Provided is a mounting device with which it is possible to suppress variation in temperature when heating an integrated package having a non-uniform thermal conductivity and suppress connection failure of the integrated package to a substrate. Specifically, the present invention comprises: a stage; a pressing unit that presses the substrate and the integrated package; a first attachment that is supported by the stage and comes into contact with one of the substrate and the integrated package; a second attachment that is supported by the pressing unit and comes into contact with the other of the substrate and the integrated package; a first heating unit that heats the first attachment; and a second heating unit that heats the second attachment. At least one of the first heating unit and the second heating unit has a plurality of heating regions based on a distribution of a pressing direction thermal conductivity, which is the thermal conductivity of the integrated package. The plurality of heating regions are configured so as to be able to generate heat at different heat generation amounts per unit time and per unit area.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Provided is a mounting device which is capable of suppressing temperature unevenness caused when an integrated package having a non-uniform thermal conductivity is heated and thereby suppressing a faulty connection of the integrated package to a board. Specifically, the mounting device has: a stage 10 on which at least one from among an integrated package β and a board α is mounted; a pressing unit 23 for pressing the board α and the integrated package β; at least one heater from among a first heater 12 and a second heater 26 for heating the board α and the integrated package β; at least one attachment from among a first attachment 13 and a second attachment 26 which contacts either the board α or the integrated package β. The first attachment 13 and the second attachment 26 have a pressing direction thermal conductivity based on the distribution of the pressing direction thermal conductivity of the integrated packageβ in the moving direction of the pressing unit 23.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A slit die comprises a manifold, a plurality of supply ports, a slit, a discharge port, a shim and a partition portion. The manifold is formed elongated in a width direction. The supply ports are provided in the manifold so as to be arranged in the width direction. The slit is connected to the manifold and is elongated in the width direction. The discharge port discharges the coating liquid from the manifold via the slit. The shim partitions the slit into a plurality of spaces in the width direction to form small slits. The partition portion partitions the manifold into a plurality of spaces in the width direction to form small manifolds. At least one of the supply ports is located in each small manifold. One of the small manifolds connects to one of the small slits.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
The present invention accurately classifies patterns of defects occurring in an object to be inspected. Specifically, a defect classification device 1 includes a classification unit 10 for classifying patterns of defect X occurring in an object W to be inspected that has been imaged so as to be divided into a plurality of visual fields F. The plurality of visual fields include a first visual field F1 and a second visual field F2 adjacent to each other. A first end part F1p on the second visual field side of the first visual field and a second end part F2p on the first visual field side of the second visual field overlap each other. The first visual field includes a first defect X1. The second visual field includes a second defect X2. The classification unit cuts out a region in which the first defect appears in the first visual field as a first defect image C1, and cuts out a region in which the second defect appears in the second visual field as a second defect image C2. When the first defect image includes the first end part and the second defect image includes the second end part, the classification unit classifies the patterns of the defects in a state in which the first defect image and the second defect image are aligned such that the first defect and the second defect overlap.
A lifting head comprises a base member that has a suctioned surface, a raising/lowering shaft supported by the base member and having a raising/lowering axial channel, a contact member fixed to one end of the raising/lowering shaft and contacting with a raising/lowering drive mechanism of a lifting device, a needle support member fixed to the other end of the raising/lowering shaft and supporting a needle, and a needle cap having a stage at one end thereof and fixed to the base member. The suctioned surface of the base member is gripped by a suction force of a first negative pressure passage of an attachment member of the lifting device. While the contact member contacts with the raising/lowering drive mechanism, an inside of the needle cap is suctioned by a suction force of a second negative pressure passage of the raising/lowering drive mechanism via the raising/lowering axial channel.
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
B25J 11/00 - Manipulators not otherwise provided for
B25J 15/04 - Gripping heads with provision for the remote detachment or exchange of the head or parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
6.
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM
Provided is an electronic component mounting method that makes it possible to produce a highly reliable fluxless bond by means of a simple device. According to the present invention, an electronic component mounting method involves bonding a bump 22 formed on a first electrode 21 of a first electronic component 20 to a second electrode 11 of a second electronic component 10 and includes an etching step for etching the first electronic component and the second electronic component with a weakly acidic organic acid to remove an oxide film formed on the surface of the bump and the second electrode and, after the etching step, a bonding step for bonding the bump formed on the first electrode to the second electrode in a state in which the first electronic component and the second electronic component are accommodated in a bonding device 70 and an inert gas has been supplied to the bonding device.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A mounting device comprises an attachment tool configured to hold a surface of a chip component opposite to a surface having a chip recognition mark, a substrate stage configured to holds a substrate, a reflection light source configured to irradiate light containing wavelengths that pass through the chip component from the attachment tool side toward the substrate, and a recognition unit configured to recognize reflected light of the light irradiated by the reflection light source, the recognition unit being configured to acquire an image formed by light that passes through the chip component and is reflected by the substrate, to acquire position information of the substrate recognition mark.
B23K 37/04 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
Provided is a variable resistance device that can set a desired resistance value while measuring the resistance value of a variable resistor. Specifically, this variable resistance device 100 comprises: a variable resistor 10 that includes a resistor 11 that has a first terminal t1 and a second terminal t2 and a slider 12 that has a third terminal t3 and is configured such that the position P at which the slider 12 contacts the resistor 11 can be changed; a drive unit 40 that moves and thereby changes the position of the slider 12 as in contact with the the resistor 11; an input-side resistance measurement unit 20 that measures an input-side variable resistance value R1 that is the resistance value between the first terminal t1 and the third terminal t3; and a control unit 30 that, when an output-side variable resistance value R2 that is the resistance value between the second terminal t2 and the third terminal t3 is adjusted to a desired output resistance value, controls the drive unit 40 to change the position at which the slider 12 contacts the resistor 11 on the basis of the input-side variable resistance value R1 measured by the input-side resistance measurement unit 20.
Provided is an element transfer method capable of transferring an element while suppressing breakage of the element caused by deformation of an adhesive layer, even when the element has a relatively small thickness. More specifically, this semiconductor chip transfer method (element transfer method) comprises: an disposition step in which an adhesive layer 2, a resist 3, and a semiconductor chip 1 are disposed in this order on a transfer substrate 10; and a transfer step in which the semiconductor chip 1 is transferred to a transfer-receiving substrate 20 by irradiating the transfer substrate 10 with laser light L from the side opposite to the surface of the transfer substrate on which the semiconductor chip 1 is disposed. The adhesive force between the adhesive layer 2 and the resist 3 is larger than the adhesive force between the resist 3 and the semiconductor chip 1, and thus in the transfer step, the resist 3 remains on the transfer substrate 10 side.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 21/58 - Mounting semiconductor devices on supports
H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
Provided is a coating device that suppresses breakage of a substrate. A coating device (400) is configured so that: a substrate is caused to float on floating stages (420, 460) and a coating stage (440) and thereby be conveyed thereon; and a processing liquid is applied to the substrate on the coating stage (440). The floating stages (420, 460) are disposed on the upstream side and/or the downstream side of the coating stage (440) in the conveyance direction of the substrate. The coating device (400) comprises: measuring instruments (430, 450, 429, 449) for obtaining measured values corresponding to distances between the upper surface of the coating stage (440) and the upper surfaces of the floating stages; and a controller for controlling an actuator for driving the coating stage (440) in the normal direction of the upper surface of the coating stage such that the measured values are within a predetermined range.
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
B05C 3/15 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating work of indefinite length not supported on conveying means
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
To provide a slit die that can make a width-direction shape of a coating film more uniform compared to conventional methods, when the coating film is formed in a stripe pattern in the width direction. A slit die is configured to apply a coating liquid on a substrate, the slit die comprising a manifold that is formed elongated in a width direction of the substrate and is a space that is configured to hold the coating liquid, a plurality of supply ports that are provided in the manifold so as to be arranged in the width direction and are configured to supply the coating liquid to the manifold, a slit that is connected to the manifold and is elongated in the width direction, a discharge port that is configured to discharge the coating liquid from the manifold via the slit, a shim that partitions the slit into a plurality of spaces in the width direction and forms small slits, and a partition portion that partitions the manifold into a plurality of spaces in the width direction and forms small manifolds, the partition portion being disposed at a position that partitions the manifold such that at least one of the supply ports is located in each small manifold, and one of the small manifolds connects to one of the small slits.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
Provided is an ion channel analysis device capable of obtaining a mathematical parameter for analyzing a state of an ion channel. Specifically, an ion channel analysis device 1 comprises: a detection unit 20 that detects an ion current I flowing through an ion channel 10; and an analysis unit 30 that acquires first data 40 related to the ion current I detected by the detection unit 20. There is a regression model M using, as teacher data, the known first data 40 and a known mathematical parameter 70 corresponding to the known first data 40. The analysis unit 30 outputs the mathematical parameter 70 corresponding to the input first data 40 by inputting the first data 40 related to the ion current I detected by the detection unit 20 to the regression model M.
