metal ply (40) and the at least one metal layer (30), —forming a gas-tight container (30) surrounding the ceramic element (10), wherein the at least one metal layer (30) is arranged between the ceramic element (10) and the metal ply (40) in the container, and—forming the metal-ceramic substrate (1) by hot isostatic pressing.
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
74.
METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE
The invention relates to a metal-ceramic substrate (1) as carrier for electric components, in particular in the form of a printed circuit board, comprising: - a ceramic element (20) and - at least one metal layer (10, 20), wherein the at least one metal layer (10) and the ceramic element (20) extend along a main extension plane (HSE) and are arranged one above the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein a binding layer (12) is formed between the at least one metal layer (10, 20) and the ceramic element (30) in the manufactured metal-ceramic substrate (1), and wherein an adhesion promoter layer of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq, preferably greater than 10 Ohm/sq, particularly preferably greater than 20 Ohm/sq, wherein a via (15) is formed in the ceramic element (30).
A thermally conductive phase-change composition includes a mixture of 5 to 25 weight percent thermoplastic polymer; 20 to 45 weight percent phase-change material; and 30 to 65 weight percent thermally conductive particles, wherein weight percent is based on the total weight of the composition and totals 100 weight percent, and wherein thermal conductivity of the composition is at least 3.0 W/m-K at a temperature below the transition temperature of the phase change material and thermal conductivity of the composition is at least 2.0 W/m-K at a temperature above the transition temperature of the phase change material, wherein thermal conductivity is determined in accordance with ASTM E1530. The phase-change compositions are reworkable and can be easily and cleanly removed from a device for maintenance and repair and repositioned without causing damage to the device.
C09K 5/06 - Substances qui subissent un changement d'état physique lors de leur utilisation le changement d'état se faisant par passage de l'état liquide à l'état solide, ou vice versa
C08K 13/04 - Ingrédients caractérisés par leur forme et ingrédients organiques ou inorganiques
C08J 3/21 - Formation de mélanges de polymères avec des additifs, p. ex. coloration en présence d'une phase liquide le polymère étant prémélangé avec une phase liquide
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
76.
THERMOSET COMPOSITE COMPRISING A CROSSLINKED IMIDE EXTENDED COMPOUND
In an aspect, a thermosettable composition comprises an imide extended compound and a reactive monomer that is free-radically crosslinkable with the reactive end groups of the imide extended compound to produce a crosslinked network. A thermoset composite can be derived from the thermosettable composition and a multilayer article can include the thermoset composite in the form of a layer. The article can be an antenna, a bond ply, a semiconductor substrate build-up/redistribution layer dielectric film, a circuit board, resin-coated-copper (RCC), or a flexible core.
In an aspect, a thermosettable composition comprises an imide extended compound and a reactive monomer that is free-radically crosslinkable with the reactive end groups of the imide extended compound to produce a crosslinked network. A thermoset composite can be derived from the thermosettable composition and a multilayer article can include the thermoset composite in the form of a layer. The article can be an antenna, a bond ply, a semiconductor substrate build-up/redistribution layer dielectric film, a circuit board, resin-coated-copper (RCC), or a flexible core.
C08G 73/12 - Précurseurs de polyimides non saturés
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
C09D 4/06 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/029 - Composés inorganiquesComposés d'oniumComposés organiques contenant des hétéro-atomes autres que l'oxygène, l'azote ou le soufre
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
78.
METHOD FOR THE MANUFACTURE OF A SPATIALLY VARYING DIELECTRIC MATERIAL, ARTICLES MADE BY THE METHOD, AND USES THEREOF
A stereolithography method of manufacture of a polymer structure having a spatially gradient dielectric constant, including: providing a volume of a liquid, radiation-curable composition; irradiating a portion of the liquid, radiation-curable composition with activating radiation in a pattern to form a layer of the polymer structure; contacting the layer with the liquid, radiation-curable composition; irradiating the liquid, radiation-curable composition with activating radiation in a pattern to form a second layer on the first layer; and repeating the contacting and irradiating to form the polymer structure, wherein the polymer structure comprises a plurality of unit cells wherein each unit cell is integrally connected with an adjacent unit cell, each unit cell is defined by a plurality of trusses formed by the irradiation, wherein the trusses are integrally connected with each other at their respective ends, and the trusses of each unit cell are dimensioned to provide the spatially gradient dielectric constant.
B29C 64/124 - Procédés de fabrication additive n’utilisant que des matériaux liquides ou visqueux, p. ex. dépôt d’un cordon continu de matériau visqueux utilisant des couches de liquide à solidification sélective
79.
