Samtec, Inc.

United States of America

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New (last 4 weeks) 3
2025 June (MTD) 4
2025 May 5
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IPC Class
G02B 6/42 - Coupling light guides with opto-electronic elements 67
H01R 12/71 - Coupling devices for rigid printing circuits or like structures 47
H01L 23/498 - Leads on insulating substrates 30
H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures 28
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or 23
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NICE Class
09 - Scientific and electric apparatus and instruments 90
42 - Scientific, technological and industrial services, research and design 21
35 - Advertising and business services 12
40 - Treatment of materials; recycling, air and water treatment, 5
41 - Education, entertainment, sporting and cultural services 1
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Pending 68
Registered / In Force 440
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1.

SOLUTIONATOR

      
Application Number 1862350
Status Registered
Filing Date 2025-03-28
Registration Date 2025-03-28
Owner Samtec Inc. (USA)
NICE Classes  ? 42 - Scientific, technological and industrial services, research and design

Goods & Services

Computer services, namely, hosting an interactive web site that features technology that allows users to design their own cable assemblies and interconnects for use with board-to-board systems, cable systems, power systems, optical systems, and radio frequency (RF) systems customized to user-defined specifications.

2.

FLEXIBLE CABLES AND WAVEGUIDES

      
Application Number 18851897
Status Pending
Filing Date 2023-03-31
First Publication Date 2025-06-26
Owner SAMTEC, INC. (USA)
Inventor
  • Garrison, Kelly
  • Epitaux, Marc
  • Mcmorrow, Norman Scott
  • Baril, Sean
  • Chuganey, Shashi Vashi
  • Moss, James Alexander

Abstract

A signal transmission line, such as a waveguide or electrical cable, can include a spacer that bears against an electrical shield so as to provide enhanced structurally stability and increased signal integrity performance. The waveguide can be a hollow or semi-hollow waveguide. The electrical cable can be a coaxial or twinaxial electrical cable.

IPC Classes  ?

  • H01P 3/16 - Dielectric waveguides, i.e. without a longitudinal conductor

3.

SEALED OPTICAL TRANSCEIVER

      
Application Number 19059840
Status Pending
Filing Date 2025-02-21
First Publication Date 2025-06-12
Owner SAMTEC, INC. (USA)
Inventor
  • Puffer, Matthew Brian
  • Lee, Raymond
  • Bettman, R. Brad
  • Loy, Edwin
  • Seville-Jones, Dyan
  • Martin, Arlon
  • Girlando, Stephen Michael
  • Bandfield, Christopher Alan

Abstract

This present disclosure seals the light propagation path in an optical interconnection element from external contaminants. The optical interconnection element includes a reflective surface, which can also be sealed from external contaminants. Additional novel concepts include all enclosed sealed regions of the optical interconnection element being fluidly connected and making the final seal of the optical interconnection element with a thin plate, which can bend reducing the pressure differential between the ambient environment and the sealed internal volume of the optical interconnection element.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements

4.

INTERCONNECTION SYSTEM, CASE ASSEMBLY, ELECTRICAL CONNECTOR, ASSEMBLY AND CONNECTOR ASSEMBLY USING DETACHABLE, CABLED FRONT-PANEL CONNECTOR

      
Application Number 19042313
Status Pending
Filing Date 2025-01-31
First Publication Date 2025-06-05
Owner Samtec, Inc. (USA)
Inventor
  • Kozlovsky, Christina
  • Shah, Jignesh H.
  • Zbinden, Eric J.

Abstract

An interconnection system is configured to be carried by a substrate and includes a cage that is configured to be connected to the substrate, that includes a first end and a second end opposed to the first end, and that is configured to receive an interconnection module; and an electrical connector located at the second end of the cage. The electrical connector includes a fixed connector that is configured to be rigidly attached to the substrate and a detachable connector that is configured to be mated and unmated from the fixed connector.

IPC Classes  ?

  • H01R 12/70 - Coupling devices
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
  • H01R 13/6583 - Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
  • H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving

5.

IMPEDANCE CONTROLLED ELECTRICAL CONTACT

      
Application Number 19030281
Status Pending
Filing Date 2025-01-17
First Publication Date 2025-05-22
Owner SAMTEC, INC. (USA)
Inventor
  • Clyatt, Iii, Clarence L.
  • Ellis, Travis

Abstract

A radio frequency (RF) electrical contact includes an electrical contact having a stationary electrical contact member and a movable electrical contact member that is received by the stationary electrical contact member. The movable electrical contact member is movable between an initial position and a mated position. The movable electrical contact member can contact the stationary electrical contact member at a stationary or fixed contact location.

IPC Classes  ?

  • H01R 24/44 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches comprising impedance matching means
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
  • H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only

6.

DATA COMMUNICATION SYSTEM

      
Application Number 19027626
Status Pending
Filing Date 2025-01-17
First Publication Date 2025-05-15
Owner SAMTEC, INC. (USA)
Inventor
  • Zbinden, Eric
  • Shah, Jignesh H.

Abstract

A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • H01R 13/187 - Pins, blades or sockets having separate spring member for producing or increasing contact pressure the spring member being in the socket

7.

ELECTRICAL CONNECTOR HAVING LEADFRAME ASSEMBLIES SEPARATED BY AIR GAPS

      
Application Number 18833466
Status Pending
Filing Date 2023-01-27
First Publication Date 2025-05-08
Owner SAMTEC, INC. (USA)
Inventor
  • Musser, Randall Eugene
  • Buck, Jonathan E.
  • Rengarajan, Madhumitha

Abstract

An electrical connector includes a connector housing that supports a plurality of leadframe assemblies that include a ground plate and a signal wafer that abuts the ground plate. The signal wafer of one leadframe assembly is spaced from the ground plate of an adjacent signal wafer so as to define an air gap therebetween. A housing portion defines at least one, at least two, at least three or three or more discrete, adjustable skew correction areas, skew voids or respective air voids.

IPC Classes  ?

  • H01R 13/6587 - Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • H01R 13/6477 - Impedance matching by variation of dielectric properties

8.

ELECTRICAL CABLE WITH DIELECTRIC FOAM

      
Application Number 19018034
Status Pending
Filing Date 2025-01-13
First Publication Date 2025-05-08
Owner SAMTEC, INC. (USA)
Inventor
  • Chuganey, Shashi
  • Sasaki, Yasuo
  • Mcmorrow, Scott
  • Noyola, Francisco
  • Diegel, Cindy Lee
  • Moss, James Alexander

Abstract

Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.

IPC Classes  ?

  • H01B 11/18 - Coaxial cablesAnalogous cables having more than one inner conductor within a common outer conductor
  • H01B 7/02 - Disposition of insulation
  • H01B 7/08 - Flat or ribbon cables
  • H01B 7/18 - Protection against damage caused by external factors, e.g. sheaths or armouring by wear, mechanical force or pressure
  • H01B 7/22 - Metal wires or tapes, e.g. made of steel
  • H01B 11/00 - Communication cables or conductors
  • H01B 11/20 - Cables having a multiplicity of coaxial lines
  • H01P 3/06 - Coaxial lines
  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

9.

LOSSY MATERIAL FOR IMPROVED SIGNAL INTEGRITY

      
Application Number 19008974
Status Pending
Filing Date 2025-01-03
First Publication Date 2025-05-01
Owner SAMTEC, INC. (USA)
Inventor
  • Buck, Jonathan E.
  • Sasaki, Yasuo
  • Ferry, Julian
  • Gore, Brandon Thomas

Abstract

An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

IPC Classes  ?

  • H01R 13/6598 - Shield material
  • H01R 4/70 - Insulation of connections
  • H01R 12/62 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
  • H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials
  • H01R 13/6461 - Means for preventing cross-talk
  • H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R 13/6589 - Shielding material individually surrounding or interposed between mutually spaced contacts with wires separated by conductive housing parts

10.

