An integrated optically functional multilayer structure including a flexible, substrate film arranged with a circuit design including electrical conductors on a first side of the substrate film; at least one light source provided upon the first side of the substrate film and connected to the circuit design the at least one light source internally illuminates at least a portion of the structure for external perception; and an optically transmissive layer-produced upon the first side of the substrate film and the at least one light source said optically transmissive layer at least partially covering the substrate film and embedding the at least one light source; wherein the substrate film defines holes therethrough and upon one or more of them the optically transmissive layer defines an outcoupling surface, configured to redirect and reflect, incident light emitted by light sources of the at least one light source.
An integrated optically functional multilayer structure (100, 500), comprising a flexible, optionally 3D-formable and further optionally thermoplastic, substrate film (102) arranged with a circuit design (106) comprising at least a number of electrical conductors on a first side of the substrate film (102); at least one light source (104) provided upon the first side of the substrate film (102) and connected to the circuit design (106), said at least one light source (104) being configured to internally illuminate at least a portion of the structure for external perception; and an optically transmissive layer (108), optionally of plastic or thermoplastic material such as polycarbonate, thermoset, silicone, epoxy, or other material, produced upon the first side of the substrate film (102) and the at least one light source (104), said optically transmissive layer (108) at least partially covering the substrate film (102) and embedding the at least one light source (104); wherein at least one of the substrate film (102) or the optically transmissive layer defines an outcoupling surface, preferably tilted (101) away from a surface plane or direction of the adjacent areas of the substrate film (102), configured to redirect and reflect, preferably by TIR (total internal reflection), incident light emitted by one or more light sources of the at least one light source (104). Related method of manufacture is presented.
An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design including at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
4.
Interface assembly and method for manufacturing interface assembly
An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.
B29C 51/14 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet de préformes ou de feuilles multicouches
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/14 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur
H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance
B29L 31/34 - Appareils électriques, p. ex. bougies ou leurs parties constitutives
5.
Optically functional multilayer structure and related method of manufacture
An integrated optically functional multilayer structure including a flexible, substrate film arranged with a circuit design including electrical conductors on a first side of the substrate film; at least one light source provided upon the first side of the substrate film and connected to the circuit design the at least one light source internally illuminates at least a portion of the structure for external perception; and an optically transmissive layer produced upon the first side of the substrate film and the at least one light source said optically transmissive layer at least partially covering the substrate film and embedding the at least one light source; wherein the substrate film defines holes therethrough and upon one or more of them the optically transmissive layer defines an outcoupling surface, configured to redirect and reflect, incident light emitted by light sources of the at least one light source.
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
An interface assembly includes a functional multilayer structure that includes a first substrate a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.
B29C 51/14 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet de préformes ou de feuilles multicouches
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/14 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur
H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance
B29L 31/34 - Appareils électriques, p. ex. bougies ou leurs parties constitutives
7.
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
An interface assembly (100 is disclosed herein which comprises a functional multilayer structure (20) that comprise a first substrate (22, 28), a molded material layer (26) on a first side of the first substrate (22, 28), and a sensor arrangement (30) comprising at least one sensor (32; 32A, 32B), wherein the sensor arrangement (30) is arranged at least partly embedded into the molded material layer (26). The assembly (100) further comprises a movable member (40) being movable relative to the functional multilayer structure (20), wherein the movable member (40) comprises at least one detection portion (42), and the sensor arrangement (30) and the at least one detection portion (42) are mutually arranged so that a position or a change of position of the movable member (40) is detectable by the sensor arrangement (30) based on a position or a change of position of the at least one detection portion (42) relative to the sensor arrangement (30). Also, a method for manufacturing an interface assembly (100) is disclosed.
An electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The electronics assembly further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
9.
Interface assembly and method for manufacturing interface assembly
An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.
B29C 51/14 - Façonnage par thermoformage, p. ex. façonnage de feuilles dans des moules en deux parties ou par emboutissage profondAppareils à cet effet de préformes ou de feuilles multicouches
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/14 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur
H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance
B29L 31/34 - Appareils électriques, p. ex. bougies ou leurs parties constitutives
10.
ILLUMINATION DEVICE FOR AN EXTERIOR COMPONENT OF A VEHICLE, WHEREIN THE EXTERIOR COMPONENT CAN BE AT LEAST PARTIALLY ILLUMINATED BY THE ILLUMINATION DEVICE, AND EXTERIOR COMPONENT
The invention relates to an illumination device (3) for an exterior component (2) of a vehicle (1), wherein the exterior component (2) can be at least partially illuminated by the illumination device (3), comprising a carrier unit (4) which has at least one opening (5) for receiving at least one lighting element (6) of the illumination device (3), wherein the at least one lighting element (6) is designed to emit light into a region (7) surrounding the illumination device (3), the at least one lighting element (6) has a reflector element (8) and the reflector element (8) has a reflector cover (9), the at least one opening (5) is covered by the reflector cover (9) and the reflector cover (9) forms a partial surface region (12) of a surface (13) of the carrier unit (4), characterised in that the partial surface region (12) has a coating that is permeable to light and in that a surface region (15) of the surface (13) of the carrier unit (4), which is different from the partial surface region (12), has a coating that is impermeable to light. The invention further relates to an exterior component (2).
F21S 43/50 - Dispositifs de signalisation spécialement adaptés à l’extérieur des véhicules, p. ex. feux de freinage, feux clignotants indicateurs de direction ou feux de recul caractérisés par des composants esthétiques non prévus ailleurs, p. ex. des enjoliveurs, des parois de séparation ou des couvercles
F21S 43/20 - Dispositifs de signalisation spécialement adaptés à l’extérieur des véhicules, p. ex. feux de freinage, feux clignotants indicateurs de direction ou feux de recul caractérisés par des réfracteurs, des glaces de fermeture transparentes, des guides ou des filtres de lumière
B60R 19/52 - Protections du radiateur ou de la calandre
B60R 13/00 - Éléments pour habiller la carrosserie, l'identifier ou la décorerAménagements ou adaptations pour la publicité
B60Q 1/28 - Agencement des dispositifs de signalisation optique ou d'éclairage, leur montage, leur support ou les circuits à cet effet les dispositifs ayant principalement pour objet d'indiquer le contour du véhicule ou de certaines de ses parties, ou pour engendrer des signaux au bénéfice d'autres véhicules pour indiquer l'avant du véhicule
B60Q 1/32 - Agencement des dispositifs de signalisation optique ou d'éclairage, leur montage, leur support ou les circuits à cet effet les dispositifs ayant principalement pour objet d'indiquer le contour du véhicule ou de certaines de ses parties, ou pour engendrer des signaux au bénéfice d'autres véhicules pour indiquer les côtés du véhicule
B60Q 1/30 - Agencement des dispositifs de signalisation optique ou d'éclairage, leur montage, leur support ou les circuits à cet effet les dispositifs ayant principalement pour objet d'indiquer le contour du véhicule ou de certaines de ses parties, ou pour engendrer des signaux au bénéfice d'autres véhicules pour indiquer l'arrière du véhicule, p. ex. au moyen de surfaces réfléchissantes
F21W 104/00 - Dispositifs d’éclairage à l’extérieur des véhicules à des fins de décoration
11.
Optically functional multilayer structure and related method of manufacture
An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 33/46 - Revêtement réfléchissant, p.ex. réflecteur de Bragg en diélectriques
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
12.
OPTICALLY FUNCTIONAL MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE
An integrated optically functional multilayer structure (100, 200, 300, 400, 500, 600, 700, 800, 900, 1100, 1300, 1400, 1500), comprising: a flexible, optionally 3D-formable and thermoplastic, substrate film (102, 102a) arranged with a circuit design (106) comprising at least a number of electrical conductors preferably additively printed on the substrate film; a light source (104) provided upon a first side of the substrate film to internally illuminate (104a, 104b) at least portion of the structure for external perception (113); an optically transmissive plastic layer (108), optionally of thermoplastic material, provided upon the first side of the substrate film, said plastic layer at least laterally surrounding or neighboring, optionally also at least partially covering, the light source (104), the substrate film optionally comprising material or material layer same as that of the plastic layer or at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer (110), said reflector design being configured to reflect, optionally dominantly specularly, the light emitted by the light source and incident upon the reflector design optionally towards the plastic layer. Related method of manufacture is presented.
F21S 2/00 - Systèmes de dispositifs d'éclairage non prévus dans les groupes principaux ou , p. ex. à construction modulaire
G02B 6/00 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage
An integrated optically functional multilayer structure (100, 200, 300, 400, 500, 600, 700, 800, 900, 1100, 1300, 1400, 1500) suitable for large area dynamic illumination, comprising a flexible, optionally 3D-formable and thermoplastic, substrate film (102, 102a) arranged with a circuit design (106) comprising at least a number of electrical conductors preferably additively printed on the substrate film; and a plurality of top-emitting (104a), bottom- installed light sources (104) provided upon a first side of the substrate film to internally illuminate (104a) at least portion of the structure for external perception via associated outcoupling areas (112, 112a, 112b, 112c), wherein for each light source of the plurality of light sources there is, optionally at least partially shared, optically transmissive plastic layer (108), optionally of thermoplastic material, provided upon the first side of the substrate film, said plastic layer at least laterally surrounding or neighboring, optionally also at least partially covering, the light source, the substrate film optionally comprising material or material layer same as that of the plastic layer or at least having a similar or lower refractive index therewith; and reflector design comprising at least one material layer (110), provided at least upon (110b; 110c) the light source and configured to reflect, optionally dominantly specularly, the light emitted by the light source and incident upon the reflective layer towards the plastic layer. Related method of manufacture is presented.
An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.
An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
18.
Optically functional multilayer structure and related method of manufacture
An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
19.
INTEGRATED OPTICALLY FUNCTIONAL MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE
Integrated functional multilayer structure (100, 200, 300, 350, 500, 600, 700, 800, 900, 1000), comprising a flexible, preferably 3D-formable and thermoplastic, substrate film (102), circuitry (104, 105, 106) provided upon the substrate film, said circuitry comprising a first light source (104) containing at least one light-emission unit, optionally LED, and a monolithic lightguide layer (108) molded upon the substrate film so as to cover and optically couple to the first light source (104), the lightguide layer (108) comprising optically attenuating, translucent material, wherein the lightguide layer (108) comprises a first surface (108A) and an opposite second surface (108B), the second surface (108B) facing the first light source (104) and a portion of the first surface (108A) containing, within a first distance (H) from the first light source (104), a pre-defined outcoupling area (112) for the light emitted by the first light source (104) and transmitted within the lightguide layer (108), said lightguide layer (108) further containing a light leakage prohibition region (114) non-overlapping with the outcoupling area (112) and separated from the first light source (104) by at least a second, preferably greater, distance (D), and the attenuation of emitted light effectuated on a direct optical path between the first light source (104) and the outcoupling area (112) is less than the attenuation effectuating on a shortest, optionally also direct, optical path between the first light source (104) and the light leakage prohibition region (114), and further wherein the optical transmittance of the translucent material of the lightguide layer is between about 25% and about 80% at selected wavelengths of about 2 mm thick sample of the translucent material while the associated half power angle is between about 5 and about 70 degrees. Related method of manufacture is presented.
A multilayer structure comprising a substrate film and a number of functional components and/or integrated circuits, comprising at least one first conductive element, at least one second conductive element, and at least one subsidiary conductive element, optionally traces, provided upon the substrate film. The substrate film has been provided with at least one coupling location enhancement element at a coupling location with respect to the substrate film, wherein at said coupling location the coupling location enhancement element is configured to provide an electrical connection between the first conductive element and second conductive element, further wherein said coupling location enhancement element is configured to inhibit coupling between the first conductive element and the subsidiary conductive element at the coupling location and between the second conductive element and the subsidiary conductive element at the coupling location.
H05K 3/22 - Traitement secondaire des circuits imprimés
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/28 - Application de revêtements de protection non métalliques
21.
Method for manufacturing electronics assembly and electronics assembly
A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance
22.
Method for manufacturing a number of electrical nodes, electrical node module, electrical node, and multilayer structure
The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.
H01L 23/24 - Matériaux de remplissage caractérisés par le matériau ou par ses propriétes physiques ou chimiques, ou par sa disposition à l'intérieur du dispositif complet solide ou à l'état de gel, à la température normale de fonctionnement du dispositif
H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p. ex. dissipateurs de chaleur
H01L 23/58 - Dispositions électriques structurelles non prévues ailleurs pour dispositifs semi-conducteurs
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/28 - Application de revêtements de protection non métalliques
23.
METHOD FOR MANUFACTURING A NUMBER OF ELECTRICAL NODES, ELECTRICAL NODE MODULE, ELECTRICAL NODE, AND MULTILAYER STRUCTURE
A method for manufacturing a number of electrical nodes (10), wherein the method comprises providing (410) a number of electronic circuits onto a first substrate (11), such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits comprises a circuit pattern (14) and at least one electronics component (12) in connection with the circuit pattern (14), wherein the electronic circuits are spaced from each other on the first substrate (11), thereby defining a blank area (30) surrounding each one of the number of electronic circuits, respectively, and providing (420) potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening (430), optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes (10).
