Abstract

An integrated optically functional multilayer structure including a flexible, substrate film arranged with a circuit design including electrical conductors on a first side of the substrate film; at least one light source provided upon the first side of the substrate film and connected to the circuit design the at least one light source internally illuminates at least a portion of the structure for external perception; and an optically transmissive layer-produced upon the first side of the substrate film and the at least one light source said optically transmissive layer at least partially covering the substrate film and embedding the at least one light source; wherein the substrate film defines holes therethrough and upon one or more of them the optically transmissive layer defines an outcoupling surface, configured to redirect and reflect, incident light emitted by light sources of the at least one light source.

IPC Classes  ?

• H10K 50/842 - Containers
• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• H10K 50/854 - Arrangements for extracting light from the devices comprising scattering means
• H10K 50/856 - Arrangements for extracting light from the devices comprising reflective means
• H10K 77/10 - Substrates, e.g. flexible substrates

Abstract

An integrated optically functional multilayer structure (100, 500), comprising a flexible, optionally 3D-formable and further optionally thermoplastic, substrate film (102) arranged with a circuit design (106) comprising at least a number of electrical conductors on a first side of the substrate film (102); at least one light source (104) provided upon the first side of the substrate film (102) and connected to the circuit design (106), said at least one light source (104) being configured to internally illuminate at least a portion of the structure for external perception; and an optically transmissive layer (108), optionally of plastic or thermoplastic material such as polycarbonate, thermoset, silicone, epoxy, or other material, produced upon the first side of the substrate film (102) and the at least one light source (104), said optically transmissive layer (108) at least partially covering the substrate film (102) and embedding the at least one light source (104); wherein at least one of the substrate film (102) or the optically transmissive layer defines an outcoupling surface, preferably tilted (101) away from a surface plane or direction of the adjacent areas of the substrate film (102), configured to redirect and reflect, preferably by TIR (total internal reflection), incident light emitted by one or more light sources of the at least one light source (104). Related method of manufacture is presented.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• H05K 1/03 - Use of materials for the substrate
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• G02B 6/42 - Coupling light guides with opto-electronic elements

Abstract

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design including at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector

IPC Classes  ?

• H01L 33/60 - Reflective elements
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor using multilayered preforms or sheets
• G01P 1/02 - Housings
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

An integrated optically functional multilayer structure including a flexible, substrate film arranged with a circuit design including electrical conductors on a first side of the substrate film; at least one light source provided upon the first side of the substrate film and connected to the circuit design the at least one light source internally illuminates at least a portion of the structure for external perception; and an optically transmissive layer produced upon the first side of the substrate film and the at least one light source said optically transmissive layer at least partially covering the substrate film and embedding the at least one light source; wherein the substrate film defines holes therethrough and upon one or more of them the optically transmissive layer defines an outcoupling surface, configured to redirect and reflect, incident light emitted by light sources of the at least one light source.

IPC Classes  ?

• H01L 33/60 - Reflective elements
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
• H10K 50/842 - Containers
• H10K 50/856 - Arrangements for extracting light from the devices comprising reflective means

Abstract

An interface assembly includes a functional multilayer structure that includes a first substrate a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor using multilayered preforms or sheets
• G01P 1/02 - Housings
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

An interface assembly (100 is disclosed herein which comprises a functional multilayer structure (20) that comprise a first substrate (22, 28), a molded material layer (26) on a first side of the first substrate (22, 28), and a sensor arrangement (30) comprising at least one sensor (32; 32A, 32B), wherein the sensor arrangement (30) is arranged at least partly embedded into the molded material layer (26). The assembly (100) further comprises a movable member (40) being movable relative to the functional multilayer structure (20), wherein the movable member (40) comprises at least one detection portion (42), and the sensor arrangement (30) and the at least one detection portion (42) are mutually arranged so that a position or a change of position of the movable member (40) is detectable by the sensor arrangement (30) based on a position or a change of position of the at least one detection portion (42) relative to the sensor arrangement (30). Also, a method for manufacturing an interface assembly (100) is disclosed.

IPC Classes  ?

• H03K 17/965 - Switches controlled by moving an element forming part of the switch
• H03K 17/968 - Switches controlled by moving an element forming part of the switch using opto-electronic devices
• H03K 17/97 - Switches controlled by moving an element forming part of the switch using a magnetic movable element
• H03K 17/975 - Switches controlled by moving an element forming part of the switch using a capacitive movable element
• H05K 5/02 - Casings, cabinets or drawers for electric apparatus Details

Abstract

An electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The electronics assembly further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Abstract

An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor using multilayered preforms or sheets
• G01P 1/02 - Housings
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

The invention relates to an illumination device (3) for an exterior component (2) of a vehicle (1), wherein the exterior component (2) can be at least partially illuminated by the illumination device (3), comprising a carrier unit (4) which has at least one opening (5) for receiving at least one lighting element (6) of the illumination device (3), wherein the at least one lighting element (6) is designed to emit light into a region (7) surrounding the illumination device (3), the at least one lighting element (6) has a reflector element (8) and the reflector element (8) has a reflector cover (9), the at least one opening (5) is covered by the reflector cover (9) and the reflector cover (9) forms a partial surface region (12) of a surface (13) of the carrier unit (4), characterised in that the partial surface region (12) has a coating that is permeable to light and in that a surface region (15) of the surface (13) of the carrier unit (4), which is different from the partial surface region (12), has a coating that is impermeable to light. The invention further relates to an exterior component (2).

IPC Classes  ?

• F21S 43/50 - Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by aesthetic components not otherwise provided for, e.g. decorative trim, partition walls or covers
• F21S 43/31 - Optical layout thereof
• F21S 43/20 - Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
• F21S 43/14 - Light emitting diodes [LED]
• B60R 19/52 - Radiator or grille guards
• B60R 13/00 - Elements for body-finishing, identifying, or decoratingArrangements or adaptations for advertising purposes
• B60Q 1/28 - Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating front of vehicle
• B60Q 1/32 - Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating vehicle sides
• B60Q 1/30 - Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating rear of vehicle, e.g. by means of reflecting surfaces
• F21W 104/00 - Exterior vehicle lighting devices for decorative purposes

Abstract

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

IPC Classes  ?

• H01L 33/60 - Reflective elements
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• H01L 33/46 - Reflective coating, e.g. dielectric Bragg reflector
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

Abstract

An integrated optically functional multilayer structure (100, 200, 300, 400, 500, 600, 700, 800, 900, 1100, 1300, 1400, 1500), comprising: a flexible, optionally 3D-formable and thermoplastic, substrate film (102, 102a) arranged with a circuit design (106) comprising at least a number of electrical conductors preferably additively printed on the substrate film; a light source (104) provided upon a first side of the substrate film to internally illuminate (104a, 104b) at least portion of the structure for external perception (113); an optically transmissive plastic layer (108), optionally of thermoplastic material, provided upon the first side of the substrate film, said plastic layer at least laterally surrounding or neighboring, optionally also at least partially covering, the light source (104), the substrate film optionally comprising material or material layer same as that of the plastic layer or at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer (110), said reflector design being configured to reflect, optionally dominantly specularly, the light emitted by the light source and incident upon the reflector design optionally towards the plastic layer. Related method of manufacture is presented.

IPC Classes  ?

• F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction
• G02B 6/00 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

An integrated optically functional multilayer structure (100, 200, 300, 400, 500, 600, 700, 800, 900, 1100, 1300, 1400, 1500) suitable for large area dynamic illumination, comprising a flexible, optionally 3D-formable and thermoplastic, substrate film (102, 102a) arranged with a circuit design (106) comprising at least a number of electrical conductors preferably additively printed on the substrate film; and a plurality of top-emitting (104a), bottom- installed light sources (104) provided upon a first side of the substrate film to internally illuminate (104a) at least portion of the structure for external perception via associated outcoupling areas (112, 112a, 112b, 112c), wherein for each light source of the plurality of light sources there is, optionally at least partially shared, optically transmissive plastic layer (108), optionally of thermoplastic material, provided upon the first side of the substrate film, said plastic layer at least laterally surrounding or neighboring, optionally also at least partially covering, the light source, the substrate film optionally comprising material or material layer same as that of the plastic layer or at least having a similar or lower refractive index therewith; and reflector design comprising at least one material layer (110), provided at least upon (110b; 110c) the light source and configured to reflect, optionally dominantly specularly, the light emitted by the light source and incident upon the reflective layer towards the plastic layer. Related method of manufacture is presented.

IPC Classes  ?

• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
• H05K 1/02 - Printed circuits Details

Abstract

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

IPC Classes  ?

• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• G02B 5/08 - Mirrors

Abstract

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

IPC Classes  ?

• F21V 7/28 - Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
• F21V 7/00 - Reflectors for light sources
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• F21V 7/10 - Construction
• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems

Abstract

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

IPC Classes  ?

• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• G02B 5/08 - Mirrors

Abstract

A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

IPC Classes  ?

• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Abstract

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

IPC Classes  ?

• H01L 33/60 - Reflective elements
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof

Abstract

Integrated functional multilayer structure (100, 200, 300, 350, 500, 600, 700, 800, 900, 1000), comprising a flexible, preferably 3D-formable and thermoplastic, substrate film (102), circuitry (104, 105, 106) provided upon the substrate film, said circuitry comprising a first light source (104) containing at least one light-emission unit, optionally LED, and a monolithic lightguide layer (108) molded upon the substrate film so as to cover and optically couple to the first light source (104), the lightguide layer (108) comprising optically attenuating, translucent material, wherein the lightguide layer (108) comprises a first surface (108A) and an opposite second surface (108B), the second surface (108B) facing the first light source (104) and a portion of the first surface (108A) containing, within a first distance (H) from the first light source (104), a pre-defined outcoupling area (112) for the light emitted by the first light source (104) and transmitted within the lightguide layer (108), said lightguide layer (108) further containing a light leakage prohibition region (114) non-overlapping with the outcoupling area (112) and separated from the first light source (104) by at least a second, preferably greater, distance (D), and the attenuation of emitted light effectuated on a direct optical path between the first light source (104) and the outcoupling area (112) is less than the attenuation effectuating on a shortest, optionally also direct, optical path between the first light source (104) and the light leakage prohibition region (114), and further wherein the optical transmittance of the translucent material of the lightguide layer is between about 25% and about 80% at selected wavelengths of about 2 mm thick sample of the translucent material while the associated half power angle is between about 5 and about 70 degrees. Related method of manufacture is presented.

IPC Classes  ?

• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems

Abstract

A multilayer structure comprising a substrate film and a number of functional components and/or integrated circuits, comprising at least one first conductive element, at least one second conductive element, and at least one subsidiary conductive element, optionally traces, provided upon the substrate film. The substrate film has been provided with at least one coupling location enhancement element at a coupling location with respect to the substrate film, wherein at said coupling location the coupling location enhancement element is configured to provide an electrical connection between the first conductive element and second conductive element, further wherein said coupling location enhancement element is configured to inhibit coupling between the first conductive element and the subsidiary conductive element at the coupling location and between the second conductive element and the subsidiary conductive element at the coupling location.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/22 - Secondary treatment of printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 1/03 - Use of materials for the substrate
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

IPC Classes  ?

• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor

Abstract

The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01L 23/24 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel, at the normal operating temperature of the device
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H01L 23/492 - Bases or plates
• H01L 23/58 - Structural electrical arrangements for semiconductor devices not otherwise provided for
• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

A method for manufacturing a number of electrical nodes (10), wherein the method comprises providing (410) a number of electronic circuits onto a first substrate (11), such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits comprises a circuit pattern (14) and at least one electronics component (12) in connection with the circuit pattern (14), wherein the electronic circuits are spaced from each other on the first substrate (11), thereby defining a blank area (30) surrounding each one of the number of electronic circuits, respectively, and providing (420) potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening (430), optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes (10).

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 1/03 - Use of materials for the substrate

Abstract

A method for manufacturing an electronics assembly (100), comprising obtaining or producing (210) an electronics module (10), wherein the electronics module (10) comprises a first circuitry (12) on a first surface at a first side of a circuit board (11), at least one electronics component (12) on the circuit board (11) and in electrical connection with the first circuitry (13), and at least one first connection portion (14) on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board (11), wherein the at least one first connection portion (14) is electrically connected to or is comprised in the first circuitry (12). The method also comprises arranging (220) the electronics module (10) on a second substrate (21), such as on a thermoformable film or sheet, preferably of plastic material, comprising a second connection portion (22) connected to a second circuitry (23) on a surface of the second substrate (21), wherein a second surface of the circuit board (11), being on the opposite second side than the first surface, faces the second substrate (21), and arranging (230) electrically conductive joint material (16) onto the first (14) and the second connection portions (22) to extend between them for electrically connecting the electronics module (10) to the second circuitry (23) via the electrically conductive joint material (16).

IPC Classes  ?

• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor

Abstract

Integrated functional multilayer structure (100, 300, 500, 600, 700, 800, 900, 1000, 1100, 1300, 1400, 1500), comprising a flexible, preferably 3D-formable and thermoplastic, substrate film (102); a lighting module (110, 400) provided upon the substrate film (102) and preferably electrically connected to the circuit design thereon, said lighting module comprising: a circuit board (112) for hosting electronics; and circuitry (114) arranged on the circuit board comprising at least one light source, optionally comprising at least one LED; a thermoplastic layer (108) comprising one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module (110, 400); wherein the circuitry (114) on the circuit board (112) of the lighting module (110, 400) including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material (116A, 116B) positioned in between, preferably at least at the periphery of the circuit board (112). Related method of manufacture is presented.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/36 - Assembling printed circuits with other printed circuits
• F21K 9/68 - Details of reflectors forming part of the light source
• F21K 9/69 - Details of refractors forming part of the light source
• F21K 9/90 - Methods of manufacture
• F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/22 - Secondary treatment of printed circuits
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/44 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H01L 21/66 - Testing or measuring during manufacture or treatment
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/02 - ContainersSeals
• H01L 23/04 - ContainersSeals characterised by the shape
• H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
• H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
• H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
• H01L 23/495 - Lead-frames
• H01L 23/498 - Leads on insulating substrates
• H01L 23/552 - Protection against radiation, e.g. light
• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

Abstract

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source; the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

IPC Classes  ?

• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• G02B 5/08 - Mirrors

Goods & Services

Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials, namely, rods of metal for welding, soldering wire of metal, spelters for welding and soldering. Machine tools; power tools; laundry washing machines; dishwashers; kitchen machines, electric; mixers [kitchen machines]; electric kitchen appliances for chopping, mixing, pressing; machines for the preparation of foodstuffs [electric, kitchen], other than for cooking; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor; agricultural, gardening and forestry machines and apparatus and parts therefor. Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets; computer peripherals; remote control apparatus; recorded and downloadable computer software; electronic control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components; covers for tablets and smartphones; touch screens and panels; display screens and display panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components; panels bearing printed circuit boards and electronic components. Medical apparatus and instruments and parts and fittings for the same; electronic monitoring instruments for medical use; clothing for medical use; patient monitoring sensors and alarms; apparatus for monitoring vital signs; pulse meters. Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same; lighting panels, light-emitting diodes (LED) lighting apparatus, lighting apparatus for vehicles and parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment; freezers; refrigerators; kitchen stoves and hot plates; kitchen ovens; kitchen machines (gas -) for cooking; coffee machines; electric kettles. Land vehicles and conveyances; air vehicles; water vehicles; rail vehicles including trams and trains; parts and fittings for land, air, water and rail vehicles; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor. Precious metals; precious metal alloys. Insulation and barrier articles and materials; insulating panels; acoustic insulating panels for buildings; plastic materials in the form of panels [semi-finished products]; semi-worked plastic substances; polymeric membranes; electrical insulation articles and materials; carbon fibres, other than for textile use; fabrics of organic fibres for use as insulation. Veneers; non-metallic cladding panels; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal; acoustic panels for buildings, not of metal. Beverage coolers [containers]. Fabrics; textiles and substitutes for textiles; household textiles; polyester textiles; polymer coated fabrics; fabrics of organic fibres, other than for insulation. Clothing; headgear; footwear; sports clothing; sports shoes; wristbands. Sporting articles and equipment and parts and fittings for the same; covers for sporting articles and equipment; toys, games, playthings and parts and fittings for the same; covers for toys, games, playthings; sports training apparatus; footballs; golf clubs; protective paddings (parts of sports suits). Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly of products for others; custom assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; server hosting, software as a service [SaaS], and rental of software; software as a service featuring software for producing products and for managing the production process of products; software maintenance and upkeep.

Abstract

Integrated functional multilayer structure (100, 200, 1100,1200) for building a gestural UI (user interface), comprising a flexible, 3D-formable substrate film (202) comprising a first surface (202a) for facing towards an environment of the structure and a user therein, and an opposite second surface(202b) facing towards the internals of the structure, where in the first (202a) and second (202b) surfaces and remaining material of the substrate film (202) in between locally define a three-dimensional protrusion (101) extending from a plane(2020) of surrounding substrate film material and formed from locally stretched and shaped material of the substrate film, said protrusion (101) preferably defining a continuous multi-sided knob (100, 200) or recess (1100, 1200) shape in the multilayer structure with a plurality of substantially vertical or canted, and optionally at least locally curved, side walls (104) perceptible by touch; circuitry (206) provided upon the substrate film and comprising a number of conductive traces, electrodes and/or components configured to detect touch on two or more of the plurality of side walls and preferably, a top (201) of the protrusion; and at least one fill layer (208) of preferably thermoplastic fill material arranged, optionally (injection) molded or cast, upon the substrate film to at least partially embed the circuitry and optionally also, volume defined by the protrusion shape and the plane. Related method of manufacture is presented.

IPC Classes  ?

• G06F 3/0354 - Pointing devices displaced or positioned by the userAccessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
• G06F 3/02 - Input arrangements using manually operated switches, e.g. using keyboards or dials
• G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
• G06F 3/033 - Pointing devices displaced or positioned by the userAccessories therefor
• G06F 3/0362 - Pointing devices displaced or positioned by the userAccessories therefor with detection of 1D translations or rotations of an operating part of the device, e.g. scroll wheels, sliders, knobs, rollers or belts
• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• G06F 3/0488 - Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
• B60K 35/00 - Instruments specially adapted for vehiclesArrangement of instruments in or on vehicles
• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H05K 3/28 - Applying non-metallic protective coatings

Goods & Services

(1) Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials, namely, rods of metal for welding, soldering wire of metal, spelters for welding and soldering. (2) Machine tools; power tools; laundry washing machines; dishwashers; kitchen machines, electric; mixers [kitchen machines]; electric kitchen appliances for chopping, mixing, pressing; machines for the preparation of foodstuffs [electric, kitchen], other than for cooking; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor; agricultural, gardening and forestry machines and apparatus and parts therefor. (3) Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets; computer peripherals; remote control apparatus; recorded and downloadable computer software; electronic control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components; covers for tablets and smartphones; touch screens and panels; display screens and display panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components; panels bearing printed circuit boards and electronic components. (4) Medical apparatus and instruments and parts and fittings for the same; electronic monitoring instruments for medical use; clothing for medical use; patient monitoring sensors and alarms; apparatus for monitoring vital signs; pulse meters. (5) Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same; lighting panels, light-emitting diodes (LED) lighting apparatus, lighting apparatus for vehicles and parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment; freezers; refrigerators; kitchen stoves and hot plates; kitchen ovens; kitchen machines (gas -) for cooking; coffee machines; electric kettles. (6) Land vehicles and conveyances; air vehicles; water vehicles; rail vehicles including trams and trains; parts and fittings for land, air, water and rail vehicles; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor. (7) Precious metals; precious metal alloys. (8) Insulation and barrier articles and materials; insulating panels; acoustic insulating panels for buildings; plastic materials in the form of panels [semi-finished products]; semi-worked plastic substances; polymeric membranes; electrical insulation articles and materials; carbon fibres, other than for textile use; fabrics of organic fibres for use as insulation. (9) Veneers; non-metallic cladding panels; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal; acoustic panels for buildings, not of metal. (10) Beverage coolers [containers]. (11) Fabrics; textiles and substitutes for textiles; household textiles; polyester textiles; polymer coated fabrics; fabrics of organic fibres, other than for insulation. (12) Clothing; headgear; footwear; sports clothing; sports shoes; wristbands. (13) Sporting articles and equipment and parts and fittings for the same; covers for sporting articles and equipment; toys, games, playthings and parts and fittings for the same; covers for toys, games, playthings; sports training apparatus; footballs; golf clubs; protective paddings (parts of sports suits). (1) Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly of products for others; custom assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components. (2) Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; server hosting, software as a service [SaaS], and rental of software; software as a service featuring software for producing products and for managing the production process of products; software maintenance and upkeep.

