The present invention suppresses a failure caused by an unexpected pressure change in an air path. Specifically, a chip holding device 1, which is for holding a chip 11 so as to be rotatable about an axis in a state where the chip 11 is in vacuum adhesion by using a collet 4, comprises: a holder 2 including a rotary shaft 21 that rotates about the axis and a fixing part 22 that fixes the rotary shaft 21 to a housing H1; an attachment 3 detachably attached to the rotary shaft 21; and the collet 4 provided on the attachment 3. The holder 2 includes: a first air path 5 through which a gas for causing the attachment 3 to vacuum-adhere to the rotary shaft 21 passes; a second air path 6 through which at least one of a gas for causing the chip 11 to vacuum-adhere to the collet 4 and a gas for releasing the vacuum adhesion between the collet 4 and the chip 11 passes; and a suppression structure 7 for suppressing occurrence of a pressure change in one path of the first air path 5 and the second air path 6 due to a pressure change in the other path.
The present invention makes it possible to make an electrode and a contact pin sufficiently electrically continuous on a chip provided with a well for forming a cell membrane. Specifically, a cell membrane chip fixing mechanism 1 comprises: a plate-shaped chip 10 having the vertical direction Z as the thickness direction; a contact pin 70 disposed in the downward direction Zb from the chip 10; and a pressing unit 90 for pressing an upper surface 11 of the chip 10. A well 20 for forming a cell membrane 64 is provided in the upper surface 11 of the chip 10. Electrodes 25 disposed on the well 20 are exposed on a lower surface 12 of the chip 10. The contact pin 70 contacts the electrodes 25 from the downward direction Zb. The pressing unit 90 presses an outer peripheral section 13 and a central section 14 on the upper surface 11 of the chip 10.
Provided is a method for forming an artificial cell membrane chip, the method making it possible to efficiently create a plurality of wells. Specifically, the method for forming an artificial cell membrane chip is for forming an artificial cell membrane chip provided with a plurality of wells that form an artificial cell membrane, the method including: a step for preparing a substrate in which a plurality of recesses are provided in a row in a plate-shaped substrate, and a groove for connecting the recesses to one another is formed between adjacent recesses in the row; and an insertion step for inserting band-shaped sheets into the recesses and the groove. In the insertion step, one of the sheets is inserted into at least two of the recesses and the groove between said recesses, and the sheet separates the recesses into two portions and is provided with a through hole for communicating the two portions. The wells comprise the sheet and the recesses separated into two portions by the sheet.
This invention makes it possible to select a suitable registration pattern for alignment. More specifically, an inspection device 1: registers a registration pattern Pk for alignment from among a plurality of patterns P formed on an inspection target A in a reference image K; detects a detection pattern Pj similar to the registration pattern from among the plurality of patterns formed on the inspection target A in an inspection image; and aligns the inspection image to the reference image on the basis of a location Lj of the detection pattern in the inspection image and a position Lk of the registration pattern Pk in the reference image. The inspection device: causes a plurality of captured images g, obtained by imaging inspection targets for respective products, to overlap with one another with reference to a provisional registration pattern Q provisionally registered from among the plurality of patterns formed on the inspection targets, thereby synthesizing a composite image G; and finds a variation E among the plurality of captured images constituting the composite image in order to determine the suitability of the provisional registration pattern as a registration pattern.
Provided are a mounting device and a mounting method that improve the connection quality between a substrate and a semiconductor chip by suppressing bonding failure between the substrate and the semiconductor chip due to voids while improving image-based positioning accuracy. Specifically, the mounting device comprises: a first attachment 12 on which a substrate α is placed; a second attachment 23 which holds a semiconductor chip β; and a camera 24 which captures images for measuring the position of the substrate α placed on the first attachment 12 and the position of the semiconductor chip β held by the second attachment 23. The second attachment 23 has a plurality of camera through-holes 23c through which an optical axis L of the camera 24 passes, and at least a part of a holding surface 23a for holding the semiconductor chip β protrudes toward the first attachment 12. The camera 24 is configured to image the semiconductor chip β and the substrate α through the camera through-holes 23c.
The purpose of the present invention is to provide a coating device capable of forming an insulating film so as to surround each of electrode films intermittently formed on a predetermined surface of a base material. Specifically, the coating device comprises: a conveyance mechanism that conveys a base material; and a coating mechanism that forms an electrode film and an insulating film by coating a predetermined surface of the base material being conveyed with an electrode material and an insulating material. The coating mechanism has: a main discharge unit that intermittently discharges the electrode material toward the predetermined surface of the base material; a side discharge unit that discharges the insulating material to a position adjacent to or at least partially overlapping both ends of each of electrode films in the width direction, the electrode films being intermittently formed on the predetermined surface of the base material; and a frame discharge unit that intermittently discharges the insulating material to a position adjacent to or at least partially overlapping the ends of each of the electrode films in the conveyance direction of the base material, the electrode films being intermittently formed on the predetermined surface of the base material.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
Provided is an ion current measurement system capable of easily identifying whether an artificial cell membrane chip is to be used for the first time or has already been used. Specifically, the ion current measurement system measures an ion current flowing through an ion channel formed in an artificial cell membrane, using an ion current measurement device for an artificial cell membrane chip including at least one well forming the artificial cell membrane. The artificial cell membrane chip includes a display section at a predetermined site. The ion current measurement device includes an identification means. The identification means recognizes the display section to identify whether the artificial cell membrane chip is to be used for the first time or has already been used.
Provided is an appearance inspection device that can suppress, in advance, the occurrence of defects in element chips that are formed by dicing. Specifically, in this appearance inspection device 100, a control unit 41 performs control in which, among a defect candidate or candidates 213 in a captured image 50, and treating a perimeter line L1 as a reference point, a defect candidate 213 that does not reach a defect determination line L2 but does reach a chipping determination line L3, which is set between the perimeter line L1 and the defect determination line L2, is determined to be chipping for analysis (chipping 213c for determining replacement timing), which is used in an analysis, and detection results regarding the chipping for analysis are reported.
The purpose of the present invention is to provide a drying device in which formation of drying unevenness of a coating film can be suppressed. Specifically, the drying device includes a heating mechanism including a radiation heating part for heating a coating film formed on a conveyed base material by radiation heat, and dries the coating film by heating the coating film by the heating mechanism. The drying device further includes a measurement part for measuring a temperature of the coating film. The heating mechanism is configured to adjust the total sum of heat energy applied to a predetermined portion of the coating film on the basis of a measurement result obtained by the measurement part.
F26B 13/10 - Arrangements for feeding, heating or supporting materialsControlling movement, tension or position of materials
F26B 3/04 - Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour circulating over, or surrounding, the materials or objects to be dried
F26B 3/28 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
F26B 13/04 - Machines or apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement with movement in a straight line using rollers
F26B 23/04 - Heating arrangements using electric heating
F26B 25/00 - Details of general application not covered by group or
10.
ANALYSIS METHOD FOR ION CURRENT AND ION CURRENT ANALYSIS SYSTEM
Provided is an analysis method whereby an analysis can be performed in a short time by appropriately providing a means of analyzing an enormous amount of calculations required for analyzing current data. Specifically, an analysis method for an ion current flowing through an ion channel comprises: an ion current measurement step of measuring an ion current for at least one artificial cell membrane chip; an ion current data storage step of storing the measured ion current data; a transmission step of transmitting the stored ion current data to a server via a network; an analysis step of analyzing the ion current on the server by a predetermined analysis method; and an analysis result storage step of storing the analyzed analysis result on the server, wherein the ion current measurement step and the ion current data storage step are executed on ion current measurement devices, and the server is connected to the at least one of the ion current measurement devices via the network.
C12Q 1/00 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions
G01N 27/26 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variablesInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by using electrolysis or electrophoresis
G01N 27/333 - Ion-selective electrodes or membranes
11.
DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD
Provided are a defect inspection device and a defect inspection method with which it is possible, when detecting a defect in a rectangular element chip, to more accurately detect the defect. Specifically, a defect inspection device comprises: an imaging unit that captures an image of a rectangular element chip 83; and a control unit that detects a defect in a peripheral region 83b of the element chip 83 by acquiring an outer peripheral line L1 and assessment lines L2 and L3 on the basis of a captured image 60 of the element chip 83 captured by the imaging unit. On the basis of a corner region C that is set at a corner of the rectangular element chip 83, the control unit sets the assessment line L3 inside the corner region C by connecting intersections of a boundary line of the corner region C and each of a pair of assessment lines L2 extending along adjacent sides of the element chip 83 such that the intersections are connected closer to an element-formation-region 83a side than in cases where each of the pair of assessment lines L2 is extended.
H01L 21/66 - Testing or measuring during manufacture or treatment
G01N 21/956 - Inspecting patterns on the surface of objects
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
12.
