Abrégé

A system for transferring power and a control signal across an isolation barrier comprises a first domain that generates a carrier signal and modulates the carrier signal with the control signal to produce a modulated signal, and a second domain that recovers DC power from the modulated signal and recovers the control signal from the modulated signal to produce a recovered control signal. The first domain may convey the modulated signal through the isolation barrier and to the second domain. The first domain may comprise an encoder that modulates the carrier signal by varying the duty cycle of the carrier signal. The recovered control signal may comprise a first MEMS switch gate drive signal and a second MEMS switch gate drive signal, and the second domain may synchronizes the first MEMS switch gate drive signal to the second MEMS switch gate drive signal.

Classes IPC  ?

• H03K 17/689 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ avec une isolation galvanique entre le circuit de commande et le circuit de sortie
• H01H 59/00 - Relais électrostatiquesRelais à électro-adhésion

Abrégé

A system for protecting a MEMS relay switch system that controls electric current to a load includes a parallel resonant circuit in series with the MEMS relay switch system. The parallel resonant circuit includes an auxiliary switch in series with a capacitor configured to be pre-charged by a voltage source, and an inductor in parallel with the auxiliary switch and the capacitor. The inductor is in series with the MEMS relay switch system. A method includes receiving a signal, activating an auxiliary switch, determining if the received signal is a turn OFF or a turn ON signal, and depending on the received signal, setting a time delay within a resonant half cycle of a parallel resonant pulse circuit, turning off the auxiliary switch, and pre-charging a capacitor of the parallel resonant pulse circuit.

Classes IPC  ?

• H01H 9/56 - Circuits non adaptés à une application particulière du dispositif de commutation non prévus ailleurs pour assurer le fonctionnement de l'interrupteur en un point déterminé de la période du courant alternatif
• H01H 47/00 - Circuits autres que ceux appropriés à une application particulière du relais et prévue pour obtenir une caractéristique de fonctionnement donnée ou pour assurer un courant d'excitation donné
• H01H 59/00 - Relais électrostatiquesRelais à électro-adhésion
• H01H 71/00 - Détails des interrupteurs ou relais de protection compris dans les groupes

Abrégé

A method of preventing corrosion associated with an electrically-conductive through-glass via (TGV) may comprise forming a TGV in a glass substrate for use in a microelectromechanical system (MEMS) device. The TGV has a first end and a second end, and at least partially comprises copper. The method may further comprise applying a conductive barrier layer on the first end of the TGV and/or the second end of the TGV, and applying a metal layer over the conductive barrier layer. The method may further comprise extending the conductive barrier layer over the first end of the TGV, and over at least a portion of the glass substrate encompassing the end of the TGV, such that the conductive barrier layer overlaps a boundary between the TGV and the glass substrate.

Classes IPC  ?

• B81B 7/00 - Systèmes à microstructure
• B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat

Abrégé

A method of preventing corrosion associated with an electrically-conductive through-glass via (TGV) may comprise forming a TGV in a glass substrate for use in a microelectromechanical system (MEMS) device. The TGV has a first end and a second end, and at least partially comprises copper. The method may further comprise applying a conductive barrier layer on the first end of the TGV and/or the second end of the TGV, and applying a metal layer over the conductive barrier layer. The method may further comprise extending the conductive barrier layer over the first end of the TGV, and over at least a portion of the glass substrate encompassing the end of the TGV, such that the conductive barrier layer overlaps a boundary between the TGV and the glass substrate.

Classes IPC  ?