Goods & Services

Common metals, unwrought or semi-wrought; common metal alloys; metallic cladding panels, namely, cladding of metal for building; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials, namely, rods of metal for welding, soldering wire of metal, spelters for welding and soldering in the nature of metal welding rods Machine tools, namely, drilling tools, boring tools, milling tools; power tools, namely, tile saws, thread mills, drill presses; laundry washing machines; dishwashers; kitchen machines, electric, namely, mixers and grinders; Kitchen mixers, electric; electric kitchen appliances for chopping, mixing, pressing, namely, electric food choppers, electric food mixers, electric food presses; machines for the preparation of foodstuffs, other than for cooking, namely, electric stand mixers; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor, namely agricultural seed planting machines, earthmoving machines, concrete construction machines and drills for the mining industry; agricultural, gardening and forestry machines and apparatus and parts therefor, namely, tilling machines for agricultural use, garden tilling machines, tree stump cutters Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly of products for others, namely, custom manufacturing of plastic injection-molded parts for others; custom assembly of products and parts and fittings of products for others, namely, custom manufacturing of plastic injection-molded parts for others; custom manufacture and assembly in the nature of custom manufacturing of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly in the nature of custom manufacturing of electronic components for vehicles; custom manufacture and assembly in the nature of custom manufacturing of electronic components for medical devices; custom manufacture and assembly in the nature of custom manufacturing of electronic components for sporting articles and equipment; custom manufacture and assembly in the nature of custom manufacturing of plastic panels; custom manufacture and assembly in the nature of custom manufacturing of molded components Scientific, optical, weighing, measuring, signalling, checking and supervision apparatus and instruments, namely, scales, measuring cups, injection molded electronic systems comprising electric sensors, electronic data relays for sensors, and recorded computer operating system software; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity, namely, electric conductors, electric switches, transformers, accumulators, voltage regulators, electrical controllers; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets, namely, headsets for telephones and headsets for remote communication; computer peripherals; remote control apparatus, namely, remote controls for computers and speakers; recorded and downloadable computer software for use in database management; electronic control boards and panels, namely, lighting panel control boards and electric control panels; sensors, not for medical use and detector units for use in controlling the actuation and operation of automotive safety apparatus and equipment; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components, namely, electric switch housings and electrical connector housings; covers for tablets and smartphones; touch screens and panels; Flat panel display screens and digital signage display panels; wearable computers, sensors and, touch screens and panels, display screens and display panels, and activity trackers, namely smartwatches, wearable electric or electronic sensors, namely wearable electronic proximity sensors with embedded contact tracing software for monitoring and alerting of social distances; electronic monitoring instruments, not for medical use, namely, electronic monitors for monitoring electric current and electrical signals, electronic devices in the nature of energy meters for tracking and monitoring energy usage; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use, namely, wearable activity trackers; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components, namely, housings for printed circuit boards and electronic components in the nature of electrical connectors and switches; panels bearing printed circuit boards and electronic components, namely, electric control panels Medical apparatus and instruments for use in cardiovascular procedures and structural parts and fittings for the same; electronic monitoring instruments for medical use, namely, fetal pulse and vital sign monitors; clothing for medical use, namely, surgical scrub suits; patient monitoring sensors and alarms; Medical apparatus for monitoring vital signs; pulse meters Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes, namely, lighting fixtures, water heaters, refrigerators, electric air dryers, ventilation hoods, water fountains, wash basins being parts of sanitary installations and structural parts and fittings for the same; lighting panels for vehicles, namely, land vehicles, air vehicles and rail vehicles, light-emitting diodes (LED) lighting apparatus, namely, LED lighting apparatus for vehicles, lighting apparatus for vehicles and structural parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment, namely, cooking ranges, hot water heating installations, beverage-cooling apparatus; freezers; refrigerators; kitchen stoves and hot plates; kitchen cooking ovens; gas kitchen machines for cooking, namely, gas stoves; Electric coffee machines; electric kettles Land vehicles and conveyances, namely, land vehicles; air vehicles, namely, airplanes; water vehicles, namely, boats; rail vehicles namely, trams and trains; structural parts and fittings for land, air, water and rail vehicles in the nature of land vehicles, airplanes, boats, trams, and trains; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles, namely, bodyworks for motor vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles in the nature of metal parts for vehicles, namely automotive exterior and interior metal decorative and protective trim; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor Precious metals; precious metal alloys Insulation and barrier articles and materials, namely, insulating materials; acoustic insulating panels; acoustic insulating panels for buildings; semi-processed plastic materials in the form of panels; semi-worked plastic substances in the nature of semi-processed plastics; polymeric membranes, namely, semi-processed polymers in pellet form for use as filling material for synthetic grounds; electrical insulation articles and materials, namely, insulators for electrical cables and electrical insulating tapes; carbon fibres, other than for textile use; fabrics of organic fibres for use as insulation Veneers, namely, veneers for floors, wood veneers and stone veneers; non-metallic cladding panels for building; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal; acoustic panels for buildings, not of metal, namely, non-metallic building panels incorporating acoustic insulation Non-electric portable beverage coolers Fabrics, namely, insulating fabrics; textiles and substitutes for textiles, namely, used as linings for clothes; household textiles, namely textile curtains; natural and synthetic fabrics and textiles, namely, polyester textiles; polymer coated fabrics, namely acrylic fabrics and woven fabrics; fabrics of organic fibres, other than for insulation, namely, cotton fabrics Clothing, namely, pants, shirts, tops, jackets and shorts; headwear; footwear; sports clothing, namely, sports shirts, sports pants, sports jackets; sports shoes; wristbands as clothing Sporting articles and equipment, namely, athletic wrist and joint supports, ball pitching screens, golf clubs, tennis rackets and skis and structural parts and fittings for the same; covers for sporting articles and equipment in the nature of fitted protective covers specially adapted for sports equipment, namely, golf clubs, tennis rackets and skis; toys, games, playthings, namely, construction toys, toy planes, cars and boats, board games, video game consoles, swing sets and structural parts and fittings for the same; covers for toys, games, playthings in the nature of fitted covers specially adapted for toy planes, cars and boats, fitted covers specially adapted to protect video game consoles for use with an external display screen or monitor, and protective fitted covers for swing sets; sports training apparatus, namely, pitching machines; footballs; golf clubs; protective paddings for playing football Scientific and technological services, namely, research and design in the field of computers and engineering; industrial analysis and research services in the field of computers and engineering; design and development of computer hardware and software; research and development of new products; technological analysis services, namely, technology research in the field of machine engineering analysis; technical measuring and testing, namely, measurement evaluations in the field of computers and engineering; server hosting, software as a service (SaaS) services featuring software for use in database management and rental of software for use in database management; software as a service (SaaS) services featuring software for producing products and for managing the production process of products; software maintenance and upkeep in the nature of updating of software

Goods & Services

Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials. Machine tools; power tools; laundry washing machines; dishwashers; kitchen machines, electric; mixers [kitchen machines]; electric kitchen appliances for chopping, mixing, pressing; machines for the preparation of foodstuffs [electric, kitchen], other than for cooking; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor; agricultural, gardening and forestry machines and apparatus and parts therefor. Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets; computer peripherals; remote control apparatus; recorded and downloadable computer software; control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components; covers for tablets and smartphones; touch screens and panels; display screens and display panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components; panels bearing printed circuit boards and electronic components. Medical apparatus and instruments and parts and fittings for the same; electronic monitoring instruments for medical use; clothing for medical use; patient monitoring sensors and alarms; apparatus for monitoring vital signs; pulse meters. Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same; lighting panels, light-emitting diodes (LED) lighting apparatus, lighting apparatus for vehicles and parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment; freezers; refrigerators; kitchen stoves and hot plates; kitchen ovens; kitchen machines (gas -) for cooking; coffee machines; electric kettles. Land vehicles and conveyances; air vehicles; water vehicles; rail vehicles including trams and trains; parts and fittings for land, air, water and rail vehicles; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor. Precious metals; precious metal alloys. Insulation and barrier articles and materials; insulating panels; acoustic panels for buildings; plastic materials in the form of panels [semi-finished products]; semi-worked plastic substances; polymeric membranes; electrical insulation articles and materials; carbon fibre; fabrics of organic fibres for use as insulation. Veneers; non-metallic cladding panels; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal. Beverage coolers. Fabrics; textiles and substitutes for textiles; household textiles; polyester textiles; polymer coated fabrics; fabrics of organic fibres, other than for insulation. Clothing; headgear; footwear; sports clothing; sports shoes; wristbands. Sporting articles and equipment and parts and fittings for the same; covers for sporting articles and equipment; toys, games, playthings and parts and fittings for the same; covers for toys, games, playthings; sports training apparatus; footballs; golf clubs; protective paddings (parts of sports suits). Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly services; assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; hosting services and software as a service and rental of software; software as a service featuring software for producing products and for managing the production process of products; software maintenance and upkeep.

Abstract

An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.

IPC Classes  ?

• F21V 29/54 - Cooling arrangements using thermoelectric means, e.g. Peltier elements
• F21K 9/69 - Details of refractors forming part of the light source
• F21V 29/87 - Organic material, e.g. filled polymer compositesThermo-conductive additives or coatings therefor
• F21V 29/76 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• F21V 23/06 - Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices
• F21K 9/90 - Methods of manufacture
• F21Y 115/10 - Light-emitting diodes [LED]

Abstract

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

IPC Classes  ?

• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• G02B 5/08 - Mirrors

Goods & Services

Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly services, namely, custom manufacturing of plastic injection-molded parts for others; custom assembly of products and parts and fittings of products for others, namely, custom manufacturing of plastic injection-molded parts for others; custom manufacture and assembly in the nature of custom manufacturing of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly in the nature of custom manufacturing of electronic components for vehicles; custom manufacture and assembly in the nature of custom manufacturing of electronic components for medical devices; custom manufacture and assembly in the nature of custom manufacturing of electronic components for sporting articles and equipment; custom manufacture and assembly in the nature of custom manufacturing of plastic panels; custom manufacture and assembly in the nature of custom manufacturing of molded components Common metals, unwrought or semi-wrought; common metal alloys; metallic cladding panels, namely, cladding of metal for building; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials,namely, rods of metal for welding, soldering wire of metal, spelters for welding and soldering in the nature of metal welding rods Machine tools, namely, drilling tools, boring tools, milling tools; power tools, namely, tile saws, thread mills, drill presses; laundry washing machines; dishwashers; kitchen machines, electric namely, mixers and grinders; Kitchen mixers, electric; electric kitchen appliances for chopping, mixing, pressing namely, electric food choppers, electric food mixers, electric food presses; machines for the preparation of foodstuffs, other than for cooking, namely, electric stand mixers; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor,namely, agricultural seed planting machines, earthmoving machines, concrete construction machines and drills for the mining industry; agricultural, gardening and forestry machines and apparatus and parts therefor,namely, tilling machines for agricultural use, garden tilling machines, tree stump cutters Scientific, optical, weighing, measuring, signalling, and checking supervision apparatus and instruments, namely, scales, measuring cups, injection molded electronic systems comprising electric sensors, electronic data relays for sensors, and recorded computer operating system software; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity, namely, electric conductors, electric switches, transformers, accumulators, voltage regulators, electrical controllers; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets, namely, headsets for telephones and headsets for remote communication; computer peripherals; remote control apparatus, namely, remote controls for computers and speakers; recorded and downloadable computer software for use in database management; control boards and panels, namely, lighting panel control boards and electric control panels; sensors, not for medical use and detector units for use in controlling the actuation and operation of automotive safety apparatus and equipment; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components, namely, electric switch housings and electrical connector housings; covers for tablets and smartphones; touch screens and panels; Flat panel display screens and digital signage display panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers namely smartwatches, wearable electric or electronic sensors, namely, wearable electronic proximity sensors with embedded contact tracing software for monitoring and alerting of social distances; electronic monitoring instruments, not for medical use namely, electronic monitors for monitoring electric current and electrical signals, electronic devices in the nature of energy meters for tracking and monitoring energy usage; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use, namely, wearable activity trackers; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components, namely, housings for printed circuit boards and electronic components in the nature of electrical connectors and switches; panels bearing printed circuit boards and electronic components, namely, electric control panels electronic monitoring instruments for medical use, namely, fetal pulse and vital sign monitors; clothing for medical use, namely, surgical scrub suits; patient monitoring sensors and alarms; Medical apparatus for monitoring vital signs; pulse meters Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes, namely, lighting fixtures, water heaters, refrigerators, electric air dryers, ventilation hoods, water fountains, wash basins being parts of sanitary installations and structural parts and fittings for the same; lighting panels for vehicles, namely, land vehicles, air vehicles and rail vehicles, light-emitting diodes (LED) lighting apparatus, namely, LED lighting apparatus for vehicles, lighting apparatus for vehicles and structural parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment,namely, cooking ranges, hot water heating installations, beverage-cooling apparatus; freezers; refrigerators; kitchen stoves and hot plates; kitchencooking ovens; gas kitchen machines for cooking,namely, gas stoves; Electric coffee machines; electric kettles Land vehicles and conveyances, namely, land vehicles; air vehicles namely, airplanes; water vehicles namely, boats; rail vehicles, namely, trams and trains; structural parts and fittings for land, air, water and rail vehicles in the nature of land vehicles, airplanes, boats, trams, and trains; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles, namely, bodyworks for motor vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles, in the nature of metal parts for vehicles, namely automotive exterior and interior metal decorative and protective trim; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor Precious metals; precious metal alloys Insulation and barrier articles and materials, namely, insulating materials; acoustic insulating panels; acoustic insulating panels for buildings; semi-processed plastic materials in the form of panels; semi-worked plastic substances in the nature of semi-processed plastics; polymeric membranes, namely, semi-processed polymers in pellet form for use as filling material for synthetic grounds; electrical insulation articles and materials, namely, insulators for electrical cables and electrical insulating tapes; carbon fibres, other than for textile use; fabrics of organic fibres for use as insulation Veneers namely, veneers for floors, wood veneers and stone veneers; non-metallic cladding panels for building; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal Fabrics, namely, insulating fabrics; textiles and substitutes for textiles, namely, used as linings for clothes; household textiles, namely textile curtains; natural and synthetic fabrics and textiles, namely, polyester textiles; polymer coated fabrics, namely acrylic fabrics and woven fabrics; fabrics of organic fibres, other than for insulation, namely, cotton fabrics Scientific and technological services and research, namely, research and design in the field of computers and engineering and research and design relating thereto; industrial analysis and research services in the field of computers and engineering; design and development of computer hardware and software; research and development of new products; technological analysis services, namely, technology research in the field of machine engineering analysis; technical measuring and testing, namely, measurement evaluations in the field of computers and engineering; hosting services and software as a service (SaaS) services featuring software for use in database management and rental of software for use in database management; providing software as a service (SaaS) services featuring software for use as a software tool for producing products and for managing the production process of products; software maintenance and upkeep in the nature of updating of software

Goods & Services

(1) Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials, namely, wire of metal, rods of metal. (2) Machine tools, namely, drilling tools, boring tools, milling tools; power tools; laundry washing machines; dishwashers; kitchen mixers, electric; electric kitchen appliances for chopping, mixing, pressing food; machines for the preparation of foodstuff, other than for cooking, namely, electric stand mixers; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor, namely, agricultural seed planting machines, earthmoving machines, namely, earth moving scrapers, earth haulers, bulldozers, hydraulic excavators, front-end loaders, concrete construction machines and drills for the mining industry; agricultural, gardening and forestry machines and apparatus and parts therefor, namely, tilling machines for agricultural use, garden tilling machines, tree stump cutters. (3) Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments, namely, laboratory scales, measuring cups, injection-molded plastic components being housing for electronic systems comprising electrical sensors for detecting electric current, electric relays, and computer software for processing sensor data; apparatus and instruments for conducting, switching, transforming, accumulating, regulating and controlling electricity, namely, electrical conductor cables, electric switchboards, electric transformers, accumulators being electrical storage batteries, voltage regulators, electrical charge controllers; electrical cables for recording, transmission and reproduction of sound and images; data processing equipment, namely, computers; headsets; computer peripherals, namely, digital cameras, keyboards, modems, mouse, printers, scanners, speakers, video recorders; remote control apparatus, namely, remote controls for computers and speakers; recorded and downloadable computer software for use in database management; control boards and panels; motion sensors and detectors; antennas, namely radio-frequency antennas, radio signal antennas, panel antennas, microwave antennas, radar antennas, satellite antennas, dish antennas, car antennas, cell phone antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components, namely, electric switch housings and electrical connector housings; covers for tablets and smartphones; touch screens and panels; flat panel display screens and digital signage display panels; wearable computers in the nature of smartwatches, wearable motion and distance sensors and detectors, touch screens and panels, wearable display screens and display panels, namely, smart sunglasses, wearable video display monitors, wearable smartphones, wearable smart watches, and activity trackers; electronic monitoring instruments, not for medical use, namely, electronic monitors energy meters for tracking and monitoring energy usage; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components being housing for printed circuit boards and electronic components; touch panels bearing printed circuit boards and electronic components for computers. (4) Medical apparatus and instruments for use in cardiovascular procedures, namely, diagnostic catheters, balloon catheters, stent delivery systems, guidewires, vascular access sheaths, and cardiac monitoring devices, surgical instruments for cardiovascular applications, namely, vessel clamps, heart retractors, cannulas, stents, artificial heart valves, and pacemakers; electronic monitoring instruments for medical use, namely, electronic temperature monitors for medical use; clothing for medical use, namely, medical gloves and gowns; patient monitoring sensors and alarms for monitoring patient movement; apparatus for monitoring vital signs, namely, patient medical monitors for monitoring vital signs; pulse meters. (5) Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same, namely, lighting fixtures, water heaters, refrigerators, electric air dryers, ventilation hoods, water fountains, wash basins being parts of sanitary installations; lighting panels for vehicles, namely, land vehicles, air vehicles and rail vehicles, light-emitting diodes (LED) lighting apparatus, namely, LED lighting for vehicles being headlights, taillights, interior lighting, and indicator lights and parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment, namely, cooking ranges, hot water heating installations namely heaters, beverage-cooling dispensing machines, fridges; freezers; refrigerators; kitchen stoves and hot plates; kitchen ovens; gas kitchen machines for cooking, namely, gas stoves; coffee machines; electric kettles. (6) Land vehicles and conveyances, namely automobiles, passenger trains, subway trains and trams; air vehicles, namely, airplanes; water vehicles, namely, boats; rail vehicles, namely, trams and trains; structural parts and fittings for land, air, water and rail vehicles, namely, injection-molded plastic units, namely, plastic parts for vehicles which are embedded with printed circuits and electronic components, used for interior and exterior paneling, steering apparatus, door handles, bumpers, vehicle sensors, and vehicle antennas; automobile dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor. (7) Precious metals; precious metal alloys. (8) Acoustical insulation barrier sheets made of sound-absorbing textile materials; acoustical insulation barrier panels; acoustic insulation panels for buildings; semi-processed plastic materials in the form of panels; semi-worked plastic substances in the nature of semi-processed plastics; polymeric membranes, namely, pellets for use as filling material for synthetic grounds; electrical insulation articles and materials; carbon fibre; fibreglass fabrics of organic fibres for use as insulation. (9) Veneers, namely, veneers for floors, wood veneers and stone veneers; non-metallic cladding panels for building; non-metallic wall panels for building; building panels, not of metal, namely, concrete, glass, plastic and wood; door panels, not of metal; doors, not of metal, namely, glass, plastic and wood. (10) Beverage coolers. (11) Textiles and substitutes for textiles, namely, for linings of clothes; household textiles, namely textile curtains; natural and synthetic fabrics and textiles, namely, polyester textiles; polymer coated fabrics, namely acrylic fabrics and woven fabrics; fabrics of organic fibres, other than for insulation, namely, cotton fabrics. (12) Clothing, namely, pants, shirts, tops, namely, athletic tops, crop tops, fleece tops, sweat tops, tank tops, jackets and shorts; headgear, namely, hats, caps, sun visors, headbands, toques; footwear, namely, shoes, boots, sandals, casual footwear; sports clothing; sports shoes; wristbands. (13) Sporting articles and equipment, namely, athletic wrist and joint supports, ball pitching screens, golf clubs, tennis rackets and skis and structural parts and fittings for the same; covers for sporting articles and equipment in the nature of fitted protective covers specially adapted for sports equipment, namely, golf clubs, tennis rackets and skis; toys, games, playthings, namely, construction toys, toy planes, cars and boats, board games, video game consoles, swing sets and structural parts and fittings for the same; covers for toys, games, playthings in the nature of fitted covers specially adapted for toy planes, cars and boats, fitted covers specially adapted to protect video game consoles for use with an external display screen or monitor, and protective fitted covers for swing sets; sports training apparatus, namely, pitching machines; footballs; golf clubs; protective paddings for playing football. (1) Custom manufacture of electric computer and electronic computer components, motor vehicle parts and fittings, manufacturing of electronic components for medical equipment, plastic panels for building, and plastic molded components for the manufacture of molded plastic; custom assembly services, namely, custom manufacturing of plastic injection-molded parts for others; custom assembly of products and parts and fittings of products, namely, custom manufacturing of plastic injection-molded parts for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components to the order and specification for vehicles in the nature of custom manufacturing of electronic components for vehicles; custom manufacture and assembly of electronic components to the order and specification of medical devices for others; custom manufacture and assembly of electronic components to the order and specification for sporting articles and equipment; custom manufacture and assembly of plastic panels for building; custom manufacture and assembly of plastic molded components for building. (2) Scientific and technological services and research, namely, research and design in the field of computers and engineering and research and design relating thereto; industrial analysis and research services in the field of computers and engineering; design and development of computer hardware and software; research and development of new products for others; technological research analysis services in the field of computers; technical measuring and testing, namely, measurement evaluations in the field of computers and engineering; hosting services and software as a service (SaaS) services featuring software for use in database management and rental of software for use in database management; providing software as a service (SaaS) featuring software for the creation of products and the management of product manufacturing processes; software maintenance and upkeep in the nature of updating of software.