DIFFERENTIAL INTERFERENCE INSPECTION DEVICE AND DIFFERENTIAL INTERFERENCE INSPECTION METHOD
To make it possible to satisfactorily visualize unevenness of an object being inspected through an inspection method in which a differential interference method is used. Specifically, a differential interference inspection device 1 comprises: a prism 10 that separates and branches two polarized lights La, Lb that are orthogonal to each other by a shear amount H; a camera 20 that captures an image G obtained by the polarized lights La, Lb hitting an object Wa being inspected through the prism 10; and a processing unit 30 that inspects the object Wa being inspected on the basis of the image G. The prism 10 can be moved so that a prism position P that corresponds to the shear amount H changes. The processing unit 30 sets a reference value R0 of the prism position P on the basis of the relationship between the absolute value Q of the prism position P and the brightness E of the image G. The prism 10 moves on the basis of a relative value R of the prism position P starting from the reference value R0 of the prism position P.
Provided is a mounting device capable of simultaneously mounting a plurality of chip components on a substrate under mounting conditions suitable for each chip component. Specifically, a mounting device 10 for mounting chip components 8 on a substrate 7 comprises a bonding head 11 for irradiating the plurality of chip components 8 with a laser and mounting the plurality of chip components 8 on the substrate 7. The bonding head 11 has a configuration that allows the beam profile of the laser to be varied so that regions having different irradiation intensities are formed within a laser irradiation region for the plurality of chip components 8, on the basis of predetermined mounting conditions for each chip component 8.
Provided is an element transfer method capable of separating an element from an adhesion layer even when the element has a relatively small thickness and a low weight. Specifically, this semiconductor chip transfer method (element transfer method) comprises: a placement step for placing and laminating, on a transfer substrate 10, an adhesion layer 2, a resist layer 3, and a semiconductor chip 1 in the stated order in a manner that allows mutual attachment; and a transfer step for emitting laser light L toward the transfer substrate 10 from the side reverse to the surface, of the transfer substrate 10, on which the semiconductor chip 1 is placed and deforming the adhesion layer 2 to thereby transfer the semiconductor chip 1 to a transfer-receiving substrate 20. In the transfer step, the adhesion layer 2 and the semiconductor chip 1 are separated as a result of destruction of the resist layer 3 caused by the deformation of the adhesion layer 2.
Provided is a reduced pressure drying device capable of reducing variation in an exhaust flow rate of a gas in a chamber in a plane of a coating film applied on a substrate. Specifically, the reduced pressure drying device is provided within a chamber and includes a support portion 20 for supporting a substrate S and an exhaust port 30 for exhausting air from the chamber. A rectifying plate 40 having an opening 40A is arranged above the substrate, a side plate 50 is arranged on a side of the substrate to shield part of a gap between the support portion and the rectifying plate, and when pressure within the chamber is reduced, the area of the opening provided in the rectifying plate and the area of the gap between the support portion and the rectifying plate that is not shielded by the side plate are adjusted so that the exhaust flow rate of gas becomes uniform in a space above the substrate.
F26B 5/04 - Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
F26B 25/00 - Details of general application not covered by group or
A perovskite film forming method comprises: forming a perovskite film on a substrate; confirming a crystalline state of the perovskite film on the substrate by means of measurement; and adjusting operating condition in the forming of the perovskite film for a subsequent substrate on the basis of measurement result obtained in the confirming of the crystalline state. In the confirming of the crystalline state, a plurality of measurement positions are provided over the entire perovskite film on the substrate and numerical data are acquired for each measurement position to acquire a numerical data distribution of the crystalline state for the entire perovskite film.
H10K 71/12 - Deposition of organic active material using liquid deposition, e.g. spin coating
H10K 30/40 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
A mounting device is provided that is configured to mount a chip component on a substrate. The mounting device includes a mounting head having an attachment tool that is configured to hold the chip component, and a head-side stage that is configured to adjust position and orientation of the attachment tool, a recognition unit configured to acquire an image from a direction perpendicular to a surface of the attachment tool, and a control unit operatively connected to the mounting head and the recognition unit. The control unit is configured to change a rotation angle of the head-side stage a plurality of times to acquire, by the recognition unit, images of a center identification mark provided at a portion movable together with the attachment tool, and configured to calculate a rotational center coordinate of the head-side stage from a plurality of pieces of position information of the center identification mark.
An element transfer device includes a support substrate holding part that holds a support substrate on which an element is supported via an adhesive layer, a laser light irradiation unit that is disposed on a side opposite to a surface on which the element is supported by the support substrate and irradiates laser light toward the support substrate, and a control unit that controls an irradiation position of the laser light irradiated from the laser light irradiation unit. An area of a spot area of the laser light is smaller than an area of a surface of the element supported by the support substrate. The control unit controls the irradiation position of the laser light such that the laser light is irradiated from one end side of the element to the other end side while moving relative to the support substrate.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B23K 26/08 - Devices involving relative movement between laser beam and workpiece
A conveying device comprises a conveying section and at least a pair of conveyor units. The conveying section is configured to convey a strip-shaped substrate in a transport direction. The conveyor units are configured to assist transport of the substrate by the conveying section. The conveyor units each include a belt member with a suction portion to which a prescribed surface of the substrate in a vicinity of corresponding one of widthwise ends of the substrate is configured to be attracted by suction force, the belt member being configured to apply a directional force to the substrate in accordance with a traveling direction of the suction portion, and a traveling direction adjustment unit that is configured to adjust the traveling direction of the suction portion.
Provided are a chip conveyance means and a mounting device that enable reduction in device cost and installation space in conveyance and mounting of a semiconductor chip without causing an electrode surface of the semiconductor chip to come into contact with other substances. Specifically, provided is a chip conveyance means comprising: a tool slider for receiving at a chip supply part and holding a semiconductor chip in a state of being held by an attachment tool, together with the attachment tool; and a conveyance rail for conveying the tool slider to a mounting part. The tool slider: has a function of delivering the semiconductor chip together with the attachment tool to a mounting head of the mounting part, and a function of receiving only the attachment tool after the semiconductor chip is mounted by the mounting head; and is capable of conveying only the attachment tool to the chip supply part along the conveyance rail.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Provided are a chip component mounting device and a chip component mounting method capable of highly accurately adjusting the parallelism of a holding surface of an attachment with respect to a substrate stage. Specifically, the chip component mounting method includes a parallelism adjustment step (step S05) for adjusting the parallelism of a holding surface 43a, and a parallelism measurement step (step S06) for measuring the parallelism of the holding surface 43a. In the parallelism measurement step, the measurement of the parallelism of the holding surface 43a is executed through calculation based on the relationship between: a plurality of positions of the holding surface 43a in the up-down direction measured when the holding surface 43a is pushed against a height reference rod 3 from above each time the position of the height reference rod 3 is horizontally shifted; and the positions of the height reference rod 3 in the corresponding measurements. In the parallelism adjustment step, the adjustment of the parallelism of the holding surface 43a is executed by lowering a bonding head 42 in a state in which the height reference rod 3 is shifted to a horizontal position coordinate (prescribed position) and pushing the holding surface 43a against the height reference rod 3.
Provided is a device manufacturing system and a device manufacturing method that make it possible to accurately arrange an element with respect to the position of a target in a short time. Specifically, a device manufacturing system 100 comprises: a singulating device 100b including a singulation processing unit 20 that forms a plurality of semiconductor chips 1 by singulating an element region formation substrate W having formed therein regions that are to become the semiconductor chips 1, in a state where the element region formation substrate W is disposed in a laminated manner on a release layer R on a transfer substrate T; and a transfer device 100c including a laser light irradiation unit 70 that irradiates the transfer substrate T with laser light L in a Z1 direction opposite to a surface of the transfer substrate T on which the semiconductor chips 1 are disposed so as to release the plurality of singulated semiconductor chips 1 from the transfer substrate T and transfer the plurality of singulated semiconductor chips 1 to a target support substrate G.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
23.
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Provided are a laser processing device and a laser processing method which are capable of performing processing by accurately irradiating a target position with laser light. Specifically, this laser processing device 100 comprises: a laser light irradiation unit 10 that irradiates a wiring pattern 2, which is an object, with laser light L; a visible light imaging unit 20 that acquires a visible light image 50v by imaging a visualization member 50 that generates visible light Lv for position identification at the position irradiated with the laser light L; and a control unit 60 that, on the basis of the position of the visible light Lv for position identification captured in the visible light image 50v, adjusts the relative positions between the irradiation position of the laser light L and the wiring pattern 2 so that the wiring pattern 2 is irradiated with the laser light L, and laser processing is performed on the wiring pattern 2.