CARRIER SUBSTRATE FOR ELECTRICAL COMPONENTS, AND METHOD FOR PRODUCING SUCH A CARRIER SUBSTRATE
The invention relates to a carrier substrate (1) for electrical components (4), comprising: - a heat sink (20), and - a ceramic element (71), wherein the ceramic element (71) is bonded at least in some sections to the heat sink (20), wherein in the finished carrier substrate (1) a bonding layer without solder material is formed between the heat sink (20) and the ceramic element (71), and wherein an adhesion promoter layer of the bonding layer has a sheet resistance greater than 5 ohms/square, preferably greater than 10 ohms/square and particularly preferably greater than 20 ohms/square.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H01S 5/024 - Dispositions pour la gestion thermique
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p. ex. d'air
80.
CARRIER ELEMENT FOR ELECTRICAL COMPONENTS, AND METHOD FOR PRODUCING A CARRIER ELEMENT OF THIS TYPE
The invention relates to a carrier element (1) for electrical components (4), wherein the carrier element (1) comprises a metal cooling body (20) for dissipating heat emitted by the electrical component during operation, wherein the cooling body (20) has a metal grain size distribution with an average grain size, wherein the average grain size is in the region of between 10 and 800 μm, preferably between 100 and 700 μm, and particularly preferably between 300 und 600 μm, characterised in that the cooling body (20) comprises an oxide-containing corrosion-protection layer (30) at least in sections.
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
F28F 19/02 - Prévention de la formation de dépôts ou de la corrosion, p. ex. en utilisant des filtres en utilisant des revêtements, p. ex. des revêtements vitreux ou émaillés
H01S 5/024 - Dispositions pour la gestion thermique
81.
Support substrate and method for producing a support substrate
A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
82.
Process for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic Substrate Produced Using Such Method
The invention relates to a process for producing a metal-ceramic substrate (1), comprising:
providing a ceramic element (10) and a metal layer,
providing a gas-tight container (25) that encloses the ceramic element (10), the container (25) preferably being formed from the metal layer or comprising the metal layer,
forming the metal-ceramic substrate (1) by connecting the metal layer to the ceramic element (10) by means of hot isostatic pressing, wherein, for the purpose of forming the metal-ceramic substrate (1), an active metal layer (15) or a contact layer comprising an active metal is arranged at least in some sections between the metal layer and the ceramic element (10) for supporting the connection of the metal layer to the ceramic element (10).
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
C04B 37/02 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles métalliques
09 - Appareils et instruments scientifiques et électriques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Circuit materials in the nature of connectors for electronic circuits, electric circuit closers, electric circuit openers, electric circuit switches, electrical circuit boards, electronic circuit cards, and electronic integrated circuits. Circuit materials in the nature of insulating and protective interlayer dielectric materials and coatings for use in integrated circuits; electronic circuit materials in the nature of polymer composite used for manufacturing electronic circuits; polymer matrix, ceramic particles, and woven glass fabric reinforced substrates for fabricating electronic circuits.
84.
FILLED SILICONE FOAM LAYER, COMPOSITIONS AND METHODS FOR THEIR MANUFACTURE, AND ARTICLES INCLUDING THE FILLED SILICONE FOAM LAYER
A very thin filled silicone foam layer is formed from a composition that includes a curable polysiloxane composition including an alkenyl-substituted polyorganosiloxane, a hydride-substituted polyorganosiloxane, and a cure catalyst; a plurality of expanded polymer microspheres having a largest dimension of less than the thickness of the foam; and a filler composition, wherein each component of the filler composition has a largest dimension of less than the thickness of the foam, the filler composition comprising a particulate ceramic filler, a particulate calcium carbonate filler, or a particulate aluminosilicate clay filler having a plate morphology, or a particulate aluminosilicate clay filler having a hollow tubular morphology, a particulate polymeric silsesquioxane filler, or a particulate methyl-phenyl MQ filler, or a plurality of glass microspheres, or a particulate paraffin wax, or a combination thereof; wherein the curable filled composition has a viscosity of less than 400,000 centiStokes, or 100,000 to 350,000 centiStokes.
C08J 9/00 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement
C08G 77/08 - Procédés de préparation caractérisés par les catalyseurs utilisés
C08G 77/12 - Polysiloxanes contenant du silicium lié à l'hydrogène
C08G 77/20 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
C08G 77/00 - Composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant du silicium, avec ou sans soufre, azote, oxygène ou carbone
85.
