Provided are a chip conveyance means and a mounting device that enable reduction in device cost and installation space in conveyance and mounting of a semiconductor chip without causing an electrode surface of the semiconductor chip to come into contact with other substances. Specifically, provided is a chip conveyance means comprising: a tool slider for receiving at a chip supply part and holding a semiconductor chip in a state of being held by an attachment tool, together with the attachment tool; and a conveyance rail for conveying the tool slider to a mounting part. The tool slider: has a function of delivering the semiconductor chip together with the attachment tool to a mounting head of the mounting part, and a function of receiving only the attachment tool after the semiconductor chip is mounted by the mounting head; and is capable of conveying only the attachment tool to the chip supply part along the conveyance rail.
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
Provided are a chip component mounting device and a chip component mounting method capable of highly accurately adjusting the parallelism of a holding surface of an attachment with respect to a substrate stage. Specifically, the chip component mounting method includes a parallelism adjustment step (step S05) for adjusting the parallelism of a holding surface 43a, and a parallelism measurement step (step S06) for measuring the parallelism of the holding surface 43a. In the parallelism measurement step, the measurement of the parallelism of the holding surface 43a is executed through calculation based on the relationship between: a plurality of positions of the holding surface 43a in the up-down direction measured when the holding surface 43a is pushed against a height reference rod 3 from above each time the position of the height reference rod 3 is horizontally shifted; and the positions of the height reference rod 3 in the corresponding measurements. In the parallelism adjustment step, the adjustment of the parallelism of the holding surface 43a is executed by lowering a bonding head 42 in a state in which the height reference rod 3 is shifted to a horizontal position coordinate (prescribed position) and pushing the holding surface 43a against the height reference rod 3.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
Provided is a device manufacturing system and a device manufacturing method that make it possible to accurately arrange an element with respect to the position of a target in a short time. Specifically, a device manufacturing system 100 comprises: a singulating device 100b including a singulation processing unit 20 that forms a plurality of semiconductor chips 1 by singulating an element region formation substrate W having formed therein regions that are to become the semiconductor chips 1, in a state where the element region formation substrate W is disposed in a laminated manner on a release layer R on a transfer substrate T; and a transfer device 100c including a laser light irradiation unit 70 that irradiates the transfer substrate T with laser light L in a Z1 direction opposite to a surface of the transfer substrate T on which the semiconductor chips 1 are disposed so as to release the plurality of singulated semiconductor chips 1 from the transfer substrate T and transfer the plurality of singulated semiconductor chips 1 to a target support substrate G.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
4.
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Provided are a laser processing device and a laser processing method which are capable of performing processing by accurately irradiating a target position with laser light. Specifically, this laser processing device 100 comprises: a laser light irradiation unit 10 that irradiates a wiring pattern 2, which is an object, with laser light L; a visible light imaging unit 20 that acquires a visible light image 50v by imaging a visualization member 50 that generates visible light Lv for position identification at the position irradiated with the laser light L; and a control unit 60 that, on the basis of the position of the visible light Lv for position identification captured in the visible light image 50v, adjusts the relative positions between the irradiation position of the laser light L and the wiring pattern 2 so that the wiring pattern 2 is irradiated with the laser light L, and laser processing is performed on the wiring pattern 2.
B23K 26/02 - Mise en place ou surveillance de la pièce à travailler, p. ex. par rapport au point d'impactAlignement, pointage ou focalisation du faisceau laser
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
A transfer device is configured to irradiate a transfer substrate with active energy rays to transfer an element held by the transfer substrate to a receiving substrate. The transfer device comprises and energy emission unit and an irradiation position control unit. The energy emission unit is configured to intermittently emit the active energy rays. The irradiation position control unit is configured to control irradiation position of the active energy rays emitted from the energy emission unit on the transfer substrate. A time interval for irradiation of the active energy rays onto the transfer substrate is adjusted in accordance with a movement speed of the irradiation position of the active energy rays on the transfer substrate, as controlled by the irradiation position control unit.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
The present invention provides a chip vacuum pickup tool (1) that ensures holding force even when picking up a thin and large semiconductor chip (C), and without applying stress that may damage the semiconductor chip (C). Specifically, the present invention provides a chip vacuum pickup tool (1) comprising: a collet (30) having a flat portion (33) that adheres closely to a semiconductor chip (C) and provided with a vacuum suction hole (31) in the flat portion (33), and a holder (20) that holds the collet (30), wherein the holder (20) has a protruding portion (20) provided with a through hole (21) connected to the vacuum suction hole (31) on the surface that holds the collet (30) and a side wall (23) that adheres closely to the perimeter of the collet (30), and a recessed portion (32) that fits with the protruding portion (20) of the holder (20) is formed in the collet (30).
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
The purpose of the present invention is to provide a positioning device capable of detecting, at an arbitrary target position, a positioning error of an object to be positioned caused by a change in the attitude angle of a stage. Specifically, the present invention is a positioning device comprising: a base; a stage that is supported by the base and, where an arbitrarily determined movement direction is an X direction, has a planar surface including the X direction and a Y direction orthogonal to the X direction used as a mounting surface, and is moved to an arbitrary position in the X direction; and an X-direction target position detection unit that measures an X-direction target position that is the position of the stage in the X direction relative to the base, and said positioning device places, in an arbitrary position in the X direction, an object to be positioned that is mounted on the mounting surface of the stage. The positioning device comprises at least one of a Z-axis rotation detection unit that detects rotation around the Z-axis, a Y-axis rotation detection unit for detecting rotation around the Y-axis, and an X-axis rotation detection unit that detects rotation around the X-axis.
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
B05C 11/00 - Parties constitutives, détails ou accessoires non prévus dans les groupes
B05C 13/02 - Moyens pour manipuler ou tenir des objets, p. ex. des objets individuels pour des objets particuliers
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p. ex. automatique
The present invention provides a mounting device and a positioning method capable of placing chip components at prescribed positions on a substrate with minimal misalignment in the case of mounting the chip components on the substrate by using a stamp that holds a plurality of chip components. Specifically, the present invention provides a mounting device and a positioning method using same, the mounting device comprising a substrate stage that holds a substrate, a stamp that holds a plurality of chip components, a stamp base that holds the stamp, and an imaging means for observing the stamp base and the substrate from the same direction, wherein the stamp and the stamp base are transparent, and the imaging means can acquire position information about the stamp and/or the stamp base along with position information about the substrate at the same time.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
Provided is a mounting device that, when a stamp that retains a plurality of chip components is used to mount chip components on a substrate, can evaluate the degree of parallelism of the substrate and the stamp with relative ease and high frequency. Specifically, provided is a mounting device comprising: a substrate stage that retains a substrate; a stamp that retains a plurality of chip components; a stamp base that retains the stamp and raises and lowers the stamp with a surface retaining the chip components facing the substrate; and an optical thickness meter that performs thickness measurement using the reflection of projected light. The mounting device has a function of: projecting light past the stamp base by using the optical thickness meter; and measuring a gap between the surface of the stamp retaining the chip components and a surface of the substrate by using light reflected by the surface of the substrate and light reflected by the surface of the stamp retaining the chip components.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
G01B 11/14 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la distance ou la marge entre des objets ou des ouvertures espacés
Provided is a substrate holding device which enables a substrate to be securely suction-attached to a stage. Specifically, the substrate holding device 10 comprises: a stage 11 which has a flat surface 12 on which a substrate W1 is mounted and to which the substrate W1 can be suction-attached; a plurality of support pins 15 which are disposed in a portion 13 of the stage 11 having the flat surface 12 and which have a tip end on which the substrate W1 is mounted; a plurality of outer guide pins 18 which are disposed in a portion of the stage 11 around the flat surface 12; and a pressing member 25 which is capable of descending from a retracted position above the flat surface 12. The support pins 15 can be displaced between an upper position in which the tip end projects upward from the flat surface 12 and a lower position where the tip end is lower than the flat surface 12. The outer guide pins 18 are disposed so as to be capable of contacting the outer peripheral edge of the substrate W1, which is mounted on the support pins 15 displaced to the lower position, from a plurality of directions. The pressing member 25 descends from the retracted position and pushes the substrate W1 onto the flat surface 12.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
11.
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Provided are a laser processing device and a laser processing method that, even when processing is performed with processing laser light including high-frequency laser light, are capable of accurately determining a processing failure on the basis of the laser light energy during the processing. Specifically, a laser processing device 100 acquires a correlation between energy TE of low-frequency laser light LT and a light intensity corresponding value TN, which is a value corresponding to the intensity of the low-frequency laser light LT, and determines, on the basis of the acquired correlation and a processing light intensity corresponding value WN, which is a value corresponding to the intensity of processing laser light LW including high-frequency laser light, a processing failure in processing performed with the processing laser light LW including high-frequency laser light.
Provided are a laser processing device and a laser processing method that are capable of accurately emitting laser light to a target position so as to perform processing on an object. Specifically, the present invention comprises: a laser light emission unit 10 that emits laser light L toward a wiring pattern 2; a visible light camera 30 that acquires a visible light image 60v by imaging a glass substrate 60 which is used to adjust the laser light L irradiation position; an IR camera 20 that acquires a laser light image 70i by imaging the laser light L which is emitted from the laser light emission unit 10 and that acquires an infrared light image 60i by imaging infrared light with which the glass substrate 60 is irradiated; and a control unit 80 that adjusts the relative positions of the laser light L irradiation position and the wiring pattern 2 on the basis of the visible light image 60v, the infrared light image 60i, and the laser light image 70i so that the wiring pattern 2 is irradiated with the laser light L, and that controls laser processing on the wiring pattern 2.
B23K 26/02 - Mise en place ou surveillance de la pièce à travailler, p. ex. par rapport au point d'impactAlignement, pointage ou focalisation du faisceau laser
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
13.
APPEARANCE INSPECTION DEVICE AND METHOD FOR CONTROLLING APPEARANCE INSPECTION DEVICE
Provided is an appearance inspection device capable of adsorbing and fixing a wafer to a table even when the wafer is warped. Specifically, this appearance inspection device 100 includes: a table 30 for adsorbing a semiconductor wafer W on a mounting surface of the semiconductor wafer W for mounting the semiconductor wafer W and fixing the semiconductor wafer W; and an air blowing part 40 for blowing compressed air onto the semiconductor wafer W. The air blowing part 40 can change a position relative to the table 30, and is configured to blow compressed air so as to press the semiconductor wafer W mounted on the surface of the table 30 against the surface of the table 30 in order to assist in fixing the wafer to the table when the semiconductor wafer W is adsorbed on the mounting surface.
