JSR Corporation

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[Owner] JSR Corporation 2,554
Techno Polymer Co., Ltd. 58
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New (last 4 weeks) 25
2026 August (MTD) 7
2026 July 23
2026 June 14
2026 May 21
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G03F 7/004 - Photosensitive materials 636
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists 607
G03F 7/20 - ExposureApparatus therefor 472
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or 295
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers 254
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01 - Chemical and biological materials for industrial, scientific and agricultural use 105
17 - Rubber and plastic; packing and insulating materials 28
05 - Pharmaceutical, veterinary and sanitary products 14
09 - Scientific and electric apparatus and instruments 13
42 - Scientific, technological and industrial services, research and design 12
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1.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number 19630590
Status Pending
Filing Date 2026-03-27
First Publication Date 2026-08-06
Owner JSR CORPORATION (Japan)
Inventor
  • Serizawa, Ryuichi
  • Kimata, Hironori
  • Ozaki, Yuki

Abstract

A method for manufacturing a semiconductor substrate includes: applying a composition for film formation to a substrate to form a coating film, and subjecting the coating film to at least one process selected from the group consisting of radiation exposure and plasma exposure. The composition for film formation includes: a metal compound comprising a metal atom and an organic acid, and a solvent.

IPC Classes  ?

  • H10P 76/40 -
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - ExposureApparatus therefor
  • H10P 14/60 -

2.

METHOD FOR PRODUCING POLYPROPYLENE-BASED RESIN FOAM PARTICLES, METHOD FOR DISCRIMINATING POLYPROPYLENE-BASED RESIN, AND METHOD FOR PRODUCING POLYPROPYLENE-BASED RESIN

      
Application Number JP2026001578
Publication Number 2026/163890
Status In Force
Filing Date 2026-01-20
Publication Date 2026-08-06
Owner
  • JSP INTERNATIONAL SARL (France)
  • JSP CORPORATION (Japan)
Inventor
  • Pereira, Antonio
  • Kopf, Valentin
  • Hira Akinobu

Abstract

This method for producing polypropylene-based resin foam particles includes a foaming step for foaming a polypropylene-based resin composition that contains a base resin composed of a polypropylene-based resin and a foaming agent. The base resin is produced using a recycled polypropylene-based resin (R). The blending amount of the polypropylene-based resin (R) in the base resin is 15 mass% or more. The polypropylene-based resin (R) has a melting point of lower than 160°C. The polypropylene-based resin (R) has an oxidation induction temperature (T3) of 220°C or higher as measured in accordance with ISO 11357-6: 2018.

IPC Classes  ?

  • C08J 9/22 - After-treatment of expandable particlesForming foamed products

3.

SEMICONDUCTOR CLEANING COMPOSITION AND CLEANING METHOD

      
Application Number JP2026002640
Publication Number 2026/164087
Status In Force
Filing Date 2026-01-27
Publication Date 2026-08-06
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada, Yuya
  • Yamada, Shota

Abstract

Provided are: a semiconductor cleaning composition that can reduce damage, e.g., corrosion, on the surface of an object to be treated and that can efficiently remove contamination from the surface of the object to be treated; and a cleaning method using this semiconductor cleaning composition. A semiconductor cleaning composition according to the present invention has a pH of 3.0-9.0 and contains: a compound (A) having at least one group selected from the group consisting of an amino group and salts thereof, at least one group selected from the group consisting of a sulfo group and salts thereof, and a group having a C4-12 cyclic structure; a phosphonic acid (B); and a liquid medium.

IPC Classes  ?

4.

UNDERLAYER FILM-FORMING COMPOSITION FOR METAL-CONTAINING RESIST FILM AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE

      
Application Number JP2026000859
Publication Number 2026/163813
Status In Force
Filing Date 2026-01-14
Publication Date 2026-08-06
Owner JSR CORPORATION (Japan)
Inventor
  • Sakai, Kazunori
  • Tsuji, Takashi
  • Dobashi, Masato
  • Ohtagaki, Yasuhiro
  • Takada, Kazuya

Abstract

Provided are: an underlayer film-forming composition for a metal-containing resist film, with which it is possible to form a resist underlayer film that has excellent resist pattern rectangularity; and a method for producing a semiconductor substrate. This underlayer film-forming composition for a metal-containing resist film contains a polymer and a solvent, wherein the polymer has a partial structure represented by formula (a-1) or formula (a-2), and at least one monovalent group (X) selected from the group consisting of groups represented by formulas (2-1) to (2-8). (In formulas (a-1) and (a-2), R1and R2122 are integers of 0-4.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C08G 10/02 - Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or halogenated aromatic hydrocarbons only of aldehydes
  • G03F 7/20 - ExposureApparatus therefor

5.

METHOD FOR PRODUCING POLYMER, POLYMER PRODUCTION DEVICE, AND SYSTEM FOR OPTIMIZING RADICAL POLYMERIZATION REACTION

      
Application Number 19149125
Status Pending
Filing Date 2024-01-19
First Publication Date 2026-08-06
Owner
  • JSR CORPORATION (Japan)
  • NATIONAL UNIVERSITY CORPORATION NARA INSTITUTE OF SCIENCE AND TECHNOLOGY (Japan)
Inventor
  • Asano, Shigehito
  • Sugawara, Tetsunori
  • Ohnishi, Yu-Ya
  • Wakiuchi, Araki
  • Fujii, Mikiya
  • Ajiro, Hiroharu

Abstract

Provide are a method for producing a polymer having a high purity and a highly controlled structural unit composition and molecular weight, and a polymer production device. The method for producing a polymer is a method in which a polymer is obtained by radical polymerization with an azo-based polymerization initiator, two or more monomers, and a solvent. The method includes a first step of performing the radical polymerization in a tubular reactor, and a second step of performing the radical polymerization in a stirred tank reactor after the first step, in which a maximum solid content concentration C1max on a mass basis in the first step is 30 mass % or more, a maximum solid content concentration C2max on a mass basis in the second step is less than 50 mass %, and the maximum solid content concentration C1max and the maximum solid content concentration C2max satisfy C1max≥C2max.

IPC Classes  ?

6.

SPIN CURRENT MAGNETIZATION ROTATING ELEMENT, MAGNETORESISTIVE EFFECT ELEMENT, AND MAGNETIC MEMORY

      
Application Number 19148544
Status Pending
Filing Date 2024-01-16
First Publication Date 2026-08-06
Owner
  • THE UNIVERSITY OF TOKYO (Japan)
  • JSR CORPORATION (Japan)
Inventor
  • Ishikawa, Takahiro
  • Akashi, Ryosuke
  • Kubo, Koutarou
  • Toga, Yuuta
  • Inukai, Kouji
  • Rittaporn, Itti
  • Hayashi, Masamitsu
  • Tsuneyuki, Shinji

Abstract

A spin current magnetization rotating element includes: a first ferromagnetic layer having a magnetization direction which is changeable; and a spin-orbit torque wiring layer adjacent to the first ferromagnetic layer. At least one element in the spin-orbit torque writing layer has a crystal structure in which, when dimensions of a lattice constant of the crystal structure are expressed by a, b, and c: atoms occupy internal coordinates: (0, 0, 0), (0.5, 0.5, 0), (0.25, 0.75, 0.25), (0.75, 0.25, 0.25), (0, 0.5, 0.5), (0.5, 0, 0.5), (0.75, 0.75, 0.75), and (0.25, 0.25, 0.75); ab planes are laminated so as to have a four-time spiral structure along c axis; and an angle between a axis and b axis (γ) is in a range of 60°≤γ≤120°, and a ratio of b to a (b/a) is in a range of 0.2≤b/a≤1.0.

IPC Classes  ?

  • H10N 50/20 - Spin-polarised current-controlled devices
  • H10B 61/00 - Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
  • H10N 50/10 - Magnetoresistive devices
  • H10N 50/85 - Materials of the active region

7.

POLYPROPYLENE RESIN FOAM PARTICLES

      
Application Number JP2026001577
Publication Number 2026/163889
Status In Force
Filing Date 2026-01-20
Publication Date 2026-08-06
Owner
  • JSP INTERNATIONAL SARL (France)
  • JSP CORPORATION (Japan)
Inventor
  • Pereira, Antonio
  • Kopf, Valentin
  • Hira Akinobu

Abstract

The polypropylene resin foam particles contain 50 mass% or more of a recycled polypropylene resin (R). The oxidation induction time (t) of the polypropylene resin foam particles at a temperature of 200° C, as measured in accordance with ISO 11357-6: 2018, is 5-360 minutes. The content of carbon black in the polypropylene resin (R) may be less than 0.5 mass% (including 0). The content of carbon black in the foam particles may be 0.5-5 mass%.

IPC Classes  ?

  • C08J 9/22 - After-treatment of expandable particlesForming foamed products

8.

RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN, AND ONIUM SALT COMPOUND

      
Application Number 19574792
Status Pending
Filing Date 2026-03-23
First Publication Date 2026-07-30
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Miyao, Kensuke
  • Okazaki, Satoshi
  • Inami, Hajime
  • Abe, Yudai

Abstract

A radiation-sensitive composition includes: a first onium salt compound represented by formula (1); at least one second onium salt compound selected from the group consisting of a carboxylic acid salt compound represented by formula (2) and a carboxylic acid intramolecular salt compound represented by formula (3); a polymer including a structural unit which includes an acid-dissociable group; and a solvent. In the formula (1), A is a (1+n)-valent organic group having 1 to 40 carbon atoms; and Rf1 and Rf2 are each independently a hydrogen atom, a monovalent organic group, a fluorine atom, or a monovalent fluorinated hydrocarbon group. In the formula (2), R1 is a monovalent organic group having 2 to 40 carbon atoms. In the formula (3), R2 is a single bond or a divalent organic group having 1 to 40 carbon atoms. A radiation-sensitive composition includes: a first onium salt compound represented by formula (1); at least one second onium salt compound selected from the group consisting of a carboxylic acid salt compound represented by formula (2) and a carboxylic acid intramolecular salt compound represented by formula (3); a polymer including a structural unit which includes an acid-dissociable group; and a solvent. In the formula (1), A is a (1+n)-valent organic group having 1 to 40 carbon atoms; and Rf1 and Rf2 are each independently a hydrogen atom, a monovalent organic group, a fluorine atom, or a monovalent fluorinated hydrocarbon group. In the formula (2), R1 is a monovalent organic group having 2 to 40 carbon atoms. In the formula (3), R2 is a single bond or a divalent organic group having 1 to 40 carbon atoms.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/23 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an unsaturated carbon skeleton containing rings other than six-membered aromatic rings
  • C07C 381/12 - Sulfonium compounds
  • C07D 321/10 - Seven-membered rings condensed with carbocyclic rings or ring systems
  • C07D 327/04 - Five-membered rings
  • C07D 333/46 - Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings substituted on the ring sulfur atom
  • C07D 493/08 - Bridged systems
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - ExposureApparatus therefor

9.

RESIST UNDERLAYER FILM FORMATION COMPOSITION AND PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE

      
Application Number JP2026000664
Publication Number 2026/160201
Status In Force
Filing Date 2026-01-13
Publication Date 2026-07-30
Owner JSR CORPORATION (Japan)
Inventor
  • Hirasawa, Kengo
  • Naganawa, Atsuko
  • Oka, Yuki

Abstract

Provided are a resist underlayer film formation composition that makes it possible to form a film that has excellent flatness and embedding properties and a production method for a semiconductor substrate. A resist underlayer film formation composition according to the present invention contains a carbonyl group–containing compound and a solvent, the carbonyl group–containing compound having at least one partial structure selected from the group that consists of partial structures represented by formula (A1) and partial structures represented by formula (A2). (In the formulas, Ar1and Ar2are a C3–20 aromatic ring, R1is a hydroxyl group, a nitro group, a halogen atom, or a C1–20 monovalent organic group, n is 1 or 2, p is an integer from 0 to 4, inclusive, and * is the site of a bond to another partial structure of the carbonyl group–containing compound, and in formula (A1), one of Y1and Y2 is a carbonyl group, and the other is a single bond, an oxygen atom, a sulfur atom, or a methylene group.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

10.

POLYPROPYLENE RESIN EXPANDED BEADS AND POLYPROPYLENE RESIN EXPANDED BEADS MOLDED BODY

      
Application Number 19143476
Status Pending
Filing Date 2023-12-25
First Publication Date 2026-07-30
Owner JSP CORPORATION (Japan)
Inventor Masumoto, Hisashi

Abstract

A polypropylene resin expanded beads containing a biomass-derived polypropylene resin and capable of providing an excellent polypropylene resin expanded beads molded body, and a polypropylene resin expanded beads molded body produced using the polypropylene resin expanded beads. In the polypropylene resin expanded beads, a base material resin of the expanded beads contains biomass-derived polypropylene resin A containing a biomass-derived monomer component in a molecular chain and fossil fuel-derived polypropylene resin B, and the base material resin contains 3% by weight or more and 60% by weight or less of the biomass-derived polypropylene resin A and 40% by weight or more and 97% by weight or less of the fossil fuel-derived polypropylene resin B (a total of both is 100% by weight); and the expanded beads molded body is obtained by in-mold molding of the polypropylene resin expanded beads.

IPC Classes  ?

  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/232 - Forming foamed products by sintering expandable particles

11.

RADIATION-SENSITIVE COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Application Number 19576194
Status Pending
Filing Date 2026-03-24
First Publication Date 2026-07-30
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

A radiation-sensitive composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; and a compound having an anion and a radiation-sensitive onium cation. The polymer has a structural unit including a group that generates a sulfonic acid by an action of radiation. The polymer includes an iodo group. At least one of the anion and the radiation-sensitive onium cation includes an acid-labile group.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 220/30 - Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
  • G03F 7/004 - Photosensitive materials
  • G03F 7/32 - Liquid compositions therefor, e.g. developers

12.

METHOD FOR PRODUCING POLYOLEFIN-BASED RESIN FOAMED PARTICLES, AND POLYOLEFIN-BASED RESIN FOAMED PARTICLES

      
Application Number JP2025043917
Publication Number 2026/160064
Status In Force
Filing Date 2025-12-16
Publication Date 2026-07-30
Owner JSP CORPORATION (Japan)
Inventor
  • Chiba Takuya
  • Suenaga Katsuyuki

Abstract

Provided are: a method for producing polyolefin-based resin foamed particles, wherein by using talc, a high expansion ratio can be achieved, and excessive bubble formation can be prevented; and polyolefin-based resin foamed particles which contain talc and exhibit a high expansion ratio, and in which excessive bubble formation is prevented. According to the production method, in a sealed container, polyolefin-based resin particles containing carbon dioxide, dispersed in an aqueous medium, are released from the sealed container under a pressure lower than the pressure inside the sealed container to cause foaming. The polyolefin-based resin particles contain talc and at least one compound A selected from the group consisting of magnesium nitrate, tripotassium phosphate, trisodium phosphate, potassium carbonate, and calcium nitrate. The amount of the talc and the compound A to be added is adjusted to a predetermined range. The polyolefin-based resin foamed particles have an average cell diameter of 20-200 μm, and contain: a polyolefin-based resin; at least one compound A selected from magnesium nitrate, tripotassium phosphate, trisodium phosphate, potassium carbonate, and calcium nitrate; and talc. The content of the talc and the compound A is adjusted to a predetermined range.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08K 3/18 - Oxygen-containing compounds, e.g. metal carbonyls
  • C08L 23/02 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers not modified by chemical after-treatment

13.

ORIENTATION AGENT FOR NMR MEASUREMENT

      
Application Number JP2026001487
Publication Number 2026/160301
Status In Force
Filing Date 2026-01-19
Publication Date 2026-07-30
Owner
  • JSR CORPORATION (Japan)
  • RIKEN (Japan)
  • NATIONAL INSTITUTE FOR MATERIALS SCIENCE (Japan)
Inventor
  • Shimizu, Shun
  • Hamaguchi, Hitoshi
  • Inoue, Akihisa
  • Mukawa, Jun
  • Ishida, Yasuhiro
  • Uchida, Noriyuki
  • Sasaki, Takayoshi
  • Ebina, Yasuo
  • Sakai, Nobuyuki

Abstract

The purpose of the present invention is to provide an orientation agent for NMR measurement that has excellent resistance to salts and the like. The present invention relates to an orientation agent for NMR measurement, the orientation agent being provided with a nanosheet and a coating agent that coats at least a portion of the nanosheet, wherein the coating agent contains a reaction product of polyoxyethylene monomethyl ether or a derivative thereof and a polyamine having a total of 3 to 30 amino groups and/or imino groups.

IPC Classes  ?

  • G01N 24/00 - Investigating or analysing materials by the use of nuclear magnetic resonance, electron paramagnetic resonance or other spin effects
  • C01G 23/04 - OxidesHydroxides
  • C01G 33/00 - Compounds of niobium

14.

RADIATION-SENSITIVE COMPOSITION AND PATTERN FORMING METHOD

      
Application Number 19135848
Status Pending
Filing Date 2023-10-17
First Publication Date 2026-07-23
Owner JSR CORPORATION (Japan)
Inventor Maruyama, Ken

Abstract

Provided are a radiation-sensitive resin composition capable of forming a resist film capable of exhibiting sensitivity and CDU performance at sufficient levels when a next-generation technology is applied, and a pattern formation method. A radiation-sensitive resin composition containing a radiation-sensitive acid generating resin containing a structural unit (I) having an acid-dissociable group and a structural unit (II) having an organic acid anion moiety and an onium cation moiety and a solvent, wherein the acid-dissociable group and the organic acid anion moiety each contain an iodine-substituted aromatic ring structure.

IPC Classes  ?

  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/30 - Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - ExposureApparatus therefor
  • H10P 76/20 -

15.

RADIATION-SENSITIVE COMPOSITION AND METHOD FOR FORMING RESIST PATTERN

      
Application Number 19137710
Status Pending
Filing Date 2023-10-19
First Publication Date 2026-07-23
Owner JSR CORPORATION (Japan)
Inventor
  • Omiya, Takuya
  • Ito, Ryo
  • Nakagawa, Atsushi
  • Matsumura, Yuushi
  • Nishikori, Katsuaki

Abstract

A radiation-sensitive composition contains: (A) a polymer having a structural unit represented by formula (1) and; and (B) an onium salt compound which is formed of an organic anion and a cation, in which the organic anion or the cation or both have an iodo group, and which generates an acid through exposure to radiation. In the formula, B1 represents a single bond or a C≥1 divalent organic group bound to E+ at a carbon atom thereof. E+ represents a divalent group having an ammonium cation structure or a phosphonium cation structure. B2 represents a C≥1 divalent organic group bound to E+ and D− at the same carbon atom of different carbon atoms thereof. D− represents a monovalent group having an anion structure. A radiation-sensitive composition contains: (A) a polymer having a structural unit represented by formula (1) and; and (B) an onium salt compound which is formed of an organic anion and a cation, in which the organic anion or the cation or both have an iodo group, and which generates an acid through exposure to radiation. In the formula, B1 represents a single bond or a C≥1 divalent organic group bound to E+ at a carbon atom thereof. E+ represents a divalent group having an ammonium cation structure or a phosphonium cation structure. B2 represents a C≥1 divalent organic group bound to E+ and D− at the same carbon atom of different carbon atoms thereof. D− represents a monovalent group having an anion structure.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C07C 381/12 - Sulfonium compounds
  • C08F 18/12 - Esters of monocarboxylic acids with unsaturated alcohols containing three or more carbon atoms
  • C08F 22/14 - Esters having no free carboxylic acid groups
  • C08F 22/16 - Esters having free carboxylic acid groups
  • C08F 22/22 - Esters containing nitrogen
  • C08F 22/24 - Esters containing sulfur
  • G03F 7/004 - Photosensitive materials
  • H10P 76/20 -

16.

RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN, AND ONIUM SALT

      
Application Number 19569093
Status Pending
Filing Date 2026-03-17
First Publication Date 2026-07-23
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Miyao, Kensuke
  • Okazaki, Satoshi
  • Inami, Hajime
  • Oshiro, Taku

Abstract

A radiation-sensitive composition includes: an onium salt compound represented by formula (1); a polymer including a structural unit (I) represented by formula (2); and a solvent. A is a (1+n)-valent organic group having 3 to 40 carbon atoms including a cyclic structure, when the group represented by A includes a linear alkanediyl group, a carbon number of the linear alkanediyl group is 1 or 2, the group represented by A does not contain a cyclohexylcarbonyloxy structure, Rf1 and Rf2 are each independently a hydrogen atom, a monovalent organic group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group, at least one of Rf1 and Rf2 is a fluorine atom or a monovalent fluorinated hydrocarbon group. W is a monocyclic lactone structure, a monocyclic carbonate structure, a monocyclic sultone structure, a monocyclic sulfone structure, or a monocyclic ether structure. A radiation-sensitive composition includes: an onium salt compound represented by formula (1); a polymer including a structural unit (I) represented by formula (2); and a solvent. A is a (1+n)-valent organic group having 3 to 40 carbon atoms including a cyclic structure, when the group represented by A includes a linear alkanediyl group, a carbon number of the linear alkanediyl group is 1 or 2, the group represented by A does not contain a cyclohexylcarbonyloxy structure, Rf1 and Rf2 are each independently a hydrogen atom, a monovalent organic group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group, at least one of Rf1 and Rf2 is a fluorine atom or a monovalent fluorinated hydrocarbon group. W is a monocyclic lactone structure, a monocyclic carbonate structure, a monocyclic sultone structure, a monocyclic sulfone structure, or a monocyclic ether structure.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • C08F 20/10 - Esters
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - ExposureApparatus therefor

17.

COMPOSITION FOR SEMICONDUCTOR PROCESSING AND PROCESSING METHOD

      
Application Number JP2026000158
Publication Number 2026/155029
Status In Force
Filing Date 2026-01-06
Publication Date 2026-07-23
Owner JSR CORPORATION (Japan)
Inventor Kamei, Yasutaka

Abstract

The present invention provides: a composition for semiconductor processing which has excellent storage stability and which can effectively reduce the occurrence of corrosion and defects in a wiring material on the surface of an object to be processed; and a processing method using the same. A composition for semiconductor processing according to the present invention contains a heterocyclic compound (A), a cationic water-soluble polymer (B), and a liquid medium (C), wherein, provided that the (A) component content is defined as MA [parts by mass] and the component (B) component content is defined as MB [parts by mass], MA/MB = 0.1–1000 and the pH is 2–9.

IPC Classes  ?

18.

RESIST UNDERLAYER FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number JP2026000879
Publication Number 2026/155155
Status In Force
Filing Date 2026-01-14
Publication Date 2026-07-23
Owner JSR CORPORATION (Japan)
Inventor
  • Hirasawa, Kengo
  • Naganawa, Atsuko
  • Oka, Yuki

Abstract

22-. n represents an integer of 4-8. The plurality of Ar's are identical or different from each other and the plurality of X's are identical or different from each other.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/004 - Photosensitive materials
  • G03F 7/26 - Processing photosensitive materialsApparatus therefor

19.

RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMING PATTERN

      
Application Number 19569143
Status Pending
Filing Date 2026-03-17
First Publication Date 2026-07-23
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Miyao, Kensuke
  • Okazaki, Satoshi
  • Inami, Hajime
  • Egawa, Fuyuki

Abstract

A radiation-sensitive composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a polymer including an acid-dissociable group. A is a (1+n)-valent organic group having 1 to 40 carbon atoms; Rf1 and Rf2 are each independently a hydrogen atom, a monovalent organic group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group; provided that at least one of Rf1 and Rf2 is a fluorine atom or a monovalent fluorinated hydrocarbon group; and R1 and R2 are each independently a hydrogen atom, a fluorine atom or a monovalent organic group having 1 to 20 carbon atoms. R4 is a monovalent organic group having 1 to 40 carbon atoms in which neither a fluorine atom nor a fluorinated hydrocarbon group is bonded to an atom adjacent to a sulfur atom in SO3−. A radiation-sensitive composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a polymer including an acid-dissociable group. A is a (1+n)-valent organic group having 1 to 40 carbon atoms; Rf1 and Rf2 are each independently a hydrogen atom, a monovalent organic group having 1 to 20 carbon atoms, a fluorine atom, or a monovalent fluorinated hydrocarbon group; provided that at least one of Rf1 and Rf2 is a fluorine atom or a monovalent fluorinated hydrocarbon group; and R1 and R2 are each independently a hydrogen atom, a fluorine atom or a monovalent organic group having 1 to 20 carbon atoms. R4 is a monovalent organic group having 1 to 40 carbon atoms in which neither a fluorine atom nor a fluorinated hydrocarbon group is bonded to an atom adjacent to a sulfur atom in SO3−.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - ExposureApparatus therefor

20.

SEMICONDUCTOR TREATMENT COMPOSITION AND TREATMENT METHOD

      
Application Number JP2026000157
Publication Number 2026/155028
Status In Force
Filing Date 2026-01-06
Publication Date 2026-07-23
Owner JSR CORPORATION (Japan)
Inventor Kamei, Yasutaka

Abstract

Provided are: a semiconductor treatment composition having excellent storage stability and capable of effectively reducing the occurrence of corrosion and defects in a wiring material on the surface of an object to be treated; and a treatment method using said composition. A semiconductor treatment composition according to the present invention contains: (A) a heterocyclic compound; (B) at least one compound selected from the group consisting of a quaternary ammonium salt, a quaternary phosphonium salt, and a tertiary sulfonium salt; and (C) a liquid medium. When the content of the component (A) is indicated by MA (parts by mass) and the content of the component (B) is indicated by MB (parts by mass), MA/MB is 0.1-1000. The semiconductor treatment composition has a pH of 2-9.

IPC Classes  ?

21.

PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM HAVING PATTERN AND METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR CIRCUIT BOARD

      
Application Number 19136348
Status Pending
Filing Date 2023-12-05
First Publication Date 2026-07-16
Owner JSR CORPORATION (Japan)
Inventor
  • Tatara, Ryoji
  • Nakafuji, Shin-Ya
  • Sakuma, Tetsuya
  • Okuda, Ryuichi
  • Doi, Takashi
  • Ooto, Junichi
  • Kato, Takahiro

Abstract

A photosensitive resin composition contains an alkali-soluble polymer (A), a photosensitizer (B), a crosslinking compound (C) having a crosslinkable group that reacts with a component (D) below by heat, a compound (D) represented by formula (1), and a solvent (E). X11 represents, for example, a nitrogen atom, R11 represents a hydrogen atom or a group represented by formula (2). L21 represents, for example, a single bond, R21 represents, for example, a hydrogen atom, R22 represents a monovalent organic group, and n21 to n23 represent an integer of 0 or more. At least one of three R11's is represented by formula (2), and in at least one group represented by formula (2), n21 is an integer of 1 or more, and at least one R21 is a hydrogen atom. A photosensitive resin composition contains an alkali-soluble polymer (A), a photosensitizer (B), a crosslinking compound (C) having a crosslinkable group that reacts with a component (D) below by heat, a compound (D) represented by formula (1), and a solvent (E). X11 represents, for example, a nitrogen atom, R11 represents a hydrogen atom or a group represented by formula (2). L21 represents, for example, a single bond, R21 represents, for example, a hydrogen atom, R22 represents a monovalent organic group, and n21 to n23 represent an integer of 0 or more. At least one of three R11's is represented by formula (2), and in at least one group represented by formula (2), n21 is an integer of 1 or more, and at least one R21 is a hydrogen atom.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07D 239/50 - Three nitrogen atoms
  • C07D 251/70 - Other substituted melamines
  • C07D 307/90 - Benzo [c] furansHydrogenated benzo [c] furans with an oxygen atom in position 1 and a nitrogen atom in position 3, or vice versa
  • C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/32 - Liquid compositions therefor, e.g. developers
  • H10W 70/695 -

22.

METHOD FOR PRODUCING POLYETHYLENE-BASED RESIN FOAM SHEET AND POLYETHYLENE-BASED RESIN FOAM SHEET

      
Application Number 19136981
Status Pending
Filing Date 2023-12-13
First Publication Date 2026-07-16
Owner JSP CORPORATION (Japan)
Inventor
  • Kayanoki, Yusuke
  • Katsuyama, Naoya
  • Kakuta, Hirotoshi

Abstract

A method for producing a polyethylene-based resin foam sheet and a polyethylene-based resin foam sheet are provided without depending on an inorganic substance and a chemical blowing agent, and the method enables production of a good polyethylene-based resin foam sheet. A method for producing a polyethylene-based resin foam sheet and a polyethylene-based resin foam sheet are provided without depending on an inorganic substance and a chemical blowing agent, and the method enables production of a good polyethylene-based resin foam sheet. In a first way of the method including extrusion-foaming a foamable resin melt containing a polyethylene-based resin and a physical blowing agent to produce a polyethylene-based resin foam sheet, one or more organic physical blowing agents selected from hydrocarbons having 3 to 5 carbon atoms and dialkyl ethers having an alkyl group having 1 to 3 carbon atoms and nitrogen are used as a physical blowing agent, and adjustment is performed so that the total (A+B) of the amount A of the organic physical blowing agents added and the amount B of the nitrogen added is 0.5 mol or more and 5 mol or less per kg of a resin component, the amount B of the nitrogen added is 0.1 mol or more and 0.4 mol or less per kg of the resin component, and the ratio (A/B) of the amount A of the organic physical blowing agents added to the amount B of the nitrogen added is 2 or more and 18 or less. The polyethylene-based resin foam sheet of the present invention has a density of 20 kg/m3 or more and 100 kg/m3 or less and an average of the number of cells of 0.5 cells/mm or more and 5 cells/mm or less in the thickness direction, the foam sheet has an ash content of less than 0.1 mass % (including 0), and the ash content includes sodium at a proportion of 10 mass % or less (including 0).

IPC Classes  ?

  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
  • C08J 9/14 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
  • C08L 23/06 - Polyethene

23.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMING METHOD, AND COMPOUND

      
Application Number JP2025039300
Publication Number 2026/150658
Status In Force
Filing Date 2025-11-10
Publication Date 2026-07-16
Owner JSR CORPORATION (Japan)
Inventor
  • Uekusa, Kouya
  • Nemoto, Ryuichi
  • Tanaka, Haruna
  • Mita, Michihiro

Abstract

Provided are: a radiation-sensitive composition which has excellent sensitivity, LWR, CDU, DOF, MEEF, pattern rectangularity, and development defect suppressing properties during the formation of a pattern; a pattern forming method; and a compound. The radiation-sensitive composition contains a compound represented by formula (1), a polymer which comprises a structural unit (I) having an acid dissociable group, and a solvent. (In the formula: Rd222 and R1and R2each independently represent a hydrogen atom or a monovalent organic group having 1-20 carbon atoms, or R1and R2are combined together and form, together with a carbon atom bonded thereto, a ring structure having 3-20 carbon atoms, wherein in cases where Rdis -CN, the total number of carbon atoms in R1and R2is 4 or more, and in cases where Rdis -F, R1and R2are each independently a monovalent organic group having 1-20 carbon atoms and the total number of carbon atoms in R1and R2is 6 or more; and Z+ is a monovalent organic cation.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 205/51 - Compounds containing nitro groups bound to a carbon skeleton the carbon skeleton being further substituted by carboxyl groups having nitro groups and carboxyl groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being saturated
  • C07C 255/19 - Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms containing cyano groups and carboxyl groups, other than cyano groups, bound to the same saturated acyclic carbon skeleton
  • C07C 255/22 - Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms containing cyano groups and carboxyl groups, other than cyano groups, bound to the same saturated acyclic carbon skeleton containing cyano groups and at least two carboxyl groups bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
  • C07D 307/33 - Oxygen atoms in position 2, the oxygen atom being in its keto or unsubstituted enol form
  • C07D 317/30 - Radicals substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
  • C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
  • C07D 319/06 - 1,3-DioxanesHydrogenated 1,3-dioxanes not condensed with other rings
  • C07D 321/10 - Seven-membered rings condensed with carbocyclic rings or ring systems
  • C07D 327/04 - Five-membered rings
  • C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
  • C07D 333/46 - Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings substituted on the ring sulfur atom
  • C07D 333/76 - Dibenzothiophenes
  • C07D 335/02 - Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings
  • C07D 493/08 - Bridged systems
  • C08F 12/22 - Oxygen
  • C08F 20/10 - Esters
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

24.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, AND COMPOUND

      
Application Number JP2025039310
Publication Number 2026/150659
Status In Force
Filing Date 2025-11-10
Publication Date 2026-07-16
Owner JSR CORPORATION (Japan)
Inventor
  • Nagano, Masahiro
  • Nemoto, Ryuichi
  • Hikami, Yuichi
  • Furukawa, Taiichi
  • Uekusa, Kouya

Abstract

Provided are: a radiation-sensitive composition that exhibits excellent sensitivity, LWR, CDU, EL, pattern rectangularity, pattern circularity, and development defect suppressing capability when forming a pattern; a pattern formation method; and an onium salt compound. This radiation-sensitive composition comprises: a compound represented by formula (1); a polymer including a structural unit (I) having an acid-dissociable group; and a solvent. (In the formula, R1represents a monovalent organic group having 2-40 carbon atoms. RLarepresents a substituted or unsubstituted monovalent group having a 3-6 membered monocyclic lactone structure, or a substituted or unsubstituted monovalent group having 2-12 carbon atoms and having a monocyclic or polycyclic lactam structure. L1represents a divalent linkage group. R2and R3each represent a monovalent organic group having 1-20 carbon atoms, or are combined to form a ring structure having 4-12 carbon atoms. R4 represents a hydroxy group, a nitro group, a cyano group, a carboxy group, an amino group, a halogen atom, or a monovalent organic group having 1-20 carbon atoms.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 53/21 - Acids containing three or more carbon atoms containing fluorine
  • C07C 61/09 - Completely hydrogenated benzenedicarboxylic acids
  • C07C 63/70 - Monocarboxylic acids
  • C07C 65/05 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing hydroxy or O-metal groups monocyclic and having all hydroxy or O-metal groups bound to the ring o-Hydroxy carboxylic acids
  • C07C 69/63 - Halogen-containing esters of saturated acids
  • C07D 205/085 - Heterocyclic compounds containing four-membered rings with one nitrogen atom as the only ring hetero atom not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with one oxygen atom directly attached in position 2, e.g. beta-lactams with a nitrogen atom directly attached in position 3
  • C07D 207/273 - 2-Pyrrolidones with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to other ring carbon atoms
  • C07D 211/76 - Oxygen atoms attached in position 2 or 6
  • C07D 305/12 - Beta-lactones
  • C07D 307/33 - Oxygen atoms in position 2, the oxygen atom being in its keto or unsubstituted enol form
  • C07D 309/30 - Oxygen atoms, e.g. delta-lactones
  • C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
  • C07D 321/10 - Seven-membered rings condensed with carbocyclic rings or ring systems
  • C07D 327/04 - Five-membered rings
  • C07D 409/12 - Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings linked by a chain containing hetero atoms as chain links
  • C07D 411/12 - Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen and sulfur atoms as the only ring hetero atoms containing two hetero rings linked by a chain containing hetero atoms as chain links
  • C07D 471/08 - Bridged systems
  • C08F 12/22 - Oxygen
  • C08F 20/10 - Esters
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

25.

SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number 19550454
Status Pending
Filing Date 2026-02-26
First Publication Date 2026-07-09
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada, Shuhei
  • Yoneda, Eiji

Abstract

A substrate includes: a substrate having a thin film on a surface thereof. The thin film includes a group derived from a compound represented by formula (1). In the formula (1), R1 is an n-valent organic group having 1 to 40 carbon atoms, and n is an integer of 1 to 4. A substrate includes: a substrate having a thin film on a surface thereof. The thin film includes a group derived from a compound represented by formula (1). In the formula (1), R1 is an n-valent organic group having 1 to 40 carbon atoms, and n is an integer of 1 to 4.

IPC Classes  ?

26.

METHOD FOR PRODUCING METABOLICALLY ACTIVATED LIVER ORGANOID, COMPOSITION, AND METHOD FOR EVALUATING TEST SUBSTANCE

      
Application Number 19365549
Status Pending
Filing Date 2025-10-22
First Publication Date 2026-07-02
Owner
  • JSR CORPORATION (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Okada, Ryo
  • Sato, Toshiro
  • Igarashi, Ryo

Abstract

A method for producing a metabolically activated liver organoid, the method including culturing primary hepatocytes or hepatocyte-like cells in a differentiation medium to obtain a metabolically activated liver organoid, in which the differentiation medium is a medium including one or two selected from the group consisting of a growth hormone receptor agonist and a prolactin receptor agonist, and a glucocorticoid receptor agonist.

IPC Classes  ?

  • C12N 5/071 - Vertebrate cells or tissues, e.g. human cells or tissues

27.

RADIATION-SENSITIVE COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number JP2025041916
Publication Number 2026/140710
Status In Force
Filing Date 2025-12-02
Publication Date 2026-07-02
Owner JSR CORPORATION (Japan)
Inventor
  • Omiya, Takuya
  • Nishikori, Katsuaki

Abstract

Provided are: a radiation-sensitive composition capable of exhibiting sensitivity, critical dimension uniformity (CDU), a process window, and a development defect-suppressing property at levels equal to or higher than those of existing compositions when forming a pattern; and a pattern formation method. The radiation-sensitive composition comprises a polymer and a solvent, and the polymer includes: a structural unit (I) containing an ester bond-containing monocyclic structure; a structural unit (II) derived from a compound represented by formula (1); and a structural unit (III) having a phenolic hydroxyl group. (In formula (1), Ar1is a substituted or unsubstituted 3C-20C monovalent aromatic group. R1is a hydrogen atom or a 1C-20C monovalent organic group, R2is a 1C-20C monovalent organic group, or if R1is a hydrogen atom, R2is bonded to Ar1and forms a ring structure together with the carbon atom to which R2is bonded and the Ar1. R3is a hydrogen atom, a halogen group, or a 1C-20C monovalent organic group. L1 is a single bond or a divalent linking group.)

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - ExposureApparatus therefor

28.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, AND RADIATION-SENSITIVE ACID GENERATOR

      
Application Number JP2025042331
Publication Number 2026/140764
Status In Force
Filing Date 2025-12-04
Publication Date 2026-07-02
Owner JSR CORPORATION (Japan)
Inventor
  • Abe, Shinya
  • Ohtagaki, Yasuhiro

Abstract

Provided are: a radiation-sensitive composition capable of exhibiting sensitivity, CDU, and development defect suppressing properties at sufficient levels when forming a pattern; a pattern formation method; and a radiation-sensitive acid generator. This radiation-sensitive composition comprises: a radiation-sensitive acid generator having an organic acid anion and an organic cation; a polymer which contains a structural unit having an acid-dissociable group; and a solvent, wherein at least one selected from the group consisting of the organic acid anion and the organic cation includes a partial structure (i) represented by formula (i). (In formula (i), R1 is a hydrogen atom or a substituted or unsubstituted C1-C10 monovalent hydrocarbon group. * is a bond with a portion other than the partial structure (i) in the radiation-sensitive acid generator.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 381/12 - Sulfonium compounds
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • C07D 333/76 - Dibenzothiophenes
  • C07F 9/6561 - Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom containing systems of two or more relevant hetero rings condensed among themselves or condensed with a common carbocyclic ring or ring system, with or without other non-condensed hetero rings
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

29.

RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, POLYMER, AND MONOMER

      
Application Number JP2025044664
Publication Number 2026/141230
Status In Force
Filing Date 2025-12-19
Publication Date 2026-07-02
Owner JSR CORPORATION (Japan)
Inventor
  • Taniguchi Takuhiro
  • Kuriki Ryunosuke
  • Hayashibara Tomoya

Abstract

This radiation-sensitive composition contains a polymer the solubility of which in a developing solution changes by the action of acid, wherein the polymer and/or a component other than the polymer has a partial structure represented by formula (1).

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 53/21 - Acids containing three or more carbon atoms containing fluorine
  • C07C 53/138 - Saturated compounds having only one carboxyl group bound to an acyclic carbon atom or hydrogen containing rings containing condensed ring systems containing an adamantane ring system
  • C07C 55/32 - Saturated compounds having more than one carboxyl group bound to acyclic carbon atoms containing halogen
  • C07C 59/125 - Saturated compounds having only one carboxyl group and containing ether groups, groups, groups, or groups
  • C07C 63/70 - Monocarboxylic acids
  • C07C 63/72 - Polycyclic acids
  • C07C 65/05 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing hydroxy or O-metal groups monocyclic and having all hydroxy or O-metal groups bound to the ring o-Hydroxy carboxylic acids
  • C07C 65/21 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing ether groups, groups, groups, or groups
  • C07C 381/12 - Sulfonium compounds
  • C07D 317/68 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

30.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING BORON-CONTAINING FILM, BORON-CONTAINING FILM FORMING MATERIAL, AND BORON-CONTAINING COMPOUND

      
Application Number JP2025044941
Publication Number 2026/141343
Status In Force
Filing Date 2025-12-23
Publication Date 2026-07-02
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada, Shuhei
  • Muto, Kazuma
  • Yoneda, Eiji

Abstract

Provided are: a method for manufacturing a semiconductor substrate, with which it is possible to form a boron-containing film that has a low dielectric constant; a method for manufacturing a boron-containing film; a boron-containing film forming material; and a boron-containing compound. This method for manufacturing a semiconductor substrate includes a step for bringing a substrate into contact with a boron-containing compound. The boron-containing compound includes at least one compound that is selected from the group consisting of a compound represented by formula (1) and a compound represented by formula (2). (In formulae (1) and (2), X is a monovalent group having a nitrogen-containing heterocyclic ring having 1 to 20 carbon atoms, or a monovalent group represented by formula (a); R1to R3are each a monovalent organic group having 1 to 40 carbon atoms, or a hydrogen atom; and n is an integer of 1 to 4.) (In formula (a), R4to R5are each a monovalent organic group having 1 to 40 carbon atoms, or R4to R5are combined with each other to constitute a nitrogen-containing heterocyclic ring having 3 to 10 ring atoms together with a nitrogen atom to which these moieties are bonded; and R6 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.)

IPC Classes  ?

  • H10P 14/694 -
  • C07F 5/02 - Boron compounds
  • C07F 5/05 - Cyclic compounds having at least one ring containing boron but no carbon in the ring
  • C23C 16/18 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
  • C23C 16/38 - Borides

31.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMING METHOD, COMPOUND, AND POLYMER

      
Application Number JP2025037499
Publication Number 2026/133733
Status In Force
Filing Date 2025-10-24
Publication Date 2026-06-25
Owner JSR CORPORATION (Japan)
Inventor
  • Hikami, Yuichi
  • Miyoshi, Hirokazu
  • Inoue, Atsushi
  • Abe, Yudai

Abstract

The purpose of the present invention is to provide: a radiation-sensitive composition which is capable of exhibiting sensitivity, LWR, MEEF, development defect suppressing properties, and CDU at sufficient levels when a pattern is formed; a pattern forming method; a compound; and a polymer. This radiation-sensitive composition contains: a polymer (A) which comprises a structural unit (M) derived from a compound represented by formula (1); and a solvent (D). (In formula (1), R1is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. L1is a divalent linking group having 1-5 carbon atoms. R2is a hydrogen atom or a monovalent organic group having 1-20 carbon atoms. R3 is a monovalent organic group containing an ester bond between carbons and having 3-20 carbon atoms.)

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C07D 305/12 - Beta-lactones
  • C07D 307/33 - Oxygen atoms in position 2, the oxygen atom being in its keto or unsubstituted enol form
  • C07D 307/93 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom ortho- or peri-condensed with carbocyclic rings or ring systems condensed with a ring other than six-membered
  • C07D 309/30 - Oxygen atoms, e.g. delta-lactones
  • C07D 493/18 - Bridged systems
  • C08F 220/36 - Esters containing nitrogen containing oxygen in addition to the carboxy oxygen
  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable

32.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND RESIST UNDERLAYER FILM FORMING COMPOSITION

      
Application Number 19539222
Status Pending
Filing Date 2026-02-13
First Publication Date 2026-06-25
Owner JSR CORPORATION (Japan)
Inventor
  • Hirasawa, Kengo
  • Tanaka, Ryotaro
  • Oka, Yuki
  • Yoshinaka, Sho

Abstract

A method for manufacturing a semiconductor substrate includes applying a resist underlayer film forming composition. The composition includes a compound which includes a plurality of groups each represented by —ORA. Each RA is independently a hydrogen atom (amount: x), a monovalent heteroatom-containing group having 1 to 10 carbon atoms (amount: y), or a monovalent organic group having 1 to 10 carbon atoms other than the monovalent heteroatom-containing group (amount: z). The compound satisfies relationships of x+y+z=100, 20≤x≤95, and 5≤y≤80. The compound is a polymer including a repeating unit represented by formula (1), an aromatic ring-containing compound that has a molecular weight of 750 or more and 3000 or less and includes —ORA, or a combination thereof. At least one selected from the group consisting of Ar1, R0 and R1 comprises —ORA. A method for manufacturing a semiconductor substrate includes applying a resist underlayer film forming composition. The composition includes a compound which includes a plurality of groups each represented by —ORA. Each RA is independently a hydrogen atom (amount: x), a monovalent heteroatom-containing group having 1 to 10 carbon atoms (amount: y), or a monovalent organic group having 1 to 10 carbon atoms other than the monovalent heteroatom-containing group (amount: z). The compound satisfies relationships of x+y+z=100, 20≤x≤95, and 5≤y≤80. The compound is a polymer including a repeating unit represented by formula (1), an aromatic ring-containing compound that has a molecular weight of 750 or more and 3000 or less and includes —ORA, or a combination thereof. At least one selected from the group consisting of Ar1, R0 and R1 comprises —ORA.

IPC Classes  ?

  • G03F 7/09 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

33.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND FILM FORMING COMPOSITION

      
Application Number 19545126
Status Pending
Filing Date 2026-02-20
First Publication Date 2026-06-25
Owner JSR CORPORATION (Japan)
Inventor
  • Kimata, Hironori
  • Serizawa, Ryuichi
  • Ozaki, Yuki

Abstract

A method for manufacturing a semiconductor substrate includes applying a composition for film formation to a substrate. The composition for film formation includes: a metal compound including a metal atom and an organic acid, and a solvent. The organic acid is represented by formula (1). R1 is a hydroxy group, a nitro group, a halogen atom, or a monovalent organic group having 1 to 20 carbon atoms; Ar1 is an r+s+t-valent aromatic ring structure having 3 to 30 carbon atoms; X is a crosslinkable group; L1 is a single bond or a divalent linking group; t is an integer of 0 to 2; r is an integer of 1 to 4; and s is an integer of 1 to 4. A method for manufacturing a semiconductor substrate includes applying a composition for film formation to a substrate. The composition for film formation includes: a metal compound including a metal atom and an organic acid, and a solvent. The organic acid is represented by formula (1). R1 is a hydroxy group, a nitro group, a halogen atom, or a monovalent organic group having 1 to 20 carbon atoms; Ar1 is an r+s+t-valent aromatic ring structure having 3 to 30 carbon atoms; X is a crosslinkable group; L1 is a single bond or a divalent linking group; t is an integer of 0 to 2; r is an integer of 1 to 4; and s is an integer of 1 to 4.

IPC Classes  ?

34.

COMPOSITION FOR FORMING PROTECTIVE FILM AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD

      
Application Number JP2025039576
Publication Number 2026/133807
Status In Force
Filing Date 2025-11-12
Publication Date 2026-06-25
Owner JSR CORPORATION (Japan)
Inventor
  • Hirabayashi, Hiroki
  • Seko, Tomoaki
  • Suzuki, Ayaka
  • Yanagi, Takanori
  • Hashizume, Nozomi

Abstract

Provided are a composition for forming a protective film having favorable storage stability and removability of a coating film, and excellent in etching solution resistance of the protective film, and a semiconductor substrate manufacturing method. The present invention is a composition for forming a protective film on a semiconductor substrate peripheral edge portion, wherein the composition contains polysiloxane and a solvent, and the polysiloxane has a first structural unit represented by formula (1) below. (In formula (1) above, X is a monovalent group represented by any one of formulae (1-1) to (1-9) below. a represents an integer of 1 to 3. If a is 2 or greater, the plurality of X's are identical or different from each other. R1represents a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or a halogen atom. b represents an integer of 0 to 2. If b is 2, the two R1s are identical or different from each other. Where, a + b is 3 or less.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/095 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

35.

Radiation-Sensitive Composition, Resist Pattern Formation Method, Acid-Generator, and Compound

      
Application Number 18720792
Status Pending
Filing Date 2022-11-07
First Publication Date 2026-06-18
Owner JSR CORPORATION (Japan)
Inventor
  • Kinoshita, Natsuko
  • Taniguchi, Takuhiro

Abstract

A radiation-sensitive composition contains: a polymer having an acid-releasable group and at least one compound (b) selected from the group consisting of a compound represented by formula (1) and a compound represented by formula (2). In formula (1), R1 represents a C1 to C20 monovalent organic group. R2 represents a single bond or a C1 to C20 divalent group which bonds to N− in formula (1) via —CR4R5— or an aromatic ring. Ma+ represents an a-valent cation. In formula (2), R7 represents a group having a partial structure in which an iodine atom is bonded to an aromatic ring. Mb+ represents a b-valent cation.

IPC Classes  ?

  • C08F 220/24 - Esters containing halogen containing perhaloalkyl radicals

36.

RADIATION-SENSITIVE COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number JP2025036602
Publication Number 2026/126639
Status In Force
Filing Date 2025-10-17
Publication Date 2026-06-18
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori, Katsuaki
  • Omiya, Takuya
  • Kobayashi, Atsushi
  • Esaki, Fumiya

Abstract

The purpose of the present invention is to provide: a radiation-sensitive composition which has excellent storage stability and is capable of exhibiting sensitivity, CDU, and bridge margin at levels that are comparable or superior those of conventional compositions during pattern formation; and a pattern formation method. This radiation-sensitive composition contains a polymer, one or more onium salts including an organic acid anion and a radiation-sensitive onium cation, a compound represented by formula (2), and a solvent, at least a portion of the organic acid anion in the onium salt being an organic acid anion (1) represented by formula (1). 

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

37.

AFFINITY CARRIER

      
Application Number JP2025036935
Publication Number 2026/126650
Status In Force
Filing Date 2025-10-21
Publication Date 2026-06-18
Owner JSR CORPORATION (Japan)
Inventor Yasuoka, Jun-Ichi

Abstract

Provided are an immunoglobulin-binding protein containing a mutant immunoglobulin-binding domain and an affinity carrier containing the immunoglobulin-binding protein. The mutant immunoglobulin-binding domain comprises an amino acid sequence having at least 80% identity with any of the amino acid sequences represented by SEQ ID NOS: 1-3, and has the following mutations (a) and (b): (a) substitution of an amino acid residue at a position corresponding to position 3 in any of the amino acid sequences represented by SEQ ID NOS: 1-3 with Ala or Asp; and (b) insertion of at least one amino acid residue selected from the group consisting of Ala, Arg, Asp, Gln, Glu, His, Met, Thr, Val, Phe, Leu, Ile, Pro, Trp, and Tyr between the position corresponding to position 3 and the position corresponding to position 4 in any of the amino acid sequences represented by SEQ ID NOS: 1-3.

IPC Classes  ?

  • C07K 17/00 - Carrier-bound or immobilised peptidesPreparation thereof
  • C07K 1/22 - Affinity chromatography or related techniques based upon selective absorption processes
  • C07K 14/315 - Peptides having more than 20 amino acidsGastrinsSomatostatinsMelanotropinsDerivatives thereof from bacteria from Streptococcus (G), e.g. Enterococci
  • C12N 1/15 - Fungi Culture media therefor modified by introduction of foreign genetic material
  • C12N 1/19 - YeastsCulture media therefor modified by introduction of foreign genetic material
  • C12N 1/21 - BacteriaCulture media therefor modified by introduction of foreign genetic material
  • C12N 5/10 - Cells modified by introduction of foreign genetic material, e.g. virus-transformed cells
  • C12N 15/31 - Genes encoding microbial proteins, e.g. enterotoxins
  • G01N 30/88 - Integrated analysis systems specially adapted therefor, not covered by a single one of groups

38.

COMPOSITION FOR SURFACE TREATMENT, METHOD FOR PRODUCING SURFACE-TREATED BASE MATERIAL, AND SELECTIVE MODIFICATION METHOD

      
Application Number JP2025042958
Publication Number 2026/127036
Status In Force
Filing Date 2025-12-09
Publication Date 2026-06-18
Owner JSR CORPORATION (Japan)
Inventor
  • Hagi, Shin-Ichirou
  • Shibata, Yoshifuru
  • Nakanishi, Kouji
  • Komatsu, Hiroyuki

Abstract

This composition for surface treatment is used for selective modification of a base material surface that includes a first region and a second region which is formed of a material different from that of the first region. This composition for surface treatment contains a compound (A) that has at least one specific functional group selected from the group consisting of protected polar functional groups and acid anhydride groups, a compound (B) that generates an acid or a base by heat, and a solvent.

IPC Classes  ?

39.

A METHOD OF OPERATING AT LEAST ONE APPARATUS FOR PROCESSING EXPANDABLE OR EXPANDED POLYMER PARTICLES

      
Application Number 19128537
Status Pending
Filing Date 2023-11-07
First Publication Date 2026-06-18
Owner JSP CORPORATION (Japan)
Inventor
  • Pluska, Robert
  • Braimllari, Xheni
  • Bustamante, Alberto
  • Talacchini, Alessandro

Abstract

A method of operating at least one apparatus for processing expandable or expanded polymer particles to form a particle foam component, including: receiving a parameter data set specifying at least one of: at least one parameter of at least one primary process for processing expandable or expanded polymer particles, at least one parameter of at least one secondary process for processing a particle foam component, or at least one parameter of a particle foam component; evaluating the parameter data set with respect to at least one evaluation criterion and generating an evaluation data set indicative of at least one current or future deviation of at least one parameter specified by the parameter data set with respect to the at least one evaluation criterion; and operating at least one apparatus for processing expandable or expanded polymer particles based on the evaluation data set.

IPC Classes  ?

  • G06F 9/48 - Program initiatingProgram switching, e.g. by interrupt
  • G06F 16/23 - Updating
  • G06F 16/2453 - Query optimisation
  • H04L 67/10 - Protocols in which an application is distributed across nodes in the network

40.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND UNDERLAYER FILM-FORMING COMPOSITION

      
Application Number 19529247
Status Pending
Filing Date 2026-02-04
First Publication Date 2026-06-18
Owner JSR CORPORATION (Japan)
Inventor
  • Kasai, Tatsuya
  • Takada, Kazuya

Abstract

A method for manufacturing a semiconductor substrate includes: applying an underlayer film-forming composition directly or indirectly to a substrate to form an underlayer film; forming a metal-containing resist film on the underlayer film; exposing the metal-containing resist film to extreme ultraviolet rays; and developing the exposed metal-containing resist film. The underlayer film-forming composition includes: a compound including a structural unit (α) represented by formula (1-1); and a solvent. In the formula (1-1), a is an integer of 1 to 3; R1 is a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or a halogen atom; b is an integer of 0 to 2; when b is 2, two R1s are the same or different from each other; provided that a+b is 3 or less. A method for manufacturing a semiconductor substrate includes: applying an underlayer film-forming composition directly or indirectly to a substrate to form an underlayer film; forming a metal-containing resist film on the underlayer film; exposing the metal-containing resist film to extreme ultraviolet rays; and developing the exposed metal-containing resist film. The underlayer film-forming composition includes: a compound including a structural unit (α) represented by formula (1-1); and a solvent. In the formula (1-1), a is an integer of 1 to 3; R1 is a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or a halogen atom; b is an integer of 0 to 2; when b is 2, two R1s are the same or different from each other; provided that a+b is 3 or less.

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/004 - Photosensitive materials
  • G03F 7/075 - Silicon-containing compounds
  • G03F 7/20 - ExposureApparatus therefor
  • H10P 76/20 -

41.

PEPTIDE, PROTEIN COMPLEX COMPRISING SAID PEPTIDE, AND T CELL RECEPTOR

      
Application Number JP2025043096
Publication Number 2026/127062
Status In Force
Filing Date 2025-12-10
Publication Date 2026-06-18
Owner
  • JSR CORPORATION (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Wakui, Seiki
  • Nagashima, Ryosuke
  • Takeshita, Masaru
  • Inamo, Jun
  • Tsunoda, Kazuyuki

Abstract

The present disclosure provides a peptide, a protein complex containing said peptide, a T cell receptor, etc. that can be used in antigen-specific immunosuppressive therapy for suppressing autoimmunity. The present invention includes peptides of 25 or fewer amino acids in length that include any one amino acid sequence selected from the group consisting of core sequences represented by SEQ ID NO: 1 through 10 and SEQ ID NO: 301 through 303.

IPC Classes  ?

  • C07K 14/47 - Peptides having more than 20 amino acidsGastrinsSomatostatinsMelanotropinsDerivatives thereof from animalsPeptides having more than 20 amino acidsGastrinsSomatostatinsMelanotropinsDerivatives thereof from humans from vertebrates from mammals
  • A61K 31/7088 - Compounds having three or more nucleosides or nucleotides
  • A61K 35/12 - Materials from mammalsCompositions comprising non-specified tissues or cellsCompositions comprising non-embryonic stem cellsGenetically modified cells
  • A61K 35/76 - VirusesSubviral particlesBacteriophages
  • A61K 38/10 - Peptides having 12 to 20 amino acids
  • A61K 38/16 - Peptides having more than 20 amino acidsGastrinsSomatostatinsMelanotropinsDerivatives thereof
  • A61K 39/395 - AntibodiesImmunoglobulinsImmune serum, e.g. antilymphocytic serum
  • A61K 45/00 - Medicinal preparations containing active ingredients not provided for in groups
  • A61K 47/68 - Medicinal preparations characterised by the non-active ingredients used, e.g. carriers or inert additivesTargeting or modifying agents chemically bound to the active ingredient the non-active ingredient being chemically bound to the active ingredient, e.g. polymer-drug conjugates the non-active ingredient being a modifying agent the modifying agent being an antibody, an immunoglobulin or a fragment thereof, e.g. an Fc-fragment
  • A61K 48/00 - Medicinal preparations containing genetic material which is inserted into cells of the living body to treat genetic diseasesGene therapy
  • A61P 37/06 - Immunosuppressants, e.g. drugs for graft rejection
  • C07K 14/725 - T-cell receptors
  • C07K 14/74 - Major histocompatibility complex [MHC]
  • C07K 16/18 - Immunoglobulins, e.g. monoclonal or polyclonal antibodies against material from animals or humans
  • C07K 16/28 - Immunoglobulins, e.g. monoclonal or polyclonal antibodies against material from animals or humans against receptors, cell surface antigens or cell surface determinants
  • C12N 1/15 - Fungi Culture media therefor modified by introduction of foreign genetic material
  • C12N 1/19 - YeastsCulture media therefor modified by introduction of foreign genetic material
  • C12N 1/21 - BacteriaCulture media therefor modified by introduction of foreign genetic material
  • C12N 5/10 - Cells modified by introduction of foreign genetic material, e.g. virus-transformed cells
  • C12N 15/12 - Genes encoding animal proteins
  • C12N 15/63 - Introduction of foreign genetic material using vectorsVectorsUse of hosts thereforRegulation of expression
  • G01N 33/53 - ImmunoassayBiospecific binding assayMaterials therefor
  • G01N 33/564 - ImmunoassayBiospecific binding assayMaterials therefor for pre-existing immune complex or autoimmune disease
  • G01N 33/566 - ImmunoassayBiospecific binding assayMaterials therefor using specific carrier or receptor proteins as ligand binding reagent

42.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION

      
Application Number 19180259
Status Pending
Filing Date 2025-04-16
First Publication Date 2026-06-11
Owner JSR CORPORATION (Japan)
Inventor
  • Tsuji, Takashi
  • Nakatsu, Hiroki
  • Katagiri, Takashi
  • Abe, Shinya
  • Naganawa, Atsuko

Abstract

A method for manufacturing a semiconductor substrate includes: forming a resist underlayer film directly or indirectly on a substrate by applying a composition for forming a resist underlayer film; forming a resist pattern directly or indirectly on the resist underlayer film; and performing etching using the resist pattern as a mask. The composition includes: a compound including a nitro group; and a solvent. The compound is a polymer including a repeating unit which includes a nitro group and an aromatic ring, an aromatic ring-containing compound including a nitro group and an aromatic ring, and having a molecular weight of 600 or more and 3,000 or less, or a combination thereof. A content of the compound in the composition relative to total components other than the solvent in the composition is 10% by mass or more.

IPC Classes  ?

  • H10P 50/00 -
  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • H10P 50/24 -
  • H10P 50/28 -

43.

METHOD FOR PRODUCING POLYPROPYLENE-BASED RESIN EXPANDED BEADS

      
Application Number 19405669
Status Pending
Filing Date 2025-12-02
First Publication Date 2026-06-04
Owner JSP Corporation (Japan)
Inventor
  • Hira, Akinobu
  • Tsuda, Yuji
  • Kaburagi, Miho

Abstract

A method for producing a polypropylene-based resin expanded bead, including expanding polypropylene-based resin particles, wherein the resin particles are composed of a mixed resin of a virgin material and a polypropylene-based resin recycled material; the recycled material contains a propylene copolymer as a base material resin; the virgin material has a melting point MP1 of 130° C. or more and less than 150° C.; a melting point MP2 (° C.) of the recycled material and the melting point MP1 (° C.) of the virgin material satisfy a specific relationship; a melt flow rate MFR2 (g/10 minutes) of the recycled material and a melt flow rate MFR1 (g/10 minutes) of the virgin material satisfy a specific relationship; and a crystallization temperature CP2 (° C.) of the recycled material and a crystallization temperature CP1 (° C.) of the virgin material satisfy a specific relationship.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • B29C 44/34 - Component parts, details or accessoriesAuxiliary operations
  • B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads
  • B29K 23/00 - Use of polyalkenes as moulding material
  • C08J 11/06 - Recovery or working-up of waste materials of polymers without chemical reactions

44.

RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMING METHOD, RADIATION-SENSITIVE ACID GENERATOR, AND COMPOUND

      
Application Number JP2025034703
Publication Number 2026/115912
Status In Force
Filing Date 2025-09-30
Publication Date 2026-06-04
Owner JSR CORPORATION (Japan)
Inventor
  • Taniguchi, Takuhiro
  • Uekusa, Kouya

Abstract

Provided is a radiation-sensitive composition which comprises a polymer (P) including a structural unit having an acid-dissociable group, and which satisfies at least one of a first requirement and a second requirement. First requirement: The radiation-sensitive composition further contains a compound represented by formula (1). Second requirement: The polymer (P) further includes a structural unit derived from an onium salt compound represented by formula (1). In formula (1), RA22, -OH, -SH, -COOH, or a group represented by formula (i). RB22, -OH, -SH, -COOH, or a group represented by formula (i). Z+ represents a radiation-sensitive onium cation.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/00 - Compounds containing at least one halogen atom bound to a six-membered aromatic ring
  • C07C 255/46 - Carboxylic acid nitriles having cyano groups bound to carbon atoms of rings other than six-membered aromatic rings to carbon atoms of non-condensed rings
  • C07C 381/12 - Sulfonium compounds
  • C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
  • C07D 307/33 - Oxygen atoms in position 2, the oxygen atom being in its keto or unsubstituted enol form
  • C07D 321/10 - Seven-membered rings condensed with carbocyclic rings or ring systems
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

45.

OPTICAL FILTER

      
Application Number JP2025029343
Publication Number 2026/110434
Status In Force
Filing Date 2025-08-21
Publication Date 2026-05-28
Owner JSR CORPORATION (Japan)
Inventor
  • Shimogawa,hiroyuki
  • Tsuchiya,shun

Abstract

Provided is an optical filter, which can be attached to an intended part of a human body and with which light taken into a detection device can be freely selected. This optical filter comprises a light-transmitting film having a light-transmitting band and a light-shielding band in a wavelength range of 400 nm to 1000 nm, a pigment being contained therein.

IPC Classes  ?

  • G02B 5/22 - Absorbing filters
  • A61B 5/02 - Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow

46.

LIGHT DETECTION DEVICE AND BIOLOGICAL INFORMATION ACQUISITION METHOD

      
Application Number JP2025031167
Publication Number 2026/110445
Status In Force
Filing Date 2025-09-03
Publication Date 2026-05-28
Owner
  • JSR CORPORATION (Japan)
  • THE UNIVERSITY OF TOKYO (Japan)
Inventor
  • Shimogawa, Hiroyuki
  • Tsuchiya, Shun
  • Yokota, Tomoyuki
  • Chen, Hongting

Abstract

Provided are a more versatile light detection device that can acquire more biological information without the need for a complicated configuration and can also be worn at an arbitrary location on the human body and a biological information acquisition method that uses the light detection device. According to the present invention, a light detection device that detects ambient light comprises: an optical filter that is a light-transmitting film into which a pigment has been incorporated and has a light-transmitting band and a light-blocking band within a wavelength range of 400–1000 nm; and a thin-film light sensor that is formed on the surface of the optical filter and detects at least a portion of ambient light in the light-transmitting band of the optical filter.

IPC Classes  ?

  • A61B 5/02 - Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
  • G02B 5/22 - Absorbing filters

47.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMING METHOD, AND COMPOUND

      
Application Number JP2025037465
Publication Number 2026/110558
Status In Force
Filing Date 2025-10-24
Publication Date 2026-05-28
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori, Katsuaki
  • Shiratani, Motohiro
  • Omiya, Takuya
  • Yamakawa, Shouya
  • Kawai, Takahiro

Abstract

Provided are a radiation-sensitive composition capable of exhibiting LWR and suppression of development defects at sufficient levels at the time of pattern formation, a pattern forming method, and a compound. A radiation-sensitive composition comprising: a compound represented by formula (1); a polymer including a structural unit having an acid-dissociable group; and a solvent. In the formula, W is a condensed ring structure having a substituted or unsubstituted bridged alicyclic ring and two or more substituted or unsubstituted aromatic rings, each of which is condensed with the bridged alicyclic ring. L is a single bond or a divalent linking group. R1222Ra, or -CORb. R22222Ra, -CORb, or -Rc. When R1is -F, R2does not contain fluorine atom. In R1and R2, Ra, Rband Rc233. Z+ is a monovalent organic cation.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 317/46 - SulfonesSulfoxides having sulfone or sulfoxide groups and carboxyl groups bound to the same carbon skeleton the carbon skeleton being further substituted by singly-bound oxygen atoms
  • C07C 381/12 - Sulfonium compounds
  • C07D 307/32 - Oxygen atoms
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

48.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, AND COMPOUND

      
Application Number JP2025037470
Publication Number 2026/110559
Status In Force
Filing Date 2025-10-24
Publication Date 2026-05-28
Owner JSR CORPORATION (Japan)
Inventor
  • Yamakawa, Shouya
  • Nishikori, Katsuaki
  • Egawa, Fuyuki

Abstract

Provided are: a radiation-sensitive composition capable of exhibiting sensitivity and a process window at sufficient levels when forming a pattern; a pattern formation method; and a compound. This radiation-sensitive composition comprises: a compound; a polymer which contains a structural unit having an acid-dissociable group; and a solvent, wherein the compound includes at least a condensed ring structure which has a substituted or unsubstituted bridged alicyclic ring and at least two substituted or unsubstituted aromatic rings each condensed with the bridged alicyclic ring, and a partial structure represented by formula (1a) or formula (1b). (In the formulae, W1and W2are each the condensed ring structure or a ring structure other than the condensed ring structure. L1122 is 0 or 1. Z+ is an organic cation.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/25 - Sulfonic acids having sulfo groups bound to carbon atoms of rings other than six-membered aromatic rings of a carbon skeleton
  • C07C 309/26 - Sulfonic acids having sulfo groups bound to carbon atoms of rings other than six-membered aromatic rings of a carbon skeleton containing nitrogen atoms, not being part of nitro or nitroso groups, bound to the carbon skeleton
  • C07C 309/27 - Sulfonic acids having sulfo groups bound to carbon atoms of rings other than six-membered aromatic rings of a carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 309/42 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing singly-bound oxygen atoms bound to the carbon skeleton having the sulfo groups bound to carbon atoms of non-condensed six-membered aromatic rings
  • C07C 309/46 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing nitrogen atoms, not being part of nitro or nitroso groups, bound to the carbon skeleton having the sulfo groups bound to carbon atoms of non-condensed six-membered aromatic rings
  • C07C 309/48 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing nitrogen atoms, not being part of nitro or nitroso groups, bound to the carbon skeleton the carbon skeleton being further substituted by halogen atoms
  • C07C 309/59 - Nitrogen analogues of carboxyl groups
  • C07C 381/12 - Sulfonium compounds
  • C07D 307/32 - Oxygen atoms
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

49.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, AND COMPOUND

      
Application Number JP2025038098
Publication Number 2026/110582
Status In Force
Filing Date 2025-10-30
Publication Date 2026-05-28
Owner JSR CORPORATION (Japan)
Inventor
  • Abe, Yudai
  • Fukuhara, Ryouta
  • Okazaki, Satoshi
  • Egawa, Fuyuki
  • Furukawa, Taiichi
  • Nemoto, Ryuichi

Abstract

Provided is a radiation-sensitive composition or the like capable of exhibiting sensitivity, LWR, CDU, EL, DOF, number of development defects, pattern rectangularity, pattern circularity, and MEEF at sufficient levels during pattern formation. The radiation-sensitive composition contains a compound represented by formula (1), a polymer including a structural unit (I) having an acid-dissociable group, and a solvent. (In the formula, Rz22Ra2533. Rais a hydrogen atom or a monovalent organic group having 1-20 carbon atoms. R155 or a monovalent organic group having 1-10 carbon atoms. Y is -O- or -NRb-. L is a single bond or a divalent organic group. However, when Rzis -F, the divalent organic group has at most four carbon atoms. W is a monovalent condensed cyclic group or a monovalent condensed cyclic group having a substituent. The condensed cyclic group or the substituent has a hetero atom. Z+ is a monovalent organic cation.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 309/19 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of a saturated carbon skeleton containing rings
  • C07C 311/51 - Y being a hydrogen or a carbon atom
  • C07C 381/12 - Sulfonium compounds
  • C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

50.

ANTITHROMBOTIC COATING MATERIAL, MEDICAL DEVICE, RESEARCH INSTRUMENT, METHODS FOR PRODUCING MEDICAL DEVICE AND RESEARCH INSTRUMENT, AND ADSORPTION SUPPRESSION METHOD

      
Application Number JP2025039538
Publication Number 2026/105755
Status In Force
Filing Date 2025-11-11
Publication Date 2026-05-21
Owner
  • JSR CORPORATION (Japan)
  • KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (Japan)
Inventor
  • Yasuike, Nobuo
  • Nishimura, Tatsuya
  • Kurita, Shin-Ya
  • Nakazato, Takumi
  • Okada, Takashi
  • Miyaji, Masaaki
  • Tanaka, Masaru
  • Anada, Takahisa

Abstract

Provided is an antithrombotic coating material containing a polyorganosiloxane having at least one of an oxiranyl group and an oxetanyl group, thereby forming a coating film having excellent adhesion to a substrate while exhibiting good antithrombotic properties.

IPC Classes  ?

  • A61L 27/34 - Macromolecular materials
  • A61L 15/26 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bondsDerivatives thereof
  • A61L 17/14 - Post-treatment to improve physical properties
  • A61L 27/44 - Composite materials, i.e. layered or containing one material dispersed in a matrix of the same or different material having a macromolecular matrix
  • A61L 29/08 - Materials for coatings
  • A61L 29/12 - Composite materials, i.e. layered or containing one material dispersed in a matrix of the same or different material
  • A61L 31/10 - Macromolecular materials
  • A61L 31/12 - Composite materials, i.e. layered or containing one material dispersed in a matrix of the same or different material
  • A61L 33/06 - Use of macromolecular materials
  • C09D 7/63 - Additives non-macromolecular organic
  • C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
  • C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
  • C09D 183/04 - Polysiloxanes

51.

RADIATION SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD

      
Application Number 19120452
Status Pending
Filing Date 2023-09-27
First Publication Date 2026-05-21
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori, Katsuaki
  • Kobayashi, Atsushi
  • Hachiya, Asuka
  • Shiratani, Motohiro
  • Nemoto, Ryuichi

Abstract

A radiation-sensitive resin composition includes: a radiation-sensitive onium salt (A) represented by formula (1); a radiation-sensitive onium salt (B) different from the radiation-sensitive onium salt (A) and represented by formula (2); a resin including a structural unit which includes an acid-dissociable group; and a solvent. Rp1 is a substituted or unsubstituted (np+1)-valent hydrocarbon group having 1 to 20 carbon atoms, or a group including a divalent heteroatom-containing structure between adjacent two carbon atoms of a substituted or unsubstituted (np+1)-valent hydrocarbon group having 1 to 20 carbon atoms, np is an integer of 1 to 5, and X1+ is a monovalent radiation-sensitive onium cation. Rp2 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms, and X2+ is a monovalent radiation-sensitive onium cation. At least one of X1+ and X2+ is a cation including a fluorine atom. A radiation-sensitive resin composition includes: a radiation-sensitive onium salt (A) represented by formula (1); a radiation-sensitive onium salt (B) different from the radiation-sensitive onium salt (A) and represented by formula (2); a resin including a structural unit which includes an acid-dissociable group; and a solvent. Rp1 is a substituted or unsubstituted (np+1)-valent hydrocarbon group having 1 to 20 carbon atoms, or a group including a divalent heteroatom-containing structure between adjacent two carbon atoms of a substituted or unsubstituted (np+1)-valent hydrocarbon group having 1 to 20 carbon atoms, np is an integer of 1 to 5, and X1+ is a monovalent radiation-sensitive onium cation. Rp2 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms, and X2+ is a monovalent radiation-sensitive onium cation. At least one of X1+ and X2+ is a cation including a fluorine atom.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

52.

ANTITHROMBOTIC COATING MATERIAL, MEDICAL DEVICE, RESEARCH INSTRUMENT, METHOD FOR PRODUCING MEDICAL DEVICE AND RESEARCH INSTRUMENT, AND ADSORPTION SUPPRESSION METHOD

      
Application Number JP2025039539
Publication Number 2026/105756
Status In Force
Filing Date 2025-11-11
Publication Date 2026-05-21
Owner
  • JSR CORPORATION (Japan)
  • KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (Japan)
Inventor
  • Yasuike, Nobuo
  • Nishimura, Tatsuya
  • Kurita, Shin-Ya
  • Nakazato, Takumi
  • Okada, Takashi
  • Miyaji, Masaaki
  • Tanaka, Masaru
  • Anada, Takahisa

Abstract

This antithrombotic coating material contains an addition polymer having a partial structure represented by formula (1), and at least one of an oxiranyl group and an oxetanyl group. In formula (1), R1is an alkanediyl group. n1 is 0 or 1. n2 is an integer of 0 to 3. R2is an alkyl group when n2 is 0, and is a hydrogen atom or an alkyl group when n2 is 1 to 3. In formula (1), the sum of the number of carbon atoms in (n2) units of R1and the number of carbon atoms in R2 is 1 to 12.

IPC Classes  ?

  • A61L 27/34 - Macromolecular materials
  • A61L 15/26 - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bondsDerivatives thereof
  • A61L 17/14 - Post-treatment to improve physical properties
  • A61L 27/44 - Composite materials, i.e. layered or containing one material dispersed in a matrix of the same or different material having a macromolecular matrix
  • A61L 29/08 - Materials for coatings
  • A61L 29/12 - Composite materials, i.e. layered or containing one material dispersed in a matrix of the same or different material
  • A61L 31/10 - Macromolecular materials
  • A61L 31/12 - Composite materials, i.e. layered or containing one material dispersed in a matrix of the same or different material
  • A61L 33/06 - Use of macromolecular materials
  • C09D 7/63 - Additives non-macromolecular organic
  • C09D 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
  • C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
  • C09D 201/06 - Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups containing oxygen atoms

53.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, AND COMPOUND

      
Application Number JP2025034716
Publication Number 2026/100258
Status In Force
Filing Date 2025-09-30
Publication Date 2026-05-15
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Abe, Yudai
  • Egawa, Fuyuki
  • Otsuka, Noboru

Abstract

The purpose of the present invention is to provide: a radiation-sensitive composition capable of exhibiting sufficient levels of sensitivity, exposure margin, depth of focus, pattern rectangularity, development defect performance, CDU, and pattern circularity during resist pattern formation; a pattern formation method; and a compound. This radiation-sensitive composition contains a compound (A) represented by formula (A1) indicated below, at least one polymer (B) selected from the group consisting of a polymer (B2) including a structural unit (I) with an acid-dissociable group and a polymer (B1) including a structural unit (II) with a phenolic hydroxyl group, and a solvent (E).

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/39 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing halogen atoms bound to the carbon skeleton
  • C07C 309/58 - Carboxylic acid groups or esters thereof
  • C07C 309/59 - Nitrogen analogues of carboxyl groups
  • C07C 381/12 - Sulfonium compounds
  • C07D 211/44 - Oxygen atoms attached in position 4
  • C07D 235/18 - BenzimidazolesHydrogenated benzimidazoles with aryl radicals directly attached in position 2
  • C07D 327/06 - Six-membered rings
  • C07D 333/16 - Radicals substituted by singly bound hetero atoms other than halogen by oxygen atoms
  • C07D 333/56 - Radicals substituted by oxygen atoms
  • C07D 333/76 - Dibenzothiophenes
  • C07D 401/14 - Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing three or more hetero rings
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

54.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, AND COMPOUND

      
Application Number JP2025034719
Publication Number 2026/100259
Status In Force
Filing Date 2025-09-30
Publication Date 2026-05-15
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Abe, Yudai
  • Tanaka, Yoshikazu
  • Otsuka, Noboru

Abstract

The purpose of the present invention is to provide a radiation-sensitive composition that makes it possible to achieve a sufficient level of storage stability and sufficient levels of sensitivity, exposure margin, depth of focus, pattern rectangularity, development defect performance, CDU, and pattern circularity during resist pattern formation, a pattern formation method, and a compound. A radiation-sensitive composition according to the present invention contains a polymer (A), a first radiation-sensitive acid generator (B) that is represented by formula (1), a second radiation-sensitive acid generator (C) that generates sulfonic acid (excluding anything that corresponds to the first radiation-sensitive acid generator (B)), and a solvent (E).

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 309/39 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing halogen atoms bound to the carbon skeleton
  • C07C 309/58 - Carboxylic acid groups or esters thereof
  • C07C 309/59 - Nitrogen analogues of carboxyl groups
  • C07C 317/14 - SulfonesSulfoxides having sulfone or sulfoxide groups bound to carbon atoms of six-membered aromatic rings
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

55.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMING METHOD, POLYMER, AND ONIUM SALT

      
Application Number JP2025035693
Publication Number 2026/100282
Status In Force
Filing Date 2025-10-08
Publication Date 2026-05-15
Owner JSR CORPORATION (Japan)
Inventor
  • Egawa, Fuyuki
  • Nemoto, Ryuichi
  • Abe, Yudai

Abstract

11 -is S-or O-2311 -233. Z+ is an organic cation. Each * is a bond to another atom in the onium salt. However, the onium salt contains one or more polymerizable groups in a portion other than the partial structure.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 381/04 - Thiosulfonates
  • C07C 381/12 - Sulfonium compounds
  • C07D 317/08 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3
  • C07D 327/06 - Six-membered rings
  • C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
  • C07D 333/76 - Dibenzothiophenes
  • C08F 12/30 - Sulfur
  • C08F 20/38 - Esters containing sulfur
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

56.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMING METHOD, ONIUM SALT COMPOUND, AND POLYMER

      
Application Number JP2025038569
Publication Number 2026/100524
Status In Force
Filing Date 2025-11-04
Publication Date 2026-05-15
Owner JSR CORPORATION (Japan)
Inventor
  • Yamakawa, Shouya
  • Okude, Ryo
  • Higo, Ryouta
  • Dairokuno, Shota
  • Egawa, Fuyuki
  • Okumura, Takeshi
  • Kuriki, Ryunosuke

Abstract

Provided are: a radiation-sensitive composition that can exhibit sensitivity, LWR, and a process window at sufficient levels, during formation of a resist pattern; a pattern forming method; an onium salt compound; and a polymer. The radiation-sensitive composition comprises: a polymer containing a structural unit (I) derived from an onium salt compound represented by formula (1); and a solvent. (In the formula, W is a cyclic structure configured together with two carbon atoms. The bond between carbon atoms, represented by the formula below, represents a single bond or a double bond. A is a group represented by any of formula (A-1) to formula (A-7). (In the formulae, RA1and RA2are each a monovalent organic group having 1-20 carbon atoms). R1is a monovalent organic group having 1-20 carbon atoms, a cyano group, a nitro group, a carboxy group, a hydroxy group, an amino group, a halogen atom, or a thiol group. Z+is a monovalent radiation-sensitive onium cation. However, RA1, RA2, R1or Z+ contains a polymerizable group).

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/12 - Esters of monohydric alcohols or phenols
  • C08F 220/38 - Esters containing sulfur
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

57.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, RADIATION-SENSITIVE ACID GENERATOR, AND COMPOUND

      
Application Number JP2025035668
Publication Number 2026/100281
Status In Force
Filing Date 2025-10-08
Publication Date 2026-05-15
Owner JSR CORPORATION (Japan)
Inventor
  • Egawa, Fuyuki
  • Nemoto, Ryuichi

Abstract

11 −is S−or O−2311 −233. Z+ is an organic cation. Each * is a bond to another atom in the onium salt.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 381/04 - Thiosulfonates
  • C07C 381/12 - Sulfonium compounds
  • C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
  • C07D 327/04 - Five-membered rings
  • C07D 327/06 - Six-membered rings
  • C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
  • C07D 497/10 - Spiro-condensed systems
  • C08F 2/06 - Organic solvent
  • C08F 4/04 - Azo-compounds
  • C08F 20/10 - Esters
  • C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

58.

DECORATIVE FILM, ELECTRONIC MEMBER, AND TOUCH PAD

      
Application Number JP2025039268
Publication Number 2026/100726
Status In Force
Filing Date 2025-11-10
Publication Date 2026-05-15
Owner JSR CORPORATION (Japan)
Inventor
  • Kishida, Hiroyuki
  • Inagaki, Katsutoshi
  • Sugimoto, Yuta

Abstract

80(90)50(90)50(90)80(90)130(50)90(50)90(50)130(50)130(50) is 0.03 to 0.85.

IPC Classes  ?

  • C08J 5/18 - Manufacture of films or sheets
  • B32B 7/023 - Optical properties
  • G02B 5/26 - Reflecting filters
  • G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

59.

RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN, AND ONIUM SALT

      
Application Number 19441079
Status Pending
Filing Date 2026-01-06
First Publication Date 2026-05-14
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Abe, Yudai
  • Nishii, Atsuto
  • Mita, Michihiro
  • Inami, Hajime
  • Egawa, Fuyuki

Abstract

A radiation-sensitive composition includes: an onium salt represented by formula (1); a polymer including a structural unit (I) which includes an acid-dissociable group; and a solvent. Ar1 is an (a1+b1+1)-valent aromatic ring, Ar2 is an (a2+b2+1)-valent aromatic ring, X1 and X2 are each independently a monovalent organic group having 1 to 20 carbon atoms, a cyano group, a nitro group, or a halogen atom, Y1 is a monovalent organic group having 4 to 20 carbon atoms bonded to Ar1 through —O—, —S—, or —SO2—, or a monovalent perfluoroalkyl group having 1 to 20 carbon atoms, and Y2 is a monovalent organic group having 4 to 20 carbon atoms bonded to Ar2 through —O—, —S—, or —SO2—, or a monovalent perfluoroalkyl group having 1 to 20 carbon atoms. A radiation-sensitive composition includes: an onium salt represented by formula (1); a polymer including a structural unit (I) which includes an acid-dissociable group; and a solvent. Ar1 is an (a1+b1+1)-valent aromatic ring, Ar2 is an (a2+b2+1)-valent aromatic ring, X1 and X2 are each independently a monovalent organic group having 1 to 20 carbon atoms, a cyano group, a nitro group, or a halogen atom, Y1 is a monovalent organic group having 4 to 20 carbon atoms bonded to Ar1 through —O—, —S—, or —SO2—, or a monovalent perfluoroalkyl group having 1 to 20 carbon atoms, and Y2 is a monovalent organic group having 4 to 20 carbon atoms bonded to Ar2 through —O—, —S—, or —SO2—, or a monovalent perfluoroalkyl group having 1 to 20 carbon atoms.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/20 - ExposureApparatus therefor

60.

ANTIBODY AND USE THEREOF

      
Application Number 19119857
Status Pending
Filing Date 2023-10-12
First Publication Date 2026-05-14
Owner
  • JSR CORPORATION (Japan)
  • KYOTO UNIVERSITY (Japan)
Inventor
  • Ishikawa, Hidefumi
  • Kanahara, Masaaki
  • Mizuuchi, Motoaki
  • Yamaguchi, Tetsuji
  • Matsuzawa, Shuichi

Abstract

An antibody or a fragment thereof, in which complementarity determining regions (CDR-H1 to CDR-H3) of a heavy chain variable region (VH region) include each of amino acid sequences set forth in SEQ ID NOs: 1 to 3, and complementarity determining regions (CDR-L1 to CDR-L3) of a light chain variable region (VL region) include each of amino acid sequences set forth in SEQ ID NOs: 4 to 6.

IPC Classes  ?

  • C07K 16/40 - Immunoglobulins, e.g. monoclonal or polyclonal antibodies against enzymes
  • A61K 39/00 - Medicinal preparations containing antigens or antibodies
  • A61P 35/00 - Antineoplastic agents

61.

RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMER, AND METHOD FOR PRODUCING THE POLYMER, AND COMPOUND

      
Application Number 19440863
Status Pending
Filing Date 2026-01-06
First Publication Date 2026-05-14
Owner JSR CORPORATION (Japan)
Inventor
  • Shiratani, Motohiro
  • Motoyama, Kazuki
  • Rozhanskii, Igor
  • Nishikori, Katsuaki
  • Miyata, Hiromu
  • Abe, Shin-Ya

Abstract

A radiation-sensitive composition includes a polymer represented by formula (1). Each of A1 and A2 independently represents a group represented by formula (a-1), (a-2), (a-3), or (a-4). Each of R3, R4, and R5 independently represents a monovalent hydrocarbon group; *1 represents a chemical bond to P1 or P2; and * represents a chemical bond; B1 represents a divalent group comprising a partial structure that can cleave the bond between A1 and A2 via B1 by an action of acid; and each of P1 and P2 independently represents a molecular chain. A radiation-sensitive composition includes a polymer represented by formula (1). Each of A1 and A2 independently represents a group represented by formula (a-1), (a-2), (a-3), or (a-4). Each of R3, R4, and R5 independently represents a monovalent hydrocarbon group; *1 represents a chemical bond to P1 or P2; and * represents a chemical bond; B1 represents a divalent group comprising a partial structure that can cleave the bond between A1 and A2 via B1 by an action of acid; and each of P1 and P2 independently represents a molecular chain.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 293/00 - Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule

62.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND UNDERLAYER FILM-FORMING COMPOSITION

      
Application Number 19443419
Status Pending
Filing Date 2026-01-08
First Publication Date 2026-05-14
Owner JSR CORPORATION (Japan)
Inventor
  • Serizawa, Ryuichi
  • Yamada, Shuhei
  • Ozaki, Yuki
  • Kimata, Hironori

Abstract

A method for manufacturing a semiconductor substrate includes: applying an underlayer film-forming composition directly or indirectly to a substrate to form an underlayer film; forming a metal-containing resist film from a metal-containing resist forming material on the underlayer film; exposing the metal-containing resist film to extreme ultraviolet rays; and developing the exposed metal-containing resist film. The underlayer film-forming composition includes: a metal compound including at least a metal atom and an organic acid; and a solvent.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • G03F 7/16 - Coating processesApparatus therefor
  • H10P 76/20 -
  • H10P 76/40 -

63.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, AND COMPOUND

      
Application Number JP2025034710
Publication Number 2026/094518
Status In Force
Filing Date 2025-09-30
Publication Date 2026-05-07
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Abe, Yudai
  • Nagano, Masahiro

Abstract

Provided are a radiation-sensitive composition that can exhibit, at sufficient levels when forming a pattern, sensitivity, CDU, LWR, MEEF, EL, development defect suppression properties, pattern circularity, pattern rectangularity, and DOF; a pattern formation method; and a compound. This radiation-sensitive composition comprises a compound represented by formula (1), a polymer including a structural unit (I) having an acid-dissociable group, and a solvent. (In the formula, W represents a substituted or unsubstituted ring structure including an acetal structure. L represents a substituted or unsubstituted divalent hydrocarbon group having 1-5 carbon atoms, or a group including a divalent heteroatom-containing group between carbon-carbon in said hydrocarbon group. R1222Ra22Rb, -CORc, or a monovalent organic group (a). Z+gg +each represent a monovalent organic cation. Lgrepresents a single bond, a divalent heteroatom-containing group, or a divalent organic group having 1-20 carbon atoms. A-represents -COO-33 -.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 381/12 - Sulfonium compounds
  • C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
  • C07D 317/24 - Radicals substituted by singly bound oxygen or sulfur atoms esterified
  • C07D 317/30 - Radicals substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
  • C07D 321/10 - Seven-membered rings condensed with carbocyclic rings or ring systems
  • C07D 327/06 - Six-membered rings
  • C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
  • C07D 333/46 - Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings substituted on the ring sulfur atom
  • C07D 333/54 - Benzo [b] thiophenesHydrogenated benzo [b] thiophenes with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to carbon atoms of the hetero ring
  • C07D 333/76 - Dibenzothiophenes
  • C07D 335/02 - Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings
  • C07D 407/04 - Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group containing two hetero rings directly linked by a ring-member-to-ring- member bond
  • C07D 493/10 - Spiro-condensed systems
  • C07D 497/10 - Spiro-condensed systems
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

64.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, ONIUM SALT COMPOUND, AND POLYMER

      
Application Number JP2025034972
Publication Number 2026/094536
Status In Force
Filing Date 2025-10-01
Publication Date 2026-05-07
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori, Katsuaki
  • Taniguchi, Takuhiro

Abstract

The purpose of the present invention is to provide a radiation-sensitive composition, pattern formation method, onium salt compound, and polymer that, during pattern formation, can exhibit a sensitivity, CDU, underexposure CDU, and number of development defects at levels equal to or better than conventional levels. The radiation-sensitive composition comprises a solvent (E) and a polymer (A) that contains a structural unit (I) having an acid-dissociable group. The radiation-sensitive composition contains an onium salt compound (P) having an onium cation represented by formula (1) and a prescribed monovalent anion, or the polymer (A) contains a structural unit (II) containing an acid-generating structure that generates an acid upon exposure and has an onium cation represented by formula (1) and an organic acid anion.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 43/225 - Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring containing halogen
  • C07C 69/76 - Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a six-membered aromatic ring
  • C07C 317/14 - SulfonesSulfoxides having sulfone or sulfoxide groups bound to carbon atoms of six-membered aromatic rings
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

65.

ACTIVE DIRECT DRIVING OF PIXELS IN DISPLAY, SIGNALING AND DIGITAL SIGNAGE DEVICES

      
Application Number US2025052651
Publication Number 2026/096367
Status In Force
Filing Date 2025-10-27
Publication Date 2026-05-07
Owner
  • MATTRIX TECHNOLOGIES, INC. (USA)
  • JSR CORPORATION (Japan)
Inventor
  • Katsui, Hiromitsu
  • Chen, Xiao
  • Liu, Bo
  • Vasilyeva, Svetlana Viktorovna
  • Lemaitre, Maxime Gregory

Abstract

Various examples are provided related to active direct driving of pixels. In one example, an active direct driving matrix device includes VOLET pixels arranged to form an emissive display; bus lines including at least one VDD line routed along edges of the VOLET pixels and VDATA lines routed under the VOLET pixels, each VOLET pixel connected to a corresponding VDATA line of the VDATA lines. In another example, a method of fabricating an active direct driving matrix device includes forming a first layer of VDATA lines over a substrate; depositing a first insulating layer over the first layer of VDATA lines; forming a second layer of VDATA lines over the first insulating layer; depositing a second insulating layer over the second layer of VDATA lines; and forming VOLET pixels over the second insulating layer, each VOLET pixel electrically connected to a corresponding VDATA line.

IPC Classes  ?

  • G09G 3/3291 - Details of drivers for data electrodes in which the data driver supplies a variable data voltage for setting the current through, or the voltage across, the light-emitting elements
  • H10K 50/30 - Organic light-emitting transistors
  • H10K 59/35 - Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
  • H05B 44/00 - Circuit arrangements for operating electroluminescent light sources

66.

RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMING METHOD, RADIATION-SENSITIVE ACID GENERATOR, AND COMPOUND

      
Application Number JP2025033122
Publication Number 2026/088669
Status In Force
Filing Date 2025-09-19
Publication Date 2026-04-30
Owner JSR CORPORATION (Japan)
Inventor
  • Taniguchi, Takuhiro
  • Egawa, Fuyuki

Abstract

Provided is a radiation-sensitive composition comprising a polymer (P) which contains a structural unit having an acid-dissociable group, wherein the composition satisfies at least one of a first requirement and a second requirement. First requirement: The polymer (P) further comprises a structural unit derived from an onium salt compound represented by formula (1). Second requirement: The composition further comprises an onium salt compound represented by formula (1). In formula (1), A1is -OH, -COOH, -NHCOR7, -CONHR722R722NHR733H. J+ is a radiation-sensitive cation.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 309/24 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of a carbon skeleton containing six-membered aromatic rings
  • C07C 309/43 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing singly-bound oxygen atoms bound to the carbon skeleton having at least one of the sulfo groups bound to a carbon atom of a six-membered aromatic ring being part of a condensed ring system
  • C07C 309/44 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing doubly-bound oxygen atoms bound to the carbon skeleton
  • C07C 309/47 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing nitrogen atoms, not being part of nitro or nitroso groups, bound to the carbon skeleton having at least one of the sulfo groups bound to a carbon atom of a six-membered aromatic ring being part of a condensed ring system
  • C07C 309/58 - Carboxylic acid groups or esters thereof
  • C07C 309/59 - Nitrogen analogues of carboxyl groups
  • C07C 311/21 - Sulfonamides having sulfur atoms of sulfonamide groups bound to carbon atoms of six-membered aromatic rings having the nitrogen atom of at least one of the sulfonamide groups bound to a carbon atom of a six-membered aromatic ring
  • C07C 381/12 - Sulfonium compounds
  • C07D 327/06 - Six-membered rings
  • C07D 333/46 - Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings substituted on the ring sulfur atom
  • C07D 333/76 - Dibenzothiophenes
  • C07D 335/02 - Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings
  • C08F 220/38 - Esters containing sulfur
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

67.

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number JP2025036501
Publication Number 2026/088855
Status In Force
Filing Date 2025-10-16
Publication Date 2026-04-30
Owner JSR CORPORATION (Japan)
Inventor
  • Sakai, Kazunori
  • Tsuji, Takashi
  • Takada, Kazuya
  • Dobashi, Masato
  • Ohtagaki, Yasuhiro

Abstract

The present invention provides: a composition for forming a resist underlayer film, with which it is possible to form a resist underlayer film that has excellent resist pattern rectangularity; and a method for manufacturing a semiconductor substrate. This composition for forming a resist underlayer film contains a polymer that has a repeating unit represented by formula (1), and a solvent. (In formula (1), Y represents a (2 + k)-valent organic group having 1 to 20 carbon atoms. X0represents a monovalent organic group having 1 to 40 carbon atoms. k represents an integer of 1 to 5. In cases where k is 2 or more, a plurality of X0moieties may be the same as or different from each other. At least two partial structures represented by formula (a) are included in the k X0. In formula (a), R1represents a monovalent organic group having 1 to 20 carbon atoms, and * represents a bond with the other part of X0.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C08F 220/12 - Esters of monohydric alcohols or phenols
  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/095 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer

68.

COMPOSITION FOR SEMICONDUCTOR PROCESSING AND PROCESSING METHOD

      
Application Number JP2025035620
Publication Number 2026/088774
Status In Force
Filing Date 2025-10-07
Publication Date 2026-04-30
Owner JSR CORPORATION (Japan)
Inventor
  • Ting, Hao Chun
  • Mori, Kosuke
  • Tano, Hiroyuki

Abstract

ABABB is 1.0 × 103to 1.0 × 106. (1): R1OR2OH (2): HCOOH (In the formula (1), R1represents a monovalent organic group, and R2 represents a divalent organic group.)

IPC Classes  ?

  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • C11D 7/26 - Organic compounds containing oxygen
  • C11D 7/32 - Organic compounds containing nitrogen

69.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, ONIUM SALT COMPOUND, AND POLYMER

      
Application Number JP2025033471
Publication Number 2026/083767
Status In Force
Filing Date 2025-09-24
Publication Date 2026-04-23
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori, Katsuaki
  • Nakagawa, Atsushi
  • Esaki, Fumiya

Abstract

Provided are a radiation-sensitive composition and the like that make it possible to achieve excellent sensitivity, excellent CDU, and an excellent minimum CD during pattern formation. A radiation-sensitive composition according to the present invention contains: a polymer that includes a structural unit (I) that has an acid-dissociable group; and a solvent. At least: the radiation-sensitive composition contains an onium salt compound (1) that includes a partial structure (a) represented by formula (a) and produces an acid when exposed to light; or the polymer includes a partial structure (a) represented by formula (a). (In the formula, R1is an acid dissociable group, L1is a divalent linear organic group, Ar is a C3–20 aromatic ring, L2is a single bond or a (y+2)-valent organic group, W-33 -or -COO-, Z+is a monovalent onium cation, n1+n2≥1, x and y are 0 or 1, and when L2 is a single bond, y is 0, and, in the partial structure (a) of the polymer, x+y is 1 or 2.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 69/92 - Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a six-membered aromatic ring of monocyclic hydroxy carboxylic acids, the hydroxy groups and the carboxyl groups of which are bound to carbon atoms of a six-membered aromatic ring with etherified hydroxyl groups
  • C07C 69/712 - Ethers the hydroxy group of the ester being etherified with a hydroxy compound having the hydroxy group bound to a carbon atom of a six-membered aromatic ring
  • C07C 233/54 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by carboxyl groups with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by a carbon atom of a six-membered aromatic ring having the carbon atom of the carboxamide group bound to a hydrogen atom or to a carbon atom of a saturated carbon skeleton
  • C07C 233/56 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having carbon atoms of carboxamide groups bound to carbon atoms of carboxyl groups, e.g. oxamides
  • C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
  • C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 317/22 - Radicals substituted by singly bound oxygen or sulfur atoms etherified
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • C07D 407/04 - Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group containing two hetero rings directly linked by a ring-member-to-ring- member bond
  • C07D 409/04 - Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings directly linked by a ring-member-to-ring- member bond
  • C08F 246/00 - Copolymers in which the nature of only the monomers in minority is defined
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

70.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, POLYMER, AND COMPOUND

      
Application Number JP2025034474
Publication Number 2026/083795
Status In Force
Filing Date 2025-09-29
Publication Date 2026-04-23
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Kashishita, Kouji

Abstract

Provided are: a radiation-sensitive composition which can exhibit sensitivity, CDU, development defect suppression properties, EL, LWR, MEEF, and pattern squareness to a sufficient level at the time of pattern formation; a pattern formation method; and a compound. The radiation-sensitive composition contains: a polymer that includes a structural unit (I) derived from a compound represented by formula (1) and a structural unit (II) having an acid-dissociable group; and a solvent. In the formula, A is a polymerizable group-containing monovalent organic group having 2-40 carbon atoms. R1and R2222Ra22Rb, -CORc22Ra22Rb, -CORc33. However, when R1is -F, R2bonded to a carbon atom to which R1is bonded is a group other than -F. At least one selected from the group consisting of R1and R2is a group other than a hydrogen atom. Z+ is a monovalent organic cation.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 327/06 - Six-membered rings
  • C07D 333/54 - Benzo [b] thiophenesHydrogenated benzo [b] thiophenes with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to carbon atoms of the hetero ring
  • C07D 333/76 - Dibenzothiophenes
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/38 - Esters containing sulfur
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

71.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, POLYMER, AND COMPOUND

      
Application Number JP2025034505
Publication Number 2026/083797
Status In Force
Filing Date 2025-09-29
Publication Date 2026-04-23
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Kashishita, Kouji

Abstract

The present invention provides: a radiation-sensitive composition capable of exhibiting sensitivity, CDU, development defect suppressibility, EL, LWR, MEEF, and pattern circularity at sufficient levels during pattern formation while reducing the amount of fluorine in a polymer; a pattern forming method; and a compound. This radiation-sensitive composition contains: a polymer including a structural unit (I) derived from a compound represented by formula (1); a structural unit (II) having an acid-dissociable group; and a solvent. (In the formula, A is a 1-40C monovalent organic group. R1and R2222Ra22Rb, -CORc, or a 1-20C monovalent organic group (a) other than these groups. When R1is -F, R2bonded to the carbon atom to which R1is bonded is a group other than -F. At least one selected from the group consisting of R1and R2is a group other than hydrogen atoms. Z+ is a monovalent organic cation containing a polymerizable group).

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/07 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton
  • C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/38 - Esters containing sulfur
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

72.

COMPOSITION FOR FORMING NITROGEN-CONTAINING FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number JP2025036118
Publication Number 2026/083948
Status In Force
Filing Date 2025-10-14
Publication Date 2026-04-23
Owner JSR CORPORATION (Japan)
Inventor
  • Yamada, Shuhei
  • Yoneda, Eiji
  • Hirasawa, Kengo

Abstract

Provided are a composition for forming a nitrogen-containing film with which a nitrogen-containing film having excellent heat resistance and embeddability can be formed, and a method for manufacturing a semiconductor substrate. This composition for forming a nitrogen-containing film contains a nitrogen-containing compound and a solvent. The nitrogen-containing compound is a compound represented by formula (A0) or formula (A1), or a polymer having a repeating unit represented by formula (A2) or formula (A3). (In the formulas, each X is independently -O-, -S-, or -NR'-. R' is a hydrogen atom or a monovalent hydrocarbon group having 1-20 carbon atoms. Raand Rbare each independently a monovalent organic group having 1-40 carbon atoms. Each Ar1 is independently a substituted or unsubstituted aromatic ring having 3-40 carbon atoms.)

IPC Classes  ?

  • H01L 21/312 - Organic layers, e.g. photoresist
  • C08G 8/04 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes
  • C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
  • G03F 7/20 - ExposureApparatus therefor

73.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMING METHOD, POLYMER, AND COMPOUND

      
Application Number JP2025034023
Publication Number 2026/083780
Status In Force
Filing Date 2025-09-26
Publication Date 2026-04-23
Owner JSR CORPORATION (Japan)
Inventor
  • Nemoto, Ryuichi
  • Terada, Nozomi

Abstract

Provided are a radiation-sensitive composition, a pattern forming method, a polymer, and a compound which are excellent in terms of sensitivity, CDU, LWR, MEEF, development defect suppression, and pattern rectangularity during pattern formation. The radiation-sensitive composition contains a polymer including a structural unit (I) derived from a compound represented by formula (1), and a solvent. (In formula (1), R1is a C1-C40 monovalent organic group. Here, when A-33 -, R1is a C3-C40 monovalent organic group including a cyclic structure. A-33 -, -COO-, or –N-22-RX. RXis a C1-C20 monovalent organic group. R2is a hydrogen atom or a C1-C20 monovalent organic group. R3is hydroxy or a C1-C20 monovalent organic group. Here, any one of R1-R6 has one polymerizable group.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
  • C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 307/33 - Oxygen atoms in position 2, the oxygen atom being in its keto or unsubstituted enol form
  • C07D 307/93 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom ortho- or peri-condensed with carbocyclic rings or ring systems condensed with a ring other than six-membered
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/38 - Esters containing sulfur
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

74.

RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN, AND RADIATION-SENSITIVE ACID GENERATOR

      
Application Number 19422540
Status Pending
Filing Date 2025-12-17
First Publication Date 2026-04-16
Owner JSR CORPORATION (Japan)
Inventor
  • Nishikori, Katsuaki
  • Taniguchi, Takuhiro
  • Kiriyama, Kazuya

Abstract

A radiation-sensitive composition includes: a polymer (A) including a structural unit (I) which includes an acid-dissociable group; and a solvent (C). The radiation-sensitive composition satisfies (i) and/or (ii). (i) The radiation-sensitive composition includes a radiation-sensitive acid generator (B) including a first organic acid anion and a first onium cation. The first onium cation is an onium cation including a halogen-free electron withdrawing group containing no halogen atom, and the first organic acid anion is a sulfonic acid anion including an iodine atom. (ii) The polymer (A) is a radiation-sensitive acid-generating polymer (A1) further including a structural unit (IV) which includes a second organic acid anion and a second onium cation. The second onium cation is an onium cation including a halogen-free electron withdrawing group containing no halogen atom, and the second organic acid anion is a sulfonic acid anion including an iodine atom.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/004 - Photosensitive materials

75.

RADIATION-SENSITIVE COMPOSITION AND PATTERN FORMING METHOD

      
Application Number 19422570
Status Pending
Filing Date 2025-12-17
First Publication Date 2026-04-16
Owner JSR CORPORATION (Japan)
Inventor
  • Kiriyama, Kazuya
  • Omiya, Takuya

Abstract

A radiation-sensitive composition includes: a polymer including a structural unit which includes an acid-dissociable group; a radiation-sensitive acid generator including a first organic acid anion and a first onium cation; an acid diffusion controlling agent which includes a second organic acid anion and a second onium cation and capable of generating an acid having a pKa higher than a pKa of an acid to be generated from the radiation-sensitive acid generator by irradiation with radiation; and a solvent. The first organic acid anion includes an acid anion moiety and an aromatic ring including a first substituent and a second substituent. The first substituent and the second substituent are each independently a hydroxy group, a sulfo group, or a sulfanyl group. At least one selected from the group consisting of the polymer, the radiation-sensitive acid generator, and the acid diffusion controlling agent includes an iodo group.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

76.

RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, AND COMPOUND

      
Application Number JP2025033123
Publication Number 2026/079103
Status In Force
Filing Date 2025-09-19
Publication Date 2026-04-16
Owner JSR CORPORATION (Japan)
Inventor
  • Taniguchi, Takuhiro
  • Kishida, Takanori
  • Shiratani, Motohiro
  • Yamakawa, Shoya

Abstract

This radiation-sensitive composition contains a polymer having an acid-dissociable group, and satisfies at least one of a first requirement and a second requirement. First requirement: a compound represented by formula (1) is additionally incorporated. Second requirement: the polymer contains a structural unit derived from a compound represented by formula (1). In formula (1), Ar1is a group yielded by removing (r + s + t +1) hydrogen atoms from an aromatic ring. Ar2is a group yielded by removing (k + 1) hydrogen atoms from an aromatic ring. X12222-O-. R1is a monovalent organic group or a hydrogen atom. Y1is a monovalent group different from the iodo group and -X1-R1.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
  • C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 291/06 - Six-membered rings
  • C07D 307/33 - Oxygen atoms in position 2, the oxygen atom being in its keto or unsubstituted enol form
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • C07D 321/10 - Seven-membered rings condensed with carbocyclic rings or ring systems
  • C07D 333/76 - Dibenzothiophenes
  • C07D 409/12 - Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings linked by a chain containing hetero atoms as chain links
  • C08F 20/10 - Esters
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

77.

METHOD FOR PRODUCING ABRASIVE GRAINS, COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, AND POLISHING METHOD

      
Application Number JP2025033836
Publication Number 2026/079146
Status In Force
Filing Date 2025-09-25
Publication Date 2026-04-16
Owner JSR CORPORATION (Japan)
Inventor
  • Fukuyo, Tsubasa
  • Nishimura, Kouhei
  • Kamei, Yasutaka

Abstract

33 -M+(2): -COO-M+In formulae (1) and (2), M+ represents a monovalent cation.

IPC Classes  ?

  • C09K 3/14 - Anti-slip materialsAbrasives
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

78.

RADIATION-SENSITIVE COMPOSITION, PATTERN-FORMING METHOD, COMPOUND, METHOD FOR PRODUCING COMPOUND, AND POLYMER

      
Application Number JP2025033332
Publication Number 2026/079112
Status In Force
Filing Date 2025-09-22
Publication Date 2026-04-16
Owner JSR CORPORATION (Japan)
Inventor
  • Yamakawa, Shouya
  • Taniguchi, Takuhiro
  • Nishikori, Katsuaki

Abstract

Provided is, inter alia, a radiation-sensitive composition that, during pattern formation, is capable of exhibiting sensitivity, LWR, and development defect suppression performance at levels equal to or higher than those of conventional compositions. A radiation-sensitive composition according to the present invention contains: a polymer including a structural unit (I) represented by formula (1); and a solvent. (R1, L2, and Ar in the formula satisfy (A1) or (A2): (A1) R1is a hydrogen atom, a halogen atom, or a C1-20 monovalent organic group, L2is a single bond or a divalent linking group, and Ar is a substituted or unsubstituted monovalent aromatic group having an iodo group; or (A2) R1and Ar combine together to form a divalent alicyclic group, the alicyclic group forming a condensed ring with a divalent aromatic group that has an iodo group and is represented by Ar. R4is a cyano group, a nitro group, *-CO-R41, or a cyclic group containing -CO- as part of the ring structure. R41is a monovalent organic group. However, if R4is a cyano group, a nitro group, or *-CO-R41, n is 1 or more.)

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 220/10 - Esters

79.

PRODUCTION METHOD FOR ABRASIVE GRAIN, COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, AND POLISHING METHOD

      
Application Number JP2025033835
Publication Number 2026/079145
Status In Force
Filing Date 2025-09-25
Publication Date 2026-04-16
Owner JSR CORPORATION (Japan)
Inventor
  • Fukuyo, Tsubasa
  • Nishimura, Kouhei
  • Kamei, Yasutaka

Abstract

Provided are: a composition for chemical mechanical polishing, the composition making it possible to polish a silicon oxide film at high speed and to suppress occurrences of polishing defects during the polishing of the silicon oxide film, and having excellent polishing properties after storage; and a polishing method using the composition. Also provided is a production method for abrasive grains that can be used in the composition for chemical mechanical polishing. This production method for abrasive grains includes: step (a) for heating a mixture containing particles having hydroxyl groups (-OH) immobilized to the surface thereof via covalent bonds and an alkoxysilane (A) having an epoxy group; step (b) for adding a basic compound to the mixture and heating the same after step (a); and step (c) for adding, to the mixture, a hydroxysilane (C) having an organic group having two or more hydroxyl groups (-OH) and heating the same after step (b).

IPC Classes  ?

  • C09K 3/14 - Anti-slip materialsAbrasives
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting

80.

