Toshiba Hokuto Electronics Corporation

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IPC Class
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls 9
H01J 25/50 - Magnetrons, i.e. tubes with a magnet system producing an H-field crossing the E-field 4
H01J 25/587 - Multi-cavity magnetrons 4
F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction 3
H01J 23/04 - Cathodes 3
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Found results for  patents

1.

Thermal print head and thermal printer

      
Application Number 16213115
Grant Number 10864749
Status In Force
Filing Date 2018-12-07
First Publication Date 2019-06-27
Grant Date 2020-12-15
Owner Toshiba Hokuto Electronics Corporation (Japan)
Inventor
  • Yamauchi, Megumi
  • Noro, Seiichi
  • Doi, Masakatsu
  • Yamamoto, Tsuyoshi
  • Abe, Yoshihide
  • Suzuki, Tomonori
  • Komori, Yuuki

Abstract

According to one embodiment, a thermal print head includes a heat sink; a head substrate placed on the heat sink and having a plurality of heat generating elements arranged in a primary scanning direction; a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit; and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, in which at least one of the first bonding wire and the second bonding wire includes any of a copper wire, a copper alloy wire, and a wire mainly made of copper and coated with a metal different from copper.

IPC Classes  ?

  • B41J 2/35 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads providing current or voltage to the thermal head
  • B41J 2/355 - Control circuits for heating-element selection
  • B41J 2/375 - Protection arrangements against overheating
  • B41J 2/335 - Structure of thermal heads

2.

Magnetron

      
Application Number 16085029
Grant Number 10403467
Status In Force
Filing Date 2016-12-27
First Publication Date 2019-03-14
Grant Date 2019-09-03
Owner Toshiba Hokuto Electronics Corporation (Japan)
Inventor Higashi, Masatoshi

Abstract

To provide a magnetron capable of effectively suppressing a plurality of higher harmonic wave components with a simple configuration. A magnetron 1 is designed so that: a choke part 60 consisting of a first choke 30 and a second choke 32 being a plurality of chokes provided on the inside of a metal sealing body 7 on an output unit 5 are provided to suppress higher harmonic waves; and a plurality of choke grooves 31A, 31B and 31C that correspond to each of higher harmonic wave components larger than the number of the first choke 30 and second choke 32 and different in each frequency are formed by the choke part 60 and the metal sealing body 7.

IPC Classes  ?

  • H05B 6/76 - Prevention of microwave leakage, e.g. door sealings
  • H01J 23/15 - Means for preventing wave energy leakage structurally associated with tube leading-in arrangements, e.g. filters, chokes, attenuating devices
  • H01J 23/54 - Filtering devices preventing unwanted frequencies or modes to be coupled to, or out of, the interaction circuitPrevention of high frequency leakage in the environment
  • H01J 25/50 - Magnetrons, i.e. tubes with a magnet system producing an H-field crossing the E-field

3.

MAGNETRON

      
Application Number JP2016002413
Publication Number 2017/199272
Status In Force
Filing Date 2016-05-17
Publication Date 2017-11-23
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Higashi, Masatoshi

Abstract

The objective of the invention is to provide a low cost magnetron wherein harmonic components may be suppressed effectively. This magnetron comprises a choke (30) that is a separate part from a metal sealing body (7) on an output side. On the metal sealing body (7), a Cu plating metal layer (7C) is provided, whereas on the choke (30), an Sn plating metal layer (30F), which costs less and has a lower melting point than Cu plating, is provided. In this manner, during a brazing step, a portion in tight contact between the Cu plating provided on the metal sealing body (7) and the Sn plating provided on the choke (30) is melted and turned into a Cu-Sn alloy, thereby joining the choke (30) to the metal sealing body (7) in an equivalent manner to when a brazing material is used. Therefore, plating costs and brazing material costs can be suppressed compared to prior art, and harmonic components can be suppressed effectively at low cost compared to prior art.

IPC Classes  ?

  • H01J 23/40 - Coupling devices having distributed capacitance and inductance, structurally associated with the tube, for introducing or removing wave energy to or from the interaction circuit
  • H01J 23/54 - Filtering devices preventing unwanted frequencies or modes to be coupled to, or out of, the interaction circuitPrevention of high frequency leakage in the environment

4.