A transfer device is configured to irradiate a transfer substrate with active energy rays to transfer an element held by the transfer substrate to a receiving substrate. The transfer device comprises and energy emission unit and an irradiation position control unit. The energy emission unit is configured to intermittently emit the active energy rays. The irradiation position control unit is configured to control irradiation position of the active energy rays emitted from the energy emission unit on the transfer substrate. A time interval for irradiation of the active energy rays onto the transfer substrate is adjusted in accordance with a movement speed of the irradiation position of the active energy rays on the transfer substrate, as controlled by the irradiation position control unit.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The present invention provides a chip vacuum pickup tool (1) that ensures holding force even when picking up a thin and large semiconductor chip (C), and without applying stress that may damage the semiconductor chip (C). Specifically, the present invention provides a chip vacuum pickup tool (1) comprising: a collet (30) having a flat portion (33) that adheres closely to a semiconductor chip (C) and provided with a vacuum suction hole (31) in the flat portion (33), and a holder (20) that holds the collet (30), wherein the holder (20) has a protruding portion (20) provided with a through hole (21) connected to the vacuum suction hole (31) on the surface that holds the collet (30) and a side wall (23) that adheres closely to the perimeter of the collet (30), and a recessed portion (32) that fits with the protruding portion (20) of the holder (20) is formed in the collet (30).
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The purpose of the present invention is to provide a positioning device capable of detecting, at an arbitrary target position, a positioning error of an object to be positioned caused by a change in the attitude angle of a stage. Specifically, the present invention is a positioning device comprising: a base; a stage that is supported by the base and, where an arbitrarily determined movement direction is an X direction, has a planar surface including the X direction and a Y direction orthogonal to the X direction used as a mounting surface, and is moved to an arbitrary position in the X direction; and an X-direction target position detection unit that measures an X-direction target position that is the position of the stage in the X direction relative to the base, and said positioning device places, in an arbitrary position in the X direction, an object to be positioned that is mounted on the mounting surface of the stage. The positioning device comprises at least one of a Z-axis rotation detection unit that detects rotation around the Z-axis, a Y-axis rotation detection unit for detecting rotation around the Y-axis, and an X-axis rotation detection unit that detects rotation around the X-axis.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
B05C 11/00 - Component parts, details or accessories not specifically provided for in groups
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
The present invention provides a mounting device and a positioning method capable of placing chip components at prescribed positions on a substrate with minimal misalignment in the case of mounting the chip components on the substrate by using a stamp that holds a plurality of chip components. Specifically, the present invention provides a mounting device and a positioning method using same, the mounting device comprising a substrate stage that holds a substrate, a stamp that holds a plurality of chip components, a stamp base that holds the stamp, and an imaging means for observing the stamp base and the substrate from the same direction, wherein the stamp and the stamp base are transparent, and the imaging means can acquire position information about the stamp and/or the stamp base along with position information about the substrate at the same time.
Provided is a mounting device that, when a stamp that retains a plurality of chip components is used to mount chip components on a substrate, can evaluate the degree of parallelism of the substrate and the stamp with relative ease and high frequency. Specifically, provided is a mounting device comprising: a substrate stage that retains a substrate; a stamp that retains a plurality of chip components; a stamp base that retains the stamp and raises and lowers the stamp with a surface retaining the chip components facing the substrate; and an optical thickness meter that performs thickness measurement using the reflection of projected light. The mounting device has a function of: projecting light past the stamp base by using the optical thickness meter; and measuring a gap between the surface of the stamp retaining the chip components and a surface of the substrate by using light reflected by the surface of the substrate and light reflected by the surface of the stamp retaining the chip components.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
Provided is a substrate holding device which enables a substrate to be securely suction-attached to a stage. Specifically, the substrate holding device 10 comprises: a stage 11 which has a flat surface 12 on which a substrate W1 is mounted and to which the substrate W1 can be suction-attached; a plurality of support pins 15 which are disposed in a portion 13 of the stage 11 having the flat surface 12 and which have a tip end on which the substrate W1 is mounted; a plurality of outer guide pins 18 which are disposed in a portion of the stage 11 around the flat surface 12; and a pressing member 25 which is capable of descending from a retracted position above the flat surface 12. The support pins 15 can be displaced between an upper position in which the tip end projects upward from the flat surface 12 and a lower position where the tip end is lower than the flat surface 12. The outer guide pins 18 are disposed so as to be capable of contacting the outer peripheral edge of the substrate W1, which is mounted on the support pins 15 displaced to the lower position, from a plurality of directions. The pressing member 25 descends from the retracted position and pushes the substrate W1 onto the flat surface 12.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
30.
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Provided are a laser processing device and a laser processing method that, even when processing is performed with processing laser light including high-frequency laser light, are capable of accurately determining a processing failure on the basis of the laser light energy during the processing. Specifically, a laser processing device 100 acquires a correlation between energy TE of low-frequency laser light LT and a light intensity corresponding value TN, which is a value corresponding to the intensity of the low-frequency laser light LT, and determines, on the basis of the acquired correlation and a processing light intensity corresponding value WN, which is a value corresponding to the intensity of processing laser light LW including high-frequency laser light, a processing failure in processing performed with the processing laser light LW including high-frequency laser light.
Provided are a laser processing device and a laser processing method that are capable of accurately emitting laser light to a target position so as to perform processing on an object. Specifically, the present invention comprises: a laser light emission unit 10 that emits laser light L toward a wiring pattern 2; a visible light camera 30 that acquires a visible light image 60v by imaging a glass substrate 60 which is used to adjust the laser light L irradiation position; an IR camera 20 that acquires a laser light image 70i by imaging the laser light L which is emitted from the laser light emission unit 10 and that acquires an infrared light image 60i by imaging infrared light with which the glass substrate 60 is irradiated; and a control unit 80 that adjusts the relative positions of the laser light L irradiation position and the wiring pattern 2 on the basis of the visible light image 60v, the infrared light image 60i, and the laser light image 70i so that the wiring pattern 2 is irradiated with the laser light L, and that controls laser processing on the wiring pattern 2.
Provided is an appearance inspection device capable of adsorbing and fixing a wafer to a table even when the wafer is warped. Specifically, this appearance inspection device 100 includes: a table 30 for adsorbing a semiconductor wafer W on a mounting surface of the semiconductor wafer W for mounting the semiconductor wafer W and fixing the semiconductor wafer W; and an air blowing part 40 for blowing compressed air onto the semiconductor wafer W. The air blowing part 40 can change a position relative to the table 30, and is configured to blow compressed air so as to press the semiconductor wafer W mounted on the surface of the table 30 against the surface of the table 30 in order to assist in fixing the wafer to the table when the semiconductor wafer W is adsorbed on the mounting surface.
G01N 21/956 - Inspecting patterns on the surface of objects
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
33.
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Provided are a laser processing device and a laser processing method wherein it is possible to accurately irradiate a target location with a laser beam outside of the visible light range to process a workpiece. Specifically, on the basis of a laser beam image 80 that is a captured image of a laser beam L composed of non-visible light outside of the visible light range and was captured by a common wide-area camera 20, and a workpiece image 70 that is a captured image of a wiring pattern 2 and is obtained by imaging visible light, this laser processing device 100 adjusts the irradiation location of the laser beam L such that the laser beam L irradiates the wiring pattern 2 at a processing location P, to perform laser processing of the wiring pattern 2.
Provided are: a manufacturing method for a battery for a secondary battery with which it is possible to reduce manufacturing cost without using a slurry; and a manufacturing device for such a battery for a secondary battery. Specifically, the provided manufacturing method for an electrode for a secondary battery includes: a formation step of forming powder particles 12 in which a binder 17 is coated on a surface of active material particles 16 into a sheet shape on a surface of a current collector 11; and a heating press step of forming an active material layer 14 on the current collector 11 by heating and pressing the powder particles 12 formed into a sheet shape.
Provided is a perovskite film evaluation method with which an evaluation can be performed in-line with good accuracy. Specifically, the perovskite film evaluation method comprises: a step (A) of irradiating a perovskite film with excitation light having an energy greater than a band gap of a perovskite crystal, and acquiring a peak intensity of an emission spectrum of photoluminescence emitted from the perovskite film; a step (B) of irradiating the perovskite film with light having an energy greater than a band gap of a perovskite crystal, and acquiring a transmittance of the perovskite film; and a step (C) of evaluating a crystal state of the perovskite film on the basis of a combination of the peak intensity and the transmittance acquired in the step (A) and the step (B).
G01N 21/27 - ColourSpectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands using photo-electric detection
H02S 50/15 - Testing of PV devices, e.g. of PV modules or single PV cells using optical means, e.g. using electroluminescence
H10K 30/40 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
The present invention suppresses a decrease in temperature of a coating film when transferring a base material from a first drying part to a second drying part. Specifically, a drying apparatus 10 comprises: a first drying part 11 that dries a coating film P applied on a base material W; and a second drying part 12 that further dries the coating film P of the base material W transferred from the first drying part 11. The first drying part 11 includes: a first heating device 21 for heating the coating film P; and a second heating device 22 for raising the atmospheric temperature of the first drying part 11, or heating the base material W or the coating film P at the first drying part 11.