LOSSY MATERIAL FOR IMPROVED SIGNAL INTEGRITY

      
Application Number 19007866
Status Pending
Filing Date 2025-01-02
First Publication Date 2025-04-24
Owner SAMTEC, INC. (USA)
Inventor
  • Buck, Jonathan E.
  • Gore, Brandon Thomas
  • Sasaki, Yasuo
  • Ferry, Julian J.

Abstract

An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

IPC Classes  ?

  • H01R 13/6599 - Dielectric material made conductive, e.g. plastic material coated with metal
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
  • H01R 13/6587 - Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs

11.

ELECTRICAL CONNECTOR

      
Application Number US2024050982
Publication Number 2025/080991
Status In Force
Filing Date 2024-10-11
Publication Date 2025-04-17
Owner SAMTEC, INC. (USA)
Inventor Abe, Kiyoshi

Abstract

Belly-to-belly electrical connectors are disclosed that can be mounted on opposite sides of a substrate, such as printed circuit board, and have the identical footprints that are aligned when the connectors are mounted to the substrate. No projections of the first electrical connector that extend into the substrate are aligned with any projections of the second electrical connector that extend into the substrate. Similarly, no projections of the second electrical connector that extend into the substrate are aligned with any projections of the first electrical connector that extend into the substrate.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/70 - Coupling devices
  • H01R 13/518 - Means for holding or embracing insulating body, e.g. casing for holding or embracing several coupling parts, e.g. frames
  • H01R 13/629 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure
  • H01R 13/639 - Additional means for holding or locking coupling parts together after engagement
  • H01R 13/648 - Protective earth or shield arrangements on coupling devices

12.

SHIELDED ELECTRICAL CABLE CONNECTOR

      
Application Number US2024050868
Publication Number 2025/080907
Status In Force
Filing Date 2024-10-11
Publication Date 2025-04-17
Owner SAMTEC, INC. (USA)
Inventor
  • Holland, Troy, Benton
  • Musser, Randall, Eugene
  • Buck, Jonathan, E.

Abstract

Shielded electrical connectors are described herein. An electrical connector can include a connector housing. The electrical connector can further include at least one electrical connector supported by the connector housing. The electrical connector can further include an electrical shield that at least partially surrounds the at least one electrical contact, where the electrical connector is configured to transmit data signals along the at least one electrical contact. The electrical connector can be configured to mate with a corresponding electrical connector having another electrical shield. When the electrical connector and the corresponding connector are partially seated, the data signals can experience crosstalk interference levels that are approximately the level of crosstalk interference the data signals experience when the electrical connector and the corresponding electrical connector are fully seated.

IPC Classes  ?

  • H01R 13/6581 - Shield structure
  • H01R 13/652 - Protective earth or shield arrangements on coupling devices with earth pin, blade or socket
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables

13.

ELECTRICAL CONNECTOR APPARATUS AND METHOD

      
Application Number US2024050948
Publication Number 2025/080965
Status In Force
Filing Date 2024-10-11
Publication Date 2025-04-17
Owner SAMTEC, INC. (USA)
Inventor
  • Musser, Randall, Eugene
  • Buck, Jonathan, E.

Abstract

An electrical connector apparatus and method as described herein. The electrical connector may include a plug connector. The electrical connector may include a mating interface. The mating interface may include a plurality of plates. The electrical connector may include a substrate. The electrical connector may include a cable connector. The electrical connector may have at least a density of 256 differential pairs per square inch. The electrical connector may include at least one internal and/or external locking mechanism.

IPC Classes  ?

  • H01R 13/6587 - Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
  • H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
  • H01R 13/652 - Protective earth or shield arrangements on coupling devices with earth pin, blade or socket
  • H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
  • H01R 13/518 - Means for holding or embracing insulating body, e.g. casing for holding or embracing several coupling parts, e.g. frames

14.

Contact wafer

      
Application Number 29725670
Grant Number D1069730
Status In Force
Filing Date 2020-02-26
First Publication Date 2025-04-08
Grant Date 2025-04-08
Owner SAMTEC, INC. (USA)
Inventor
  • Buck, Jonathan E.
  • Mongold, John A.

15.

MANAGING UNWANTED HEAT, MECHANICAL STRESSES AND EMI IN ELECTRICAL CONNECTORS AND PRINTED CIRCUIT BOARDS

      
Application Number 18973393
Status Pending
Filing Date 2024-12-09
First Publication Date 2025-03-27
Owner Samtec, Inc. (USA)
Inventor
  • Best, Burrell G.
  • Vicich, Brian R.
  • Meredith, Kevin R.
  • Faith, Chadrick P.
  • Novak, Istvan
  • Buck, Jonathan E.

Abstract

A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.

IPC Classes  ?

  • H05K 7/14 - Mounting supporting structure in casing or on frame or rack
  • H01F 27/36 - Electric or magnetic shields or screens
  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
  • H05K 1/02 - Printed circuits Details
  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

16.

HYBRID COAXIAL CABLE

      
Application Number US2024046523
Publication Number 2025/059399
Status In Force
Filing Date 2024-09-13
Publication Date 2025-03-20
Owner SAMTEC, INC. (USA)
Inventor Birch, Daniel, Richard

Abstract

An electrical conductor assembly can include a first connector and a coupler configured to couple to the first connector and a second conductor so as to electrically connect the first connector to the second conductor. The first connector can be a coaxial cable. The second conductor can be a coaxial cable. The first connector can be more rigid than the second conductor. The first connector can be configured to couple to a substrate. An end of the first connector can include an engagement surface configured to remove oxidation on the substrate.

IPC Classes  ?

  • H01R 9/05 - Connectors arranged to contact a plurality of the conductors of a multiconductor cable for coaxial cables
  • H01R 24/38 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
  • H01R 13/629 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure
  • H01R 13/504 - BasesCases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together

17.

FILLING MATERIALS AND METHODS OF FILLING VIAS

      
Application Number 18549742
Status Pending
Filing Date 2022-03-10
First Publication Date 2025-03-13
Owner SAMTEC, INC. (USA)
Inventor
  • Hammann, Thomas Jacob
  • Owens, Adam
  • Bohn, Christopher
  • Hagan, Nathan
  • Robertson, Nathan
  • Wrschka, Peter

Abstract

Electrically conductive pastes are disclosed that are configured to fill a hole in a substrate. The paste can be cured in the hole so as to define an electrically conductive metallized via. Fills that perform at high temperatures are also disclosed.

IPC Classes  ?

18.

FIREBLADE

      
Serial Number 99075178
Status Pending
Filing Date 2025-03-10
Owner Samtec Inc. ()
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Substrate populated with separable interconnects for use as an optical evaluation module in the field of data transmission

19.

HYPER CLAW

      
Serial Number 99073003
Status Pending
Filing Date 2025-03-07
Owner Samtec Inc. ()
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Electrical conductors and electrical connectors that carry electrical conductors

20.

EDGE-MOUNT CONNECTOR

      
Application Number 18724845
Status Pending
Filing Date 2022-12-28
First Publication Date 2025-02-27
Owner Samtec, Inc. (USA)
Inventor Shelly, Christopher W.

Abstract

An edge-mount connector that self-adjusts against an edge thickness of a substrate, such as a printed circuit board. Rotation of fasteners, along with direct or indirect engagement between the fasteners and corresponding surfaces on the edge-mount connector or a clamp of the edge-mount connector can walk the edge-mount connector towards and against the edge thickness of the substrate.

IPC Classes  ?

  • H01R 24/50 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
  • H01R 103/00 - Two poles

21.

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

      
Application Number 18725118
Status Pending
Filing Date 2022-12-27
First Publication Date 2025-02-27
Owner
  • MEDTRONIC, INC. (USA)
  • Samtec, Inc. (USA)
Inventor
  • Qiu, Caian
  • Ruben, David A.
  • Patel, Neha M.
  • Kinzie, Patrick W.
  • Hammann, Tom
  • Bohn, Chris

Abstract

Various embodiments of an electrical component and a method of forming such electrical component are disclosed. The electrical component includes a substrate and one or more corrosion-resistant vias Each of the one or more corrosion-resistant vias includes one or more sidewalls formed by the substrate an interface layer disposed on at least a portion of the one or more sidewalls, and gold alloy bonded to the interface layer.

