A method for forming a perovskite layer on a carrier substrate and a method for manufacturing a solar cell having such a perovskite layer. The method includes mixing a solution which contains a first and a second perovskite precursor at a mixing temperature, applying the solution to the carrier substrate, moving the carrier substrate together with the applied solution in a two-dimensional movement and simultaneously cooling the carrier substrate together with the applied solution to a deposition temperature below the carrier substrate starting temperature in order to produce a deposited layer which contains the first and the second perovskite precursor on the carrier substrate.
H10K 71/15 - Deposition of organic active material using liquid deposition, e.g. spin coating characterised by the solvent used
H10F 10/17 - Photovoltaic cells having only PIN junction potential barriers
H10F 71/00 - Manufacture or treatment of devices covered by this subclass
H10K 30/40 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
H10K 85/50 - Organic perovskitesHybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3
2.
PROCESS FOR THE FORMATION OF A PEROVSKITE LAYER IN PARTICULAR FOR A PHOTOVOLTAIC CELL
A method for forming a perovskite layer on a carrier substrate and a method for manufacturing a solar cell having such a perovskite layer. The method includes providing the carrier substrate coated with a first perovskite precursor layer composed of a first perovskite precursor, coating the first perovskite precursor layer on the carrier substrate with a second perovskite precursor layer by applying a solution, which contains a second perovskite precursor forming the second perovskite precursor layer, to a roll, and transferring the solution as a solution film to the first perovskite precursor layer by unrolling the roll along the first perovskite precursor layer, and heating the first perovskite precursor layer together with the solution film above a predetermined reaction temperature limit to initiate a chemical reaction between the first perovskite precursor and the second perovskite precursor.
The present invention relates to a vacuum lock (2) for a high-temperature process plant (42), and to a high-temperature process plant in which a heating chamber (3) is connected next to the vacuum lock (2) for processing, wherein the vacuum lock (2) has: a heating device having a first heat transfer medium (5) in fluid form for heating the vacuum lock (2), a heat exchanger (20), and a first heat transfer medium circuit (8) for the first heat transfer medium (5) with circulation of the heat transfer medium (5) from the heat exchanger (20) to the heating device of the vacuum lock (2) and back to the heat exchanger (20), wherein the heat exchanger (20) is designed to heat the first heat transfer medium (5) by means of a second heat transfer medium circuit (9) coupled to the heat exchanger (20).
The present invention relates to a system for treating a metal foil, wherein the system comprises a first roller, a second roller, and a treatment zone arranged therebetween, wherein the treatment zone has a planar surface over which the metal foil is guided during treatment, wherein the system is configured such that a magnetic field can be generated in the treatment zone during treatment.
A carrier cassette for wafers comprises two side plates facing each other in a first direction, each of which comprises a locking groove on an upper side of the same, at least one lower retaining rod mounted between the two opposing side plates, and at least two lateral retaining rods facing each other in a second direction, mounted between the two opposing side plates, and an upper locking rod that can be locked in the locking grooves of the opposing side plates to hold down wafers in the carrier cassette. The upper locking rod is configured to hold down the two rows of wafers and comprises projections configured to separate wafers of both rows adjacent in the first direction from each other when the upper locking rod is locked in the locking grooves.
System comprising a supply zone, a first and a second output zone, each comprising. an output handling device, at least a first waiting zone, a transfer zone comprising a manipulator, at least one tray picking handling device and two tray carriages. The at least one tray picking handling device is adapted to remove at least two tray units from a stack of a plurality of tray units at the same time and to move the removed tray units from the supply zone to a first waiting position in the first waiting zone and/or the two tray carriages can be moved on vertically offset paths.
The invention relates to a lock valve with a lock valve opening, a lock valve cover (4), at least one lever arm (5), and at least one coupling system, wherein the lock valve opening is bordered by a flange (1) with a first sealing surface (3), the lock valve cover has a front face with a second sealing surface (12), and the coupling system has a bolt (6), a centering disc (7), and an elastic element (8); the bolt has a first end with a bolt head (62) and a second end which is secured to the lever arm, the centering disc has a centering disc opening which extends through the centering disc, the centering disc being secured to the lock valve cover and provided between the first and the second end of the bolt in such a way that the bolt projects through the centering disc opening, and the elastic element is provided between the lever arm and the centering disc; and, when the lock valve is in a closed state, the second sealing surface is in gas-tight contact with the first sealing surface, and a force transmission path runs from the lever arm to the flange via the elastic element.
F16K 51/02 - Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
F16K 1/20 - Lift valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure members with pivoted discs or flaps with axis of rotation arranged externally of valve member
8.
APPARATUS AND METHOD FOR TREATING WAFERS USING GUIDING ELEMENTS
An apparatus for treating wafers includes a basin, a hole plate, a filling pipe and guiding elements. The basin serves to receive a treatment liquid and the wafers to be treated. The hole plate separates the basin in an upper and lower areas, wherein the hole plate comprises holes that fluidically connect the lower area and the upper area. The upper area comprises a receiving area for one or several wafer carriers in which wafers are arranged side-by-side with a gap in between. The filling pipe is disposed in the lower area of the basin and comprises filling pipe openings along its longitudinal direction. The guide elements are disposed in the upper area of the basin, in addition to the outer walls of the basin, and laterally limit the receiving area of at least one wafer carrier to concentrate a flow of the treatment liquid on the receiving area.
An apparatus for treating wafers with the treatment liquid comprises a basin, a hole plate, a filling pipe and separating elements. The basin serves to receive the treatment liquid and the wafers to be treated. The hole plate separates the basin in an upper area and a lower area, wherein the hole plate comprises holes that fluidically connect the lower area and the upper area. The filling pipe is disposed in the lower area of the basin and comprises filling pipe openings along its longitudinal direction. The separating elements are disposed in the lower area of the basin between at least some filling pipe openings and extend in a direction that intersects the longitudinal direction of the filling pipe in order to at least reduce flows of the treatment liquid in longitudinal direction of the filling pipe between the at least some of the filling pipe openings.
The invention relates to a coating source with additional dopants for a coating installation, to a coating installation having such a coating source, and to a method for coating substrates using such a coating source.
The present invention relates to a coating plant for coating substrates by means of sputtering as well as a process for replacing a target in such a coating plant.
The present invention relates to a coating source for a coating plant, a coating plant with such a coating source and a method for coating substrates using such a coating source. Furthermore, the present invention relates to a method for refilling a coating source.
C23C 16/448 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
14.
CONTAINER FOR HOLDING BULK MATERIAL WHILE IT IS BEING INTRODUCED INTO A FLUID, AND METHOD FOR PRODUCING A CONTAINER
A description is given of a container (1) for holding bulk material, such as for example silicon fragments (3), while it is being introduced into a fluid, such as for example while it is being immersed in a liquid (5), and of a method for producing such a container. The container (1) comprises a base structure (7), which delimits a holding volume (9) of the container (1) in a lower region, and comprises a number of side walls (11), which laterally surround the holding volume (9) and are each disposed transversely in relation to the base structure (7). The base structure (7) is formed in one piece from a plate (17) and has a trapezoidal-profile-like geometry, in which some lower-lying elongated subregions (19) form depressed areas of the base structure (7), which are separated from adjacent areas of the base structure (7) by higher-lying elongated subregions (21) extending between them. The base structure (7) also has a multiplicity of through-holes (23).
A carrier cassette for wafers comprises: two side plates which are mutually opposite in a first direction and each of which has a locking slot on a top side thereof; at least one lower holding rod which is attached between the two mutually opposite side plates; and at least two side holding rods which are mutually opposite in a second direction and which are attached between the two mutually opposite side plates; and an upper locking rod which can be locked in the locking slots of the mutually opposite side plates in order to hold down wafers in the carrier cassette. The side plates, the at least one lower holding rod, the at least two side holding rods and the upper locking rod delimit two receiving regions for two rows of wafers, said rows extending in the first direction, and the two receiving regions being mutually adjacent in the second direction. The upper locking rod is designed to hold down the two rows of wafers and has protrusions, each protrusion being designed to separate associated wafers of the two rows, said wafers being adjacent to one another in the first direction, from one another when the upper locking rod is locked in the locking slots.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
16.
Coating chamber with distance detection for the substrates
The invention relates to a system comprising a first trough (21) and a second trough (22), the openings of which face in different directions, and a rotary mechanism suitable for rotating the first and the second trough about a common axis of rotation; to a wet-chemical production plant comprising such a system; and to a method for removing objects from a transporting and handling means using such a system.
Described are a process for forming a perovskite layer (1) on a carrier substrate (3) and a process for manufacturing a photovoltaic cell (29) comprising a perovskite layer of said kind. The process comprises at least the following steps: providing the carrier substrate (3) that is coated with a first perovskite precursor layer (5) made of a first perovskite precursor; coating the first perovskite precursor layer (5) on the carrier substrate (3) with a second perovskite precursor layer (7) by - applying a solution containing a second perovskite precursor forming the second perovskite precursor layer onto a roll (11), and - transferring the solution (9) as a solution film (13) forming the second perovskite precursor layer (7) to the first perovskite precursor layer (5) by rolling the roll (11) along the first perovskite precursor layer (5); and heating the first perovskite precursor layer (5) along with the solution film (13) to a temperature above a specified limit reaction temperature in order to initiate a chemical reaction between the first perovskite precursor and the second perovskite precursor.
H10K 71/13 - Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
H10K 85/50 - Organic perovskitesHybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3
19.