Abstract

An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.

IPC Classes  ?

• F21V 29/54 - Cooling arrangements using thermoelectric means, e.g. Peltier elements
• F21V 29/87 - Organic material, e.g. filled polymer compositesThermo-conductive additives or coatings therefor
• F21V 29/76 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• F21K 9/69 - Details of refractors forming part of the light source
• F21K 9/90 - Methods of manufacture
• F21V 23/06 - Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices
• F21Y 115/10 - Light-emitting diodes [LED]

Abstract

The multilayer structure including a substrate film and a number of functional components and/or integrated circuits, including at least one first conductive element, at least one second conductive element, and at least one subsidiary conductive element, optionally traces, provided upon the substrate film. The substrate film has been provided with at least one coupling location enhancement element at a coupling location with respect to the substrate film, wherein at said coupling location the coupling location enhancement element is configured to provide an electrical connection between the first conductive element and second conductive element, further wherein said coupling location enhancement element is configured to inhibit coupling between the first conductive element and the subsidiary conductive element at the coupling location and between the second conductive element and the subsidiary conductive element at the coupling location.

IPC Classes  ?

• G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier

Goods & Services

Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials.. Machine tools; power tools; laundry washing machines; dishwashers; kitchen machines, electric; mixers [kitchen machines]; electric kitchen appliances for chopping, mixing, pressing; machines for the preparation of foodstuffs [electric, kitchen], other than for cooking; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor; agricultural, gardening and forestry machines and apparatus and parts therefor.. Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets; computer peripherals; remote control apparatus; recorded and downloadable computer software; control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components; covers for tablets and smartphones; touch screens and panels; display screens and display panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components; panels bearing printed circuit boards and electronic components.. Medical apparatus and instruments and parts and fittings for the same; electronic monitoring instruments for medical use; clothing for medical use; patient monitoring sensors and alarms; apparatus for monitoring vital signs; pulse meters.. Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same; lighting panels, light-emitting diodes (LED) lighting apparatus, lighting apparatus for vehicles and parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment; freezers; refrigerators; kitchen stoves and hot plates; kitchen ovens; kitchen machines (gas -) for cooking; coffee machines; electric kettles.. Land vehicles and conveyances; air vehicles; water vehicles; rail vehicles including trams and trains; parts and fittings for land, air, water and rail vehicles; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor.. Precious metals; precious metal alloys.. Insulation and barrier articles and materials; insulating panels; acoustic panels for buildings; plastic materials in the form of panels [semi-finished products]; semi-worked plastic substances; polymeric membranes; electrical insulation articles and materials; carbon fibre; fabrics of organic fibres for use as insulation.. Veneers; non-metallic cladding panels; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal.. Beverage coolers.. Fabrics; textiles and substitutes for textiles; household textiles; polyester textiles; polymer coated fabrics; fabrics of organic fibres, other than for insulation.. Clothing; headgear; footwear; sports clothing; sports shoes; wristbands.. Sporting articles and equipment and parts and fittings for the same; covers for sporting articles and equipment; toys, games, playthings and parts and fittings for the same; covers for toys, games, playthings; sports training apparatus; footballs; golf clubs; protective paddings (parts of sports suits).. Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly services; assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components.. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; hosting services and software as a service and rental of software; providing on a software as a service basis a software tool for producing products and for managing the production process of products; software maintenance and upkeep..

Abstract

An integrated functional multilayer structure includes a flexible, 3D-formable substrate film having a first surface facing towards an environment of the structure and a user therein, and an opposite second surface facing towards the internals of the structure, wherein the first and second surfaces and remaining material of the substrate film in between locally define a three-dimensional protrusion extending from a plane of surrounding substrate film material and formed from locally stretched and shaped material of the substrate film, side walls perceptible by touch; circuitry provided upon the substrate film includes a number of conductive traces, electrodes and/or components to detect touch on two or more of the plurality of side walls and at least one fill layer upon the substrate film to at least partially embed the circuitry.

IPC Classes  ?

• G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
• G06F 3/04847 - Interaction techniques to control parameter settings, e.g. interaction with sliders or dials
• G06F 3/04883 - Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures for inputting data by handwriting, e.g. gesture or text

Abstract

An integrated functional multilayer structure includes substrate film, circuitry provided upon the substrate film including a first light source and a monolithic lightguide layer, the lightguide layer includes a first surface and an opposite second surface, the second surface facing the first light source and a portion of the first surface containing, a pre-defined outcoupling area for the light emitted by the first light source and transmitted within the lightguide layer, the lightguide layer further containing a light leakage prohibition region and the attenuation of emitted light effectuated on a direct optical path between the first light source and the outcoupling area is less than the attenuation effectuating on a optical path between the first light source and the light leakage prohibition region. A related method of manufacture is also presented.

IPC Classes  ?

• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems

Abstract

An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

IPC Classes  ?

• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Goods & Services

Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials. Machine tools; power tools; laundry washing machines; dishwashers; kitchen machines, electric; mixers [kitchen machines]; electric kitchen appliances for chopping, mixing, pressing; machines for the preparation of foodstuffs [electric, kitchen], other than for cooking; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor; agricultural, gardening and forestry machines and apparatus and parts therefor. Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets; computer peripherals; remote control apparatus; recorded and downloadable computer software; control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components; covers for tablets and smartphones; touch screens and panels; display screens and display panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components; panels bearing printed circuit boards and electronic components. Medical apparatus and instruments and parts and fittings for the same; electronic monitoring instruments for medical use; clothing for medical use; patient monitoring sensors and alarms; apparatus for monitoring vital signs; pulse meters. Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same; lighting panels, light-emitting diodes (LED) lighting apparatus, lighting apparatus for vehicles and parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment; freezers; refrigerators; kitchen stoves and hot plates; kitchen ovens; kitchen machines (gas -) for cooking; coffee machines; electric kettles. Land vehicles and conveyances; air vehicles; water vehicles; rail vehicles including trams and trains; parts and fittings for land, air, water and rail vehicles; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor. Precious metals; precious metal alloys. Insulation and barrier articles and materials; insulating panels; acoustic panels for buildings; plastic materials in the form of panels [semi-finished products]; semi-worked plastic substances; polymeric membranes; electrical insulation articles and materials; carbon fibre; fabrics of organic fibres for use as insulation. Veneers; non-metallic cladding panels; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal. Beverage coolers. Fabrics; textiles and substitutes for textiles; household textiles; polyester textiles; polymer coated fabrics; fabrics of organic fibres, other than for insulation. Clothing; headgear; footwear; sports clothing; sports shoes; wristbands. Sporting articles and equipment and parts and fittings for the same; covers for sporting articles and equipment; toys, games, playthings and parts and fittings for the same; covers for toys, games, playthings; sports training apparatus; footballs; golf clubs; protective paddings (parts of sports suits). Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly services; assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; hosting services and software as a service and rental of software; providing on a software as a service basis a software tool for producing products and for managing the production process of products; software maintenance and upkeep.

Goods & Services

(1) Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signaling, checking (supervision), life-saving and teaching apparatus and instruments namely, molded electronic systems comprising electric acceleration, motions pressure, temperature and touchscreen sensors, electronic data relays for the aforementioned sensors, computer software for operating system programs; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity namely, electrical conductors for electric motors, electric current switches, transformers, electrical controllers for governing the electrical output of rechargeable batteries, circuit boards and electronic components including ink and adhesives, namely, printed electronic circuits for conducting electricity; apparatus for recording, transmission or reproduction of sound or images namely, computer hardware for data processing equipment, computers, remote control apparatus, namely, electrical controls for computers and computer speakers, recorded and downloadable computer software for use in database management, lighting panel control boards, electronic sensors and electronic detectors for accessing control systems for the actuation and operation of automotive safety and automotive equipment, car antennas, electrical circuits and circuit boards, microprocessors, housing for switching apparatus, namely, computer network switches and computer cases, covers for tablets and smartphones, touch screens and touch panels, flat panel display screens and electric control panels, wearable computers in the nature of smartwatches, wearable motion and distance sensors and detectors, wearable touch screens monitors, wearable activity trackers, electronic monitor energy meters for tracking and monitoring energy usage, wearable cameras that transmit physiological or location data via computer networks, biometric electronically encoded identity wristbands, printed circuit boards being electronic components for computers, printed circuit boards and electronic components being parts of computers comprised primarily of injection-molded plastics, housings for printed circuit boards and electronic components for computers comprised primarily of injection-molded plastics, touch panels bearing printed circuit boards and electronic components for computers being computer touchscreens; magnetic data carriers, recording discs, namely, blank magnetic discs; compact discs, DVDs and other digital recording media, namely, blank compact discs, blank digital versatile discs; cash registers, calculating machines, data processing equipment, namely, computers; computer software for operating system programs. (2) Apparatus for lighting, heating, steam generating, cooking, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same, namely, lighting fixtures, water heaters, refrigerators, electric air dryers, ventilation hoods, water fountains, wash basins being parts of sanitary installations, flat light panels, light-emitting diodes (LED) lighting fixtures, interior and front and rear lighting for vehicles and structural parts and fittings therefor, deep freezers, freezer-refrigerators, beverage coolers, electric kitchen stoves and electric hot plates, electric kitchen cooking ovens for household purposes, gas cooking ovens for household purposes, electric coffee machines, electric kettles. (3) Vehicles, namely automobiles, passenger trains, subway trains and trams, airplanes, boats, structural parts and fittings for land, air and water vehicles; replacement parts, namely structural parts and interior trim parts for automobiles, airplanes, boats and passenger trains, trams, and subway trains, namely, plastic parts for vehicles, namely, fitted dashboard covers embedded with printed circuits and electronic components for computers comprised primarily of injection-molded plastics, vehicle body panels, steering wheels, vehicle door handles, vehicle bumpers, antenna toppers for automobiles, vehicle dashboards, upholstery for vehicles, namely, automobiles, airplanes, boats, passenger trains, trams and subway trains; covers for vehicle steering wheels, doors and bumpers for land, air and water vehicles, bodywork parts for land, air and water vehicles, body panels for land, air and water vehicles, interior and exterior panels for land, air and water vehicles, door panels and roof panels for land, air and water vehicles, motor car seats and parts and fittings therefor, children's car seats; passenger trains, subway trains, trams and automobiles for locomotion by land, planes for locomotion by air and boats for locomotion by water and structural parts and fittings therefor, structural replacement parts for automobiles, airplanes, boats and trains, plastic parts for vehicles, namely, fitted dashboard covers, rear inner panels, rear shelf panels, roof panels and body panels for vehicles embedded with printed circuits and electronic components being computers, upholstery for vehicles, namely, automobiles, airplanes and boats, trams, passenger trains and subway trains, covers for vehicle steering wheels, doors for vehicles and automobiles, passenger trains, trams, and subway trains, plane and boat bumpers, structural parts for automobiles, aircrafts, and boats, passenger trains, trams and subway trains, motor car seats and parts and fittings therefore, namely, seat belt safety buckles and car seat belt cross connectors, upholstery for vehicle seats, arm rests for vehicle seats, head-rests for vehicle seats, car seats for children. (1) Scientific and technological services, namely, industrial research and design in the field of computer hardware and software, and software engineering; industrial analysis and research services in the field of computers and engineering, research and development of new products, technological consultation relating to machine engineering analysis, technical measuring and testing of computers, electronic components and electronic systems, hosting the websites of others, software as a service (SaaS) services, featuring software for use in database management, rental of software, software as a service (SaaS) for producing products and for managing the production process of products, namely, for use in manufacturing injection-molded plastic housings for electronic components, computer software maintenance; design and development of computer hardware and software.