Provided is an inspection device capable of obtaining accurate coordinates of a chip provided on a substrate. Specifically, this inspection device comprises: a stage on which a target substrate is placed; a camera that images the target substrate to obtain a captured image; and a controller that calculates a target measurement value of target coordinates of a chip with respect to a target origin of the target substrate on the basis of the distance between an image reference position and the chip in the direction in which pixels are arranged and a relative movement set value between the stage and the camera. The controller corrects the target measurement value by using a projective transformation matrix to calculate a target correction value. The controller calculates an alignment measurement value of the alignment coordinates with respect to an alignment origin of an alignment substrate on the basis of the distance between the image reference position and an alignment mark in the direction in which the pixels are arranged, in a state in which the alignment origin is aligned with the image reference position. The controller calculates a parameter of the projective transformation matrix on the basis of the alignment measurement value and a known alignment actual measurement value.
Provided is a substrate holding device with which substrates of various sizes can be suctioned to a stage. Specifically, a substrate holding device 1 is equipped with a stage 10 for holding a substrate W. The stage 10 includes: a placement surface 60 on which the substrate W is placed; and a plurality of suction grooves 70 formed of recesses provided on the placement surface 60 and arranged concentrically. The suction grooves 70 suck the substrate W by negative pressure. The placement surface 60 includes a boundary portion 61 that intersects with the suction grooves 70. The suction grooves 70 are each divided by the boundary portion 61.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
15.
APPEARANCE INSPECTION DEVICE AND APPEARANCE INSPECTION METHOD
Provided are an appearance inspection device and an appearance inspection method capable of detecting the height of a defect present on the surface of an object without performing additional processing on the object itself. Specifically, this appearance inspection device 100 comprises: an imaging unit 5 that acquires a detection image 20 that is a visible light image in which a semiconductor wafer U and a defect D present in the semiconductor wafer U appear; and a processing unit 1 that detects the height of the defect D with respect to the semiconductor wafer U on the basis of the detection image 20. The imaging unit 5 images a plurality of the detection images 20 while changing the distance between the imaging unit 5 and the semiconductor wafer U. The processing unit 1 is configured to detect the height of the defect D with respect to the semiconductor wafer U on the basis of the degree of variation in pixel values of a defect portion 12, in which the defect D appears, in each of the plurality of detection images 20.
The present invention provides an appearance inspection device capable of acquiring information for appropriately detecting a defective portion in an appearance image showing an object even when the degree of surface roughness is different depending on the object. Specifically, provided is an appearance inspection device 100 comprising: an image acquisition unit 5 that acquires an appearance image 10 of a semiconductor wafer U; and a processing unit 1 that generates a detection image 10c for detecting a defective portion 12 by performing detection filter processing on the appearance image 10. The processing unit 1 is configured to generate the detection image 10c according to the degree of roughness of a surface S of the semiconductor wafer U appearing in the appearance image 10 by performing detection filter processing for reducing detection sensitivity to the defective portion 12 and the defective portion 13 as the degree of roughness of the surface S of the semiconductor wafer U appearing in the appearance image 10 increases.
A coating device comprises a stage, a coater and a dryer. A substrate is configured to be placed on the stage. The coater is configured to eject a coating liquid from a nozzle to form a coating film on the substrate that is placed on the stage while moving relative to the substrate. The dryer is configured to dry the coating film on the substrate. Drying promotion force of the dryer for promoting drying is adjusted on the basis of drying distribution information of the coating film on the substrate in accordance with a region of the coating film.
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
Provided are a wafer dividing method, wafer machining method, and wafer dividing device that make it possible to increase the semiconductor material utilization efficiency, mainly in power semiconductor usages. Specifically, provided is a wafer dividing method for obtaining thin wafers that includes attaching fixing plates to both sides of a wafer comprising at least a semiconductor crystal, and cutting the wafer near the middle in the thickness direction while holding the fixing plates on both sides, thereby obtaining two thin wafers attached to the fixing plates.
B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor by tools other than of rotary type, e.g. reciprocating tools
Provided is a coating device capable of preventing a film thickness distribution of a coating film from changing after the coating film has been formed. Specifically, the device comprises: an attachment stage (10) having an attachment surface (10a) for attaching and holding a substrate (W); a coating unit (20) that applies a coating liquid to the substrate (W) attached to and held by the attachment stage (10) and forms a coating film (M) on the substrate (W); and a drying promotion unit (30) that, after the coating film (M) has been formed, promotes the drying of the coating film (M) on the substrate (W) while the attachment and holding of the substrate by the attachment stage (10) is being maintained.
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B05C 9/14 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating
Provided is a clip device capable of performing a stable gripping operation and a stable gripping state releasing operation in a small installation space even during high-speed conveyance. Specifically, a clip device 100 comprises a gripping clip 10, a closer 20, and an opener 30. The closer 20 and the opener 30 include a first magnet 21 and a second magnet 22, or a first magnet 31 and a second magnet 32. The first magnet 21 or the first magnet 31 is arranged such that the magnetization direction thereof is along a direction towards the gripping clip 10. The second magnet 22 or the second magnet 32 is arranged such that the magnetization direction thereof is orthogonal to the magnetization direction of the first magnet 21 or the first magnet 31 so as to concentrate the magnetic force line thereof on the first magnet 21 or the first magnet 31 side.
B29C 55/08 - Shaping by stretching, e.g. drawing through a dieApparatus therefor of plates or sheets uniaxial, e.g. oblique transverse to the direction of feed
A positioning device is provided for determining a relative position between a substrate and a processing unit that is configured to perform an attachment process, when performing the attachment process at a prescribed position of the substrate. The positioning device comprises a substrate table configured to hold the substrate, a processing position movement mechanism including a driving unit configured to move the substrate table and the processing unit relative to each other, and a braking unit configured to restrict movement, caused by the driving unit, of at least one of the substrate table and the processing unit, and a control unit connected to the driving unit and the braking unit. The control unit is configured to restrict, by using the braking unit, the movement of the at least one of the substrate table and the processing unit during the attachment process.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Provided are a mounting device and a mounting method for relatively easily supplying a mounting head with a semiconductor chip having an activated electrode surface. Specifically, provided are a mounting device and a mounting method using the same, the mounting device comprising: a chip supply unit that picks up a semiconductor chip; a mounting unit that performs face-down mounting of the semiconductor chip picked up by the chip supply unit on a substrate; a chip transport mechanism that transports the semiconductor chip from the chip supply unit to the mounting unit; and a surface treatment means that performs surface activation treatment on an electrode surface of the semiconductor chip in order to improve bondability with an electrode surface of the substrate, the surface treatment means being disposed so as to perform the surface activation treatment on the electrode surface of the semiconductor chip being transported by the chip transport mechanism.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A laminate manufacturing apparatus comprises a vacuum chamber, a gas introduction port, and a plasma generator. The laminate manufacturing apparatus has a surface hydrophilization mode in which a film formation surface of a substrate is modified by a plasma atmosphere in a state in which an evaporation source that imparts a hydrophilic group is supplied into the vacuum chamber, thereby rendering the film formation surface hydrophilic, and a self-assembling mode in which an evaporation source of a precursor material of a self-assembled monolayer is supplied to the substrate on which the film formation surface has been hydrophilized, in a state in which an evaporation source that promotes hydrolysis of the precursor material of the self-assembled monolayer has been supplied while an inside of the vacuum chamber is under a vacuum, thereby forming the self-assembled monolayer on the hydrophilized film formation surface.
C23C 16/50 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
B01J 19/08 - Processes employing the direct application of electric or wave energy, or particle radiationApparatus therefor
C23C 16/448 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
C23C 16/455 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
C23C 16/458 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
C23C 16/52 - Controlling or regulating the coating process
A bonding device is configured to bond a first element and a second element. The bonding device comprises an activating unit configured to activate a first bonding surface, which is a bonding surface of the first element, and a second bonding surface, which is a bonding surface of the second element, and a bonding unit configured to irradiate an active energy ray to cause the first bonding surface and the second bonding surface to come closer and bond with each other, from a state in which the first bonding surface and the second bonding surface face each other with a prescribed gap therebetween.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A transfer device transfers an element held on a transfer substrate to a receiving substrate. The transfer device comprises an energy irradiation unit irradiating an active energy ray toward the element through the transfer substrate in a state in which the transfer substrate and the receiving substrate face each other across the element. The transfer substrate has a blistering layer in which a blister is generated due to irradiation of an active energy ray. The receiving substrate has a capture layer that is arranged facing the transfer substrate. The energy irradiation unit forms the blister in an element holding area to change a tilt of the element relative to the transfer substrate and to bring the element closer to the receiving substrate, thereby causing the a portion of the element to come in contact with the capture layer first, in a state in which the blistering layer holds the element.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A mounting device mounts a chip component having a chip recognition mark and a substrate having a substrate recognition mark. An attachment tool has transparency and has a tool recognition mark. The attachment tool holds a surface of the chip component opposite to a surface having the chip recognition mark. A chip position recognition unit simultaneously acquires position information of the chip recognition mark and of the tool recognition mark. The substrate position recognition unit acquires position information of the substrate recognition mark and of the tool recognition mark. A control unit moves a substrate stage holding the substrate or the attachment tool in the in-plane direction of the substrate on the basis of information obtained by the chip position recognition unit and by the substrate position recognition unit to perform alignment between the chip component and the substrate.