G01N 21/956 - Inspection de motifs sur la surface d'objets
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
14.
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Provided are a laser processing device and a laser processing method wherein it is possible to accurately irradiate a target location with a laser beam outside of the visible light range to process a workpiece. Specifically, on the basis of a laser beam image 80 that is a captured image of a laser beam L composed of non-visible light outside of the visible light range and was captured by a common wide-area camera 20, and a workpiece image 70 that is a captured image of a wiring pattern 2 and is obtained by imaging visible light, this laser processing device 100 adjusts the irradiation location of the laser beam L such that the laser beam L irradiates the wiring pattern 2 at a processing location P, to perform laser processing of the wiring pattern 2.
B23K 26/02 - Mise en place ou surveillance de la pièce à travailler, p. ex. par rapport au point d'impactAlignement, pointage ou focalisation du faisceau laser
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
15.
MANUFACTURING METHOD FOR ELECTRODE AND MANUFACTURING DEVICE FOR ELECTRODE
Provided are: a manufacturing method for a battery for a secondary battery with which it is possible to reduce manufacturing cost without using a slurry; and a manufacturing device for such a battery for a secondary battery. Specifically, the provided manufacturing method for an electrode for a secondary battery includes: a formation step of forming powder particles 12 in which a binder 17 is coated on a surface of active material particles 16 into a sheet shape on a surface of a current collector 11; and a heating press step of forming an active material layer 14 on the current collector 11 by heating and pressing the powder particles 12 formed into a sheet shape.
Provided is a perovskite film evaluation method with which an evaluation can be performed in-line with good accuracy. Specifically, the perovskite film evaluation method comprises: a step (A) of irradiating a perovskite film with excitation light having an energy greater than a band gap of a perovskite crystal, and acquiring a peak intensity of an emission spectrum of photoluminescence emitted from the perovskite film; a step (B) of irradiating the perovskite film with light having an energy greater than a band gap of a perovskite crystal, and acquiring a transmittance of the perovskite film; and a step (C) of evaluating a crystal state of the perovskite film on the basis of a combination of the peak intensity and the transmittance acquired in the step (A) and the step (B).
G01N 21/27 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en utilisant la détection photo-électrique
G01N 21/57 - Réflexion spéculaire en mesurant le brillant
H02S 50/15 - Tests de dispositifs PV, p. ex. de modules PV ou de cellules PV individuelles utilisant des moyens optiques, e.g. utilisant l'électroluminescence
H10K 30/40 - Dispositifs organiques sensibles au rayonnement infrarouge, à la lumière, au rayonnement électromagnétique de plus courte longueur d'onde ou au rayonnement corpusculaire comprenant une structure p-i-n, ayant p. ex. un absorbeur pérovskite entre des couches de transport de charge de type p et de type n
The present invention suppresses a decrease in temperature of a coating film when transferring a base material from a first drying part to a second drying part. Specifically, a drying apparatus 10 comprises: a first drying part 11 that dries a coating film P applied on a base material W; and a second drying part 12 that further dries the coating film P of the base material W transferred from the first drying part 11. The first drying part 11 includes: a first heating device 21 for heating the coating film P; and a second heating device 22 for raising the atmospheric temperature of the first drying part 11, or heating the base material W or the coating film P at the first drying part 11.
F26B 3/30 - Procédés de séchage d'un matériau solide ou d'objets impliquant l'utilisation de chaleur par radiation, p. ex. du soleil à l'aide d'éléments émettant des rayons infrarouges
F26B 13/10 - Aménagements pour l'alimentation, le chauffage ou la tenue du matériauCommande du mouvement, de la tension ou de la position du matériau
The present invention inhibits position aberration between an inspection image and a reference image in inspecting an inspection target. Specifically, an inspection device 1 compares an inspection image J with a reference image K to thereby inspect an inspection target. For the reference image, a registration pattern Pk is registered. For the inspection image, a detection pattern Pj is detected. The inspection image is aligned with the reference image on the basis of the position of the detection pattern and the position of the registration pattern. For the reference image: a temporary registration pattern Q is temporarily registered among a plurality of patterns P formed for the inspection target; a first pattern candidate T1 and a second pattern candidate T2 which are similar to the temporary registration pattern are searched for; a similarity difference ΔF between the similarity of the temporary registration pattern to the first pattern candidate and the similarity of the temporary registration pattern to the second pattern candidate is compared with a threshold value G; and when the similarity difference is smaller than the threshold value, the temporary registration pattern is not registered as the registration pattern, and when the similarity difference is greater than the threshold value, the temporary registration pattern is registered as the registration pattern.
The present invention provides a mounting device for achieving secure mounting while preventing attachment tool contamination when performing face-down mounting of a chip component onto a board using a pre-applied underfill. Specifically, there is provided a mounting device comprising: a board stage that holds a board; a mounting head that holds a chip component; a lifting means that raises and lowers the mounting head in a direction perpendicular to the board; an imaging means for observing the chip component held by the mounting head; a chip temporary holding unit allowing the chip component to be transferred to and from the mounting head; and a control unit which is connected to the imaging means and which calculates the position of the chip component relative to an attachment tool that forms a surface of the mounting head for holding the chip component.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
Provided is a mounting device with which it is possible to suppress variation in temperature when heating an integrated package having a non-uniform thermal conductivity and suppress connection failure of the integrated package to a substrate. Specifically, the present invention comprises: a stage; a pressing unit that presses the substrate and the integrated package; a first attachment that is supported by the stage and comes into contact with one of the substrate and the integrated package; a second attachment that is supported by the pressing unit and comes into contact with the other of the substrate and the integrated package; a first heating unit that heats the first attachment; and a second heating unit that heats the second attachment. At least one of the first heating unit and the second heating unit has a plurality of heating regions based on a distribution of a pressing direction thermal conductivity, which is the thermal conductivity of the integrated package. The plurality of heating regions are configured so as to be able to generate heat at different heat generation amounts per unit time and per unit area.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
Provided is a mounting device which is capable of suppressing temperature unevenness caused when an integrated package having a non-uniform thermal conductivity is heated and thereby suppressing a faulty connection of the integrated package to a board. Specifically, the mounting device has: a stage 10 on which at least one from among an integrated package β and a board α is mounted; a pressing unit 23 for pressing the board α and the integrated package β; at least one heater from among a first heater 12 and a second heater 26 for heating the board α and the integrated package β; at least one attachment from among a first attachment 13 and a second attachment 26 which contacts either the board α or the integrated package β. The first attachment 13 and the second attachment 26 have a pressing direction thermal conductivity based on the distribution of the pressing direction thermal conductivity of the integrated packageβ in the moving direction of the pressing unit 23.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
A slit die comprises a manifold, a plurality of supply ports, a slit, a discharge port, a shim and a partition portion. The manifold is formed elongated in a width direction. The supply ports are provided in the manifold so as to be arranged in the width direction. The slit is connected to the manifold and is elongated in the width direction. The discharge port discharges the coating liquid from the manifold via the slit. The shim partitions the slit into a plurality of spaces in the width direction to form small slits. The partition portion partitions the manifold into a plurality of spaces in the width direction to form small manifolds. At least one of the supply ports is located in each small manifold. One of the small manifolds connects to one of the small slits.
B05C 5/02 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage à partir d'un dispositif de sortie en contact, ou presque en contact, avec l'ouvrage
The present invention accurately classifies patterns of defects occurring in an object to be inspected. Specifically, a defect classification device 1 includes a classification unit 10 for classifying patterns of defect X occurring in an object W to be inspected that has been imaged so as to be divided into a plurality of visual fields F. The plurality of visual fields include a first visual field F1 and a second visual field F2 adjacent to each other. A first end part F1p on the second visual field side of the first visual field and a second end part F2p on the first visual field side of the second visual field overlap each other. The first visual field includes a first defect X1. The second visual field includes a second defect X2. The classification unit cuts out a region in which the first defect appears in the first visual field as a first defect image C1, and cuts out a region in which the second defect appears in the second visual field as a second defect image C2. When the first defect image includes the first end part and the second defect image includes the second end part, the classification unit classifies the patterns of the defects in a state in which the first defect image and the second defect image are aligned such that the first defect and the second defect overlap.
A lifting head comprises a base member that has a suctioned surface, a raising/lowering shaft supported by the base member and having a raising/lowering axial channel, a contact member fixed to one end of the raising/lowering shaft and contacting with a raising/lowering drive mechanism of a lifting device, a needle support member fixed to the other end of the raising/lowering shaft and supporting a needle, and a needle cap having a stage at one end thereof and fixed to the base member. The suctioned surface of the base member is gripped by a suction force of a first negative pressure passage of an attachment member of the lifting device. While the contact member contacts with the raising/lowering drive mechanism, an inside of the needle cap is suctioned by a suction force of a second negative pressure passage of the raising/lowering drive mechanism via the raising/lowering axial channel.
B25J 15/04 - Têtes de préhension avec possibilité pour l'enlèvement ou l'échange à distance de la tête ou de parties de celle-ci
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
25.
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM
Provided is an electronic component mounting method that makes it possible to produce a highly reliable fluxless bond by means of a simple device. According to the present invention, an electronic component mounting method involves bonding a bump 22 formed on a first electrode 21 of a first electronic component 20 to a second electrode 11 of a second electronic component 10 and includes an etching step for etching the first electronic component and the second electronic component with a weakly acidic organic acid to remove an oxide film formed on the surface of the bump and the second electrode and, after the etching step, a bonding step for bonding the bump formed on the first electrode to the second electrode in a state in which the first electronic component and the second electronic component are accommodated in a bonding device 70 and an inert gas has been supplied to the bonding device.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
B23K 1/20 - Traitement préalable des pièces ou des surfaces destinées à être brasées, p. ex. en vue d'un revêtement galvanique
B23K 31/02 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs au brasage ou au soudage
A mounting device comprises an attachment tool configured to hold a surface of a chip component opposite to a surface having a chip recognition mark, a substrate stage configured to holds a substrate, a reflection light source configured to irradiate light containing wavelengths that pass through the chip component from the attachment tool side toward the substrate, and a recognition unit configured to recognize reflected light of the light irradiated by the reflection light source, the recognition unit being configured to acquire an image formed by light that passes through the chip component and is reflected by the substrate, to acquire position information of the substrate recognition mark.