MAGNETRON

      
Application Number JP2016088826
Publication Number 2017/163524
Status In Force
Filing Date 2016-12-27
Publication Date 2017-09-28
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Higashi, Masatoshi

Abstract

The objective of the invention is to effectively suppress a plurality of high harmonic components via a simple configuration. This magnetron (1) comprises: a choke portion (60) suppressing high harmonics, configured from a first choke (30) and a second choke (32), which are a plurality of chokes provided on the inner side of a metal seal body (7) in an output portion (5); and a plurality of choke grooves (31A), (31B), (31C) formed by the choke portion (60) and the metal seal body (7), and corresponding to each of the high harmonic components having different frequencies and in a larger number than the number of the first choke (30) and the second choke (32).

IPC Classes  ?

  • H01J 23/54 - Filtering devices preventing unwanted frequencies or modes to be coupled to, or out of, the interaction circuitPrevention of high frequency leakage in the environment

5.

LIGHT-EMITTING MODULE

      
Application Number JP2016088318
Publication Number 2017/115712
Status In Force
Filing Date 2016-12-22
Publication Date 2017-07-06
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

A light-emitting module according to the embodiments of the present invention is equipped with: a translucent first insulation film; a conductor layer that is provided to the first insulation film; a second insulation film that is disposed facing the first insulation film; a plurality of light-emitting elements that are disposed between the first insulation film and the second insulation film and are provided, on one surface thereof, with a pair of electrodes connecting to the conductor layer; and a substrate that is connected to the first insulation film and has formed thereon a circuit connecting to the conductor layer.

IPC Classes  ?

  • H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages

6.

LIGHT-EMITTING MODULE

      
Application Number JP2016002650
Publication Number 2016/194370
Status In Force
Filing Date 2016-06-01
Publication Date 2016-12-08
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

A light-emitting module is provided with a light-emitting element having: a flexible first insulation substrate having a plurality of conductive patterns formed in the surface thereof; a first electrode disposed in a first region of a surface facing the first insulation substrate, the first electrode being connected to a first conductive pattern from among the plurality of conductive patterns with a first bump interposed therebetween; and a second electrode disposed in a second region of the surface facing the first insulation substrate, the second region being different from the first region, and the second electrode being connected to a second conductive patter different from the first conductive pattern with a second bump interposed therebetween. The ratio of the distance from the first region to the point of contact between the first bump and the first conductive pattern with respect to the distance from the first electrode to a position at which the outer edge of the first conductive pattern and the outer edge of the second region intersect is 0.1 or greater.

IPC Classes  ?

  • H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
  • F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction
  • F21V 19/00 - Fastening of light sources or lamp holders
  • F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
  • F21Y 101/00 - Point-like light sources

7.

LIGHT-EMITTING MODULE

      
Application Number JP2016002237
Publication Number 2016/178322
Status In Force
Filing Date 2016-04-28
Publication Date 2016-11-10
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

A light-emitting module according to an embodiment of the present invention includes: a first insulating film having optical transparency; a plurality of mesh patterns formed on the first insulating film and including a plurality of first line patterns that are parallel to each other and a plurality of second line patterns that intersect the first line patterns and that are parallel to each other; a light-emitting element connected to two mesh patterns among the plurality of mesh patterns; and a resin layer that secures the light-emitting element to the first insulating film, and at the boundary between a first mesh pattern and a second mesh pattern that are adjacent to each other among the plurality of mesh patterns, a line pattern projecting from the first mesh pattern to the boundary and a line pattern projecting from the second mesh pattern to the boundary are arrayed adjacent to each other along the boundary.

IPC Classes  ?

  • H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
  • F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction
  • F21V 19/00 - Fastening of light sources or lamp holders
  • F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
  • H05K 1/02 - Printed circuits Details

8.