Provided is a mounting apparatus capable of accurately grasping rotational center coordinates at the time of position adjustment, and performing highly accurate positioning when mounting a chip component on a substrate, such as a wiring board. Specifically, a mounting apparatus is provided which comprises: an attachment tool that holds the chip component; a mounting head that has a head-side stage for adjusting the position of the attachment tool in X, Y, and θ directions; a recognition means that acquires an image from a direction perpendicular to the surface of the attachment tool; and a control unit that is connected to the mounting head and the recognition means. A center-identifying mark is provided on a portion associated with the attachment tool. The control unit has the function for: changing the rotation angle of the head-side stage a plurality of times to acquire images of the center-identifying mark by means of the recognition means; and calculating the rotation center coordinates of the head-side stage from a plurality of items of position information on the center-identifying mark.
Provided is a positioning apparatus capable of suppressing the effects of calibration errors on positioning accuracy. Specifically, the positioning apparatus includes: an X-axis movement device and a Y-axis movement device; an imaging device for measuring a movement position; and a control device for outputting a position control signal S to each movement device and acquiring a measured position Pm of an object. The control device performs: first calibration control S1 for calculating a reference calibration value C of a position control signal S on the basis of a target position Pt and the measured position Pm; and second calibration control S2 for selecting a calibration measurement position having the smaller difference from the target position Pt, among an addition-side calibration measurement position Pma and a subtraction-side calibration measurement position Pms that have been moved on the basis of a calibration position control signal Sc calibrated using a temporary calibration value obtained by adding or subtracting a prescribed value to or from the reference calibration value C, and for setting the temporary calibration value used to calculate the calibration position control signal Sc, obtained by moving the object to the selected calibration measurement position, as a new reference calibration value C.
The present invention realizes highly accurate mounting without reducing the takt time in face-down mounting in which electrode surfaces are mounted facing each other. Specifically, provided are a tool slider, a chip slider, and a mounting device, the tool slider being used for conveying an attachment tool that holds a chip component on the lower surface, wherein is a frame is provided that supports the edge of the lower surface of the attachment tool, the frame has suction holes in communication with a reduced pressure flow path on the surface in contact with the attachment tool, and the shape allows the chip component to be housed inside the frame.
The present invention provides: a flux transfer device that reduces, as much as possible, the effects, on takt time, of a transfer process for transferring flux to a bump electrode of a chip component which is held by a mounting head. Specifically, the present invention provides: a flux transfer device comprising a flux transfer unit that has a cavity for storing flux and a transfer unit slide means that can move the flux transfer unit horizontally, wherein when the flux is to be transferred to the bump electrode, the flux transfer unit is made to approach a mounting head such that the cavity is disposed directly under the chip component, and when the mounting head is to mount the chip component, the flux transfer unit is moved so as not to be under the mounting head; and a mounting device comprising the same.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
31.
ELECTRODE MATERIAL, ELECTRODE SLURRY, PRODUCTION METHOD FOR ELECTRODE MATERIAL, ELECTRODE, AND PRODUCTION METHOD FOR ELECTRODE
An electrode material 1 for secondary batteries that suppresses reductions in electrode capacity and has excellent cycle characteristics includes an electrode active material 10. All or a portion of the surface of the electrode active material 10 is coated with a non-aqueous binder 20 in a shell-like manner.
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
H01M 4/36 - Selection of substances as active materials, active masses, active liquids
H01M 4/485 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
The purpose of the present invention is to provide a drying device with which energy consumed when drying a coating film can be reduced to a greater extent than in the past. Specifically, a drying device having a housing part through the interior of which passes a base material on which a coating film is formed, and a supply part that supplies gas into the housing part, a first drying unit and a second drying unit for drying the coating film by heating the coating film being arranged side by side in the housing part, wherein: the first drying unit is provided with a supply part that supplies gas into the housing part of the first drying unit, and a first heating source that indirectly heats the coating film by heating the gas until the gas is supplied from the supply part to the housing part; and the second drying unit is provided with a second heating source that directly heats the coating film in the housing part of the second drying unit.
F26B 13/10 - Arrangements for feeding, heating or supporting materialsControlling movement, tension or position of materials
F26B 3/02 - Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air
F26B 13/02 - Machines or apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement with movement in a straight line
Provided is a drying device capable of sufficiently drying an insulating material while suppressing excessive drying of an electrode material. More specifically, in this drying device, with regard to the electrode material and the insulating material which are applied to the base material, a first drying unit is configured to dry the insulating material.
F26B 3/04 - Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour circulating over, or surrounding, the materials or objects to be dried
F26B 3/28 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
F26B 13/04 - Machines or apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement with movement in a straight line using rollers
F26B 13/10 - Arrangements for feeding, heating or supporting materialsControlling movement, tension or position of materials
Provided is a chip position measuring device capable of accurately correcting measurement errors of the respective acquired positions of all chip components, even when the chip components are arranged with a high density on an actual substrate or when the number of divisions of an imaging region of the actual substrate is very greatly increased. Specifically, in the chip position measuring device 100, a control unit 40 corrects the positions of a plurality of chip components 210 for each of a plurality of actual substrate divided imaging regions 230 on the basis of measurement errors in each of a plurality of master substrate divided imaging regions 330.
Provided are a workpiece-position-adjusting device and a mounting apparatus using the same, the workpiece-position-adjusting device being capable of highly accurate positioning by obtaining a center of rotation at the time of position adjustment with high accuracy for both X-coordinates and Y-coordinates. Specifically provided are a workpiece-position-adjusting device and a mounting apparatus using the same, the workpiece-position-adjusting device comprising a stage for adjusting the position of a workpiece-holding unit in a XY theta direction, and a recognition means for acquiring an image of the workpiece-holding unit. The workpiece-position-adjusting device has a functionality wherein a center identification mark is provided at a portion that is interlocked with the workpiece-holding unit, images of the center identification mark are acquired by the recognition means by driving the stage and changing the rotation angle a plurality of times, and the rotation center coordinates of the stage are calculated from position information of the plurality of center identification marks. The Y-coordinate of the rotation center is obtained by placing the center identification mark at a position that is separated in the X-direction from a provisionally set temporary rotation center, and the X-coordinate of the rotation center is obtained by placing the center identification mark at a position that is separated in the Y-direction from the temporary rotation center.
A positive electrode material for secondary batteries that has exceptional high rate characteristics and cycle characteristics, the positive electrode material containing a positive electrode active material 10 and a crystalline metal oxide 20 that is attached to part of the surface of the positive electrode active material 10.
H01M 4/36 - Selection of substances as active materials, active masses, active liquids
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
The purpose of the present invention is to provide a coating device capable of suppressing dragging of a coating liquid at a coating end part. Specifically, this coating device coats a coating liquid onto a base material to be conveyed, and comprises: a coating part in which a discharge port that is long in a width direction orthogonal to the conveyance direction of the base material, and a coating flow path that is connected to the discharge port and supplies the coating liquid to the discharge port, are formed; and a volume adjusting mechanism for changing the volume of the coating flow path. The volume adjusting mechanism has a volume adjusting part inserted into the coating flow path, and a driving part for adjusting the insertion amount of the volume adjusting part.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
38.
ELEMENT TRANSFER DEVICE AND ELEMENT TRANSFER METHOD
Provided is an element transfer device with which an element can be easily peeled. Specifically, a semiconductor chip transfer device 100 (element transfer device) is provided with: a support substrate holding unit 30 for holding a support substrate 10 on which a semiconductor chip 1 is supported with an adhesive layer 2 therebetween; a laser beam irradiation unit 70 for irradiating the support substrate 10 with laser light L; and a control unit 60 for controlling the irradiation position of the laser light L irradiated from the laser beam irradiation unit 70. The area of a spot region SA of the laser light L is smaller than the area of a surface 1c supported by the support substrate 10 of the semiconductor chip 1. The control unit 60 controls the irradiation position of the laser light L so that, when viewed from a direction perpendicular to the surface of the support substrate 19, the laser light L irradiates the support substrate 10 while moving relative thereto from one end 1a side to the other end 1b side of the semiconductor chip 1.
H01L 21/52 - Mounting semiconductor bodies in containers
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
Provided is a coating device with which it is possible to perform movement control of a movement unit with high accuracy. Specifically, the coating device 10 has: a movement unit 11 that coats a base material W with liquid; a guide device 12 that guides the movement of the movement unit 11; and a cable carrier 13 that supports a cable group 14 including a power line 14a that supplies electric power to the movement unit 11. The movement unit 11 has: a coating unit 16 equipped with a coating head 21 which can move in the guiding direction of the guide device 12 and which ejects liquid; a control unit 17 which can move in the guiding direction independently of the coating unit 16 and which is connected to the cable carrier 13; and a flexible wire harness 18 which connects between the control unit 17 and the coating unit 16 with a slack.
Provided is an image processing method for detecting, when performing imaging inspection on a semiconductor chip or the like having wiring, a defect that is present in an image by eliminating the influence of the wiring. Specifically, provided is an image processing method for detecting an irregular image by performing image processing on an imaging screen having a straight line extending in one direction displayed thereon, the image processing method comprising: a step for acquiring a first processed image obtained by performing smoothing filter processing on the imaging screen using a segment defined by a first number a of pixels arranged along the one direction and a second number b of pixels arranged along a different direction from the one direction; a step for acquiring a second processed image obtained by performing smoothing filter processing on the imaging screen using a segment defined by a third number c of pixels arranged along the one direction and a fourth number d of pixels arranged along the different direction; a step for acquiring a third processed image, which is an image obtained by subtracting the first processed image form the second processed image; and a detection step for detecting an irregular image using the third processed image. a is greater than any of b, c, and d.