F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
F26B 13/10 - Arrangements for feeding, heating or supporting materialsControlling movement, tension or position of materials
The present invention inhibits position aberration between an inspection image and a reference image in inspecting an inspection target. Specifically, an inspection device 1 compares an inspection image J with a reference image K to thereby inspect an inspection target. For the reference image, a registration pattern Pk is registered. For the inspection image, a detection pattern Pj is detected. The inspection image is aligned with the reference image on the basis of the position of the detection pattern and the position of the registration pattern. For the reference image: a temporary registration pattern Q is temporarily registered among a plurality of patterns P formed for the inspection target; a first pattern candidate T1 and a second pattern candidate T2 which are similar to the temporary registration pattern are searched for; a similarity difference ΔF between the similarity of the temporary registration pattern to the first pattern candidate and the similarity of the temporary registration pattern to the second pattern candidate is compared with a threshold value G; and when the similarity difference is smaller than the threshold value, the temporary registration pattern is not registered as the registration pattern, and when the similarity difference is greater than the threshold value, the temporary registration pattern is registered as the registration pattern.
The present invention provides a mounting device for achieving secure mounting while preventing attachment tool contamination when performing face-down mounting of a chip component onto a board using a pre-applied underfill. Specifically, there is provided a mounting device comprising: a board stage that holds a board; a mounting head that holds a chip component; a lifting means that raises and lowers the mounting head in a direction perpendicular to the board; an imaging means for observing the chip component held by the mounting head; a chip temporary holding unit allowing the chip component to be transferred to and from the mounting head; and a control unit which is connected to the imaging means and which calculates the position of the chip component relative to an attachment tool that forms a surface of the mounting head for holding the chip component.
Provided is a mounting device with which it is possible to suppress variation in temperature when heating an integrated package having a non-uniform thermal conductivity and suppress connection failure of the integrated package to a substrate. Specifically, the present invention comprises: a stage; a pressing unit that presses the substrate and the integrated package; a first attachment that is supported by the stage and comes into contact with one of the substrate and the integrated package; a second attachment that is supported by the pressing unit and comes into contact with the other of the substrate and the integrated package; a first heating unit that heats the first attachment; and a second heating unit that heats the second attachment. At least one of the first heating unit and the second heating unit has a plurality of heating regions based on a distribution of a pressing direction thermal conductivity, which is the thermal conductivity of the integrated package. The plurality of heating regions are configured so as to be able to generate heat at different heat generation amounts per unit time and per unit area.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Provided is a mounting device which is capable of suppressing temperature unevenness caused when an integrated package having a non-uniform thermal conductivity is heated and thereby suppressing a faulty connection of the integrated package to a board. Specifically, the mounting device has: a stage 10 on which at least one from among an integrated package β and a board α is mounted; a pressing unit 23 for pressing the board α and the integrated package β; at least one heater from among a first heater 12 and a second heater 26 for heating the board α and the integrated package β; at least one attachment from among a first attachment 13 and a second attachment 26 which contacts either the board α or the integrated package β. The first attachment 13 and the second attachment 26 have a pressing direction thermal conductivity based on the distribution of the pressing direction thermal conductivity of the integrated packageβ in the moving direction of the pressing unit 23.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A slit die comprises a manifold, a plurality of supply ports, a slit, a discharge port, a shim and a partition portion. The manifold is formed elongated in a width direction. The supply ports are provided in the manifold so as to be arranged in the width direction. The slit is connected to the manifold and is elongated in the width direction. The discharge port discharges the coating liquid from the manifold via the slit. The shim partitions the slit into a plurality of spaces in the width direction to form small slits. The partition portion partitions the manifold into a plurality of spaces in the width direction to form small manifolds. At least one of the supply ports is located in each small manifold. One of the small manifolds connects to one of the small slits.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
The present invention accurately classifies patterns of defects occurring in an object to be inspected. Specifically, a defect classification device 1 includes a classification unit 10 for classifying patterns of defect X occurring in an object W to be inspected that has been imaged so as to be divided into a plurality of visual fields F. The plurality of visual fields include a first visual field F1 and a second visual field F2 adjacent to each other. A first end part F1p on the second visual field side of the first visual field and a second end part F2p on the first visual field side of the second visual field overlap each other. The first visual field includes a first defect X1. The second visual field includes a second defect X2. The classification unit cuts out a region in which the first defect appears in the first visual field as a first defect image C1, and cuts out a region in which the second defect appears in the second visual field as a second defect image C2. When the first defect image includes the first end part and the second defect image includes the second end part, the classification unit classifies the patterns of the defects in a state in which the first defect image and the second defect image are aligned such that the first defect and the second defect overlap.
A lifting head comprises a base member that has a suctioned surface, a raising/lowering shaft supported by the base member and having a raising/lowering axial channel, a contact member fixed to one end of the raising/lowering shaft and contacting with a raising/lowering drive mechanism of a lifting device, a needle support member fixed to the other end of the raising/lowering shaft and supporting a needle, and a needle cap having a stage at one end thereof and fixed to the base member. The suctioned surface of the base member is gripped by a suction force of a first negative pressure passage of an attachment member of the lifting device. While the contact member contacts with the raising/lowering drive mechanism, an inside of the needle cap is suctioned by a suction force of a second negative pressure passage of the raising/lowering drive mechanism via the raising/lowering axial channel.
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
B25J 11/00 - Manipulators not otherwise provided for
B25J 15/04 - Gripping heads with provision for the remote detachment or exchange of the head or parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
44.
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM
Provided is an electronic component mounting method that makes it possible to produce a highly reliable fluxless bond by means of a simple device. According to the present invention, an electronic component mounting method involves bonding a bump 22 formed on a first electrode 21 of a first electronic component 20 to a second electrode 11 of a second electronic component 10 and includes an etching step for etching the first electronic component and the second electronic component with a weakly acidic organic acid to remove an oxide film formed on the surface of the bump and the second electrode and, after the etching step, a bonding step for bonding the bump formed on the first electrode to the second electrode in a state in which the first electronic component and the second electronic component are accommodated in a bonding device 70 and an inert gas has been supplied to the bonding device.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A mounting device comprises an attachment tool configured to hold a surface of a chip component opposite to a surface having a chip recognition mark, a substrate stage configured to holds a substrate, a reflection light source configured to irradiate light containing wavelengths that pass through the chip component from the attachment tool side toward the substrate, and a recognition unit configured to recognize reflected light of the light irradiated by the reflection light source, the recognition unit being configured to acquire an image formed by light that passes through the chip component and is reflected by the substrate, to acquire position information of the substrate recognition mark.
B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
Provided is a variable resistance device that can set a desired resistance value while measuring the resistance value of a variable resistor. Specifically, this variable resistance device 100 comprises: a variable resistor 10 that includes a resistor 11 that has a first terminal t1 and a second terminal t2 and a slider 12 that has a third terminal t3 and is configured such that the position P at which the slider 12 contacts the resistor 11 can be changed; a drive unit 40 that moves and thereby changes the position of the slider 12 as in contact with the the resistor 11; an input-side resistance measurement unit 20 that measures an input-side variable resistance value R1 that is the resistance value between the first terminal t1 and the third terminal t3; and a control unit 30 that, when an output-side variable resistance value R2 that is the resistance value between the second terminal t2 and the third terminal t3 is adjusted to a desired output resistance value, controls the drive unit 40 to change the position at which the slider 12 contacts the resistor 11 on the basis of the input-side variable resistance value R1 measured by the input-side resistance measurement unit 20.
Provided is an element transfer method capable of transferring an element while suppressing breakage of the element caused by deformation of an adhesive layer, even when the element has a relatively small thickness. More specifically, this semiconductor chip transfer method (element transfer method) comprises: an disposition step in which an adhesive layer 2, a resist 3, and a semiconductor chip 1 are disposed in this order on a transfer substrate 10; and a transfer step in which the semiconductor chip 1 is transferred to a transfer-receiving substrate 20 by irradiating the transfer substrate 10 with laser light L from the side opposite to the surface of the transfer substrate on which the semiconductor chip 1 is disposed. The adhesive force between the adhesive layer 2 and the resist 3 is larger than the adhesive force between the resist 3 and the semiconductor chip 1, and thus in the transfer step, the resist 3 remains on the transfer substrate 10 side.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 21/58 - Mounting semiconductor devices on supports
H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
Provided is a coating device that suppresses breakage of a substrate. A coating device (400) is configured so that: a substrate is caused to float on floating stages (420, 460) and a coating stage (440) and thereby be conveyed thereon; and a processing liquid is applied to the substrate on the coating stage (440). The floating stages (420, 460) are disposed on the upstream side and/or the downstream side of the coating stage (440) in the conveyance direction of the substrate. The coating device (400) comprises: measuring instruments (430, 450, 429, 449) for obtaining measured values corresponding to distances between the upper surface of the coating stage (440) and the upper surfaces of the floating stages; and a controller for controlling an actuator for driving the coating stage (440) in the normal direction of the upper surface of the coating stage such that the measured values are within a predetermined range.