PROCESS FOR THE FORMATION OF A PEROVSKITE LAYER IN PARTICULAR FOR A PHOTOVOLTAIC CELL
Described are a process for forming a perovskite layer (1) on a carrier substrate (3) and a process for manufacturing a photovoltaic cell comprising a perovskite layer of said kind. The process comprises at least the following steps: - mixing a solution containing a first perovskite precursor (7) and a second perovskite precursor (9) at a mixing temperature (T1); - applying the solution (5) to the carrier substrate (3), the temperature of which has optionally been brought to a carrier substrate starting temperature (T2); - moving the carrier substrate (3) along with the applied solution (5) in a two-dimensional movement and simultaneously cooling the carrier substrate (3) along with the applied solution (5) to a deposition temperature (T3) lying below the carrier substrate starting temperature (T2) in order to produce, on the carrier substrate (3), a deposited layer (11) containing the first and second perovskite precursors (7, 9); - optionally: removing a non-deposited portion (13) of the solution (5) from the carrier substrate (3); and - optionally: heating the deposited layer (11) to above a drying temperature (T4) lying above the deposition temperature (T3) in order to initiate a chemical reaction between the first perovskite precursor (7) and the second perovskite precursor (9).
A system comprising a feeder zone (2), at least a first and a second loading zone (3, 5), at least one first waiting zone (6), at least one transfer zone (7), and at least two tray carriages (8, 9). Each loading zone has at least one loading station and at least one loading elevator, each transfer zone (7) has at least one stack handling unit (71), and the tray carriages (8, 9) can be moved in the horizontal direction on vertically offset conveyance paths.
B65G 57/30 - Stacking of articles by adding to the bottom of the stack
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
B65G 25/06 - Conveyors comprising a cyclically-moving, e.g. reciprocating, carrier or impeller which is disengaged from the load during the return part of its movement the carrier or impeller having identical forward and return paths of movement, e.g. reciprocating conveyors having carriers, e.g. belts
In a method for generating a textured surface of a semiconductor layer, a surface of the semiconductor layer is etched anisotropically with a first alkaline etching solution to generate a surface of the semiconductor layer including pyramid-shape textures. Subsequently, the surface including the pyramid-shaped textures is etched anisotropically with a second alkaline etching solution, which differs from the first alkaline etching solution, to cause material removal of the pyramid-shaped textures, thereby reducing a height difference between peaks and neighboring valleys of the pyramid-shaped textures. A method for manufacturing a tandem solar cell further includes generating a first solar cell structure of the tandem solar cell including the textured surface, and generating a second solar cell structure of the tandem solar cell on the side of the first solar cell structure on which the textured surface is arranged.
The invention relates to a lock chamber for a substrate treatment system with a inlet lock flap and an outlet lock flap, wherein the lock chamber is suitable and designed for introducing a ventilation gas into the interior of the lock chamber, wherein the lock chamber furthermore has, in its interior, at least two parallel shielding plates, a transport device for transporting a substrate through between the shielding plates and a heating device, wherein the shielding plates have a material which is at least partially transparent at least in the infrared range. The invention also relates to a substrate treatment system having such a lock chamber, and to a method for transferring a glass substrate from a low-pressure region into a region with higher pressure by means of such a lock chamber.
C03C 17/00 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating
C03C 23/00 - Other surface treatment of glass not in the form of fibres or filaments
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
C23C 14/56 - Apparatus specially adapted for continuous coatingArrangements for maintaining the vacuum, e.g. vacuum locks
23.
METHOD AND WET BENCH FOR THE IN-LINE PROCESSING OF SOLAR-CELL SUBSTRATES
A method and a wet bench for processing a plurality of solar cell substrates are described. Each solar cell substrate includes a silicon wafer. The method includes steps of removing at least a partial area of a near-surface layer of the silicon wafer by an etching process by treating the surface of the solar cell substrate with an etching liquid, and producing a silicon oxide thin film at least on a partial surface of the solar cell substrate by treating the partial surface with an oxidising liquid. The solar cell substrates are subjected to process steps (i) and (ii) sequentially, one after the other within a single processing apparatus. The wet bench usable for etching liquid baths as well as oxidation liquid baths in which the solar cell substrates may be superficially oxidised, for example in an ozone-containing solution.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
The present invention relates to a coating source for a coating plant, a coating plant with such a coating source and a method for coating substrates using such a coating source.
The invention relates to a device for treating wafers using a treatment liquid, having a basin, a perforated plate, a filling tube, and separating elements. The basin is used to receive the treatment liquid and the wafers to be treated. The perforated plate separates the basin into an upper region and a lower region, said perforated plate having holes which fluidically connect the lower region and the upper region. The filling tube is arranged in the lower region of the basin and has filling tube openings along the longitudinal direction of the filling tube. The separating elements are arranged in the lower region of the basin between at least some of the filling tube openings of the filling tube and extend in a direction which intersects the longitudinal direction of the filling tube in order to at least reduce the flow of the treatment liquid in the longitudinal direction of the filling tube between said tube filling openings.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B01F 23/231 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids by bubbling
B01J 19/26 - Nozzle-type reactors, i.e. the distribution of the initial reactants within the reactor is effected by their introduction or injection through nozzles
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
27.
DEVICE AND METHOD FOR TREATING WAFERS USING GUIDE ELEMENTS
The invention relates to a device for treating wafers using a treatment liquid, having a basin, a perforated plate, a filling tube, and guide elements. The basin is used to receive the treatment liquid and the wafers to be treated. The perforated plate separates the basin into an upper region and a lower region, said perforated plate having holes which fluidically connect the lower region and the upper region. The upper region has a receiving region for one or more wafer carriers in which respective wafers are arranged next to one another in a mutually spaced manner. The filling tube is arranged in the lower region of the basin and has filling tube openings along the longitudinal direction of the filling tube. The guide elements are arranged in the upper region of the basin in addition to outer walls of the basin and laterally delimit the receiving region of at least one wafer carrier in order to concentrate the flow of the treatment liquid onto the receiving region.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B01F 23/231 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids by bubbling
B01J 19/26 - Nozzle-type reactors, i.e. the distribution of the initial reactants within the reactor is effected by their introduction or injection through nozzles
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
The present invention relates in general to a carrier for the edge passivation of semiconductor elements and, specifically, to a storage insert for receiving a stack of multiple wafers or semiconductor elements, to a carrier for a plurality of such storage inserts and to a method for populating such a carrier.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
the present invention relates to a spacer device for a heating system for heating large-area substrates, a heating system for heating large-area substrates, and a method for heating large-area substrates.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
30.
PROCESS FOR MANUFACTURING A STARTING MATERIAL FOR A SILICON SOLAR CELL HAVING PASSIVATED CONTACTS
The present invention is directed to a process for manufacturing a starting material for a silicon solar cell having passivated contacts, a system for carrying out the process, and an intermediate product resulting from the process.
The invention relates to removal handling with a first row and a second row each comprising at least two suction units for extracting products by suction, wherein the rows extend in the longitudinal direction of the removal handling, and the rows are arranged parallel to one another and are movable in the transverse direction. The distance between the individual rows is adjustable, and the distances between the suction units in each of the first and second rows are adjustable. Furthermore, a drip tray is movably arranged at each row in such a way that the drip tray can be moved into a first position beneath the suction units or can be moved into a second position, which is not beneath the suction units.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B65G 47/91 - Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
A detent pawl with a detent and a bellows-type suction element, the detent having a suction surface and a rotatably mounted lever with a projection, and the bellows-type suction element having a front face that is in suctioning contact with the suction surface of the detent; and a detent pawl mechanism comprising a detent pawl and a vacuum pump.
The present invention relates very generally to the monitoring of a flame treatment device and in particular to a substrate treatment system having a flame treatment device and first and second substrate monitoring units.
The invention relates to an installation with a supply zone, a first and a second dispensing zone each with a dispensing handling unit, at least a first waiting zone, a transfer zone with a manipulator, at least one tray removal handling system and two tray slides. The at least one tray removal handling system is suitable for removing at least two tray units simultaneously from a stack of several tray units and for moving the removed tray units from the supply zone to a first waiting position in the first waiting zone and/or the two tray slides can be moved along vertically offset paths.
A continuous through-flow plant with a loading unit, at least one wet-chemical processing module and a treatment module. The treatment module defines a continuous through-flow path for product carriers and is functionally connected to the loading unit and/or at least one of the at least one processing modules in such a way that product carriers can be fed from the processing module to the treatment module and/or that product carriers can be fed from the treatment module to the loading unit. The treatment module is arranged in the continuous through-flow plant in such a way that it can be operated independently of the operating status of the at least one processing module and comprises a cleaning area for cleaning and drying product carriers and a storage area for storing the product carriers. The cleaning area has at least one turning zone with at least one turning unit, which is suitable for turning product carriers about a horizontal axis.
B08B 3/02 - Cleaning by the force of jets or sprays
B08B 3/04 - Cleaning involving contact with liquid
B65G 35/06 - Mechanical conveyors not otherwise provided for comprising a load-carrier moving along a path, e.g. a closed path, and adapted to be engaged by any one of a series of traction elements spaced along the path
The present invention relates to a coating plant for coating substrates by cathode sputtering, and to a method for replacing a target in such a coating plant.
C23C 14/35 - Sputtering by application of a magnetic field, e.g. magnetron sputtering
H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
F16B 12/20 - Jointing of furniture or the like, e.g. hidden from exterior using pegs, bolts, tenons, clamps, clips, or the like for non-metal furniture parts, e.g. made of wood, of plastics using clamps, clips, wedges, sliding bolts, or the like
Coating machine for thin film application; Sputtering machine; Machine tools, namely, process modules for oxidation, preclean modules, deposition modules, rotating substrate modules and linear dynamic deposition modules as parts of a cluster modular machine for coating; Machine Systems including machines and machine tools for processes, namely, coating processes, surface treatment processes, semiconductor frontend process, semiconductor backend process and wafer level packaging processes
The present invention relates to a slit diaphragm, a slit diaphragm system comprising at least two slit diaphragms arranged adjacent to each other and to a coating module and coating facility comprising a slit diaphragm.