Magnetron

      
Application Number 15049925
Grant Number 09852872
Status In Force
Filing Date 2016-02-22
First Publication Date 2016-06-16
Grant Date 2017-12-26
Owner Toshiba Hokuto Electronics Corporation (Japan)
Inventor Higashi, Masatoshi

Abstract

Provided is a low-cost magnetron that is excellent in productivity without any adverse effect on characteristics. Two large and small strap rings 11 (11A and 11B) are only disposed at lower ends, or input sides, of a plurality of vanes 10 (10A and 10B) in the direction of a tube axis m. Diameter Rip of a protruding flat surface 41 of an input side pole piece 18 is larger than diameter Rop of a protruding flat surface 40 of an output side pole piece 17. Therefore, it is possible to provide a practical magnetron without a significant decrease in productivity or characteristics from a conventional one, while cutting costs by reducing the number of parts with the use of two strap rings on one side.

IPC Classes  ?

  • H01J 23/10 - Magnet systems for directing or deflecting the discharge along a desired path, e.g. a spiral path
  • H01J 25/587 - Multi-cavity magnetrons
  • H01J 25/52 - Magnetrons, i.e. tubes with a magnet system producing an H-field crossing the E-field with an electron space having a shape that does not prevent any electron from moving completely around the cathode or guide electrode
  • H01J 23/22 - Connections between resonators, e.g. strapping for connecting resonators of a magnetron
  • H01J 23/213 - Simultaneous tuning of more than one resonator, e.g. resonant cavities of a magnetron
  • H01J 23/04 - Cathodes

9.

Magnetron

      
Application Number 14950818
Grant Number 09653246
Status In Force
Filing Date 2015-11-24
First Publication Date 2016-06-09
Grant Date 2017-05-16
Owner Toshiba Hokuto Electronics Corporation (Japan)
Inventor Kato, Naoya

Abstract

To provide a magnetron improved in high efficiency and load stability while suppressing costs. By shortening the height of vane Vh so that the ratio of the height of vane Vh to a gap between end hats EHg (EHg/Vh) satisfies a condition 1.12≦EHg/Vh≦1.26, an input side pole piece-vane gap IPpvg becomes larger than an output side pole piece-vane gap OPpvg, and an input side end hat-vane gap IPevg becomes larger than an output side end hat-vane gap OPevg, load stability at high efficiency can be improved while shortening the height of vane Vh. Therefore, it is possible to provide a magnetron improved in high efficiency and load stability while suppressing costs.

IPC Classes  ?

  • H01J 25/50 - Magnetrons, i.e. tubes with a magnet system producing an H-field crossing the E-field
  • H01J 23/04 - Cathodes
  • H01J 25/52 - Magnetrons, i.e. tubes with a magnet system producing an H-field crossing the E-field with an electron space having a shape that does not prevent any electron from moving completely around the cathode or guide electrode
  • H01J 25/587 - Multi-cavity magnetrons
  • H01J 23/05 - Cathodes having a cylindrical emissive surface, e.g. cathodes for magnetrons
  • H01J 23/10 - Magnet systems for directing or deflecting the discharge along a desired path, e.g. a spiral path

10.

LIGHT-EMISSION MODULE AND PRODUCTION METHOD FOR LIGHT-EMISSION MODULE

      
Application Number JP2015004816
Publication Number 2016/047134
Status In Force
Filing Date 2015-09-18
Publication Date 2016-03-31
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

A light-emission module comprising: a first translucent insulator; an electrically-conductive circuit layer provided on the surface of the first translucent insulator; a second translucent insulator arranged facing the electrically-conductive circuit layer; a light-emitting element arranged between the first translucent insulator and the second translucent insulator and connected to the electrically-conductive circuit layer; and a third translucent insulator arranged between the first translucent insulator and the second translucent insulator and having thermosetting properties.

IPC Classes  ?

  • H01L 33/56 - Materials, e.g. epoxy or silicone resin
  • H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

11.

LIGHT-EMISSION MODULE

      
Application Number JP2015004814
Publication Number 2016/047132
Status In Force
Filing Date 2015-09-18
Publication Date 2016-03-31
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

This light-emission module comprises: a first insulating film having light transmission properties; a second insulating film arranged facing the first insulating film; a first double-sided light-emitting element arranged between the first insulating film and the second insulating film and having a pair of electrodes on at least one surface thereof; a second double-sided light-emitting element arranged close to the first double-sided light-emitting element between the first insulating film and the second insulating film, having a pair of electrodes on one surface thereof, and emitting a different light to the first double-sided light-emitting element; and a conductor pattern formed on the surface of the first insulating film and being connected to each electrode on the first double-sided light-emitting element and the second double-sided light-emitting element.

