Abstract

Disclosed are a heat-electricity discrete power module with two-way heat-dissipation ceramic substrates and a manufacturing method of the same, including: two double-sided metal-clad ceramic substrates, a power transistor die, and an insulation sealant; each double-sided metal-clad ceramic substrate including a ceramic insulation layer, a three-dimensional conductive layer formed on the first ceramic insulation layer and facing the opposite three-dimensional conductive layer to constitute an electrical circuit, and a thermally-conductive metallic layer opposite and insulated from the three-dimensional conductive layer, respectively; electrodes of each power transistor die are electrically conductively connected to the three-dimensional conductive layer, and their upper and lower surfaces are thermally conductively connected to respective three-dimensional conductive layers; circuit components are additionally mounted on the three-dimensional conductive layers; at least one conductive post is formed between the circuits of respective three-dimensional conductive layers; the power transistor die and conductive post are completely encapsulated by the insulation sealant.

IPC Classes  ?

• H01L 23/495 - Lead-frames
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A power module, a manufacturing method, and a mold are disclosed. The power module includes a circuit substrate, a terminal assembly, and a package body. A surface of the circuit substrate is provided with at least one semiconductor component, each terminal assembly includes a terminal rack and a terminal inserted onto the terminal rack, and each terminal rack is disposed on the surface of the circuit substrate and has an insert surface and provided for passing each terminal through the insert surface into the terminal rack for combination. The package body is installed on the circuit substrate to package the semiconductor component and has an external surface substantially aligned with the insert surface of each terminal rack, or the insert surface protruding from the external surface, to make each terminal protrude out from the package body.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass

Abstract

A power apparatus (1, 2) includes a substrate (10, 10′), a first power component (20), a second power component (30), and a connection board (40, 40′). The substrate (10, 10′) includes a first area (11) and a second area (12) separated from each other. The first power component (20) is arranged on the first area (11). The second power component (30) is arranged on the second area (12). The connection board (40, 40′) is arranged between the first area (11) and the second area (12), and is electrically connected to the first power component (20) and the second area (12) respectively.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits

Abstract

A power apparatus includes a substrate, a first power circuit, and a second power circuit. The substrate includes a first metallization region, a second metallization region, and a third metallization region which are separated from each other. The first power circuit is electrically connected to the first metallization region and the third metallization region, and is arranged across the second metallization region and fails to be in contact with the second metallization region. The second power circuit is electrically connected to the second metallization region and the third metallization region, and fails to be in contact with the first metallization region.

IPC Classes  ?

• H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
• H02M 7/00 - Conversion of AC power input into DC power outputConversion of DC power input into AC power output

Abstract

Disclosed is a thermal conduction-electrical conduction isolated circuit board with a ceramic substrate and a power transistor embedded, mainly comprising: a dielectric material layer, a heat-dissipating ceramic block, a securing portion, a stepped metal electrode layer, a power transistor, and a dielectric material packaging, wherein a via hole is formed in the dielectric material layer, the heat-dissipating ceramic block is correspondingly embedded in the via hole, the heat-dissipating ceramic block has a thermal conductivity higher than that of the dielectric material layer and a thickness less than that of the dielectric material layer, the stepped metal electrode layer conducts electricity and heat for the power transistor, the dielectric material packaging is configured to partially expose the source connecting pin, drain connecting pin, and gate connecting pin of the encapsulated stepped metal electrode layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

A low parasitic inductance power module having staggered, interleaving busbars, including: at least one base extending a long a length direction, the base having at least one current input busbar and at least one current output busbar, the current input busbar and the current out busbar being formed with a plurality of interdigitated contact terminals, respectively; a first unit comprising a first circuit base portion disposed on the base along the width direction, on the first circuit base portion being disposed a plurality of first power devices; and a second unit, whereby when current flows through the units and the individual interdigitated contact terminals, individual inductances produced thereby are cancelled with each other, whereby overall parasitic inductance of the power module is reduced.

IPC Classes  ?

• H01L 23/64 - Impedance arrangements
• H01L 23/498 - Leads on insulating substrates
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A low parasitic inductance power module featuring staggered, interleaving conductive members, including: at least one base extending in a length direction, at least one input bus-bar and at least one output bus-bar being disposed on the base; a first unit including a first circuit base portion disposed on the base along the width direction, a plurality of first power devices being disposed on the first circuit base portion, each of the first power devices having paralleled first current input ends and paralleled first current output ends; the first current input ends or the current output ends being conductively connected to the first circuit base portion; and a second unit. The units are serially connected to the bus-bars via staggered, interleaving input conductive members and output conductive members whereby individual inductances generated are mutually counteracted, thus reducing the overall parasitic inductance.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H02M 7/00 - Conversion of AC power input into DC power outputConversion of DC power input into AC power output
• H05K 1/02 - Printed circuits Details
• H05K 1/181 -

Abstract

A power module includes two power input terminals, two main substrates, a plurality of first switches, a plurality of second switches, and a bridge main unit. The bridge main unit is across the two main substrates, and includes a first bridge subunit and a second bridge subunit. Each of the first bridge subunit and the second bridge subunit includes a first conducting region on a bottom surface, and a second conducting region and a third conducting region on a top surface. The first conducting region transmits a current signal of a current path of a switch circuit formed by the power input terminals, the first switches, and the second switches. The second conducting region is connected to the control terminals of the first switches and the second switches. The third conducting region is connected to the output terminals of the first switches and the second switches.