A method for manufacturing an electronics assembly (100), comprising obtaining or producing (210) an electronics module (10), wherein the electronics module (10) comprises a first circuitry (12) on a first surface at a first side of a circuit board (11), at least one electronics component (12) on the circuit board (11) and in electrical connection with the first circuitry (13), and at least one first connection portion (14) on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board (11), wherein the at least one first connection portion (14) is electrically connected to or is comprised in the first circuitry (12). The method also comprises arranging (220) the electronics module (10) on a second substrate (21), such as on a thermoformable film or sheet, preferably of plastic material, comprising a second connection portion (22) connected to a second circuitry (23) on a surface of the second substrate (21), wherein a second surface of the circuit board (11), being on the opposite second side than the first surface, faces the second substrate (21), and arranging (230) electrically conductive joint material (16) onto the first (14) and the second connection portions (22) to extend between them for electrically connecting the electronics module (10) to the second circuitry (23) via the electrically conductive joint material (16).
Integrated functional multilayer structure (100, 300, 500, 600, 700, 800, 900, 1000, 1100, 1300, 1400, 1500), comprising a flexible, preferably 3D-formable and thermoplastic, substrate film (102); a lighting module (110, 400) provided upon the substrate film (102) and preferably electrically connected to the circuit design thereon, said lighting module comprising: a circuit board (112) for hosting electronics; and circuitry (114) arranged on the circuit board comprising at least one light source, optionally comprising at least one LED; a thermoplastic layer (108) comprising one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module (110, 400); wherein the circuitry (114) on the circuit board (112) of the lighting module (110, 400) including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material (116A, 116B) positioned in between, preferably at least at the periphery of the circuit board (112). Related method of manufacture is presented.
The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/44 - Fabrication des électrodes sur les corps semi-conducteurs par emploi de procédés ou d'appareils non couverts par les groupes
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/04 - ConteneursScellements caractérisés par la forme
H01L 23/28 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
H01L 23/49 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes formées de structures soudées du type fils de connexion
H01L 23/52 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre
H01L 23/488 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes formées de structures soudées
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/552 - Protection contre les radiations, p. ex. la lumière
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
27.
Optically functionally multilayer structure suitable for large area illumination and related method of manufacture
An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source; the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
19 - Matériaux de construction non métalliques
21 - Ustensiles, récipients, matériaux pour le ménage; verre; porcelaine; faience
24 - Tissus et produits textiles
25 - Vêtements; chaussures; chapellerie
28 - Jeux, jouets, articles de sport
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Common metals; common metal alloys; metallic cladding
panels; metallic wall panels; building panels of metal; door
panels of metal; doors of metal; welding and soldering
materials, namely, rods of metal for welding, soldering wire
of metal, spelters for welding and soldering. Machine tools; power tools; laundry washing machines;
dishwashers; kitchen machines, electric; mixers [kitchen
machines]; electric kitchen appliances for chopping, mixing,
pressing; machines for the preparation of foodstuffs
[electric, kitchen], other than for cooking; elevators and
parts therefor; agricultural, earthmoving, construction, oil
and gas extraction and mining equipment and parts therefor;
agricultural, gardening and forestry machines and apparatus
and parts therefor. Scientific, optical, weighing, measuring, signalling, and
checking (supervision) apparatus and instruments; apparatus
and instruments for conducting, switching, transforming,
accumulating, regulating or controlling electricity;
apparatus for recording, transmission or reproduction of
sound or images; data processing equipment, computers;
headsets; computer peripherals; remote control apparatus;
recorded and downloadable computer software; electronic
control boards and panels; sensors and detectors; antennas;
electrical circuits and circuit boards; microprocessors;
cases and housings for computers and for electric equipment
being electric components; covers for tablets and
smartphones; touch screens and panels; display screens and
display panels; wearable computers, sensors and detectors,
touch screens and panels, display screens and display
panels, and activity trackers; electronic monitoring
instruments, not for medical use; wearable electronic
equipment that transmit physiological or location data via
computer networks, not for medical use; electronically
encoded identity wristbands; printed circuit boards bearing
electronic components; injection-molded plastic components
bearing printed circuit boards and electronic components;
panels bearing printed circuit boards and electronic
components. Medical apparatus and instruments and parts and fittings for
the same; electronic monitoring instruments for medical use;
clothing for medical use; patient monitoring sensors and
alarms; apparatus for monitoring vital signs; pulse meters. Apparatus for lighting, heating, refrigerating, drying,
ventilating, water supply and sanitary purposes and parts
and fittings for the same; lighting panels, light-emitting
diodes (LED) lighting apparatus, lighting apparatus for
vehicles and parts and fittings for the same; food and
beverage cooking, heating, cooling and preservation
equipment; freezers; refrigerators; kitchen stoves and hot
plates; kitchen ovens; kitchen machines (gas -) for cooking;
coffee machines; electric kettles. Land vehicles and conveyances; air vehicles; water vehicles;
rail vehicles including trams and trains; parts and fittings
for land, air, water and rail vehicles; dashboards;
upholstery for land, air, water and rail vehicles; covers
for vehicle steering wheels; doors and bumpers for land,
air, water and rail vehicles; bodywork parts for land, air,
water and rail vehicles; body panels for land, air, water
and rail vehicles; interior and exterior panels for land,
air, water and rail vehicles; door panels and roof panels
for land, air, water and rail vehicles; vehicle seats and
parts and fittings therefor. Precious metals; precious metal alloys. Insulation and barrier articles and materials; insulating
panels; acoustic insulating panels for buildings; plastic
materials in the form of panels [semi-finished products];
semi-worked plastic substances; polymeric membranes;
electrical insulation articles and materials; carbon fibres,
other than for textile use; fabrics of organic fibres for
use as insulation. Veneers; non-metallic cladding panels; non-metallic wall
panels; building panels, not of metal; door panels, not of
metal; doors, not of metal; acoustic panels for buildings,
not of metal. Beverage coolers [containers]. Fabrics; textiles and substitutes for textiles; household
textiles; polyester textiles; polymer coated fabrics;
fabrics of organic fibres, other than for insulation. Clothing; headgear; footwear; sports clothing; sports shoes;
wristbands. Sporting articles and equipment and parts and fittings for
the same; covers for sporting articles and equipment; toys,
games, playthings and parts and fittings for the same;
covers for toys, games, playthings; sports training
apparatus; footballs; golf clubs; protective paddings (parts
of sports suits). Custom manufacture of electric and electronic components,
vehicle parts and fittings, electronic components for
medical devices, electronic components for sporting articles
and equipment, plastic panels, and plastic molded
components; custom assembly of products for others; custom
assembly of products and parts and fittings of products for
others; custom manufacture and assembly of vehicle bodies
and chassis and parts and fittings for the same; custom
manufacture and assembly of electronic components for
vehicles; custom manufacture and assembly of electronic
components for medical devices; custom manufacture and
assembly of electronic components for sporting articles and
equipment; custom manufacture and assembly of plastic
panels; custom manufacture and assembly of molded
components. Scientific and technological services and research and
design relating thereto; industrial analysis and research
services; design and development of computer hardware and
software; research and development of new products;
technological analysis services; technical measuring and
testing; server hosting, software as a service [SaaS], and
rental of software; software as a service featuring software
for producing products and for managing the production
process of products; software maintenance and upkeep.
29.
INTEGRAL 3D STRUCTURE FOR CREATING UI, RELATED DEVICE AND METHODS OF MANUFACTURE AND USE
Integrated functional multilayer structure (100, 200, 1100,1200) for building a gestural UI (user interface), comprising a flexible, 3D-formable substrate film (202) comprising a first surface (202a) for facing towards an environment of the structure and a user therein, and an opposite second surface(202b) facing towards the internals of the structure, where in the first (202a) and second (202b) surfaces and remaining material of the substrate film (202) in between locally define a three-dimensional protrusion (101) extending from a plane(2020) of surrounding substrate film material and formed from locally stretched and shaped material of the substrate film, said protrusion (101) preferably defining a continuous multi-sided knob (100, 200) or recess (1100, 1200) shape in the multilayer structure with a plurality of substantially vertical or canted, and optionally at least locally curved, side walls (104) perceptible by touch; circuitry (206) provided upon the substrate film and comprising a number of conductive traces, electrodes and/or components configured to detect touch on two or more of the plurality of side walls and preferably, a top (201) of the protrusion; and at least one fill layer (208) of preferably thermoplastic fill material arranged, optionally (injection) molded or cast, upon the substrate film to at least partially embed the circuitry and optionally also, volume defined by the protrusion shape and the plane. Related method of manufacture is presented.
G06F 3/0354 - Dispositifs de pointage déplacés ou positionnés par l'utilisateurLeurs accessoires avec détection des mouvements relatifs en deux dimensions [2D] entre le dispositif de pointage ou une partie agissante dudit dispositif, et un plan ou une surface, p. ex. souris 2D, boules traçantes, crayons ou palets
G06F 3/02 - Dispositions d'entrée utilisant des interrupteurs actionnés manuellement, p. ex. des claviers ou des cadrans
G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur
G06F 3/033 - Dispositifs de pointage déplacés ou positionnés par l'utilisateurLeurs accessoires
G06F 3/0362 - Dispositifs de pointage déplacés ou positionnés par l'utilisateurLeurs accessoires avec détection des translations ou des rotations unidimensionnelles [1D] d’une partie agissante du dispositif de pointage, p. ex. molettes de défilement, curseurs, boutons, rouleaux ou bandes
G06F 3/041 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
G06F 3/0488 - Techniques d’interaction fondées sur les interfaces utilisateur graphiques [GUI] utilisant des caractéristiques spécifiques fournies par le périphérique d’entrée, p. ex. des fonctions commandées par la rotation d’une souris à deux capteurs, ou par la nature du périphérique d’entrée, p. ex. des gestes en fonction de la pression exercée enregistrée par une tablette numérique utilisant un écran tactile ou une tablette numérique, p. ex. entrée de commandes par des tracés gestuels
B60K 35/00 - Instruments spécialement adaptés aux véhiculesAgencement d’instruments dans ou sur des véhicules
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H05K 3/28 - Application de revêtements de protection non métalliques
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
19 - Matériaux de construction non métalliques
21 - Ustensiles, récipients, matériaux pour le ménage; verre; porcelaine; faience
24 - Tissus et produits textiles
25 - Vêtements; chaussures; chapellerie
28 - Jeux, jouets, articles de sport
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
(1) Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials, namely, rods of metal for welding, soldering wire of metal, spelters for welding and soldering.
(2) Machine tools; power tools; laundry washing machines; dishwashers; kitchen machines, electric; mixers [kitchen machines]; electric kitchen appliances for chopping, mixing, pressing; machines for the preparation of foodstuffs [electric, kitchen], other than for cooking; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor; agricultural, gardening and forestry machines and apparatus and parts therefor.
(3) Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets; computer peripherals; remote control apparatus; recorded and downloadable computer software; electronic control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components; covers for tablets and smartphones; touch screens and panels; display screens and display panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components; panels bearing printed circuit boards and electronic components.
(4) Medical apparatus and instruments and parts and fittings for the same; electronic monitoring instruments for medical use; clothing for medical use; patient monitoring sensors and alarms; apparatus for monitoring vital signs; pulse meters.
(5) Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same; lighting panels, light-emitting diodes (LED) lighting apparatus, lighting apparatus for vehicles and parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment; freezers; refrigerators; kitchen stoves and hot plates; kitchen ovens; kitchen machines (gas -) for cooking; coffee machines; electric kettles.
(6) Land vehicles and conveyances; air vehicles; water vehicles; rail vehicles including trams and trains; parts and fittings for land, air, water and rail vehicles; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor.
(7) Precious metals; precious metal alloys.
(8) Insulation and barrier articles and materials; insulating panels; acoustic insulating panels for buildings; plastic materials in the form of panels [semi-finished products]; semi-worked plastic substances; polymeric membranes; electrical insulation articles and materials; carbon fibres, other than for textile use; fabrics of organic fibres for use as insulation.
(9) Veneers; non-metallic cladding panels; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal; acoustic panels for buildings, not of metal.
(10) Beverage coolers [containers].
(11) Fabrics; textiles and substitutes for textiles; household textiles; polyester textiles; polymer coated fabrics; fabrics of organic fibres, other than for insulation.
(12) Clothing; headgear; footwear; sports clothing; sports shoes; wristbands.
(13) Sporting articles and equipment and parts and fittings for the same; covers for sporting articles and equipment; toys, games, playthings and parts and fittings for the same; covers for toys, games, playthings; sports training apparatus; footballs; golf clubs; protective paddings (parts of sports suits). (1) Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly of products for others; custom assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components.
(2) Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; server hosting, software as a service [SaaS], and rental of software; software as a service featuring software for producing products and for managing the production process of products; software maintenance and upkeep.