B23K 37/04 - Dispositifs ou procédés auxiliaires non spécialement adaptés à un procédé couvert par un seul des autres groupes principaux de la présente sous-classe pour maintenir ou mettre en position les pièces
Provided is a variable resistance device that can set a desired resistance value while measuring the resistance value of a variable resistor. Specifically, this variable resistance device 100 comprises: a variable resistor 10 that includes a resistor 11 that has a first terminal t1 and a second terminal t2 and a slider 12 that has a third terminal t3 and is configured such that the position P at which the slider 12 contacts the resistor 11 can be changed; a drive unit 40 that moves and thereby changes the position of the slider 12 as in contact with the the resistor 11; an input-side resistance measurement unit 20 that measures an input-side variable resistance value R1 that is the resistance value between the first terminal t1 and the third terminal t3; and a control unit 30 that, when an output-side variable resistance value R2 that is the resistance value between the second terminal t2 and the third terminal t3 is adjusted to a desired output resistance value, controls the drive unit 40 to change the position at which the slider 12 contacts the resistor 11 on the basis of the input-side variable resistance value R1 measured by the input-side resistance measurement unit 20.
Provided is an element transfer method capable of transferring an element while suppressing breakage of the element caused by deformation of an adhesive layer, even when the element has a relatively small thickness. More specifically, this semiconductor chip transfer method (element transfer method) comprises: an disposition step in which an adhesive layer 2, a resist 3, and a semiconductor chip 1 are disposed in this order on a transfer substrate 10; and a transfer step in which the semiconductor chip 1 is transferred to a transfer-receiving substrate 20 by irradiating the transfer substrate 10 with laser light L from the side opposite to the surface of the transfer substrate on which the semiconductor chip 1 is disposed. The adhesive force between the adhesive layer 2 and the resist 3 is larger than the adhesive force between the resist 3 and the semiconductor chip 1, and thus in the transfer step, the resist 3 remains on the transfer substrate 10 side.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
H01L 21/58 - Montage des dispositifs à semi-conducteurs sur des supports
H10D 84/00 - Dispositifs intégrés formés dans ou sur des substrats semi-conducteurs qui comprennent uniquement des couches semi-conductrices, p. ex. sur des plaquettes de Si ou sur des plaquettes de GaAs-sur-Si
Provided is a coating device that suppresses breakage of a substrate. A coating device (400) is configured so that: a substrate is caused to float on floating stages (420, 460) and a coating stage (440) and thereby be conveyed thereon; and a processing liquid is applied to the substrate on the coating stage (440). The floating stages (420, 460) are disposed on the upstream side and/or the downstream side of the coating stage (440) in the conveyance direction of the substrate. The coating device (400) comprises: measuring instruments (430, 450, 429, 449) for obtaining measured values corresponding to distances between the upper surface of the coating stage (440) and the upper surfaces of the floating stages; and a controller for controlling an actuator for driving the coating stage (440) in the normal direction of the upper surface of the coating stage such that the measured values are within a predetermined range.
H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
B05C 3/15 - Appareillages dans lesquels un ouvrage est mis en contact avec une grande quantité de liquide ou autre matériau fluide l'ouvrage étant immergé dans le liquide ou autre matériau fluide pour traiter un ouvrage de longueur indéfinie non supporté par des transporteurs
B05C 5/00 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
Provided is an ion channel analysis device capable of obtaining a mathematical parameter for analyzing a state of an ion channel. Specifically, an ion channel analysis device 1 comprises: a detection unit 20 that detects an ion current I flowing through an ion channel 10; and an analysis unit 30 that acquires first data 40 related to the ion current I detected by the detection unit 20. There is a regression model M using, as teacher data, the known first data 40 and a known mathematical parameter 70 corresponding to the known first data 40. The analysis unit 30 outputs the mathematical parameter 70 corresponding to the input first data 40 by inputting the first data 40 related to the ion current I detected by the detection unit 20 to the regression model M.
Provided is an inspection device capable of obtaining accurate coordinates of a chip provided on a substrate. Specifically, this inspection device comprises: a stage on which a target substrate is placed; a camera that images the target substrate to obtain a captured image; and a controller that calculates a target measurement value of target coordinates of a chip with respect to a target origin of the target substrate on the basis of the distance between an image reference position and the chip in the direction in which pixels are arranged and a relative movement set value between the stage and the camera. The controller corrects the target measurement value by using a projective transformation matrix to calculate a target correction value. The controller calculates an alignment measurement value of the alignment coordinates with respect to an alignment origin of an alignment substrate on the basis of the distance between the image reference position and an alignment mark in the direction in which the pixels are arranged, in a state in which the alignment origin is aligned with the image reference position. The controller calculates a parameter of the projective transformation matrix on the basis of the alignment measurement value and a known alignment actual measurement value.
Provided is a substrate holding device with which substrates of various sizes can be suctioned to a stage. Specifically, a substrate holding device 1 is equipped with a stage 10 for holding a substrate W. The stage 10 includes: a placement surface 60 on which the substrate W is placed; and a plurality of suction grooves 70 formed of recesses provided on the placement surface 60 and arranged concentrically. The suction grooves 70 suck the substrate W by negative pressure. The placement surface 60 includes a boundary portion 61 that intersects with the suction grooves 70. The suction grooves 70 are each divided by the boundary portion 61.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
33.
APPEARANCE INSPECTION DEVICE AND APPEARANCE INSPECTION METHOD
Provided are an appearance inspection device and an appearance inspection method capable of detecting the height of a defect present on the surface of an object without performing additional processing on the object itself. Specifically, this appearance inspection device 100 comprises: an imaging unit 5 that acquires a detection image 20 that is a visible light image in which a semiconductor wafer U and a defect D present in the semiconductor wafer U appear; and a processing unit 1 that detects the height of the defect D with respect to the semiconductor wafer U on the basis of the detection image 20. The imaging unit 5 images a plurality of the detection images 20 while changing the distance between the imaging unit 5 and the semiconductor wafer U. The processing unit 1 is configured to detect the height of the defect D with respect to the semiconductor wafer U on the basis of the degree of variation in pixel values of a defect portion 12, in which the defect D appears, in each of the plurality of detection images 20.
The present invention provides an appearance inspection device capable of acquiring information for appropriately detecting a defective portion in an appearance image showing an object even when the degree of surface roughness is different depending on the object. Specifically, provided is an appearance inspection device 100 comprising: an image acquisition unit 5 that acquires an appearance image 10 of a semiconductor wafer U; and a processing unit 1 that generates a detection image 10c for detecting a defective portion 12 by performing detection filter processing on the appearance image 10. The processing unit 1 is configured to generate the detection image 10c according to the degree of roughness of a surface S of the semiconductor wafer U appearing in the appearance image 10 by performing detection filter processing for reducing detection sensitivity to the defective portion 12 and the defective portion 13 as the degree of roughness of the surface S of the semiconductor wafer U appearing in the appearance image 10 increases.
A coating device comprises a stage, a coater and a dryer. A substrate is configured to be placed on the stage. The coater is configured to eject a coating liquid from a nozzle to form a coating film on the substrate that is placed on the stage while moving relative to the substrate. The dryer is configured to dry the coating film on the substrate. Drying promotion force of the dryer for promoting drying is adjusted on the basis of drying distribution information of the coating film on the substrate in accordance with a region of the coating film.
B05C 5/00 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage
B05C 5/02 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage à partir d'un dispositif de sortie en contact, ou presque en contact, avec l'ouvrage
F26B 21/12 - Commande, p. ex. régulation des paramètres de l'alimentation en gaz de la vitesse d'écoulementCommande, p. ex. régulation des paramètres de l'alimentation en gaz du débit
36.
WAFER DIVIDING METHOD AND MACHINING METHOD, AND WAFER DIVIDING DEVICE
Provided are a wafer dividing method, wafer machining method, and wafer dividing device that make it possible to increase the semiconductor material utilization efficiency, mainly in power semiconductor usages. Specifically, provided is a wafer dividing method for obtaining thin wafers that includes attaching fixing plates to both sides of a wafer comprising at least a semiconductor crystal, and cutting the wafer near the middle in the thickness direction while holding the fixing plates on both sides, thereby obtaining two thin wafers attached to the fixing plates.
B28D 5/04 - Travail mécanique des pierres fines, pierres précieuses, cristaux, p. ex. des matériaux pour semi-conducteursAppareillages ou dispositifs à cet effet par outils autres que ceux du type rotatif, p. ex. par des outils animés d'un mouvement alternatif
Provided is a coating device capable of preventing a film thickness distribution of a coating film from changing after the coating film has been formed. Specifically, the device comprises: an attachment stage (10) having an attachment surface (10a) for attaching and holding a substrate (W); a coating unit (20) that applies a coating liquid to the substrate (W) attached to and held by the attachment stage (10) and forms a coating film (M) on the substrate (W); and a drying promotion unit (30) that, after the coating film (M) has been formed, promotes the drying of the coating film (M) on the substrate (W) while the attachment and holding of the substrate by the attachment stage (10) is being maintained.
B05C 13/02 - Moyens pour manipuler ou tenir des objets, p. ex. des objets individuels pour des objets particuliers
B05C 5/02 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage à partir d'un dispositif de sortie en contact, ou presque en contact, avec l'ouvrage
B05C 9/14 - Appareillages ou installations pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par des moyens non prévus dans l'un des groupes , ou dans lesquels le moyen pour déposer le liquide ou autre matériau fluide n'est pas important pour appliquer un liquide ou autre matériau fluide et exécuter une opération auxiliaire l'opération auxiliaire nécessitant un chauffage
Provided is a clip device capable of performing a stable gripping operation and a stable gripping state releasing operation in a small installation space even during high-speed conveyance. Specifically, a clip device 100 comprises a gripping clip 10, a closer 20, and an opener 30. The closer 20 and the opener 30 include a first magnet 21 and a second magnet 22, or a first magnet 31 and a second magnet 32. The first magnet 21 or the first magnet 31 is arranged such that the magnetization direction thereof is along a direction towards the gripping clip 10. The second magnet 22 or the second magnet 32 is arranged such that the magnetization direction thereof is orthogonal to the magnetization direction of the first magnet 21 or the first magnet 31 so as to concentrate the magnetic force line thereof on the first magnet 21 or the first magnet 31 side.
B29C 55/08 - Façonnage par étirage, p. ex. étirage à travers une matriceAppareils à cet effet de plaques ou de feuilles suivant un seul axe, p. ex. étirage oblique coupant la direction d'alimentation
A positioning device is provided for determining a relative position between a substrate and a processing unit that is configured to perform an attachment process, when performing the attachment process at a prescribed position of the substrate. The positioning device comprises a substrate table configured to hold the substrate, a processing position movement mechanism including a driving unit configured to move the substrate table and the processing unit relative to each other, and a braking unit configured to restrict movement, caused by the driving unit, of at least one of the substrate table and the processing unit, and a control unit connected to the driving unit and the braking unit. The control unit is configured to restrict, by using the braking unit, the movement of the at least one of the substrate table and the processing unit during the attachment process.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
Provided are a mounting device and a mounting method for relatively easily supplying a mounting head with a semiconductor chip having an activated electrode surface. Specifically, provided are a mounting device and a mounting method using the same, the mounting device comprising: a chip supply unit that picks up a semiconductor chip; a mounting unit that performs face-down mounting of the semiconductor chip picked up by the chip supply unit on a substrate; a chip transport mechanism that transports the semiconductor chip from the chip supply unit to the mounting unit; and a surface treatment means that performs surface activation treatment on an electrode surface of the semiconductor chip in order to improve bondability with an electrode surface of the substrate, the surface treatment means being disposed so as to perform the surface activation treatment on the electrode surface of the semiconductor chip being transported by the chip transport mechanism.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
A laminate manufacturing apparatus comprises a vacuum chamber, a gas introduction port, and a plasma generator. The laminate manufacturing apparatus has a surface hydrophilization mode in which a film formation surface of a substrate is modified by a plasma atmosphere in a state in which an evaporation source that imparts a hydrophilic group is supplied into the vacuum chamber, thereby rendering the film formation surface hydrophilic, and a self-assembling mode in which an evaporation source of a precursor material of a self-assembled monolayer is supplied to the substrate on which the film formation surface has been hydrophilized, in a state in which an evaporation source that promotes hydrolysis of the precursor material of the self-assembled monolayer has been supplied while an inside of the vacuum chamber is under a vacuum, thereby forming the self-assembled monolayer on the hydrophilized film formation surface.
C23C 16/50 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement au moyen de décharges électriques
B01J 19/08 - Procédés utilisant l'application directe de l'énergie ondulatoire ou électrique, ou un rayonnement particulaireAppareils à cet usage
C23C 16/448 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour produire des courants de gaz réactifs, p. ex. par évaporation ou par sublimation de matériaux précurseurs
C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction
C23C 16/458 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour supporter les substrats dans la chambre de réaction
C23C 16/52 - Commande ou régulation du processus de dépôt
H01J 37/32 - Tubes à décharge en atmosphère gazeuse
A bonding device is configured to bond a first element and a second element. The bonding device comprises an activating unit configured to activate a first bonding surface, which is a bonding surface of the first element, and a second bonding surface, which is a bonding surface of the second element, and a bonding unit configured to irradiate an active energy ray to cause the first bonding surface and the second bonding surface to come closer and bond with each other, from a state in which the first bonding surface and the second bonding surface face each other with a prescribed gap therebetween.
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
A transfer device transfers an element held on a transfer substrate to a receiving substrate. The transfer device comprises an energy irradiation unit irradiating an active energy ray toward the element through the transfer substrate in a state in which the transfer substrate and the receiving substrate face each other across the element. The transfer substrate has a blistering layer in which a blister is generated due to irradiation of an active energy ray. The receiving substrate has a capture layer that is arranged facing the transfer substrate. The energy irradiation unit forms the blister in an element holding area to change a tilt of the element relative to the transfer substrate and to bring the element closer to the receiving substrate, thereby causing the a portion of the element to come in contact with the capture layer first, in a state in which the blistering layer holds the element.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
A mounting device mounts a chip component having a chip recognition mark and a substrate having a substrate recognition mark. An attachment tool has transparency and has a tool recognition mark. The attachment tool holds a surface of the chip component opposite to a surface having the chip recognition mark. A chip position recognition unit simultaneously acquires position information of the chip recognition mark and of the tool recognition mark. The substrate position recognition unit acquires position information of the substrate recognition mark and of the tool recognition mark. A control unit moves a substrate stage holding the substrate or the attachment tool in the in-plane direction of the substrate on the basis of information obtained by the chip position recognition unit and by the substrate position recognition unit to perform alignment between the chip component and the substrate.
Provided is a mounting apparatus capable of accurately grasping rotational center coordinates at the time of position adjustment, and performing highly accurate positioning when mounting a chip component on a substrate, such as a wiring board. Specifically, a mounting apparatus is provided which comprises: an attachment tool that holds the chip component; a mounting head that has a head-side stage for adjusting the position of the attachment tool in X, Y, and θ directions; a recognition means that acquires an image from a direction perpendicular to the surface of the attachment tool; and a control unit that is connected to the mounting head and the recognition means. A center-identifying mark is provided on a portion associated with the attachment tool. The control unit has the function for: changing the rotation angle of the head-side stage a plurality of times to acquire images of the center-identifying mark by means of the recognition means; and calculating the rotation center coordinates of the head-side stage from a plurality of items of position information on the center-identifying mark.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
Provided is a positioning apparatus capable of suppressing the effects of calibration errors on positioning accuracy. Specifically, the positioning apparatus includes: an X-axis movement device and a Y-axis movement device; an imaging device for measuring a movement position; and a control device for outputting a position control signal S to each movement device and acquiring a measured position Pm of an object. The control device performs: first calibration control S1 for calculating a reference calibration value C of a position control signal S on the basis of a target position Pt and the measured position Pm; and second calibration control S2 for selecting a calibration measurement position having the smaller difference from the target position Pt, among an addition-side calibration measurement position Pma and a subtraction-side calibration measurement position Pms that have been moved on the basis of a calibration position control signal Sc calibrated using a temporary calibration value obtained by adding or subtracting a prescribed value to or from the reference calibration value C, and for setting the temporary calibration value used to calculate the calibration position control signal Sc, obtained by moving the object to the selected calibration measurement position, as a new reference calibration value C.
The present invention realizes highly accurate mounting without reducing the takt time in face-down mounting in which electrode surfaces are mounted facing each other. Specifically, provided are a tool slider, a chip slider, and a mounting device, the tool slider being used for conveying an attachment tool that holds a chip component on the lower surface, wherein is a frame is provided that supports the edge of the lower surface of the attachment tool, the frame has suction holes in communication with a reduced pressure flow path on the surface in contact with the attachment tool, and the shape allows the chip component to be housed inside the frame.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
The present invention provides: a flux transfer device that reduces, as much as possible, the effects, on takt time, of a transfer process for transferring flux to a bump electrode of a chip component which is held by a mounting head. Specifically, the present invention provides: a flux transfer device comprising a flux transfer unit that has a cavity for storing flux and a transfer unit slide means that can move the flux transfer unit horizontally, wherein when the flux is to be transferred to the bump electrode, the flux transfer unit is made to approach a mounting head such that the cavity is disposed directly under the chip component, and when the mounting head is to mount the chip component, the flux transfer unit is moved so as not to be under the mounting head; and a mounting device comprising the same.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
49.
ELECTRODE MATERIAL, ELECTRODE SLURRY, PRODUCTION METHOD FOR ELECTRODE MATERIAL, ELECTRODE, AND PRODUCTION METHOD FOR ELECTRODE
An electrode material 1 for secondary batteries that suppresses reductions in electrode capacity and has excellent cycle characteristics includes an electrode active material 10. All or a portion of the surface of the electrode active material 10 is coated with a non-aqueous binder 20 in a shell-like manner.
H01M 4/58 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs de composés inorganiques autres que les oxydes ou les hydroxydes, p. ex. sulfures, séléniures, tellurures, halogénures ou LiCoFyEmploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs de structures polyanioniques, p. ex. phosphates, silicates ou borates
H01M 4/13 - Électrodes pour accumulateurs à électrolyte non aqueux, p. ex. pour accumulateurs au lithiumLeurs procédés de fabrication
H01M 4/36 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs
H01M 4/485 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques d'oxydes ou d'hydroxydes mixtes pour insérer ou intercaler des métaux légers, p. ex. LiTi2O4 ou LiTi2OxFy
H01M 4/505 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de manganèse d'oxydes ou d'hydroxydes mixtes contenant du manganèse pour insérer ou intercaler des métaux légers, p. ex. LiMn2O4 ou LiMn2OxFy
H01M 4/525 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de nickel, de cobalt ou de fer d'oxydes ou d'hydroxydes mixtes contenant du fer, du cobalt ou du nickel pour insérer ou intercaler des métaux légers, p. ex. LiNiO2, LiCoO2 ou LiCoOxFy
H01M 4/62 - Emploi de substances spécifiées inactives comme ingrédients pour les masses actives, p. ex. liants, charges
Provided is a chip position measuring device capable of accurately correcting measurement errors of the respective acquired positions of all chip components, even when the chip components are arranged with a high density on an actual substrate or when the number of divisions of an imaging region of the actual substrate is very greatly increased. Specifically, in the chip position measuring device 100, a control unit 40 corrects the positions of a plurality of chip components 210 for each of a plurality of actual substrate divided imaging regions 230 on the basis of measurement errors in each of a plurality of master substrate divided imaging regions 330.
Provided are a workpiece-position-adjusting device and a mounting apparatus using the same, the workpiece-position-adjusting device being capable of highly accurate positioning by obtaining a center of rotation at the time of position adjustment with high accuracy for both X-coordinates and Y-coordinates. Specifically provided are a workpiece-position-adjusting device and a mounting apparatus using the same, the workpiece-position-adjusting device comprising a stage for adjusting the position of a workpiece-holding unit in a XY theta direction, and a recognition means for acquiring an image of the workpiece-holding unit. The workpiece-position-adjusting device has a functionality wherein a center identification mark is provided at a portion that is interlocked with the workpiece-holding unit, images of the center identification mark are acquired by the recognition means by driving the stage and changing the rotation angle a plurality of times, and the rotation center coordinates of the stage are calculated from position information of the plurality of center identification marks. The Y-coordinate of the rotation center is obtained by placing the center identification mark at a position that is separated in the X-direction from a provisionally set temporary rotation center, and the X-coordinate of the rotation center is obtained by placing the center identification mark at a position that is separated in the Y-direction from the temporary rotation center.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
A positive electrode material for secondary batteries that has exceptional high rate characteristics and cycle characteristics, the positive electrode material containing a positive electrode active material 10 and a crystalline metal oxide 20 that is attached to part of the surface of the positive electrode active material 10.