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
B05C 3/15 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length not supported on conveying means
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
To provide a slit die that can make a width-direction shape of a coating film more uniform compared to conventional methods, when the coating film is formed in a stripe pattern in the width direction. A slit die is configured to apply a coating liquid on a substrate, the slit die comprising a manifold that is formed elongated in a width direction of the substrate and is a space that is configured to hold the coating liquid, a plurality of supply ports that are provided in the manifold so as to be arranged in the width direction and are configured to supply the coating liquid to the manifold, a slit that is connected to the manifold and is elongated in the width direction, a discharge port that is configured to discharge the coating liquid from the manifold via the slit, a shim that partitions the slit into a plurality of spaces in the width direction and forms small slits, and a partition portion that partitions the manifold into a plurality of spaces in the width direction and forms small manifolds, the partition portion being disposed at a position that partitions the manifold such that at least one of the supply ports is located in each small manifold, and one of the small manifolds connects to one of the small slits.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
Provided is an ion channel analysis device capable of obtaining a mathematical parameter for analyzing a state of an ion channel. Specifically, an ion channel analysis device 1 comprises: a detection unit 20 that detects an ion current I flowing through an ion channel 10; and an analysis unit 30 that acquires first data 40 related to the ion current I detected by the detection unit 20. There is a regression model M using, as teacher data, the known first data 40 and a known mathematical parameter 70 corresponding to the known first data 40. The analysis unit 30 outputs the mathematical parameter 70 corresponding to the input first data 40 by inputting the first data 40 related to the ion current I detected by the detection unit 20 to the regression model M.
Provided is an inspection device capable of obtaining accurate coordinates of a chip provided on a substrate. Specifically, this inspection device comprises: a stage on which a target substrate is placed; a camera that images the target substrate to obtain a captured image; and a controller that calculates a target measurement value of target coordinates of a chip with respect to a target origin of the target substrate on the basis of the distance between an image reference position and the chip in the direction in which pixels are arranged and a relative movement set value between the stage and the camera. The controller corrects the target measurement value by using a projective transformation matrix to calculate a target correction value. The controller calculates an alignment measurement value of the alignment coordinates with respect to an alignment origin of an alignment substrate on the basis of the distance between the image reference position and an alignment mark in the direction in which the pixels are arranged, in a state in which the alignment origin is aligned with the image reference position. The controller calculates a parameter of the projective transformation matrix on the basis of the alignment measurement value and a known alignment actual measurement value.
Provided is a substrate holding device with which substrates of various sizes can be suctioned to a stage. Specifically, a substrate holding device 1 is equipped with a stage 10 for holding a substrate W. The stage 10 includes: a placement surface 60 on which the substrate W is placed; and a plurality of suction grooves 70 formed of recesses provided on the placement surface 60 and arranged concentrically. The suction grooves 70 suck the substrate W by negative pressure. The placement surface 60 includes a boundary portion 61 that intersects with the suction grooves 70. The suction grooves 70 are each divided by the boundary portion 61.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
53.
APPEARANCE INSPECTION DEVICE AND APPEARANCE INSPECTION METHOD
Provided are an appearance inspection device and an appearance inspection method capable of detecting the height of a defect present on the surface of an object without performing additional processing on the object itself. Specifically, this appearance inspection device 100 comprises: an imaging unit 5 that acquires a detection image 20 that is a visible light image in which a semiconductor wafer U and a defect D present in the semiconductor wafer U appear; and a processing unit 1 that detects the height of the defect D with respect to the semiconductor wafer U on the basis of the detection image 20. The imaging unit 5 images a plurality of the detection images 20 while changing the distance between the imaging unit 5 and the semiconductor wafer U. The processing unit 1 is configured to detect the height of the defect D with respect to the semiconductor wafer U on the basis of the degree of variation in pixel values of a defect portion 12, in which the defect D appears, in each of the plurality of detection images 20.
The present invention provides an appearance inspection device capable of acquiring information for appropriately detecting a defective portion in an appearance image showing an object even when the degree of surface roughness is different depending on the object. Specifically, provided is an appearance inspection device 100 comprising: an image acquisition unit 5 that acquires an appearance image 10 of a semiconductor wafer U; and a processing unit 1 that generates a detection image 10c for detecting a defective portion 12 by performing detection filter processing on the appearance image 10. The processing unit 1 is configured to generate the detection image 10c according to the degree of roughness of a surface S of the semiconductor wafer U appearing in the appearance image 10 by performing detection filter processing for reducing detection sensitivity to the defective portion 12 and the defective portion 13 as the degree of roughness of the surface S of the semiconductor wafer U appearing in the appearance image 10 increases.
A coating device comprises a stage, a coater and a dryer. A substrate is configured to be placed on the stage. The coater is configured to eject a coating liquid from a nozzle to form a coating film on the substrate that is placed on the stage while moving relative to the substrate. The dryer is configured to dry the coating film on the substrate. Drying promotion force of the dryer for promoting drying is adjusted on the basis of drying distribution information of the coating film on the substrate in accordance with a region of the coating film.
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
Provided are a wafer dividing method, wafer machining method, and wafer dividing device that make it possible to increase the semiconductor material utilization efficiency, mainly in power semiconductor usages. Specifically, provided is a wafer dividing method for obtaining thin wafers that includes attaching fixing plates to both sides of a wafer comprising at least a semiconductor crystal, and cutting the wafer near the middle in the thickness direction while holding the fixing plates on both sides, thereby obtaining two thin wafers attached to the fixing plates.
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
Provided is a coating device capable of preventing a film thickness distribution of a coating film from changing after the coating film has been formed. Specifically, the device comprises: an attachment stage (10) having an attachment surface (10a) for attaching and holding a substrate (W); a coating unit (20) that applies a coating liquid to the substrate (W) attached to and held by the attachment stage (10) and forms a coating film (M) on the substrate (W); and a drying promotion unit (30) that, after the coating film (M) has been formed, promotes the drying of the coating film (M) on the substrate (W) while the attachment and holding of the substrate by the attachment stage (10) is being maintained.
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B05C 9/14 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating
Provided is a clip device capable of performing a stable gripping operation and a stable gripping state releasing operation in a small installation space even during high-speed conveyance. Specifically, a clip device 100 comprises a gripping clip 10, a closer 20, and an opener 30. The closer 20 and the opener 30 include a first magnet 21 and a second magnet 22, or a first magnet 31 and a second magnet 32. The first magnet 21 or the first magnet 31 is arranged such that the magnetization direction thereof is along a direction towards the gripping clip 10. The second magnet 22 or the second magnet 32 is arranged such that the magnetization direction thereof is orthogonal to the magnetization direction of the first magnet 21 or the first magnet 31 so as to concentrate the magnetic force line thereof on the first magnet 21 or the first magnet 31 side.
B29C 55/08 - Shaping by stretching, e.g. drawing through a dieApparatus therefor of plates or sheets uniaxial, e.g. oblique transverse to the direction of feed
A positioning device is provided for determining a relative position between a substrate and a processing unit that is configured to perform an attachment process, when performing the attachment process at a prescribed position of the substrate. The positioning device comprises a substrate table configured to hold the substrate, a processing position movement mechanism including a driving unit configured to move the substrate table and the processing unit relative to each other, and a braking unit configured to restrict movement, caused by the driving unit, of at least one of the substrate table and the processing unit, and a control unit connected to the driving unit and the braking unit. The control unit is configured to restrict, by using the braking unit, the movement of the at least one of the substrate table and the processing unit during the attachment process.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Provided are a mounting device and a mounting method for relatively easily supplying a mounting head with a semiconductor chip having an activated electrode surface. Specifically, provided are a mounting device and a mounting method using the same, the mounting device comprising: a chip supply unit that picks up a semiconductor chip; a mounting unit that performs face-down mounting of the semiconductor chip picked up by the chip supply unit on a substrate; a chip transport mechanism that transports the semiconductor chip from the chip supply unit to the mounting unit; and a surface treatment means that performs surface activation treatment on an electrode surface of the semiconductor chip in order to improve bondability with an electrode surface of the substrate, the surface treatment means being disposed so as to perform the surface activation treatment on the electrode surface of the semiconductor chip being transported by the chip transport mechanism.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A bonding device is configured to bond a first element and a second element. The bonding device comprises an activating unit configured to activate a first bonding surface, which is a bonding surface of the first element, and a second bonding surface, which is a bonding surface of the second element, and a bonding unit configured to irradiate an active energy ray to cause the first bonding surface and the second bonding surface to come closer and bond with each other, from a state in which the first bonding surface and the second bonding surface face each other with a prescribed gap therebetween.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A transfer device transfers an element held on a transfer substrate to a receiving substrate. The transfer device comprises an energy irradiation unit irradiating an active energy ray toward the element through the transfer substrate in a state in which the transfer substrate and the receiving substrate face each other across the element. The transfer substrate has a blistering layer in which a blister is generated due to irradiation of an active energy ray. The receiving substrate has a capture layer that is arranged facing the transfer substrate. The energy irradiation unit forms the blister in an element holding area to change a tilt of the element relative to the transfer substrate and to bring the element closer to the receiving substrate, thereby causing the a portion of the element to come in contact with the capture layer first, in a state in which the blistering layer holds the element.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A mounting device mounts a chip component having a chip recognition mark and a substrate having a substrate recognition mark. An attachment tool has transparency and has a tool recognition mark. The attachment tool holds a surface of the chip component opposite to a surface having the chip recognition mark. A chip position recognition unit simultaneously acquires position information of the chip recognition mark and of the tool recognition mark. The substrate position recognition unit acquires position information of the substrate recognition mark and of the tool recognition mark. A control unit moves a substrate stage holding the substrate or the attachment tool in the in-plane direction of the substrate on the basis of information obtained by the chip position recognition unit and by the substrate position recognition unit to perform alignment between the chip component and the substrate.