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
19 - Matériaux de construction non métalliques
21 - Ustensiles, récipients, matériaux pour le ménage; verre; porcelaine; faience
24 - Tissus et produits textiles
25 - Vêtements; chaussures; chapellerie
28 - Jeux, jouets, articles de sport
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Common metals, unwrought or semi-wrought; common metal alloys; metallic cladding panels, namely, cladding of metal for building; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials, namely, rods of metal for welding, soldering wire of metal, spelters for welding and soldering in the nature of metal welding rods Machine tools, namely, drilling tools, boring tools, milling tools; power tools, namely, tile saws, thread mills, drill presses; laundry washing machines; dishwashers; kitchen machines, electric, namely, mixers and grinders; Kitchen mixers, electric; electric kitchen appliances for chopping, mixing, pressing, namely, electric food choppers, electric food mixers, electric food presses; machines for the preparation of foodstuffs, other than for cooking, namely, electric stand mixers; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor, namely agricultural seed planting machines, earthmoving machines, concrete construction machines and drills for the mining industry; agricultural, gardening and forestry machines and apparatus and parts therefor, namely, tilling machines for agricultural use, garden tilling machines, tree stump cutters Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly of products for others, namely, custom manufacturing of plastic injection-molded parts for others; custom assembly of products and parts and fittings of products for others, namely, custom manufacturing of plastic injection-molded parts for others; custom manufacture and assembly in the nature of custom manufacturing of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly in the nature of custom manufacturing of electronic components for vehicles; custom manufacture and assembly in the nature of custom manufacturing of electronic components for medical devices; custom manufacture and assembly in the nature of custom manufacturing of electronic components for sporting articles and equipment; custom manufacture and assembly in the nature of custom manufacturing of plastic panels; custom manufacture and assembly in the nature of custom manufacturing of molded components Scientific, optical, weighing, measuring, signalling, checking and supervision apparatus and instruments, namely, scales, measuring cups, injection molded electronic systems comprising electric sensors, electronic data relays for sensors, and recorded computer operating system software; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity, namely, electric conductors, electric switches, transformers, accumulators, voltage regulators, electrical controllers; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets, namely, headsets for telephones and headsets for remote communication; computer peripherals; remote control apparatus, namely, remote controls for computers and speakers; recorded and downloadable computer software for use in database management; electronic control boards and panels, namely, lighting panel control boards and electric control panels; sensors, not for medical use and detector units for use in controlling the actuation and operation of automotive safety apparatus and equipment; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components, namely, electric switch housings and electrical connector housings; covers for tablets and smartphones; touch screens and panels; Flat panel display screens and digital signage display panels; wearable computers, sensors and, touch screens and panels, display screens and display panels, and activity trackers, namely smartwatches, wearable electric or electronic sensors, namely wearable electronic proximity sensors with embedded contact tracing software for monitoring and alerting of social distances; electronic monitoring instruments, not for medical use, namely, electronic monitors for monitoring electric current and electrical signals, electronic devices in the nature of energy meters for tracking and monitoring energy usage; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use, namely, wearable activity trackers; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components, namely, housings for printed circuit boards and electronic components in the nature of electrical connectors and switches; panels bearing printed circuit boards and electronic components, namely, electric control panels Medical apparatus and instruments for use in cardiovascular procedures and structural parts and fittings for the same; electronic monitoring instruments for medical use, namely, fetal pulse and vital sign monitors; clothing for medical use, namely, surgical scrub suits; patient monitoring sensors and alarms; Medical apparatus for monitoring vital signs; pulse meters Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes, namely, lighting fixtures, water heaters, refrigerators, electric air dryers, ventilation hoods, water fountains, wash basins being parts of sanitary installations and structural parts and fittings for the same; lighting panels for vehicles, namely, land vehicles, air vehicles and rail vehicles, light-emitting diodes (LED) lighting apparatus, namely, LED lighting apparatus for vehicles, lighting apparatus for vehicles and structural parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment, namely, cooking ranges, hot water heating installations, beverage-cooling apparatus; freezers; refrigerators; kitchen stoves and hot plates; kitchen cooking ovens; gas kitchen machines for cooking, namely, gas stoves; Electric coffee machines; electric kettles Land vehicles and conveyances, namely, land vehicles; air vehicles, namely, airplanes; water vehicles, namely, boats; rail vehicles namely, trams and trains; structural parts and fittings for land, air, water and rail vehicles in the nature of land vehicles, airplanes, boats, trams, and trains; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles, namely, bodyworks for motor vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles in the nature of metal parts for vehicles, namely automotive exterior and interior metal decorative and protective trim; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor Precious metals; precious metal alloys Insulation and barrier articles and materials, namely, insulating materials; acoustic insulating panels; acoustic insulating panels for buildings; semi-processed plastic materials in the form of panels; semi-worked plastic substances in the nature of semi-processed plastics; polymeric membranes, namely, semi-processed polymers in pellet form for use as filling material for synthetic grounds; electrical insulation articles and materials, namely, insulators for electrical cables and electrical insulating tapes; carbon fibres, other than for textile use; fabrics of organic fibres for use as insulation Veneers, namely, veneers for floors, wood veneers and stone veneers; non-metallic cladding panels for building; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal; acoustic panels for buildings, not of metal, namely, non-metallic building panels incorporating acoustic insulation Non-electric portable beverage coolers Fabrics, namely, insulating fabrics; textiles and substitutes for textiles, namely, used as linings for clothes; household textiles, namely textile curtains; natural and synthetic fabrics and textiles, namely, polyester textiles; polymer coated fabrics, namely acrylic fabrics and woven fabrics; fabrics of organic fibres, other than for insulation, namely, cotton fabrics Clothing, namely, pants, shirts, tops, jackets and shorts; headwear; footwear; sports clothing, namely, sports shirts, sports pants, sports jackets; sports shoes; wristbands as clothing Sporting articles and equipment, namely, athletic wrist and joint supports, ball pitching screens, golf clubs, tennis rackets and skis and structural parts and fittings for the same; covers for sporting articles and equipment in the nature of fitted protective covers specially adapted for sports equipment, namely, golf clubs, tennis rackets and skis; toys, games, playthings, namely, construction toys, toy planes, cars and boats, board games, video game consoles, swing sets and structural parts and fittings for the same; covers for toys, games, playthings in the nature of fitted covers specially adapted for toy planes, cars and boats, fitted covers specially adapted to protect video game consoles for use with an external display screen or monitor, and protective fitted covers for swing sets; sports training apparatus, namely, pitching machines; footballs; golf clubs; protective paddings for playing football Scientific and technological services, namely, research and design in the field of computers and engineering; industrial analysis and research services in the field of computers and engineering; design and development of computer hardware and software; research and development of new products; technological analysis services, namely, technology research in the field of machine engineering analysis; technical measuring and testing, namely, measurement evaluations in the field of computers and engineering; server hosting, software as a service (SaaS) services featuring software for use in database management and rental of software for use in database management; software as a service (SaaS) services featuring software for producing products and for managing the production process of products; software maintenance and upkeep in the nature of updating of software
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
19 - Matériaux de construction non métalliques
21 - Ustensiles, récipients, matériaux pour le ménage; verre; porcelaine; faience
24 - Tissus et produits textiles
25 - Vêtements; chaussures; chapellerie
28 - Jeux, jouets, articles de sport
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Common metals; common metal alloys; metallic cladding
panels; metallic wall panels; building panels of metal; door
panels of metal; doors of metal; welding and soldering
materials. Machine tools; power tools; laundry washing machines;
dishwashers; kitchen machines, electric; mixers [kitchen
machines]; electric kitchen appliances for chopping, mixing,
pressing; machines for the preparation of foodstuffs
[electric, kitchen], other than for cooking; elevators and
parts therefor; agricultural, earthmoving, construction, oil
and gas extraction and mining equipment and parts therefor;
agricultural, gardening and forestry machines and apparatus
and parts therefor. Scientific, optical, weighing, measuring, signalling, and
checking (supervision) apparatus and instruments; apparatus
and instruments for conducting, switching, transforming,
accumulating, regulating or controlling electricity;
apparatus for recording, transmission or reproduction of
sound or images; data processing equipment, computers;
headsets; computer peripherals; remote control apparatus;
recorded and downloadable computer software; control boards
and panels; sensors and detectors; antennas; electrical
circuits and circuit boards; microprocessors; cases and
housings for computers and for electric equipment being
electric components; covers for tablets and smartphones;
touch screens and panels; display screens and display
panels; wearable computers, sensors and detectors, touch
screens and panels, display screens and display panels, and
activity trackers; electronic monitoring instruments, not
for medical use; wearable electronic equipment that transmit
physiological or location data via computer networks, not
for medical use; electronically encoded identity wristbands;
printed circuit boards bearing electronic components;
injection-molded plastic components bearing printed circuit
boards and electronic components; panels bearing printed
circuit boards and electronic components. Medical apparatus and instruments and parts and fittings for
the same; electronic monitoring instruments for medical use;
clothing for medical use; patient monitoring sensors and
alarms; apparatus for monitoring vital signs; pulse meters. Apparatus for lighting, heating, refrigerating, drying,
ventilating, water supply and sanitary purposes and parts
and fittings for the same; lighting panels, light-emitting
diodes (LED) lighting apparatus, lighting apparatus for
vehicles and parts and fittings for the same; food and
beverage cooking, heating, cooling and preservation
equipment; freezers; refrigerators; kitchen stoves and hot
plates; kitchen ovens; kitchen machines (gas -) for cooking;
coffee machines; electric kettles. Land vehicles and conveyances; air vehicles; water vehicles;
rail vehicles including trams and trains; parts and fittings
for land, air, water and rail vehicles; dashboards;
upholstery for land, air, water and rail vehicles; covers
for vehicle steering wheels; doors and bumpers for land,
air, water and rail vehicles; bodywork parts for land, air,
water and rail vehicles; body panels for land, air, water
and rail vehicles; interior and exterior panels for land,
air, water and rail vehicles; door panels and roof panels
for land, air, water and rail vehicles; vehicle seats and
parts and fittings therefor. Precious metals; precious metal alloys. Insulation and barrier articles and materials; insulating
panels; acoustic panels for buildings; plastic materials in
the form of panels [semi-finished products]; semi-worked
plastic substances; polymeric membranes; electrical
insulation articles and materials; carbon fibre; fabrics of
organic fibres for use as insulation. Veneers; non-metallic cladding panels; non-metallic wall
panels; building panels, not of metal; door panels, not of
metal; doors, not of metal. Beverage coolers. Fabrics; textiles and substitutes for textiles; household
textiles; polyester textiles; polymer coated fabrics;
fabrics of organic fibres, other than for insulation. Clothing; headgear; footwear; sports clothing; sports shoes;
wristbands. Sporting articles and equipment and parts and fittings for
the same; covers for sporting articles and equipment; toys,
games, playthings and parts and fittings for the same;
covers for toys, games, playthings; sports training
apparatus; footballs; golf clubs; protective paddings (parts
of sports suits). Custom manufacture of electric and electronic components,
vehicle parts and fittings, electronic components for
medical devices, electronic components for sporting articles
and equipment, plastic panels, and plastic molded
components; custom assembly services; assembly of products
and parts and fittings of products for others; custom
manufacture and assembly of vehicle bodies and chassis and
parts and fittings for the same; custom manufacture and
assembly of electronic components for vehicles; custom
manufacture and assembly of electronic components for
medical devices; custom manufacture and assembly of
electronic components for sporting articles and equipment;
custom manufacture and assembly of plastic panels; custom
manufacture and assembly of molded components. Scientific and technological services and research and
design relating thereto; industrial analysis and research
services; design and development of computer hardware and
software; research and development of new products;
technological analysis services; technical measuring and
testing; hosting services and software as a service and
rental of software; software as a service featuring software
for producing products and for managing the production
process of products; software maintenance and upkeep.
33.
Integrated multilayer structure containing optically functional module and related method of manufacture
An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.