FLAME RETARDANT MULTILAYER MATERIAL, METHOD OF MANUFACTURE, AND USES THEREOF
A multilayer material, including a compressible polymer foam layer, wherein the compressible polymer foam layer has a density of less than 400 kg/m3, a compression force deflection of 5 to 1,035 kPa at 25% deflection determined in accordance with ASTM D3574-17, and a thickness of less than 3.5 millimeters; and a solid, polymeric flame retardant layer disposed on a first side of the compressible polymer foam layer, wherein the flame retardant layer has a thickness of less than 0.3 millimeters, wherein the thickness of the compressible polymer foam layer is at least two times greater than the thickness of the flame retardant layer; wherein each of the compressible polymer foam layer and the flame retardant layer includes a flame retardant composition, and wherein the multilayer material has a thickness of 3.5 millimeters or less, and a UL-94 rating of V1, preferably V0, HF1, or a combination thereof.
B32B 5/18 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par le fait qu'une des couches contient un matériau sous forme de mousse ou essentiellement poreux
B32B 5/20 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par le fait qu'une des couches contient un matériau sous forme de mousse ou essentiellement poreux la structure sous forme de mousse étant réalisée sur place
B32B 27/06 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B32B 27/36 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyesters
86.
FLAME RETARDANT MULTILAYER MATERIAL, METHOD OF MANUFACTURE, AND USES THEREOF
A multilayer material, including a first polymer foam layer having a density of less than 481 kg/m3, a compression force deflection of 5 to 1,035 kPa, at 25% deflection determined in accordance with ASTM D3574-17, and a thickness of less than 3.5 millimeters; and a second polymer foam layer having a density of greater than 240 kg/m3, wherein the density of the second polymer foam layer is at least two times greater than the density of the first polymer foam layer, and a thickness of less than 0.3 millimeters, wherein the thickness of the first polymer foam layer is at least two times greater than the thickness of the second polymer foam layer; wherein the first polymer foam layer and the second polymer foam layer include a flame retardant composition, and wherein the multilayer material has a thickness of 3.5 millimeters or less, and a UL-94 rating of V1.
B32B 5/18 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par le fait qu'une des couches contient un matériau sous forme de mousse ou essentiellement poreux
B32B 5/20 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par le fait qu'une des couches contient un matériau sous forme de mousse ou essentiellement poreux la structure sous forme de mousse étant réalisée sur place
B32B 5/32 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses les deux couches étant sous forme de mousse ou essentiellement poreuses
87.
FILLED SILICONE FOAM LAYER, COMPOSITIONS AND METHODS FOR THEIR MANUFACTURE, AND ARTICLES INCLUDING THE FILLED SILICONE FOAM LAYER
A very thin filled silicone foam layer is formed from a composition that includes a curable polysiloxane composition including an alkenyl-substituted polyorganosiloxane, a hydride-substituted polyorganosiloxane, and a cure catalyst; a plurality of expanded polymer microspheres having a largest dimension of less than the thickness of the foam; and a filler composition, wherein each component of the filler composition has a largest dimension of less than the thickness of the foam, the filler composition comprising a particulate ceramic filler, a particulate calcium carbonate filler, or a particulate aluminosilicate clay filler having a plate morphology, or a particulate aluminosilicate clay filler having a hollow tubular morphology, a particulate polymeric silsesquioxane filler, or a particulate methyl-phenyl MQ filler, or a plurality of glass microspheres, or a particulate paraffin wax, or a combination thereof; wherein the curable filled composition has a viscosity of less than 400,000 centiStokes, or 100,000 to 350,000 centiStokes.