• B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
• B81B 7/00 - Systèmes à microstructure
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); custom manufacturing and assembling services of semiconductor parts and integrated circuits for others; semiconductor foundry (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); processing of semiconductors; custom assembling of circuit board and semiconductor for others; processing of parts for semiconductor manufacturing; processing of semiconductor elements; processing of semiconductor wafers; custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip; processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; processing and assembling services of wafers, semiconductors, integrated circuits, for others (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); cutting, forming, and etching process of semiconductors and integrated circuits for others; manufacturing services for others in the nature of encasing wafers, semiconductors, and integrated circuits in packaging (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations). Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); custom manufacturing and assembling services of semiconductor parts and integrated circuits for others; semiconductor foundry (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); processing of semiconductors; custom assembling of circuit board and semiconductor for others; processing of parts for semiconductor manufacturing; processing of semiconductor elements; processing of semiconductor wafers; custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip; processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; processing and assembling services of wafers, semiconductors, integrated circuits, for others (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); cutting, forming, and etching process of semiconductors and integrated circuits for others; manufacturing services for others in the nature of encasing wafers, semiconductors, and integrated circuits in packaging (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations). Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); custom manufacturing and assembling services of semiconductor parts and integrated circuits for others; semiconductor foundry (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); processing of semiconductors; custom assembling of circuit board and semiconductor for others; processing of parts for semiconductor manufacturing; processing of semiconductor elements; processing of semiconductor wafers; custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip; processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; processing and assembling services of wafers, semiconductors, integrated circuits, for others (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); cutting, forming, and etching process of semiconductors and integrated circuits for others; manufacturing services for others in the nature of encasing wafers, semiconductors, and integrated circuits in packaging (term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations). Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); custom manufacturing and assembling services of semiconductor parts and integrated circuits for others; semiconductor foundry (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); processing of semiconductors; custom assembling of circuit board and semiconductor for others; processing of parts for semiconductor manufacturing; processing of semiconductor elements; processing of semiconductor wafers; custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip; processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; processing and assembling services of wafers, semiconductors, integrated circuits, for others (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations); cutting, forming, and etching process of semiconductors and integrated circuits for others; manufacturing services for others in the nature of encasing wafers, semiconductors, and integrated circuits in packaging (Term considered too vague by the International Bureau pursuant to Rule 13 (2) (b) of the Regulations). Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Abrégé

A switch device may comprise a micro-relay disposed between a first terminal and a second terminal. The micro-relay may be configured to selectively electrically couple the first terminal to the second terminal. The switch device may further comprise a bypass circuit configured to selectively divert at least a portion of electrical current flowing from the first terminal to the micro-relay, and direct the diverted electrical current to the second terminal. The switch device may further comprise an energy harvesting circuit configured to (i) withdraw a portion of energy flowing into the switch device, (ii) store the portion of energy in an energy storage device, and (iii) supplying the energy stored in the energy storage device to one or more components within the switch device.

Classes IPC  ?

• H01H 1/00 - Contacts
• H01H 59/00 - Relais électrostatiquesRelais à électro-adhésion
• H01H 71/08 - BornesConnexions

Abrégé

A device for switching a differential signal includes an input port, a first output port, a second output port, a first micro electromechanical system (MEMS) switch, and a second MEMS switch. The first and second MEMS switches selectively couple the input port to either the first output port or the second output port. The differential input port is separated into two single-ended paths. One single-ended path is switched through the first MEMS switch, and the other single-ended path is switched through the second MEMS switch. The single-ended paths are spatially matched with respect to length and orientation, and are at least partially distributed through at least two layers of electrical conductors, with adjacent layers of electrical conductors separated by electrically insulating layers.

Classes IPC  ?

• H03K 17/00 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts

Abrégé

A device for switching a differential signal includes an input port, a first output port, a second output port, a first micro electromechanical system (MEMS) switch, and a second MEMS switch. The first and second MEMS switches selectively couple the input port to either the first output port or the second output port. The differential input port is separated into two single-ended paths. One single-ended path is switched through the first MEMS switch, and the other single-ended path is switched through the second MEMS switch. The single-ended paths are spatially matched with respect to length and orientation, and are at least partially distributed through at least two layers of electrical conductors, with adjacent layers of electrical conductors separated by electrically insulating layers.

Classes IPC  ?

• H01P 1/201 - Filtres à ondes électromagnétiques transversales

Produits et services

Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits; Custom manufacturing of semiconductor parts and integrated circuits for others; Semiconductor foundry services for others; Processing of semiconductors; Custom manufacturing of circuit board and semiconductor for others; Processing of parts for semiconductor manufacturing; Processing of semiconductor elements; Processing of semiconductor wafers; Custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip for others; Processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; Processing services of wafers, semiconductors, integrated circuits, for others; Cutting, forming, and etching process of semiconductors and integrated circuits for others Semiconductors; integrated electronic circuits; electronic components for computers containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components for computers, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM) for others

Produits et services

Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits; Custom manufacturing of semiconductor parts and integrated circuits for others; Semiconductor foundry services for others; Processing of semiconductors; Custom manufacturing of circuit board and semiconductor for others; Processing of parts for semiconductor manufacturing; Processing of semiconductor elements; Processing of semiconductor wafers; Custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip for others; Processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; Processing services of wafers, semiconductors, integrated circuits, for others; Cutting, forming, and etching process of semiconductors and integrated circuits for others Semiconductors; integrated electronic circuits; electronic components for computers containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components for computers, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM) for others