IPC Classes  ?

• H02M 7/58 - Conversion of DC power input into AC power output without possibility of reversal by dynamic converters using mechanical contact-making and -breaking parts to interrupt a single potential
• H02M 7/5387 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
• H05K 7/14 - Mounting supporting structure in casing or on frame or rack
• H02M 7/00 - Conversion of AC power input into DC power outputConversion of DC power input into AC power output

Abstract

A low parasitic inductance power module featuring staggered interleaving conductive members, including: at least one base extending in a length direction; a substrate on which at least one input bus bar and at least one output bus bar are provided; a first unit including a first circuit base portion disposed on the base in a width direction, a plurality of first power devices being disposed on the first circuit base portion, each first power device having a first current input end and a first current output end which are parallel connected, the first current input end or the first current output end being conducted to the first circuit base portion; and a second unit. The units are serially-connected to the bus bars via input conductive members and output conductive members arrayed in a staggered interleaving mode, whereby to create individual inductances counteracting with each other, reducing overall parasitic inductance.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass

Abstract

A metal honeycomb substrate includes a tubular body, a flat plate, and a wavy plate. The tubular body has a receiving portion. The wavy plate is stacked with the flat plate to form a spiral structure received in the receiving portion. The wavy plate has a wavy-shaped cross section and includes a second region and a continuous region connected to the second region. The wavy-shaped cross section includes peak portions and valley portions. The wavy plate has a solder region overlapping at least one portion of at least one of the second region and the continuous region. Solders are on outer sides of the peak portions and outer sides of the valley portions which are in the solder region. A ratio of an area of the solder region to an area of the wavy plate is in a range between substantially 20% and substantially 66%.

IPC Classes  ?

• B01D 46/24 - Particle separators, e.g. dust precipitators, using rigid hollow filter bodies

Goods & Services

Spark plugs; exhaust gas recirculation [EGR] valves for motors and engines; Carburetors; Motor mufflers; Exhaust pipes for land vehicles; Silencer; Carburetors [vehicle parts]; Oil coolers [vehicle engine parts]; Oil filters; Radiator caps for cooling radiators of engines; Ignition coils for automotive engines; Protective plates for mufflers for motors and engines; Air filters for automobile engines; Electronic ignitions for vehicles; Fuel injector parts for land and water vehicle engines; Oil filters for engines; Catalytic converters for motors and engines. Circuit boards; Semiconductors; Integrated circuits; Electronic circuits; Printed circuit boards; Semiconductor chips; Semiconductor elements; Sockets for integrated circuit; Very Large Scale Integrated Circuits; Integrated circuit boards; Silicon chips; Large Scale Integrated Circuits; Semiconductor devices; Microchips; Transformers [electricity]; Step-up transformers; Electronic regulators; Current rectifiers; Electric rectifiers; Voltage regulators; AC/DC converters; Frequency converters; Voltage converters; Amplifiers for servo motors; Electronic controllers for servo motors; Controllers for servo motors; Electric power supply units; Voltage regulators for vehicles; Solenoid valves [electromagnetic switches]; Power adapters; Charging stations for electric vehicles; Inverters; Power controllers; Electric power converters.

Goods & Services

Circuit boards; Semiconductors; Integrated circuits; Electronic circuits; Printed circuit boards; Semiconductor chips; Semiconductor elements; Electrical sockets for integrated circuits; Very Large Scale Integrated Circuits; Integrated circuit boards; Silicon chips; Large Scale Integrated Circuits; Semiconductor devices; Microchips; Electrical transformers; Step-up transformers; Electronic regulators; Current rectifiers; Electric rectifiers; Voltage regulators; AC/DC converters; Frequency converters for 3-phase current; Voltage converters for 3-phase current; Amplifiers for servo motors; Electronic controllers for servo motors; Electric power supply units; Voltage regulators for vehicles; Solenoid valves being electromagnetic switches; Power adapters; Charging stations for electric vehicles; Inverters; Power controllers; Electric power converters

Abstract

A motor control device with built-in shunt resistor and power transistor is disclosed, comprising a high-thermally conductive substrate; an electrically conductive circuit which is thermo-conductively installed on the high-thermally conductive substrate and includes a first thermal connection pad portion and a second thermal connection pad portion mutually spaced apart; a high power transistor conductively connected to the electrical conducive circuit; and a shunt resistor conductively connected to the high power transistor, respectively including a body whose thermal expansion coefficient is greater than that of the high-thermally conductive substrate, as well as a pair of welding portions extending from the body, in which the body has a prescribed width, and the width of the welding portion is greater than the prescribed width, and the body and the high-thermally conductive substrate are spaced apart such that, upon welding the welding portion to the first thermal connection pad portion and the second thermal connection pad portion, the thermal expansion stress occurring between the body and the high-thermally conductive substrate can be distributed and undertaken in the width direction.