F21V 29/54 - Dispositions de refroidissement utilisant des moyens thermo-électriques, p. ex. des éléments Peltier
F21K 9/69 - Détails des réfracteurs faisant partie de la source lumineuse
F21V 29/87 - Matériaux organiques, p. ex. composites polymères chargésProtection des dispositifs d'éclairage contre les détériorations thermiquesDispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage caractérisées par le matériau additifs thermo-conducteurs ou leurs revêtements
F21V 29/76 - Dispositions de refroidissement caractérisées par des éléments passifs de dissipation de chaleur, p. ex. puits thermiques avec ailettes ou lames avec ailettes ou lames en plans parallèles essentiellement identiques, p. ex. avec une section en forme de peigne
F21V 23/06 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage les éléments étant des dispositifs de couplage
An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
06 - Métaux communs et minerais; objets en métal
07 - Machines et machines-outils
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
19 - Matériaux de construction non métalliques
24 - Tissus et produits textiles
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly services, namely, custom manufacturing of plastic injection-molded parts for others; custom assembly of products and parts and fittings of products for others, namely, custom manufacturing of plastic injection-molded parts for others; custom manufacture and assembly in the nature of custom manufacturing of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly in the nature of custom manufacturing of electronic components for vehicles; custom manufacture and assembly in the nature of custom manufacturing of electronic components for medical devices; custom manufacture and assembly in the nature of custom manufacturing of electronic components for sporting articles and equipment; custom manufacture and assembly in the nature of custom manufacturing of plastic panels; custom manufacture and assembly in the nature of custom manufacturing of molded components Common metals, unwrought or semi-wrought; common metal alloys; metallic cladding panels, namely, cladding of metal for building; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials,namely, rods of metal for welding, soldering wire of metal, spelters for welding and soldering in the nature of metal welding rods Machine tools, namely, drilling tools, boring tools, milling tools; power tools, namely, tile saws, thread mills, drill presses; laundry washing machines; dishwashers; kitchen machines, electric namely, mixers and grinders; Kitchen mixers, electric; electric kitchen appliances for chopping, mixing, pressing namely, electric food choppers, electric food mixers, electric food presses; machines for the preparation of foodstuffs, other than for cooking, namely, electric stand mixers; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor,namely, agricultural seed planting machines, earthmoving machines, concrete construction machines and drills for the mining industry; agricultural, gardening and forestry machines and apparatus and parts therefor,namely, tilling machines for agricultural use, garden tilling machines, tree stump cutters Scientific, optical, weighing, measuring, signalling, and checking supervision apparatus and instruments, namely, scales, measuring cups, injection molded electronic systems comprising electric sensors, electronic data relays for sensors, and recorded computer operating system software; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity, namely, electric conductors, electric switches, transformers, accumulators, voltage regulators, electrical controllers; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets, namely, headsets for telephones and headsets for remote communication; computer peripherals; remote control apparatus, namely, remote controls for computers and speakers; recorded and downloadable computer software for use in database management; control boards and panels, namely, lighting panel control boards and electric control panels; sensors, not for medical use and detector units for use in controlling the actuation and operation of automotive safety apparatus and equipment; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components, namely, electric switch housings and electrical connector housings; covers for tablets and smartphones; touch screens and panels; Flat panel display screens and digital signage display panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers namely smartwatches, wearable electric or electronic sensors, namely, wearable electronic proximity sensors with embedded contact tracing software for monitoring and alerting of social distances; electronic monitoring instruments, not for medical use namely, electronic monitors for monitoring electric current and electrical signals, electronic devices in the nature of energy meters for tracking and monitoring energy usage; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use, namely, wearable activity trackers; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components, namely, housings for printed circuit boards and electronic components in the nature of electrical connectors and switches; panels bearing printed circuit boards and electronic components, namely, electric control panels electronic monitoring instruments for medical use, namely, fetal pulse and vital sign monitors; clothing for medical use, namely, surgical scrub suits; patient monitoring sensors and alarms; Medical apparatus for monitoring vital signs; pulse meters Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes, namely, lighting fixtures, water heaters, refrigerators, electric air dryers, ventilation hoods, water fountains, wash basins being parts of sanitary installations and structural parts and fittings for the same; lighting panels for vehicles, namely, land vehicles, air vehicles and rail vehicles, light-emitting diodes (LED) lighting apparatus, namely, LED lighting apparatus for vehicles, lighting apparatus for vehicles and structural parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment,namely, cooking ranges, hot water heating installations, beverage-cooling apparatus; freezers; refrigerators; kitchen stoves and hot plates; kitchencooking ovens; gas kitchen machines for cooking,namely, gas stoves; Electric coffee machines; electric kettles Land vehicles and conveyances, namely, land vehicles; air vehicles namely, airplanes; water vehicles namely, boats; rail vehicles, namely, trams and trains; structural parts and fittings for land, air, water and rail vehicles in the nature of land vehicles, airplanes, boats, trams, and trains; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles, namely, bodyworks for motor vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles, in the nature of metal parts for vehicles, namely automotive exterior and interior metal decorative and protective trim; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor Precious metals; precious metal alloys Insulation and barrier articles and materials, namely, insulating materials; acoustic insulating panels; acoustic insulating panels for buildings; semi-processed plastic materials in the form of panels; semi-worked plastic substances in the nature of semi-processed plastics; polymeric membranes, namely, semi-processed polymers in pellet form for use as filling material for synthetic grounds; electrical insulation articles and materials, namely, insulators for electrical cables and electrical insulating tapes; carbon fibres, other than for textile use; fabrics of organic fibres for use as insulation Veneers namely, veneers for floors, wood veneers and stone veneers; non-metallic cladding panels for building; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal Fabrics, namely, insulating fabrics; textiles and substitutes for textiles, namely, used as linings for clothes; household textiles, namely textile curtains; natural and synthetic fabrics and textiles, namely, polyester textiles; polymer coated fabrics, namely acrylic fabrics and woven fabrics; fabrics of organic fibres, other than for insulation, namely, cotton fabrics Scientific and technological services and research, namely, research and design in the field of computers and engineering and research and design relating thereto; industrial analysis and research services in the field of computers and engineering; design and development of computer hardware and software; research and development of new products; technological analysis services, namely, technology research in the field of machine engineering analysis; technical measuring and testing, namely, measurement evaluations in the field of computers and engineering; hosting services and software as a service (SaaS) services featuring software for use in database management and rental of software for use in database management; providing software as a service (SaaS) services featuring software for use as a software tool for producing products and for managing the production process of products; software maintenance and upkeep in the nature of updating of software
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
19 - Matériaux de construction non métalliques
21 - Ustensiles, récipients, matériaux pour le ménage; verre; porcelaine; faience
24 - Tissus et produits textiles
25 - Vêtements; chaussures; chapellerie
28 - Jeux, jouets, articles de sport
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
(1) Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials, namely, wire of metal, rods of metal.
(2) Machine tools, namely, drilling tools, boring tools, milling tools; power tools; laundry washing machines; dishwashers; kitchen mixers, electric; electric kitchen appliances for chopping, mixing, pressing food; machines for the preparation of foodstuff, other than for cooking, namely, electric stand mixers; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor, namely, agricultural seed planting machines, earthmoving machines, namely, earth moving scrapers, earth haulers, bulldozers, hydraulic excavators, front-end loaders, concrete construction machines and drills for the mining industry; agricultural, gardening and forestry machines and apparatus and parts therefor, namely, tilling machines for agricultural use, garden tilling machines, tree stump cutters.
(3) Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments, namely, laboratory scales, measuring cups, injection-molded plastic components being housing for electronic systems comprising electrical sensors for detecting electric current, electric relays, and computer software for processing sensor data; apparatus and instruments for conducting, switching, transforming, accumulating, regulating and controlling electricity, namely, electrical conductor cables, electric switchboards, electric transformers, accumulators being electrical storage batteries, voltage regulators, electrical charge controllers; electrical cables for recording, transmission and reproduction of sound and images; data processing equipment, namely, computers; headsets; computer peripherals, namely, digital cameras, keyboards, modems, mouse, printers, scanners, speakers, video recorders; remote control apparatus, namely, remote controls for computers and speakers; recorded and downloadable computer software for use in database management; control boards and panels; motion sensors and detectors; antennas, namely radio-frequency antennas, radio signal antennas, panel antennas, microwave antennas, radar antennas, satellite antennas, dish antennas, car antennas, cell phone antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components, namely, electric switch housings and electrical connector housings; covers for tablets and smartphones; touch screens and panels; flat panel display screens and digital signage display panels; wearable computers in the nature of smartwatches, wearable motion and distance sensors and detectors, touch screens and panels, wearable display screens and display panels, namely, smart sunglasses, wearable video display monitors, wearable smartphones, wearable smart watches, and activity trackers; electronic monitoring instruments, not for medical use, namely, electronic monitors energy meters for tracking and monitoring energy usage; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components being housing for printed circuit boards and electronic components; touch panels bearing printed circuit boards and electronic components for computers.
(4) Medical apparatus and instruments for use in cardiovascular procedures, namely, diagnostic catheters, balloon catheters, stent delivery systems, guidewires, vascular access sheaths, and cardiac monitoring devices, surgical instruments for cardiovascular applications, namely, vessel clamps, heart retractors, cannulas, stents, artificial heart valves, and pacemakers; electronic monitoring instruments for medical use, namely, electronic temperature monitors for medical use; clothing for medical use, namely, medical gloves and gowns; patient monitoring sensors and alarms for monitoring patient movement; apparatus for monitoring vital signs, namely, patient medical monitors for monitoring vital signs; pulse meters.
(5) Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same, namely, lighting fixtures, water heaters, refrigerators, electric air dryers, ventilation hoods, water fountains, wash basins being parts of sanitary installations; lighting panels for vehicles, namely, land vehicles, air vehicles and rail vehicles, light-emitting diodes (LED) lighting apparatus, namely, LED lighting for vehicles being headlights, taillights, interior lighting, and indicator lights and parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment, namely, cooking ranges, hot water heating installations namely heaters, beverage-cooling dispensing machines, fridges; freezers; refrigerators; kitchen stoves and hot plates; kitchen ovens; gas kitchen machines for cooking, namely, gas stoves; coffee machines; electric kettles.
(6) Land vehicles and conveyances, namely automobiles, passenger trains, subway trains and trams; air vehicles, namely, airplanes; water vehicles, namely, boats; rail vehicles, namely, trams and trains; structural parts and fittings for land, air, water and rail vehicles, namely, injection-molded plastic units, namely, plastic parts for vehicles which are embedded with printed circuits and electronic components, used for interior and exterior paneling, steering apparatus, door handles, bumpers, vehicle sensors, and vehicle antennas; automobile dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor.
(7) Precious metals; precious metal alloys.
(8) Acoustical insulation barrier sheets made of sound-absorbing textile materials; acoustical insulation barrier panels; acoustic insulation panels for buildings; semi-processed plastic materials in the form of panels; semi-worked plastic substances in the nature of semi-processed plastics; polymeric membranes, namely, pellets for use as filling material for synthetic grounds; electrical insulation articles and materials; carbon fibre; fibreglass fabrics of organic fibres for use as insulation.
(9) Veneers, namely, veneers for floors, wood veneers and stone veneers; non-metallic cladding panels for building; non-metallic wall panels for building; building panels, not of metal, namely, concrete, glass, plastic and wood; door panels, not of metal; doors, not of metal, namely, glass, plastic and wood.
(10) Beverage coolers.
(11) Textiles and substitutes for textiles, namely, for linings of clothes; household textiles, namely textile curtains; natural and synthetic fabrics and textiles, namely, polyester textiles; polymer coated fabrics, namely acrylic fabrics and woven fabrics; fabrics of organic fibres, other than for insulation, namely, cotton fabrics.
(12) Clothing, namely, pants, shirts, tops, namely, athletic tops, crop tops, fleece tops, sweat tops, tank tops, jackets and shorts; headgear, namely, hats, caps, sun visors, headbands, toques; footwear, namely, shoes, boots, sandals, casual footwear; sports clothing; sports shoes; wristbands.
(13) Sporting articles and equipment, namely, athletic wrist and joint supports, ball pitching screens, golf clubs, tennis rackets and skis and structural parts and fittings for the same; covers for sporting articles and equipment in the nature of fitted protective covers specially adapted for sports equipment, namely, golf clubs, tennis rackets and skis; toys, games, playthings, namely, construction toys, toy planes, cars and boats, board games, video game consoles, swing sets and structural parts and fittings for the same; covers for toys, games, playthings in the nature of fitted covers specially adapted for toy planes, cars and boats, fitted covers specially adapted to protect video game consoles for use with an external display screen or monitor, and protective fitted covers for swing sets; sports training apparatus, namely, pitching machines; footballs; golf clubs; protective paddings for playing football. (1) Custom manufacture of electric computer and electronic computer components, motor vehicle parts and fittings, manufacturing of electronic components for medical equipment, plastic panels for building, and plastic molded components for the manufacture of molded plastic; custom assembly services, namely, custom manufacturing of plastic injection-molded parts for others; custom assembly of products and parts and fittings of products, namely, custom manufacturing of plastic injection-molded parts for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components to the order and specification for vehicles in the nature of custom manufacturing of electronic components for vehicles; custom manufacture and assembly of electronic components to the order and specification of medical devices for others; custom manufacture and assembly of electronic components to the order and specification for sporting articles and equipment; custom manufacture and assembly of plastic panels for building; custom manufacture and assembly of plastic molded components for building.
(2) Scientific and technological services and research, namely, research and design in the field of computers and engineering and research and design relating thereto; industrial analysis and research services in the field of computers and engineering; design and development of computer hardware and software; research and development of new products for others; technological research analysis services in the field of computers; technical measuring and testing, namely, measurement evaluations in the field of computers and engineering; hosting services and software as a service (SaaS) services featuring software for use in database management and rental of software for use in database management; providing software as a service (SaaS) featuring software for the creation of products and the management of product manufacturing processes; software maintenance and upkeep in the nature of updating of software.