The present invention provides a substrate holding device capable of reliably holding a substrate even when the substrate is warped in a convex shape. Specifically, provided is a substrate holding device that supports and holds a lower surface of a substrate. The substrate holding device includes: a central support part that supports a central section of the lower surface of the substrate; an outer periphery support part that supports an outer periphery section of the lower surface of the substrate; and a lifting part that relatively moves the central support part and the outer periphery support part in the thickness direction of the substrate. The outer periphery support part has a substrate outer periphery suctioning part that suctions the substrate. The central support part has a substrate center suctioning part that suctions the substrate, and a section of the central support part that is brought into contact with the lower surface of the substrate is curved in a convex shape.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided is a vent tank that makes it possible for an application liquid, which has been discharged into the vent tank through air vent processing, to be reused in a clean state. Specifically, a vent tank 10, which recovers an application liquid discharged from an applicator 20, comprises: a tank body 11 that stores the application liquid; vent piping 12 that is inserted into the tank body 11 and guides, to the tank body 11, the application liquid discharged from the applicator 20; and a cleaning nozzle 13 that is inserted into the tank body 11 and ejects a cleaning liquid into the tank body 11. The cleaning nozzle 13 is provided with a nozzle part 13a that ejects the cleaning liquid into the tank body 11 omnidirectionally.
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
The purpose of the present invention is to provide a transport device capable of adjusting the position of an end of a substrate in a width direction thereof. Specifically, the transport device comprises a transport unit that transports a strip-shaped substrate in a longitudinal direction, and at least one pair of conveyor units that assist the transport unit in transporting the substrate, and each run a belt member in a state in which a predetermined surface of the substrate transported by the transport unit is adhered to an adhesive unit formed on the belt member, thereby sending the substrate in a traveling direction of the adhesive unit to which the substrate is adhered, wherein the pair of conveyor units are arranged so as to adhere the predetermined surface of the substrate to the adhesive unit of the belt member in the vicinity of either end of the substrate in the width direction of the substrate, and the pair of conveyor units are provided with a traveling direction adjustment unit for adjusting the traveling direction of the adhesive portion of each belt member.
There has been a case where, even if uneven patterns on the surface of a substrate are highlighted by a differential interference microscope, cracks formed in a surface of the substrate cannot be easily recognized visually. The present invention makes it easy to visually recognize cracks formed in the surface of a substrate in observing the surface of the substrate by using a differential interference optical method. Specifically, an observation device 1 observes a surface W1 of a substrate W. The observation device 1 comprises: a holding unit 20 that holds the substrate W; and a differential interference microscope 10 that projects the surface W1 of the substrate W held by the holding unit 20 and acquires an image G. The holding unit 20 holds the substrate W in a bent state.
Provided is a three-dimensional modeling method for a core-shell system, in which, in a step for curing a core material, molding defects caused by gases emitted from the core material can be prevented, and deformation of the shell can be suppressed. Specifically, this three-dimensional modeling method includes: a shell modeling step for using a shell material to model a shell that defines the external shape of a three-dimensional model; a core material filling step for filling a liquid-phase core material into a core section, which is a section enclosed by the inner surface of the shell; and a core material curing step for curing the core material inside the core section. The method also includes a core section sealing step for sealing an opening in the core section by leaving an uncured region of the shell material on the upper surface of the core material filled into the core section. The core material curing step is performed after the core section sealing step.
B29C 64/135 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
B29C 64/379 - Handling of additively manufactured objects, e.g. using robots
tiiii in neighboring fields of view. An imaging picture of a prescribed pattern inside the overlap area is recorded as an alignment mark to be utilized for a neighbor field of view, and an inspection picture is created in the neighbor field of view with the imaging position of the recorded alignment mark as a reference.
The present invention addresses the problem of precisely classifying a pattern of a defect that has occurred in an inspection object. Specifically, an automatic defect classification device 1 classifies a pattern of a defect X that has occurred in an inspection object W. The inspection object W is imaged so as to be divided into a plurality of mutually adjacent visual fields F. In a case in which a defect X is included on the perimeter F1a of a first visual field F1 as an arbitrary visual field FA that is one visual field F among the plurality of visual fields F, and the defect X is included on the perimeter F2a of a second visual field F2 as an adjacent visual field FB that is another visual field F adjacent to the first visual field F1 (arbitrary visual field FA) among the plurality of visual fields F, the automatic defect classification device 1 classifies a pattern of the defect X in a state in which the first visual field F1 (arbitrary visual field FA) and the second visual field F2 (adjacent visual field FB) are combined.
The present invention relates to a ring-type illumination device for dark-field observation, wherein the illumination density of light with respect to a subject region on an object being inspected is improved, and variation in brightness is suppressed. Specifically, this ring-type illumination device 2 carries out dark-field observation with respect to a subject region A on an object being inspected W. The ring-type illumination device 2 comprises a ring-shaped ring member 10. The ring member 10 is disposed so that a central hole 12 faces the target region A and so that a circumferential part 11 is located farther circumferentially outward than the target region A. The circumferential part 11 is provided with an exit opening 13, which is disposed spanning the entire circumference of the circumferential part 11 and through which light L exits obliquely relative to the target region A. Optical elements 20, 21 that diffuse the light L in the circumferential direction of the ring member 10 are provided between the exit opening 13 and the target region A.
National Institute of Maritime, Port and Aviation Technology (Japan)
Toray ENGINEERING CO., LTD. (Japan)
Toray Engineering D Solutions Co., Ltd. (Japan)
Inventor
Itakura, Daisuke
Furuichi, Kenji
Ishihara, Ryoichi
Uchida, Yoshihiro
Matsuo, Tsuyoshi
Sawada, Satoshi
Hyakusai, Akira
Abstract
A method for molding analysis of a plate-like intermediate base material containing resin and reinforcing material when the base material is molded, including applying a base material model having anisotropy between out-of-plane direction and an in-plane direction orthogonal to the out-of-plane direction, and calculating viscosity distribution in a cross-section direction of a molded article using each viscosity in accordance with a flow field, and the viscosity distribution indicates that under a boundary condition there is no slip flow of the base material on a wall surface of the mold, as a result of a shear field in the vicinity of the wall surface, a low viscosity layer that is more affected by an out-of-plane shear viscosity than a central portion of the base material is automatically formed in the vicinity of the wall surface, and the base material in the vicinity of the wall surface functions as a lubricating layer.
The present invention provides a transfer substrate holding device, a transfer device, and a transfer method which make it possible to accurately transfer, to a transfer-receiving substrate, an element held by a flexible transfer substrate. Specifically, provided is a transfer substrate holding device 13 that holds the rear surface side of a flexible transfer substrate 22, which holds an element 21 on the front surface side thereof, in order to irradiate the transfer substrate 22 with active energy rays 11, wherein: at a portion that faces an element holding region 22c, which is a region of the transfer substrate 22 where the element 21 is held, provided is a transmission part 13b that transmits active energy rays 11, from a transfer substrate facing surface 13a which faxes the transfer substrate 22 to a surface on the opposite side from the transfer substrate facing surface 13a, and that makes contact with the transfer substrate 22; and a clamping region 17 for producing a clamping force to clamp and hold the transfer substrate 22 is provided outside the transmission part 13b on the transfer substrate facing surface 13a side.
H01L 21/52 - Mounting semiconductor bodies in containers
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided is a transfer device whereby portions irradiated with an actinic energy beam can be prevented from being overly crowded. Specifically, provided is a transfer device 10 that irradiates a transfer substrate 22 with an actinic energy beam 11 to thereby transfer an element 21 held by the transfer substrate 22 to a receiving substrate 23. The transfer device 10 is equipped with an energy emission part 12 which intermittently emits an actinic energy beam 11 and an irradiation position control unit 15 which controls positions where the transfer substrate 22 is to be irradiated with the actinic energy beam 11 emitted from the energy emission part 12. Time intervals between operations of irradiating the transfer substrate 22 with the actinic energy beam are regulated in accordance with the traveling speed of the position where the transfer substrate 22 is to be irradiated with the actinic energy beam 11 according to control by the irradiation position control unit 15.
H01L 21/52 - Mounting semiconductor bodies in containers
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
52.
STRUCTURE MANUFACTURING DEVICE AND STRUCTURE MANUFACTURING METHOD
This structure manufacturing device comprises a slurry supply part that supplies a slurry to one end surface of a porous substrate, and a slurry suction part that suctions the slurry supplied to the porous substrate through the other end surface of the porous substrate. The structure manufacturing device also comprises a shielding part that covers the outer-peripheral surface of the porous substrate in a state of being set apart from the outer-peripheral surface so that inflow of air to the interior through the outer-peripheral surface is blocked.