C08J 9/00 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement
C08J 9/32 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement à partir de compositions contenant des microbilles, p. ex. mousses syntactiques
09 - Appareils et instruments scientifiques et électriques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Circuit materials in the nature of connectors for electronic circuits, electric circuit closers, electric circuit openers, electric circuit switches, electrical circuit boards, electronic circuit cards, and electronic integrated circuits Circuit materials in the nature of insulating and protective
interlayer dielectric materials and coatings for use in
integrated circuits; electronic circuit materials in the
nature of polymer composite used for manufacturing
electronic circuits; polymer matrix, ceramic particles, and
woven glass fabric reinforced substrates for fabricating
electronic circuits
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
07 - Machines et machines-outils
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Adhesives for printed circuit boards and heat sink bonding
applications; adhesives for commercial and industrial use,
namely, transfer adhesives. Non-metal mechanical seals being machine parts for use in
automotive applications, namely, for reducing noise,
friction, and wear among automotive parts. Polytetrafluoroethylene (PTFE) films and tapes for
industrial and commercial use; ultra high molecular weight
polyethylene (UHMW-PE) films for industrial and commercial
use; fluoropolymer films and tapes for industrial and
commercial use; polyolefin films and tapes for industrial
and commercial use; adhesive tapes for industrial and
commercial use; pressure sensitive adhesive tapes for
industrial and commercial use; plastic and glass fiber
fabric tape substrates primarily of non-metals for
industrial and commercial use; electrical insulation tapes;
plastic film laminates for use in the manufacture of
electronic wires and cables, electrical circuit materials,
microwave circuit materials, gaskets, seals, diaphragms,
expansion joints, filters, release liners, adhesive tapes,
and battery and fuel cell separators; non-metal laminates
for use in the manufacture of electronic wires and cables,
electrical circuit materials, microwave circuit materials,
gaskets, seals, diaphragms, expansion joints, filters,
release liners, adhesive tapes, and battery and fuel cell
separators; low friction wear reduction coatings in the
nature of polytetrafluoroethylene (PTFE) films and tapes for
industrial and commercial use; bearing and seal compounds
and materials for industrial and commercial use; sealing
materials; stuffing materials of rubber or plastics and
non-metal seals for industrial and commercial use.
90.
Flame retardant multilayer material, method of manufacture, and uses thereof
3, wherein the density of the second polymer foam layer is at least two times greater than the density of the first polymer foam layer, and a thickness of less than 0.3 millimeters, wherein the thickness of the first polymer foam layer is at least two times greater than the thickness of the second polymer foam layer; wherein the first polymer foam layer and the second polymer foam layer include a flame retardant composition, and wherein the multilayer material has a thickness of 3.5 millimeters or less, and a UL-94 rating of V1.
B32B 5/32 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses les deux couches étant sous forme de mousse ou essentiellement poreuses
B32B 5/18 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par le fait qu'une des couches contient un matériau sous forme de mousse ou essentiellement poreux
B32B 7/02 - Propriétés physiques, chimiques ou physicochimiques
B32B 37/20 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches toutes les couches existant et présentant une cohésion avant la stratification impliquant uniquement l'assemblage de bandes continues
B32B 38/00 - Opérations auxiliaires liées aux procédés de stratification
91.
FLAME RETARDANT MULTILAYER MATERIAL, METHOD OF MANUFACTURE, AND USES THEREOF
A multilayer material, including a compressible polymer foam layer, wherein the compressible polymer foam layer has a density of less than 400 kg/m3, a compression force deflection of 5 to 1,035 kPa at 25% deflection determined in accordance with ASTM D3574-17, and a thickness of less than 3.5 millimeters; and a solid, polymeric flame retardant layer disposed on a first side of the compressible polymer foam layer, wherein the flame retardant layer has a thickness of less than 0.3 millimeters, wherein the thickness of the compressible polymer foam layer is at least two times greater than the thickness of the flame retardant layer; wherein each of the compressible polymer foam layer and the flame retardant layer includes a flame retardant composition, and wherein the multilayer material has a thickness of 3.5 millimeters or less, and a UL-94 rating of V1, preferably V0, HF1, or a combination thereof.
B32B 27/06 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B32B 5/18 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par le fait qu'une des couches contient un matériau sous forme de mousse ou essentiellement poreux
B32B 27/36 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyesters
92.
METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE
Metal-ceramic substrate (1), which is provided as a printed circuit board for mounting electrical components, comprising: - a component metallization (10) and a backside metallization (20) and - a ceramic element (30), which is arranged between the component metallization (10) at the backside metallization (20) along a stacking direction (S), wherein the component metallization (10) has a first metal portion (11) and a second metal portion (12), wherein the first metal portion (11) and the second metal portion (12) are separated from one another by an insulating portion (15), and wherein the backside metallization (20) has a material weakening (25), in particular a material cut-out, which, seen in the stacking direction (S), is arranged congruent with the insulating portion (15).
wherein the ceramic element (10) has a first size (L1, D1) and the insulation layer (40) has a second size (L2, D2) and a ratio of the second size (L2, D2) to the first size (L1, D1) has a value smaller than 0.8, to form an island-like insulation layer (40) on the primary component metallization (21).