37.
Integrated multilayer structure containing optically functional module and related method of manufacture
An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.
F21V 29/54 - Dispositions de refroidissement utilisant des moyens thermo-électriques, p. ex. des éléments Peltier
F21V 29/87 - Matériaux organiques, p. ex. composites polymères chargésProtection des dispositifs d'éclairage contre les détériorations thermiquesDispositions de refroidissement ou de chauffage spécialement adaptées aux dispositifs ou systèmes d'éclairage caractérisées par le matériau additifs thermo-conducteurs ou leurs revêtements
F21V 29/76 - Dispositions de refroidissement caractérisées par des éléments passifs de dissipation de chaleur, p. ex. puits thermiques avec ailettes ou lames avec ailettes ou lames en plans parallèles essentiellement identiques, p. ex. avec une section en forme de peigne
F21K 9/69 - Détails des réfracteurs faisant partie de la source lumineuse
The multilayer structure including a substrate film and a number of functional components and/or integrated circuits, including at least one first conductive element, at least one second conductive element, and at least one subsidiary conductive element, optionally traces, provided upon the substrate film. The substrate film has been provided with at least one coupling location enhancement element at a coupling location with respect to the substrate film, wherein at said coupling location the coupling location enhancement element is configured to provide an electrical connection between the first conductive element and second conductive element, further wherein said coupling location enhancement element is configured to inhibit coupling between the first conductive element and the subsidiary conductive element at the coupling location and between the second conductive element and the subsidiary conductive element at the coupling location.
G06K 19/02 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par l'utilisation de matériaux spécifiés, p. ex. pour éviter l'usure pendant le transport à travers la machine
G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
19 - Matériaux de construction non métalliques
21 - Ustensiles, récipients, matériaux pour le ménage; verre; porcelaine; faience
24 - Tissus et produits textiles
25 - Vêtements; chaussures; chapellerie
28 - Jeux, jouets, articles de sport
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials.. Machine tools; power tools; laundry washing machines; dishwashers; kitchen machines, electric; mixers [kitchen machines]; electric kitchen appliances for chopping, mixing, pressing; machines for the preparation of foodstuffs [electric, kitchen], other than for cooking; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor; agricultural, gardening and forestry machines and apparatus and parts therefor.. Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets; computer peripherals; remote control apparatus; recorded and downloadable computer software; control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components; covers for tablets and smartphones; touch screens and panels; display screens and display panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components; panels bearing printed circuit boards and electronic components.. Medical apparatus and instruments and parts and fittings for the same; electronic monitoring instruments for medical use; clothing for medical use; patient monitoring sensors and alarms; apparatus for monitoring vital signs; pulse meters.. Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same; lighting panels, light-emitting diodes (LED) lighting apparatus, lighting apparatus for vehicles and parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment; freezers; refrigerators; kitchen stoves and hot plates; kitchen ovens; kitchen machines (gas -) for cooking; coffee machines; electric kettles.. Land vehicles and conveyances; air vehicles; water vehicles; rail vehicles including trams and trains; parts and fittings for land, air, water and rail vehicles; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor.. Precious metals; precious metal alloys.. Insulation and barrier articles and materials; insulating panels; acoustic panels for buildings; plastic materials in the form of panels [semi-finished products]; semi-worked plastic substances; polymeric membranes; electrical insulation articles and materials; carbon fibre; fabrics of organic fibres for use as insulation.. Veneers; non-metallic cladding panels; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal.. Beverage coolers.. Fabrics; textiles and substitutes for textiles; household textiles; polyester textiles; polymer coated fabrics; fabrics of organic fibres, other than for insulation.. Clothing; headgear; footwear; sports clothing; sports shoes; wristbands.. Sporting articles and equipment and parts and fittings for the same; covers for sporting articles and equipment; toys, games, playthings and parts and fittings for the same; covers for toys, games, playthings; sports training apparatus; footballs; golf clubs; protective paddings (parts of sports suits).. Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly services; assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components.. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; hosting services and software as a service and rental of software; providing on a software as a service basis a software tool for producing products and for managing the production process of products; software maintenance and upkeep..
40.
Integral 3D structure for creating UI, related device and methods of manufacture and use
An integrated functional multilayer structure includes a flexible, 3D-formable substrate film having a first surface facing towards an environment of the structure and a user therein, and an opposite second surface facing towards the internals of the structure, wherein the first and second surfaces and remaining material of the substrate film in between locally define a three-dimensional protrusion extending from a plane of surrounding substrate film material and formed from locally stretched and shaped material of the substrate film, side walls perceptible by touch; circuitry provided upon the substrate film includes a number of conductive traces, electrodes and/or components to detect touch on two or more of the plurality of side walls and at least one fill layer upon the substrate film to at least partially embed the circuitry.
G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur
G06F 3/04847 - Techniques d’interaction pour la commande des valeurs des paramètres, p. ex. interaction avec des règles ou des cadrans
G06F 3/04883 - Techniques d’interaction fondées sur les interfaces utilisateur graphiques [GUI] utilisant des caractéristiques spécifiques fournies par le périphérique d’entrée, p. ex. des fonctions commandées par la rotation d’une souris à deux capteurs, ou par la nature du périphérique d’entrée, p. ex. des gestes en fonction de la pression exercée enregistrée par une tablette numérique utilisant un écran tactile ou une tablette numérique, p. ex. entrée de commandes par des tracés gestuels pour l’entrée de données par calligraphie, p. ex. sous forme de gestes ou de texte
41.
Integrated optically functional multilayer structure and related method of manufacture
An integrated functional multilayer structure includes substrate film, circuitry provided upon the substrate film including a first light source and a monolithic lightguide layer, the lightguide layer includes a first surface and an opposite second surface, the second surface facing the first light source and a portion of the first surface containing, a pre-defined outcoupling area for the light emitted by the first light source and transmitted within the lightguide layer, the lightguide layer further containing a light leakage prohibition region and the attenuation of emitted light effectuated on a direct optical path between the first light source and the outcoupling area is less than the attenuation effectuating on a optical path between the first light source and the light leakage prohibition region. A related method of manufacture is also presented.
An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/28 - Application de revêtements de protection non métalliques
43.
System for manufacturing an electromechanical structure
A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
19 - Matériaux de construction non métalliques
21 - Ustensiles, récipients, matériaux pour le ménage; verre; porcelaine; faience
24 - Tissus et produits textiles
25 - Vêtements; chaussures; chapellerie
28 - Jeux, jouets, articles de sport
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Common metals; common metal alloys; metallic cladding panels; metallic wall panels; building panels of metal; door panels of metal; doors of metal; welding and soldering materials. Machine tools; power tools; laundry washing machines; dishwashers; kitchen machines, electric; mixers [kitchen machines]; electric kitchen appliances for chopping, mixing, pressing; machines for the preparation of foodstuffs [electric, kitchen], other than for cooking; elevators and parts therefor; agricultural, earthmoving, construction, oil and gas extraction and mining equipment and parts therefor; agricultural, gardening and forestry machines and apparatus and parts therefor. Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; headsets; computer peripherals; remote control apparatus; recorded and downloadable computer software; control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for computers and for electric equipment being electric components; covers for tablets and smartphones; touch screens and panels; display screens and display panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; injection-molded plastic components bearing printed circuit boards and electronic components; panels bearing printed circuit boards and electronic components. Medical apparatus and instruments and parts and fittings for the same; electronic monitoring instruments for medical use; clothing for medical use; patient monitoring sensors and alarms; apparatus for monitoring vital signs; pulse meters. Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same; lighting panels, light-emitting diodes (LED) lighting apparatus, lighting apparatus for vehicles and parts and fittings for the same; food and beverage cooking, heating, cooling and preservation equipment; freezers; refrigerators; kitchen stoves and hot plates; kitchen ovens; kitchen machines (gas -) for cooking; coffee machines; electric kettles. Land vehicles and conveyances; air vehicles; water vehicles; rail vehicles including trams and trains; parts and fittings for land, air, water and rail vehicles; dashboards; upholstery for land, air, water and rail vehicles; covers for vehicle steering wheels; doors and bumpers for land, air, water and rail vehicles; bodywork parts for land, air, water and rail vehicles; body panels for land, air, water and rail vehicles; interior and exterior panels for land, air, water and rail vehicles; door panels and roof panels for land, air, water and rail vehicles; vehicle seats and parts and fittings therefor. Precious metals; precious metal alloys. Insulation and barrier articles and materials; insulating panels; acoustic panels for buildings; plastic materials in the form of panels [semi-finished products]; semi-worked plastic substances; polymeric membranes; electrical insulation articles and materials; carbon fibre; fabrics of organic fibres for use as insulation. Veneers; non-metallic cladding panels; non-metallic wall panels; building panels, not of metal; door panels, not of metal; doors, not of metal. Beverage coolers. Fabrics; textiles and substitutes for textiles; household textiles; polyester textiles; polymer coated fabrics; fabrics of organic fibres, other than for insulation. Clothing; headgear; footwear; sports clothing; sports shoes; wristbands. Sporting articles and equipment and parts and fittings for the same; covers for sporting articles and equipment; toys, games, playthings and parts and fittings for the same; covers for toys, games, playthings; sports training apparatus; footballs; golf clubs; protective paddings (parts of sports suits). Custom manufacture of electric and electronic components, vehicle parts and fittings, electronic components for medical devices, electronic components for sporting articles and equipment, plastic panels, and plastic molded components; custom assembly services; assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; hosting services and software as a service and rental of software; providing on a software as a service basis a software tool for producing products and for managing the production process of products; software maintenance and upkeep.
09 - Appareils et instruments scientifiques et électriques
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
(1) Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signaling, checking (supervision), life-saving and teaching apparatus and instruments namely, molded electronic systems comprising electric acceleration, motions pressure, temperature and touchscreen sensors, electronic data relays for the aforementioned sensors, computer software for operating system programs; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity namely, electrical conductors for electric motors, electric current switches, transformers, electrical controllers for governing the electrical output of rechargeable batteries, circuit boards and electronic components including ink and adhesives, namely, printed electronic circuits for conducting electricity; apparatus for recording, transmission or reproduction of sound or images namely, computer hardware for data processing equipment, computers, remote control apparatus, namely, electrical controls for computers and computer speakers, recorded and downloadable computer software for use in database management, lighting panel control boards, electronic sensors and electronic detectors for accessing control systems for the actuation and operation of automotive safety and automotive equipment, car antennas, electrical circuits and circuit boards, microprocessors, housing for switching apparatus, namely, computer network switches and computer cases, covers for tablets and smartphones, touch screens and touch panels, flat panel display screens and electric control panels, wearable computers in the nature of smartwatches, wearable motion and distance sensors and detectors, wearable touch screens monitors, wearable activity trackers, electronic monitor energy meters for tracking and monitoring energy usage, wearable cameras that transmit physiological or location data via computer networks, biometric electronically encoded identity wristbands, printed circuit boards being electronic components for computers, printed circuit boards and electronic components being parts of computers comprised primarily of injection-molded plastics, housings for printed circuit boards and electronic components for computers comprised primarily of injection-molded plastics, touch panels bearing printed circuit boards and electronic components for computers being computer touchscreens; magnetic data carriers, recording discs, namely, blank magnetic discs; compact discs, DVDs and other digital recording media, namely, blank compact discs, blank digital versatile discs; cash registers, calculating machines, data processing equipment, namely, computers; computer software for operating system programs.
(2) Apparatus for lighting, heating, steam generating, cooking, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same, namely, lighting fixtures, water heaters, refrigerators, electric air dryers, ventilation hoods, water fountains, wash basins being parts of sanitary installations, flat light panels, light-emitting diodes (LED) lighting fixtures, interior and front and rear lighting for vehicles and structural parts and fittings therefor, deep freezers, freezer-refrigerators, beverage coolers, electric kitchen stoves and electric hot plates, electric kitchen cooking ovens for household purposes, gas cooking ovens for household purposes, electric coffee machines, electric kettles.