IPC Classes  ?

  • H01L 23/498 - Leads on insulating substrates
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or

22.

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

      
Application Number 18725120
Status Pending
Filing Date 2022-12-27
First Publication Date 2025-02-27
Owner
  • MEDTRONIC, INC. (USA)
  • Samtec, Inc. (USA)
Inventor
  • Qiu, Caian
  • Ruben, David A.
  • Patel, Neha M.
  • Kinzie, Patrick W.
  • Garcia, Ramiro
  • Hammann, Tom
  • Bohn, Chris

Abstract

Various embodiments of an electrical component and a method of forming such electrical component are disclosed. The electrical component includes a substrate and one or more corrosion-resistant vias. The substrate includes ceramic or sapphire. Each of the one or more corrosion-resistant vias includes one or more sidewalls formed by the substrate a corrosion-resistant alloy bonded to the one or more sidewalls.

IPC Classes  ?

  • H01L 23/498 - Leads on insulating substrates
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or

23.

ELECTRICAL CONNECTOR SYSTEM

      
Application Number 18933097
Status Pending
Filing Date 2024-10-31
First Publication Date 2025-02-20
Owner SAMTEC, INC. (USA)
Inventor
  • Buck, Jonathan E.
  • Mongold, John

Abstract

An orthogonal electrical connector system includes vertical electrical connectors that are configured to e mated to each other so as to place respective pluralities of first and second substrates that are oriented orthogonal to each other in data communication with each other through the mated electrical connectors. Other connector systems are also disclosed.

IPC Classes  ?

  • H01R 13/6461 - Means for preventing cross-talk
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
  • H01R 13/04 - Pins or blades for co-operation with sockets
  • H01R 13/11 - Resilient sockets
  • H01R 24/20 - Coupling parts carrying sockets, clips or analogous contacts and secured only to wire or cable
  • H01R 24/28 - Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
  • H01R 107/00 - Four or more poles

24.

OPTICAL ENGINE FOR HIGH-SPEED DATA TRANSMISSION

      
Application Number 18722873
Status Pending
Filing Date 2022-12-22
First Publication Date 2025-02-13
Owner SAMTEC, INC. (USA)
Inventor
  • Epitaux, Marc
  • Coronati, John

Abstract

An optical engine having an optically transparent substrate with a lens on a first major surface and an optoelectronic element on an opposed second major surface is described. The optical engine has a sealed optical path and is capable of operating submerged in a cooling liquid. The optical engine may be attached to a mounting substrate to form an optoelectronic subassembly that may be incorporated in many different types of optical interconnects.

IPC Classes  ?

  • H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • H01L 23/00 - Details of semiconductor or other solid state devices
  • H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
  • H01L 23/498 - Leads on insulating substrates

25.

OVERMOLDED LEAD FRAME PROVIDING CONTACT SUPPORT AND IMPEDANCE MATCHING PROPERTIES

      
Application Number 18929994
Status Pending
Filing Date 2024-10-29
First Publication Date 2025-02-13
Owner Samtec, Inc. (USA)
Inventor
  • Mongold, John A.
  • Buck, Jonathan E.

Abstract

An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.

IPC Classes  ?

  • H01R 13/6477 - Impedance matching by variation of dielectric properties
  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • H01R 13/41 - Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
  • H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
  • H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only
  • H01R 13/646 - Details of coupling devices of the kinds covered by groups or specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
  • H03H 7/38 - Impedance-matching networks

26.

HIGH DENSITY ELECTRICAL CABLE CONNECTOR WITH SELF-SECURING ELECTRICAL CONTACTS

      
Application Number US2024040295
Publication Number 2025/029867
Status In Force
Filing Date 2024-07-31
Publication Date 2025-02-06
Owner SAMTEC, INC. (USA)
Inventor
  • Birch, Daniel, Richard
  • Moore, Matthew

Abstract

A high density electrical connector can include a connector housing and electrical contacts supported by the connector housing. The contacts extend through channels of the connector housing. The channels can be arranged in rows of channels, wherein the channels of each row are spaced from each other along a row direction. The connector housing includes slots that can connect adjacent ones of the channels to each other along a row direction.

IPC Classes  ?

  • H01R 24/40 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
  • H01R 13/422 - Securing in a demountable manner in resilient one-piece base or caseOne-piece base or case formed with resilient locking means
  • H01R 13/639 - Additional means for holding or locking coupling parts together after engagement

27.

LEAD FRAME WITH ELECTRICAL SHORTING PROTECTION

      
Application Number 18715484
Status Pending
Filing Date 2023-01-18
First Publication Date 2025-02-06
Owner Samtec, Inc. (USA)
Inventor
  • Tucker, Aaron
  • Jones, Iii, Richard L.

Abstract

A cable termination that helps prevent unwanted, inadvertent electrical shorting between a signal conductor and a cable ground shield, cable serve shield, or cable reference shield of a cable, such as a coaxial or twin axial cable.

IPC Classes  ?

  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
  • H01R 13/6591 - Specific features or arrangements of connection of shield to conductive members
  • H01R 13/6592 - Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable

28.

FLEX CIRCUIT AND ELECTRICAL COMMUNICATION ASSEMBLIES RELATED TO SAME

      
Application Number US2024039089
Publication Number 2025/024408
Status In Force
Filing Date 2024-07-23
Publication Date 2025-01-30
Owner SAMTEC, INC. (USA)
Inventor
  • Epitaux, Marc
  • Gore, Brandon, Thomas
  • Buck, Jonathan, E.

Abstract

Flex circuit embodiments are provided having high signal conductor density and high signal integrity. Electrical communication systems are described that are configured to be placed in electrical communication with the flex circuits. Electrical communication systems are described that include an electrical connector that is selectively intermatable with an electrical connector that is mounted to a flex circuit, and an electrical connector that is mounted to a substrate such as a printed circuit board (PCB).

IPC Classes  ?

  • H05K 1/02 - Printed circuits Details
  • H05K 1/09 - Use of materials for the metallic pattern
  • H05K 7/14 - Mounting supporting structure in casing or on frame or rack

29.

ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME

      
Application Number 18886066
Status Pending
Filing Date 2024-09-16
First Publication Date 2025-01-09
Owner SAMTEC, INC. (USA)
Inventor
  • Nolet, Alan D.
  • Liotta, Andrew Haynes
  • Holland, Troy Benton
  • Hammann, Thomas Jacob
  • Bates, Heidi
  • Goia, Daniel
  • Hardikar, Vishwas Vinayak
  • Kumar, Ajeet
  • Long, Daniel
  • Mcgraw, Nicole
  • Moen, Lauren Savawn
  • Owens, Adam

Abstract

An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

IPC Classes  ?

  • H01L 23/498 - Leads on insulating substrates
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
  • H01L 23/15 - Ceramic or glass substrates
  • H05K 1/03 - Use of materials for the substrate
  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

30.

Electrical contact arrangement

      
Application Number 29937846
Grant Number D1056855
Status In Force
Filing Date 2024-04-17
First Publication Date 2025-01-07
Grant Date 2025-01-07
Owner SAMTEC, INC. (USA)
Inventor
  • Faith, Chadrick Paul
  • Biddle, Gary Ellsworth
  • Musser, Randall Eugene
  • Buck, Jonathan Earl

31.

ELECTRICAL CONNECTOR APPARATUS AND METHOD

      
Application Number US2024036016
Publication Number 2025/006885
Status In Force
Filing Date 2024-06-28
Publication Date 2025-01-02
Owner SAMTEC, INC. (USA)
Inventor
  • Buck, Jonathan
  • Holland, Troy B.
  • Gore, Brandon
  • Josephson, Andrew

Abstract

An electrical connector apparatus and method as described herein. The electrical connector may include a plug connector. The electrical connector may include a mating interface. The mating interface may include a plurality of plates. The electrical connector may include a substrate. The electrical connector may include a cable connector. The electrical connector may have at least a density of 256 differential pairs per square inch. The electrical connector may include at least one internal and/or external locking mechanism. The electrical connector and/or interposer may include a film. The electrical connector may include a cup shaped connector. The electrical connector and/or interposer may include one or more containment structures.