IPC Classes  ?

  • H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
  • H01L 33/52 - Encapsulations

12.

LIGHT-EMISSION MODULE

      
Application Number JP2015004815
Publication Number 2016/047133
Status In Force
Filing Date 2015-09-18
Publication Date 2016-03-31
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

This light-emission module comprises: a first insulating film having light-transmitting properties; a second insulating film arranged facing the first insulating film; a plurality of first double-sided light-emitting elements arranged between the first insulating film and the second insulating film and having a pair of electrodes on one surface thereof; a plurality of second double-sided light-emitting elements arranged close to the first double-sided light-emitting elements between the first insulating film and second insulating film, having a pair of electrodes on one surface thereof, and emitting a different light to the first light-emitting elements; a first conductor pattern formed on the surface of the first insulating film and connecting the first double-sided light-emitting elements in series; a second conductor pattern formed on the surface of the first insulating film and connecting the second double-sided light-emitting elements in series; and a connection section that connects the first conductor pattern and the second conductor pattern.

IPC Classes  ?

  • H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

13.

LIGHT-EMITTING DEVICE

      
Application Number JP2015001600
Publication Number 2015/146115
Status In Force
Filing Date 2015-03-23
Publication Date 2015-10-01
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

 A light-emitting device is provided with: a base having optical transparency; a first light-emitting element that has an electrode formed on one surface only, the electrode being connected to a conductor layer formed on the base; a second light-emitting element that has an electrode formed on one surface only, the electrode being connected to a conductor layer formed on the base, and that emits light of a color different from the color of the light from the first light-emitting element; and a resin layer for retaining the light-emitting elements, with respect to the base.

IPC Classes  ?

  • H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages

14.

LIGHT-EMISSION DEVICE

      
Application Number JP2014005998
Publication Number 2015/083364
Status In Force
Filing Date 2014-12-01
Publication Date 2015-06-11
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

A light-emission device according to an embodiment of the present invention is flexible, and is provided with: a light-emission unit; and external wiring which is connected to the light-emission unit. The light-emission unit is provided with: a pair of insulating substrates which are translucent and flexible; a plurality of light-emission elements which are arranged between the pair of insulating substrates; an internal wiring pattern which is formed on an inside surface of at least one from among the pair of insulating substrates, and which is connected to the light-emission elements; and a resin layer which is provided between the pair of insulating substrates, is translucent, and exhibits insulation properties. Ends of the external wiring are divided into a plurality of wires having a line width narrower than that of the internal wiring. An anisotropic conductive adhesive agent is used to bond ends of the internal wiring pattern, at an end of the insulating substrates, to the ends of the external wiring which have been divided into the plurality of wires.

IPC Classes  ?

  • H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

15.

LIGHT-EMISSION DEVICE, AND PRODUCTION METHOD THEREFOR

      
Application Number JP2014005999
Publication Number 2015/083365
Status In Force
Filing Date 2014-12-01
Publication Date 2015-06-11
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

This light-emission device is provided with: a first translucent support substrate which is provided with a first translucent insulator, and a conductive circuit layer provided to a surface of the first translucent insulator; a second translucent support substrate which is provided with a second translucent insulator, and which is disposed such that a surface of the second translucent insulator faces the conductive circuit layer, and a prescribed gap is formed between the first translucent support substrate and the second translucent support substrate; light-emission diodes which are disposed in the gap between the first translucent support substrate and the second translucent support substrate, and which are each provided with a diode main body, and first and second electrodes that are provided to one surface of the diode main body and are electrically connected to the conductive circuit layer via conductive bumps; and a third translucent insulator which is embedded in the space between the first translucent support substrate and the second translucent support substrate.

IPC Classes  ?

  • H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

16.