(3) Vehicles, namely automobiles, passenger trains, subway trains and trams, airplanes, boats, structural parts and fittings for land, air and water vehicles; replacement parts, namely structural parts and interior trim parts for automobiles, airplanes, boats and passenger trains, trams, and subway trains, namely, plastic parts for vehicles, namely, fitted dashboard covers embedded with printed circuits and electronic components for computers comprised primarily of injection-molded plastics, vehicle body panels, steering wheels, vehicle door handles, vehicle bumpers, antenna toppers for automobiles, vehicle dashboards, upholstery for vehicles, namely, automobiles, airplanes, boats, passenger trains, trams and subway trains; covers for vehicle steering wheels, doors and bumpers for land, air and water vehicles, bodywork parts for land, air and water vehicles, body panels for land, air and water vehicles, interior and exterior panels for land, air and water vehicles, door panels and roof panels for land, air and water vehicles, motor car seats and parts and fittings therefor, children's car seats; passenger trains, subway trains, trams and automobiles for locomotion by land, planes for locomotion by air and boats for locomotion by water and structural parts and fittings therefor, structural replacement parts for automobiles, airplanes, boats and trains, plastic parts for vehicles, namely, fitted dashboard covers, rear inner panels, rear shelf panels, roof panels and body panels for vehicles embedded with printed circuits and electronic components being computers, upholstery for vehicles, namely, automobiles, airplanes and boats, trams, passenger trains and subway trains, covers for vehicle steering wheels, doors for vehicles and automobiles, passenger trains, trams, and subway trains, plane and boat bumpers, structural parts for automobiles, aircrafts, and boats, passenger trains, trams and subway trains, motor car seats and parts and fittings therefore, namely, seat belt safety buckles and car seat belt cross connectors, upholstery for vehicle seats, arm rests for vehicle seats, head-rests for vehicle seats, car seats for children. (1) Scientific and technological services, namely, industrial research and design in the field of computer hardware and software, and software engineering; industrial analysis and research services in the field of computers and engineering, research and development of new products, technological consultation relating to machine engineering analysis, technical measuring and testing of computers, electronic components and electronic systems, hosting the websites of others, software as a service (SaaS) services, featuring software for use in database management, rental of software, software as a service (SaaS) for producing products and for managing the production process of products, namely, for use in manufacturing injection-molded plastic housings for electronic components, computer software maintenance; design and development of computer hardware and software.
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
25 - Vêtements; chaussures; chapellerie
28 - Jeux, jouets, articles de sport
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
(1) Scientific, optical, weighing, measuring, signalling, checking, supervising apparatus and instruments, namely, laboratory scales, measuring cups; scientific, optical, weighing, measuring, signaling, checking, supervision apparatus and instruments, namely, injection molded electronic systems comprising electric sensors, acceleration sensors, motion sensors, pressure sensors, temperature sensors, touchscreen sensors, electronic data relays for sensors; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity, namely, electric conductors for transformers, current switches, electrical transformers, accumulators being electrical storage batteries, voltage regulators, electrical charge controllers; computers for the recording, transmission and reproduction of sound and images; apparatus for recording, transmission or reproduction of sound or images, namely, computer hardware for data processing equipment, computers; computer data processing equipment, namely, computers; remote control apparatus, namely, remote controls for computers and speakers; recorded and downloadable computer software for operating system programs; lighting panel control boards and panels; acceleration sensors and motion detectors for use in controlling the actuation and operation of vehicle safety and security while driving; antennas, namely radio-frequency antennas, radio signal antennas, panel antennas, microwave antennas, radar antennas, satellite antennas, dish antennas, car antennas, cell phone antennas; electrical circuits and circuit boards; microprocessors; cases and housings for electric equipment and computers; covers for tablets and smartphones; flat panel display screens and electric control panels; wearable computers in the nature of smartwatches, wearable motion and distance sensors and detectors, computer touch screens and panels, wearable display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use, namely, electronic computer monitors energy meters for tracking and monitoring energy usage; wearable electronic equipment, namely wearable cameras that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; printed circuit boards and electronic components for injection-molded plastic components for computers; injection-molded plastic components being housings for printed circuit boards and electronic components; touch panels bearing printed circuit boards and electronic components for computers.
(2) Medical apparatus and instruments for use in cardiovascular procedures, and parts and fittings for the same; electronic monitoring instruments for medical use, namely, electronic temperature monitors for medical use; clothing for medical use, namely, medical gloves and gowns; medical apparatus and instruments, namely, electronic plastic molded machines comprised of patient monitoring sensors and alarms for monitoring vital signs; apparatus for monitoring vital signs, namely patient medical monitors for monitoring vital signs; pulse meters.
(3) Apparatus for lighting, heating, refrigerating, drying, ventilating, water supply and sanitary purposes and parts and fittings for the same, namely, lighting fixtures, water heaters, refrigerators, electric air dryers, ventilation hoods, water fountains, wash basins being parts of sanitary installations; lighting panels, light-emitting diodes (LED) lighting fixtures, lighting apparatus for vehicles and parts and fittings for the same
(4) Replacement parts and fittings for land vehicles, airplanes, boats and trains, namely, injection-molded plastic units, namely, plastic parts for vehicles which are embedded with printed circuits and electronic components, used for interior and exterior paneling, steering wheel, door handles, bumpers, fuel tank sensors and vehicle antenna toppers, dashboards, upholstery for land, air and water vehicles; covers for vehicle steering wheels, doors and bumpers for vehicles; bodywork parts for land, air and water vehicles; body panels for vehicles; interior and exterior panels for vehicles; door panels and roof panels for vehicles.
(5) Clothing, namely, pants, shirts, tops, jackets and shorts, sweaters, casual clothing; headgear, namely hats, caps, sun visors, headbands, toques; footwear, namely shoes, boots, sandals, casual footwear; sports clothing; sports shoes; wristbands.
(6) Sporting articles and equipment, namely, athletic wrist and joint supports, ball pitching screens, golf clubs, tennis rackets and snow skis and water skis and structural parts and fittings for the same; covers especially designed for snowboards; construction toys, toy planes, cars and boats, board games, video game consoles, playthings, namely, swing sets playthings and parts and fittings for the same; covers for toys, games, playthings, namely, fitted covers specially adapted for toy planes, cars and boats, fitted covers specially adapted to protect video game consoles for use with an external display screen or monitor, and protective fitted covers for swing sets; sports training apparatus, namely, pitching machines; footballs; golf clubs; sports protective paddings (parts of sports suits) for athletic use (1) Custom manufacture and assembly of computers for others; custom manufacture and assembly of furniture and structural parts and fittings of furniture for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels for creating a seamless structure, namely screen surfaces, surface finishes of machines and tools, and smart home devices comprised primarily of plastics for others; custom manufacture of molded components for creating a seamless structure, namely screen surfaces, surface finishes of machines and tools, and smart home devices comprised primarily of plastics for others.
(2) Scientific and technological services and research and design relating thereto, namely, industrial research and design in the field of computer hardware and software, and software engineering; industrial analysis and research services in the field of computers and industrial engineering; design and development of computer hardware and software; research and development of new products for others; technological consultation relating to machine engineering analysis; technical measuring and testing of computers, electronic components and electronic systems; hosting the websites of others; software as a service (SAAS) services, featuring software for use in database management; rental of software.
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Scientific, optical, weighing, measuring, signalling, and
checking (supervision) apparatus and instruments; apparatus
and instruments for conducting, switching, transforming,
accumulating, regulating or controlling electricity; circuit
boards and electronic components for conducting electricity;
apparatus for recording, transmission or reproduction of
sound or images; data processing equipment, computers;
remote control apparatus; recorded and downloadable computer
software; control boards and panels; sensors and detectors;
antennas; electrical circuits and circuit boards;
microprocessors; cases for electronic devices; cases adapted
for computers; computer housings; covers for tablets and
smartphones; touch screens and panels; display screens and
panels; wearable computers, sensors and detectors, touch
screens and panels, display screens and display panels, and
activity trackers; electronic monitoring instruments, not
for medical use; wearable electronic equipment that transmit
physiological or location data via computer networks, not
for medical use; electronically encoded identity wristbands;
printed circuit boards bearing electronic components;
printed circuit boards and electronic components in the form
of injection-molded plastic components; panels bearing
printed circuit boards and electronic components. Assembly services; assembly of products and parts and
fittings of products for others; custom manufacture and
assembly of vehicle bodies and chassis and parts and
fittings for the same; custom manufacture and assembly of
electronic components for vehicles; custom manufacture and
assembly of electronic components for medical devices;
custom manufacture and assembly of electronic components for
sporting articles and equipment; custom manufacture and
assembly of plastic panels; custom manufacture and assembly
of molded components. Education; providing of training; educational and teaching
services; provision of training courses; arranging and
conducting of classes; arranging of workshops and seminars;
personnel training; know-how transfer [training]; advisory
services relating to education. Scientific and technological services and research and
design relating thereto; industrial analysis and research
services; design and development of computer hardware and
software; research and development of new products;
technological analysis services; technical measuring and
testing; hosting services and software as a service and
rental of software; providing on a software as a service
basis a software tool for producing products and for
managing the production process of products; software
maintenance and upkeep.
48.
METHOD OF MANUFACTURE OF A STRUCTURE AND STRUCTURE
The presented method of manufacture of a structure comprises obtaining or producing a functional electronics assembly comprising at least a first substrate, atleast one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substratefilm, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material toat least partly embed the at least one electronics component into the first material. The first substrate film is adapted to comprise a recess defining a volume,and the at least one electronics component is arranged at least partly in thevolume.
An integrated multilayer structure includes a substrate film including an electrically insulating material; a circuit design including electrically conductive elements provided on the substrate film, the conductive elements defining a number of contact areas; a connector at the edge of the substrate film, the connector including a number of electrically conductive elongated contact elements, such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector; and at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H01R 43/20 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour assembler les pièces de contact avec le socle isolant, le boîtier ou le manchon ou pour les en désassembler
H01R 12/72 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires se couplant avec la bordure des circuits imprimés rigides ou des structures similaires
H01R 13/504 - SoclesBoîtiers composés de différentes pièces les différentes pièces étant moulées, collées, soudées, p. ex. par soudage à ultrasons, ou réunies par estampage
H01R 43/24 - Assemblage par moulage sur les pièces de contact
50.
CONNECTING STRUCTURES FOR INCLUSION IN INTEGRATED MULTILAYER STRUCTURES
Integrated multilayer structure (100, 200, 240, 280, 400,580, 640, 740, 900, 1300, 1400) comprising: a substrate film (102) comprising electrically substantially insulating material; a circuit design (106, 108, 109) comprising electrically conductive elements (106) provided on the substrate film, said conductive elements defining a number of contact areas (107); a connector (110) at the edge (102E) of the substrate film, the connector comprising a number of electrically conductive elongated contact elements (118), such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element (112) responsive to mating the external connecting element with the connector; and at least one plastic layer (104, 104B, 105) molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector, the covered portions including connection points of the contact elements with the contact areas and at least partially excluding the extended portions of the contact elements configured to couple to the external connecting element. A corresponding method of manufacture is presented.
An optoelectronically functional multilayer structure as well as related methods of manufacturing an optoelectronically functional multilayer structure are described herein.
An optoelectronically functional multilayer structure and related methods of manufacturing an optoelectronically functional multilayer structure, such structure including an optionally thermoplastic formable substrate film, electronics comprising preferably light-emitting and/or light-sensitive elements, an optically transmissive layer, and a light-blocking layer defining a number of structural channels extending in at least a first direction.
A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/08 - Élimination du matériau conducteur par décharge électrique, p. ex. par érosion par étincelles
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/28 - Application de revêtements de protection non métalliques
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
H05K 3/44 - Fabrication de circuits à âme métallique isolée
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 21/77 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/16 - Matériaux de remplissage ou pièces auxiliaires dans le conteneur, p. ex. anneaux de centrage
H01L 23/18 - Matériaux de remplissage caractérisés par le matériau ou par ses propriétes physiques ou chimiques, ou par sa disposition à l'intérieur du dispositif complet
H01L 23/24 - Matériaux de remplissage caractérisés par le matériau ou par ses propriétes physiques ou chimiques, ou par sa disposition à l'intérieur du dispositif complet solide ou à l'état de gel, à la température normale de fonctionnement du dispositif
H01L 23/28 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
H01L 23/52 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 23/552 - Protection contre les radiations, p. ex. la lumière
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.
H05K 5/00 - Enveloppes, coffrets ou tiroirs pour appareils électriques
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H05K 3/28 - Application de revêtements de protection non métalliques
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Scientific, optical, weighing, measuring, signalling, and checking apparatus and instruments, namely, scales, measuring cups; Scientific, optical, weighing, measuring, signaling, checking, supervision apparatus and instruments, namely, injection molded electronic systems comprising electric sensors, electronic data relays for sensors, recorded computer software for operation of electronic sensors for injection molded systems and operating machines for manufacturing injection-molded plastic housings for electronic components; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity, namely, electric conductors, electric switches, transformers, accumulators, voltage regulators, electrical controllers; circuit boards; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; remote control apparatus, namely, remote controls for computers and speakers; recorded and downloadable computer software for use in database management; lighting panel control boards; sensors and detector units for use in controlling the actuation and operation of automotive safety apparatus and equipment; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for electric equipment and computers, namely, housing for switching apparatus and computer cases; protective covers specially adapted for tablets and smartphones; touch screens and touch panels; flat panel display screens and electric control panels; wearable computers in the nature of smartwatches, wearable sensors and detectors, namely, wearable electronic proximity sensors with embedded contact tracing software for monitoring and alerting of social distances; wearable touch screens and panels; wearable display screens and display panels; wearable activity trackers; electronic monitoring instruments, not for medical use, namely, electronic monitors energy meters for tracking and monitoring energy usage; wearable electronic equipment, namely, wearable cameras not for medical use that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; printed circuit boards and electronic components for injection-molded plastic components for computers; injection-molded plastic components being housings for printed circuit boards and electronic components; touch panels bearing printed circuit boards and electronic components for computers Custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components all of the foregoing for others to the order and specifications of others Educational services, namely providing classes, seminars and workshops in the field of structural electronics; providing of training in the field of structural electronics; provision of training courses in the field of structural electronics; arranging and conducting of classes in the field of structural electronics; arranging of workshops and seminars in the field of structural electronics; personnel training in the field of structural electronics; provision of training in the nature of providing know-how in the field of structural electronics; advisory services relating to education Scientific and technological services, namely, research and design in the field of computers and engineering; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services in the field of structural electronics; technical measuring and testing of computers; hosting the websites of others; software as a service for use in database management and rental of software; providing software as a service (SAAS) for integrating design and manufacturing of injection-molded plastic housings for electronic components; software maintenance and upkeep, namely, updating and maintenance of computer software
56.
Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
Integrated functional multilayer structure (100), comprising asubstrate film (102) formed or formable so as to exhibit aselected shape (103); and a number of functional, preferably5including optical, mechanical, optoelectrical, electrical and/orspecifically, electronic, elements (110, 112, 114, 210), such asconductors (112), insulators (114), components (110, 210)and/or integrated circuits (110, 210), provided upon thesubstrate film in the proximity of the shape (103); wherein the0substrate film (102) has further been provided with a structuraltuning element (116, 316, 416, 616, 716, 816, 916, 1016),optionally comprising an elongated (316, 416), circumferential(616, 716) or other selected shape, said structural tuning elementbeing configured to locally control induced deformation,5optionally including stretching, bending, compression and/orshearing, of the substrate film within said proximity of the shape.Related method of manufacture is presented.Fig. 10
A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.
An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.
G02B 6/00 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage
F21V 8/00 - Utilisation de guides de lumière, p. ex. dispositifs à fibres optiques, dans les dispositifs ou systèmes d'éclairage
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/28 - Application de revêtements de protection non métalliques
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
41 - Éducation, divertissements, activités sportives et culturelles
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Scientific, optical, weighing, measuring, signalling, and checking (supervision) apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; circuit boards and electronic components including ink and adhesive for conducting electricity; apparatus for recording, transmission or reproduction of sound or images; data processing equipment, computers; remote control apparatus; recorded and downloadable computer software; control boards and panels; sensors and detectors; antennas; electrical circuits and circuit boards; microprocessors; cases and housings for electricalapparatus and computers; covers for tablets and smartphones; touch screens and panels; display screens and panels; wearable computers, sensors and detectors, touch screens and panels, display screens and display panels, and activity trackers; electronic monitoring instruments, not for medical use; wearable electronic equipment that transmit physiological or location data via computer networks, not for medical use; electronically encoded identity wristbands; printed circuit boards bearing electronic components; printed circuit boards and electronic components in the form of injection-molded plastic components; panels bearing printed circuit boards and electronic components. Assembly services; assembly of products and parts and fittings of products for others; custom manufacture and assembly of vehicle bodies and chassis and parts and fittings for the same; custom manufacture and assembly of electronic components for vehicles; custom manufacture and assembly of electronic components for medical devices; custom manufacture and assembly of electronic components for sporting articles and equipment; custom manufacture and assembly of plastic panels; custom manufacture and assembly of molded components. Education; Providing of training; Educational and teaching services; Provision of training courses; Arranging and conducting of classes; Arranging of workshops and seminars; Personnel training; Know-how transfer [training]; Advisory services relating to education. Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software; research and development of new products; technological analysis services; technical measuring and testing; hosting services and software as a service and rental of software; providing on a software as a service basis a software tool for producing products and for managing the production process of products; software maintenance and upkeep.
61.
Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.
B32B 1/00 - Produits stratifiés ayant une forme non plane
B32B 3/00 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme
B32B 3/30 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes caractérisés par une couche comportant des retraits ou des saillies, p. ex. des gorges, des nervures
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
G06F 3/044 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs
B29L 31/34 - Appareils électriques, p. ex. bougies ou leurs parties constitutives
B29C 45/16 - Fabrication d'objets multicouches ou polychromes
62.
System for manufacturing an electromechanical structure
A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
A method of manufacture of a structure includes obtaining or producing a functional electronics assembly including at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substrate film, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material to at least partly embed the at least one electronics component into the first material. The first substrate film is adapted to include a recess defining a volume, and the at least one electronics component is arranged at least partly in the volume.
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/28 - Application de revêtements de protection non métalliques
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
H01L 21/12 - Application d'une électrode à la surface libre du sélénium ou du tellure, après l'apposition du sélénium ou du tellure à la plaque de support
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 23/28 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
H01L 23/52 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre
H01L 23/498 - Connexions électriques sur des substrats isolants
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
A multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics on at least first side thereof, a number of light sources on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, a plastic lightguide layer molded onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent material, and a masking layer provided on the outer surface of the plastic lightguide layer, wherein the masking layer defines a window for letting light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.
G02B 6/00 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage
F21V 8/00 - Utilisation de guides de lumière, p. ex. dispositifs à fibres optiques, dans les dispositifs ou systèmes d'éclairage
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/28 - Application de revêtements de protection non métalliques
65.
Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node
An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
Electrical node (100, 100b, 100c, 200, 200b, 200c, 300, 400, 502, 602, 702, 802, 1404, 404B, 1502, 1504), comprising a substrate (20, 60) for accommodating at least one functional element, preferably an essentially electrical element (12, 14), said substrate having a first side and an opposite second side, said substrate further hosting a number of connecting elements (16, 31) for electrically or electromagnetically, such as inductively, capacitively or optically, connecting the at least one functional element with a circuit of an external structure; the at least one functional element optionally comprising at least one electronic component and further optionally a number of conductive traces connecting thereto, provided to the substrate and optionally projecting from the first side of the substrate; and a first material layer (30) defining a protective covering (10) at least upon said at least one functional element, said first material layer optionally defining at least portion of the exterior surface of the node; wherein the first material layer comprises elastic material arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto, preferably between the connecting elements and at least one element of the external structure, such as a material layer (90) molded, cast or otherwise produced or provided on the node. A related multilayer structure and method of manufacture are presented.
Integrated multilayer structure (100, 200, 300, 400, 600, 700), comprising a substrate film (102) having a first side and an opposing second side; electronics comprising at least one light source (110), optionally a LED, provided upon the first side of the substrate film and a number of electrical conductors (112), preferably printed by printed electronics technology, at least electrically coupled to the at least one light source (110), the at least one light source (110) being configured to emit light in selected one or more frequencies or wavelengths, optionally including visible light; an optically transmissive element (104) comprising thermoplastic optically transmissive, having regard to the selected frequencies or wavelengths, material having a first refractive index and produced, preferably through utilization of molding from said optically transmissive thermoplastic material, onto the first side of the substrate film (102) so as to at least partially embed the at least one light source (110) therewithin; and optical cladding (106, 106a, 106b) comprising material having a lower refractive index than the first refractive index and provided adjacent the optically transmissive element upon the first side of the substrate film (102), wherein the at least one light source, the optically transmissive element and the optical cladding have been mutually configured (702, 704) so as to convey light emitted by the light source (110) within the optically transmissive material of the optically transmissive element, at least portion of the conveyed light undergoing a substantially total internal reflection when incident upon the optical cladding. Related method of manufacture is presented
G02B 6/00 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage
69.
System for manufacturing an electromechanical structure
A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.
H02M 3/156 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation
G05F 1/67 - Régulation de la puissance électrique à la puissance maximale que peut fournir un générateur, p. ex. une cellule solaire
H02J 1/10 - Fonctionnement de sources à courant continu en parallèle
H02M 7/217 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continu sans possibilité de réversibilité par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02J 9/06 - Circuits pour alimentation de puissance de secours ou de réserve, p. ex. pour éclairage de secours dans lesquels le système de distribution est déconnecté de la source normale et connecté à une source de réserve avec commutation automatique
G05F 1/445 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type alternatif utilisant des tubes à décharge ou des dispositifs à semi-conducteurs comme dispositifs de commande finale à dispositifs à semi-conducteurs uniquement constitués par des transistors en série avec la charge
H02M 1/08 - Circuits spécialement adaptés à la production d'une tension de commande pour les dispositifs à semi-conducteurs incorporés dans des convertisseurs statiques
H02J 3/38 - Dispositions pour l’alimentation en parallèle d’un seul réseau, par plusieurs générateurs, convertisseurs ou transformateurs
H05B 45/10 - Commande de l'intensité de la lumière
An electrical node (100), a method, an electrical assembly such as a node strip or sheet, a related multilayer structure and a method of manufacture are presented. The electrical node comprises a first substrate film (10) defining a cavity, and a first material layer (30) arranged to at l east partly fill the cavity, and to embed or at l east partly cover at l east one electrical element (12) arranged into the cavity.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
73.
MULTILAYER STRUCTURE WITH EMBEDDED SENSING FUNCTIONALITIES AND RELATED METHOD OF MANUFACTURE
Integrated multilayer structure suitable for use in sensing applications is presented. The multilayer structure comprises at least one plastic layer (104), at least one film (102, 102B) layer provided on both sides of the plastic layer, said film layer (102) on a first side of the plastic layer comprising electronics (103, 110, 112, 114, 116, 305, 404, 405, 505, 06, 508, 510, 606, 606B, 608, 706, 708, 1010, 1012) incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. Said sensing electronics comprise an electrode and a connection element for connecting the electrode to a control circuitry, and said film layer (102B) on a second side of the plastic layer comprising features (105, 118, 120, 124, 126, 128, 306, 408, 512, 606C, 608C, 710, 810, 1002) including one conductive feature, said features being configured to adapt the sensing response of the sensing electronics on the first side of the plastic layer.
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
74.
METHOD FOR MANUFACTURING A MULTILAYER STRUCTURE WITH EMBEDDED FUNCTIONALITIES AND RELATED MULTILAYER STRUCTURE
Method (300) for manufacturing an integrated multilayer structure, comprising: obtaining (304) a substrate film of selected material and having a first and second side, said substrate film optionally being flexible and/or comprising plastic and/or composite material; providing (308, 310, 312) at least on the first side of the substrate film one or more first functional features, optionally including decorative, informative, other optical, protective, electrical and/or electronic features such as conductors and/or electronic components; arranging (316) at least one layer, preferably at least partially comprising electrically substantially insulating and/or conductive material, optionally plastic material, upon at least the first side of the substrate film; removing (318), optionally selectively and locally, at least a portion of the substrate film so that space (206), optionally comprising a through-hole in the substrate film, is released in the structure, wherein a detachment-enhancing feature provided to the substrate film, is configured to facilitate the removal of said at least portion such that the adjacent remaining film material, if any, the arranged layer and the first functional features are preserved and preferably remain substantially intact; and providing (320) at least one second functional feature into the space released for use so that the at least one second functional feature least functionally, preferably optically, electrically and/or electromagnetically, connects with at least one of said one or more first functional features.
B32B 3/26 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes
B32B 7/06 - Liaison entre couches permettant une séparation sans difficultés
Interface arrangement (1300, 1400, 1500, 1600, 2000), optionally consisting of or comprising an essentially electrical, or specifically, electronic node type component, for providing electrical or electromagnetic connection between an external system (46, 200) and a host structure (300) of the interface arrangement, the interface arrangement comprising a first substrate film (10) defining a cavity; a first material layer (30) arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element (12) at least partly arranged into the cavity, wherein the at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between said external system and electronics of the host structure; and a first connection element (45), preferably arranged at least partly into the cavity, and configured for connecting to the external system (46), wherein the first connection element is further at least functionally connected to the converter element. Related multilayer structure and method of manufacture are presented.
H01R 13/6591 - Caractéristiques ou dispositions spécifiques de raccordement du blindage aux organes conducteurs
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H01R 12/52 - Connexions fixes pour circuits imprimés rigides ou structures similaires se raccordant à d'autres circuits imprimés rigides ou à des structures similaires
H01R 12/71 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires
76.
INTEGRATED MULTILAYER STRUCTURE FOR USE IN SENSING APPLICATIONS AND METHOD FOR MANUFACTURING THEREOF
An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure comprises at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics comprises at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of said plastic layer having a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of said plastic layer and the sensing element being locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.
A method for manufacturing an integrated multilayer structure includes obtaining a substrate film having first and second sides, providing at least on the first side one or more first functional features, arranging at least one layer upon at least the first side; removing, at least a portion of the substrate film so that space is released in the structure wherein a detachment-enhancing feature provided to the substrate film is configured to facilitate the removal of the at least a portion of the substrate film such that the adjacent remaining film material, if any, the arranged layer and the one or more first functional features are preserved and preferably remain substantially intact; and providing at least one second functional feature into the space released for use so that the at least one second functional feature operatively connects with at least one of the one or more first functional features.