IPC Classes  ?

  • H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
  • H01R 13/639 - Additional means for holding or locking coupling parts together after engagement
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
  • H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
  • H01R 13/518 - Means for holding or embracing insulating body, e.g. casing for holding or embracing several coupling parts, e.g. frames

32.

RF WAVEGUIDE CABLE ASSEMBLY

      
Application Number 18816395
Status Pending
Filing Date 2024-08-27
First Publication Date 2024-12-19
Owner SAMTEC, INC. (USA)
Inventor
  • Epitaux, Marc
  • Chuganey, Shashi
  • Garrison, Kelly
  • Hall, Iii, Thomas Albert
  • Diegel, Cindy Lee
  • Moss, James Alexander
  • Noyola, Francisco
  • Sasaki, Yasuo
  • Mcmorrow, Scott

Abstract

Radio frequency (RP) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.

IPC Classes  ?

  • H01P 5/08 - Coupling devices of the waveguide type for linking lines or devices of different kinds
  • H01P 1/04 - Fixed joints
  • H01P 3/16 - Dielectric waveguides, i.e. without a longitudinal conductor

33.

PLATING AND SOLDER MASK APPARATUS AND METHODS

      
Application Number US2024034076
Publication Number 2024/259283
Status In Force
Filing Date 2024-06-14
Publication Date 2024-12-19
Owner SAMTEC, INC. (USA)
Inventor
  • Larimore, Zachary
  • Holland, Troy B.
  • Brown, Matthew
  • James, Erica
  • Crain, Mark

Abstract

An electrical connector comprising, one or more aerosol structures deposited on one or more surfaces of the electrical connector and a method of depositing one or more aerosol materials onto one or more conductors comprising, providing one or more electrical conductors having one or more surfaces, aerosol jetting one or more aerosol structures on the one or more surfaces of the one or more electrical conductors, and at least one of masking, containing, and/or excluding one or more materials on the one or more surfaces of the one or more electrical conductors.

IPC Classes  ?

  • H01R 12/52 - Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
  • H01R 12/58 - Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
  • H05K 3/28 - Applying non-metallic protective coatings
  • H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
  • H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

34.

RF WAVEGUIDE CABLE ASSEMBLY

      
Application Number 18816315
Status Pending
Filing Date 2024-08-27
First Publication Date 2024-12-19
Owner SAMTEC, INC. (USA)
Inventor
  • Epitaux, Marc
  • Chuganey, Shashi
  • Garrison, Kelly
  • Hall, Iii, Thomas Albert
  • Diegel, Cindy Lee
  • Moss, James Alexander
  • Noyola, Francisco
  • Sasaki, Yasuo
  • Mcmorrow, Scott

Abstract

Radio frequency (RF) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.

IPC Classes  ?

  • H01P 5/08 - Coupling devices of the waveguide type for linking lines or devices of different kinds
  • H01P 1/04 - Fixed joints
  • H01P 3/16 - Dielectric waveguides, i.e. without a longitudinal conductor

35.

Contact

      
Application Number 29832053
Grant Number D1054386
Status In Force
Filing Date 2022-03-24
First Publication Date 2024-12-17
Grant Date 2024-12-17
Owner SAMTEC, INC. (USA)
Inventor
  • Musser, Randall E.
  • Buck, Jonathan E.

36.

Electrical connector

      
Application Number 29866918
Grant Number D1053815
Status In Force
Filing Date 2022-09-30
First Publication Date 2024-12-10
Grant Date 2024-12-10
Owner SAMTEC, INC. (USA)
Inventor Cheng, Chia Chi

37.

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

      
Application Number 18804721
Status Pending
Filing Date 2024-08-14
First Publication Date 2024-12-05
Owner Samtec, Inc. (USA)
Inventor
  • Zbinden, Eric J.
  • Musser, Randall E.
  • Verdiell, Jean-Marc A.
  • Mongold, John A.
  • Vicich, Brian R.
  • Guetig, Keith R.

Abstract

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/639 - Additional means for holding or locking coupling parts together after engagement
  • H04B 1/3827 - Portable transceivers
  • H04B 10/25 - Arrangements specific to fibre transmission
  • H04B 10/27 - Arrangements for networking
  • H04B 10/40 - Transceivers
  • H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
  • H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

38.

OPTICAL BLOCK PROVIDING OPTICAL COMMUNICATION BETWEEN OPTICAL FIBERS AND OPTOELECTRONIC ELEMENTS

      
Application Number US2024030998
Publication Number 2024/243512
Status In Force
Filing Date 2024-05-24
Publication Date 2024-11-28
Owner SAMTEC, INC. (USA)
Inventor
  • Bettman, R. Brad
  • Ahadian, Joseph F.

Abstract

A system and method for making an optical connection between optical fibers and optoelectronic elements using an optical block is described. The optical block is a portion of an optical interconnect module that includes a detachable optical interface to a plurality of optical fibers. The optical interface may include two configurations: a first configuration and a second configuration. The first configuration includes an exposed optical path, and the second configuration includes a sealed optical path. A common optical interconnect module and a common optical block can be used in both configurations. The optical block may include alignment features that help enable accurate registration of the optical block to a mating element with respect to six degrees-of-freedom.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures

39.

CONNECTOR WITH LINEAR COAXIAL, RIGHT ANGLE COAXIAL AND OPTICAL CONNECTORS

      
Application Number 18782101
Status Pending
Filing Date 2024-07-24
First Publication Date 2024-11-21
Owner SAMTEC, INC. (USA)
Inventor
  • Clyatt, Iii, Clarence L.
  • Mongold, John A.
  • Buck, Jonathan E.
  • Woodson, Andrew
  • Ruzzi, Jason

Abstract

Modular block type of board connector having two different types of RF connectors and an optical cable with an optical connector. A RF connector with built-in impedance tuning and automatic biasing.

IPC Classes  ?

  • H01R 9/05 - Connectors arranged to contact a plurality of the conductors of a multiconductor cable for coaxial cables
  • H01R 12/70 - Coupling devices
  • H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
  • H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only
  • H01R 24/44 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches comprising impedance matching means

40.

Electrical connector

      
Application Number 29876646
Grant Number D1049052
Status In Force
Filing Date 2023-05-25
First Publication Date 2024-10-29
Grant Date 2024-10-29
Owner SAMTEC, INC. (USA)
Inventor
  • Faith, Chadrick Paul
  • Schmelz, Dale

41.

RF CONNECTOR MOUNTING

      
Application Number 18292060
Status Pending
Filing Date 2022-09-22
First Publication Date 2024-10-10
Owner Samtec, Inc. (USA)
Inventor
  • Garrison, Kelly F.
  • Hall, Iii, Thomas A.
  • Birch, Daniel R.
  • Buck, Jonathan E.
  • Faith, Chadrick P.
  • Shelly, Christopher W.

Abstract

An electrical connector includes a housing and an aligner. The aligner is defined by a connector base of the housing or by an alignment peg. The aligner defined by the connector base is configured to cooperate with a corresponding fiducial to properly align the electrical connector on a mounting surface of a substrate. The aligner defined by an alignment peg includes a main body and an embossed portion that defines a protrusion that extends from the main body. The embossed portion is configured to mate with a raised or recessed portion of a substrate to properly locate and align the electrical connector to the substrate.

IPC Classes  ?

  • H01R 24/50 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
  • H01R 103/00 - Two poles

42.

Connector

      
Application Number 29832052
Grant Number D1045804
Status In Force
Filing Date 2022-03-24
First Publication Date 2024-10-08
Grant Date 2024-10-08
Owner SAMTEC, INC. (USA)
Inventor
  • Musser, Randall E.
  • Buck, Jonathan E.

43.