Produits et services

Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits; Custom manufacturing of semiconductor parts and integrated circuits for others; Semiconductor foundry services for others; Processing of semiconductors; Custom manufacturing of circuit board and semiconductor for others; Processing of parts for semiconductor manufacturing; Processing of semiconductor elements; Processing of semiconductor wafers; Custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip for others; Processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; Processing services of wafers, semiconductors, integrated circuits, for others; Cutting, forming, and etching process of semiconductors and integrated circuits for others Semiconductors; integrated electronic circuits; electronic components for computers containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components for computers, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM) for others

Produits et services

Semiconductor and integrated circuit foundry services, namely, manufacturing services for others in the field of semiconductors and integrated circuits; Custom manufacturing of semiconductor parts and integrated circuits for others; Semiconductor foundry services for others; Processing of semiconductors; Custom manufacturing of circuit board and semiconductor for others; Processing of parts for semiconductor manufacturing; Processing of semiconductor elements; Processing of semiconductor wafers; Custom manufacturing of wafers, semiconductors, integrated circuits, including custom manufacturing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip for others; Processing of wafers, semiconductors, integrated circuits, including processing of application-specific integrated circuit, logic chip, mixed signal chip and memory chip, for others; Processing services of wafers, semiconductors, integrated circuits, for others; Cutting, forming, and etching process of semiconductors and integrated circuits for others Semiconductors; integrated electronic circuits; electronic components for computers containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components for computers, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM) for others

Abrégé

A micro-relay switch array may comprise an array of micro-relays disposed on a substrate, and a cap disposed over the array of micro-relays, thereby encapsulating the array of micro-relays. The micro-relay array may further comprise an array of through- substrate vias (TSVs) associated with the array of micro-relays, arranged such that columns of TSVs alternate with columns of micro-relays, and a plurality of device electrical conductors, each of which electrically couples one of the TSVs of the array of TSVs directly to at least two of the micro-relays. The micro-relay array may further comprise a plurality of TSV electrical conductors, each of which electrically couples at least two TSVs together. Each micro-relay of the array of micro-relays may be a micro-electromechanical system (MEMS) switch. The substrate and cap may be glass, and the TSVs may be through-glass vias.

Classes IPC  ?

• H01H 59/00 - Relais électrostatiquesRelais à électro-adhésion
• H01H 1/00 - Contacts

Abrégé

A micro-relay switch array may comprise an array of micro-relays disposed on a substrate, and a cap disposed over the array of micro-relays, thereby encapsulating the array of micro-relays. The micro-relay switch array may further comprise an array of through-substrate vias (TSVs) associated with the array of micro-relays, arranged such that columns of TSVs alternate with columns of micro-relays, and a plurality of device electrical conductors, each of which electrically couples one of the TSVs of the array of TSVs directly to at least two of the micro-relays. The micro-relay switch array may further comprise a plurality of TSV electrical conductors, each of which electrically couples at least two TSVs together. Each micro-relay of the array of micro-relays may be a micro-electromechanical system (MEMS) switch. The substrate and cap may be glass, and the TSVs may be through-glass vias.

Classes IPC  ?

• B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques

Abrégé

A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum-group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.

Classes IPC  ?

• H01H 1/0237 - Matériau composite avec un métal noble comme matériau de base et contenant des oxydes
• B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
• H01H 49/00 - Appareils ou procédés spécialement adaptés à la fabrication de relais ou d'éléments de relais
• H01H 59/00 - Relais électrostatiquesRelais à électro-adhésion
• H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
• H01H 1/00 - Contacts

Abrégé

A switch device may comprise a micro-relay disposed between a first terminal and a second terminal. The micro-relay may be configured to selectively electrically couple the first terminal to the second terminal. The switch device may further comprise a bypass circuit configured to selectively divert at least a portion of electrical current flowing from the first terminal to the micro-relay, and direct the diverted electrical current to the second terminal. The switch device may further comprise an energy harvesting circuit configured to (i) withdraw a portion of energy flowing into the switch device, (ii) store the portion of energy in an energy storage device, and (iii) supplying the energy stored in the energy storage device to one or more components within the switch device.

Classes IPC  ?

• H01H 59/00 - Relais électrostatiquesRelais à électro-adhésion
• H01H 71/00 - Détails des interrupteurs ou relais de protection compris dans les groupes

Abrégé

A metallized via structure may comprise a via hole, a barrier layer deposited within the via hole, and a metallic plug disposed within the via hole. The via hole may be formed in a device package, and the via hole may be defined by at least one interior wall of the device package. The barrier layer may be disposed upon the at least one interior wall to form a barrier layer lined via hole. The metallic plug may be disposed within the barrier lined via hole by pressurized injection of a molten metal, such that the barrier layer is situated between the metallic plug and the at least one interior wall. The barrier layer may be situated to prevent the metallic plug from contacting the interior wall.