H01M 4/36 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs
H01M 4/505 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de manganèse d'oxydes ou d'hydroxydes mixtes contenant du manganèse pour insérer ou intercaler des métaux légers, p. ex. LiMn2O4 ou LiMn2OxFy
H01M 4/525 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs d'oxydes ou d'hydroxydes inorganiques de nickel, de cobalt ou de fer d'oxydes ou d'hydroxydes mixtes contenant du fer, du cobalt ou du nickel pour insérer ou intercaler des métaux légers, p. ex. LiNiO2, LiCoO2 ou LiCoOxFy
H01M 4/58 - Emploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs de composés inorganiques autres que les oxydes ou les hydroxydes, p. ex. sulfures, séléniures, tellurures, halogénures ou LiCoFyEmploi de substances spécifiées comme matériaux actifs, masses actives, liquides actifs de structures polyanioniques, p. ex. phosphates, silicates ou borates
The purpose of the present invention is to provide a coating device capable of suppressing dragging of a coating liquid at a coating end part. Specifically, this coating device coats a coating liquid onto a base material to be conveyed, and comprises: a coating part in which a discharge port that is long in a width direction orthogonal to the conveyance direction of the base material, and a coating flow path that is connected to the discharge port and supplies the coating liquid to the discharge port, are formed; and a volume adjusting mechanism for changing the volume of the coating flow path. The volume adjusting mechanism has a volume adjusting part inserted into the coating flow path, and a driving part for adjusting the insertion amount of the volume adjusting part.
B05C 5/02 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage à partir d'un dispositif de sortie en contact, ou presque en contact, avec l'ouvrage
B05C 11/10 - Stockage, débit ou réglage du liquide ou d'un autre matériau fluideRécupération de l'excès de liquide ou d'un autre matériau fluide
54.
ELEMENT TRANSFER DEVICE AND ELEMENT TRANSFER METHOD
Provided is an element transfer device with which an element can be easily peeled. Specifically, a semiconductor chip transfer device 100 (element transfer device) is provided with: a support substrate holding unit 30 for holding a support substrate 10 on which a semiconductor chip 1 is supported with an adhesive layer 2 therebetween; a laser beam irradiation unit 70 for irradiating the support substrate 10 with laser light L; and a control unit 60 for controlling the irradiation position of the laser light L irradiated from the laser beam irradiation unit 70. The area of a spot region SA of the laser light L is smaller than the area of a surface 1c supported by the support substrate 10 of the semiconductor chip 1. The control unit 60 controls the irradiation position of the laser light L so that, when viewed from a direction perpendicular to the surface of the support substrate 19, the laser light L irradiates the support substrate 10 while moving relative thereto from one end 1a side to the other end 1b side of the semiconductor chip 1.
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
B23K 26/57 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler le faisceau laser entrant dans une face de la pièce à travailler d’où il est transmis à travers le matériau de la pièce à travailler pour opérer sur une face différente de la pièce à travailler, p. ex. pour effectuer un enlèvement de matière, pour raccorder par fusion, pour modifier ou pour reformer le matériau
H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
The purpose of the present invention is to provide a drying device with which energy consumed when drying a coating film can be reduced to a greater extent than in the past. Specifically, a drying device having a housing part through the interior of which passes a base material on which a coating film is formed, and a supply part that supplies gas into the housing part, a first drying unit and a second drying unit for drying the coating film by heating the coating film being arranged side by side in the housing part, wherein: the first drying unit is provided with a supply part that supplies gas into the housing part of the first drying unit, and a first heating source that indirectly heats the coating film by heating the gas until the gas is supplied from the supply part to the housing part; and the second drying unit is provided with a second heating source that directly heats the coating film in the housing part of the second drying unit.
F26B 13/10 - Aménagements pour l'alimentation, le chauffage ou la tenue du matériauCommande du mouvement, de la tension ou de la position du matériau
F26B 3/02 - Procédés de séchage d'un matériau solide ou d'objets impliquant l'utilisation de chaleur par convection, c.-à-d. la chaleur étant transférée d'une source de chaleur au matériau ou aux objets à sécher par un gaz ou par une vapeur, p. ex. l'air
F26B 13/02 - Machines ou appareils à mouvement progressif pour le séchage des tissus, fibres, fils ou autres matériaux en grandes longueurs avec mouvement en ligne droite
Provided is a drying device capable of sufficiently drying an insulating material while suppressing excessive drying of an electrode material. More specifically, in this drying device, with regard to the electrode material and the insulating material which are applied to the base material, a first drying unit is configured to dry the insulating material.
F26B 3/04 - Procédés de séchage d'un matériau solide ou d'objets impliquant l'utilisation de chaleur par convection, c.-à-d. la chaleur étant transférée d'une source de chaleur au matériau ou aux objets à sécher par un gaz ou par une vapeur, p. ex. l'air le gaz ou la vapeur circulant sur ou autour du matériau ou des objets à sécher
F26B 3/28 - Procédés de séchage d'un matériau solide ou d'objets impliquant l'utilisation de chaleur par radiation, p. ex. du soleil
F26B 3/30 - Procédés de séchage d'un matériau solide ou d'objets impliquant l'utilisation de chaleur par radiation, p. ex. du soleil à l'aide d'éléments émettant des rayons infrarouges
F26B 13/04 - Machines ou appareils à mouvement progressif pour le séchage des tissus, fibres, fils ou autres matériaux en grandes longueurs avec mouvement en ligne droite utilisant des rouleaux
F26B 13/10 - Aménagements pour l'alimentation, le chauffage ou la tenue du matériauCommande du mouvement, de la tension ou de la position du matériau
Provided is a coating device with which it is possible to perform movement control of a movement unit with high accuracy. Specifically, the coating device 10 has: a movement unit 11 that coats a base material W with liquid; a guide device 12 that guides the movement of the movement unit 11; and a cable carrier 13 that supports a cable group 14 including a power line 14a that supplies electric power to the movement unit 11. The movement unit 11 has: a coating unit 16 equipped with a coating head 21 which can move in the guiding direction of the guide device 12 and which ejects liquid; a control unit 17 which can move in the guiding direction independently of the coating unit 16 and which is connected to the cable carrier 13; and a flexible wire harness 18 which connects between the control unit 17 and the coating unit 16 with a slack.
Provided is an image processing method for detecting, when performing imaging inspection on a semiconductor chip or the like having wiring, a defect that is present in an image by eliminating the influence of the wiring. Specifically, provided is an image processing method for detecting an irregular image by performing image processing on an imaging screen having a straight line extending in one direction displayed thereon, the image processing method comprising: a step for acquiring a first processed image obtained by performing smoothing filter processing on the imaging screen using a segment defined by a first number a of pixels arranged along the one direction and a second number b of pixels arranged along a different direction from the one direction; a step for acquiring a second processed image obtained by performing smoothing filter processing on the imaging screen using a segment defined by a third number c of pixels arranged along the one direction and a fourth number d of pixels arranged along the different direction; a step for acquiring a third processed image, which is an image obtained by subtracting the first processed image form the second processed image; and a detection step for detecting an irregular image using the third processed image. a is greater than any of b, c, and d.
The present invention provides a substrate holding device capable of reliably holding a substrate even when the substrate is warped in a convex shape. Specifically, provided is a substrate holding device that supports and holds a lower surface of a substrate. The substrate holding device includes: a central support part that supports a central section of the lower surface of the substrate; an outer periphery support part that supports an outer periphery section of the lower surface of the substrate; and a lifting part that relatively moves the central support part and the outer periphery support part in the thickness direction of the substrate. The outer periphery support part has a substrate outer periphery suctioning part that suctions the substrate. The central support part has a substrate center suctioning part that suctions the substrate, and a section of the central support part that is brought into contact with the lower surface of the substrate is curved in a convex shape.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
Provided is a vent tank that makes it possible for an application liquid, which has been discharged into the vent tank through air vent processing, to be reused in a clean state. Specifically, a vent tank 10, which recovers an application liquid discharged from an applicator 20, comprises: a tank body 11 that stores the application liquid; vent piping 12 that is inserted into the tank body 11 and guides, to the tank body 11, the application liquid discharged from the applicator 20; and a cleaning nozzle 13 that is inserted into the tank body 11 and ejects a cleaning liquid into the tank body 11. The cleaning nozzle 13 is provided with a nozzle part 13a that ejects the cleaning liquid into the tank body 11 omnidirectionally.
B05C 11/10 - Stockage, débit ou réglage du liquide ou d'un autre matériau fluideRécupération de l'excès de liquide ou d'un autre matériau fluide
B05C 5/02 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage à partir d'un dispositif de sortie en contact, ou presque en contact, avec l'ouvrage
The purpose of the present invention is to provide a transport device capable of adjusting the position of an end of a substrate in a width direction thereof. Specifically, the transport device comprises a transport unit that transports a strip-shaped substrate in a longitudinal direction, and at least one pair of conveyor units that assist the transport unit in transporting the substrate, and each run a belt member in a state in which a predetermined surface of the substrate transported by the transport unit is adhered to an adhesive unit formed on the belt member, thereby sending the substrate in a traveling direction of the adhesive unit to which the substrate is adhered, wherein the pair of conveyor units are arranged so as to adhere the predetermined surface of the substrate to the adhesive unit of the belt member in the vicinity of either end of the substrate in the width direction of the substrate, and the pair of conveyor units are provided with a traveling direction adjustment unit for adjusting the traveling direction of the adhesive portion of each belt member.
There has been a case where, even if uneven patterns on the surface of a substrate are highlighted by a differential interference microscope, cracks formed in a surface of the substrate cannot be easily recognized visually. The present invention makes it easy to visually recognize cracks formed in the surface of a substrate in observing the surface of the substrate by using a differential interference optical method. Specifically, an observation device 1 observes a surface W1 of a substrate W. The observation device 1 comprises: a holding unit 20 that holds the substrate W; and a differential interference microscope 10 that projects the surface W1 of the substrate W held by the holding unit 20 and acquires an image G. The holding unit 20 holds the substrate W in a bent state.
Provided is a three-dimensional modeling method for a core-shell system, in which, in a step for curing a core material, molding defects caused by gases emitted from the core material can be prevented, and deformation of the shell can be suppressed. Specifically, this three-dimensional modeling method includes: a shell modeling step for using a shell material to model a shell that defines the external shape of a three-dimensional model; a core material filling step for filling a liquid-phase core material into a core section, which is a section enclosed by the inner surface of the shell; and a core material curing step for curing the core material inside the core section. The method also includes a core section sealing step for sealing an opening in the core section by leaving an uncured region of the shell material on the upper surface of the core material filled into the core section. The core material curing step is performed after the core section sealing step.
B29C 64/135 - Procédés de fabrication additive n’utilisant que des matériaux liquides ou visqueux, p. ex. dépôt d’un cordon continu de matériau visqueux utilisant des couches de liquide à solidification sélective caractérisés par la source d'énergie à cet effet, p. ex. par irradiation globale combinée avec un masque la source d’énergie étant concentrée, p. ex. lasers à balayage ou sources lumineuses focalisées
B29C 64/379 - Manutention des objets en 3D obtenus, p. ex. à l’aide de robots
tiiii in neighboring fields of view. An imaging picture of a prescribed pattern inside the overlap area is recorded as an alignment mark to be utilized for a neighbor field of view, and an inspection picture is created in the neighbor field of view with the imaging position of the recorded alignment mark as a reference.
The present invention addresses the problem of precisely classifying a pattern of a defect that has occurred in an inspection object. Specifically, an automatic defect classification device 1 classifies a pattern of a defect X that has occurred in an inspection object W. The inspection object W is imaged so as to be divided into a plurality of mutually adjacent visual fields F. In a case in which a defect X is included on the perimeter F1a of a first visual field F1 as an arbitrary visual field FA that is one visual field F among the plurality of visual fields F, and the defect X is included on the perimeter F2a of a second visual field F2 as an adjacent visual field FB that is another visual field F adjacent to the first visual field F1 (arbitrary visual field FA) among the plurality of visual fields F, the automatic defect classification device 1 classifies a pattern of the defect X in a state in which the first visual field F1 (arbitrary visual field FA) and the second visual field F2 (adjacent visual field FB) are combined.
The present invention relates to a ring-type illumination device for dark-field observation, wherein the illumination density of light with respect to a subject region on an object being inspected is improved, and variation in brightness is suppressed. Specifically, this ring-type illumination device 2 carries out dark-field observation with respect to a subject region A on an object being inspected W. The ring-type illumination device 2 comprises a ring-shaped ring member 10. The ring member 10 is disposed so that a central hole 12 faces the target region A and so that a circumferential part 11 is located farther circumferentially outward than the target region A. The circumferential part 11 is provided with an exit opening 13, which is disposed spanning the entire circumference of the circumferential part 11 and through which light L exits obliquely relative to the target region A. Optical elements 20, 21 that diffuse the light L in the circumferential direction of the ring member 10 are provided between the exit opening 13 and the target region A.
National Institute of Maritime, Port and Aviation Technology (Japon)
Toray ENGINEERING CO., LTD. (Japon)
Toray Engineering D Solutions Co., Ltd. (Japon)
Inventeur(s)
Itakura, Daisuke
Furuichi, Kenji
Ishihara, Ryoichi
Uchida, Yoshihiro
Matsuo, Tsuyoshi
Sawada, Satoshi
Hyakusai, Akira
Abrégé
A method for molding analysis of a plate-like intermediate base material containing resin and reinforcing material when the base material is molded, including applying a base material model having anisotropy between out-of-plane direction and an in-plane direction orthogonal to the out-of-plane direction, and calculating viscosity distribution in a cross-section direction of a molded article using each viscosity in accordance with a flow field, and the viscosity distribution indicates that under a boundary condition there is no slip flow of the base material on a wall surface of the mold, as a result of a shear field in the vicinity of the wall surface, a low viscosity layer that is more affected by an out-of-plane shear viscosity than a central portion of the base material is automatically formed in the vicinity of the wall surface, and the base material in the vicinity of the wall surface functions as a lubricating layer.
G06F 30/23 - Optimisation, vérification ou simulation de l’objet conçu utilisant les méthodes des éléments finis [MEF] ou les méthodes à différences finies [MDF]
The present invention provides a transfer substrate holding device, a transfer device, and a transfer method which make it possible to accurately transfer, to a transfer-receiving substrate, an element held by a flexible transfer substrate. Specifically, provided is a transfer substrate holding device 13 that holds the rear surface side of a flexible transfer substrate 22, which holds an element 21 on the front surface side thereof, in order to irradiate the transfer substrate 22 with active energy rays 11, wherein: at a portion that faces an element holding region 22c, which is a region of the transfer substrate 22 where the element 21 is held, provided is a transmission part 13b that transmits active energy rays 11, from a transfer substrate facing surface 13a which faxes the transfer substrate 22 to a surface on the opposite side from the transfer substrate facing surface 13a, and that makes contact with the transfer substrate 22; and a clamping region 17 for producing a clamping force to clamp and hold the transfer substrate 22 is provided outside the transmission part 13b on the transfer substrate facing surface 13a side.
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
Provided is a transfer device whereby portions irradiated with an actinic energy beam can be prevented from being overly crowded. Specifically, provided is a transfer device 10 that irradiates a transfer substrate 22 with an actinic energy beam 11 to thereby transfer an element 21 held by the transfer substrate 22 to a receiving substrate 23. The transfer device 10 is equipped with an energy emission part 12 which intermittently emits an actinic energy beam 11 and an irradiation position control unit 15 which controls positions where the transfer substrate 22 is to be irradiated with the actinic energy beam 11 emitted from the energy emission part 12. Time intervals between operations of irradiating the transfer substrate 22 with the actinic energy beam are regulated in accordance with the traveling speed of the position where the transfer substrate 22 is to be irradiated with the actinic energy beam 11 according to control by the irradiation position control unit 15.
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
B23K 26/57 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler le faisceau laser entrant dans une face de la pièce à travailler d’où il est transmis à travers le matériau de la pièce à travailler pour opérer sur une face différente de la pièce à travailler, p. ex. pour effectuer un enlèvement de matière, pour raccorder par fusion, pour modifier ou pour reformer le matériau
70.
STRUCTURE MANUFACTURING DEVICE AND STRUCTURE MANUFACTURING METHOD
This structure manufacturing device comprises a slurry supply part that supplies a slurry to one end surface of a porous substrate, and a slurry suction part that suctions the slurry supplied to the porous substrate through the other end surface of the porous substrate. The structure manufacturing device also comprises a shielding part that covers the outer-peripheral surface of the porous substrate in a state of being set apart from the outer-peripheral surface so that inflow of air to the interior through the outer-peripheral surface is blocked.
Provided is a transfer method that, during transfer of an element using blistering, enables the element to be transferred from a transfer substrate to an accurate position on a substrate to be transferred onto. Specifically, the transfer method comprises: a transfer preparation step in which, in a state in which a predetermined element 21 is being held by a transfer substrate 22 with the distance between the transfer substrate 22 and a substrate 23 to be transferred onto being a first distance d1, the transfer substrate 22 and the substrate 23 to be transferred onto are opposed to each other so as to sandwich the predetermined element 21; a transfer step in which a blister 30 is caused to occur on the transfer substrate 22 in the vicinity of the position in which the predetermined element 21 is being held, thereby causing the predetermined element 21 and the substrate 23 to be transferred onto to become closer to each other to cause the predetermined element 21 to be held by the substrate 23 to be transferred onto; a substrate spacing step in which the distance between the transfer substrate 22 and the substrate 23 to be transferred onto is increased to a second distance d2 greater than the first distance d1; an alignment-direction movement step in which the transfer substrate 22 and the substrate 23 to be transferred onto are caused to move relatively in a direction in which elements 21 are aligned on the transfer substrate 22; and a substrate approaching step in which the distance between the transfer substrate 22 and the substrate 23 to be transferred onto is returned to the first distance d1.
The present invention uses a virtual defect to realistically reproduce an actual defect that occurs in an object being inspected. Specifically, a defect image processing device 1: uses a captured image 2a of an object 2 being inspected as a background 20 to display, with a plurality of pixels P, a virtual defect drawn image 10 in which a virtual defect 30 is drawn on the background 20; further divides a boundary pixel Pa into a plurality of subpixels S, the boundary pixel Pa being a pixel P that includes a boundary 11 between the virtual defect 30 and the background 20 among the plurality of pixels P; determines a ratio (n2:n3) between the number n2 of subpixels S that belong to the background 20 and the number n3 of subpixels S that belong to the virtual defect 30 in the boundary pixel Pa; calculates a luminance L1 of the boundary pixel Pa on the basis of a luminance L2 of the background 20 and a luminance L3 of the virtual defect 30, and the ratio (n2:n3); and compresses the plurality of subpixels S obtained through the division into the boundary pixel Pa.
According to the present invention, an actual defect occurring in an inspected object is reproduced realistically using a virtual defect. Specifically, a defect image processing device 1 displays a virtual defect rendered image 10 in which a virtual defect 30 is rendered on a background 20 using a plurality of pixels P, where a captured image 2a of an inspected object 2 is used as the background 20, wherein a filter 40 determining an influence imparted to a luminance Li of one pixel Pi among the plurality of pixels P by luminances Lj of other surrounding pixels Pj is prepared, and in the virtual defect rendered image 10, the luminance Li of the one pixel Pi can be adjusted through the filter 40 by means of the influence of the luminances Lj of the other surrounding pixels Pj.
A chemical solution synthesis device comprises a chemical solution holding unit, a reaction vessel, a first chemical solution feed unit, a chemical solution feed and discharge unit, and a second chemical solution feed unit. The chemical solution holding unit is configured to hold a chemical solution. The chemical solution and carriers are reacted in the reaction vessel. The chemical solution is transferable from the chemical solution holding unit to the reaction vessel without coming into contact with atmosphere. The first chemical solution feed unit is connected to the reaction vessel and configured to supply the chemical solution to the reaction vessel. The chemical solution feed and discharge unit is provided vertically above the first chemical solution feed unit. The second chemical solution feed unit is configured to suppress adhesion of the carriers to the reaction vessel.
A collet replacement mechanism for replacing a collet of a pickup tool that is configured to pick up chip components by suction using the collet comprises an attachment configured to hold the collet on a bottom surface thereof, an attachment holder disposed at a lower part of the pickup tool and configured to hold an upper part of the attachment by magnetic force, and an attachment storage unit having a guide that is configured to latch the attachment to store the attachment, the attachment being detachable from the attachment holder in a state of being latched to the guide.
The purpose of the present invention is to provide a drying system that is capable of improving solvent collection capacity over the prior art. Specifically, provided is a drying system comprising a plurality of drying units that each have a housing part through the inside of which passes a base material having a coating formed thereon, and that each heat the coating by introducing heated gas into the housing part to vaporize the solvent, and a plurality of solvent collection units that cool a gas containing the solvent discharged from the drying units to liquefy and collect the solvent, and a circulation path that is for circulating the gas between the drying units and the solvent collection units. The drying units are provided such that the respective housing parts thereof are in communication along a transfer route of the base material. A connecting path for sending gas cooled by a solvent collection unit to another solvent collection unit is provided between at least one set of solvent collection units among the plurality of solvent collection units.