LIGHT-EMISSION UNIT, LIGHT-EMISSION DEVICE, AND LIGHT-EMISSION-UNIT PRODUCTION METHOD

      
Application Number JP2014006000
Publication Number 2015/083366
Status In Force
Filing Date 2014-12-01
Publication Date 2015-06-11
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

The present invention is provided with: a first insulation film which is optically transparent, and transmits visible light; a second insulation film which is disposed facing the first insulation film; a plurality of conductor patterns which are formed on a surface of the first insulation film and/or the second insulation film, and which comprise mesh patterns that transmit visible light; a plurality of first light-emission elements which are each connected to two of the plurality of conductor patterns; and a resin layer which is disposed between the first insulation film and the second insulation film, and which supports the first light-emission elements.

IPC Classes  ?

  • H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

17.

LIGHT-EMITTING DEVICE

      
Application Number JP2014005323
Publication Number 2015/068344
Status In Force
Filing Date 2014-10-21
Publication Date 2015-05-14
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

 A light-emitting device (1) according to an embodiment is provided with first and second transparent support substrates (2, 3) with a light-emitting diode (8) being interposed therebetween. The light-emitting diode (8) has a first semiconductor layer (14) provided on a first surface (area of S1) of a substrate (9), a light-emitting layer (16) (area of S2), and a semiconductor layer (15), a pad-shaped first electrode (11) being formed on the second semiconductor layer (15). Where the distance from the first surface of the substrate (9) to the front surface of the first electrode (11) is H, the light-emitting diode (8) has a shape satisfying the relationship "1 ≤ S1/S2 ≤ -(3.46/H) + 2.73."

IPC Classes  ?

  • H01L 33/54 - Encapsulations having a particular shape
  • F21S 2/00 - Systems of lighting devices, not provided for in main groups or , e.g. of modular construction
  • H01L 33/38 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the electrodes with a particular shape
  • F21Y 101/02 - Miniature, e.g. light emitting diodes (LED)

18.

Plasma emission device, and electromagnetic wave generator used therein

      
Application Number 14592188
Grant Number 09648718
Status In Force
Filing Date 2015-01-08
First Publication Date 2015-05-07
Grant Date 2017-05-09
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Kato, Naoya

Abstract

A plasma emission device in an embodiment includes: an electromagnetic wave generator; a waveguide transmitting an electromagnetic wave emitted from the electromagnetic wave generator, an antenna receiving the electromagnetic wave transmitted through the waveguide; an electromagnetic wave focuser which is irradiated with the electromagnetic wave from the antenna; and an electrodeless bulb disposed in the electromagnetic wave focuser. A light-emitting material filled in the electrodeless bulb is excited by the electromagnetic wave focused by the electromagnetic wave focuser to perform plasma emission. The electromagnetic wave generator includes a cathode part and an anode part. A maximum output efficiency of the electromagnetic wave to be generated with an input power of 700 W or less is 70% or more.

IPC Classes  ?

  • H05H 1/46 - Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
  • H01J 65/04 - Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating

19.

MAGNETRON

      
Application Number JP2014004408
Publication Number 2015/029430
Status In Force
Filing Date 2014-08-27
Publication Date 2015-03-05
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Higashi, Masatoshi

Abstract

In the present invention, a large strap ring and a small strap ring (11A, 11B) are disposed only on a lower end side, serving as an input side, of a tube axis (m) direction of a plurality of vanes (10A, 10B), and a diameter (Rip) of a projecting flat surface (41) of an input-side pole piece (18) is made to be larger than a diameter (Rop) of a projecting flat surface (40) of an output-side pole piece (17). Due to the foregoing, it is possible to provide a magnetron that is practical, with no major deterioration of manufacturability or properties as compared to the prior art, while also reducing the number of components and lowering costs by using two strap rings on one side.

IPC Classes  ?

  • H01J 23/20 - Cavity resonatorsAdjustment or tuning thereof
  • H01J 23/10 - Magnet systems for directing or deflecting the discharge along a desired path, e.g. a spiral path
  • H01J 23/22 - Connections between resonators, e.g. strapping for connecting resonators of a magnetron

20.