Provided is a transfer method that, during transfer of an element using blistering, enables the element to be transferred from a transfer substrate to an accurate position on a substrate to be transferred onto. Specifically, the transfer method comprises: a transfer preparation step in which, in a state in which a predetermined element 21 is being held by a transfer substrate 22 with the distance between the transfer substrate 22 and a substrate 23 to be transferred onto being a first distance d1, the transfer substrate 22 and the substrate 23 to be transferred onto are opposed to each other so as to sandwich the predetermined element 21; a transfer step in which a blister 30 is caused to occur on the transfer substrate 22 in the vicinity of the position in which the predetermined element 21 is being held, thereby causing the predetermined element 21 and the substrate 23 to be transferred onto to become closer to each other to cause the predetermined element 21 to be held by the substrate 23 to be transferred onto; a substrate spacing step in which the distance between the transfer substrate 22 and the substrate 23 to be transferred onto is increased to a second distance d2 greater than the first distance d1; an alignment-direction movement step in which the transfer substrate 22 and the substrate 23 to be transferred onto are caused to move relatively in a direction in which elements 21 are aligned on the transfer substrate 22; and a substrate approaching step in which the distance between the transfer substrate 22 and the substrate 23 to be transferred onto is returned to the first distance d1.
The present invention uses a virtual defect to realistically reproduce an actual defect that occurs in an object being inspected. Specifically, a defect image processing device 1: uses a captured image 2a of an object 2 being inspected as a background 20 to display, with a plurality of pixels P, a virtual defect drawn image 10 in which a virtual defect 30 is drawn on the background 20; further divides a boundary pixel Pa into a plurality of subpixels S, the boundary pixel Pa being a pixel P that includes a boundary 11 between the virtual defect 30 and the background 20 among the plurality of pixels P; determines a ratio (n2:n3) between the number n2 of subpixels S that belong to the background 20 and the number n3 of subpixels S that belong to the virtual defect 30 in the boundary pixel Pa; calculates a luminance L1 of the boundary pixel Pa on the basis of a luminance L2 of the background 20 and a luminance L3 of the virtual defect 30, and the ratio (n2:n3); and compresses the plurality of subpixels S obtained through the division into the boundary pixel Pa.
According to the present invention, an actual defect occurring in an inspected object is reproduced realistically using a virtual defect. Specifically, a defect image processing device 1 displays a virtual defect rendered image 10 in which a virtual defect 30 is rendered on a background 20 using a plurality of pixels P, where a captured image 2a of an inspected object 2 is used as the background 20, wherein a filter 40 determining an influence imparted to a luminance Li of one pixel Pi among the plurality of pixels P by luminances Lj of other surrounding pixels Pj is prepared, and in the virtual defect rendered image 10, the luminance Li of the one pixel Pi can be adjusted through the filter 40 by means of the influence of the luminances Lj of the other surrounding pixels Pj.
A chemical solution synthesis device comprises a chemical solution holding unit, a reaction vessel, a first chemical solution feed unit, a chemical solution feed and discharge unit, and a second chemical solution feed unit. The chemical solution holding unit is configured to hold a chemical solution. The chemical solution and carriers are reacted in the reaction vessel. The chemical solution is transferable from the chemical solution holding unit to the reaction vessel without coming into contact with atmosphere. The first chemical solution feed unit is connected to the reaction vessel and configured to supply the chemical solution to the reaction vessel. The chemical solution feed and discharge unit is provided vertically above the first chemical solution feed unit. The second chemical solution feed unit is configured to suppress adhesion of the carriers to the reaction vessel.
A collet replacement mechanism for replacing a collet of a pickup tool that is configured to pick up chip components by suction using the collet comprises an attachment configured to hold the collet on a bottom surface thereof, an attachment holder disposed at a lower part of the pickup tool and configured to hold an upper part of the attachment by magnetic force, and an attachment storage unit having a guide that is configured to latch the attachment to store the attachment, the attachment being detachable from the attachment holder in a state of being latched to the guide.
The purpose of the present invention is to provide a drying system that is capable of improving solvent collection capacity over the prior art. Specifically, provided is a drying system comprising a plurality of drying units that each have a housing part through the inside of which passes a base material having a coating formed thereon, and that each heat the coating by introducing heated gas into the housing part to vaporize the solvent, and a plurality of solvent collection units that cool a gas containing the solvent discharged from the drying units to liquefy and collect the solvent, and a circulation path that is for circulating the gas between the drying units and the solvent collection units. The drying units are provided such that the respective housing parts thereof are in communication along a transfer route of the base material. A connecting path for sending gas cooled by a solvent collection unit to another solvent collection unit is provided between at least one set of solvent collection units among the plurality of solvent collection units.
F26B 15/00 - Machines or apparatus for drying objects with progressive movementMachines or apparatus with progressive movement for drying batches of material in compact form
F26B 21/04 - Circulating air or gases in closed cycles, e.g. wholly within the drying enclosure partly outside the drying enclosure
A coating device is provided with a stage on which a substrate is configured to be placed, an applicator movably arranged relative to the substrate placed on the stage and configured to discharge a coating liquid from a nozzle to form a coating film on the substrate, and a dryer having an air supply port with at least one porous member. The dryer is configured to dry the coating film formed on the substrate by the applicator by supplying air to the coating film from the air supply port. The at least one porous member is configured and arranged to suppress formation of local variations in an amount of air supplied from the air supply port.
B05C 9/12 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
B05D 3/04 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
Provided is a mounting device that acquires position information about a substrate recognition mark and achieves highly accurate mounting, even when a chip component covers the substrate recognition mark in facedown mounting. Specifically, provided is a mounting device comprising: an attachment tool that holds a surface of a chip component opposite to a surface having a chip recognition mark; a substrate stage that holds a substrate; a reflective light source that emits, toward the surface of the substrate from the attachment tool side, light containing a wavelength which is transmitted through the chip component; and a recognition means for recognizing reflected light of the light emitted by the reflective light source, wherein the recognition means acquires an image formed by the light that has been transmitted through the chip component and reflected at the substrate, and acquires position information about the substrate recognition mark.
A coating device comprises a die with a slit that is longer in a width direction and discharges a coating liquid to form a coating film on a substrate, a first flow path that supplies the coating liquid toward the die, a first manifold that is linked to the first flow path and holds the coating liquid that flows in from the first flow path, a plurality of second flow paths that are linked to the first manifold, a second manifold that is linked to the second flow paths and the slit, is longer in the width direction, and holds the coating liquid that flows in from the second flow paths, and an adjustment unit that is provided along at least one of the second flow paths and adjusts a flow of the coating liquid flowing through the at least one of the second flow paths.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
62.
METHOD FOR FORMING PEROVSKITE FILM AND APPARATUS FOR FORMING PEROVSKITE FILM
The present invention provides a method for forming a perovskite film and an apparatus for forming a perovskite film, each of which enables the achievement of a perovskite solar cell that has a stable power generation efficiency. Specifically, this method for forming a perovskite film comprises: a film formation step in which a perovskite film is formed on a substrate; a crystalline state checking step in which the crystalline state of the perovskite film on the substrate is checked by means of measurement; and a condition adjustment step in which the working conditions in the film formation step for the following substrates are adjusted on the basis of the measurement results of the crystalline state checking step. In the crystalline state checking step, a numerical data distribution of the crystalline state of the entirety of the perovskite film is acquired by setting a plurality of measurement positions over the entirety of the perovskite film on the substrate and acquiring numerical data at each one of the measurement positions.
H10K 30/40 - Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
H10K 71/70 - Testing, e.g. accelerated lifetime tests
H10K 85/50 - Organic perovskitesHybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3
Provided is a coating device which makes it possible to prevent the crystal state of a formed coating film from becoming non-uniform. More specifically, a coating device is provided, which is provided with a stage on which a substrate is mounted, an application device which ejects a coating solution through a nozzle to form a coating film on the substrate while moving relatively to the substrate mounted on the stage, and a dryer which dries the coating film on the substrate, in which the dryer has such a configuration that a drying-promoting force for promoting drying from drying distribution information about the coating film on the substrate is controlled in accordance with position on the coating film.
B05C 9/12 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
The present invention addresses the problem of disclosing a method for bringing a retaining layer in contact with an element only in a region having a size equivalent to that of a second main surface of the element or inside the second main surface of the element, and a device therefor. Specifically, the present invention provides a retaining layer partial removal method for partially removing a retaining layer 10 on a substrate 20 that retains a second main surface 1B of elements via the retaining layer 10, the retaining layer partial removal method being characterized by carrying out a retaining layer removal step for partially removing the retaining layer 10 by emitting a laser from the first main surface 1A side of the elements such that an emission range convers an entire arrangement region of the retaining layer 10 in an array region of the elements.
Provided is a coating device capable of shortening takt time for coating operations. Specifically, a coating device provided with a stage on which a substrate is carried and a coating unit for forming a coating film on the substrate carried on the surface of the stage by moving relative to the substrate in one direction while discharging a coating liquid, the device having a configuration wherein: the coating unit has an applicator for discharging the coating liquid and a support unit for supporting the applicator; the support unit has a column, which is disposed on one side of the width direction orthogonal to the coating direction, and a beam, which extends from the column so as to cross the stage; and the applicator is supported by the support unit with a cantilever beam structure by being attached to the beam.