A dual band antenna includes a substrate having a magnetodielectric material, and an electrically conductive patch disposed on the substrate, wherein the patch has at least one in-plane cutout having an H-shape or an I-shape, as observed in a plan view of the patch.
A dual band antenna includes a substrate having a magnetodielectric material, and an electrically conductive patch disposed on the substrate, wherein the patch has at least one in-plane cutout having an H-shape or an I-shape, as observed in a plan view of the patch.
A waveguide antenna system, includes: an electromagnetic, EM, transition portion having a transition region having a signal feed interface and an open waveguide section, the EM transition portion configured to couple EM energy from the signal feed interface to a guided waveguide mode of EM energy to the open waveguide section via the transition region; and a leaky waveguide antenna portion configured and disposed to radiate electromagnetic energy received from the open waveguide section; wherein the EM transition portion is electromagnetically coupled to the leaky waveguide antenna portion, the EM transition portion being configured to support a transfer of electromagnetic energy from a signal feed structure to the leaky waveguide antenna portion.
H01P 3/123 - Guides d'ondes creux présentant une section complexe ou en forme d'échelons, p. ex. guides d'ondes striés ou rainurés
H01P 5/107 - Transitions entre guides d'ondes creux triplaque
H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets
H01Q 13/20 - Antennes constituées par un guide non résonnant à ondes de fuite ou une ligne de transmissionStructures équivalentes produisant un rayonnement le long du trajet de l'onde guidée
An electromagnetic, EM, apparatus, includes: a first portion having an EM signal feed; and a second portion disposed on the first portion, the second portion having a shaped metallized form having at least one shaped metallized cavity, the second portion further having a dielectric medium disposed within each of the at least one shaped metallized cavity such that respective ones of the dielectric medium has a 3D shape that conforms to a shape of a corresponding one of the at least one shaped metallized cavity.
H01Q 21/06 - Réseaux d'unités d'antennes, de même polarisation, excitées individuellement et espacées entre elles
H01Q 19/08 - Combinaisons d'éléments actifs primaires d'antennes avec des dispositifs secondaires, p. ex. avec des dispositifs quasi optiques, pour donner à une antenne une caractéristique directionnelle désirée utilisant des dispositifs de réfraction ou de diffraction, p. ex. lentilles pour modifier le diagramme de rayonnement d'un cornet rayonnant dans lequel il est disposé
H01P 3/123 - Guides d'ondes creux présentant une section complexe ou en forme d'échelons, p. ex. guides d'ondes striés ou rainurés
H01P 5/103 - Transitions entre guides d'ondes creux et lignes coaxiales
An electromagnetic, EM, apparatus, includes: a first portion having an EM signal feed; and a second portion disposed on the first portion, the second portion having a shaped metallized form having at least one shaped metallized cavity, the second portion further having a dielectric medium disposed within each of the at least one shaped metallized cavity such that respective ones of the dielectric medium has a 3D shape that conforms to a shape of a corresponding one of the at least one shaped metallized cavity.
A waveguide antenna system, includes: an electromagnetic, EM, transition portion having a transition region having a signal feed interface and an open waveguide section, the EM transition portion configured to couple EM energy from the signal feed interface to a guided waveguide mode of EM energy to the open waveguide section via the transition region; and a leaky waveguide antenna portion configured and disposed to radiate electromagnetic energy received from the open waveguide section; wherein the EM transition portion is electromagnetically coupled to the leaky waveguide antenna portion, the EM transition portion being configured to support a transfer of electromagnetic energy from a signal feed structure to the leaky waveguide antenna portion.
A coated separator includes a porous separator base material including a porous polymer film; a first coating layer including electrochemically stable thermoplastic polymer particles disposed on a first surface of the porous separator base material, wherein the electrochemically stable thermoplastic polymer particles have a melting temperature of 90 to 135° C.; and a second coating layer including ceramic particles having an average particle size of greater than 100 nanometers; wherein the second coating layer is disposed on the first coating layer on a side opposite the porous separator base material; or the second coating layer is disposed on the porous separator base material on a second side opposite first coating layer; or the first coating layer and the second coating layer are combined to form an intermixed coating layer disposed on the first surface of the porous separator base material. Electrochemical cells, a device including an electrochemical cell, and a method of making the coated separator are also described.
H01M 50/451 - Séparateurs, membranes ou diaphragmes caractérisés par le matériau ayant une structure en couches comprenant des couches de matériau organique uniquement et des couches comprenant un matériau inorganique
H01M 50/414 - Résines synthétiques, p. ex. thermoplastiques ou thermodurcissables