Provided is a mounting apparatus capable of accurately grasping rotational center coordinates at the time of position adjustment, and performing highly accurate positioning when mounting a chip component on a substrate, such as a wiring board. Specifically, a mounting apparatus is provided which comprises: an attachment tool that holds the chip component; a mounting head that has a head-side stage for adjusting the position of the attachment tool in X, Y, and θ directions; a recognition means that acquires an image from a direction perpendicular to the surface of the attachment tool; and a control unit that is connected to the mounting head and the recognition means. A center-identifying mark is provided on a portion associated with the attachment tool. The control unit has the function for: changing the rotation angle of the head-side stage a plurality of times to acquire images of the center-identifying mark by means of the recognition means; and calculating the rotation center coordinates of the head-side stage from a plurality of items of position information on the center-identifying mark.
Provided is a positioning apparatus capable of suppressing the effects of calibration errors on positioning accuracy. Specifically, the positioning apparatus includes: an X-axis movement device and a Y-axis movement device; an imaging device for measuring a movement position; and a control device for outputting a position control signal S to each movement device and acquiring a measured position Pm of an object. The control device performs: first calibration control S1 for calculating a reference calibration value C of a position control signal S on the basis of a target position Pt and the measured position Pm; and second calibration control S2 for selecting a calibration measurement position having the smaller difference from the target position Pt, among an addition-side calibration measurement position Pma and a subtraction-side calibration measurement position Pms that have been moved on the basis of a calibration position control signal Sc calibrated using a temporary calibration value obtained by adding or subtracting a prescribed value to or from the reference calibration value C, and for setting the temporary calibration value used to calculate the calibration position control signal Sc, obtained by moving the object to the selected calibration measurement position, as a new reference calibration value C.
The present invention realizes highly accurate mounting without reducing the takt time in face-down mounting in which electrode surfaces are mounted facing each other. Specifically, provided are a tool slider, a chip slider, and a mounting device, the tool slider being used for conveying an attachment tool that holds a chip component on the lower surface, wherein is a frame is provided that supports the edge of the lower surface of the attachment tool, the frame has suction holes in communication with a reduced pressure flow path on the surface in contact with the attachment tool, and the shape allows the chip component to be housed inside the frame.
The present invention provides: a flux transfer device that reduces, as much as possible, the effects, on takt time, of a transfer process for transferring flux to a bump electrode of a chip component which is held by a mounting head. Specifically, the present invention provides: a flux transfer device comprising a flux transfer unit that has a cavity for storing flux and a transfer unit slide means that can move the flux transfer unit horizontally, wherein when the flux is to be transferred to the bump electrode, the flux transfer unit is made to approach a mounting head such that the cavity is disposed directly under the chip component, and when the mounting head is to mount the chip component, the flux transfer unit is moved so as not to be under the mounting head; and a mounting device comprising the same.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
68.
ELECTRODE MATERIAL, ELECTRODE SLURRY, PRODUCTION METHOD FOR ELECTRODE MATERIAL, ELECTRODE, AND PRODUCTION METHOD FOR ELECTRODE
An electrode material 1 for secondary batteries that suppresses reductions in electrode capacity and has excellent cycle characteristics includes an electrode active material 10. All or a portion of the surface of the electrode active material 10 is coated with a non-aqueous binder 20 in a shell-like manner.
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
H01M 4/36 - Selection of substances as active materials, active masses, active liquids
H01M 4/485 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
The purpose of the present invention is to provide a drying device with which energy consumed when drying a coating film can be reduced to a greater extent than in the past. Specifically, a drying device having a housing part through the interior of which passes a base material on which a coating film is formed, and a supply part that supplies gas into the housing part, a first drying unit and a second drying unit for drying the coating film by heating the coating film being arranged side by side in the housing part, wherein: the first drying unit is provided with a supply part that supplies gas into the housing part of the first drying unit, and a first heating source that indirectly heats the coating film by heating the gas until the gas is supplied from the supply part to the housing part; and the second drying unit is provided with a second heating source that directly heats the coating film in the housing part of the second drying unit.
F26B 13/10 - Arrangements for feeding, heating or supporting materialsControlling movement, tension or position of materials
F26B 3/02 - Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air
F26B 13/02 - Machines or apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement with movement in a straight line
Provided is a drying device capable of sufficiently drying an insulating material while suppressing excessive drying of an electrode material. More specifically, in this drying device, with regard to the electrode material and the insulating material which are applied to the base material, a first drying unit is configured to dry the insulating material.
F26B 3/04 - Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour circulating over, or surrounding, the materials or objects to be dried
F26B 3/28 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
F26B 13/04 - Machines or apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement with movement in a straight line using rollers
F26B 13/10 - Arrangements for feeding, heating or supporting materialsControlling movement, tension or position of materials
Provided is a chip position measuring device capable of accurately correcting measurement errors of the respective acquired positions of all chip components, even when the chip components are arranged with a high density on an actual substrate or when the number of divisions of an imaging region of the actual substrate is very greatly increased. Specifically, in the chip position measuring device 100, a control unit 40 corrects the positions of a plurality of chip components 210 for each of a plurality of actual substrate divided imaging regions 230 on the basis of measurement errors in each of a plurality of master substrate divided imaging regions 330.
Provided are a workpiece-position-adjusting device and a mounting apparatus using the same, the workpiece-position-adjusting device being capable of highly accurate positioning by obtaining a center of rotation at the time of position adjustment with high accuracy for both X-coordinates and Y-coordinates. Specifically provided are a workpiece-position-adjusting device and a mounting apparatus using the same, the workpiece-position-adjusting device comprising a stage for adjusting the position of a workpiece-holding unit in a XY theta direction, and a recognition means for acquiring an image of the workpiece-holding unit. The workpiece-position-adjusting device has a functionality wherein a center identification mark is provided at a portion that is interlocked with the workpiece-holding unit, images of the center identification mark are acquired by the recognition means by driving the stage and changing the rotation angle a plurality of times, and the rotation center coordinates of the stage are calculated from position information of the plurality of center identification marks. The Y-coordinate of the rotation center is obtained by placing the center identification mark at a position that is separated in the X-direction from a provisionally set temporary rotation center, and the X-coordinate of the rotation center is obtained by placing the center identification mark at a position that is separated in the Y-direction from the temporary rotation center.
A positive electrode material for secondary batteries that has exceptional high rate characteristics and cycle characteristics, the positive electrode material containing a positive electrode active material 10 and a crystalline metal oxide 20 that is attached to part of the surface of the positive electrode active material 10.
H01M 4/36 - Selection of substances as active materials, active masses, active liquids
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
The purpose of the present invention is to provide a coating device capable of suppressing dragging of a coating liquid at a coating end part. Specifically, this coating device coats a coating liquid onto a base material to be conveyed, and comprises: a coating part in which a discharge port that is long in a width direction orthogonal to the conveyance direction of the base material, and a coating flow path that is connected to the discharge port and supplies the coating liquid to the discharge port, are formed; and a volume adjusting mechanism for changing the volume of the coating flow path. The volume adjusting mechanism has a volume adjusting part inserted into the coating flow path, and a driving part for adjusting the insertion amount of the volume adjusting part.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
75.
ELEMENT TRANSFER DEVICE AND ELEMENT TRANSFER METHOD
Provided is an element transfer device with which an element can be easily peeled. Specifically, a semiconductor chip transfer device 100 (element transfer device) is provided with: a support substrate holding unit 30 for holding a support substrate 10 on which a semiconductor chip 1 is supported with an adhesive layer 2 therebetween; a laser beam irradiation unit 70 for irradiating the support substrate 10 with laser light L; and a control unit 60 for controlling the irradiation position of the laser light L irradiated from the laser beam irradiation unit 70. The area of a spot region SA of the laser light L is smaller than the area of a surface 1c supported by the support substrate 10 of the semiconductor chip 1. The control unit 60 controls the irradiation position of the laser light L so that, when viewed from a direction perpendicular to the surface of the support substrate 19, the laser light L irradiates the support substrate 10 while moving relative thereto from one end 1a side to the other end 1b side of the semiconductor chip 1.
H01L 21/52 - Mounting semiconductor bodies in containers
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
Provided is a coating device with which it is possible to perform movement control of a movement unit with high accuracy. Specifically, the coating device 10 has: a movement unit 11 that coats a base material W with liquid; a guide device 12 that guides the movement of the movement unit 11; and a cable carrier 13 that supports a cable group 14 including a power line 14a that supplies electric power to the movement unit 11. The movement unit 11 has: a coating unit 16 equipped with a coating head 21 which can move in the guiding direction of the guide device 12 and which ejects liquid; a control unit 17 which can move in the guiding direction independently of the coating unit 16 and which is connected to the cable carrier 13; and a flexible wire harness 18 which connects between the control unit 17 and the coating unit 16 with a slack.