A transfer device is provided that comprises a transfer substrate holding unit, a receiving substrate holding unit, and an active energy ray irradiation unit. The transfer substrate holding unit holds a transfer substrate with an ablation layer on which at least one element is held. The receiving substrate holding unit holds a receiving substrate such that the ablation layer of the transfer substrate is opposite the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer of the transfer substrate with an active energy ray to cause ablation for transferring the at least one element held by the ablation layer from the transfer substrate to the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer with the active energy ray at a plurality of locations in a holding region of the ablation layer that holds one of the at least one element.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairingApparatus therefor
B23K 26/57 - Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
B23K 26/067 - Dividing the beam into multiple beams, e.g. multi-focusing
67.
NANOWIRE-EQUIPPED FILM AND NANOWIRE MANUFACTURING METHOD
A nanowire-equipped film comprises a substrate made of a crystalline resin, and nanowires made of a metal oxide and grown directly on the substrate. A fine textured structure is formed on a surface of the substrate, and the nanowires are grown directly from the textured structure.
C23C 18/12 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
C23C 18/04 - Pretreatment of the material to be coated
The purpose of the present invention is to provide a drying system capable of reducing energy consumption in a coating film drying step in the manufacturing process of a lithium ion battery as compared with the conventional systems. A drying system (100) for drying a coating film made of a slurry of a positive electrode material including NMP formed on a base material in a manufacturing process of a lithium ion battery, the drying system being configured to include a first gas supply means (3) for supplying a gas used for drying the coating film, a first drying unit (1) that heats the gas supplied by the first gas supply means and heats and dries the coating film with the heated gas, and a second gas supply means (6) for supplying gas containing moisture to the first drying unit.
F26B 13/02 - Machines or apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement with movement in a straight line
Provided is an automatic defect classification device that facilitates correction of errors in classification categories assigned in advance by a user and enables improvement in the accuracy of automatic defect classification, even when there are many defect images constituting training data. The automatic defect classification device is for generating, by using training data in which classification categories clearly indicating associations of a plurality of defect images with defect classifications have been assigned to the defect images in advance by the user, classifiers corresponding to the defect images and for, by using the classifiers, automatically assigning the classification categories to defect images of which classification categories are unknown. The automatic defect classification device comprises: a training data input unit that receives input of training data; a processing unit that performs a predetermined process on the plurality of defect images; and a display unit that displays the defect images. The processing unit causes the display unit to perform display in a changed display format of defect portions of the defect images in accordance with the classification categories which have been assigned by the classifiers and with which the defect images are associated.
The purpose of the present invention is to provide a drying device that is capable of preventing a break in a base material even if tension applied to the base material is less than that during normal transfer. Specifically, provided is a drying device that is provided on a transfer path in which a base material is transferred roll-to-roll with a prescribed tension applied thereto, and that dries a coating film applied to the base material while the base material is transferred, said drying device comprising: a drying nozzle that blows a gas from below and above the base material, lifts the base material, and dries the coating film applied to the base material; an edge nip part that, in a lifting region in which the base material is lifted by the drying nozzle, grasps at least the vicinity of the pair of edges of the base material in the width direction and defines the transfer path of the edges; and a support member that is provided below or above the base material in the lifting region and contacts a prescribed surface of the base material where the tension applied in a state of being lifted by the drying nozzle is smaller than the prescribed tension.
Provided are a transfer device and a transfer method capable of flip-chip mounting an element onto a circuit board without damaging or soiling bumps. Specifically, the present invention is a transfer device 10 for transferring an element 21 held on a transfer substrate 22 onto a circuit board 23 having an electrode surface on which an electrode 23a is formed, the transfer device 10 having an energy irradiation unit 12 that irradiates an active energy ray 11 towards the element 21 through the transfer substrate 22 in a state in which the transfer substrate 22 faces the circuit board 23 and the element 21 is sandwiched therebetween, separates the element 21 from the transfer substrate 22, and biases the element 21 towards the circuit board 23. A prescribed surface side of the circuit board 23 has an auxiliary conductive function that aids in formation of conductivity between the electrode 23a and the element 21, and a catching function that adhesively retains the element 21 which is biased from the transfer substrate 22, and a member having the auxiliary conductive function is provided to at least the surface of the electrode 23a facing the element 21.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
The present invention addresses the problem of transferring an element such as a semiconductor chip with high precision and with a simple configuration. Specifically, provided is a transfer method for transferring, to a transfer-receiving substrate via laser lift-off, elements (1) that arranged at least along a first direction on a first main surface of a transfer substrate (20) and are held by a holding layer (10), said transfer method being characterized in that a first element transfer step is performed in which a region centered on the holding layer (10) holding a first element (1) to be transferred is irradiated from the second main surface side of the transfer substrate (20) with a laser using a first laser spot (50) of a size that irradiates a region larger than the entire area of at least one first element (1) to be transferred, the holding layer (10) holding the entire area of the first element (1) to be transferred is irradiated with a laser having an energy capable of separating the first element (1) to be transferred, and the first element (1) is transferred to the transfer-receiving substrate (30).
H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
The purpose of the present invention is to provide a slit die that is capable of achieving, as compared with a conventional slit die, greater uniformity in the width-direction shape of a coating formed in a stripe manner in the width direction. Provided is a slit die for applying a coating liquid to a base material, the slit die including: a manifold that is a space formed in an elongated manner in the width direction of the base material to store the coating liquid; a plurality of supply ports that are provided in the manifold so as to be arrayed in the width direction and that supply the coating liquid to the manifold; a slit that is elongated in the width direction so as to be connected to the manifold; a discharge port that discharges the coating liquid from the manifold via the slit; shims that partition the slit into a plurality of spaces in the width direction to form small slits; and partitions that partition the manifold into a plurality of spaces in the width direction to form small manifolds, wherein the partitions are configured so as to be disposed at positions at which at least one supply port is positioned in each of the small manifolds and at positions at which the manifold is partitioned so that each small slit is connected to one small manifold.
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
74.
MEDICINAL SOLUTION SYNTHESIS METHOD AND MEDICINAL SOLUTION SYNTHESIS APPARATUS
Provided are a medicinal solution synthesis method and a medicinal solution synthesis apparatus, whereby it becomes possible to improve the efficiency of the synthesis from a carrier and a medicinal solution in a reaction vessel part. More specifically, a medicinal solution synthesis method is provided, in which a medicinal solution is fed to a reaction vessel part while avoiding the contacting of the medicinal solution with the atmosphere and the medicinal solution is reacted with a carrier in the reaction vessel part, and in which a gas supply pipe for supplying a gas so as to stir the medicinal solution and the carrier is connected to the reaction vessel part through a pore member capable of forming air bubbles in the reaction vessel part. The method is so configured that the diameters of the air bubbles formed in the reaction vessel part by supplying the gas through the gas supply pipe can be varied by varying the opening area of each of pores in the pore member or the density of the pores.
B01J 8/24 - Chemical or physical processes in general, conducted in the presence of fluids and solid particlesApparatus for such processes with fluidised particles according to "fluidised-bed" technique
B01F 33/40 - Mixers using gas or liquid agitation, e.g. with air supply tubes
B01J 8/16 - Chemical or physical processes in general, conducted in the presence of fluids and solid particlesApparatus for such processes with particles being subjected to vibrations or pulsations
Provided are a lifting head and a lifting device that make it possible to maintain the position of a needle positioned on the lifting device so as to be easily removable. Specifically, the present invention has: a base member 2 that has a suctioned surface 2a; a spline shaft 4 that is supported on the base member 2 and has a raising/lowering axial channel 4a; a contact member 5 that is fixed to one end part of the spline shaft 4 and is to contact a raising/lowering drive mechanism 11 of a lifting device 10; a needle support member 7 that is fixed to the spline shaft 4 and supports a needle 8; and a needle cap 9 that has a stage 9a at one end part and is fixed to the base member. The suctioned surface 2a of the base member 2 is suctioned by the suction force of a first negative pressure passage 16e of an attachment member 16. When the contact member 5 is in contact with the raising/lowering drive mechanism 11, the inside of the needle cap 9 is suctioned by the suction force of a second negative pressure passage 14b of the raising/lowering drive mechanism 11 via the raising/lowering axial channel 4a.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/52 - Mounting semiconductor bodies in containers
The objective of the present invention is to provide a drying system capable of preventing the occurrence of wrinkles in a base material even if a coating film is heated. More specifically, this drying system, which is provided on a conveying route of a base material conveyed by roll-to-roll conveying, to dry a coating film applied to the base material while conveying the base material, comprises a heating unit for heating the coating film applied to the base material to vaporize a solvent contained in the coating film, and a moisture adjusting means for adjusting an amount of solvent contained in the coating film, wherein the moisture adjusting means is configured to adjust the amount of solvent contained in the coating film on the base material to a predetermined amount, at least when the conveyed base material passes through the heating unit and first comes into contact with a first conveying roller that comes into contact with the base material with a predetermined wrap angle.
