According to one embodiment, a thermal print head includes a heat sink; a head substrate placed on the heat sink and having a plurality of heat generating elements arranged in a primary scanning direction; a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit; and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, in which at least one of the first bonding wire and the second bonding wire includes any of a copper wire, a copper alloy wire, and a wire mainly made of copper and coated with a metal different from copper.
B41J 2/35 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par l'application sélective de chaleur à un matériau d'impression ou de transfert d'impression sensibles à la chaleur utilisant des têtes thermiques en alimentant la tête thermique en courant ou en tension
B41J 2/355 - Circuits de commande pour la sélection de l'élément chauffant
B41J 2/375 - Dispositions de protection contre la surchauffe
To provide a magnetron capable of effectively suppressing a plurality of higher harmonic wave components with a simple configuration.
A magnetron 1 is designed so that: a choke part 60 consisting of a first choke 30 and a second choke 32 being a plurality of chokes provided on the inside of a metal sealing body 7 on an output unit 5 are provided to suppress higher harmonic waves; and a plurality of choke grooves 31A, 31B and 31C that correspond to each of higher harmonic wave components larger than the number of the first choke 30 and second choke 32 and different in each frequency are formed by the choke part 60 and the metal sealing body 7.
H05B 6/76 - Prévention des fuites de micro-ondes, p. ex. étanchéité des portes
H01J 23/15 - Moyens pour empêcher la déperdition d'énergie ondulatoire structurellement associés avec les dispositifs de traversée du tube, p. ex. filtres, bobines d'arrêt, dispositifs attenuateurs
H01J 23/54 - Dispositifs de filtrage empêchant les fréquences ou les modes indésirables d'être couplés dans ou hors du circuit d'interactionMesures pour empêcher la déperdition haute fréquence dans l'environnement
H01J 25/50 - Magnétrons, c.-à-d. tubes comprenant un système magnétique produisant un champ H qui croise le champ E
The objective of the invention is to provide a low cost magnetron wherein harmonic components may be suppressed effectively. This magnetron comprises a choke (30) that is a separate part from a metal sealing body (7) on an output side. On the metal sealing body (7), a Cu plating metal layer (7C) is provided, whereas on the choke (30), an Sn plating metal layer (30F), which costs less and has a lower melting point than Cu plating, is provided. In this manner, during a brazing step, a portion in tight contact between the Cu plating provided on the metal sealing body (7) and the Sn plating provided on the choke (30) is melted and turned into a Cu-Sn alloy, thereby joining the choke (30) to the metal sealing body (7) in an equivalent manner to when a brazing material is used. Therefore, plating costs and brazing material costs can be suppressed compared to prior art, and harmonic components can be suppressed effectively at low cost compared to prior art.
H01J 23/40 - Dispositifs de couplage à capacité et inductance réparties, structurellement associés au tube pour introduire ou extraire une énergie ondulatoire dans ou à partir du circuit d'interaction
H01J 23/54 - Dispositifs de filtrage empêchant les fréquences ou les modes indésirables d'être couplés dans ou hors du circuit d'interactionMesures pour empêcher la déperdition haute fréquence dans l'environnement
The objective of the invention is to effectively suppress a plurality of high harmonic components via a simple configuration. This magnetron (1) comprises: a choke portion (60) suppressing high harmonics, configured from a first choke (30) and a second choke (32), which are a plurality of chokes provided on the inner side of a metal seal body (7) in an output portion (5); and a plurality of choke grooves (31A), (31B), (31C) formed by the choke portion (60) and the metal seal body (7), and corresponding to each of the high harmonic components having different frequencies and in a larger number than the number of the first choke (30) and the second choke (32).
H01J 23/54 - Dispositifs de filtrage empêchant les fréquences ou les modes indésirables d'être couplés dans ou hors du circuit d'interactionMesures pour empêcher la déperdition haute fréquence dans l'environnement
A light-emitting module according to the embodiments of the present invention is equipped with: a translucent first insulation film; a conductor layer that is provided to the first insulation film; a second insulation film that is disposed facing the first insulation film; a plurality of light-emitting elements that are disposed between the first insulation film and the second insulation film and are provided, on one surface thereof, with a pair of electrodes connecting to the conductor layer; and a substrate that is connected to the first insulation film and has formed thereon a circuit connecting to the conductor layer.