SUDDEN SERVICE

      
Serial Number 98783646
Status Pending
Filing Date 2024-10-03
Owner Samtec Inc. ()
NICE Classes  ? 35 - Advertising and business services

Goods & Services

Customer services, namely, responding to customer inquiries in the field of electrical signal interconnects, electrical radio frequency (RF) interconnects, and electrical power interconnects, optical interconnects, and electrically conductive substrates

44.

NITROWAVE

      
Application Number 1812610
Status Registered
Filing Date 2024-08-06
Registration Date 2024-08-06
Owner Samtec Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Cables for electrical transmission.

45.

SOLUTIONATOR

      
Serial Number 98783643
Status Pending
Filing Date 2024-10-03
Owner Samtec Inc. ()
NICE Classes  ? 42 - Scientific, technological and industrial services, research and design

Goods & Services

Computer services, namely, providing an interactive web site that features technology that allows users to design their own cable assemblies and interconnects for use with board-to-board systems, cable systems, power systems, optical systems, and radio frequency (RF) systems customized to user-defined specifications

46.

SI-BORG

      
Application Number 1812931
Status Registered
Filing Date 2024-07-23
Registration Date 2024-07-23
Owner Samtec Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Software for use in connection with automated breakout region trace routing.

47.

CONNECTOR AND METHOD OF USE WITHOUT PREATTACHED SOLDER BALL

      
Application Number US2024021166
Publication Number 2024/206156
Status In Force
Filing Date 2024-03-22
Publication Date 2024-10-03
Owner SAMTEC, INC. (USA)
Inventor
  • Harris, Jacob Land
  • Huffman, James Robert

Abstract

An electrical connector comprising: at least three immediately consecutive, parallel, linear arrays of electrical conductors, each electrical conductor further comprising a SMT conductor tail that is devoid of a solder mass, wherein each SMT conductor tail is immediately adjacent to another SMT conductor tail.

IPC Classes  ?

  • H01R 12/57 - Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
  • H01R 12/70 - Coupling devices
  • H01R 43/02 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections

48.

Connector

      
Application Number 29833175
Grant Number D1043588
Status In Force
Filing Date 2022-04-01
First Publication Date 2024-09-24
Grant Date 2024-09-24
Owner SAMTEC, INC. (USA)
Inventor
  • Musser, Randall E.
  • Buck, Jonathan E.

49.

CABLE CONNECTOR SYSTEMS

      
Application Number 18671033
Status Pending
Filing Date 2024-05-22
First Publication Date 2024-09-19
Owner Samtec, Inc. (USA)
Inventor
  • Mongold, John A.
  • Buck, Jonathan E.
  • Shah, Jignesh H.
  • Faith, Chadrick P.
  • Musser, Randall E.
  • Williams Barnet, Jean Karlo
  • Mcmorrow, Norman S.

Abstract

A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.

IPC Classes  ?

  • H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
  • H01R 13/518 - Means for holding or embracing insulating body, e.g. casing for holding or embracing several coupling parts, e.g. frames

50.

ELECTRICAL CABLE WITH DIELECTRIC FOAM

      
Application Number 18676913
Status Pending
Filing Date 2024-05-29
First Publication Date 2024-09-19
Owner SAMTEC, INC. (USA)
Inventor
  • Chuganey, Shashi
  • Sasaki, Yasuo
  • Mcmorrow, Scott
  • Noyola, Francisco
  • Diegel, Cindy Lee
  • Moss, James Alexander

Abstract

Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.

IPC Classes  ?

  • H01B 11/18 - Coaxial cablesAnalogous cables having more than one inner conductor within a common outer conductor
  • H01B 7/02 - Disposition of insulation
  • H01B 7/08 - Flat or ribbon cables
  • H01B 7/18 - Protection against damage caused by external factors, e.g. sheaths or armouring by wear, mechanical force or pressure
  • H01B 7/22 - Metal wires or tapes, e.g. made of steel
  • H01B 11/00 - Communication cables or conductors
  • H01B 11/20 - Cables having a multiplicity of coaxial lines
  • H01P 3/06 - Coaxial lines
  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

51.

ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME

      
Application Number 18668527
Status Pending
Filing Date 2024-05-20
First Publication Date 2024-09-12
Owner SAMTEC, INC. (USA)
Inventor
  • Nolet, Alan
  • Goia, Daniel
  • Hardikar, Vishwas
  • Kumar, Ajeet
  • Long, Daniel
  • Liotta, Andrew

Abstract

An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.

IPC Classes  ?

  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
  • H01L 23/15 - Ceramic or glass substrates
  • H01L 23/498 - Leads on insulating substrates

52.

CONTROLLED ATTENUATION OF A REFLECTION FROM A COATED SURFACE

      
Application Number 18283555
Status Pending
Filing Date 2022-04-05
First Publication Date 2024-09-12
Owner Samtec, Inc. (USA)
Inventor
  • Girlando, Stephen M.
  • Bandfield, Christopher A.
  • Nightingale, John L.

Abstract

An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a reflective surface formed by a coating which is textured to attenuate the light transmitted through the optical block. The reflective surface is encapsulated so that its reflective properties are not affected by liquids or contaminants on an outer surface of the coating.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements

53.

Electrical connector

      
Application Number 29841152
Grant Number D1041426
Status In Force
Filing Date 2022-06-03
First Publication Date 2024-09-10
Grant Date 2024-09-10
Owner SAMTEC, INC. (USA)
Inventor
  • Buck, Jonathan E.
  • Mongold, John A.

54.

Connector

      
Application Number 29833208
Grant Number D1040766
Status In Force
Filing Date 2022-04-01
First Publication Date 2024-09-03
Grant Date 2024-09-03
Owner SAMTEC, INC. (USA)
Inventor
  • Musser, Randall E.
  • Buck, Jonathan E.

55.

Connector

      
Application Number 29821508
Grant Number D1039500
Status In Force
Filing Date 2021-12-30
First Publication Date 2024-08-20
Grant Date 2024-08-20
Owner SAMTEC, INC. (USA)
Inventor
  • Musser, Randall E.
  • Buck, Jonathan E.

56.

DATA COMMUNICATION LINE AND CONNECTOR

      
Application Number 18566363
Status Pending
Filing Date 2022-06-03
First Publication Date 2024-08-08
Owner SAMTEC, INC. (USA)
Inventor
  • Epitaux, Marc
  • Hall, Iii, Thomas Albert

Abstract

A data communication connector can include a dielectric waveguide that extends along a central axis, and a recess that is configured to receive an antenna. The data communication connector can include an electrically conductive body that receives the dielectric waveguide. The electrically conductive body can define the recess. The dielectric waveguide can include a dielectric core, a ground shield, and a jacket.

IPC Classes  ?

  • H01P 3/16 - Dielectric waveguides, i.e. without a longitudinal conductor

57.

NITROWAVE

      
Application Number 235364000
Status Pending
Filing Date 2024-08-06
Owner Samtec Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

(1) Cables for electrical transmission.

58.

SI-BORG

      
Application Number 235355000
Status Pending
Filing Date 2024-07-23
Owner Samtec Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

(1) Software for use in connection with automated breakout region trace routing.

59.

HALO

      
Serial Number 98624804
Status Pending
Filing Date 2024-06-28
Owner Samtec Inc. ()
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

A two-part electrical and optical interconnect, in the nature of mid-board, near chip, and on-chip mounted, 56/112 Gbps PAM4 signal capable electrical socket connector that does not receive an edge card, an RJ11 connector, or an RJ45 connector and does not have a DC/DC converter modules, isolation modules and filters (including, but not limited to, inductors and surge protection devices), and a corresponding finished optical transceiver that exclusively mates with the electrical socket connector, all for use with data center and high performance computing protocols

60.

High aspect ratio vias filled with liquid metal fill

      
Application Number 18554556
Grant Number 12336112
Status In Force
Filing Date 2022-04-11
First Publication Date 2024-06-13
Grant Date 2025-06-17
Owner SAMTEC, INC. (USA)
Inventor
  • Bohn, Christopher David
  • Crain, Mark
  • Roehm, Justin
  • Hammann, Thomas Jacob
  • Robertson, Nathan
  • Brown, Jeremy
  • Pelkey, Christopher
  • Owens, Adam
  • Payton, Russell
  • Frank, Russell

Abstract

A substrate includes a substrate body made of a material such as glass, and at least one electrical via that extends at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.