H01L 23/485 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes formées de couches conductrices inséparables du corps semi-conducteur sur lequel elles ont été déposées formées de structures en couches comprenant des couches conductrices et isolantes, p. ex. contacts planaires
H01L 23/498 - Connexions électriques sur des substrats isolants
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H01R 13/405 - Fixation d'une manière non démontable, p. ex. par moulage, rivetage
A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.
G06F 3/045 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction utilisant des éléments résistifs, p. ex. une seule surface uniforme ou deux surfaces parallèles mises en contact
B32B 3/30 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes caractérisés par une couche comportant des retraits ou des saillies, p. ex. des gorges, des nervures
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
G06F 3/044 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs
B29C 45/16 - Fabrication d'objets multicouches ou polychromes
B29L 31/34 - Appareils électriques, p. ex. bougies ou leurs parties constitutives
79.
Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.
G06F 3/045 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction utilisant des éléments résistifs, p. ex. une seule surface uniforme ou deux surfaces parallèles mises en contact
B32B 3/30 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes caractérisés par une couche comportant des retraits ou des saillies, p. ex. des gorges, des nervures
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
G06F 3/044 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs
B29C 45/16 - Fabrication d'objets multicouches ou polychromes
B29L 31/34 - Appareils électriques, p. ex. bougies ou leurs parties constitutives
80.
Method for manufacturing an electronic assembly and an electronic assembly
A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
B29C 45/16 - Fabrication d'objets multicouches ou polychromes
G01D 5/24 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier la capacité
H01F 41/04 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants pour la fabrication de bobines
B29L 31/34 - Appareils électriques, p. ex. bougies ou leurs parties constitutives
Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.
G01R 27/26 - Mesure de l'inductance ou de la capacitanceMesure du facteur de qualité, p. ex. en utilisant la méthode par résonanceMesure de facteur de pertesMesure des constantes diélectriques
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
G06F 3/044 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs
82.
MULTILAYER STRUCTURE FOR ELECTRONICS AND RELATED METHOD OF MANUFACTURE
Integrated multilayer structure (100), comprising a substrate film (102) having a first side (102A) and an opposite second side (102B), said substrate film comprising electrically substantially insulating material, a circuit design comprising a number of electrically conductive areas (106) of electrically conductive material on said first and/or second sides of the substrate film, a connector (110) comprising a number of electrically conductive contact elements (118), said connector being provided to the substrate film so that it extends to both said first and second sides of said substrate film and said number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element (112) responsive to mating the external connecting element with the connector on said first or second side of or adjacent to the substrate film, and at least one plastic layer (104, 105), preferably of thermoplastic material, molded onto said first and/or second side of the substrate film so as to at least partially cover the connector and enhance securing of the connector to the substrate film. Corresponding method of manufacture is presented.
An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.
H05K 5/00 - Enveloppes, coffrets ou tiroirs pour appareils électriques
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H05K 3/28 - Application de revêtements de protection non métalliques
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
84.
ARRANGEMENT AND METHOD FOR DELIVERING A CURRENT-CONTROLLED VOLTAGE
H02M 3/156 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation
G05F 1/67 - Régulation de la puissance électrique à la puissance maximale que peut fournir un générateur, p. ex. une cellule solaire
H02J 1/10 - Fonctionnement de sources à courant continu en parallèle
H02M 7/217 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continu sans possibilité de réversibilité par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02J 9/06 - Circuits pour alimentation de puissance de secours ou de réserve, p. ex. pour éclairage de secours dans lesquels le système de distribution est déconnecté de la source normale et connecté à une source de réserve avec commutation automatique
G05F 1/445 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type alternatif utilisant des tubes à décharge ou des dispositifs à semi-conducteurs comme dispositifs de commande finale à dispositifs à semi-conducteurs uniquement constitués par des transistors en série avec la charge
H02M 1/08 - Circuits spécialement adaptés à la production d'une tension de commande pour les dispositifs à semi-conducteurs incorporés dans des convertisseurs statiques
H02J 3/38 - Dispositions pour l’alimentation en parallèle d’un seul réseau, par plusieurs générateurs, convertisseurs ou transformateurs
H05B 33/08 - Circuits pour faire fonctionner des sources lumineuses électroluminescentes
86.
Multilayer structure with embedded multilayer electronics
An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.
G06F 3/044 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs
B29C 45/16 - Fabrication d'objets multicouches ou polychromes
B29C 39/12 - Fabrication d'objets multicouches ou polychromes
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/28 - Application de revêtements de protection non métalliques
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
G06F 3/0488 - Techniques d’interaction fondées sur les interfaces utilisateur graphiques [GUI] utilisant des caractéristiques spécifiques fournies par le périphérique d’entrée, p. ex. des fonctions commandées par la rotation d’une souris à deux capteurs, ou par la nature du périphérique d’entrée, p. ex. des gestes en fonction de la pression exercée enregistrée par une tablette numérique utilisant un écran tactile ou une tablette numérique, p. ex. entrée de commandes par des tracés gestuels
G06F 3/041 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction
G06F 3/0354 - Dispositifs de pointage déplacés ou positionnés par l'utilisateurLeurs accessoires avec détection des mouvements relatifs en deux dimensions [2D] entre le dispositif de pointage ou une partie agissante dudit dispositif, et un plan ou une surface, p. ex. souris 2D, boules traçantes, crayons ou palets
G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur
B29L 31/34 - Appareils électriques, p. ex. bougies ou leurs parties constitutives
87.
Multilayer structure with embedded light source and light-guiding features and related method of manufacture
An integrated multilayer structure including a substrate film having a first side and an opposing second side; electronics including at least one light source, provided upon the first side and a number of electrical conductors, at least electrically coupled to the at least one light source which is configured to emit light in selected one or more frequencies or wavelengths; an optically transmissive element including thermoplastic optically transmissive material having a first refractive index and produced onto the first side of the substrate film so as to at least partially embed the at least one light source therewithin; and optical cladding including material having a lower refractive index than the first refractive index and provided adjacent the optically transmissive element upon the first side of the substrate film.
An electrical node including a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity, wherein the first material layer includes elastic material to reduce thermal expansion related stresses between elements adjacent thereto.
A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
11 - Appareils de contrôle de l'environnement
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
14 - Métaux précieux et leurs alliages; bijouterie; horlogerie
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
19 - Matériaux de construction non métalliques
24 - Tissus et produits textiles
25 - Vêtements; chaussures; chapellerie
28 - Jeux, jouets, articles de sport
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Common metals; common metal alloys; metallic cladding
panels; metallic wall panels; building panels of metal; door
panels of metal; doors of metal; welding and soldering wire. Machine tools; power tools; laundry washing machines;
dishwashers; kitchen machines, electric; mixers [kitchen
machines]; electric kitchen appliances for chopping, mixing,
pressing; machines for the preparation of foodstuffs
[electric, kitchen], other than for cooking; elevators and
parts therefor; agricultural, earthmoving, construction, oil
and gas extraction and mining equipment and parts therefor;
agricultural, gardening and forestry machines and apparatus
and parts therefor. Scientific, optical, weighing, measuring, signalling, and
checking (supervision) apparatus and instruments; apparatus
and instruments for conducting, switching, transforming,
accumulating, regulating or controlling electricity; circuit
boards and electronic components including ink and adhesive
for conducting electricity; apparatus for recording,
transmission or reproduction of sound or images; data
processing equipment, computers; remote control apparatus;
recorded and downloadable computer software; control boards
and panels; sensors and detectors; antennas; electrical
circuits and circuit boards; microprocessors; cases and
housings for electric equipment and computers; covers for
tablets and smartphones; touch screens and panels; display
screens and panels; wearable computers, sensors and
detectors, touch screens and panels, display screens and
display panels, and activity trackers; electronic monitoring
instruments, not for medical use; wearable electronic
equipment that transmit physiological or location data via
computer networks, not for medical use; electronically
encoded identity wristbands; printed circuit boards bearing
electronic components; printed circuit boards and electronic
components in the form of injection-molded plastic
components; panels bearing printed circuit boards and
electronic components. Medical apparatus and instruments and parts and fittings
therefor; electronic monitoring instruments for medical use,
namely, fetal pulse and vital sign monitors; clothing for
medical use; patient monitoring sensors and alarms;
apparatus for monitoring vital signs; pulse meters. Apparatus for lighting, heating, refrigerating, drying,
ventilating, water supply and sanitary purposes and parts
and fittings therefor; lighting panels, light-emitting
diodes (LED) lighting apparatus, lighting apparatus for
vehicles and parts and fittings therefor; food and beverage
cooking, heating, cooling and treatment equipment; freezers;
refrigerators; beverage coolers; kitchen stoves and hot
plates; kitchen ovens; kitchen machines (gas -) for cooking;
coffee machines; electric kettles. Land vehicles and conveyances; air vehicles; water vehicles;
parts and fittings for land, air and water vehicles;
dashboards; upholstery for land, air and water vehicles;
covers for vehicle steering wheels; doors and bumpers for
land, air and water vehicles; bodywork parts for land, air
and water vehicles; body panels for land, air and water
vehicles; interior and exterior panels for land, air and
water vehicles; door panels and roof panels for land, air
and water vehicles; car seats and parts and fittings
therefor. Precious metals; precious metal alloys. Insulation and barrier articles and materials; insulating
panels; acoustic panels for buildings; plastic materials in
the form of panels [semi-finished products]; semi-worked
plastic substances; polymeric membranes for insulation;
electrical insulation articles and materials; carbon fibre
for insulation; fabrics of organic fibres for use as
insulation. Veneers; non-metallic cladding panels; non-metallic wall
panels; building panels, not of metal; door panels, not of
metal; doors, not of metal. Fabrics; textiles and substitutes for textiles; household
textiles; polyester textiles; polymer coated fabrics;
fabrics of organic fibres, other than for insulation. Clothing; headgear; footwear; sports clothing; sports shoes;
wristbands. Sporting articles and equipment and parts and fittings
therefor; covers for sporting articles and equipment; toys,
games, playthings and parts and fittings therefor; covers
for toys, games, playthings; sports training apparatus;
footballs; golf clubs; protective paddings (parts of sports
suits). Custom manufacture and assembly services; manufacture and
assembly of products and parts and fittings of products for
others; custom manufacture and assembly of vehicle bodies
and chassis and parts and fittings therefor; custom
manufacture and assembly of electronic components for
vehicles; custom manufacture and assembly of electronic
components for medical devices; custom manufacture and
assembly of electronic components for sporting articles and
equipment; custom manufacture and assembly of plastic
panels; custom manufacture of molded components. Scientific and technological services and research and
design relating thereto; industrial analysis and research
services; design and development of computer hardware and
software; research and development of new products;
technological analysis services; technical measuring and
testing; hosting services and software as a service and
rental of software; providing on a software as a service
basis a software tool for producing products and for
managing the production process of products; software
maintenance and upkeep.
91.
Interfacing arrangement, method for manufacturing an interfacing arrangement, and multilayer structure hosting an interfacing arrangement
Interface arrangement comprising an electrical node type component for providing electrical or electromagnetic connection between an external system and a host structure of the interface arrangement. The interface arrangement comprising a first substrate film defining a cavity. A first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element at least partly arranged into the cavity. The at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between the external system and electronics of the host structure. A first connection element arranged at least partly into the cavity and configured for connecting to the external system. The first connection element is further at least functionally connected to the converter element. Related multilayer structures and methods of manufacture are presented.
Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.
Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.
An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/28 - Application de revêtements de protection non métalliques
95.
MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE
Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro- optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.
Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.
A method for manufacturing a multilayer structure includes obtaining a first substrate film for accommodating electronics, providing circuitry on at least the second side of the first substrate film, forming the first substrate film to at least locally or more widely exhibit a selected non-planar three-dimensional shape subsequent to providing at least a portion of the circuitry on the at least the second side of the first substrate film, and melding plastic material on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film.
Multilayer assembly for an electronic device includes a substrate film configured to accommodate electronics, said film having the first side and a second side, at least one area light source and configured to emit light of predetermined frequency or frequency band, a molded lightguide layer, the lightguide layer being of optically at least translucent material, wherein the lightguide layer is configured to transmit light emitted by the embedded light source so that the transmitted light propagates within the lightguide layer and is outcoupled therefrom via an outer surface thereof substantially opposite to the embedded light source, and a masking layer provided on the outer surface of the plastic lightguide layer, containing substantially opaque material to block external view of at least some internals of the multilayer structure, wherein the masking layer defines a window for letting the light emitted by the embedded light source and propagated within the plastic lightguide layer to pass through the masking layer towards the environment.
An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.
G06F 3/044 - Numériseurs, p. ex. pour des écrans ou des pavés tactiles, caractérisés par les moyens de transduction par des moyens capacitifs
B29C 45/14 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet en incorporant des parties ou des couches préformées, p. ex. moulage par injection autour d'inserts ou sur des objets à recouvrir
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 3/28 - Application de revêtements de protection non métalliques
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
An electrical node, a method, an electrical assembly such as a node strip or sheet, a related multilayer structure, and a method of manufacture are presented. The electrical node comprises a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element arranged into the cavity.