Provided is an image processing method for detecting, when performing imaging inspection on a semiconductor chip or the like having wiring, a defect that is present in an image by eliminating the influence of the wiring. Specifically, provided is an image processing method for detecting an irregular image by performing image processing on an imaging screen having a straight line extending in one direction displayed thereon, the image processing method comprising: a step for acquiring a first processed image obtained by performing smoothing filter processing on the imaging screen using a segment defined by a first number a of pixels arranged along the one direction and a second number b of pixels arranged along a different direction from the one direction; a step for acquiring a second processed image obtained by performing smoothing filter processing on the imaging screen using a segment defined by a third number c of pixels arranged along the one direction and a fourth number d of pixels arranged along the different direction; a step for acquiring a third processed image, which is an image obtained by subtracting the first processed image form the second processed image; and a detection step for detecting an irregular image using the third processed image. a is greater than any of b, c, and d.
The present invention provides a substrate holding device capable of reliably holding a substrate even when the substrate is warped in a convex shape. Specifically, provided is a substrate holding device that supports and holds a lower surface of a substrate. The substrate holding device includes: a central support part that supports a central section of the lower surface of the substrate; an outer periphery support part that supports an outer periphery section of the lower surface of the substrate; and a lifting part that relatively moves the central support part and the outer periphery support part in the thickness direction of the substrate. The outer periphery support part has a substrate outer periphery suctioning part that suctions the substrate. The central support part has a substrate center suctioning part that suctions the substrate, and a section of the central support part that is brought into contact with the lower surface of the substrate is curved in a convex shape.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided is a vent tank that makes it possible for an application liquid, which has been discharged into the vent tank through air vent processing, to be reused in a clean state. Specifically, a vent tank 10, which recovers an application liquid discharged from an applicator 20, comprises: a tank body 11 that stores the application liquid; vent piping 12 that is inserted into the tank body 11 and guides, to the tank body 11, the application liquid discharged from the applicator 20; and a cleaning nozzle 13 that is inserted into the tank body 11 and ejects a cleaning liquid into the tank body 11. The cleaning nozzle 13 is provided with a nozzle part 13a that ejects the cleaning liquid into the tank body 11 omnidirectionally.
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
The purpose of the present invention is to provide a transport device capable of adjusting the position of an end of a substrate in a width direction thereof. Specifically, the transport device comprises a transport unit that transports a strip-shaped substrate in a longitudinal direction, and at least one pair of conveyor units that assist the transport unit in transporting the substrate, and each run a belt member in a state in which a predetermined surface of the substrate transported by the transport unit is adhered to an adhesive unit formed on the belt member, thereby sending the substrate in a traveling direction of the adhesive unit to which the substrate is adhered, wherein the pair of conveyor units are arranged so as to adhere the predetermined surface of the substrate to the adhesive unit of the belt member in the vicinity of either end of the substrate in the width direction of the substrate, and the pair of conveyor units are provided with a traveling direction adjustment unit for adjusting the traveling direction of the adhesive portion of each belt member.
There has been a case where, even if uneven patterns on the surface of a substrate are highlighted by a differential interference microscope, cracks formed in a surface of the substrate cannot be easily recognized visually. The present invention makes it easy to visually recognize cracks formed in the surface of a substrate in observing the surface of the substrate by using a differential interference optical method. Specifically, an observation device 1 observes a surface W1 of a substrate W. The observation device 1 comprises: a holding unit 20 that holds the substrate W; and a differential interference microscope 10 that projects the surface W1 of the substrate W held by the holding unit 20 and acquires an image G. The holding unit 20 holds the substrate W in a bent state.
Provided is a three-dimensional modeling method for a core-shell system, in which, in a step for curing a core material, molding defects caused by gases emitted from the core material can be prevented, and deformation of the shell can be suppressed. Specifically, this three-dimensional modeling method includes: a shell modeling step for using a shell material to model a shell that defines the external shape of a three-dimensional model; a core material filling step for filling a liquid-phase core material into a core section, which is a section enclosed by the inner surface of the shell; and a core material curing step for curing the core material inside the core section. The method also includes a core section sealing step for sealing an opening in the core section by leaving an uncured region of the shell material on the upper surface of the core material filled into the core section. The core material curing step is performed after the core section sealing step.
B29C 64/135 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
B29C 64/379 - Handling of additively manufactured objects, e.g. using robots
tiiii in neighboring fields of view. An imaging picture of a prescribed pattern inside the overlap area is recorded as an alignment mark to be utilized for a neighbor field of view, and an inspection picture is created in the neighbor field of view with the imaging position of the recorded alignment mark as a reference.
The present invention addresses the problem of precisely classifying a pattern of a defect that has occurred in an inspection object. Specifically, an automatic defect classification device 1 classifies a pattern of a defect X that has occurred in an inspection object W. The inspection object W is imaged so as to be divided into a plurality of mutually adjacent visual fields F. In a case in which a defect X is included on the perimeter F1a of a first visual field F1 as an arbitrary visual field FA that is one visual field F among the plurality of visual fields F, and the defect X is included on the perimeter F2a of a second visual field F2 as an adjacent visual field FB that is another visual field F adjacent to the first visual field F1 (arbitrary visual field FA) among the plurality of visual fields F, the automatic defect classification device 1 classifies a pattern of the defect X in a state in which the first visual field F1 (arbitrary visual field FA) and the second visual field F2 (adjacent visual field FB) are combined.
The present invention relates to a ring-type illumination device for dark-field observation, wherein the illumination density of light with respect to a subject region on an object being inspected is improved, and variation in brightness is suppressed. Specifically, this ring-type illumination device 2 carries out dark-field observation with respect to a subject region A on an object being inspected W. The ring-type illumination device 2 comprises a ring-shaped ring member 10. The ring member 10 is disposed so that a central hole 12 faces the target region A and so that a circumferential part 11 is located farther circumferentially outward than the target region A. The circumferential part 11 is provided with an exit opening 13, which is disposed spanning the entire circumference of the circumferential part 11 and through which light L exits obliquely relative to the target region A. Optical elements 20, 21 that diffuse the light L in the circumferential direction of the ring member 10 are provided between the exit opening 13 and the target region A.
National Institute of Maritime, Port and Aviation Technology (Japan)
Toray ENGINEERING CO., LTD. (Japan)
Toray Engineering D Solutions Co., Ltd. (Japan)
Inventor
Itakura, Daisuke
Furuichi, Kenji
Ishihara, Ryoichi
Uchida, Yoshihiro
Matsuo, Tsuyoshi
Sawada, Satoshi
Hyakusai, Akira
Abstract
A method for molding analysis of a plate-like intermediate base material containing resin and reinforcing material when the base material is molded, including applying a base material model having anisotropy between out-of-plane direction and an in-plane direction orthogonal to the out-of-plane direction, and calculating viscosity distribution in a cross-section direction of a molded article using each viscosity in accordance with a flow field, and the viscosity distribution indicates that under a boundary condition there is no slip flow of the base material on a wall surface of the mold, as a result of a shear field in the vicinity of the wall surface, a low viscosity layer that is more affected by an out-of-plane shear viscosity than a central portion of the base material is automatically formed in the vicinity of the wall surface, and the base material in the vicinity of the wall surface functions as a lubricating layer.
The present invention provides a transfer substrate holding device, a transfer device, and a transfer method which make it possible to accurately transfer, to a transfer-receiving substrate, an element held by a flexible transfer substrate. Specifically, provided is a transfer substrate holding device 13 that holds the rear surface side of a flexible transfer substrate 22, which holds an element 21 on the front surface side thereof, in order to irradiate the transfer substrate 22 with active energy rays 11, wherein: at a portion that faces an element holding region 22c, which is a region of the transfer substrate 22 where the element 21 is held, provided is a transmission part 13b that transmits active energy rays 11, from a transfer substrate facing surface 13a which faxes the transfer substrate 22 to a surface on the opposite side from the transfer substrate facing surface 13a, and that makes contact with the transfer substrate 22; and a clamping region 17 for producing a clamping force to clamp and hold the transfer substrate 22 is provided outside the transmission part 13b on the transfer substrate facing surface 13a side.
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided is a transfer device whereby portions irradiated with an actinic energy beam can be prevented from being overly crowded. Specifically, provided is a transfer device 10 that irradiates a transfer substrate 22 with an actinic energy beam 11 to thereby transfer an element 21 held by the transfer substrate 22 to a receiving substrate 23. The transfer device 10 is equipped with an energy emission part 12 which intermittently emits an actinic energy beam 11 and an irradiation position control unit 15 which controls positions where the transfer substrate 22 is to be irradiated with the actinic energy beam 11 emitted from the energy emission part 12. Time intervals between operations of irradiating the transfer substrate 22 with the actinic energy beam are regulated in accordance with the traveling speed of the position where the transfer substrate 22 is to be irradiated with the actinic energy beam 11 according to control by the irradiation position control unit 15.