IPC Classes  ?

  • H05K 3/00 - Apparatus or processes for manufacturing printed circuits
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
  • H01L 23/498 - Leads on insulating substrates
  • H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
  • H05K 3/42 - Plated through-holes

61.

ELECTRICALLY CONDUCTIVE VIAS HAVING END CAPS

      
Application Number US2023081766
Publication Number 2024/118884
Status In Force
Filing Date 2023-11-30
Publication Date 2024-06-06
Owner SAMTEC, INC. (USA)
Inventor
  • Crain, Mark
  • Bohn, Christopher, David
  • Faiz, Abderrazzak
  • Larimore, Zack
  • Holland, Troy, Benton
  • Robertson, Nathan

Abstract

An electrically conductive component includes a substrate and an electrically conductive via that can include an electrically conductive coating bonded to an internal surface of the substrate, a fill that is surrounded by the electrically conductive coating, and first and second electrically conductive end caps that hermetically seal opposed ends of the vias.

IPC Classes  ?

  • H01L 23/498 - Leads on insulating substrates
  • H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or

62.

Electrical contact arrangement

      
Application Number 29865977
Grant Number D1028904
Status In Force
Filing Date 2022-08-23
First Publication Date 2024-05-28
Grant Date 2024-05-28
Owner SAMTEC, INC. (USA)
Inventor
  • Faith, Chadrick Paul
  • Biddle, Gary Ellsworth
  • Musser, Randall Eugene
  • Buck, Jonathan Earl

63.

Overmolded lead frame providing contact support and impedance matching properties

      
Application Number 18425168
Grant Number 12176656
Status In Force
Filing Date 2024-01-29
First Publication Date 2024-05-23
Grant Date 2024-12-24
Owner SAMTEC, INC. (USA)
Inventor
  • Mongold, John A.
  • Buck, Jonathan E.

Abstract

An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.

IPC Classes  ?

  • H01R 13/646 - Details of coupling devices of the kinds covered by groups or specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • H01R 13/41 - Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
  • H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
  • H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only
  • H01R 13/6477 - Impedance matching by variation of dielectric properties
  • H03H 7/38 - Impedance-matching networks

64.

INTERCONNECT ALIGNMENT SYSTEM AND METHOD

      
Application Number 18552463
Status Pending
Filing Date 2022-03-30
First Publication Date 2024-05-23
Owner SAMTEC, INC. (USA)
Inventor
  • Coronati, John
  • Epitaux, Marc
  • Gore, Brandon Thomas

Abstract

An interconnection system includes a mating substrate that is configured to be placed in electrical communication with a main board along an insertion direction so as to define a separable interface. The interconnection system is configured to align the mating substrate with the main board along first and second transverse directions that are perpendicular to each other and to the insertion direction.

IPC Classes  ?

  • H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or

65.

INTERCONNECT MODULE FOR HIGH-SPEED DATA TRANSMISSION

      
Application Number US2023077825
Publication Number 2024/092074
Status In Force
Filing Date 2023-10-26
Publication Date 2024-05-02
Owner SAMTEC, INC. (USA)
Inventor
  • Epitaux, Marc
  • Nightingale, John, L.
  • Coronati, John

Abstract

An interconnect module having a base substrate with a microcontroller on a top surface and a photonic integrated circuit (PIC) and photodetector array on an opposed bottom surface is described. The interconnect module has a top and bottom fiber assembly, which both have a row of optical fibers. The bottom fiber assembly is actively aligned with the PIC to maximize optical coupling efficiency between the bottom fiber assembly and the PIC and then permanently affixed in this position. The top fiber assembly is actively aligned with the photodetector array to maximize optical coupling efficiency between the top fiber assembly and the photodetector array and then permanently affixed in this position.

IPC Classes  ?

  • G06F 13/38 - Information transfer, e.g. on bus
  • G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water

66.

Connector

      
Application Number 29821509
Grant Number D1024967
Status In Force
Filing Date 2021-12-30
First Publication Date 2024-04-30
Grant Date 2024-04-30
Owner SAMTEC, INC. (USA)
Inventor
  • Musser, Randall E.
  • Buck, Jonathan E.

67.

METHOD AND APPARATUS FOR SECURING DATA COMMUNICATION DEVICES

      
Application Number US2023076166
Publication Number 2024/077198
Status In Force
Filing Date 2023-10-06
Publication Date 2024-04-11
Owner SAMTEC, INC. (USA)
Inventor Abe, Kiyoshi

Abstract

A connector can include a connector body and a latch coupled to the connector body. The latch can be configured to couple to an anchor element upon movement of the connector body in a first direction. The latch can be configured to decouple from the anchor element upon movement of the connector body in a second direction different from the first direction.

IPC Classes  ?

  • H01R 13/629 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure
  • H01R 13/639 - Additional means for holding or locking coupling parts together after engagement

68.

EYE SPEED THINAX

      
Application Number 1783928
Status Registered
Filing Date 2024-01-26
Registration Date 2024-01-26
Owner Samtec Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Electrical cable, namely, twin axial electrical cable.

69.

EYE SPEED THINSE

      
Application Number 1780690
Status Registered
Filing Date 2024-01-26
Registration Date 2024-01-26
Owner Samtec Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Electrical cable, namely, coaxial electrical cable.

70.

EYE SPEED AIR

      
Application Number 1780691
Status Registered
Filing Date 2024-01-26
Registration Date 2024-01-26
Owner Samtec Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Electrical cable, namely, twin axial electrical cable.

71.

SWITCH

      
Application Number US2023031923
Publication Number 2024/050136
Status In Force
Filing Date 2023-09-01
Publication Date 2024-03-07
Owner SAMTEC, INC. (USA)
Inventor Shah, Jignesh

Abstract

An orthogonal switch includes one or more of a front panel, a host substrate, such as printed circuit board, and an auxiliary substrate, such as a poser or a control printed circuit board. The host substrate is directly or indirectly physically connected to the auxiliary substrate, electrically connected to the auxiliary substrate or both, and the host substrate that has a first major surface, and an opposed second major surface and at least three edges, wherein the first major surface is positioned generally parallel to the front panel. The front panel defines a plurality of panel openings arranged in rows and columns.

IPC Classes  ?

72.

ELECTRICAL CONNECTOR APPARATUS AND METHOD

      
Application Number US2023031924
Publication Number 2024/050137
Status In Force
Filing Date 2023-09-01
Publication Date 2024-03-07
Owner SAMTEC, INC. (USA)
Inventor
  • Buck, Jonathan
  • Ortega, Jose Luis

Abstract

An electrical connector apparatus and method as described herein. The electrical connector may include a plug connector. The electrical connector may include a mating interface. The mating interface may include a plurality of plates. The electrical connector may include a substrate. The electrical connector may include a cable connector. The electrical connector may have at least a density of at least 213 differential pairs per square inch, including 256 differential pairs per square inch. The electrical connector may include at least one internal and/or external locking mechanism.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
  • H01R 13/42 - Securing in a demountable manner
  • H01R 13/639 - Additional means for holding or locking coupling parts together after engagement
  • H01R 13/6461 - Means for preventing cross-talk
  • H01R 24/20 - Coupling parts carrying sockets, clips or analogous contacts and secured only to wire or cable
  • H01R 24/28 - Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable

73.

OPTICAL TRANSCEIVER WITH VERSATILE POSITIONING

      
Application Number 18504414
Status Pending
Filing Date 2023-11-08
First Publication Date 2024-02-29
Owner SAMTEC, INC. (USA)
Inventor Zbinden, Eric

Abstract

An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements
  • H04B 10/25 - Arrangements specific to fibre transmission
  • H04B 10/40 - Transceivers

74.

NITROWAVE

      
Serial Number 98425182
Status Pending
Filing Date 2024-02-28
Owner Samtec Inc. ()
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Cables for electrical transmission

75.

RACK-MOUNTABLE EQUIPMENT WITH A HIGH-HEAT-DISSIPATION MODULE, AND TRANSCEIVER RECEPTACLE WITH INCREASED COOLING

      
Application Number 18382242
Status Pending
Filing Date 2023-10-20
First Publication Date 2024-02-22
Owner Samtec, Inc. (USA)
Inventor
  • Zbinden, Eric J.
  • Hall, Iii, Thomas A.

Abstract

An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements

76.

DATA COMMUNICATION SYSTEM

      
Application Number 18260024
Status Pending
Filing Date 2021-12-30
First Publication Date 2024-02-22
Owner SAMTEC, INC. (USA)
Inventor
  • Shah, Jignesh H.
  • Blando, Gustavo
  • Williams Barnett, Jean Karlo

Abstract

An electrical connector includes a connector housing and a plurality of electrical contacts supported by the connector housing. The electrical contacts are oriented oblique to a mounting interface of the connector housing that mounts to an underlying substrate. The electrical connector can further include a plurality of electrical cables mounted to the electrical contacts. The electrical cables can extend from the electrical contacts along a direction oblique to the mounting interface.

IPC Classes  ?

  • H01R 13/6591 - Specific features or arrangements of connection of shield to conductive members
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 13/6463 - Means for preventing cross-talk using twisted pairs of wires
  • H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]

77.

SI-BORG

      
Serial Number 98401922
Status Pending
Filing Date 2024-02-12
Owner Samtec Inc. ()
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Downloadable software for use in connection with automated breakout region trace routing

78.

EYE SPEED AIR

      
Application Number 231697400
Status Pending
Filing Date 2024-01-26
Owner Samtec Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

(1) Electrical cable, namely, twin axial electrical cable.

79.

EYE SPEED THINSE

      
Application Number 231697200
Status Pending
Filing Date 2024-01-26
Owner Samtec Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

(1) Electrical cable, namely, coaxial electrical cable.

80.

EYE SPEED THINAX

      
Application Number 231957200
Status Pending
Filing Date 2024-01-26
Owner Samtec Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

(1) Electrical cable, namely, twin axial electrical cable.

81.

INSULATING BEAD FOR RF CONNECTOR

      
Document Number 03260690
Status Pending
Filing Date 2023-07-07
Open to Public Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor
  • Seger, Joseph B. Jr.
  • Birch, Daniel R.
  • Beraun, David S.
  • Holland, Troy B.

IPC Classes  ?

  • H01R 24/28 - Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
  • H01R 43/18 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members

82.

RF CONNECTOR

      
Document Number 03260981
Status Pending
Filing Date 2023-07-07
Open to Public Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor Hall Iii, Thomas A.

Abstract

An electrical connector includes a connector housing and a core that is inserted into the connector housing. The core includes a shell, a center conductor, a ground conductor, and an insulating spacer provided between the center conductor and the ground conductor. Internal components of the core can be manufactured by an additive manufacturing process.

IPC Classes  ?

  • H01R 13/646 - Details of coupling devices of the kinds covered by groups or specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
  • H01R 24/38 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts

83.

INVERTIBLE TWO-PHASE MODULE COOLING APPARATUS AND METHOD

      
Application Number US2023026762
Publication Number 2024/010754
Status In Force
Filing Date 2023-06-30
Publication Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor Hall Iii, Thomas A.

Abstract

A heat sink apparatus and method for heat transfer. The heat sink may include one or more fins. The heat sink may include one or more cavities. The heat sink may include one or more working fluids. The heat sink, or portions thereof, may be made by additive manufacturing.

IPC Classes  ?

  • H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

84.

COMPRESSION INTERPOSER

      
Application Number US2023027085
Publication Number 2024/010901
Status In Force
Filing Date 2023-07-07
Publication Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor
  • Holland, Troy B.
  • Menkhaus, Michael R.

Abstract

An interposer, such as a compressible interposer, that can include a spring, such as a coil spring, which can at least partially circumscribe a compressible, electrically dielectric center. The interposer can be used in place of or as a substitute for a solder-based surface mount technology (SMT) solder ball or a solder charge. The interposer can be attached with other interposers to a carrier to form an LGA-LGA type of interposer.

IPC Classes  ?

  • H01L 23/498 - Leads on insulating substrates
  • H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
  • H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or

85.

ELECTRICAL INTERPOSER

      
Application Number US2023027092
Publication Number 2024/010906
Status In Force
Filing Date 2023-07-07
Publication Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor
  • Birch, Daniel R.
  • Holland, Troy B.

Abstract

An electrical interposer includes an electrical conductor, an inner wall that circumscribes the electrical conductor, an outer wall that circumscribes the inner wall, and a connecting structure provided between the inner wall and the outer wall.

IPC Classes  ?

  • H01R 24/38 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
  • H01R 13/6589 - Shielding material individually surrounding or interposed between mutually spaced contacts with wires separated by conductive housing parts

86.

CABLE APPARATUS AND METHOD

      
Application Number US2023027131
Publication Number 2024/010930
Status In Force
Filing Date 2023-07-07
Publication Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor Holland, Troy B.

Abstract

A cable apparatus and method. A board connector and method. The cable assembly may include a cable. The cable assembly and/or the board connector may include one or more connectors and/or one or more conductors. The cable assembly may be a waveguide. The cable assembly, the board connector, or portions thereof, may be made by D3 printing or additive manufacturing, including multi-material 3D printing or additive manufacturing. Multi-material can include two or more of electrically non-conductive or insulative material, electrically conductive material, electrically lossy material, and magnetically absorbing material.

IPC Classes  ?

  • H01B 7/00 - Insulated conductors or cables characterised by their form
  • H01B 11/18 - Coaxial cablesAnalogous cables having more than one inner conductor within a common outer conductor
  • H01B 11/20 - Cables having a multiplicity of coaxial lines
  • H01B 13/016 - Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing co-axial cables
  • H01P 3/12 - Hollow waveguides
  • H01R 12/70 - Coupling devices
  • H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
  • B29C 64/10 - Processes of additive manufacturing

87.

METHOD AND APPARTUS FOR ADDITIVELY FABRICATING ELECTRICAL COMPONENTS

      
Application Number US2023069742
Publication Number 2024/011199
Status In Force
Filing Date 2023-07-07
Publication Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor
  • Hall, Thomas, Albert, Iii.
  • Holland, Troy, Benton

Abstract

Methods and apparatus are provided for additively fabricating an electrical component such as an electrical connector. An additive manufacturing station includes at least two beams that intersect in a bath of resin, such that the combined energy of the beams at the intersection is sufficient to crosslink the resin.

IPC Classes  ?

  • H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures

88.

DATA COMMUNICATION LINE WITH LATTICE STRUCTURE

      
Application Number US2023069761
Publication Number 2024/011213
Status In Force
Filing Date 2023-07-07
Publication Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor
  • Seger, Joseph, Bryan
  • Menkhaus, Michael, Ryan
  • Holland, Troy, Benton

Abstract

A data communication line can include a first segment, a second segment, and an electrically conductive element coupled to each of the first and second segments such that the first and second segments are movable relative to each other. The first and second segments can be electrically insulative. The first and second segments can be spaced from each other along a central axis of the data communication line. The first and second segments can be manufactured by an additive manufacturing process.

IPC Classes  ?

  • H01B 11/18 - Coaxial cablesAnalogous cables having more than one inner conductor within a common outer conductor
  • H01B 11/20 - Cables having a multiplicity of coaxial lines
  • H01B 19/00 - Apparatus or processes specially adapted for manufacturing insulators or insulating bodies

89.

ADDITIVE MANUFACTURED WAVEGUIDE

      
Application Number US2023069818
Publication Number 2024/011245
Status In Force
Filing Date 2023-07-07
Publication Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor
  • Nightingale, John, L.
  • Seger Jr, Joseph, Bryan

Abstract

A cable can include a first end and a second end. The cable can be adapted to transmit an electrical signal or light from the first end to the second end. The cable can be a non-extruded dielectric. The cable can be a waveguide. The cable can be manufactured by three-dimensional printing. The cable can have any desired length. The cable can be manufactured by sequentially printing any number of segments.

IPC Classes  ?

  • H01P 11/00 - Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
  • H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
  • B29C 64/10 - Processes of additive manufacturing

90.

WIRE TO EDGE CARD CONNECTOR APPARATUS AND METHOD

      
Application Number 18345756
Status Pending
Filing Date 2023-06-30
First Publication Date 2024-01-11
Owner Samtec, Inc. (USA)
Inventor Hall, Iii, Thomas A.

Abstract

An electrical connector apparatus and method. The electrical connector may include one or more electrically conductive materials. The electrical connector may include one or more receptacles. The one or more electrically conductive materials may include one or more teeth. The electrical connector, or portions thereof, may be made by additive manufacturing.

IPC Classes  ?

  • H01R 13/6592 - Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
  • B33Y 80/00 - Products made by additive manufacturing

91.

INSULATING BEAD FOR RF CONNECTOR

      
Application Number US2023027082
Publication Number 2024/010899
Status In Force
Filing Date 2023-07-07
Publication Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor
  • Seger, Joseph B., Jr.
  • Birch, Daniel R.
  • Beraun, David S.

Abstract

An RF connector is tuned by a process of determining an impedance profile for the RF connector, determining a structure of the insulating bead that provides the impedance profile, and forming the insulating bead by an additive manufacturing process. The additive manufacturing process can be a three-dimensional (3D) printing process.

IPC Classes  ?

  • H01R 24/28 - Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
  • H01R 43/18 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
  • B33Y 80/00 - Products made by additive manufacturing

92.

RF CONNECTOR

      
Application Number US2023027084
Publication Number 2024/010900
Status In Force
Filing Date 2023-07-07
Publication Date 2024-01-11
Owner SAMTEC, INC. (USA)
Inventor Hall Iii, Thomas A.

Abstract

An electrical connector includes a connector housing and a core that is inserted into the connector housing. The core includes a shell, a center conductor, a ground conductor, and an insulating spacer provided between the center conductor and the ground conductor. Internal components of the core can be manufactured by an additive manufacturing process.

IPC Classes  ?

  • H01R 24/38 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
  • H01R 13/646 - Details of coupling devices of the kinds covered by groups or specially adapted for high-frequency, e.g. structures providing an impedance match or phase match

93.

INTERCONNECT MODULE ASSEMBLY

      
Application Number US2023069329
Publication Number 2024/006880
Status In Force
Filing Date 2023-06-29
Publication Date 2024-01-04
Owner SAMTEC, INC. (USA)
Inventor
  • Mongold, John, A.
  • Epitaux, Marc
  • Ketwitz, Ronald

Abstract

An interconnect module and mating ring socket that form a vertical insertion interconnect module assembly are described. The interconnect module may be an optical transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a detachable cable assembly secured to the interconnect module by a cable latch. A slidable ring socket latch secures the interconnect module to the ring socket. A cable latch that secures the detachable cable assembly to the interconnect module has a pivot axis that can shift its position to facilitate latching and unlatching of the detachable cable assembly.

IPC Classes  ?

  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
  • H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
  • G02B 6/42 - Coupling light guides with opto-electronic elements

94.

VERTICAL INSERTION INTERCONNECTION SYSTEM WITH RING CONNECTOR FOR HIGH-SPEED DATA TRANSMISSION

      
Application Number 18248944
Status Pending
Filing Date 2021-10-13
First Publication Date 2023-12-07
Owner SAMTEC, INC. (USA)
Inventor
  • Zbinden, Eric
  • Mongold, John A.

Abstract

An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

IPC Classes  ?

  • G02B 6/42 - Coupling light guides with opto-electronic elements

95.

VERTICAL INTERCONNECT SYSTEM FOR HIGH-SPEED DATA TRANSMISSION

      
Application Number 18248930
Status Pending
Filing Date 2021-10-13
First Publication Date 2023-11-30
Owner SAMTEC, INC. (USA)
Inventor Zbinden, Eric

Abstract

A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

IPC Classes  ?

  • H01R 13/639 - Additional means for holding or locking coupling parts together after engagement
  • H01R 43/26 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
  • G02B 6/42 - Coupling light guides with opto-electronic elements

96.

Electrical connector

      
Application Number 29689980
Grant Number D1005964
Status In Force
Filing Date 2019-05-03
First Publication Date 2023-11-28
Grant Date 2023-11-28
Owner SAMTEC, INC. (USA)
Inventor
  • Faith, Chadrick Paul
  • Schmelz, Dale

97.

Connector

      
Application Number 29809263
Grant Number D1002550
Status In Force
Filing Date 2021-09-27
First Publication Date 2023-10-24
Grant Date 2023-10-24
Owner SAMTEC, INC. (USA)
Inventor
  • Musser, Randall E.
  • Buck, Jonathan E.

98.

TWINAXIAL CABLE SPLITTER

      
Application Number 17760138
Status Pending
Filing Date 2021-02-04
First Publication Date 2023-10-19
Owner SAMTEC, INC. (USA)
Inventor
  • Gore, Brandon Thomas
  • Mellitz, Richard
  • Yang, Gauss
  • Garrison, Kelly
  • Mcmorrow, Norman S.

Abstract

A twinaxial cable splitter includes first and second electrical splitter conductors that are configured to be placed in electrical communication with respective first and second signal conductors of a twinaxial electrical cable at one end of the electrical splitter conductors, and are configured to be placed in electrical communication with respective first and second electrical signal conductors of first and second coaxial electrical cables. Thus, the first and second coaxial electrical cables are placed in electrical communication with the first and second electrical signal conductors, respectively, of the twinaxial cable. The twinaxial cable is in electrical communication with an IC die package. The first and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package.

IPC Classes  ?

  • H01R 25/00 - Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
  • H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer

99.

FLEXIBLE CABLES AND WAVEGUIDES

      
Application Number US2023017020
Publication Number 2023/192552
Status In Force
Filing Date 2023-03-31
Publication Date 2023-10-05
Owner SAMTEC, INC. (USA)
Inventor
  • Garrison, Kelly
  • Epitaux, Marc
  • Mcmorrow, Norman, Scott
  • Baril, Sean
  • Chuganey, Shashi, Vashi
  • Moss, James, Alexander

Abstract

A signal transmission line, such as a waveguide or electrical cable, can include a spacer that bears against an electrical shield so as to provide enhanced structurally stability and increased signal integrity performance. The waveguide can be a hollow or semi-hollow waveguide. The electrical cable can be a coaxial or twinaxial electrical cable.

IPC Classes  ?

  • H01B 7/02 - Disposition of insulation
  • H01B 7/04 - Flexible cables, conductors, or cords, e.g. trailing cables
  • H01B 13/14 - Insulating conductors or cables by extrusion
  • H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
  • H01P 3/12 - Hollow waveguides

100.

Interconnection system, case assembly, electrical connector, assembly and connector assembly using detachable, cabled front-panel connector

      
Application Number 17768681
Grant Number 12244084
Status In Force
Filing Date 2020-11-12
First Publication Date 2023-09-21
Grant Date 2025-03-04
Owner Samtec, Inc. (USA)
Inventor
  • Kozlovsky, Christina
  • Shah, Jignesh H.
  • Zbinden, Eric J.

Abstract

An interconnection system is configured to be carried by a substrate and includes a cage that is configured to be connected to the substrate, that includes a first end and a second end opposed to the first end, and that is configured to receive an interconnection module; and an electrical connector located at the second end of the cage. The electrical connector includes a fixed connector that is configured to be rigidly attached to the substrate and a detachable connector that is configured to be mated and unmated from the fixed connector.

IPC Classes  ?

  • H01R 12/70 - Coupling devices
  • H01R 12/71 - Coupling devices for rigid printing circuits or like structures
  • H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
  • H01R 13/6583 - Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
  • H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
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