Abstract

A method of preventing corrosion associated with an electrically-conductive through-glass via (TGV) may comprise forming a TGV in a glass substrate for use in a microelectromechanical system (MEMS) device. The TGV has a first end and a second end, and at least partially comprises copper. The method may further comprise applying a conductive barrier layer on the first end of the TGV and/or the second end of the TGV, and applying a metal layer over the conductive barrier layer. The method may further comprise extending the conductive barrier layer over the first end of the TGV, and over at least a portion of the glass substrate encompassing the end of the TGV, such that the conductive barrier layer overlaps a boundary between the TGV and the glass substrate.

IPC Classes  ?

• B81B 7/00 - Microstructural systems
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

Abstract

A method of preventing corrosion associated with an electrically-conductive through-glass via (TGV) may comprise forming a TGV in a glass substrate for use in a microelectromechanical system (MEMS) device. The TGV has a first end and a second end, and at least partially comprises copper. The method may further comprise applying a conductive barrier layer on the first end of the TGV and/or the second end of the TGV, and applying a metal layer over the conductive barrier layer. The method may further comprise extending the conductive barrier layer over the first end of the TGV, and over at least a portion of the glass substrate encompassing the end of the TGV, such that the conductive barrier layer overlaps a boundary between the TGV and the glass substrate.

IPC Classes  ?

• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• B81B 7/00 - Microstructural systems
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); custom manufacturing and assembling services of semiconductor parts and integrated circuits for others; semiconductor foundry (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); processing of semiconductors; custom assembling of circuit board and semiconductor for others; processing of parts for semiconductor manufacturing; processing of semiconductor elements; processing of semiconductor wafers; custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip; processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; processing and assembling services of wafers, semiconductors, integrated circuits, for others (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); cutting, forming, and etching process of semiconductors and integrated circuits for others; manufacturing services for others in the nature of encasing wafers, semiconductors, and integrated circuits in packaging (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations). Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); custom manufacturing and assembling services of semiconductor parts and integrated circuits for others; semiconductor foundry (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); processing of semiconductors; custom assembling of circuit board and semiconductor for others; processing of parts for semiconductor manufacturing; processing of semiconductor elements; processing of semiconductor wafers; custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip; processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; processing and assembling services of wafers, semiconductors, integrated circuits, for others (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); cutting, forming, and etching process of semiconductors and integrated circuits for others; manufacturing services for others in the nature of encasing wafers, semiconductors, and integrated circuits in packaging (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations). Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); custom manufacturing and assembling services of semiconductor parts and integrated circuits for others; semiconductor foundry (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); processing of semiconductors; custom assembling of circuit board and semiconductor for others; processing of parts for semiconductor manufacturing; processing of semiconductor elements; processing of semiconductor wafers; custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip; processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; processing and assembling services of wafers, semiconductors, integrated circuits, for others (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); cutting, forming, and etching process of semiconductors and integrated circuits for others; manufacturing services for others in the nature of encasing wafers, semiconductors, and integrated circuits in packaging (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations). Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); custom manufacturing and assembling services of semiconductor parts and integrated circuits for others; semiconductor foundry (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); processing of semiconductors; custom assembling of circuit board and semiconductor for others; processing of parts for semiconductor manufacturing; processing of semiconductor elements; processing of semiconductor wafers; custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip; processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; processing and assembling services of wafers, semiconductors, integrated circuits, for others (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); cutting, forming, and etching process of semiconductors and integrated circuits for others; manufacturing services for others in the nature of encasing wafers, semiconductors, and integrated circuits in packaging (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations). Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Abstract

A switch device may comprise a micro-relay disposed between a first terminal and a second terminal. The micro-relay may be configured to selectively electrically couple the first terminal to the second terminal. The switch device may further comprise a bypass circuit configured to selectively divert at least a portion of electrical current flowing from the first terminal to the micro-relay, and direct the diverted electrical current to the second terminal. The switch device may further comprise an energy harvesting circuit configured to (i) withdraw a portion of energy flowing into the switch device, (ii) store the portion of energy in an energy storage device, and (iii) supplying the energy stored in the energy storage device to one or more components within the switch device.

IPC Classes  ?