H01L 21/52 - Mounting semiconductor bodies in containers
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
89.
STRUCTURE MANUFACTURING DEVICE AND STRUCTURE MANUFACTURING METHOD
This structure manufacturing device comprises a slurry supply part that supplies a slurry to one end surface of a porous substrate, and a slurry suction part that suctions the slurry supplied to the porous substrate through the other end surface of the porous substrate. The structure manufacturing device also comprises a shielding part that covers the outer-peripheral surface of the porous substrate in a state of being set apart from the outer-peripheral surface so that inflow of air to the interior through the outer-peripheral surface is blocked.
Provided is a transfer method that, during transfer of an element using blistering, enables the element to be transferred from a transfer substrate to an accurate position on a substrate to be transferred onto. Specifically, the transfer method comprises: a transfer preparation step in which, in a state in which a predetermined element 21 is being held by a transfer substrate 22 with the distance between the transfer substrate 22 and a substrate 23 to be transferred onto being a first distance d1, the transfer substrate 22 and the substrate 23 to be transferred onto are opposed to each other so as to sandwich the predetermined element 21; a transfer step in which a blister 30 is caused to occur on the transfer substrate 22 in the vicinity of the position in which the predetermined element 21 is being held, thereby causing the predetermined element 21 and the substrate 23 to be transferred onto to become closer to each other to cause the predetermined element 21 to be held by the substrate 23 to be transferred onto; a substrate spacing step in which the distance between the transfer substrate 22 and the substrate 23 to be transferred onto is increased to a second distance d2 greater than the first distance d1; an alignment-direction movement step in which the transfer substrate 22 and the substrate 23 to be transferred onto are caused to move relatively in a direction in which elements 21 are aligned on the transfer substrate 22; and a substrate approaching step in which the distance between the transfer substrate 22 and the substrate 23 to be transferred onto is returned to the first distance d1.
The present invention uses a virtual defect to realistically reproduce an actual defect that occurs in an object being inspected. Specifically, a defect image processing device 1: uses a captured image 2a of an object 2 being inspected as a background 20 to display, with a plurality of pixels P, a virtual defect drawn image 10 in which a virtual defect 30 is drawn on the background 20; further divides a boundary pixel Pa into a plurality of subpixels S, the boundary pixel Pa being a pixel P that includes a boundary 11 between the virtual defect 30 and the background 20 among the plurality of pixels P; determines a ratio (n2:n3) between the number n2 of subpixels S that belong to the background 20 and the number n3 of subpixels S that belong to the virtual defect 30 in the boundary pixel Pa; calculates a luminance L1 of the boundary pixel Pa on the basis of a luminance L2 of the background 20 and a luminance L3 of the virtual defect 30, and the ratio (n2:n3); and compresses the plurality of subpixels S obtained through the division into the boundary pixel Pa.
According to the present invention, an actual defect occurring in an inspected object is reproduced realistically using a virtual defect. Specifically, a defect image processing device 1 displays a virtual defect rendered image 10 in which a virtual defect 30 is rendered on a background 20 using a plurality of pixels P, where a captured image 2a of an inspected object 2 is used as the background 20, wherein a filter 40 determining an influence imparted to a luminance Li of one pixel Pi among the plurality of pixels P by luminances Lj of other surrounding pixels Pj is prepared, and in the virtual defect rendered image 10, the luminance Li of the one pixel Pi can be adjusted through the filter 40 by means of the influence of the luminances Lj of the other surrounding pixels Pj.
A chemical solution synthesis device comprises a chemical solution holding unit, a reaction vessel, a first chemical solution feed unit, a chemical solution feed and discharge unit, and a second chemical solution feed unit. The chemical solution holding unit is configured to hold a chemical solution. The chemical solution and carriers are reacted in the reaction vessel. The chemical solution is transferable from the chemical solution holding unit to the reaction vessel without coming into contact with atmosphere. The first chemical solution feed unit is connected to the reaction vessel and configured to supply the chemical solution to the reaction vessel. The chemical solution feed and discharge unit is provided vertically above the first chemical solution feed unit. The second chemical solution feed unit is configured to suppress adhesion of the carriers to the reaction vessel.
A collet replacement mechanism for replacing a collet of a pickup tool that is configured to pick up chip components by suction using the collet comprises an attachment configured to hold the collet on a bottom surface thereof, an attachment holder disposed at a lower part of the pickup tool and configured to hold an upper part of the attachment by magnetic force, and an attachment storage unit having a guide that is configured to latch the attachment to store the attachment, the attachment being detachable from the attachment holder in a state of being latched to the guide.
The purpose of the present invention is to provide a drying system that is capable of improving solvent collection capacity over the prior art. Specifically, provided is a drying system comprising a plurality of drying units that each have a housing part through the inside of which passes a base material having a coating formed thereon, and that each heat the coating by introducing heated gas into the housing part to vaporize the solvent, and a plurality of solvent collection units that cool a gas containing the solvent discharged from the drying units to liquefy and collect the solvent, and a circulation path that is for circulating the gas between the drying units and the solvent collection units. The drying units are provided such that the respective housing parts thereof are in communication along a transfer route of the base material. A connecting path for sending gas cooled by a solvent collection unit to another solvent collection unit is provided between at least one set of solvent collection units among the plurality of solvent collection units.
F26B 15/00 - Machines or apparatus for drying objects with progressive movementMachines or apparatus with progressive movement for drying batches of material in compact form
F26B 21/04 - Circulating air or gases in closed cycles, e.g. wholly within the drying enclosure partly outside the drying enclosure
A coating device is provided with a stage on which a substrate is configured to be placed, an applicator movably arranged relative to the substrate placed on the stage and configured to discharge a coating liquid from a nozzle to form a coating film on the substrate, and a dryer having an air supply port with at least one porous member. The dryer is configured to dry the coating film formed on the substrate by the applicator by supplying air to the coating film from the air supply port. The at least one porous member is configured and arranged to suppress formation of local variations in an amount of air supplied from the air supply port.
B05C 9/12 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
B05D 3/04 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
Provided is a mounting device that acquires position information about a substrate recognition mark and achieves highly accurate mounting, even when a chip component covers the substrate recognition mark in facedown mounting. Specifically, provided is a mounting device comprising: an attachment tool that holds a surface of a chip component opposite to a surface having a chip recognition mark; a substrate stage that holds a substrate; a reflective light source that emits, toward the surface of the substrate from the attachment tool side, light containing a wavelength which is transmitted through the chip component; and a recognition means for recognizing reflected light of the light emitted by the reflective light source, wherein the recognition means acquires an image formed by the light that has been transmitted through the chip component and reflected at the substrate, and acquires position information about the substrate recognition mark.
A coating device comprises a die with a slit that is longer in a width direction and discharges a coating liquid to form a coating film on a substrate, a first flow path that supplies the coating liquid toward the die, a first manifold that is linked to the first flow path and holds the coating liquid that flows in from the first flow path, a plurality of second flow paths that are linked to the first manifold, a second manifold that is linked to the second flow paths and the slit, is longer in the width direction, and holds the coating liquid that flows in from the second flow paths, and an adjustment unit that is provided along at least one of the second flow paths and adjusts a flow of the coating liquid flowing through the at least one of the second flow paths.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
99.
METHOD FOR FORMING PEROVSKITE FILM AND APPARATUS FOR FORMING PEROVSKITE FILM
The present invention provides a method for forming a perovskite film and an apparatus for forming a perovskite film, each of which enables the achievement of a perovskite solar cell that has a stable power generation efficiency. Specifically, this method for forming a perovskite film comprises: a film formation step in which a perovskite film is formed on a substrate; a crystalline state checking step in which the crystalline state of the perovskite film on the substrate is checked by means of measurement; and a condition adjustment step in which the working conditions in the film formation step for the following substrates are adjusted on the basis of the measurement results of the crystalline state checking step. In the crystalline state checking step, a numerical data distribution of the crystalline state of the entirety of the perovskite film is acquired by setting a plurality of measurement positions over the entirety of the perovskite film on the substrate and acquiring numerical data at each one of the measurement positions.
H10K 30/40 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
H10K 71/70 - Testing, e.g. accelerated lifetime tests
H10K 85/50 - Organic perovskitesHybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3
Provided is a coating device which makes it possible to prevent the crystal state of a formed coating film from becoming non-uniform. More specifically, a coating device is provided, which is provided with a stage on which a substrate is mounted, an application device which ejects a coating solution through a nozzle to form a coating film on the substrate while moving relatively to the substrate mounted on the stage, and a dryer which dries the coating film on the substrate, in which the dryer has such a configuration that a drying-promoting force for promoting drying from drying distribution information about the coating film on the substrate is controlled in accordance with position on the coating film.
B05C 9/12 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