In a method for producing a textured surface of a semiconductor layer, a surface of the semiconductor layer is etched with a first alkaline etching solution to produce a surface of the semiconductor layer having pyramid-like textures. The surface having the pyramid-like textures is then etched with a second alkaline etching solution, which is different from the first alkaline etching solution, to bring about material removal from the pyramid-like textures, as a result of which a height difference between peaks and adjacent valleys of the pyramid-like textures is reduced. A method for manufacturing a tandem solar cell further comprises producing a first solar cell structure of the tandem solar cell that has the textured surface produced in this way, and producing a second solar cell structure of the tandem solar cell on the side of the first solar cell structure on which the textured surface is arranged.
H01L 31/078 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier including different types of potential barriers provided for in two or more of groups
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
42.
HEATING SYSTEM AND METHOD FOR HEATING LARGE-SURFACE SUBSTRATES
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Coating machine for thin film application; Sputtering machine; Machine tools, namely process modules for oxidation, preclean modules, deposition modules, rotating substrate modules and linear dynamic deposition modules as parts of a cluster modular machine for coating; Machine Systems including machines and machine tools for coating, surface treatment, semiconductor frontend processing, semiconductor backend processing and wafer level packaging.
44.
METHOD AND SYSTEM FOR THE PRODUCTION OF A STARTING MATERIAL FOR A SILICON SOLAR CELL WITH PASSIVATED CONTACTS
The present invention is directed to a method as well as to a machine for producing a starting material for a silicon solar cell with passivated contacts.
H01L 31/20 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor material
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
45.
COATING CHAMBER WITH DISTANCE DETECTION FOR THE SUBSTRATES
C23C 14/52 - Means for observation of the coating process
G01J 5/00 - Radiation pyrometry, e.g. infrared or optical thermometry
C23C 14/56 - Apparatus specially adapted for continuous coatingArrangements for maintaining the vacuum, e.g. vacuum locks
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The present invention relates to a coating source for a coating installation, to a coating installation having such a coating source, and to a method for coating substrates using such a coating source. The present invention further relates to a method for refilling a coating source.
The present invention relates to a coating source for a coating installation, to a coating installation having such a coating source, and to a method for coating substrates using such a coating source.
A method and a wet bench (1) for the processing of a number of solar-cell substrates (5) are described. Each solar-cell substrate (5) comprises a silicon wafer. The method comprises at least the following process steps: (i) removing at least a partial region (75) of a layer near the surface of the silicon wafer by means of an etching process by treating the surface of the solar-cell substrate with an etching fluid, and (ii) generating a silicon oxide thin film (77) at least on a partial surface of the solar-cell substrate by treating the partial surface with an oxidizing liquid. The solar-cell substrates are subjected to process steps (i) and (ii) sequentially, one after the other, within an individual processing apparatus (3). The wet bench (1) that can be used for this comprises not only an etching-fluid tank (13) but also an oxidation-liquid tank (33), in which the solar-cell substrates can be superficially oxidized, for example in an ozone-containing solution.
H01L 31/068 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/20 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor material
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
49.
SPACER DEVICE FOR A HEATING SYSTEM FOR HEATING LARGE-AREA SUBSTRATES, HEATING SYSTEM, AND HEATING METHOD
The invention relates to a spacer device for a heating system for heating large-area substrates, a heating system for heating large-area substrates, and a method for heating large-area substrates.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
51.
PROCESS FOR MANUFACTURING A STARTING MATERIAL FOR A SILICON SOLAR CELL HAVING PASSIVATED CONTACTS
The invention relates to a process for manufacturing a starting material for a silicon solar cell having passivated contacts, a system for carrying out said process, and an intermediate product obtained in said process.
H01L 31/0745 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
The present invention relates very generally to the monitoring of a flame treatment device and in particular to a substrate treatment system having a flame treatment device and first and second substrate monitoring units.
The present invention relates to a substrate carrier for accommodating and transporting a substrate, to a changing station comprising such a substrate carrier as well as to a method for treating a substrate.
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
C03B 32/00 - Thermal after-treatment of glass products not provided for in groups , e.g. crystallisation, eliminating gas inclusions or other impurities
55.
PLASMA TREATMENT SYSTEM AND PLASMA TREATMENT METHOD
A treatment system (100) comprises a process chamber (101) for dynamic or static treatment of at least one substrate. An inductively coupled plasma source, ICP source (120, 120′), comprises at least one inductor (130a, 130b) extending along the longitudinal direction of the ICP source (120, 120′), a gas supply device (141, 142) for one or a plurality of process gases, and a gas directing arrangement (150) disposed in the process chamber (101), said gas directing arrangement (150) extending along the longitudinal direction of the ICP source (120, 120′) and partially surrounding the at least one inductor (130a, 130b).
The present invention relates to a slit diaphragm, to a slit diaphragm system comprising at least two slit diaphragms positioned adjacent to one another, and to a coating module or a coating unit having a slit diaphragm.
H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
C23C 14/22 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
58.
CONTINUOUS FLOW SYSTEM AND METHOD FOR COATING SUBSTRATES
A continuous machine (100) for coating substrates (103) comprises a process module (130) and a vacuum lock (110, 150) for introducing the substrates (103) or removing the substrates (103). The vacuum lock (110, 150) comprises a chamber for receiving a substrate carrier (102) with a plurality of substrates (103) and a flow channel arrangement for evacuating and venting the chamber. The flow channel arrangement comprises a first channel for evacuating and venting the chamber and a second channel for evacuating and venting the chamber, wherein the first channel and the second channel are arranged at opposing sides of the chamber.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
C23C 14/56 - Apparatus specially adapted for continuous coatingArrangements for maintaining the vacuum, e.g. vacuum locks
C23C 16/54 - Apparatus specially adapted for continuous coating
C23C 16/50 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
H01L 31/0747 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells comprising a heterojunction of crystalline and amorphous materials, e.g. heterojunction with intrinsic thin layer or HIT® solar cells
H01L 31/0368 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 31/068 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
C23C 16/448 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
B01B 1/00 - BoilingBoiling apparatus for physical or chemical purposes
C23C 16/52 - Controlling or regulating the coating process
G05D 23/19 - Control of temperature characterised by the use of electric means
62.
Treatment machine, drive unit for a treatment machine and use of the treatment machine
A treatment machine comprises a chamber for the treatment of one substrate or a plurality of substrates. A rotatably supported temperature-controlled shaft (30) defines a cylindrical, gas-tight hollow space. A heating arrangement (40, 50) is provided for electrically heating at least a part of the shaft (30) arranged in the chamber. The heating arrangement (40, 50) comprises an accommodation mandrel (40) for accommodating at least one electrical heating element (50), said accommodation mandrel (40) being arranged in a non-rotating manner and extending into the hollow space of the shaft (30). An outer surface of the accommodation mandrel (40) is spaced apart from an inner surface of the shaft (30) by a gap.
B05C 9/14 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating
B21K 1/10 - Making machine elements axles or shafts of cylindrical form
C21D 9/28 - Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articlesFurnaces therefor for plain shafts
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Machines for surface treatment; machines for cleaning;
machines for etching; industrial robots; machines for wet
chemical treatment; machines for washing, cleaning and
pre-cleaning; machines for ultra- or mega-sonic cleaning;
machines for surface conditioning; machines for wet chemical
coating, machines for wet chemical etching; machines for
surface modification; machines for electrochemical etching;
machines for drying; automated handling apparatus; moving
and handling equipment; industrial handling apparatus for
use in the handling of workpieces; apparatus for handling
materials; mechanisms being parts of loading-unloading
machines and apparatus; industrial machines combining
several functions for material treatment and automated
handling.
64.
PLASMA TREATMENT SYSTEM AND PLASMA TREATMENT METHOD
A treatment system (100) has a process chamber (101) for dynamic or static treatment of at least one substrate. An inductively coupled plasma source, ICP source (120, 120'), has at least one inductor (130a, 130b) that extends in the longitudinal direction of the ICP source (120, 120'), a gas supply device (141, 142) for one or more process gases and a gas directing arrangement (150) which is disposed in the process chamber (101) and extends in the longitudinal direction of the ICP source (120, 120') and partly surrounds the at least one inductor (130a, 130b).
Vacuum coating machines; automated handling apparatus;
moving and handling equipment; industrial handling apparatus
for use in the handling of workpieces; apparatus for
handling materials; mechanisms for transportation; machines
for surface treatment; combinations of industrial machines
and automated handling apparatus for performing several
processes regarding treatment of materials; industrial
machines combining several functions for material treatment
and automated handling; inline machine systems, namely
machines and machine components for coating, plasma
treatment, vacuum deposition; machines for vacuum coating,
in particular physical or chemical vapour deposition, on
planar and threedimensional substrates, in particular
plastic, glass, ceramic or metal substrates, in particular
in the fields of food, beverages, cosmetics, jewelry,
automotive, optics, sanitary engineering, lighting, medical
engineering, consumer and household electronics and other
industrial applications.
66.