Goods & Services

(1) Scientific, optical, weighing, measuring, signalling, checking, supervising apparatus and instruments, namely, laboratory scales, measuring cups; scientific, optical, weighing, measuring, signaling, checking, supervision apparatus and instruments, namely, injection molded electronic systems comprising electric sensors, acceleration sensors, motion sensors, pressure sensors, temperature sensors, touchscreen sensors, electronic data relays for sensors; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity, namely, electric conductors for transformers, current switches, electrical transformers, accumulators being electrical storage batteries, voltage regulators, electrical charge controllers; computers for the recording, transmission and reproduction of sound and images; apparatus for recording, transmission or reproduction of sound or images, namely, computer hardware for data processing equipment, computers; computer data processing equipment, namely, computers; remote control apparatus, namely, remote controls for computers and speakers; recorded and downloadable computer software for operating system programs; lighting panel control boards and panels; acceleration sensors and motion detectors for use in controlling the actuation and operation of vehicle safety and security while driving; antennas, namely radio-frequency antennas, radio signal antennas, panel antennas, microwave antennas, radar antennas, satellite antennas, dish antennas, car antennas, cell phone antennas; electrical circuits and circuit boards; microprocessors; cases and housings for electric equipment and computers; covers for tablets and smartphones; flat panel display screens and electric control panels; wearable computers in the nature of smartwatches, wearable motion and distance sensors and detectors, computer touch screens and panels, wearable display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use, namely, electronic computer monitors energy meters for tracking and monitoring energy usage; wearable electronic equipment, namely wearable cameras that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; printed circuit boards and electronic components for injection-molded plastic components for computers; injection-molded plastic components being housings for printed circuit boards and electronic components; touch panels bearing printed circuit boards and electronic components for computers. (2) Medical apparatus and instruments for use in cardiovascular procedures, and parts and fittings for the same; electronic monitoring instruments for medical use, namely, electronic temperature monitors for medical use; clothing for medical use, namely, medical gloves and gowns; medical apparatus and instruments, namely, electronic plastic molded machines comprised of patient monitoring sensors and alarms for monitoring vital signs; apparatus for monitoring vital signs, namely patient medical monitors for monitoring vital signs; pulse meters. (3) Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same, namely, lighting fixtures, water heaters, refrigerators, electric air dryers, ventilation hoods, water fountains, wash basins being parts of sanitary installations; lighting panels, light-emitting diodes (LED) lighting fixtures, lighting apparatus for vehicles and parts and fittings for the same (4) Replacement parts and fittings for land vehicles, airplanes, boats and trains, namely, injection-molded plastic units, namely, plastic parts for vehicles which are embedded with printed circuits and electronic components, used for interior and exterior paneling, steering wheel, door handles, bumpers, fuel tank sensors and vehicle antenna toppers, dashboards, upholstery for land, air and water vehicles; covers for vehicle steering wheels, doors and bumpers for vehicles; bodywork parts for land, air and water vehicles; body panels for vehicles; interior and exterior panels for vehicles; door panels and roof panels for vehicles. (5) Clothing, namely, pants, shirts, tops, jackets and shorts, sweaters, casual clothing; headgear, namely hats, caps, sun visors, headbands, toques; footwear, namely shoes, boots, sandals, casual footwear; sports clothing; sports shoes; wristbands. (6) Sporting articles and equipment, namely, athletic wrist and joint supports, ball pitching screens, golf clubs, tennis rackets and snow skis and water skis and structural parts and fittings for the same; covers especially designed for snowboards; construction toys, toy planes, cars and boats, board games, video game consoles, playthings, namely, swing sets playthings and parts and fittings for the same; covers for toys, games, playthings, namely, fitted covers specially adapted for toy planes, cars and boats, fitted covers specially adapted to protect video game consoles for use with an external display screen or monitor, and protective fitted covers for swing sets; sports training apparatus, namely, pitching machines; footballs; golf clubs; sports protective paddings (parts of sports suits) for athletic use (1) Custom manufacture and assembly of computers for others; custom manufacture and assembly of furniture and structural parts and fittings of furniture for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels for creating a seamless structure, namely screen surfaces, surface finishes of machines and tools, and smart home devices comprised primarily of plastics for others; custom manufacture of molded components for creating a seamless structure, namely screen surfaces, surface finishes of machines and tools, and smart home devices comprised primarily of plastics for others. (2) Scientific and technological services and research and design relating thereto, namely, industrial research and design in the field of computer hardware and software, and software engineering; industrial analysis and research services in the field of computers and industrial engineering; design and development of computer hardware and software; research and development of new products for others; technological consultation relating to machine engineering analysis; technical measuring and testing of computers, electronic components and electronic systems; hosting the websites of others; software as a service (SAAS) services, featuring software for use in database management; rental of software.

Goods & Services

Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; circuit boards and electronic components for conducting electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; remote control apparatus; recorded and downloadable computer software; control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases for electronic devices; cases adapted for computers; computer housings; covers for tablets and smartphones; touch screens and panels; display screens and panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; printed circuit boards and electronic components in the form of injection-molded plastic components; panels bearing printed circuit boards and electronic components. Assembly services; assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components. Education; providing of training; educational and teaching services; provision of training courses; arranging and conducting of classes; arranging of workshops and seminars; personnel training; know-how transfer [training]; advisory services relating to education. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; hosting services and software as a service and rental of software; providing on a software as a service basis a software tool for producing products and for managing the production process of products; software maintenance and upkeep.

Abstract

The presented method of manufacture of a structure comprises obtaining or producing a functional electronics assembly comprising at least a first substrate, atleast one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substratefilm, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material toat least partly embed the at least one electronics component into the first material. The first substrate film is adapted to comprise a recess defining a volume,and the at least one electronics component is arranged at least partly in thevolume.

IPC Classes  ?

• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 5/06 - Hermetically-sealed casings

Abstract

An integrated multilayer structure includes a substrate film including an electrically insulating material; a circuit design including electrically conductive elements provided on the substrate film, the conductive elements defining a number of contact areas; a connector at the edge of the substrate film, the connector including a number of electrically conductive elongated contact elements, such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector; and at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
• H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
• H01R 13/504 - BasesCases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
• H01R 43/24 - Assembling by moulding on contact members

Abstract

Integrated multilayer structure (100, 200, 240, 280, 400,580, 640, 740, 900, 1300, 1400) comprising: a substrate film (102) comprising electrically substantially insulating material; a circuit design (106, 108, 109) comprising electrically conductive elements (106) provided on the substrate film, said conductive elements defining a number of contact areas (107); a connector (110) at the edge (102E) of the substrate film, the connector comprising a number of electrically conductive elongated contact elements (118), such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element (112) responsive to mating the external connecting element with the connector; and at least one plastic layer (104, 104B, 105) molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector, the covered portions including connection points of the contact elements with the contact areas and at least partially excluding the extended portions of the contact elements configured to couple to the external connecting element. A corresponding method of manufacture is presented.

IPC Classes  ?

• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

An optoelectronically functional multilayer structure as well as related methods of manufacturing an optoelectronically functional multilayer structure are described herein.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• F21V 11/08 - Screens not covered by groups , , or using diaphragms containing one or more apertures
• G02B 5/00 - Optical elements other than lenses
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor

Abstract

An optoelectronically functional multilayer structure and related methods of manufacturing an optoelectronically functional multilayer structure, such structure including an optionally thermoplastic formable substrate film, electronics comprising preferably light-emitting and/or light-sensitive elements, an optically transmissive layer, and a light-blocking layer defining a number of structural channels extending in at least a first direction.

IPC Classes  ?

• G02B 5/00 - Optical elements other than lenses
• B29D 11/00 - Producing optical elements, e.g. lenses or prisms
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/1362 - Active matrix addressed cells

Abstract

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/08 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 3/44 - Manufacturing insulated metal core circuits
• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 21/77 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 23/16 - Fillings or auxiliary members in containers, e.g. centering rings
• H01L 23/18 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
• H01L 23/24 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel, at the normal operating temperature of the device
• H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
• H01L 23/498 - Leads on insulating substrates
• H01L 23/552 - Protection against radiation, e.g. light
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H05K 5/03 - Covers
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• H05K 5/06 - Hermetically-sealed casings
• B29K 101/12 - Thermoplastic materials
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

IPC Classes  ?