A light-emitting module is provided with a light-emitting element having: a flexible first insulation substrate having a plurality of conductive patterns formed in the surface thereof; a first electrode disposed in a first region of a surface facing the first insulation substrate, the first electrode being connected to a first conductive pattern from among the plurality of conductive patterns with a first bump interposed therebetween; and a second electrode disposed in a second region of the surface facing the first insulation substrate, the second region being different from the first region, and the second electrode being connected to a second conductive patter different from the first conductive pattern with a second bump interposed therebetween. The ratio of the distance from the first region to the point of contact between the first bump and the first conductive pattern with respect to the distance from the first electrode to a position at which the outer edge of the first conductive pattern and the outer edge of the second region intersect is 0.1 or greater.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
F21S 2/00 - Systèmes de dispositifs d'éclairage non prévus dans les groupes principaux ou , p. ex. à construction modulaire
F21V 19/00 - Montage des sources lumineuses ou des supports de sources lumineuses sur ou dans les dispositifs d'éclairage
F21V 23/00 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage
A light-emitting module according to an embodiment of the present invention includes: a first insulating film having optical transparency; a plurality of mesh patterns formed on the first insulating film and including a plurality of first line patterns that are parallel to each other and a plurality of second line patterns that intersect the first line patterns and that are parallel to each other; a light-emitting element connected to two mesh patterns among the plurality of mesh patterns; and a resin layer that secures the light-emitting element to the first insulating film, and at the boundary between a first mesh pattern and a second mesh pattern that are adjacent to each other among the plurality of mesh patterns, a line pattern projecting from the first mesh pattern to the boundary and a line pattern projecting from the second mesh pattern to the boundary are arrayed adjacent to each other along the boundary.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
F21S 2/00 - Systèmes de dispositifs d'éclairage non prévus dans les groupes principaux ou , p. ex. à construction modulaire
F21V 19/00 - Montage des sources lumineuses ou des supports de sources lumineuses sur ou dans les dispositifs d'éclairage
F21V 23/00 - Agencement des éléments du circuit électrique dans ou sur les dispositifs d’éclairage
Provided is a low-cost magnetron that is excellent in productivity without any adverse effect on characteristics.
Two large and small strap rings 11 (11A and 11B) are only disposed at lower ends, or input sides, of a plurality of vanes 10 (10A and 10B) in the direction of a tube axis m. Diameter Rip of a protruding flat surface 41 of an input side pole piece 18 is larger than diameter Rop of a protruding flat surface 40 of an output side pole piece 17. Therefore, it is possible to provide a practical magnetron without a significant decrease in productivity or characteristics from a conventional one, while cutting costs by reducing the number of parts with the use of two strap rings on one side.
H01J 25/52 - Magnétrons, c.-à-d. tubes comprenant un système magnétique produisant un champ H qui croise le champ E dont l'espace électronique présente une forme propre à permettre aux électrons de se mouvoir entièrement autour de la cathode ou de l'électrode de guidage
H01J 23/22 - Connexions entre résonateurs, p. ex. rubans de connexion de résonateurs d'un magnétron
H01J 23/213 - Accord simultané de plusieurs résonateurs, p. ex. cavités résonnantes d'un magnétron
To provide a magnetron improved in high efficiency and load stability while suppressing costs. By shortening the height of vane Vh so that the ratio of the height of vane Vh to a gap between end hats EHg (EHg/Vh) satisfies a condition 1.12≦EHg/Vh≦1.26, an input side pole piece-vane gap IPpvg becomes larger than an output side pole piece-vane gap OPpvg, and an input side end hat-vane gap IPevg becomes larger than an output side end hat-vane gap OPevg, load stability at high efficiency can be improved while shortening the height of vane Vh. Therefore, it is possible to provide a magnetron improved in high efficiency and load stability while suppressing costs.