• H01H 1/00 - Contacts
• H01H 59/00 - Electrostatic relaysElectro-adhesion relays
• H01H 71/08 - TerminalsConnections

Abstract

A device for switching a differential signal includes an input port, a first output port, a second output port, a first micro electromechanical system (MEMS) switch, and a second MEMS switch. The first and second MEMS switches selectively couple the input port to either the first output port or the second output port. The differential input port is separated into two single-ended paths. One single-ended path is switched through the first MEMS switch, and the other single-ended path is switched through the second MEMS switch. The single-ended paths are spatially matched with respect to length and orientation, and are at least partially distributed through at least two layers of electrical conductors, with adjacent layers of electrical conductors separated by electrically insulating layers.

IPC Classes  ?

• H03K 17/00 - Electronic switching or gating, i.e. not by contact-making and -breaking

Abstract

A device for switching a differential signal includes an input port, a first output port, a second output port, a first micro electromechanical system (MEMS) switch, and a second MEMS switch. The first and second MEMS switches selectively couple the input port to either the first output port or the second output port. The differential input port is separated into two single-ended paths. One single-ended path is switched through the first MEMS switch, and the other single-ended path is switched through the second MEMS switch. The single-ended paths are spatially matched with respect to length and orientation, and are at least partially distributed through at least two layers of electrical conductors, with adjacent layers of electrical conductors separated by electrically insulating layers.

IPC Classes  ?

• H01P 1/201 - Filters for transverse electromagnetic waves

Goods & Services

Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits; Custom manufacturing of semiconductor parts and integrated circuits for others; Semiconductor foundry services for others; Processing of semiconductors; Custom manufacturing of circuit board and semiconductor for others; Processing of parts for semiconductor manufacturing; Processing of semiconductor elements; Processing of semiconductor wafers; Custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip for others; Processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; Processing services of wafers, semiconductors, integrated circuits, for others; Cutting, forming, and etching process of semiconductors and integrated circuits for others Semiconductors; integrated electronic circuits; electronic components for computers containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components for computers, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM) for others

Goods & Services

Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits; Custom manufacturing of semiconductor parts and integrated circuits for others; Semiconductor foundry services for others; Processing of semiconductors; Custom manufacturing of circuit board and semiconductor for others; Processing of parts for semiconductor manufacturing; Processing of semiconductor elements; Processing of semiconductor wafers; Custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip for others; Processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; Processing services of wafers, semiconductors, integrated circuits, for others; Cutting, forming, and etching process of semiconductors and integrated circuits for others Semiconductors; integrated electronic circuits; electronic components for computers containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components for computers, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM) for others

Goods & Services

Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits; Custom manufacturing of semiconductor parts and integrated circuits for others; Semiconductor foundry services for others; Processing of semiconductors; Custom manufacturing of circuit board and semiconductor for others; Processing of parts for semiconductor manufacturing; Processing of semiconductor elements; Processing of semiconductor wafers; Custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip for others; Processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; Processing services of wafers, semiconductors, integrated circuits, for others; Cutting, forming, and etching process of semiconductors and integrated circuits for others Semiconductors; integrated electronic circuits; electronic components for computers containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components for computers, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM) for others

Goods & Services

Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits; Custom manufacturing of semiconductor parts and integrated circuits for others; Semiconductor foundry services for others; Processing of semiconductors; Custom manufacturing of circuit board and semiconductor for others; Processing of parts for semiconductor manufacturing; Processing of semiconductor elements; Processing of semiconductor wafers; Custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip for others; Processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; Processing services of wafers, semiconductors, integrated circuits, for others; Cutting, forming, and etching process of semiconductors and integrated circuits for others Semiconductors; integrated electronic circuits; electronic components for computers containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components for computers, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM) for others

Abstract

A micro-relay switch array may comprise an array of micro-relays disposed on a substrate, and a cap disposed over the array of micro-relays, thereby encapsulating the array of micro-relays. The micro-relay array may further comprise an array of through- substrate vias (TSVs) associated with the array of micro-relays, arranged such that columns of TSVs alternate with columns of micro-relays, and a plurality of device electrical conductors, each of which electrically couples one of the TSVs of the array of TSVs directly to at least two of the micro-relays. The micro-relay array may further comprise a plurality of TSV electrical conductors, each of which electrically couples at least two TSVs together. Each micro-relay of the array of micro-relays may be a micro-electromechanical system (MEMS) switch. The substrate and cap may be glass, and the TSVs may be through-glass vias.

IPC Classes  ?