LIGHT-EMITTING DEVICE AND PRODUCTION METHOD THEREFOR

      
Application Number JP2014001764
Publication Number 2014/156159
Status In Force
Filing Date 2014-03-27
Publication Date 2014-10-02
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

A light-emitting device (1) according to an embodiment of the present invention is provided with first and second translucent insulating bodies (4, 6) and a light-emitting diode (8) that is arranged therebetween. The first and second electrodes (9, 10) of the light-emitting diode (8) are electrically connected to conductive circuit layers (5, 7) that are provided to the surface of at least one of the first and second translucent insulating bodies (4, 6). A third translucent insulating body (13) is embedded between the first translucent insulating body (4) and the second translucent insulating body (6) and has a Vicat softening temperature of 80-160 °C and/or a tensile storage elastic modulus of 0.01-10 GPa.

IPC Classes  ?

  • H01L 33/56 - Materials, e.g. epoxy or silicone resin
  • H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls

21.

LIGHT-EMITTING DEVICE, PRODUCTION METHOD THEREFOR, AND DEVICE USING LIGHT-EMITTING DEVICE

      
Application Number JP2014058747
Publication Number 2014/157455
Status In Force
Filing Date 2014-03-27
Publication Date 2014-10-02
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Maki, Keiichi

Abstract

Provided is a light-emitting device that is characterized by: an area that is sandwiched by a pair of translucent insulator sheets that each comprise a translucent conductive layer or by a translucent insulator sheet that comprises a plurality of translucent conductor layers and a translucent insulator sheet that does not comprise a translucent conductor layer being filled with a translucent elastomer and one or more light-emitting diodes that each comprise a cathode electrode and an anode electrode that are each electrically connected to each of the translucent conductive layers; the translucent elastomer being present in at least part of the interface between the anode electrode and the cathode electrode of the light-emitting diode and the translucent conductive layer; and a recessed section on the surface of the anode electrode and the cathode electrode being filled with the translucent elastomer. The light-emitting device exhibits excellent bending resistance and thermal cycle characteristics during production and use thereof and makes it possible to maintain lighting against strong bending and a strong thermal load. Also provided is a production method for the light-emitting device that is characterized by vacuum pressing at a temperature that is equal to or slightly higher than the Vicat softening temperature of the translucent elastomer.

IPC Classes  ?

  • H01L 33/56 - Materials, e.g. epoxy or silicone resin
  • H01L 33/54 - Encapsulations having a particular shape

22.

PLASMA EMISSION DEVICE, AND ELECTROMAGNETIC WAVE GENERATOR EMPLOYED IN SAME

      
Application Number JP2013004222
Publication Number 2014/010226
Status In Force
Filing Date 2013-07-08
Publication Date 2014-01-16
Owner TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
Inventor Kato, Naoya

Abstract

Provided is a plasma emission device for enhanced emission efficiency, and improved total luminous flux based thereon. The plasma emission device (1) has: an electromagnetic wave generator (2); a waveguide (4) for transmitting electromagnetic waves radiated from the electromagnetic wave generator (2); an antenna (5) for receiving the electromagnetic waves transmitted through the waveguide (4); an electromagnetic wave focuser (6) irradiated by electromagnetic waves from the antenna (6); and an electrodeless valve (7) situated inside the electromagnetic wave focuser (6), and is designed to emit a plasma through excitation, by electromagnetic waves, of a light-emitting substance filling the interior of the electrodeless valve (7). In this plasma emission device (1), the electromagnetic wave generator (2) is provided with a cathode part and an anode part, and the maximum output efficiency of electromagnetic waves generated at an input power of 700 W or less is 70% or greater.

IPC Classes  ?

  • H01J 65/04 - Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating
  • H01J 25/587 - Multi-cavity magnetrons

23.

Magnetron and microwave oven therewith

      
Application Number 13070694
Grant Number 08928223
Status In Force
Filing Date 2011-03-24
First Publication Date 2011-09-29
Grant Date 2015-01-06
Owner Toshiba Hokuto Electronics Corporation (Japan)
Inventor Higashi, Masatoshi

Abstract

A magnetron has an anode cylinder, ten vanes, three strap rings. The ten vanes are fixed to an inner surface of the anode cylinder and arranged in a radial pattern of which center is at an axis of the anode cylinder. Each of the three strap rings connects vanes that are alternatively arranged. A first strap ring and a third strap ring are arranged on a first end of the vanes in a direction of axis, and a second strap ring is arranged on a second end that is opposite to the first end. Outer diameter of the second strap ring is equal to inner diameter of the first strap ring and outer diameter of the third strap ring is equal to inner diameter of the second strap ring.