H01J 25/52 - Magnétrons, c.-à-d. tubes comprenant un système magnétique produisant un champ H qui croise le champ E dont l'espace électronique présente une forme propre à permettre aux électrons de se mouvoir entièrement autour de la cathode ou de l'électrode de guidage
A light-emission module comprising: a first translucent insulator; an electrically-conductive circuit layer provided on the surface of the first translucent insulator; a second translucent insulator arranged facing the electrically-conductive circuit layer; a light-emitting element arranged between the first translucent insulator and the second translucent insulator and connected to the electrically-conductive circuit layer; and a third translucent insulator arranged between the first translucent insulator and the second translucent insulator and having thermosetting properties.
H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
This light-emission module comprises: a first insulating film having light transmission properties; a second insulating film arranged facing the first insulating film; a first double-sided light-emitting element arranged between the first insulating film and the second insulating film and having a pair of electrodes on at least one surface thereof; a second double-sided light-emitting element arranged close to the first double-sided light-emitting element between the first insulating film and the second insulating film, having a pair of electrodes on one surface thereof, and emitting a different light to the first double-sided light-emitting element; and a conductor pattern formed on the surface of the first insulating film and being connected to each electrode on the first double-sided light-emitting element and the second double-sided light-emitting element.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
This light-emission module comprises: a first insulating film having light-transmitting properties; a second insulating film arranged facing the first insulating film; a plurality of first double-sided light-emitting elements arranged between the first insulating film and the second insulating film and having a pair of electrodes on one surface thereof; a plurality of second double-sided light-emitting elements arranged close to the first double-sided light-emitting elements between the first insulating film and second insulating film, having a pair of electrodes on one surface thereof, and emitting a different light to the first light-emitting elements; a first conductor pattern formed on the surface of the first insulating film and connecting the first double-sided light-emitting elements in series; a second conductor pattern formed on the surface of the first insulating film and connecting the second double-sided light-emitting elements in series; and a connection section that connects the first conductor pattern and the second conductor pattern.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
A light-emitting device is provided with: a base having optical transparency; a first light-emitting element that has an electrode formed on one surface only, the electrode being connected to a conductor layer formed on the base; a second light-emitting element that has an electrode formed on one surface only, the electrode being connected to a conductor layer formed on the base, and that emits light of a color different from the color of the light from the first light-emitting element; and a resin layer for retaining the light-emitting elements, with respect to the base.
A light-emission device according to an embodiment of the present invention is flexible, and is provided with: a light-emission unit; and external wiring which is connected to the light-emission unit. The light-emission unit is provided with: a pair of insulating substrates which are translucent and flexible; a plurality of light-emission elements which are arranged between the pair of insulating substrates; an internal wiring pattern which is formed on an inside surface of at least one from among the pair of insulating substrates, and which is connected to the light-emission elements; and a resin layer which is provided between the pair of insulating substrates, is translucent, and exhibits insulation properties. Ends of the external wiring are divided into a plurality of wires having a line width narrower than that of the internal wiring. An anisotropic conductive adhesive agent is used to bond ends of the internal wiring pattern, at an end of the insulating substrates, to the ends of the external wiring which have been divided into the plurality of wires.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
15.
LIGHT-EMISSION DEVICE, AND PRODUCTION METHOD THEREFOR
This light-emission device is provided with: a first translucent support substrate which is provided with a first translucent insulator, and a conductive circuit layer provided to a surface of the first translucent insulator; a second translucent support substrate which is provided with a second translucent insulator, and which is disposed such that a surface of the second translucent insulator faces the conductive circuit layer, and a prescribed gap is formed between the first translucent support substrate and the second translucent support substrate; light-emission diodes which are disposed in the gap between the first translucent support substrate and the second translucent support substrate, and which are each provided with a diode main body, and first and second electrodes that are provided to one surface of the diode main body and are electrically connected to the conductive circuit layer via conductive bumps; and a third translucent insulator which is embedded in the space between the first translucent support substrate and the second translucent support substrate.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
16.