• H01H 59/00 - Electrostatic relaysElectro-adhesion relays
• H01H 1/00 - Contacts

Abstract

A micro-relay switch array may comprise an array of micro-relays disposed on a substrate, and a cap disposed over the array of micro-relays, thereby encapsulating the array of micro-relays. The micro-relay switch array may further comprise an array of through-substrate vias (TSVs) associated with the array of micro-relays, arranged such that columns of TSVs alternate with columns of micro-relays, and a plurality of device electrical conductors, each of which electrically couples one of the TSVs of the array of TSVs directly to at least two of the micro-relays. The micro-relay switch array may further comprise a plurality of TSV electrical conductors, each of which electrically couples at least two TSVs together. Each micro-relay of the array of micro-relays may be a micro-electromechanical system (MEMS) switch. The substrate and cap may be glass, and the TSVs may be through-glass vias.

IPC Classes  ?

• B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Abstract

A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum-group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.

IPC Classes  ?

• H01H 1/0237 - Composite material having a noble metal as the basic material and containing oxides
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H01H 49/00 - Apparatus or processes specially adapted to the manufacture of relays or parts thereof
• H01H 59/00 - Electrostatic relaysElectro-adhesion relays
• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• H01H 1/00 - Contacts

Abstract

A switch device may comprise a micro-relay disposed between a first terminal and a second terminal. The micro-relay may be configured to selectively electrically couple the first terminal to the second terminal. The switch device may further comprise a bypass circuit configured to selectively divert at least a portion of electrical current flowing from the first terminal to the micro-relay, and direct the diverted electrical current to the second terminal. The switch device may further comprise an energy harvesting circuit configured to (i) withdraw a portion of energy flowing into the switch device, (ii) store the portion of energy in an energy storage device, and (iii) supplying the energy stored in the energy storage device to one or more components within the switch device.

IPC Classes  ?

• H01H 59/00 - Electrostatic relaysElectro-adhesion relays
• H01H 71/00 - Details of the protective switches or relays covered by groups

Abstract

A metallized via structure may comprise a via hole, a barrier layer deposited within the via hole, and a metallic plug disposed within the via hole. The via hole may be formed in a device package, and the via hole may be defined by at least one interior wall of the device package. The barrier layer may be disposed upon the at least one interior wall to form a barrier layer lined via hole. The metallic plug may be disposed within the barrier lined via hole by pressurized injection of a molten metal, such that the barrier layer is situated between the metallic plug and the at least one interior wall. The barrier layer may be situated to prevent the metallic plug from contacting the interior wall.

IPC Classes  ?

• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
• H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• H01L 23/498 - Leads on insulating substrates

Abstract

A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal-nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.

IPC Classes  ?

• H01L 23/15 - Ceramic or glass substrates
• C23C 16/40 - Oxides
• C23C 16/455 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

Abstract

A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal- nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.

IPC Classes  ?

• C03C 17/36 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
• C03C 17/09 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with metals by deposition from the vapour phase
• C03C 17/22 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with other inorganic material
• C03C 17/34 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/15 - Ceramic or glass substrates
• H01L 23/498 - Leads on insulating substrates
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

Abstract

A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum- group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.

IPC Classes  ?

• B81B 7/00 - Microstructural systems
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

Abstract

A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum-group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.

IPC Classes  ?

• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H01H 1/0237 - Composite material having a noble metal as the basic material and containing oxides
• H01H 49/00 - Apparatus or processes specially adapted to the manufacture of relays or parts thereof
• H01H 59/00 - Electrostatic relaysElectro-adhesion relays
• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• H01H 1/00 - Contacts

Abstract

A differential time delay shifter may comprise a 1-to-N switch, where N is an integer greater than 1. The switch may have a pole contact, N throw contacts, and a pole arm to selectively couple the pole contact to one of the throw contacts. One throw contacts may be a first throw contact at a first switch position, and one throw contacts may be a last throw contact at a last switch position. The shifter may further comprise one or more transmission lines, each of which is electrically connected between two of the N throw contacts. The shifter may further comprise a source configured to generate an electromagnetic signal. The source may be electrically coupled to the pole contact, to convey the signal to the pole contact. The shifter may further comprise one or more loads, a first of which is electrically coupled to the first throw contact.

IPC Classes  ?

• H01Q 3/26 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elementsArrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the distribution of energy across a radiating aperture
• H01P 1/18 - Phase-shifters
• H04W 16/28 - Cell structures using beam steering

Abstract

A differential time delay shifter may comprise a 1-to-N switch, where N is an integer greater than 1. The switch may have a pole contact, N throw contacts, and a pole arm to selectively couple the pole contact to one of the throw contacts. One throw contacts may be a first throw contact at a first switch position, and one throw contacts may be a last throw contact at a last switch position. The shifter may further comprise one or more transmission lines, each of which is electrically connected between two of the N throw contacts. The shifter may further comprise a source configured to generate an electromagnetic signal. The source may be electrically coupled to the pole contact, to convey the signal to the pole contact. The shifter may further comprise one or more loads, a first of which is electrically coupled to the first throw contact.

IPC Classes  ?

• H04B 7/06 - Diversity systemsMulti-antenna systems, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station
• H01P 1/18 - Phase-shifters

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit.

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit.

Goods & Services

(1) Semiconductors; integrated electronic circuits; electronic components containing micro-electromechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for opening or closing electronic circuits for use in the areas of next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation. (1) Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Goods & Services

(1) Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for opening or closing electronic circuits for use in the areas of next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation. (1) Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Abstract

A hermetically sealed component may comprise a glass substrate, a device with at least one electrical port associated with the glass substrate, and a glass cap. The glass cap may have at least one side wall. The glass cap may have a shaped void extending therethrough, from top surface of the glass cap to bottom surface of glass pillar. An electrically conductive plug may be disposed within the void, the plug configured to hermetically seal the void. The electrically conductive plug may be electrically coupled to the electrical port. The glass cap may be disposed on the glass substrate, with the at least one side wall disposed therebetween, to form a cavity encompassing the device. The side wall may contact the glass substrate and the glass cap to provide a hermetic seal, such that a first environment within the cavity is isolated from a second environment external to the cavity.

IPC Classes  ?

• B81B 7/00 - Microstructural systems
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H01H 1/00 - Contacts

Abstract

A hermetically sealed component may comprise a glass substrate, a device with at least one electrical port associated with the glass substrate, and a glass cap. The glass cap may have at least one side wall. The glass cap may have a shaped void extending therethrough, from top surface of the glass cap to bottom surface of glass pillar. An electrically conductive plug may be disposed within the void, the plug configured to hermetically seal the void. The electrically conductive plug may be electrically coupled to the electrical port. The glass cap may be disposed on the glass substrate, with the at least one side wall disposed therebetween, to form a cavity encompassing the device. The side wall may contact the glass substrate and the glass cap to provide a hermetic seal, such that a first environment within the cavity is isolated from a second environment external to the cavity.

IPC Classes  ?

• B81B 7/00 - Microstructural systems
• B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
• H01H 1/00 - Contacts

Abstract

A hermetically sealed component may comprise a glass substrate, a device with at least one electrical port associated with the glass substrate, and a glass cap. The glass cap may have at least one side wall. The glass cap may have a shaped void extending therethrough, from top surface of the glass cap to bottom surface of glass pillar. An electrically conductive plug may be disposed within the void, the plug configured to hermetically seal the void. The electrically conductive plug may be electrically coupled to the electrical port. The glass cap may be disposed on the glass substrate, with the at least one side wall disposed therebetween, to form a cavity encompassing the device. The side wall may contact the glass substrate and the glass cap to provide a hermetic seal, such that a first environment within the cavity is isolated from a second environment external to the cavity.

IPC Classes  ?

• H01L 41/113 - Piezo-electric or electrostrictive elements with mechanical input and electrical output
• B81B 7/00 - Microstructural systems
• H01H 1/00 - Contacts

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)

Abstract

A method of mitigating self-actuation of a switch may comprise generating a tracking signal, based on an input signal that the switch is configured to convey, and combining the tracking signal with an actuating signal to generate a modified actuating signal. The actuating signal may be configured to change a state of the switch from a first state (e.g., ON) to a second state (e.g., OFF). The method further comprises selectively applying the modified actuating signal to a gate of the switch. A switch self-actuation mitigation system may comprise a first coupling device for electrically couple an AC component of a first signal to a node, where the first signal is applied a switch input. The system may further comprise a second coupling device configured to electrically couple an actuating signal to the node, and a driving device configured to selectively couple the node to a gate of the switch.

IPC Classes  ?

• H01H 59/00 - Electrostatic relaysElectro-adhesion relays
• H01P 1/12 - Auxiliary devices for switching or interrupting by mechanical chopper

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit.

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM). Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Goods & Services

(1) Semiconductors; integrated electronic circuits; integrated electronic circuits containing micro-electro-mechanical systems (MEMS) based sensors and actuators; integrated electronic circuits containing system-in-package (SIP) modules, and multi-chip-modules (MCM). (1) Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)

Goods & Services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)