Classes IPC  ?

• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 21/50 - Assemblage de dispositifs à semi-conducteurs en utilisant des procédés ou des appareils non couverts par l'un uniquement des groupes ou
• H01L 23/10 - ConteneursScellements caractérisés par le matériau ou par la disposition des scellements entre les parties, p. ex. entre le couvercle et la base ou entre les connexions et les parois du conteneur
• H01L 23/498 - Connexions électriques sur des substrats isolants

Abrégé

A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal-nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.

Classes IPC  ?

• H01L 23/15 - Substrats en céramique ou en verre
• C23C 16/40 - Oxydes
• C23C 16/455 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement caractérisé par le procédé utilisé pour introduire des gaz dans la chambre de réaction ou pour modifier les écoulements de gaz dans la chambre de réaction
• H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau

Abrégé

A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal- nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.

Classes IPC  ?

• C03C 17/36 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement avec au moins deux revêtements ayant des compositions différentes un revêtement au moins étant un métal
• C03C 17/09 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement par des métaux par dépôt à partir d'une phase vapeur
• C03C 17/22 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement par d'autres matières inorganiques
• C03C 17/34 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement avec au moins deux revêtements ayant des compositions différentes
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 23/15 - Substrats en céramique ou en verre
• H01L 23/498 - Connexions électriques sur des substrats isolants
• B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat

Abrégé

A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum- group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.

Classes IPC  ?

• B81B 7/00 - Systèmes à microstructure
• B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat

Abrégé

A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum-group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.

Classes IPC  ?

• B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
• H01H 1/0237 - Matériau composite avec un métal noble comme matériau de base et contenant des oxydes
• H01H 49/00 - Appareils ou procédés spécialement adaptés à la fabrication de relais ou d'éléments de relais
• H01H 59/00 - Relais électrostatiquesRelais à électro-adhésion
• H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
• H01H 1/00 - Contacts

Abrégé

A differential time delay shifter may comprise a 1-to-N switch, where N is an integer greater than 1. The switch may have a pole contact, N throw contacts, and a pole arm to selectively couple the pole contact to one of the throw contacts. One throw contacts may be a first throw contact at a first switch position, and one throw contacts may be a last throw contact at a last switch position. The shifter may further comprise one or more transmission lines, each of which is electrically connected between two of the N throw contacts. The shifter may further comprise a source configured to generate an electromagnetic signal. The source may be electrically coupled to the pole contact, to convey the signal to the pole contact. The shifter may further comprise one or more loads, a first of which is electrically coupled to the first throw contact.

Classes IPC  ?

• H01Q 3/26 - Dispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la phase relative ou l’amplitude relative et l’énergie d’excitation entre plusieurs éléments rayonnants actifsDispositifs pour changer ou faire varier l'orientation ou la forme du diagramme de directivité des ondes rayonnées par une antenne ou un système d'antenne faisant varier la distribution de l’énergie à travers une ouverture rayonnante
• H01P 1/18 - Déphaseurs
• H04W 16/28 - Structures des cellules utilisant l'orientation du faisceau

Abrégé

A differential time delay shifter may comprise a 1-to-N switch, where N is an integer greater than 1. The switch may have a pole contact, N throw contacts, and a pole arm to selectively couple the pole contact to one of the throw contacts. One throw contacts may be a first throw contact at a first switch position, and one throw contacts may be a last throw contact at a last switch position. The shifter may further comprise one or more transmission lines, each of which is electrically connected between two of the N throw contacts. The shifter may further comprise a source configured to generate an electromagnetic signal. The source may be electrically coupled to the pole contact, to convey the signal to the pole contact. The shifter may further comprise one or more loads, a first of which is electrically coupled to the first throw contact.

Classes IPC  ?

• H04B 7/06 - Systèmes de diversitéSystèmes à plusieurs antennes, c.-à-d. émission ou réception utilisant plusieurs antennes utilisant plusieurs antennes indépendantes espacées à la station d'émission
• H01P 1/18 - Déphaseurs

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit.

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit.