F26B 15/00 - Machines ou appareils à mouvement progressif pour le séchage d'objetsMachines ou appareils à mouvement progressif, pour le séchage de lots d'un matériau de forme compacte
F26B 21/04 - Circulation de l'air ou des gaz en cycles fermés, p. ex. totalement à l'intérieur de l'enceinte de séchage partiellement à l'extérieur de l'enceinte de séchage
A coating device is provided with a stage on which a substrate is configured to be placed, an applicator movably arranged relative to the substrate placed on the stage and configured to discharge a coating liquid from a nozzle to form a coating film on the substrate, and a dryer having an air supply port with at least one porous member. The dryer is configured to dry the coating film formed on the substrate by the applicator by supplying air to the coating film from the air supply port. The at least one porous member is configured and arranged to suppress formation of local variations in an amount of air supplied from the air supply port.
B05C 9/12 - Appareillages ou installations pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par des moyens non prévus dans l'un des groupes , ou dans lesquels le moyen pour déposer le liquide ou autre matériau fluide n'est pas important pour appliquer un liquide ou autre matériau fluide et exécuter une opération auxiliaire l'opération auxiliaire étant exécutée après l'application
B05D 3/04 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par exposition à des gaz
Provided is a mounting device that acquires position information about a substrate recognition mark and achieves highly accurate mounting, even when a chip component covers the substrate recognition mark in facedown mounting. Specifically, provided is a mounting device comprising: an attachment tool that holds a surface of a chip component opposite to a surface having a chip recognition mark; a substrate stage that holds a substrate; a reflective light source that emits, toward the surface of the substrate from the attachment tool side, light containing a wavelength which is transmitted through the chip component; and a recognition means for recognizing reflected light of the light emitted by the reflective light source, wherein the recognition means acquires an image formed by the light that has been transmitted through the chip component and reflected at the substrate, and acquires position information about the substrate recognition mark.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
A coating device comprises a die with a slit that is longer in a width direction and discharges a coating liquid to form a coating film on a substrate, a first flow path that supplies the coating liquid toward the die, a first manifold that is linked to the first flow path and holds the coating liquid that flows in from the first flow path, a plurality of second flow paths that are linked to the first manifold, a second manifold that is linked to the second flow paths and the slit, is longer in the width direction, and holds the coating liquid that flows in from the second flow paths, and an adjustment unit that is provided along at least one of the second flow paths and adjusts a flow of the coating liquid flowing through the at least one of the second flow paths.
B05C 5/02 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage à partir d'un dispositif de sortie en contact, ou presque en contact, avec l'ouvrage
B05C 11/10 - Stockage, débit ou réglage du liquide ou d'un autre matériau fluideRécupération de l'excès de liquide ou d'un autre matériau fluide
80.
METHOD FOR FORMING PEROVSKITE FILM AND APPARATUS FOR FORMING PEROVSKITE FILM
The present invention provides a method for forming a perovskite film and an apparatus for forming a perovskite film, each of which enables the achievement of a perovskite solar cell that has a stable power generation efficiency. Specifically, this method for forming a perovskite film comprises: a film formation step in which a perovskite film is formed on a substrate; a crystalline state checking step in which the crystalline state of the perovskite film on the substrate is checked by means of measurement; and a condition adjustment step in which the working conditions in the film formation step for the following substrates are adjusted on the basis of the measurement results of the crystalline state checking step. In the crystalline state checking step, a numerical data distribution of the crystalline state of the entirety of the perovskite film is acquired by setting a plurality of measurement positions over the entirety of the perovskite film on the substrate and acquiring numerical data at each one of the measurement positions.
H10K 30/40 - Dispositifs organiques sensibles au rayonnement infrarouge, à la lumière, au rayonnement électromagnétique de plus courte longueur d'onde ou au rayonnement corpusculaire comprenant une structure p-i-n, ayant p. ex. un absorbeur pérovskite entre des couches de transport de charge de type p et de type n
H10K 71/70 - Tests, p. ex. tests de durée de vie accélérée
Provided is a coating device which makes it possible to prevent the crystal state of a formed coating film from becoming non-uniform. More specifically, a coating device is provided, which is provided with a stage on which a substrate is mounted, an application device which ejects a coating solution through a nozzle to form a coating film on the substrate while moving relatively to the substrate mounted on the stage, and a dryer which dries the coating film on the substrate, in which the dryer has such a configuration that a drying-promoting force for promoting drying from drying distribution information about the coating film on the substrate is controlled in accordance with position on the coating film.
B05C 9/12 - Appareillages ou installations pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par des moyens non prévus dans l'un des groupes , ou dans lesquels le moyen pour déposer le liquide ou autre matériau fluide n'est pas important pour appliquer un liquide ou autre matériau fluide et exécuter une opération auxiliaire l'opération auxiliaire étant exécutée après l'application
B05C 5/02 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage à partir d'un dispositif de sortie en contact, ou presque en contact, avec l'ouvrage
The present invention addresses the problem of disclosing a method for bringing a retaining layer in contact with an element only in a region having a size equivalent to that of a second main surface of the element or inside the second main surface of the element, and a device therefor. Specifically, the present invention provides a retaining layer partial removal method for partially removing a retaining layer 10 on a substrate 20 that retains a second main surface 1B of elements via the retaining layer 10, the retaining layer partial removal method being characterized by carrying out a retaining layer removal step for partially removing the retaining layer 10 by emitting a laser from the first main surface 1A side of the elements such that an emission range convers an entire arrangement region of the retaining layer 10 in an array region of the elements.
Provided is a coating device capable of shortening takt time for coating operations. Specifically, a coating device provided with a stage on which a substrate is carried and a coating unit for forming a coating film on the substrate carried on the surface of the stage by moving relative to the substrate in one direction while discharging a coating liquid, the device having a configuration wherein: the coating unit has an applicator for discharging the coating liquid and a support unit for supporting the applicator; the support unit has a column, which is disposed on one side of the width direction orthogonal to the coating direction, and a beam, which extends from the column so as to cross the stage; and the applicator is supported by the support unit with a cantilever beam structure by being attached to the beam.
A transfer device is provided that comprises a transfer substrate holding unit, a receiving substrate holding unit, and an active energy ray irradiation unit. The transfer substrate holding unit holds a transfer substrate with an ablation layer on which at least one element is held. The receiving substrate holding unit holds a receiving substrate such that the ablation layer of the transfer substrate is opposite the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer of the transfer substrate with an active energy ray to cause ablation for transferring the at least one element held by the ablation layer from the transfer substrate to the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer with the active energy ray at a plurality of locations in a holding region of the ablation layer that holds one of the at least one element.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
B32B 43/00 - Opérations spécialement adaptées aux produits stratifiés et non prévues ailleurs, p. ex. réparationAppareils pour ces opérations
B23K 26/57 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler le faisceau laser entrant dans une face de la pièce à travailler d’où il est transmis à travers le matériau de la pièce à travailler pour opérer sur une face différente de la pièce à travailler, p. ex. pour effectuer un enlèvement de matière, pour raccorder par fusion, pour modifier ou pour reformer le matériau
B23K 26/067 - Division du faisceau en faisceaux multiples, p. ex. foyers multiples
85.
NANOWIRE-EQUIPPED FILM AND NANOWIRE MANUFACTURING METHOD
A nanowire-equipped film comprises a substrate made of a crystalline resin, and nanowires made of a metal oxide and grown directly on the substrate. A fine textured structure is formed on a surface of the substrate, and the nanowires are grown directly from the textured structure.
C23C 18/12 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par décomposition thermique caractérisée par le dépôt sur des matériaux inorganiques, autres que des matériaux métalliques
The purpose of the present invention is to provide a drying system capable of reducing energy consumption in a coating film drying step in the manufacturing process of a lithium ion battery as compared with the conventional systems. A drying system (100) for drying a coating film made of a slurry of a positive electrode material including NMP formed on a base material in a manufacturing process of a lithium ion battery, the drying system being configured to include a first gas supply means (3) for supplying a gas used for drying the coating film, a first drying unit (1) that heats the gas supplied by the first gas supply means and heats and dries the coating film with the heated gas, and a second gas supply means (6) for supplying gas containing moisture to the first drying unit.
F26B 13/02 - Machines ou appareils à mouvement progressif pour le séchage des tissus, fibres, fils ou autres matériaux en grandes longueurs avec mouvement en ligne droite
Provided is an automatic defect classification device that facilitates correction of errors in classification categories assigned in advance by a user and enables improvement in the accuracy of automatic defect classification, even when there are many defect images constituting training data. The automatic defect classification device is for generating, by using training data in which classification categories clearly indicating associations of a plurality of defect images with defect classifications have been assigned to the defect images in advance by the user, classifiers corresponding to the defect images and for, by using the classifiers, automatically assigning the classification categories to defect images of which classification categories are unknown. The automatic defect classification device comprises: a training data input unit that receives input of training data; a processing unit that performs a predetermined process on the plurality of defect images; and a display unit that displays the defect images. The processing unit causes the display unit to perform display in a changed display format of defect portions of the defect images in accordance with the classification categories which have been assigned by the classifiers and with which the defect images are associated.
The purpose of the present invention is to provide a drying device that is capable of preventing a break in a base material even if tension applied to the base material is less than that during normal transfer. Specifically, provided is a drying device that is provided on a transfer path in which a base material is transferred roll-to-roll with a prescribed tension applied thereto, and that dries a coating film applied to the base material while the base material is transferred, said drying device comprising: a drying nozzle that blows a gas from below and above the base material, lifts the base material, and dries the coating film applied to the base material; an edge nip part that, in a lifting region in which the base material is lifted by the drying nozzle, grasps at least the vicinity of the pair of edges of the base material in the width direction and defines the transfer path of the edges; and a support member that is provided below or above the base material in the lifting region and contacts a prescribed surface of the base material where the tension applied in a state of being lifted by the drying nozzle is smaller than the prescribed tension.