LIGHT-EMISSION UNIT, LIGHT-EMISSION DEVICE, AND LIGHT-EMISSION-UNIT PRODUCTION METHOD
The present invention is provided with: a first insulation film which is optically transparent, and transmits visible light; a second insulation film which is disposed facing the first insulation film; a plurality of conductor patterns which are formed on a surface of the first insulation film and/or the second insulation film, and which comprise mesh patterns that transmit visible light; a plurality of first light-emission elements which are each connected to two of the plurality of conductor patterns; and a resin layer which is disposed between the first insulation film and the second insulation film, and which supports the first light-emission elements.
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
A light-emitting device (1) according to an embodiment is provided with first and second transparent support substrates (2, 3) with a light-emitting diode (8) being interposed therebetween. The light-emitting diode (8) has a first semiconductor layer (14) provided on a first surface (area of S1) of a substrate (9), a light-emitting layer (16) (area of S2), and a semiconductor layer (15), a pad-shaped first electrode (11) being formed on the second semiconductor layer (15). Where the distance from the first surface of the substrate (9) to the front surface of the first electrode (11) is H, the light-emitting diode (8) has a shape satisfying the relationship "1 ≤ S1/S2 ≤ -(3.46/H) + 2.73."
A plasma emission device in an embodiment includes: an electromagnetic wave generator; a waveguide transmitting an electromagnetic wave emitted from the electromagnetic wave generator, an antenna receiving the electromagnetic wave transmitted through the waveguide; an electromagnetic wave focuser which is irradiated with the electromagnetic wave from the antenna; and an electrodeless bulb disposed in the electromagnetic wave focuser. A light-emitting material filled in the electrodeless bulb is excited by the electromagnetic wave focused by the electromagnetic wave focuser to perform plasma emission. The electromagnetic wave generator includes a cathode part and an anode part. A maximum output efficiency of the electromagnetic wave to be generated with an input power of 700 W or less is 70% or more.
H05H 1/46 - Production du plasma utilisant des champs électromagnétiques appliqués, p. ex. de l'énergie à haute fréquence ou sous forme de micro-ondes
H01J 65/04 - Lampes à atmosphère gazeuse portée à la luminescence par un champ électromagnétique extérieur ou par une radiation corpusculaire extérieure, p. ex. lampe indicatrice
In the present invention, a large strap ring and a small strap ring (11A, 11B) are disposed only on a lower end side, serving as an input side, of a tube axis (m) direction of a plurality of vanes (10A, 10B), and a diameter (Rip) of a projecting flat surface (41) of an input-side pole piece (18) is made to be larger than a diameter (Rop) of a projecting flat surface (40) of an output-side pole piece (17). Due to the foregoing, it is possible to provide a magnetron that is practical, with no major deterioration of manufacturability or properties as compared to the prior art, while also reducing the number of components and lowering costs by using two strap rings on one side.
A light-emitting device (1) according to an embodiment of the present invention is provided with first and second translucent insulating bodies (4, 6) and a light-emitting diode (8) that is arranged therebetween. The first and second electrodes (9, 10) of the light-emitting diode (8) are electrically connected to conductive circuit layers (5, 7) that are provided to the surface of at least one of the first and second translucent insulating bodies (4, 6). A third translucent insulating body (13) is embedded between the first translucent insulating body (4) and the second translucent insulating body (6) and has a Vicat softening temperature of 80-160 °C and/or a tensile storage elastic modulus of 0.01-10 GPa.
H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
21.