IPC Classes  ?

  • H01J 25/50 - Magnetrons, i.e. tubes with a magnet system producing an H-field crossing the E-field
  • H01J 23/22 - Connections between resonators, e.g. strapping for connecting resonators of a magnetron
  • H01J 25/587 - Multi-cavity magnetrons

24.

Method for manufacturing thermal head

      
Application Number 12562373
Grant Number 08261431
Status In Force
Filing Date 2009-09-18
First Publication Date 2010-03-25
Grant Date 2012-09-11
Owner
  • Kabushiki Kaisha Toshiba (Japan)
  • Toshiba Hokuto Electronics Corporation (Japan)
Inventor
  • Iino, Daiki
  • Sawada, Masato
  • Ando, Atsunori
  • Kitamura, Shigenori
  • Asakura, Taro

Abstract

A method for manufacturing a thermal head, including: forming a resistance heating element and an electrode on an insulating substrate, the resistance heating element emitting heat by a current flowing the resistance heating element, the electrode being connected to the resistance heating element; forming a corrosion prevention layer on the resistance heating element and the electrode; annealing the resistance heating element; adjusting an electrical resistance of the resistance heating element; and forming a protective layer on the corrosion prevention layer, the protective layer having glass as a main component. The annealing is implemented prior to the adjusting. The forming the corrosion prevention layer is implemented prior to the annealing.

IPC Classes  ?

25.

SOLDERING MATERIAL, LAMP BULB, MAGNETRON AND SOLDERING METHOD

      
Application Number JP2008002467
Publication Number 2009/057239
Status In Force
Filing Date 2008-09-08
Publication Date 2009-05-07
Owner
  • TOSHIBA HOKUTO ELECTRONICS CORPORATION (Japan)
  • TOSHIBA MATERIALS CO., LTD. (Japan)
Inventor
  • Ueda, Makoto
  • Morioka, Tsutomu

Abstract

Disclosed is a soldering material mainly composed of Mo, which does not use Ru that is a rare metal. Specifically disclosed is a soldering material (26, 27) which is composed of 1-3.5 wt% of C, 1-3.5 wt% of B and the balance of Mo.

IPC Classes  ?

  • B23K 35/32 - Selection of soldering or welding materials proper with the principal constituent melting at more than 1550°C
  • B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
  • C22C 27/04 - Alloys based on tungsten or molybdenum
  • H01J 23/04 - Cathodes

26.

Magnetron for microwave oven

      
Application Number 12208760
Grant Number 08525413
Status In Force
Filing Date 2008-09-11
First Publication Date 2009-03-12
Grant Date 2013-09-03
Owner Toshiba Hokuto Electronics Corporation (Japan)
Inventor Higashi, Masatoshi

Abstract

A magnetron for microwave oven has an anode cylinder, vanes (height: H (mm)), a cathode spirally extending along the central axis, a pair of end hats (outer diameter: DEH1 (mm), DEH2 (mm)) fixed to both ends of the cathode, and a pair of pole pieces. Vanes extend from an inner surface of the anode cylinder to the central axis. Free ends of the vanes form a vane inscribing circle (diameter: Da (mm)). Pole pieces expand like funnels from through-holes (inner diameter: DPP1 (mm), DPP2 (mm)) facing to the end hats and pinch the cathode. The shape of the magnetron satisfies, H≦8.5, H/Da≦0.95, DEH1/DPP1≦0.8, DEH1/DPP2≦0.8, DEH2/DPP1≦0.8, DEH2/DPP2≦0.8, 0.92≦Da/DPP1≦0.95, and 0.92≦Da/DPP2≦0.95.

IPC Classes  ?

  • H01J 25/50 - Magnetrons, i.e. tubes with a magnet system producing an H-field crossing the E-field