Vacuum lock and method for transferring a substrate carrier
A vacuum lock for a vacuum coating plant comprises a chamber for receiving a substrate carrier, wherein the chamber comprises a first and a second inner surface. A conveyor is configured for conveying the substrate carrier. The vacuum lock comprises a flow channel assembly for evacuating and venting the chamber, the flow channel assembly being configured to cause a gas flow between both the first inner surface and a first substrate carrier surface facing the first inner surface and between the second inner surface and a second substrate carrier surface facing the second inner surface. The substrate carrier can be positioned between the first and the second inner surfaces such that a ratio of a first distance between the first inner surface and the first substrate carrier surface to a length (L) of the substrate carrier is smaller than 0.1, and a ratio of a second distance between the second inner surface and the second substrate carrier surface to a length (L) of the substrate carrier is smaller than 0.1.
09 - Scientific and electric apparatus and instruments
20 - Furniture and decorative products
37 - Construction and mining; installation and repair services
Goods & Services
Machines for plasma surface treatment; machines for chemical
surface treatment; sputter coating machines; machines for
vacuum deposition; machines for cleaning; machines for
etching; machines for injection molding; machines for
replication; machines for lacquering; machines for
embossing; machines for UV-curing; machines for quality
inspection; machines for nano imprint lithography; machines
for laser exposure, machines for photoresist developing;
machines for laser beam recording; machines for thermal
treatment (heating and cooling); machines for wet chemical
treatment; machines for wet chemical deposition; automated
handling apparatus; moving and handling equipment;
industrial handling apparatus for use in the handling of
workpieces; apparatus for handling materials; mechanisms for
transportation; combinations of industrial machines and
automated handling apparatus for performing several
processes regarding treatment of materials; industrial
machines combining several functions for material treatment
and automated handling; in line machine systems, namely
machines and machine tools for coating, surface treatment,
thermal treatment, plasma treatment, spraying, vacuum
deposition, lacquering, cleaning, etching. Application software; artificial intelligence and machine
learning software; artificial intelligence software for
surveillance; artificial intelligence software for analysis;
measuring, detecting, monitoring and controlling devices. Receptacles of plastic for storing, transporting and
processing substrates, in particular wafers. Installation, repair and maintenance services in relation to
machines, machine components and machine combinations;
installation, repair and maintenance services in relation to
measuring, detecting, monitoring and controlling devices.
09 - Scientific and electric apparatus and instruments
20 - Furniture and decorative products
37 - Construction and mining; installation and repair services
Goods & Services
Machines for plasma surface treatment; machines for chemical surface treatment; machines for large area coating using sputter deposition, namely horizontal or vertical or tilted sputtering deposition and machines for vacuum deposition for coating of layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric ,transparent and electrically conductive or passivating layers, in particular using physical or chemical vapour deposition; machines, namely, physical or chemical vacuum deposition machines for coating planar and three-dimensional substrates and machines for multi-layer vacuum deposition for coating of metals and ceramics; machines for vacuum deposition for coating of layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric, transparent and electrically conductive or passivating layers, in particular using physical or chemical vapour deposition on substrates; machines for large area coating using vacuum deposition, namely horizontal or vertical or tilted sputtering deposition for vacuum deposition for coating of metal, metal alloys, metal oxides or metal nitrides; machines for the production of optical storage media and optical storage discs for high-definition and ultra-definition resolution content for vacuum deposition for coating of metals, metal alloys, metal oxides or metal nitrides; machines for vacuum deposition for coating of metals, metal alloys, phase transition ceramics or semiconductors; combinations of machines for automation of substrate handling and processing for the refinement of planar and three-dimensional substrates namely for vacuum deposition for coating of metals, metal alloys, metal oxides, or metal nitrides semiconductors; machines for cleaning glass or silicon substrates; in-line machines for cleaning thin-film solar cells; machines for cleaning of substrates, namely, semiconductor and glass wafers and machines for cleaning for single side and double side processing of glass and silicon substrates; machines for chemical cleaning of mono and multi crystalline silicon; machines for etching thin-film solar cells; machines for etching substrates, namely, semiconductor and glass wafers; in-line machines for acidic etching or alkaline etching, for single side and double side processing; machines for chemical etching of mono and multi crystalline silicon; machines for injection molding; machines for replication being manufacturing, namely manufacturing of optical discs including CD, DVD, HD-DVD and other types of optical discs and optical storage media; machines for lacquering; machines for embossing; machines for nano imprint lithography by wet embossing; machines for laser exposure changing a material from an amorphous structure into a crystalline structure; machines for photoresist developing in the nature of laser exposure or laser beam recording; machines for laser beam recording, namely, for the production of master disc for the replication of optical disc or optical storage media; machines for wet chemical treatment, namely, machines used for wet-chemical etching, cleaning, coating and drying of substrates; machines for wet chemical deposition; automated cargo handling apparatus, namely for transporting, conveying, lifting, handling, loading and packaging objects, parts, workpieces, and materials; moving and handling equipment, namely handling arms conveyors being cargo handling machines, conveyor belts and industrial robots; mechanisms for transportation, namely, pneumatic transporters; combinations of industrial machines and automated handling apparatus for performing several processes regarding treatment of materials, namely for automation of substrate handling and processing for the refinement of planar and three-dimensional substrates, namely for vacuum deposition for coating of layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric, transparent and electrically conductive or passivating layers, in particular using physical or chemical vapour deposition, for surface treatment of substrates, for lacquering, namely, spray-coating of substrates with UV curable lacquer or solvent based lacquer, for UV-curing or drying; combinations of machines for manufacturing silicon solar cells, namely for automation of substrate handling and processing, for vacuum deposition for coating of transparent, conductive, metallic, semi-conductive, non-conductive, dielectric, transparent and electrically conductive, or passivating layers, for wet chemical treatment of substrates, for laser ablation, namely, electrical insulating, for structuring, for contact opening, for contact firing of substrates and screen print and for thermal treatment of substrates; combinations of industrial machines and automated handling apparatus for performing several processes regarding treatment of materials, namely for manufacturing thin film solar cells, namely for automation of substrate handling and processing, for vacuum deposition for coating of substrates, for wet chemical treatment of substrates, for laser ablation, namely, surface structuring, electrical insulation or cell formation of substrates, or thermal treatment of substrates and for lamination or contacting substrates; in line machine systems, namely, machines and machine tools for coating, surface treatment, thermal treatment, plasma treatment, spraying, vacuum deposition, lacquering, cleaning, etching in the nature of in-line machines for wet chemical treatment, for etching, cleaning, coating and drying thin-film solar cells or glass or silicon substrates, semiconductor devices and optical components Downloadable industrial automation software for use in controlling automated machines; downloadable and recorded software featuring artificial intelligence and machine learning for use in the operation of automated machines; downloadable software featuring artificial intelligence for use in condition monitoring of machines; Downloadable factory automation software, namely, software to integrate manufacturing machine operations, track problems and generate production reports; Measuring apparatus and instruments for measuring layer thickness, reflection of light and electromagnetic waves, sound waves, transmission of light and electromagnetic waves, namely, spectrometers; measuring apparatus and instruments for measuring sheet resistance with two or four pin probes or eddy current probes; measuring apparatus and instruments for measuring material composition of optical storage media, CDs, and DVDs, glass, solar cells, planar and three-dimensional substrates, in particular plastic, glass, ceramic or metal substrates, layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric, transparent and electrically conductive or passivating layers, single and polycrystalline thin films media, UV curable lacquer, metals, metal alloys, metal oxides or metal nitrides, thin-wall optical parts and micro-structured parts, microfluidic devices, micro electro mechanical structures; magnetic sensors, namely, sensors for measuring the magnetic field of, anisotropic magnetoresistance, giant magnetoresistance and tunnel magnetoresistance structures, semiconductor devices and optical components, none of which are for medical purposes Receptacles of plastic for commercial use, namely, plastic containers for storing, transporting and processing substrates, in particular silicon wafers Installation, repair and maintenance of machines for vacuum coating, thermal treatment, lacquering, chemical treatment media supply, automation and combinations thereof as well as component parts of those machines; installation, repair and maintenance of measuring apparatus and instruments being parts of machines and/or machine combinations; installation, repair and maintenance services in relation to measuring, detecting, monitoring and controlling devices
09 - Scientific and electric apparatus and instruments
20 - Furniture and decorative products
37 - Construction and mining; installation and repair services
Goods & Services
Machines for plasma surface treatment; machines for chemical surface treatment; sputter coating machines; machines for vacuum deposition; machines for cleaning; machines for etching; machines for injection molding; machines for replication; machines for lacquering; machines for embossing; machines for UV-curing; machines for quality inspection; machines for nano imprint lithography; machines for laser exposure, machines for photoresist developing; machines for laser beam recording; machines for thermal treatment (heating and cooling); machines for wet chemical treatment; machines for wet chemical deposition; automated handling apparatus; moving and handling equipment; industrial handling apparatus for use in the handling of workpieces; apparatus for handling materials; mechanisms for transportation; combinations of industrial machines and automated handling apparatus for performing several processes regarding treatment of materials; Industrial machines combining several functions for material treatment and automated handling; Inline machine systems, namely machines and machine tools for coating, surface treatment, thermal treatment, plasma treatment, spraying, vacuum deposition, lacquering, cleaning, etching. Application Software; artificial intelligence and machine learning software; artificial intelligence software for surveillance; artificial intelligence software for analysis; measuring, detecting, monitoring and controlling devices. Receptacles of plastic for storing, transporting and processing substrates, in particular wafers. Installation, repair and maintenance services in relation to machines, machine components and machine combinations; installation, repair and maintenance services in relation to measuring, detecting, monitoring and controlling devices.