• H05K 5/00 - Casings, cabinets or drawers for electric apparatus
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Goods & Services

Scientific, optical, weighing, measuring, signalling, and checking apparatus and instruments, namely, scales, measuring cups; Scientific, optical, weighing, measuring, signaling, checking, supervision apparatus and instruments, namely, injection molded electronic systems comprising electric sensors, electronic data relays for sensors, recorded computer software for operation of electronic sensors for injection molded systems and operating machines for manufacturing injection-molded plastic housings for electronic components; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity, namely, electric conductors, electric switches, transformers, accumulators, voltage regulators, electrical controllers; circuit boards; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; remote control apparatus, namely, remote controls for computers and speakers; recorded and downloadable computer software for use in database management; lighting panel control boards; sensors and detector units for use in controlling the actuation and operation of automotive safety apparatus and equipment; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for electric equipment and computers, namely, housing for switching apparatus and computer cases; protective covers specially adapted for tablets and smartphones; touch screens and touch panels; flat panel display screens and electric control panels; wearable computers in the nature of smartwatches, wearable sensors and detectors, namely, wearable electronic proximity sensors with embedded contact tracing software for monitoring and alerting of social distances; wearable touch screens and panels; wearable display screens and display panels; wearable activity trackers; electronic monitoring instruments, not for medical use, namely, electronic monitors energy meters for tracking and monitoring energy usage; wearable electronic equipment, namely, wearable cameras not for medical use that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; printed circuit boards and electronic components for injection-molded plastic components for computers; injection-molded plastic components being housings for printed circuit boards and electronic components; touch panels bearing printed circuit boards and electronic components for computers Custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components all of the foregoing for others to the order and specifications of others Educational services, namely providing classes, seminars and workshops in the field of structural electronics; providing of training in the field of structural electronics; provision of training courses in the field of structural electronics; arranging and conducting of classes in the field of structural electronics; arranging of workshops and seminars in the field of structural electronics; personnel training in the field of structural electronics; provision of training in the nature of providing know-how in the field of structural electronics; advisory services relating to education Scientific and technological services, namely, research and design in the field of computers and engineering; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services in the field of structural electronics; technical measuring and testing of computers; hosting the websites of others; software as a service for use in database management and rental of software; providing software as a service (SAAS) for integrating design and manufacturing of injection-molded plastic housings for electronic components; software maintenance and upkeep, namely, updating and maintenance of computer software

Abstract

A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

Integrated functional multilayer structure (100), comprising asubstrate film (102) formed or formable so as to exhibit aselected shape (103); and a number of functional, preferably5including optical, mechanical, optoelectrical, electrical and/orspecifically, electronic, elements (110, 112, 114, 210), such asconductors (112), insulators (114), components (110, 210)and/or integrated circuits (110, 210), provided upon thesubstrate film in the proximity of the shape (103); wherein the0substrate film (102) has further been provided with a structuraltuning element (116, 316, 416, 616, 716, 816, 916, 1016),optionally comprising an elongated (316, 416), circumferential(616, 716) or other selected shape, said structural tuning elementbeing configured to locally control induced deformation,5optionally including stretching, bending, compression and/orshearing, of the substrate film within said proximity of the shape.Related method of manufacture is presented.Fig. 10

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details

Abstract

An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

IPC Classes  ?

• G02B 6/00 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings
• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/28 - Applying non-metallic protective coatings

Goods & Services

Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; circuit boards and electronic components including ink and adhesive for conducting electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; remote control apparatus; recorded and downloadable computer software; control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for electricalapparatus and computers; covers for tablets and smartphones; touch screens and panels; display screens and panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; printed circuit boards and electronic components in the form of injection-molded plastic components; panels bearing printed circuit boards and electronic components. Assembly services; assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components. Education; Providing of training; Educational and teaching services; Provision of training courses; Arranging and conducting of classes; Arranging of workshops and seminars; Personnel training; Know-how transfer [training]; Advisory services relating to education. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; hosting services and software as a service and rental of software; providing on a software as a service basis a software tool for producing products and for managing the production process of products; software maintenance and upkeep.

Abstract

A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.

IPC Classes  ?

• B32B 1/00 - Layered products having a non-planar shape
• B32B 3/00 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form
• B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof
• B29C 45/16 - Making multilayered or multicoloured articles

Abstract

A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

A method of manufacture of a structure includes obtaining or producing a functional electronics assembly including at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substrate film, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material to at least partly embed the at least one electronics component into the first material. The first substrate film is adapted to include a recess defining a volume, and the at least one electronics component is arranged at least partly in the volume.

IPC Classes  ?

• H05K 1/00 - Printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• H01L 21/12 - Application of an electrode to the exposed surface of the selenium or tellurium after the selenium or tellurium has been applied to the foundation plate
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
• H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
• H01L 23/498 - Leads on insulating substrates
• H05K 5/03 - Covers
• H05K 5/06 - Hermetically-sealed casings
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29K 101/12 - Thermoplastic materials
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

A multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics on at least first side thereof, a number of light sources on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, a plastic lightguide layer molded onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent material, and a masking layer provided on the outer surface of the plastic lightguide layer, wherein the masking layer defines a window for letting light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.

IPC Classes  ?

• G02B 6/00 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings
• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 5/06 - Hermetically-sealed casings

Abstract

An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 5/06 - Hermetically-sealed casings
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

Electrical node (100, 100b, 100c, 200, 200b, 200c, 300, 400, 502, 602, 702, 802, 1404, 404B, 1502, 1504), comprising a substrate (20, 60) for accommodating at least one functional element, preferably an essentially electrical element (12, 14), said substrate having a first side and an opposite second side, said substrate further hosting a number of connecting elements (16, 31) for electrically or electromagnetically, such as inductively, capacitively or optically, connecting the at least one functional element with a circuit of an external structure; the at least one functional element optionally comprising at least one electronic component and further optionally a number of conductive traces connecting thereto, provided to the substrate and optionally projecting from the first side of the substrate; and a first material layer (30) defining a protective covering (10) at least upon said at least one functional element, said first material layer optionally defining at least portion of the exterior surface of the node; wherein the first material layer comprises elastic material arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto, preferably between the connecting elements and at least one element of the external structure, such as a material layer (90) molded, cast or otherwise produced or provided on the node. A related multilayer structure and method of manufacture are presented.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

Integrated multilayer structure (100, 200, 300, 400, 600, 700), comprising a substrate film (102) having a first side and an opposing second side; electronics comprising at least one light source (110), optionally a LED, provided upon the first side of the substrate film and a number of electrical conductors (112), preferably printed by printed electronics technology, at least electrically coupled to the at least one light source (110), the at least one light source (110) being configured to emit light in selected one or more frequencies or wavelengths, optionally including visible light; an optically transmissive element (104) comprising thermoplastic optically transmissive, having regard to the selected frequencies or wavelengths, material having a first refractive index and produced, preferably through utilization of molding from said optically transmissive thermoplastic material, onto the first side of the substrate film (102) so as to at least partially embed the at least one light source (110) therewithin; and optical cladding (106, 106a, 106b) comprising material having a lower refractive index than the first refractive index and provided adjacent the optically transmissive element upon the first side of the substrate film (102), wherein the at least one light source, the optically transmissive element and the optical cladding have been mutually configured (702, 704) so as to convey light emitted by the light source (110) within the optically transmissive material of the optically transmissive element, at least portion of the conveyed light undergoing a substantially total internal reflection when incident upon the optical cladding. Related method of manufacture is presented

IPC Classes  ?

• G02B 6/00 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings

Abstract

A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• F21V 3/00 - GlobesBowlsCover glasses
• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/46 - Manufacturing multi-layer circuits
• F21Y 115/10 - Light-emitting diodes [LED]
• F21Y 115/15 - Organic light-emitting diodes [OLED]

Abstract

LED) that is being passed through the target component and said voltage is adaptable to a varying resistance of the arrangement and its features.

IPC Classes  ?

• H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
• G05F 1/67 - Regulating electric power to the maximum power available from a generator, e.g. from solar cell
• H02J 1/10 - Parallel operation of dc sources
• H02M 7/217 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
• H02J 9/06 - Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over
• G05F 1/445 - Regulating voltage or current wherein the variable is actually regulated by the final control device is AC using discharge tubes or semiconductor devices as final control devices semiconductor devices only being transistors in series with the load
• H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
• H02J 3/38 - Arrangements for parallelly feeding a single network by two or more generators, converters or transformers
• H05B 45/10 - Controlling the intensity of the light
• H05B 45/395 - Linear regulators

Abstract

An electrical node (100), a method, an electrical assembly such as a node strip or sheet, a related multilayer structure and a method of manufacture are presented. The electrical node comprises a first substrate film (10) defining a cavity, and a first material layer (30) arranged to at l east partly fill the cavity, and to embed or at l east partly cover at l east one electrical element (12) arranged into the cavity.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

Abstract

Integrated multilayer structure suitable for use in sensing applications is presented. The multilayer structure comprises at least one plastic layer (104), at least one film (102, 102B) layer provided on both sides of the plastic layer, said film layer (102) on a first side of the plastic layer comprising electronics (103, 110, 112, 114, 116, 305, 404, 405, 505, 06, 508, 510, 606, 606B, 608, 706, 708, 1010, 1012) incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. Said sensing electronics comprise an electrode and a connection element for connecting the electrode to a control circuitry, and said film layer (102B) on a second side of the plastic layer comprising features (105, 118, 120, 124, 126, 128, 306, 408, 512, 606C, 608C, 710, 810, 1002) including one conductive feature, said features being configured to adapt the sensing response of the sensing electronics on the first side of the plastic layer.

IPC Classes  ?

• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Abstract

Method (300) for manufacturing an integrated multilayer structure, comprising: obtaining (304) a substrate film of selected material and having a first and second side, said substrate film optionally being flexible and/or comprising plastic and/or composite material; providing (308, 310, 312) at least on the first side of the substrate film one or more first functional features, optionally including decorative, informative, other optical, protective, electrical and/or electronic features such as conductors and/or electronic components; arranging (316) at least one layer, preferably at least partially comprising electrically substantially insulating and/or conductive material, optionally plastic material, upon at least the first side of the substrate film; removing (318), optionally selectively and locally, at least a portion of the substrate film so that space (206), optionally comprising a through-hole in the substrate film, is released in the structure, wherein a detachment-enhancing feature provided to the substrate film, is configured to facilitate the removal of said at least portion such that the adjacent remaining film material, if any, the arranged layer and the first functional features are preserved and preferably remain substantially intact; and providing (320) at least one second functional feature into the space released for use so that the at least one second functional feature least functionally, preferably optically, electrically and/or electromagnetically, connects with at least one of said one or more first functional features.

IPC Classes  ?