LIGHT-EMITTING DEVICE, PRODUCTION METHOD THEREFOR, AND DEVICE USING LIGHT-EMITTING DEVICE
Provided is a light-emitting device that is characterized by: an area that is sandwiched by a pair of translucent insulator sheets that each comprise a translucent conductive layer or by a translucent insulator sheet that comprises a plurality of translucent conductor layers and a translucent insulator sheet that does not comprise a translucent conductor layer being filled with a translucent elastomer and one or more light-emitting diodes that each comprise a cathode electrode and an anode electrode that are each electrically connected to each of the translucent conductive layers; the translucent elastomer being present in at least part of the interface between the anode electrode and the cathode electrode of the light-emitting diode and the translucent conductive layer; and a recessed section on the surface of the anode electrode and the cathode electrode being filled with the translucent elastomer. The light-emitting device exhibits excellent bending resistance and thermal cycle characteristics during production and use thereof and makes it possible to maintain lighting against strong bending and a strong thermal load. Also provided is a production method for the light-emitting device that is characterized by vacuum pressing at a temperature that is equal to or slightly higher than the Vicat softening temperature of the translucent elastomer.
Provided is a plasma emission device for enhanced emission efficiency, and improved total luminous flux based thereon. The plasma emission device (1) has: an electromagnetic wave generator (2); a waveguide (4) for transmitting electromagnetic waves radiated from the electromagnetic wave generator (2); an antenna (5) for receiving the electromagnetic waves transmitted through the waveguide (4); an electromagnetic wave focuser (6) irradiated by electromagnetic waves from the antenna (6); and an electrodeless valve (7) situated inside the electromagnetic wave focuser (6), and is designed to emit a plasma through excitation, by electromagnetic waves, of a light-emitting substance filling the interior of the electrodeless valve (7). In this plasma emission device (1), the electromagnetic wave generator (2) is provided with a cathode part and an anode part, and the maximum output efficiency of electromagnetic waves generated at an input power of 700 W or less is 70% or greater.
H01J 65/04 - Lampes à atmosphère gazeuse portée à la luminescence par un champ électromagnétique extérieur ou par une radiation corpusculaire extérieure, p. ex. lampe indicatrice
A magnetron has an anode cylinder, ten vanes, three strap rings. The ten vanes are fixed to an inner surface of the anode cylinder and arranged in a radial pattern of which center is at an axis of the anode cylinder. Each of the three strap rings connects vanes that are alternatively arranged. A first strap ring and a third strap ring are arranged on a first end of the vanes in a direction of axis, and a second strap ring is arranged on a second end that is opposite to the first end. Outer diameter of the second strap ring is equal to inner diameter of the first strap ring and outer diameter of the third strap ring is equal to inner diameter of the second strap ring.
A method for manufacturing a thermal head, including: forming a resistance heating element and an electrode on an insulating substrate, the resistance heating element emitting heat by a current flowing the resistance heating element, the electrode being connected to the resistance heating element; forming a corrosion prevention layer on the resistance heating element and the electrode; annealing the resistance heating element; adjusting an electrical resistance of the resistance heating element; and forming a protective layer on the corrosion prevention layer, the protective layer having glass as a main component. The annealing is implemented prior to the adjusting. The forming the corrosion prevention layer is implemented prior to the annealing.
Disclosed is a soldering material mainly composed of Mo, which does not use Ru that is a rare metal. Specifically disclosed is a soldering material (26, 27) which is composed of 1-3.5 wt% of C, 1-3.5 wt% of B and the balance of Mo.
A magnetron for microwave oven has an anode cylinder, vanes (height: H (mm)), a cathode spirally extending along the central axis, a pair of end hats (outer diameter: DEH1 (mm), DEH2 (mm)) fixed to both ends of the cathode, and a pair of pole pieces. Vanes extend from an inner surface of the anode cylinder to the central axis. Free ends of the vanes form a vane inscribing circle (diameter: Da (mm)). Pole pieces expand like funnels from through-holes (inner diameter: DPP1 (mm), DPP2 (mm)) facing to the end hats and pinch the cathode. The shape of the magnetron satisfies, H≦8.5, H/Da≦0.95, DEH1/DPP1≦0.8, DEH1/DPP2≦0.8, DEH2/DPP1≦0.8, DEH2/DPP2≦0.8, 0.92≦Da/DPP1≦0.95, and 0.92≦Da/DPP2≦0.95.
brevets