F26B 13/04 - Machines or apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement with movement in a straight line using rollers
F26B 13/10 - Arrangements for feeding, heating or supporting materialsControlling movement, tension or position of materials
Provided are a joining device and a joining method which are capable of easily implementing joining that involves the activation of a joining surface. Specifically, this joining device 100, which joins a first element 21 and a second element 23, has: an activation part 30 which activates a first joining surface which is a joining surface of the first element 21, and a second joining surface which is a joining surface of the second element 23; and a joining part 10 which from a state where the first joining surface and the second joining surface are made to face each other with a predetermined gap therebetween, causes the first joining surface and the second joining surface to approach each other and be joined to each other by irradiation with active energy rays.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
B23K 20/00 - Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
Provided are a transfer device and a transfer method capable of reliably detaching an element from a transfer substrate and transferring the element to a transfer destination substrate. Specifically, a transfer substrate 22 is provided with a blistering layer 24 on which a blister 30 is generated through irradiation with an active energy ray. An element 21 is held on the blistering layer 24. A transfer destination substrate 23 is provided with a catch layer 25 on which the element 21 can be held. The catch layer 25 is disposed so as to face the transfer substrate 22. An energy irradiation unit 12, by generating the blister 30 in an element holding region 24a which is a region for holding one element 21 on the blistering layer 24, changes the inclination of the element 21 with respect to the transfer substrate 22 to bring the element 21 near the transfer destination substrate 23, and causes a portion of the element 21 to firstly make contact with the catch layer 25 in a state where the element 21 is held on the blistering layer 24.
The purpose of the present invention is to provide a coating device with which it is possible to maintain, in a stable manner, the spacing between a substrate and a coating part for applying a coating liquid. Specifically, the present invention provides a coating device for applying a coating liquid by means of a coating part onto a prescribed surface of a substrate transported by a roll-to-roll process, the coating part being provided with a body part formed so as to be elongated in the width direction of the substrate, a discharge port that is formed so as to project from the body part and that discharges the coating liquid onto the prescribed surface of the substrate, and a support member defining a transportation path for the substrate. The support member has a support roll in which the outer circumferential surface thereof comes into contact with the substrate. The support roll is provided so as to be integral with the body part so as to be located on the upstream side and/or the downstream side of the discharge port on the transportation path, so as to be in contact with at least a part of a non-coated region, of the prescribed surface of the substrate, on which no coating is formed.
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
80.
DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD
Provided is a defect inspection device making it possible, with a simple method, to automatically detect optimum optical conditions for imaging a region that includes a defect. A defect inspection device 1 comprises: an optical microscope 10 provided with an imaging unit 14 for capturing an image of a chip 31; a control unit 20 for controlling optical conditions for capturing the image of the chip; and a storage unit 25 for storing the location of a defect in the chip that has been detected in advance. The imaging unit is provided with a detecting means for: capturing, while changing the optical conditions, a first image of a region that includes the defect stored in the storage unit as well as a second image of a region that does not include the defect in the same region as the region that includes the defect; and detecting the optimum optical conditions for imaging the region that includes the defect by comparing a feature amount of the first image and a feature amount of the second image.
Provided are a substrate processing device and a scale correction method that make it possible to ascertain an actual movement amount of a substrate even in a case where a scale has undergone thermal expansion, and to suppress degradation in positional accuracy on the substrate. More specifically, this substrate processing device comprises: a stage whereon a substrate, for which at least two reference points are set, is placed; a substrate processing unit that performs predetermined processing of the substrate placed on the stage; a movement unit that moves the substrate atop the stage and the substrate processing unit relative to each other on the basis of scale reading information; and a control device that controls said stage and said units. The substrate processing device is configured to use the control device to perform scale correction in accordance with a deviation between a set distance between the reference points set for the substrate and an actual distance between the reference points set for the substrate conveyed onto the stage.
Provided are a coating film formation method and an ink jet coating device capable of suppressing formation of uneven coating even when a defective nozzle occurs. Specifically, the coating film formation method for ejecting liquid droplets by an ink jet method onto a film formation region on a base material to form a coating film comprises conducting, in this order: a defective nozzle detection step for detecting a defective nozzle among a plurality of nozzles ejecting liquid droplets; a pre-film formation step for conducting film formation by ejecting liquid droplets by a normal nozzle in advance onto a defective film formation region, which is a film formation region that will be formed by the defective nozzle detected by the defective nozzle detection step; and a main coating step for conducting film formation on the region other than landing position where the defective nozzle should eject.
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
B05D 1/36 - Successively applying liquids or other fluent materials, e.g. without intermediate treatment
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
The present invention accurately classifies defect patterns generated in an object to be inspected. Specifically, an automatic defect classification device 1 classifies defect patterns P generated in the object W to be inspected. The automatic defect classification device 1 comprises: a plurality of defect classification units 10 that classify the defect patterns P to obtain primary classification results R; a defect re-classification unit 20 that re-classifies the defect patterns P on the basis of the plurality of primary classification results R obtained by the plurality of defect classification units 10, to obtain a re-classification result T; and a re-classification registration unit 30 that registers a re-classification condition V according to the defect re-classification unit 20.
The objective of the present invention is to perform inspections with a high throughput even if multiple LED elements having different colors are arranged on one substrate. Specifically, this fluorescent inspection device for performing inspection by causing LED elements arranged on a substrate to emit fluorescence, comprises a substrate holding unit, an exciting light emitting unit, an image capturing unit, a relative movement unit, an inspecting unit, and a control unit, wherein: the exciting light emitting unit comprises a first light source and a second light source; the image capturing unit comprises a first image capturing camera for capturing an inspection image including light having a fluorescence wavelength, emitted from an LED element that emits first wavelength light, and a second image capturing camera for capturing an inspection image including light having a fluorescence wavelength, emitted from an LED element that emits second wavelength light; and the control unit causes the first image capturing camera and the second image capturing camera to capture images alternately with image-capture timings thereof offset relative to one another, while causing the relative movement unit to move relatively in one direction, and with image capture by the first image capturing camera synchronized with light emission by the first light source and image capture by the second image capturing camera synchronized with light emission by the second light source.
The present invention maintains the inspection accuracy of comparing an inspection image with a reference image by suppressing the influence of image blurring and afterimages, even if the movement speed when acquiring the inspection image increases. Specifically, this wafer inspection device performs inspection based on a captured inspection image of the exterior or interior of a wafer, and comprises: an image acquisition unit that acquires an inspection image; a reference image registration unit that registers a reference image that serves as an inspection reference for the inspection image; and an inspection unit that performs inspection by comparing the inspection image with the reference image. The inspection image is captured while an imaging means and the wafer are relatively moved, and the reference image is generated by non-defective product learning processing based on a plurality of learning images captured in the same direction as the direction of relative movement in which the inspection image is captured.
A positive electrode according to the present invention is a positive electrode of a lithium ion secondary battery in which a coating film containing a positive electrode active material is pressed against a surface of a positive electrode base material, and the positive electrode active material is a mixture of a first active material containing single particles of lithium composite oxide and a second active material containing secondary particles which are aggregated single particles of lithium composite oxide.
H01M 4/36 - Selection of substances as active materials, active masses, active liquids
H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodesLithium-ion batteries
H01M 4/131 - Electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
The present invention provides a mounting device and mounting method that are capable of achieving high-precision mounting with a mounting precision of 1 μm or smaller in face-down mounting, in which mounting is performed with electrode surfaces of a chip component and a substrate facing each other. Specifically, provided are: a mounting device comprising an attachment tool that holds a chip component, is transparent, and has a tool recognition mark, a chip position recognition means that simultaneously acquires position information of the tool recognition mark and a chip recognition mark in a state in which the chip component is held by the attachment tool, and a substrate position recognition means that acquires position information of the tool recognition mark and a substrate recognition mark, wherein on the basis of the information acquired by the chip position recognition means and the information acquired by the substrate position recognition means, a substrate stage or the attachment tool is moved in the substrate in-plane direction to align the chip component and the substrate; and a mounting method.
The purpose of the present invention is to provide a positioning device and a mounting device for enabling high precision and high speed when mounting a plurality of chip components to a large substrate. Specifically, the present invention provides: a positioning device characterized in that the positioning device comprises a substrate table for holding a substrate, a driving means for moving the substrate table and a processing means relative to each other, a processing position movement mechanism having a damping means for restricting the movement of at least one of the substrate table and the processing means caused by the driving means, and a control unit connected to the driving means and the damping means, the control unit restricting, by using the damping means, the movement of at least one of the substrate table and the processing means during the attachment process; and a mounting device using said positioning device.
The present invention provides a wafer inspection device that makes it possible, when inspecting a wafer which is affixed to a film material, to reliably hold the wafer without causing localized deformation (elongation etc.) in the film material, which is easily deformed. Specifically, provided is a wafer inspection device for inspecting a wafer which is supported by an adhesive film that is affixed to a ring-like frame, said wafer inspection device comprising: a holding unit that contacts the adhesive film and that holds the wafer at a prescribed orientation; an illumination unit that emits illumination light toward the wafer; an imaging unit that images the exterior and/or interior of the wafer; and an inspection unit that performs an inspection on the basis of an inspection image of the exterior and/or interior of the wafer as imaged by the imaging unit, wherein the part of the holding unit that contacts the adhesive film is a porous member, and the porous member is disposed so as to surround the wafer in a region which is set further outward that the edge of the wafer.