• B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
• B32B 7/06 - Interconnection of layers permitting easy separation
• H05K 1/00 - Printed circuits

Abstract

Interface arrangement (1300, 1400, 1500, 1600, 2000), optionally consisting of or comprising an essentially electrical, or specifically, electronic node type component, for providing electrical or electromagnetic connection between an external system (46, 200) and a host structure (300) of the interface arrangement, the interface arrangement comprising a first substrate film (10) defining a cavity; a first material layer (30) arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element (12) at least partly arranged into the cavity, wherein the at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between said external system and electronics of the host structure; and a first connection element (45), preferably arranged at least partly into the cavity, and configured for connecting to the external system (46), wherein the first connection element is further at least functionally connected to the converter element. Related multilayer structure and method of manufacture are presented.

IPC Classes  ?

• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/02 - Printed circuits Details
• H01R 13/6591 - Specific features or arrangements of connection of shield to conductive members
• H05K 1/14 - Structural association of two or more printed circuits
• H01R 12/52 - Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
• H01R 12/71 - Coupling devices for rigid printing circuits or like structures

Abstract

An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure comprises at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics comprises at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of said plastic layer having a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of said plastic layer and the sensing element being locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.

IPC Classes  ?

• H03K 17/96 - Touch switches

Abstract

A method for manufacturing an integrated multilayer structure includes obtaining a substrate film having first and second sides, providing at least on the first side one or more first functional features, arranging at least one layer upon at least the first side; removing, at least a portion of the substrate film so that space is released in the structure wherein a detachment-enhancing feature provided to the substrate film is configured to facilitate the removal of the at least a portion of the substrate film such that the adjacent remaining film material, if any, the arranged layer and the one or more first functional features are preserved and preferably remain substantially intact; and providing at least one second functional feature into the space released for use so that the at least one second functional feature operatively connects with at least one of the one or more first functional features.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
• H01L 23/498 - Leads on insulating substrates
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H01R 13/405 - Securing in non-demountable manner, e.g. moulding, riveting
• H05K 1/02 - Printed circuits Details

Abstract

A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.

IPC Classes  ?

• G06F 3/045 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
• B29C 45/16 - Making multilayered or multicoloured articles
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.

IPC Classes  ?

• G06F 3/045 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
• B29C 45/16 - Making multilayered or multicoloured articles
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.

IPC Classes  ?

• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B29C 45/16 - Making multilayered or multicoloured articles
• G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
• H01F 27/28 - CoilsWindingsConductive connections
• H01F 38/14 - Inductive couplings
• H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof
• H01Q 9/04 - Resonant antennas
• B29B 11/06 - Making preforms by moulding the material
• B29K 705/00 - Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts

Abstract

Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.

IPC Classes  ?

• G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

Abstract

Integrated multilayer structure (100), comprising a substrate film (102) having a first side (102A) and an opposite second side (102B), said substrate film comprising electrically substantially insulating material, a circuit design comprising a number of electrically conductive areas (106) of electrically conductive material on said first and/or second sides of the substrate film, a connector (110) comprising a number of electrically conductive contact elements (118), said connector being provided to the substrate film so that it extends to both said first and second sides of said substrate film and said number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element (112) responsive to mating the external connecting element with the connector on said first or second side of or adjacent to the substrate film, and at least one plastic layer (104, 105), preferably of thermoplastic material, molded onto said first and/or second side of the substrate film so as to at least partially cover the connector and enhance securing of the connector to the substrate film. Corresponding method of manufacture is presented.

IPC Classes  ?

• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

IPC Classes  ?

• H05K 5/00 - Casings, cabinets or drawers for electric apparatus
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

supplyoutoutR.LEDLEDLED) that is being passed through the target component.

IPC Classes  ?

• H05B 33/08 - Circuit arrangements for operating electroluminescent light sources

Abstract

LED) that is being passed through the target component.

IPC Classes  ?

• H02M 3/156 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
• G05F 1/67 - Regulating electric power to the maximum power available from a generator, e.g. from solar cell
• H02J 1/10 - Parallel operation of dc sources
• H02M 7/217 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
• H02J 9/06 - Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over
• G05F 1/445 - Regulating voltage or current wherein the variable is actually regulated by the final control device is AC using discharge tubes or semiconductor devices as final control devices semiconductor devices only being transistors in series with the load
• H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
• H02J 3/38 - Arrangements for parallelly feeding a single network by two or more generators, converters or transformers
• H05B 33/08 - Circuit arrangements for operating electroluminescent light sources

Abstract

An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

IPC Classes  ?

• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
• B29C 45/16 - Making multilayered or multicoloured articles
• B29C 39/12 - Making multilayered or multicoloured articles
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/03 - Use of materials for the substrate
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/36 - Assembling printed circuits with other printed circuits
• G06F 3/0488 - Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• G06F 3/0354 - Pointing devices displaced or positioned by the userAccessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
• G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

An integrated multilayer structure including a substrate film having a first side and an opposing second side; electronics including at least one light source, provided upon the first side and a number of electrical conductors, at least electrically coupled to the at least one light source which is configured to emit light in selected one or more frequencies or wavelengths; an optically transmissive element including thermoplastic optically transmissive material having a first refractive index and produced onto the first side of the substrate film so as to at least partially embed the at least one light source therewithin; and optical cladding including material having a lower refractive index than the first refractive index and provided adjacent the optically transmissive element upon the first side of the substrate film.

IPC Classes  ?

• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• H05K 1/02 - Printed circuits Details
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

An electrical node including a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity, wherein the first material layer includes elastic material to reduce thermal expansion related stresses between elements adjacent thereto.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Goods & Services

Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering wire. Machine tools; power tools; laundry washing machines; dishwashers; kitchen machines, electric; mixers [kitchen machines]; electric kitchen appliances for chopping, mixing, pressing; machines for the preparation of foodstuffs [electric, kitchen], other than for cooking; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor; agricultural, gardening and forestry machines and apparatus and parts therefor. Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; circuit boards and electronic components including ink and adhesive for conducting electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; remote control apparatus; recorded and downloadable computer software; control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for electric equipment and computers; covers for tablets and smartphones; touch screens and panels; display screens and panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; printed circuit boards and electronic components in the form of injection-molded plastic components; panels bearing printed circuit boards and electronic components. Medical apparatus and instruments and parts and fittings therefor; electronic monitoring instruments for medical use, namely, fetal pulse and vital sign monitors; clothing for medical use; patient monitoring sensors and alarms; apparatus for monitoring vital signs; pulse meters. Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings therefor; lighting panels, light-emitting diodes (LED) lighting apparatus, lighting apparatus for vehicles and parts and fittings therefor; food and beverage cooking, heating, cooling and treatment equipment; freezers; refrigerators; beverage coolers; kitchen stoves and hot plates; kitchen ovens; kitchen machines (gas -) for cooking; coffee machines; electric kettles. Land vehicles and conveyances; air vehicles; water vehicles; parts and fittings for land, air and water vehicles; dashboards; upholstery for land, air and water vehicles; covers for vehicle steering wheels; doors and bumpers for land, air and water vehicles; bodywork parts for land, air and water vehicles; body panels for land, air and water vehicles; interior and exterior panels for land, air and water vehicles; door panels and roof panels for land, air and water vehicles; car seats and parts and fittings therefor. Precious metals; precious metal alloys. Insulation and barrier articles and materials; insulating panels; acoustic panels for buildings; plastic materials in the form of panels [semi-finished products]; semi-worked plastic substances; polymeric membranes for insulation; electrical insulation articles and materials; carbon fibre for insulation; fabrics of organic fibres for use as insulation. Veneers; non-metallic cladding panels; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal. Fabrics; textiles and substitutes for textiles; household textiles; polyester textiles; polymer coated fabrics; fabrics of organic fibres, other than for insulation. Clothing; headgear; footwear; sports clothing; sports shoes; wristbands. Sporting articles and equipment and parts and fittings therefor; covers for sporting articles and equipment; toys, games, playthings and parts and fittings therefor; covers for toys, games, playthings; sports training apparatus; footballs; golf clubs; protective paddings (parts of sports suits). Custom manufacture and assembly services; manufacture and assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings therefor; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture of molded components. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; hosting services and software as a service and rental of software; providing on a software as a service basis a software tool for producing products and for managing the production process of products; software maintenance and upkeep.

Abstract

Interface arrangement comprising an electrical node type component for providing electrical or electromagnetic connection between an external system and a host structure of the interface arrangement. The interface arrangement comprising a first substrate film defining a cavity. A first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element at least partly arranged into the cavity. The at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between the external system and electronics of the host structure. A first connection element arranged at least partly into the cavity and configured for connecting to the external system. The first connection element is further at least functionally connected to the converter element. Related multilayer structures and methods of manufacture are presented.

IPC Classes  ?

• H05K 5/00 - Casings, cabinets or drawers for electric apparatus
• H05K 7/00 - Constructional details common to different types of electric apparatus
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H01R 12/71 - Coupling devices for rigid printing circuits or like structures
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

IPC Classes  ?

• F21S 10/00 - Lighting devices or systems producing a varying lighting effect
• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/02 - Printed circuits Details
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• F21V 3/00 - GlobesBowlsCover glasses
• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/46 - Manufacturing multi-layer circuits
• F21Y 115/10 - Light-emitting diodes [LED]
• F21Y 115/15 - Organic light-emitting diodes [OLED]

Abstract

Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro- optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.

IPC Classes  ?

• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details

Abstract

Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A method for manufacturing a multilayer structure includes obtaining a first substrate film for accommodating electronics, providing circuitry on at least the second side of the first substrate film, forming the first substrate film to at least locally or more widely exhibit a selected non-planar three-dimensional shape subsequent to providing at least a portion of the circuitry on the at least the second side of the first substrate film, and melding plastic material on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film.

IPC Classes  ?

• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/02 - Printed circuits Details
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

Multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics, said film having the first side and a second side, at least one area light source and configured to emit light of predetermined frequency or frequency band, a molded lightguide layer, the lightguide layer being of optically at least translucent material, wherein the lightguide layer is configured to transmit light emitted by the embedded light source so that the transmitted light propagates within the lightguide layer and is outcoupled therefrom via an outer surface thereof substantially opposite to the embedded light source, and a masking layer provided on the outer surface of the plastic lightguide layer, containing substantially opaque material to block external view of at least some internals of the multilayer structure, wherein the masking layer defines a window for letting the light emitted by the embedded light source and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.

IPC Classes  ?

• F21V 21/00 - Supporting, suspending, or attaching arrangements for lighting devicesHand grips
• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

IPC Classes  ?

• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
• B29C 45/14 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• H05K 1/03 - Use of materials for the substrate
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/36 - Assembling printed circuits with other printed circuits
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof

Abstract

An electrical node, a method, an electrical assembly such as a node strip or sheet, a related multilayer structure, and a method of manufacture are presented. The electrical node comprises a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element arranged into the cavity.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits