Abrégé

Disclosed are a heat-electricity discrete power module with two-way heat-dissipation ceramic substrates and a manufacturing method of the same, including: two double-sided metal-clad ceramic substrates, a power transistor die, and an insulation sealant; each double-sided metal-clad ceramic substrate including a ceramic insulation layer, a three-dimensional conductive layer formed on the first ceramic insulation layer and facing the opposite three-dimensional conductive layer to constitute an electrical circuit, and a thermally-conductive metallic layer opposite and insulated from the three-dimensional conductive layer, respectively; electrodes of each power transistor die are electrically conductively connected to the three-dimensional conductive layer, and their upper and lower surfaces are thermally conductively connected to respective three-dimensional conductive layers; circuit components are additionally mounted on the three-dimensional conductive layers; at least one conductive post is formed between the circuits of respective three-dimensional conductive layers; the power transistor die and conductive post are completely encapsulated by the insulation sealant.

Classes IPC  ?

• H01L 23/495 - Cadres conducteurs
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe

Abrégé

A power module, a manufacturing method, and a mold are disclosed. The power module includes a circuit substrate, a terminal assembly, and a package body. A surface of the circuit substrate is provided with at least one semiconductor component, each terminal assembly includes a terminal rack and a terminal inserted onto the terminal rack, and each terminal rack is disposed on the surface of the circuit substrate and has an insert surface and provided for passing each terminal through the insert surface into the terminal rack for combination. The package body is installed on the circuit substrate to package the semiconductor component and has an external surface substantially aligned with the insert surface of each terminal rack, or the insert surface protruding from the external surface, to make each terminal protrude out from the package body.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
• H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
• H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
• H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe

Abrégé

A power apparatus (1, 2) includes a substrate (10, 10′), a first power component (20), a second power component (30), and a connection board (40, 40′). The substrate (10, 10′) includes a first area (11) and a second area (12) separated from each other. The first power component (20) is arranged on the first area (11). The second power component (30) is arranged on the second area (12). The connection board (40, 40′) is arranged between the first area (11) and the second area (12), and is electrically connected to the first power component (20) and the second area (12) respectively.

Classes IPC  ?

• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 25/16 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types couverts par plusieurs des sous-classes , , , , ou , p. ex. circuit hybrides

Abrégé

A power apparatus includes a substrate, a first power circuit, and a second power circuit. The substrate includes a first metallization region, a second metallization region, and a third metallization region which are separated from each other. The first power circuit is electrically connected to the first metallization region and the third metallization region, and is arranged across the second metallization region and fails to be in contact with the second metallization region. The second power circuit is electrically connected to the second metallization region and the third metallization region, and fails to be in contact with the first metallization region.

Classes IPC  ?

• H02M 1/44 - Circuits ou dispositions pour corriger les interférences électromagnétiques dans les convertisseurs ou les onduleurs
• H02M 7/00 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continuTransformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant alternatif

Abrégé

Disclosed is a thermal conduction-electrical conduction isolated circuit board with a ceramic substrate and a power transistor embedded, mainly comprising: a dielectric material layer, a heat-dissipating ceramic block, a securing portion, a stepped metal electrode layer, a power transistor, and a dielectric material packaging, wherein a via hole is formed in the dielectric material layer, the heat-dissipating ceramic block is correspondingly embedded in the via hole, the heat-dissipating ceramic block has a thermal conductivity higher than that of the dielectric material layer and a thickness less than that of the dielectric material layer, the stepped metal electrode layer conducts electricity and heat for the power transistor, the dielectric material packaging is configured to partially expose the source connecting pin, drain connecting pin, and gate connecting pin of the encapsulated stepped metal electrode layer.

Classes IPC  ?

• H05K 1/02 - Circuits imprimés Détails
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

Abrégé

A low parasitic inductance power module having staggered, interleaving busbars, including: at least one base extending a long a length direction, the base having at least one current input busbar and at least one current output busbar, the current input busbar and the current out busbar being formed with a plurality of interdigitated contact terminals, respectively; a first unit comprising a first circuit base portion disposed on the base along the width direction, on the first circuit base portion being disposed a plurality of first power devices; and a second unit, whereby when current flows through the units and the individual interdigitated contact terminals, individual inductances produced thereby are cancelled with each other, whereby overall parasitic inductance of the power module is reduced.

Classes IPC  ?

• H01L 23/64 - Dispositions relatives à l'impédance
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide

Abrégé

A low parasitic inductance power module featuring staggered, interleaving conductive members, including: at least one base extending in a length direction, at least one input bus-bar and at least one output bus-bar being disposed on the base; a first unit including a first circuit base portion disposed on the base along the width direction, a plurality of first power devices being disposed on the first circuit base portion, each of the first power devices having paralleled first current input ends and paralleled first current output ends; the first current input ends or the current output ends being conductively connected to the first circuit base portion; and a second unit. The units are serially connected to the bus-bars via staggered, interleaving input conductive members and output conductive members whereby individual inductances generated are mutually counteracted, thus reducing the overall parasitic inductance.

Classes IPC  ?

• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H02M 7/00 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continuTransformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant alternatif
• H05K 1/02 - Circuits imprimés Détails
• H05K 1/181 -

Abrégé

A power module includes two power input terminals, two main substrates, a plurality of first switches, a plurality of second switches, and a bridge main unit. The bridge main unit is across the two main substrates, and includes a first bridge subunit and a second bridge subunit. Each of the first bridge subunit and the second bridge subunit includes a first conducting region on a bottom surface, and a second conducting region and a third conducting region on a top surface. The first conducting region transmits a current signal of a current path of a switch circuit formed by the power input terminals, the first switches, and the second switches. The second conducting region is connected to the control terminals of the first switches and the second switches. The third conducting region is connected to the output terminals of the first switches and the second switches.

Classes IPC  ?

• H02M 7/58 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant alternatif sans possibilité de réversibilité par convertisseurs dynamiques utilisant des organes mécaniques d'établissement et de coupure de contact pour interrompre une tension unique
• H02M 7/5387 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant alternatif sans possibilité de réversibilité par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs, p. ex. onduleurs à impulsions à un seul commutateur dans une configuration en pont
• H05K 7/14 - Montage de la structure de support dans l'enveloppe, sur cadre ou sur bâti
• H02M 7/00 - Transformation d'une puissance d'entrée en courant alternatif en une puissance de sortie en courant continuTransformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant alternatif

Abrégé

A low parasitic inductance power module featuring staggered interleaving conductive members, including: at least one base extending in a length direction; a substrate on which at least one input bus bar and at least one output bus bar are provided; a first unit including a first circuit base portion disposed on the base in a width direction, a plurality of first power devices being disposed on the first circuit base portion, each first power device having a first current input end and a first current output end which are parallel connected, the first current input end or the first current output end being conducted to the first circuit base portion; and a second unit. The units are serially-connected to the bus bars via input conductive members and output conductive members arrayed in a staggered interleaving mode, whereby to create individual inductances counteracting with each other, reducing overall parasitic inductance.

Classes IPC  ?

• H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
• H01L 23/498 - Connexions électriques sur des substrats isolants
• H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe

Abrégé

A metal honeycomb substrate includes a tubular body, a flat plate, and a wavy plate. The tubular body has a receiving portion. The wavy plate is stacked with the flat plate to form a spiral structure received in the receiving portion. The wavy plate has a wavy-shaped cross section and includes a second region and a continuous region connected to the second region. The wavy-shaped cross section includes peak portions and valley portions. The wavy plate has a solder region overlapping at least one portion of at least one of the second region and the continuous region. Solders are on outer sides of the peak portions and outer sides of the valley portions which are in the solder region. A ratio of an area of the solder region to an area of the wavy plate is in a range between substantially 20% and substantially 66%.

Classes IPC  ?

• B01D 46/24 - Séparateurs de particules utilisant des corps filtrants creux et rigides, p. ex. appareils de précipitation de poussières

Produits et services

Spark plugs; exhaust gas recirculation [EGR] valves for motors and engines; Carburetors; Motor mufflers; Exhaust pipes for land vehicles; Silencer; Carburetors [vehicle parts]; Oil coolers [vehicle engine parts]; Oil filters; Radiator caps for cooling radiators of engines; Ignition coils for automotive engines; Protective plates for mufflers for motors and engines; Air filters for automobile engines; Electronic ignitions for vehicles; Fuel injector parts for land and water vehicle engines; Oil filters for engines; Catalytic converters for motors and engines. Circuit boards; Semiconductors; Integrated circuits; Electronic circuits; Printed circuit boards; Semiconductor chips; Semiconductor elements; Sockets for integrated circuit; Very Large Scale Integrated Circuits; Integrated circuit boards; Silicon chips; Large Scale Integrated Circuits; Semiconductor devices; Microchips; Transformers [electricity]; Step-up transformers; Electronic regulators; Current rectifiers; Electric rectifiers; Voltage regulators; AC/DC converters; Frequency converters; Voltage converters; Amplifiers for servo motors; Electronic controllers for servo motors; Controllers for servo motors; Electric power supply units; Voltage regulators for vehicles; Solenoid valves [electromagnetic switches]; Power adapters; Charging stations for electric vehicles; Inverters; Power controllers; Electric power converters.

Produits et services

Circuit boards; Semiconductors; Integrated circuits; Electronic circuits; Printed circuit boards; Semiconductor chips; Semiconductor elements; Electrical sockets for integrated circuits; Very Large Scale Integrated Circuits; Integrated circuit boards; Silicon chips; Large Scale Integrated Circuits; Semiconductor devices; Microchips; Electrical transformers; Step-up transformers; Electronic regulators; Current rectifiers; Electric rectifiers; Voltage regulators; AC/DC converters; Frequency converters for 3-phase current; Voltage converters for 3-phase current; Amplifiers for servo motors; Electronic controllers for servo motors; Electric power supply units; Voltage regulators for vehicles; Solenoid valves being electromagnetic switches; Power adapters; Charging stations for electric vehicles; Inverters; Power controllers; Electric power converters

Abrégé

A motor control device with built-in shunt resistor and power transistor is disclosed, comprising a high-thermally conductive substrate; an electrically conductive circuit which is thermo-conductively installed on the high-thermally conductive substrate and includes a first thermal connection pad portion and a second thermal connection pad portion mutually spaced apart; a high power transistor conductively connected to the electrical conducive circuit; and a shunt resistor conductively connected to the high power transistor, respectively including a body whose thermal expansion coefficient is greater than that of the high-thermally conductive substrate, as well as a pair of welding portions extending from the body, in which the body has a prescribed width, and the width of the welding portion is greater than the prescribed width, and the body and the high-thermally conductive substrate are spaced apart such that, upon welding the welding portion to the first thermal connection pad portion and the second thermal connection pad portion, the thermal expansion stress occurring between the body and the high-thermally conductive substrate can be distributed and undertaken in the width direction.

Classes IPC  ?

• H02P 7/298 - Dispositions pour réguler ou commander la vitesse ou le couple de moteurs électriques à courant continu pour réguler ou commander individuellement un moteur dynamo-électrique à courant continu en faisant varier le champ ou le courant d'induit par commande maîtresse avec puissance auxiliaire utilisant des tubes à décharge ou des dispositifs à semi-conducteurs utilisant des dispositifs à semi-conducteurs commandant l'alimentation de l'induit et du champ
• H02P 6/12 - Contrôle de la commutationIndication d'un défaut de commutation
• H03K 17/56 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs

Abrégé

A UV tube for killing microorganisms in a fluid generally includes a hollow tubular body, a UV isolation layer, and at least one UV light source. The hollow tubular body has an inlet port, an outlet port, and a fluid channel portion between the inlet port and the outlet port. The fluid channel portion has an inner surface. The UV isolation layer is disposed at the inner surface of the hollow tubular body for sheltering the inner surface of the hollow tubular body. The fluid is allowed to flow through the UV isolation layer. The UV light source is provided at the hollow tubular body and/or the UV isolation layer. The UV isolation layer can absorb and/or reflect the ultraviolet light emitting from the UV light source, so that the possibility of the fluid channel portion being irradiated by the UV light can be reduced.

Classes IPC  ?

• A61L 9/20 - Désinfection, stérilisation ou désodorisation de l'air utilisant des phénomènes physiques des radiations des ultraviolets
• C02F 1/32 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout par irradiation par la lumière ultraviolette
• F24F 3/16 - Systèmes de conditionnement d'air dans lesquels l'air conditionné primaire est fourni par une ou plusieurs stations centrales aux blocs de distribution situés dans les pièces ou enceintes, blocs dans lesquels il peut subir un traitement secondaireAppareillage spécialement conçu pour de tels systèmes caractérisés par le traitement de l'air autrement que par chauffage et refroidissement par purification, p. ex. par filtrageSystèmes de conditionnement d'air dans lesquels l'air conditionné primaire est fourni par une ou plusieurs stations centrales aux blocs de distribution situés dans les pièces ou enceintes, blocs dans lesquels il peut subir un traitement secondaireAppareillage spécialement conçu pour de tels systèmes caractérisés par le traitement de l'air autrement que par chauffage et refroidissement par stérilisationSystèmes de conditionnement d'air dans lesquels l'air conditionné primaire est fourni par une ou plusieurs stations centrales aux blocs de distribution situés dans les pièces ou enceintes, blocs dans lesquels il peut subir un traitement secondaireAppareillage spécialement conçu pour de tels systèmes caractérisés par le traitement de l'air autrement que par chauffage et refroidissement par ozonisation

Abrégé

A fuel tank cap includes a casing; a main chamber disposed in the casing; a vapor vent channel disposed in the casing and communicating with the main chamber; annular partition walls disposed in the main chamber and configured to divide the main chamber into troughs surrounding a central tunnel, each partition wall including a cut so that the troughs and the tunnel are capable of communicating with each other via the cut; activated carbon filled in the troughs; and a permeable plug disposed in the tunnel, which is made by wrapping rust-resistant flexible wires so that a plurality of intercommunicated air gaps are formed among the flexible wires. The vapor vent channel includes the cuts, the troughs and the air gaps. The activated carbon captures fuel vapors and absorbs VOCs in the fuel vapors when the fuel vapors pass through the vapor vent channel.

Classes IPC  ?

• B01D 53/04 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par adsorption, p. ex. chromatographie préparatoire en phase gazeuse avec adsorbants fixes
• B60K 15/035 - Réservoirs de carburant caractérisés par de moyens d'aération
• B60K 15/04 - Entrées de réservoir

Abrégé

A fuel tank cap includes a casing; a main chamber disposed in the casing; a vapor vent channel disposed in the casing and communicating with the main chamber; annular partition walls disposed in the main chamber and configured to divide the main chamber into troughs, each partition wall including a cut so that the troughs are capable of communicating with each other via the cut; and activated carbon filled in the troughs. The vapor vent channel includes the cuts and the troughs. The activated carbon captures fuel vapors and absorbs VOCs in the fuel vapors when the fuel vapors pass through the vapor vent channel. The invention eliminates the low efficiency problem of capturing the harmful VOCs of the fuel vapors by the conventional activated carbon canister.

Classes IPC  ?

• B01D 53/04 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par adsorption, p. ex. chromatographie préparatoire en phase gazeuse avec adsorbants fixes
• B60K 15/035 - Réservoirs de carburant caractérisés par de moyens d'aération
• B60K 15/04 - Entrées de réservoir

Produits et services

Agricultural machines, namely, cultivators, harvestors, disk harrows and seeders; Air filters for mechanical purposes; Air-intake tubes and filters for after-market installation of automotive engines; Automotive exhaust pipe; Catalytic converters for motors and engines; Emission reduction units for motors and engines, namely, catalytic converters; Emission reduction units for motors and engines, namely, EGR valves; Emission reduction units for motors and engines, namely, PCV valves; Engine mufflers; Engine or motor mufflers; Exhaust manifold for engines; Exhaust pipes for land vehicles; Exhaust silencers for engines; Fuel filters; Fuel injector parts for land and water vehicle engines; Ignition devices for motors of land vehicles; Lawn and garden tilling machines; Lawnmowers; Motor mufflers; Motorcycle engine parts, namely, air cleaners; Mulberry leaf chopping machines; Oil filters for motors and engines

Produits et services

Agricultural machines, namely, cultivators, harvestors, disk harrows or seeders; [ Air filters for mechanical purposes; Air-intake tubes and filters for after-market installation of automotive engines; Automotive exhaust pipe; Catalytic converters for motors and engines; ] Emission reduction units for motors and engines, namely, [ catalytic converters; Emission reduction units for motors and engines, namely, ] EGR valves; [ Emission reduction units for motors and engines, namely, PCV valves; Engine mufflers; Engine or motor mufflers; Exhaust manifold for engines; Exhaust pipes for land vehicles; Exhaust silencers for engines; Fuel filters; ] Fuel injector parts for land and water vehicle engines; Ignition devices for motors of land vehicles; Lawn and garden tilling machines; [ Lawnmowers; Motor mufflers; Motorcycle engine parts, namely, air cleaners; Mulberry leaf chopping machines; Oil filters for motors and engines ]