Provided is a coating apparatus with which it is possible to suppress formation of unevenness in coating and form a coating film having a uniform thickness even in the case when foreign matter is present between a stage and a substrate. Specifically, the coating apparatus comprises: a stage on which a substrate is to be placed; and a coating unit which forms a coating film on the substrate being placed on the surface of the stage, by discharging a coating liquid onto the substrate while moving in one direction relative to the substrate. The stage has: an exclusion area holding part which suctions and holds an exclusion area that is other than a coating area of the substrate where a coating film is to be formed; and a coating area holding part which suctions and holds the coating area. The exclusion area holding part is provided so as to enclose the coating area, and is so formed as to be capable of holding the substrate on the stage in a state where the coating area holding part is disabled.
B05C 13/00 - Means for manipulating or holding work, e.g. for separate articles
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 3/12 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
The objective of the present invention is to reliably detect defects that it is desired to detect, and to prevent detection of pseudo-defects, even in an outer peripheral portion of a wafer. Specifically, this wafer external appearance inspecting device for inspecting defects present in a wafer is provided with an inspecting unit for inspecting an inspection region set in the wafer, on the basis of an external appearance image in which an external appearance of the wafer has been captured, wherein the inspecting unit comprises: an outer edge position detecting unit for detecting a position of an outer edge portion of the wafer included in the external appearance image; an approximation line generating unit for generating a first approximation line in a position along the outer edge portion by performing approximation line fitting processing with respect to the outer edge portion in the external appearance image, and generating a second approximation line in a position offset from the first approximation line by a prescribed dimension toward the inside of the wafer; an outer periphery inspection region setting unit for setting, as an outer periphery inspection region, a region formed by the first approximation line and the second approximation line in the external appearance image; and an outer periphery inspecting unit for inspecting the outer periphery inspection region.
Provided is an automatic defect classifier that facilitates the correction of errors in classification categories assigned by a user, and can improve the accuracy of automatic defect classification, even when there are many defect images constituting training data. The automatic defect classifier, which uses training data to automatically assign classification categories to defect images for which the classification category is unknown, comprises: a training data evaluation classifier generation unit; a feature amount calculation unit; a category mismatch calculation unit that calculates the degree of mismatch between the feature amount in each defect image and the respective allowable thresholds for feature amounts set in the classification category that is the same as and classification categories that are different from the classification category assigned to each defect image; and a misclassified image detection unit that selects the classification category with the smallest calculated degree of mismatch, and detects, as misclassified images, images for which the selected classification category does not match the classification category assigned by the user and for which the degree of mismatch has been determined to exceed a predetermined threshold value.
A mounting device comprises a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism acquires position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates an amount of positional deviation between a chip component and a substrate from the position information about the chip recognition mark and the substrate recognition mark, and performs alignment by driving the mounting head and/or the substrate stage according to the amount of the positional deviation. The chip component and the substrate are brought closer with each other and the alignment is performed in a state in which the imaging unit simultaneously images the chip recognition mark and the substrate recognition mark within a depth of field, after which the chip component and the substrate are brought into close contact with each other.
[Problem] Provided is a method that is for producing a three-dimensional object and that enables effective prevention of collapse of an outer mold when thermally curing a thermosetting resin. [Solution] The method for producing a three-dimensional object according to the present disclosure is characterized by comprising a step for forming an outer mold by curing a resin composition containing a curable resin and thermally expandable microcapsules, a step for filling the outer mold with a thermosetting resin composition, and thermally curing the thermosetting resin composition, and a step for heating the outer mold to at least the foaming initiation temperature of the thermally expandable microcapsule to cause the outer mold to collapse, and removing a three-dimensional object formed of the cured thermosetting resin composition, and is characterized in that the heating temperature in the step for thermally curing the thermosetting resin composition is lower than the foaming initiation temperature of the thermally expandable microcapsule by at least 30°C.
B29C 69/00 - Combinations of shaping techniques not provided for in a single one of main groups , e.g. associations of moulding and joining techniquesApparatus therefor
Provided is a lighting device that can easily select and emit light having a specific wave length. Specifically, this lightning device is provided with: a light source unit that outputs light having a specific wavelength; an illumination unit that emits light output from the light source unit: and a light guiding path part that connects the light source unit and the illumination unit. The lighting device is configured such that: the light guiding path part has light-source-side optical fiber wires which are connected to the light source unit and which enable transmission of light output from the light source unit, illumination-side fiber wires which are connected to the illumination unit and which enable transmission of light to the illumination unit, and a guide connection part for connecting between the light-source-side optical fiber wires and the illumination-side fiber wires; the light source unit is formed so as to be able to selectively output light having different wavelengths; in the guide connection part, the light-source-side optical fiber wires are held in a collective state, and the collectively held light-source-side optical fiber wires and the illumination-side fiber wires are held in a state of facing each other; and by changing the wavelength at the light source unit, selected light is emitted from the illumination unit.
09 - Scientific and electric apparatus and instruments
10 - Medical apparatus and instruments
37 - Construction and mining; installation and repair services
42 - Scientific, technological and industrial services, research and design
Goods & Services
Chemical processing machines and apparatus; textile machines
and apparatus; food or beverage processing machines and
apparatus; painting machines and apparatus; plastic
processing machines and apparatus; semiconductor
manufacturing machines and systems. Optical machines and apparatus; measuring or testing
machines and instruments; computer programs; echo sounders;
ultrasonic flaw detectors; ultrasonic sensors; electron
microscopes. Medical apparatus and instruments. Construction. Designing of machines, apparatus, instruments [including
their parts] or systems composed of such machines, apparatus
and instruments; computer software design, computer
programming, or maintenance of computer software.
97.
LITHIUM ION BATTERY WITH BARRIER FILM AND METHOD FOR PRODUCING LITHIUM ION BATTERY WITH BARRIER FILM
The purpose of the present invention is to provide a lithium ion battery with a barrier film that is capable of suppressing etching by hydrogen fluoride and of maintaining barrier properties, and a method for producing the lithium ion battery with a barrier film. The lithium ion battery with a barrier film in which the barrier film is formed on at least part of the outer peripheral surface of a battery portion, wherein the barrier film has a barrier layer that suppresses the infiltration of moisture into the battery portion, and a buffer layer having higher etching resistance to hydrogen fluoride than the barrier layer, and the barrier film is formed so that the buffer layer is in contact with the battery portion.
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
A purpose of the present invention is to provide a drying device that can convey a base material in a stable state when drying a coating film formed on the base material. This drying device is provided on a conveyance path for roll-to-roll conveyance of a base material, and dries a coating film formed on the base material. The coating film is formed on a prescribed surface of the base material in a stripe pattern in the width direction of the base material so as to have a plurality of application sections on which the coating film is formed, and non-application sections where the coating film is not formed between the plurality of application sections. The drying device includes a drying nozzle that dries the coating film by blowing a gas on the prescribed surface of the base material and/or the reverse surface from the prescribed surface of the base material. The drying nozzle has a wind pressure regulation means for regulating such that the wind pressure at locations facing the non-application sections is lower than the wind pressure at locations facing the application sections.
B05C 9/14 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating
F26B 13/04 - Machines or apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement with movement in a straight line using rollers
F26B 13/10 - Arrangements for feeding, heating or supporting materialsControlling movement, tension or position of materials
To provide a drying device that is capable of conveying a base material in a stable state when drying a coated film formed on the base material. Specifically, a drying device 2 that dries a coated film coated on a base material W while conveying the base material W in a predetermined direction includes a drying nozzle 22 that causes flotation of the base material W and dries the coated film by blowing air toward the base material W, and a touching member 24 that comes into contact with the base material W in a flotation region that is a region in which the base material W is in a floating state due to the drying nozzle 22, wherein the coated film is formed on part of the base material W in a width direction thereof, and the touching member 24 comes into contact with the base material W in a non-coated portion H that is a portion on which the coated film is not formed.
B05C 9/12 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
F26B 13/10 - Arrangements for feeding, heating or supporting materialsControlling movement, tension or position of materials
F26B 13/20 - Supporting materials by fluid jets, e.g. air
The purpose of the present invention is to provide a drying system which can reduce energy consumption more than conventional systems in a drying step for a coating film in the manufacturing process of a lithium-ion battery. This drying system, which is for drying a coating film made of a slurry of an electrode material formed on a base material in the manufacturing process of a lithium-ion battery, comprises: a gas supply unit that supplies gas to be used in order to dry the coating film; a drying unit that heats the gas supplied by the gas supply unit and heats the coating film formed on the base material with the heated gas to dry the coating film; a gas discharge unit that discharges a portion of the gas from the drying unit; a solvent recovery unit that cools and recovers a solvent vaporized by the coating film being heated by the drying unit; a circulation path that circulates the gas between the drying unit and the solvent recovery unit; and a first heat exchange unit that performs heat exchange between the gas heading from the drying unit to the solvent recovery unit through the circulation path, and the gas heading from the solvent recovery unit to the drying unit through the circulation path.
B05C 9/14 - Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by groups , or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating
F26B 13/04 - Machines or apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement with movement in a straight line using rollers
F26B 21/00 - Arrangements for supplying or controlling air or gases for drying solid materials or objects
F26B 21/04 - Circulating air or gases in closed cycles, e.g. wholly within the drying enclosure partly outside the drying enclosure