Vacuum coating machines; automated handling apparatus; moving and handling equipment; industrial handling apparatus for use in the handling of workpieces; apparatus for handling materials; mechanisms for transportation; machines for surface treatment; combinations of industrial machines and automated handling apparatus for performing several processes regarding treatment of materials; industrial machines combining several functions for material treatment and automated handling; inline machine systems, namely machines and machine components for coating, plasma treatment, vacuum deposition; machines for vacuum coating, in particular physical or chemical vapour deposition, on planar and threedimensional substrates, in particular plastic, glass, ceramic or metal substrates, in particular in the fields of food, beverages, cosmetics, jewelry, automotive, optics, sanitary engineering, lighting, medical engineering, consumer and household electronics and other industrial applications.
Machines for surface treatment; machines for cleaning; machines for etching; industrial Robots; machines for wet chemical treatment; machines for washing, cleaning and pre-cleaning; machines for ultra- or mega-sonic cleaning; machines for surface conditioning; machines for wet chemical coating, machines for wet chemical etching; machines for surface modification; machines for electrochemical etching; machines for drying; automated handling apparatus; moving and handling equipment; industrial handling apparatus for use in the handling of workpieces; apparatus for handling materials; mechanisms for transportation; Industrial machines combining several functions for material treatment and automated handling.
An illuminant comprising a transparent substrate layer with a first index of refraction, a connecting layer with a second index of refraction that differs from the first index of refraction, and a metallic, translucent layer, wherein the connecting layer is arranged between the substrate layer and the metallic layer, and wherein on the side facing the connecting layer the substrate layer comprises a plurality of decoupling structures suitable for decoupling light that propagates within the substrate layer from the substrate layer in the direction towards the metallic layer.
The invention relates to a continuous flow system (100) for coating substrates (103) comprising a treatment module (130) and a vacuum sluice (110, 150) for introducing the substrates (103) or for discharging the substrates (103). The vacuum sluice (110, 150) has a chamber for receiving a substrate carrier (102) having a plurality of substrates (103) and a flow channel arrangement for evacuating and flooding the chamber. The flow channel arrangement comprises a first channel for evacuating and flooding the chamber and a second channel for evacuating and flooding the chamber, wherein the first channel and the second channel are arranged on opposite sides of the chamber.
C23C 16/54 - Apparatus specially adapted for continuous coating
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
76.
METHOD AND DEVICE FOR CLEANING ETCHED SURFACES OF A SEMICONDUCTOR SUBSTRATE
The invention relates to a method which comprises the cleaning of the surface of a textured silicon substrate and causes a removal of organic compounds located on the surface of the textured silicon substrate, and further comprises a removal of porous silicon from the surface of the textured silicon substrate and carrying out a metal cleaning of the surface of the textured silicon substrate.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
77.
METHOD AND DEVICE FOR TREATING ETCHED SURFACES OF A SEMICONDUCTOR SUBSTRATE USING A OZONE-CONTAINING MEDIUM
The invention relates to a method for treating a surface of a textured silicon substrate, comprising an ozone-based treatment of the surface of the textured silicon substrate to remove porous silicon and/or to cause a metal cleaning and/or a cleaning of organic compounds.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
78.
VACUUM LOCK AND METHOD FOR TRANSFERRING A SUBSTRATE CARRIER VIA A LOCK
The invention relates to a vacuum lock (10) for a vacuum coating system, which vacuum lock has a chamber (30) for accommodating a substrate carrier (20), the chamber (30) having a first and a second inner surface (31, 32). A conveying device (40) is configured to convey the substrate carrier (20). The vacuum lock (10) has a flow channel assembly (51, 52, 56, 57) for evacuating and flooding the chamber (30), which flow channel assembly is configured to bring about a gas flow both between the first inner surface (31) and a first substrate carrier surface (21) facing the first inner surface (31) and between the second inner surface (32) and a second substrate carrier surface (22) facing the second inner surface (32). The substrate carrier (20) can be positioned between the first and the second inner surfaces (31, 32) in such a way that a ratio of a first distance between the first inner surface (31) and the first substrate carrier surface (21) to a length (L) of the substrate carrier (20) is less than 0.1 and a ratio of a second distance between the second inner surface (32) and the second substrate carrier surface (22) to a length (L) of the substrate carrier (20) is less than 0.1.
A device for treating substrates by a treating liquid has at least one rotatably supported support roller which a substrate to be treated rests on during operation. The support roller has a hollow cylinder having a porous rigid material which the substrate to be treated rests on during operation. The device is configured to deliver, during operation, treating liquid via the interior of the hollow cylinder of the at least one support roller through the porous rigid material to the external surface of the hollow cylinder in order to treat at least one surface of the substrate by the treating liquid. The device is configured to treat several substrates in the form of plate-shaped separate wafers arranged one behind the other and/or next to one another in the device, by the treating liquid and to transport the substrates in a transport plane during the treatment.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B05C 1/02 - Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
80.
METHOD AND DEVICE FOR TEXTURING A SURFACE OF A MULTICRYSTALLINE DIAMOND WIRE-SAWN SILICON SUBSTRATE BY USING OZONE-CONTAINING MEDIUM
The invention relates to a method for treating the surface of a multi-crystalline diamond wire-sawn silicon substrate, which method comprises texturing the surface of the multi-crystalline diamond wire-sawn silicon substrate and, before at least part of the texturing, treating the surface of the multi-crystalline diamond wire-sawn silicon substrate with an ozone-containing acid medium, in order to effect roughening of the surface of the multi-crystalline diamond wire-sawn silicon substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
The present invention relates to an illuminant having a transparent substrate layer (1) with a first refractive index, a connecting layer (2) with a second refractive index that differs from the first refractive index, and a metallic, light-transmitting layer (3), wherein the connecting layer (2) is arranged between the substrate layer (1) and the metallic layer (3) and wherein the substrate layer (1) has a plurality of output-coupling structures (5) on the side facing the connecting layer (2), said output-coupling structures being suitable for output-coupling light that is propagating within the substrate layer (1) from the substrate layer (1) in the direction of the metallic layer (3).
A continuous system for transmitting accelerating forces and decelerating forces by interlocking, consisting of at least one carrier system having at least two connecting elements, a plurality of transport systems arranged one behind the other, wherein each transport system has a cam drum or cylindrical cam having a helical groove and the connecting elements of the carrier system are suitable for interlockingly engaging with the groove of the cam drum, and at least one motor, which drives the cam drums.
B65G 29/00 - Rotary conveyors, e.g. rotating discs, arms, star-wheels or cones
C23C 14/56 - Apparatus specially adapted for continuous coatingArrangements for maintaining the vacuum, e.g. vacuum locks
B65G 35/06 - Mechanical conveyors not otherwise provided for comprising a load-carrier moving along a path, e.g. a closed path, and adapted to be engaged by any one of a series of traction elements spaced along the path
C23C 16/54 - Apparatus specially adapted for continuous coating
83.
METHOD AND APPARATUS FOR THERMAL TREATMENT OF COATED SUBSTRATES, IN PARTICULAR THIN-FILM SOLAR SUBSTRATES
The invention relates to a method for thermal treatment of a flat substrate with a first side that is to be coated or is already coated and a second side opposite said first side, by generating a homogeneous temperature distribution on the first side and heating the substrate from the second side by means of a heating system. The method comprises the following steps: Measuring a height profile of the substrate and a temperature profile of the substrate and minimizing a measured deviation of the height profile from the plane by controlling the heating system to modify the temperature profile of the substrate by way of a control algorithm and depending on properties of the substrate and the measured height and temperature profiles.
A system (1) for gas phase deposition comprises a gas injector (30) configured to process gases to a substrate (10) for gas phase deposition onto the substrate (10). The gas injector (30) comprises a first flow path (31) and a second flow path (41) different from the first flow path (31). The system (1) comprises a first temperature adjustment mechanism (6) associated with the first flow path (31) to control a temperature of a process gas passing through the first flow path (31). The system (1) comprises a second temperature adjustment mechanism (7) associated with at least the second flow path (41) to control a temperature of a process gas passing through the second flow path (41). The first temperature adjustment mechanism (6) and the second temperature adjustment mechanism (7) are operable independently of each other. The system is configured to cause rotation and levitation of the substrate (10) during etching of the substrate (10) and/or deposition.
C23C 16/455 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A system (100) and a corresponding method for simultaneous rotation and levitation of a substrate (130) during deposition and/or etching of the substrate are disclosed. The system (100) comprises a carrier (110) located below the substrate (130), wherein the carrier (110) comprises at least two gas inlets (110) to provide gas to a bottom surface of the substrate (130) to levitate the substrate above the carrier. The system further comprises at least one holding member (120) connected to the carrier (110) and being configured to restrict horizontal drifting of the substrate (130).