Produits et services

(1) Semiconductors; integrated electronic circuits; electronic components containing micro-electromechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for opening or closing electronic circuits for use in the areas of next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation. (1) Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Produits et services

(1) Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for opening or closing electronic circuits for use in the areas of next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation. (1) Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Abrégé

A hermetically sealed component may comprise a glass substrate, a device with at least one electrical port associated with the glass substrate, and a glass cap. The glass cap may have at least one side wall. The glass cap may have a shaped void extending therethrough, from top surface of the glass cap to bottom surface of glass pillar. An electrically conductive plug may be disposed within the void, the plug configured to hermetically seal the void. The electrically conductive plug may be electrically coupled to the electrical port. The glass cap may be disposed on the glass substrate, with the at least one side wall disposed therebetween, to form a cavity encompassing the device. The side wall may contact the glass substrate and the glass cap to provide a hermetic seal, such that a first environment within the cavity is isolated from a second environment external to the cavity.

Classes IPC  ?

• B81B 7/00 - Systèmes à microstructure
• B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
• H01H 1/00 - Contacts

Abrégé

A hermetically sealed component may comprise a glass substrate, a device with at least one electrical port associated with the glass substrate, and a glass cap. The glass cap may have at least one side wall. The glass cap may have a shaped void extending therethrough, from top surface of the glass cap to bottom surface of glass pillar. An electrically conductive plug may be disposed within the void, the plug configured to hermetically seal the void. The electrically conductive plug may be electrically coupled to the electrical port. The glass cap may be disposed on the glass substrate, with the at least one side wall disposed therebetween, to form a cavity encompassing the device. The side wall may contact the glass substrate and the glass cap to provide a hermetic seal, such that a first environment within the cavity is isolated from a second environment external to the cavity.

Classes IPC  ?

• B81B 7/00 - Systèmes à microstructure
• B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
• H01H 1/00 - Contacts

Abrégé

A hermetically sealed component may comprise a glass substrate, a device with at least one electrical port associated with the glass substrate, and a glass cap. The glass cap may have at least one side wall. The glass cap may have a shaped void extending therethrough, from top surface of the glass cap to bottom surface of glass pillar. An electrically conductive plug may be disposed within the void, the plug configured to hermetically seal the void. The electrically conductive plug may be electrically coupled to the electrical port. The glass cap may be disposed on the glass substrate, with the at least one side wall disposed therebetween, to form a cavity encompassing the device. The side wall may contact the glass substrate and the glass cap to provide a hermetic seal, such that a first environment within the cavity is isolated from a second environment external to the cavity.

Classes IPC  ?

• H01L 41/113 - Eléments piézo-électriques ou électrostrictifs à entrée mécanique et sortie électrique
• B81B 7/00 - Systèmes à microstructure
• H01H 1/00 - Contacts

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)

Abrégé

A method of mitigating self-actuation of a switch may comprise generating a tracking signal, based on an input signal that the switch is configured to convey, and combining the tracking signal with an actuating signal to generate a modified actuating signal. The actuating signal may be configured to change a state of the switch from a first state (e.g., ON) to a second state (e.g., OFF). The method further comprises selectively applying the modified actuating signal to a gate of the switch. A switch self-actuation mitigation system may comprise a first coupling device for electrically couple an AC component of a first signal to a node, where the first signal is applied a switch input. The system may further comprise a second coupling device configured to electrically couple an actuating signal to the node, and a driving device configured to selectively couple the node to a gate of the switch.

Classes IPC  ?

• H01H 59/00 - Relais électrostatiquesRelais à électro-adhésion
• H01P 1/12 - Dispositifs commutateurs ou interrupteurs utilisant un vibreur mécanique

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; downloadable software for use with semiconductors for opening or closing an electric circuit; downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit. Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM); Platform as a service (PAAS) featuring computer software platforms for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit.

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) being integrated circuits; Downloadable software for use with semiconductors for opening or closing an electric circuit; Downloadable software for use with integrated electronic circuits for opening or closing an electric circuit; Downloadable software for use with electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators for opening or closing an electric circuit; Downloadable software for use with electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) for opening or closing an electric circuit; Downloadable software for use with multiple industries, namely, next generation 5G mobile networks, industrial IoT markets, battery management, home automation, electronic vehicles and medical instrumentation for opening or closing an electric circuit Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM). Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM).

Produits et services

(1) Semiconductors; integrated electronic circuits; integrated electronic circuits containing micro-electro-mechanical systems (MEMS) based sensors and actuators; integrated electronic circuits containing system-in-package (SIP) modules, and multi-chip-modules (MCM). (1) Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)

Produits et services

Semiconductors; integrated electronic circuits; electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators; electronic components, namely, system-in-package (SIP) modules, and multi-chip-modules (MCM) Scientific and technological services, namely, research, design, and development services of integrated electronic circuits, electronic components containing micro-electro-mechanical systems (MEMS) based sensors and actuators, system-in-package (SIP) modules, and multi-chip-modules (MCM)