IPC Classes  ?

• H02P 7/298 - Arrangements for regulating or controlling the speed or torque of electric DC motors for regulating or controlling an individual DC dynamo-electric motor by varying field or armature current by master control with auxiliary power using discharge tubes or semiconductor devices using semiconductor devices controlling armature and field supplies
• H02P 6/12 - Monitoring commutationProviding indication of commutation failure
• H03K 17/56 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices

Abstract

A UV tube for killing microorganisms in a fluid generally includes a hollow tubular body, a UV isolation layer, and at least one UV light source. The hollow tubular body has an inlet port, an outlet port, and a fluid channel portion between the inlet port and the outlet port. The fluid channel portion has an inner surface. The UV isolation layer is disposed at the inner surface of the hollow tubular body for sheltering the inner surface of the hollow tubular body. The fluid is allowed to flow through the UV isolation layer. The UV light source is provided at the hollow tubular body and/or the UV isolation layer. The UV isolation layer can absorb and/or reflect the ultraviolet light emitting from the UV light source, so that the possibility of the fluid channel portion being irradiated by the UV light can be reduced.

IPC Classes  ?

• A61L 9/20 - Ultraviolet radiation
• C02F 1/32 - Treatment of water, waste water, or sewage by irradiation with ultraviolet light
• F24F 3/16 - Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatmentApparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filteringAir-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatmentApparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by sterilisationAir-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatmentApparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by ozonisation

Abstract

A fuel tank cap includes a casing; a main chamber disposed in the casing; a vapor vent channel disposed in the casing and communicating with the main chamber; annular partition walls disposed in the main chamber and configured to divide the main chamber into troughs surrounding a central tunnel, each partition wall including a cut so that the troughs and the tunnel are capable of communicating with each other via the cut; activated carbon filled in the troughs; and a permeable plug disposed in the tunnel, which is made by wrapping rust-resistant flexible wires so that a plurality of intercommunicated air gaps are formed among the flexible wires. The vapor vent channel includes the cuts, the troughs and the air gaps. The activated carbon captures fuel vapors and absorbs VOCs in the fuel vapors when the fuel vapors pass through the vapor vent channel.

IPC Classes  ?

• B01D 53/04 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
• B60K 15/035 - Fuel tanks characterised by venting means
• B60K 15/04 - Tank inlets

Abstract

A fuel tank cap includes a casing; a main chamber disposed in the casing; a vapor vent channel disposed in the casing and communicating with the main chamber; annular partition walls disposed in the main chamber and configured to divide the main chamber into troughs, each partition wall including a cut so that the troughs are capable of communicating with each other via the cut; and activated carbon filled in the troughs. The vapor vent channel includes the cuts and the troughs. The activated carbon captures fuel vapors and absorbs VOCs in the fuel vapors when the fuel vapors pass through the vapor vent channel. The invention eliminates the low efficiency problem of capturing the harmful VOCs of the fuel vapors by the conventional activated carbon canister.

IPC Classes  ?

• B01D 53/04 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
• B60K 15/035 - Fuel tanks characterised by venting means
• B60K 15/04 - Tank inlets

Goods & Services

Agricultural machines, namely, cultivators, harvestors, disk harrows and seeders; Air filters for mechanical purposes; Air-intake tubes and filters for after-market installation of automotive engines; Automotive exhaust pipe; Catalytic converters for motors and engines; Emission reduction units for motors and engines, namely, catalytic converters; Emission reduction units for motors and engines, namely, EGR valves; Emission reduction units for motors and engines, namely, PCV valves; Engine mufflers; Engine or motor mufflers; Exhaust manifold for engines; Exhaust pipes for land vehicles; Exhaust silencers for engines; Fuel filters; Fuel injector parts for land and water vehicle engines; Ignition devices for motors of land vehicles; Lawn and garden tilling machines; Lawnmowers; Motor mufflers; Motorcycle engine parts, namely, air cleaners; Mulberry leaf chopping machines; Oil filters for motors and engines

Goods & Services

Agricultural machines, namely, cultivators, harvestors, disk harrows or seeders; [ Air filters for mechanical purposes; Air-intake tubes and filters for after-market installation of automotive engines; Automotive exhaust pipe; Catalytic converters for motors and engines; ] Emission reduction units for motors and engines, namely, [ catalytic converters; Emission reduction units for motors and engines, namely, ] EGR valves; [ Emission reduction units for motors and engines, namely, PCV valves; Engine mufflers; Engine or motor mufflers; Exhaust manifold for engines; Exhaust pipes for land vehicles; Exhaust silencers for engines; Fuel filters; ] Fuel injector parts for land and water vehicle engines; Ignition devices for motors of land vehicles; Lawn and garden tilling machines; [ Lawnmowers; Motor mufflers; Motorcycle engine parts, namely, air cleaners; Mulberry leaf chopping machines; Oil filters for motors and engines ]