Provided are a transfer device and a transfer method capable of flip-chip mounting an element onto a circuit board without damaging or soiling bumps. Specifically, the present invention is a transfer device 10 for transferring an element 21 held on a transfer substrate 22 onto a circuit board 23 having an electrode surface on which an electrode 23a is formed, the transfer device 10 having an energy irradiation unit 12 that irradiates an active energy ray 11 towards the element 21 through the transfer substrate 22 in a state in which the transfer substrate 22 faces the circuit board 23 and the element 21 is sandwiched therebetween, separates the element 21 from the transfer substrate 22, and biases the element 21 towards the circuit board 23. A prescribed surface side of the circuit board 23 has an auxiliary conductive function that aids in formation of conductivity between the electrode 23a and the element 21, and a catching function that adhesively retains the element 21 which is biased from the transfer substrate 22, and a member having the auxiliary conductive function is provided to at least the surface of the electrode 23a facing the element 21.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
The present invention addresses the problem of transferring an element such as a semiconductor chip with high precision and with a simple configuration. Specifically, provided is a transfer method for transferring, to a transfer-receiving substrate via laser lift-off, elements (1) that arranged at least along a first direction on a first main surface of a transfer substrate (20) and are held by a holding layer (10), said transfer method being characterized in that a first element transfer step is performed in which a region centered on the holding layer (10) holding a first element (1) to be transferred is irradiated from the second main surface side of the transfer substrate (20) with a laser using a first laser spot (50) of a size that irradiates a region larger than the entire area of at least one first element (1) to be transferred, the holding layer (10) holding the entire area of the first element (1) to be transferred is irradiated with a laser having an energy capable of separating the first element (1) to be transferred, and the first element (1) is transferred to the transfer-receiving substrate (30).
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
The purpose of the present invention is to provide a slit die that is capable of achieving, as compared with a conventional slit die, greater uniformity in the width-direction shape of a coating formed in a stripe manner in the width direction. Provided is a slit die for applying a coating liquid to a base material, the slit die including: a manifold that is a space formed in an elongated manner in the width direction of the base material to store the coating liquid; a plurality of supply ports that are provided in the manifold so as to be arrayed in the width direction and that supply the coating liquid to the manifold; a slit that is elongated in the width direction so as to be connected to the manifold; a discharge port that discharges the coating liquid from the manifold via the slit; shims that partition the slit into a plurality of spaces in the width direction to form small slits; and partitions that partition the manifold into a plurality of spaces in the width direction to form small manifolds, wherein the partitions are configured so as to be disposed at positions at which at least one supply port is positioned in each of the small manifolds and at positions at which the manifold is partitioned so that each small slit is connected to one small manifold.
B05C 5/02 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage à partir d'un dispositif de sortie en contact, ou presque en contact, avec l'ouvrage
92.
MEDICINAL SOLUTION SYNTHESIS METHOD AND MEDICINAL SOLUTION SYNTHESIS APPARATUS
Provided are a medicinal solution synthesis method and a medicinal solution synthesis apparatus, whereby it becomes possible to improve the efficiency of the synthesis from a carrier and a medicinal solution in a reaction vessel part. More specifically, a medicinal solution synthesis method is provided, in which a medicinal solution is fed to a reaction vessel part while avoiding the contacting of the medicinal solution with the atmosphere and the medicinal solution is reacted with a carrier in the reaction vessel part, and in which a gas supply pipe for supplying a gas so as to stir the medicinal solution and the carrier is connected to the reaction vessel part through a pore member capable of forming air bubbles in the reaction vessel part. The method is so configured that the diameters of the air bubbles formed in the reaction vessel part by supplying the gas through the gas supply pipe can be varied by varying the opening area of each of pores in the pore member or the density of the pores.
B01J 8/24 - Procédés chimiques ou physiques en général, conduits en présence de fluides et de particules solidesAppareillage pour de tels procédés les particules étant fluidisées selon la technique du "lit fluidisé"
B01F 33/40 - Mélangeurs utilisant l'agitation de gaz ou de liquide, p. ex. avec des tubes d'alimentation en air
B01J 8/16 - Procédés chimiques ou physiques en général, conduits en présence de fluides et de particules solidesAppareillage pour de tels procédés les particules étant soumises à des vibrations ou des pulsations
Provided are a lifting head and a lifting device that make it possible to maintain the position of a needle positioned on the lifting device so as to be easily removable. Specifically, the present invention has: a base member 2 that has a suctioned surface 2a; a spline shaft 4 that is supported on the base member 2 and has a raising/lowering axial channel 4a; a contact member 5 that is fixed to one end part of the spline shaft 4 and is to contact a raising/lowering drive mechanism 11 of a lifting device 10; a needle support member 7 that is fixed to the spline shaft 4 and supports a needle 8; and a needle cap 9 that has a stage 9a at one end part and is fixed to the base member. The suctioned surface 2a of the base member 2 is suctioned by the suction force of a first negative pressure passage 16e of an attachment member 16. When the contact member 5 is in contact with the raising/lowering drive mechanism 11, the inside of the needle cap 9 is suctioned by the suction force of a second negative pressure passage 14b of the raising/lowering drive mechanism 11 via the raising/lowering axial channel 4a.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
The objective of the present invention is to provide a drying system capable of preventing the occurrence of wrinkles in a base material even if a coating film is heated. More specifically, this drying system, which is provided on a conveying route of a base material conveyed by roll-to-roll conveying, to dry a coating film applied to the base material while conveying the base material, comprises a heating unit for heating the coating film applied to the base material to vaporize a solvent contained in the coating film, and a moisture adjusting means for adjusting an amount of solvent contained in the coating film, wherein the moisture adjusting means is configured to adjust the amount of solvent contained in the coating film on the base material to a predetermined amount, at least when the conveyed base material passes through the heating unit and first comes into contact with a first conveying roller that comes into contact with the base material with a predetermined wrap angle.
F26B 13/04 - Machines ou appareils à mouvement progressif pour le séchage des tissus, fibres, fils ou autres matériaux en grandes longueurs avec mouvement en ligne droite utilisant des rouleaux
F26B 13/10 - Aménagements pour l'alimentation, le chauffage ou la tenue du matériauCommande du mouvement, de la tension ou de la position du matériau
Provided are a joining device and a joining method which are capable of easily implementing joining that involves the activation of a joining surface. Specifically, this joining device 100, which joins a first element 21 and a second element 23, has: an activation part 30 which activates a first joining surface which is a joining surface of the first element 21, and a second joining surface which is a joining surface of the second element 23; and a joining part 10 which from a state where the first joining surface and the second joining surface are made to face each other with a predetermined gap therebetween, causes the first joining surface and the second joining surface to approach each other and be joined to each other by irradiation with active energy rays.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
B23K 20/00 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
Provided are a transfer device and a transfer method capable of reliably detaching an element from a transfer substrate and transferring the element to a transfer destination substrate. Specifically, a transfer substrate 22 is provided with a blistering layer 24 on which a blister 30 is generated through irradiation with an active energy ray. An element 21 is held on the blistering layer 24. A transfer destination substrate 23 is provided with a catch layer 25 on which the element 21 can be held. The catch layer 25 is disposed so as to face the transfer substrate 22. An energy irradiation unit 12, by generating the blister 30 in an element holding region 24a which is a region for holding one element 21 on the blistering layer 24, changes the inclination of the element 21 with respect to the transfer substrate 22 to bring the element 21 near the transfer destination substrate 23, and causes a portion of the element 21 to firstly make contact with the catch layer 25 in a state where the element 21 is held on the blistering layer 24.
The purpose of the present invention is to provide a coating device with which it is possible to maintain, in a stable manner, the spacing between a substrate and a coating part for applying a coating liquid. Specifically, the present invention provides a coating device for applying a coating liquid by means of a coating part onto a prescribed surface of a substrate transported by a roll-to-roll process, the coating part being provided with a body part formed so as to be elongated in the width direction of the substrate, a discharge port that is formed so as to project from the body part and that discharges the coating liquid onto the prescribed surface of the substrate, and a support member defining a transportation path for the substrate. The support member has a support roll in which the outer circumferential surface thereof comes into contact with the substrate. The support roll is provided so as to be integral with the body part so as to be located on the upstream side and/or the downstream side of the discharge port on the transportation path, so as to be in contact with at least a part of a non-coated region, of the prescribed surface of the substrate, on which no coating is formed.
B05C 13/02 - Moyens pour manipuler ou tenir des objets, p. ex. des objets individuels pour des objets particuliers
B05C 5/02 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage à partir d'un dispositif de sortie en contact, ou presque en contact, avec l'ouvrage
98.
DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD
Provided is a defect inspection device making it possible, with a simple method, to automatically detect optimum optical conditions for imaging a region that includes a defect. A defect inspection device 1 comprises: an optical microscope 10 provided with an imaging unit 14 for capturing an image of a chip 31; a control unit 20 for controlling optical conditions for capturing the image of the chip; and a storage unit 25 for storing the location of a defect in the chip that has been detected in advance. The imaging unit is provided with a detecting means for: capturing, while changing the optical conditions, a first image of a region that includes the defect stored in the storage unit as well as a second image of a region that does not include the defect in the same region as the region that includes the defect; and detecting the optimum optical conditions for imaging the region that includes the defect by comparing a feature amount of the first image and a feature amount of the second image.
Provided are a substrate processing device and a scale correction method that make it possible to ascertain an actual movement amount of a substrate even in a case where a scale has undergone thermal expansion, and to suppress degradation in positional accuracy on the substrate. More specifically, this substrate processing device comprises: a stage whereon a substrate, for which at least two reference points are set, is placed; a substrate processing unit that performs predetermined processing of the substrate placed on the stage; a movement unit that moves the substrate atop the stage and the substrate processing unit relative to each other on the basis of scale reading information; and a control device that controls said stage and said units. The substrate processing device is configured to use the control device to perform scale correction in accordance with a deviation between a set distance between the reference points set for the substrate and an actual distance between the reference points set for the substrate conveyed onto the stage.
Provided are a coating film formation method and an ink jet coating device capable of suppressing formation of uneven coating even when a defective nozzle occurs. Specifically, the coating film formation method for ejecting liquid droplets by an ink jet method onto a film formation region on a base material to form a coating film comprises conducting, in this order: a defective nozzle detection step for detecting a defective nozzle among a plurality of nozzles ejecting liquid droplets; a pre-film formation step for conducting film formation by ejecting liquid droplets by a normal nozzle in advance onto a defective film formation region, which is a film formation region that will be formed by the defective nozzle detected by the defective nozzle detection step; and a main coating step for conducting film formation on the region other than landing position where the defective nozzle should eject.
B05D 1/26 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par application de liquides ou d'autres matériaux fluides, à partir d'un orifice en contact ou presque en contact avec la surface
B05C 5/00 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage
B05C 11/10 - Stockage, débit ou réglage du liquide ou d'un autre matériau fluideRécupération de l'excès de liquide ou d'un autre matériau fluide
B05D 1/36 - Applications successives de liquides ou d'autres matériaux fluides, p. ex. sans traitement intermédiaire
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
B41J 2/01 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre