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
C23C 16/46 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A device for treating substrates by a treating liquid comprises at least one rotatably supported support roller which a substrate to be treated rests on during operation. The support roller comprises a hollow cylinder comprising a porous rigid material which the substrate to be treated rests on during operation. The device is configured to deliver, during operation, treating liquid via the interior of the hollow cylinder of the at least one support roller through the porous rigid material to the external surface of the hollow cylinder in order to treat at least one surface of the substrate by the treating liquid. The device is configured to treat several substrates in the form of plate-shaped separate wafers arranged one behind the other and/or next to one another in the device, by the treating liquid and to transport the substrates in a transport plane during the treatment.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
01 - Chemical and biological materials for industrial, scientific and agricultural use
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
09 - Scientific and electric apparatus and instruments
20 - Furniture and decorative products
37 - Construction and mining; installation and repair services
41 - Education, entertainment, sporting and cultural services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Coating compositions [chemicals for vacuum coating], other
than paint; chemical coatings for manufacturing surface
compositions using physical vapour deposition; ceramic
sputtering targets [chemical materials]. Metal sputtering targets. Machines for vacuum coating of disc-shaped plastic
substrates by sputtering or vacuum deposition of metal,
metal alloys, metal oxides or metal nitrides for the
production of optical storage media; machines for vacuum
coating, in particular physical or chemical vapour
deposition, on planar and three-dimensional substrates, in
particular plastic, glass, ceramic or metal substrates, in
particular in the fields of food, beverages, cosmetics,
jewelry, automotive, optics, sanitary engineering, lighting,
medical engineering, consumer and household electronics and
other industrial applications; machines for multi-layer
vacuum deposition of metals or ceramics for the production
of storage media, in particular disc-shaped storage media;
machines for vacuum deposition of layers, in particular
transparent, conductive, metallic, semi-conductive,
non-conductive, dielectric or transparent/electrically
conductive, or passivating layers, in particular using
physical or chemical vapour deposition on substrates, in
particular on glass and silicon; machines for large area
coating using physical vapour deposition, in particular for
the layer deposition of copper, indium, gallium, selenium,
sulfur, indium sulfide, sodium fluoride, potassium fluoride,
aluminium or combinations of these materials on glass or
flexible substrates for the production of thin film solar
cells; machines for large area coating using physical vapour
deposition, in particular for the layer deposition of
cadmium, tellurium, cadmium sulfide, cadmium chloride or
combinations of these materials on glass substrates for the
production of thin film solar cells; machines for metal
organic chemical vapour deposition (MO-CVD) and metal
organic vapour phase epitaxy (MOVPE); machines for large
area coating using vacuum deposition, in particular
horizontal or vertical sputtering deposition, on glass,
metal or plastic substrates, in particular for the
production of solar cells; machines for injection molding,
vacuum deposition, lacquering (spin-coating), bonding,
UV-curing and quality inspection for the production of
optical storage media, in particular CD, DVD5/10, DVD9;
machines for injection molding, vacuum deposition,
lacquering (spin-coating), (wet) embossing, UV-curing and
quality inspection for the production of optical storage
media, in particular optical storage disc, in particular
BD25/33/50/66/100 (Blu-ray disc), Ultra HD Blu-ray disc;
machines for injection molding, in particular of thin-wall
optical parts and micro-structured parts; machines for nano
imprint lithography by (wet) embossing, in particular for
the production of diffractive optical components,
microfluidic devices and micro electro mechanical structures
(MEMS); machines for cleaning, vacuum deposition,
spin-coating for photoresist, laser exposure, photoresist
developing, laser beam recording and quality inspection, in
particular for the production of disc masters for CD,
DVD5/10, DVD 9, optical storage disc and other recording
formats; machines for multi-layer deposition of magnetic and
non-magnetic materials by physical vapour deposition, in
particular rotating substrate deposition, for research,
development and production; machines for multi-layer
deposition of magnetic and non-magnetic materials by
physical vapour deposition, in particular
linear-dynamic-deposition, for research, development and
production of MRAM (Magnetoresistive random-access memory)
cells and magnetic sensors, in particular for anisotropic
magnetoresistance (AMR), giant magnetoresistance (GMR) and
tunnel magnetoresistance (TMR) structures; machines for
thermal treatment (heating and cooling) of pre-coated large
area substrates in a controlled gas atmosphere for the
production of solar cells, in particular thin film solar
cells; in-line machines for wet chemical treatment, in
particular etching, cleaning, coating and drying, in
particular for thin-film solar cells; machines for wet
chemical treatment of batches of substrates, in particular
etching, cleaning, coating and drying of substrates, in
particular of semiconductor or glass wafers for production
of crystalline solar cells, semiconductor devices and
optical components; machines for wet chemical bath
deposition of layers, in particular cadmium sulfide, zinc
oxide-sulfide and zinc sulfide for thin film solar cells;
in-line machines for wet chemical treatment, in particular
cleaning, acidic etching, alkaline etching and drying, for
single side and double side processing of glass and silicon
substrates; machines for wet chemical treatment of batches
of material, in particular chemical etching, cleaning and
drying of mono and multi crystalline silicon, in particular
chunks and ingot off cuts; combinations of machines for
automation, vacuum deposition, surface treatment, lacquering
(spray-coating), UV-curing or drying, for the refinement of
planar and three-dimensional substrates, in particular of
plastic, glass, ceramic or metal, in particular in the field
of food, beverages, cosmetics, jewelry, automotives, optics,
sanitary engineering, lighting, medical engineering,
consumer and household electronics or other industrial
applications; combinations of machines for automation,
vacuum deposition, wet chemical treatment, laser ablation,
screen print or thermal treatment for the manufacturing of
solar cells, in particular silicon solar cells; combinations
of machines for automation, vacuum deposition, wet chemical
treatment, laser ablation, thermal treatment, lamination or
contacting for the manufacturing of solar cells, in
particular thin film solar cells. Measuring apparatus and instruments for machines and/or
machine combinations. Receptacles of plastic for storing, transporting and
processing substrates, in particular silicon wafers. Installation, repair and maintenance services in relation to
machines, machine components and machine combinations;
installation, repair and maintenance services in relation to
measuring apparatus and instruments being parts of machines
and/or machine combinations; erecting of manufacturing
plants. Education; providing of training and training courses for
installation, maintenance and repair of machines and machine
combinations. Scientific and technological services and research and
design relating thereto; industrial analysis and research
services; design and development of industrial production
facilities; engineering, technical consultation, planning,
technical design of industrial production facilities;
analysis, development, research and technical optimization
related to function, productivity and cost of industrial
production processes; analysis, development, research and
technical optimization of industrial products and devices.
System and method for gas phase deposition of at least one material to a substrate having a first and a second surface opposite to the first surface. The system comprises a holding member configured to hold the substrate, a deposition member configured to apply the at least one material to the substrate from at least one direction and a heater located at a distance from the substrate and being configured to apply heat to the substrate from the side of the first surface and from the side of the second surface of the substrate.
C23C 16/46 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
C23C 16/48 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
01 - Chemical and biological materials for industrial, scientific and agricultural use
07 - Machines and machine tools
09 - Scientific and electric apparatus and instruments
20 - Furniture and decorative products
37 - Construction and mining; installation and repair services
41 - Education, entertainment, sporting and cultural services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Coating compositions other than paint for vacuum coating, namely, chemical compounds for coating of optical storage media, CDs, and DVDs, glass, solar cells, planar and three-dimensional substrates, in particular plastic, glass, ceramic or metal substrates, layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric or transparent/electrically conductive, or passivating layers, single and polycrystalline thin films media, UV curable lacquer, metals, metal alloys, metal oxides or metal nitrides, thin-wall optical parts and micro-structured parts, microfluidic devices and micro electro mechanical structures (MEMS), namely for nano imprint lithography by wet embossing, MRAMs (Magnetoresistive random-access memory) cells and magnetic sensors, namely, for anisotropic magnetoresistance (AMR), giant magnetoresistance (GMR) and tunnel magnetoresistance (TMR) structures, semiconductor components, all before-mentioned goods in particular in the field of food, beverages, cosmetics, jewelry, automotives, optics, sanitary engineering, lighting, medical engineering, consumer and household electronics Machines, namely, vacuum deposition machines for coating disc-shaped plastic substrates by sputtering or vacuum deposition of metal, metal alloys, metal oxides or metal nitrides for the production of optical storage media; machines, namely, physical or chemical vacuum deposition machines for coating planar and three-dimensional substrates, in particular plastic, glass, ceramic or metal substrates, in particular in the fields of food, beverages, cosmetics, jewelry, automotive, optics, sanitary engineering, lighting, medical engineering, consumer and household electronics and other industrial applications; machines for multi-layer vacuum deposition for coating of metals and ceramics for the production of storage media, in particular disc-shaped storage media; machines for vacuum deposition for coating of layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric or transparent/electrically conductive, or passivating layers, in particular using physical or chemical vapour deposition on substrates, in particular on glass and silicon; machines for large area coating using physical vapour deposition, namely, for coating layer deposition of respectively copper, indium, gallium, selenium, sulfur, indium sulfide, sodium fluoride, potassium fluoride, aluminium or combinations of these materials on glass or flexible substrates for the production of thin film solar cells; machines for large area coating using physical vapour deposition, namely, for coating layer deposition of cadmium, tellurium, cadmium sulfide, cadmium chloride and combinations of these materials on glass substrates for the production of thin film solar cells; machines for metal organic chemical vapour deposition (MO-CVD) and metal organic vapour phase epitaxy (MOVPE) for coating of single and polycrystalline thin films on substrates; machines for large area coating using vacuum deposition, namely horizontal or vertical or tilted sputtering deposition for coating glass, metal and plastic substrates for the production of solar cells; machines for the production of optical storage media, CDs, and DVDs, namely for injection molding, for vacuum deposition for coating of metal, metal alloys, metal oxides or metal nitrides, for lacquering, namely, spin-coating or spray coating of UV curable lacquer, for bonding substrates with UV curable lacquer, for UV-curing and for quality inspection; machines for the production of optical storage media and optical storage discs for high-definition and ultra-definition resolution content, namely, for injection molding, for vacuum deposition for coating of metals, metal alloys, metal oxides or metal nitrides, for lacquering, namely, spin-coating or spray coating of UV curable lacquer, for wet embossing, for UV-curing and for quality inspection; machines for injection molding of thin-wall optical parts and micro-structured parts; machines for the production of diffractive optical components, microfluidic devices and micro electro mechanical structures (MEMS), namely for nano imprint lithography by wet embossing; machines for the production of disc masters for CDs, DVDs, optical storage discs and other recording formats, namely, optical storage disc for high-definition and ultra-definition resolution content, namely machines for cleaning glass or silicon substrates respectively, or for vacuum deposition for coating of metals, metal alloys, phase transition ceramics or semiconductors, for spin-coating for photoresist, for laser exposure, or for laser beam recording, for photoresist developing, or for quality inspection; machines for multi-layer deposition for magnetic and non-magnetic materials by physical vapour deposition, namely, rotating substrate deposition; machines for multi-layer deposition of magnetic and non-magnetic materials by physical vapour deposition, namely, linear-dynamic deposition for research, development or for the production of MRAM (Magnetoresistive random-access memory) cells or magnetic sensors, namely, anisotropic magnetoresistance (AMR), giant magnetoresistance (GMR) or tunnel magnetoresistance (TMR) structures; machines for thermal treatment, namely, heating and cooling of pre-coated large area substrates, namely, glass or flexible substrates for the production of thin film solar cells in a controlled gas atmosphere; in-line machines for wet chemical treatment, namely, machines for etching, cleaning, coating and drying thin-film solar cells; machines for wet chemical treatment of batches of substrates, namely, machines for etching, cleaning, coating and drying of substrates, namely, semiconductor and glass wafers for production of crystalline solar cells, semiconductor devices and optical components; machines for wet chemical bath deposition of layers, namely, machines for coating of cadmium sulfide, zinc oxide-sulfide and zinc sulfide on thin film solar cells; in-line machines for wet chemical treatment, namely, machines for cleaning, acidic etching, alkaline etching and drying, for single side and double side processing of glass and silicon substrates; machines for wet chemical treatment of batches of material, namely, machines for chemical etching, cleaning and drying of mono and multi crystalline silicon, in particular chunks and ingot off cuts; combinations of machines for automation of substrate handling and processing for the refinement of planar and three-dimensional substrates, namely, plastic, glass, ceramic and metal, for industrial use in the field of food, beverages, cosmetics, jewelry, automotives, optics, sanitary engineering, lighting, medical engineering, consumer and household electronics or other industrial applications, namely for vacuum deposition for coating of metals, metal alloys, metal oxides, or metal nitrides semi-conductors, for surface treatment of substrates, for lacquering, namely, spray-coating of substrates with UV curable lacquer or solvent based lacquer, for UV-curing or drying; combinations of machines for manufacturing silicon solar cells, namely for automation of substrate handling and processing, for vacuum deposition for coating of transparent, conductive, metallic, semi-conductive, non-conductive, dielectric, transparent electrically conductive, or passivating layers, for wet chemical treatment of substrates, for laser ablation, namely, electrical insulating, for structuring, for contact opening, for contact firing of substrates and screen print and for thermal treatment of substrates; combinations of machines for manufacturing thin film solar cells, namely for automation of substrate handling and processing, for vacuum deposition for coating of substrates, for wet chemical treatment of substrates, for laser ablation, namely, surface structuring, electrical insulation or cell formation of substrates, or thermal treatment of substrates and for lamination or contacting substrates Measuring apparatus and instruments for measuring layer thickness, reflection of light and electromagnetic waves, sound waves, transmission of light and electromagnetic waves, namely, spectrometers; Measuring apparatus and instruments for measuring sheet resistance with two or four pin probes or eddy current probes; and measuring apparatus and instruments for measuring material composition of optical storage media, CDs, and DVDs, glass, solar cells, planar and three-dimensional substrates, in particular plastic, glass, ceramic or metal substrates, layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric or transparent/electrically conductive, or passivating layers, single and polycrystalline thin films media, UV curable lacquer, metals, metal alloys, metal oxides or metal nitrides, thin-wall optical parts and micro-structured parts, icrofluidic devices and micro electro mechanical structures (MEMS), namely, nano imprint lithography by wet embossing, MRAMs (Magnetoresistive random-access memory) cells; and magnetic sensors, namely, sensors for measuring the magnetic field of, anisotropic magnetoresistance (AMR), giant magnetoresistance (GMR) and tunnel magnetoresistance (TMR) structures and, semiconductor devices and optical components, all goods in the fields of food, beverages, cosmetics, jewelry, automotives, optics, sanitary engineering, lighting, medical engineering, consumer and household electronics Receptacles of plastic for commercial use, namely, plastic containers for storing, transporting and processing substrates, in particular silicon wafers Installation, repair and maintenance of machines for vacuum coating, thermal treatment, lacquering chemical treatment media supply, automation and combinations thereof as well as components and parts of those machines; installation, repair and maintenance of measuring apparatus and instruments being parts of machines and/or machine combinations; erecting of manufacturing plants Education services, namely, conducting training courses, lectures, seminars, hand-on seminars, workshops in the field of engineering, process engineering, machine operation, maintenance machine safety; training services in the field of the installation, maintenance and repair of equipment for vacuum coating, thermal treatment, lacquering, chemical treatment, media supply, automation, handling machines and machine combinations; training courses of instruction for installation, maintenance and repair of equipment for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, handling machines and machine combinations Scientific and technological services, namely, research and design in the fields of machine building industry, vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, handling and combinations thereof; scientific and technological services, namely, industrial analysis and research services for the purpose of customer service and advice in the fields of machine building industry, vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, handling and combinations thereof; scientific and technological services, namely, design and development of industrial production facilities; engineering, technical consultation, planning, technical design of industrial production facilities; scientific and technological services, namely, analysis and development of machines in the fields of vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, handling and combinations thereof, related to function, productivity and cost of industrial production processes; technical research in the field of machine building industry, namely machines for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, handling and combinations thereof, related to function, productivity and cost of industrial production processes; technical optimization, namely, technological services in the form of the development of new technology which optimizes and improves throughput of machines for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, handling and combinations thereof, related to completion and optimization of function, productivity and cost of industrial production processes, which decreases media consumption, namely, energy, lacquers, chemicals, polymers, water, pressure air, gases, electricity, and sputtering materials that are needed to operate machines for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, handling and combinations thereof; related to completion and optimization of function, productivity and cost of industrial production processes, which increases yield of machines for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, handling and combinations thereof, related to completion and optimization of function, productivity and cost of industrial production processes, and which improves the quality of machines for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, , handling and combinations thereof, related to completion and optimization of function, productivity and cost of industrial production processes; scientific and technological services, namely, analysis and development of industrial products and devices in the machine building industry, namely machines for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, and combinations thereof; technical research services in the fields of industrial products and devices in the machine building industry, namely machines for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, and combinations thereof; and technical optimization, namely, technological services in the form of the development of new technology which optimizes quality of industrial products and devices in the machine building industry, namely, machines for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, and combinations thereof, which increases functional and physical properties of industrial products and devices in the machine building industry, namely, machines for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, and combinations thereof, which increases yield and throughput in regard to industrial or custom applications of industrial products and devices in the machine building industry, namely, machines for vacuum coating, thermal treatment, lacquering, chemical treatment, injection molding, media supply, automation, and combinations thereof
90.
Method and device for stringing substrates together in coating systems
B65G 43/10 - Sequence control of conveyors operating in combination
B65G 43/08 - Control devices operated by article or material being fed, conveyed, or discharged
C23C 16/00 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
B65G 47/26 - Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
01 - Chemical and biological materials for industrial, scientific and agricultural use
06 - Common metals and ores; objects made of metal
07 - Machines and machine tools
09 - Scientific and electric apparatus and instruments
20 - Furniture and decorative products
37 - Construction and mining; installation and repair services
41 - Education, entertainment, sporting and cultural services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Coating compositions [chemicals for vacuum coating], other than paint; chemical coatings for manufacturing surface compositions using physical vapour deposition; ceramic sputtering targets. Metal sputtering targets. Machines for vacuum coating of disc-shaped plastic substrates by sputtering or vacuum deposition of metal, metal alloys, metal oxides or metal nitrides for the production of optical storage media; machines for vacuum coating, in particular physical or chemical vapour deposition, on planar and three-dimensional substrates, in particular plastic, glass, ceramic or metal substrates, in particular in the fields of food, beverages, cosmetics, jewelry, automotive, optics, sanitary engineering, lighting, medical engineering, consumer and household electronics and other industrial applications; machines for multi-layer vacuum deposition of metals or ceramics for the production of storage media, in particular disc-shaped storage media; machines for vacuum deposition of layers, in particular transparent, conductive, metallic, semi-conductive, non-conductive, dielectric or transparent/electrically conductive, or passivating layers, in particular using physical or chemical vapour deposition on substrates, in particular on glass and silicon; machines for large area coating using physical vapour deposition, in particular for the layer deposition of copper, indium, gallium, selenium, sulfur, indium sulfide, sodium fluoride, potassium fluoride, aluminium or combinations of these materials on glass or flexible substrates for the production of thin film solar cells; machines for large area coating using physical vapour deposition, in particular for the layer deposition of cadmium, tellurium, cadmium sulfide, cadmium chloride or combinations of these materials on glass substrates for the production of thin film solar cells; machines for metal organic chemical vapour deposition (MO-CVD) and metal organic vapour phase epitaxy (MOVPE); machines for large area coating using vacuum deposition, in particular horizontal or vertical sputtering deposition, on glass, metal or plastic substrates, in particular for the production of solar cells; machines for injection molding, vacuum deposition, lacquering (spin-coating), bonding, UV-curing and quality inspection for the production of optical storage media, in particular CD, DVD5/10, DVD9; machines for injection molding, vacuum deposition, lacquering (spin-coating), (wet) embossing, UV-curing and quality inspection for the production of optical storage media, in particular Optical storage disc, in particular BD25/33/50/66/100, BD-UHD; machines for injection molding, in particular of thin-wall optical parts and micro-structured parts; machines for nano imprint lithography by (wet) embossing, in particular for the production of diffractive optical components, microfluidic devices and micro electro mechanical structures (MEMS); machines for cleaning, vacuum deposition, spin-coating for photoresist, laser exposure, photoresist developing, laser beam recording and quality inspection, in particular for the production of disc masters for CD, DVD5/10, DVD 9, Optical storage disc and other recording formats; machines for multi-layer deposition of magnetic and non-magnetic materials by physical vapour deposition, in particular rotating substrate deposition, for research, development and production; machines for multi-layer deposition of magnetic and non-magnetic materials by physical vapour deposition, in particular linear-dynamic-deposition, for research, development and production of MRAM memory cells and magnetic sensors, in particular for anisotropic magnetoresistance (AMR), giant magnetoresistance (GMR) and tunnel magnetoresistance (TMR) structures; machines for thermal treatment (heating and cooling) of pre-coated large area substrates in a controlled gas atmosphere for the production of solar cells, in particular thin film solar cells; in-line machines for wet chemical treatment, in particular etching, cleaning, coating and drying, in particular for thin-film solar cells; machines for wet chemical treatment of batches of substrates, in particular etching, cleaning, coating and drying of substrates, in particular of semiconductor or glass wafers for production of crystalline solar cells, semiconductor devices and optical components; machines for wet chemical bath deposition of layers, in particular cadmium sulfide, zinc oxide-sulfide and zinc sulfide for thin film solar cells; in-line machines for wet chemical treatment, in particular cleaning, acidic etching, alkaline etching and drying, for single side and double side processing of glass and silicon substrates; machines for wet chemical treatment of batches of material, in particular chemical etching, cleaning and drying of mono and multi crystalline silicon, in particular chunks and ingot off cuts; combinations of machines for automation, vacuum deposition, surface treatment, lacquering (spray-coating), UV-curing or drying, for the refinement of planar and three-dimensional substrates, in particular of plastic, glass, ceramic or metal, in particular for the fields of food, beverages, cosmetics, jewelry, automotives, optics, sanitary engineering, lighting, medical engineering, consumer and household electronics or other industrial applications; combinations of machines for automation, vacuum deposition, wet chemical treatment, laser ablation, screen print or thermal treatment for the manufacturing of solar cells, in particular silicon solar cells; combinations of machines for automation, vacuum deposition, wet chemical treatment, laser ablation, thermal treatment, lamination or contacting for the manufacturing of solar cells, in particular thin film solar cells. Measuring apparatus and instruments being parts of machines and/or machine combinations. Receptacles of plastic for storing, transporting and processing substrates, in particular silicon wafers. Installation, repair and maintenance services in relation to machines, machine components and machine combinations; installation, repair and maintenance services in relation to measuring apparatus and instruments being parts of machines and/or machine combinations. Education; providing of training and training courses for installation, maintenance and repair of machines and machine combinations. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of industrial production facilities; engineering, technical consultation, planning, technical design and realization of industrial production facilities; analysis, development, research and optimization related to function, productivity and cost of industrial production processes; analysis, development, research and optimization of industrial products and devices.
37 - Construction and mining; installation and repair services
Goods & Services
Machines for vacuum coating, in particular by means of physical or chemical vapour deposition of single and multi-layer coats, of substrates for industrial applications, of silicon, plastic, glass or metal being substrates, in particular for photovoltaics; Machines for deposition of layers onto substrates in a vacuum, in particular of transparent, conductive, metallic, semi-conductive, non-conductive, dielectric, transparent/electrically conductive or passivating single and multi-layer coats of organic or non-organic materials, in particular by means of physical or chemical vapour deposition, in particular for photovoltaics. Installation, maintenance and repair of machines for vacuum coating of substrates.
The invention relates to a continuous system for transmitting accelerating forces and decelerating forces by means of interlocking, consisting of at least one carrier system having at least two connecting elements, a plurality of transport systems arranged one behind the other, wherein each transport system has a cam drum having a helical groove and the connecting elements of the carrier system are suitable for interlockingly engaging with the groove of the cam drum, and at least one motor, which drives the cam drums.
C23C 14/56 - Apparatus specially adapted for continuous coatingArrangements for maintaining the vacuum, e.g. vacuum locks
C23C 16/54 - Apparatus specially adapted for continuous coating
B65G 35/06 - Mechanical conveyors not otherwise provided for comprising a load-carrier moving along a path, e.g. a closed path, and adapted to be engaged by any one of a series of traction elements spaced along the path
94.
TRANSPORT APPARATUS, APPARATUS FOR HANDLING AN ARTICLE AND TRANSPORT METHOD
A transport apparatus has a transport device which is designed to support transport along a transport path of an article to be transported, wherein the article to be transported is a semiconductor wafer, a glass panel or a polymer sheet, and at least one flexible roller for holding the article to be transported against the transport device. The flexible roller has a hub and a roll-off ring which is mounted on the hub in a flexible manner by way of a plurality of spokes distributed around the circumference of the hub. Each of the spokes has a first segment, which is attached to the hub, a second segment, which is attached to the roll-off ring, and a third segment between the first segment and the second segment, which is at a greater inclination with respect to the radial direction than the first and the second segment.
B65G 37/00 - Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
B65G 39/06 - Adaptations of individual rollers and supports therefor the roller sleeves being shock-absorbing, e.g. formed by helically-wound wires
95.
Method and system for naturally oxidizing a substrate
A system and method for treating a substrate in a reaction chamber. A transfer chamber is arranged between a first lock and a second lock, wherein the second lock is provided between the transfer chamber and the reaction chamber. A substrate is transferred into the transfer chamber through the first lock, and the first lock is closed. In a next step, the transfer chamber is flooded with the same gas as in the reaction chamber and the pressure and temperature of the gaseous atmosphere in the transfer chamber is controlled to be the same as in the reaction chamber. Then, the second lock is opened and the substrate is transferred from the transfer chamber into the reaction chamber to treat the substrate. A computer program product for carrying out the above method.
C23C 16/46 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
C23C 16/52 - Controlling or regulating the coating process
96.
METHOD AND SYSTEM FOR NATURALLY OXIDIZING A SUBSTRATE
The present invention relates to a system and method for treating a substrate in a reaction chamber. A transfer chamber is arranged between a first lock and a second lock, wherein the second lock is provided between the transfer chamber and the reaction chamber. A substrate is transferred into the transfer chamber through the first lock, and the first lock is closed. In a next step, the transfer chamber is flooded with the same gas as in the reaction chamber and the pressure and temperature of the gaseous atmosphere in the transfer chamber is controlled to be the same as in the reaction chamber. Then, the second lock is opened and the substrate is transferred from the transfer chamber into the reaction chamber to treat the substrate. The present invention also relates to a computer program product for carrying out the method of the invention.
The invention relates to a target for coating a substrate with an alloy by means of cathode sputtering, said alloy having at least one first material and one second material as alloy components. The surface of the target has at least one first section made of the first material and one second section made of the second material. The two sections adjoin each other and form a common boundary line. The invention further relates to a device and a method for coating a substrate with an alloy by means of cathode sputtering using the target according to the invention.
The invention relates to a method for coating a substrate (10) with an AlOx layer (12), in particular an Al2O3 layer, said method comprising the following method steps: (a) providing an inductively coupled plasma source (ICP source) (20) having a reaction chamber (22) and at least one RF inductor (24), (b) introducing an aluminium compound, preferably trimethyl aluminium (TMA), into the ICP source, (c) introducing oxygen and/or an oxygen compound as a reactive gas into the ICP source and inductively coupling energy into the ICP source to form a plasma (30), and (d) depositing the AlOx layer on the substrate. The invention also relates to a coating installation for depositing thin layers on a substrate, in particular for carrying out the above method. The coating installation comprises an inductively coupled plasma source (ICP) (20) having a reaction chamber (22) and at least one RF inductor (24), a substrate holder for arranging the substrate in the reaction chamber and channels (26, 28) for introducing the aluminium compound and a reactive gas into the ICP source. The substrate is arranged in the reaction chamber in such a way that the surface to be coated of the substrate is facing the ICP source.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
C23C 16/509 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
C23C 16/455 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
99.
METHOD FOR OPERATING SEVERAL LOADS IN ALTERNATING CURRENT NETWORKS WITH LEADING EDGE OR TRAILING EDGE PHASE CUTTING
The invention relates to a method for operating a first and a second electrical load in an alternating current network. The method can be operated in an optional first operating mode, in which the positive and negative half waves for each load are controlled with a first phase angle. In addition, a second operating mode is provided, in which a first part of the positive and negative half waves for the first load and a second part of the positive and negative half waves for the second load are controlled with respective second phase angles. The invention further relates to a device for performing the method, having first and second phase angle control for the first and second loads.
H02M 5/257 - Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
H02M 1/12 - Arrangements for reducing harmonics from AC input or output
100.
COATING SUBSTRATES WITH AN ALLOY BY MEANS OF CATHODE SPUTTERING
The invention relates to a target for coating a substrate with an alloy by means of cathode sputtering, said alloy having at least one first material and one second material as alloy components. The surface of the target has at least one first section made of the first material and one second section made of the second material. The two sections adjoin each other and form a common boundary line. The invention further relates to a device and method for coating a substrate with an alloy by means of cathode sputtering using the target according to the invention.