POLYPROPYLENE-BASED RESIN EXPANDED BEAD, MOLDED ARTICLE OF POLYPROPYLENE-BASED RESIN EXPANDED BEADS, AUTOMOTIVE BUMPER CORE, AND AUTOMOTIVE TOOL BOX

      
Application Number 19347795
Status Pending
Filing Date 2025-10-02
First Publication Date 2026-04-09
Owner JSP CORPORATION (Japan)
Inventor Sakamura, Takumi

Abstract

An expanded bead has a foamed layer made of a polypropylene-based resin and a specific shape including one or more defective portions. The polypropylene-based resin constituting the foamed layer contains a polypropylene-based resin (A) having a melting point of 135° C. to 150° C. and a flexural modulus of less than 1000 MPa, and a polypropylene-based resin (B) having a melting point of 145° C. to 160° C. and a flexural modulus of 1000 MPa or more. The mass ratio between the resin (A) and the resin (B) in the polypropylene-based resin is represented by resin (A):resin (B)=65:35 to 35:65.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • B29B 9/06 - Making granules by dividing preformed material in the form of filamentary material, e.g. combined with extrusion
  • B29B 9/16 - Auxiliary treatment of granules
  • B29C 44/34 - Component parts, details or accessoriesAuxiliary operations
  • B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads
  • B29K 23/00 - Use of polyalkenes as moulding material
  • B29K 105/00 - Condition, form or state of moulded material
  • B29K 105/04 - Condition, form or state of moulded material cellular or porous
  • B29L 31/00 - Other particular articles
  • B29L 31/30 - Vehicles, e.g. ships or aircraft, or body parts thereof
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08J 9/228 - Forming foamed products
  • C08K 3/04 - Carbon
  • C08K 3/38 - Boron-containing compounds

81.

METHOD FOR PRODUCING POLYPROPYLENE-BASED RESIN FOAM PARTICLE, AND POLYPROPYLENE-BASED RESIN FOAM PARTICLE

      
Application Number JP2025034546
Publication Number 2026/075085
Status In Force
Filing Date 2025-09-29
Publication Date 2026-04-09
Owner JSP CORPORATION (Japan)
Inventor
  • Kitahara Taizo
  • Inoue Tsubasa

Abstract

Provided is a method for producing a polypropylene-based resin foam particle, with which it is possible to form a molded body having excellent in-mold moldability and excellent compression properties. In this method for producing a polypropylene-based resin foam particle, in which a foam particle is obtained by foaming a polypropylene-based resin particle, the polypropylene-based resin particle is constituted from a mixed resin obtained by kneading an impact polypropylene having a melt flow rate, as measured at a temperature of 230°C under a load of 2.16 kg, of more than 10 g/10 min and not more than 80 g/10 min and a polypropylene-based resin A having a melt flow rate, as measured at a temperature of 230°C under a load of 2.16 kg, of less than 3 g/10 min. In the polypropylene-based resin particle, the mass ratio of the impact polypropylene and the polypropylene-based resin A is such that impact polypropylene : polypropylene-based resin A =97:3 to 40:60.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent

82.

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION FOR FILM FORMATION

      
Application Number 19044924
Status Pending
Filing Date 2025-02-04
First Publication Date 2026-04-02
Owner JSR CORPORATION (Japan)
Inventor
  • Hirasawa, Kengo
  • Takada, Kazuya
  • Ozaki, Yuki
  • Kimata, Hironori
  • Serizawa, Ryuichi

Abstract

A method for manufacturing a semiconductor substrate includes applying a composition for film formation to a substrate. The composition includes: a metal compound; an aromatic compound including an aromatic hydrocarbon ring structure and a partial structure represented by formula (1); and a solvent. The aromatic hydrocarbon ring structure has 6 or more carbon atoms. X is a group represented by formula (i) (ii), (iii) or (iv). R1 is a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, and R2 is a monovalent organic group having 1 to 20 carbon atoms. R3 is a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, and R4 is a monovalent organic group having 1 to 20 carbon atoms. R5 is a monovalent organic group having 1 to 20 carbon atoms. R6 is a monovalent organic group having 1 to 20 carbon atoms. A method for manufacturing a semiconductor substrate includes applying a composition for film formation to a substrate. The composition includes: a metal compound; an aromatic compound including an aromatic hydrocarbon ring structure and a partial structure represented by formula (1); and a solvent. The aromatic hydrocarbon ring structure has 6 or more carbon atoms. X is a group represented by formula (i) (ii), (iii) or (iv). R1 is a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, and R2 is a monovalent organic group having 1 to 20 carbon atoms. R3 is a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, and R4 is a monovalent organic group having 1 to 20 carbon atoms. R5 is a monovalent organic group having 1 to 20 carbon atoms. R6 is a monovalent organic group having 1 to 20 carbon atoms.

IPC Classes  ?

  • G03F 7/09 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
  • H10P 76/20 -

83.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, AND ONIUM SALT COMPOUND

      
Application Number JP2025032661
Publication Number 2026/070533
Status In Force
Filing Date 2025-09-17
Publication Date 2026-04-02
Owner JSR CORPORATION (Japan)
Inventor
  • Kuriki, Ryunosuke
  • Taniguchi, Takuhiro
  • Terada, Nozomi
  • Nishikori, Katsuaki

Abstract

Provided is a radiation-sensitive composition or the like having excellent sensitivity, excellent CDU, and an excellent process window. This radiation-sensitive composition comprises: an onium salt compound represented by formula (1); a polymer that includes a structural unit having an acid-dissociable group; and a solvent. (In the formula, X represents a halogeno group. When X includes an iodo group, the iodo group is bound to the p-position of the COO-group in the formula. R1represents a hydrocarbon group, a group (α) having, between carbon-carbon in said group, a divalent heteroatom-containing group, or a group (β) obtained by substituting a hydrogen atom of said group (α) or said hydrocarbon group with a chloro group, a bromo group, an iodo group, a hydroxy group, a nitro group, an amino group, a carboxy group, or a cyano group. When h is 2 or more, the two R1s may be combined to form a ring structure having 5-20 member rings. R2represents a monovalent hydrocarbon group having 1-5 carbon atoms, a cyano group, a nitro group, or a hydroxy group. Z+ represents an organic cation including an aromatic ring substituted with an electron-withdrawing group.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 63/70 - Monocarboxylic acids
  • C07C 65/03 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing hydroxy or O-metal groups monocyclic and having all hydroxy or O-metal groups bound to the ring
  • C07C 65/21 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing ether groups, groups, groups, or groups
  • C07C 255/16 - Carboxylic acid nitriles having cyano groups bound to acyclic carbon atoms containing cyano groups and singly-bound oxygen atoms bound to the same carbon atom of an acyclic carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 303/23 - Oxiranylmethyl ethers of compounds having one hydroxy group bound to a six-membered aromatic ring, the oxiranylmethyl radical not being further substituted, i.e.
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

84.

POLYMER, COMPOSITION, CURED PRODUCT, LAMINATED BODY, AND ELECTRONIC COMPONENT

      
Application Number 19109248
Status Pending
Filing Date 2023-07-31
First Publication Date 2026-03-26
Owner JSR CORPORATION (Japan)
Inventor
  • Kawashima, Naoyuki
  • Satonaka, Eri
  • Anabuki, Shoma

Abstract

A polymer (A) includes a repeating structural unit represented by formula (1). R11 represents a divalent substituted or unsubstituted nitrogen-containing heteroaromatic ring; R12's independently represent a divalent substituted or unsubstituted aromatic hydrocarbon group; R13 represents a hydrocarbon group having 1 to 20 carbon atoms to which at least one group represented by formula (a1) is bonded in addition to two R12's; X1's independently represent —O—, —S—, or —N(R14)—; and R14 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, or a group in which the hydrocarbon group or the halogenated hydrocarbon group is partially substituted with an oxygen atom, a sulfur atom, or both. In formula (a1), * represents a linkage to the R13; ** represents a bond to another structural unit in the polymer (A). A polymer (A) includes a repeating structural unit represented by formula (1). R11 represents a divalent substituted or unsubstituted nitrogen-containing heteroaromatic ring; R12's independently represent a divalent substituted or unsubstituted aromatic hydrocarbon group; R13 represents a hydrocarbon group having 1 to 20 carbon atoms to which at least one group represented by formula (a1) is bonded in addition to two R12's; X1's independently represent —O—, —S—, or —N(R14)—; and R14 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, or a group in which the hydrocarbon group or the halogenated hydrocarbon group is partially substituted with an oxygen atom, a sulfur atom, or both. In formula (a1), * represents a linkage to the R13; ** represents a bond to another structural unit in the polymer (A).

IPC Classes  ?

  • C08G 65/40 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols and other compounds
  • B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
  • C08F 290/06 - Polymers provided for in subclass
  • C08K 5/13 - PhenolsPhenolates
  • C08K 5/14 - Peroxides

85.

COMPOSITION FOR RESIST UNDERLAYER FILM FORMATION, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR PRODUCING AROMATIC-RING-CONTAINING COMPOUND

      
Application Number JP2025032027
Publication Number 2026/063319
Status In Force
Filing Date 2025-09-10
Publication Date 2026-03-26
Owner JSR CORPORATION (Japan)
Inventor
  • Hirasawa,kengo
  • Oka,yuki

Abstract

22-.)

IPC Classes  ?

  • G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
  • C07D 307/88 - Benzo [c] furansHydrogenated benzo [c] furans with one oxygen atom directly attached in position 1 or 3
  • C07D 327/04 - Five-membered rings
  • C08G 8/02 - Condensation polymers of aldehydes or ketones with phenols only of ketones
  • G03F 7/20 - ExposureApparatus therefor
  • H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or

86.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMING METHOD, ONIUM SALT COMPOUND, AND POLYMER

      
Application Number JP2025032703
Publication Number 2026/063441
Status In Force
Filing Date 2025-09-17
Publication Date 2026-03-26
Owner JSR CORPORATION (Japan)
Inventor
  • Esaki, Fumiya
  • Shiratani, Motohiro
  • Ito, Ryo

Abstract

Provided is a radiation-sensitive composition or the like, which has satisfactory storage stability and can exhibit sensitivity, LWR, and Min CD at levels equal to or higher than conventional levels, at the time of pattern formation. The radiation-sensitive composition comprises a polymer containing a structural unit (I) having an acid-dissociable group, and a solvent, wherein the polymer has a partial structure (w) represented by formula (w1) or (w2), or the radiation-sensitive composition contains an onium salt compound having a partial structure (w) represented by formula (w1) or (w2). Formula 1 (At least one selected from the group consisting of R1, R2, and R3 is an iodine atom or a bromine atom. X is an iodine atom or a bromine atom.)

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 57/18 - Unsaturated compounds having carboxyl groups bound to acyclic carbon atoms with only carbon-to-carbon triple bonds as unsaturation
  • C07C 59/64 - Unsaturated compounds containing ether groups, groups, groups, or groups containing six-membered aromatic rings
  • C07C 65/28 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing ether groups, groups, groups, or groups having unsaturation outside the aromatic rings
  • C07C 69/36 - Oxalic acid esters
  • C07C 233/55 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by carboxyl groups with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by a carbon atom of a six-membered aromatic ring having the carbon atom of the carboxamide group bound to a carbon atom of an unsaturated carbon skeleton
  • C07C 235/06 - Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by oxygen atoms having carbon atoms of carboxamide groups bound to acyclic carbon atoms and singly-bound oxygen atoms bound to the same carbon skeleton the carbon skeleton being acyclic and saturated having the nitrogen atoms of the carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms
  • C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
  • C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 309/42 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing singly-bound oxygen atoms bound to the carbon skeleton having the sulfo groups bound to carbon atoms of non-condensed six-membered aromatic rings
  • C07C 381/12 - Sulfonium compounds
  • C07D 307/68 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • C07D 333/40 - Thiophene-2-carboxylic acid
  • C07D 407/04 - Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group containing two hetero rings directly linked by a ring-member-to-ring- member bond
  • C07D 409/04 - Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings directly linked by a ring-member-to-ring- member bond
  • C08F 212/02 - Monomers containing only one unsaturated aliphatic radical
  • C08F 220/10 - Esters
  • C09K 3/00 - Materials not provided for elsewhere
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

87.

METHOD FOR PRODUCING POROUS PARTICLES, AND METHOD FOR PRODUCING CARRIER FOR PURIFICATION OR ADSORPTION

      
Application Number JP2025032253
Publication Number 2026/063344
Status In Force
Filing Date 2025-09-12
Publication Date 2026-03-26
Owner JSR CORPORATION (Japan)
Inventor
  • Kikuchi, Masahiro
  • Kobayashi, Kunihiko

Abstract

Provided are methods for efficiently producing porous particles and a carrier for purification or adsorption which have excellent antifouling properties or excellent carbon dioxide adsorption properties. A method for producing porous particles includes steps (i) to (iii) mentioned below, wherein the water-based medium in step (iii) is a water-based medium such that the amount of a salt dissolved per unit mass is 10 parts by mass or more when the mass of the salt per unit mass in a saturated solution reached by dissolving the salt in the water-based medium under conditions of 23°C and 1 atm is 100. (i) A step for preparing a hydrocolloid in a salt-containing water-based medium; (ii) a step for dispersing a liquid composition in a hydrocolloid-containing water-based medium prepared in step (i), the liquid composition containing a hydrophobe having a solubility in water at 25°C of 1.0×10-4g/L or less and one or more monomers that are different from the hydrophobe; and (iii) a step for subjecting the monomers dispersed in step (ii) to suspension polymerization in a water-based medium containing a hydrocolloid and a salt.

IPC Classes  ?

  • C08F 2/18 - Suspension polymerisation
  • B01J 20/281 - Sorbents specially adapted for preparative, analytical or investigative chromatography
  • B01J 20/282 - Porous sorbents
  • B01J 20/285 - Porous sorbents based on polymers
  • C08F 6/24 - Treatment of polymer suspensions

88.

COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE

      
Application Number 19336726
Status Pending
Filing Date 2025-09-23
First Publication Date 2026-03-19
Owner JSR CORPORATION (Japan)
Inventor
  • Dobashi, Masato
  • Ehara, Kengo
  • Dei, Satoshi
  • Mayumi, Kosuke
  • Yamada, Shuhei
  • Tatsubo, Daiki
  • Sakai, Kazunori
  • Ohtagaki, Yasuhiro
  • Akita, Shunpei

Abstract

A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. R1 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; L1 is a single bond or a divalent linking group; and Ar1 is a monovalent group comprising an aromatic ring having 6 to 20 ring members, a hydrogen atom of the aromatic ring is substituted with at least one halogen atom, and the monovalent group represented by Ar1 further comprises et least one group selected from the group consisting of a group represented by formulae (2-1) to (2-8). A composition includes: a polymer including a repeating unit represented by formula (1); and a solvent. R1 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; L1 is a single bond or a divalent linking group; and Ar1 is a monovalent group comprising an aromatic ring having 6 to 20 ring members, a hydrogen atom of the aromatic ring is substituted with at least one halogen atom, and the monovalent group represented by Ar1 further comprises et least one group selected from the group consisting of a group represented by formulae (2-1) to (2-8).

IPC Classes  ?

  • G03F 7/095 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
  • C09D 141/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic ring containing sulfurCoating compositions based on derivatives of such polymers
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/004 - Photosensitive materials
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

89.

METHOD FOR PRODUCING EXPANDED BEADS

      
Application Number 19108418
Status Pending
Filing Date 2023-08-25
First Publication Date 2026-03-19
Owner JSP CORPORATION (Japan)
Inventor
  • Inoue, Tsubasa
  • Hira, Akinobu

Abstract

A method for producing expanded beads using a mixture of a polypropylene-based resin A that is a non-recovered material and polypropylene-based resin B that is a recovered product of a post-consumer material. The method enables production of expanded beads wherein variation in the expansion ratio and reduction in the closed cell ratio are inhibited, and is capable of improving the appearance of a molded article. A base material resin, a mixture of resin A having a melting point 130-155° C. and resin B is used, the blending rate of A is 40 −97 wt %, and B is 3 −60 wt %, the melting point difference between the resins is 10-30° C., resin B has an ash content of 5 wt % or less, and in a melting peak observed in a DSC curve in heat-flux differential scanning calorimetry, the difference between an extrapolated melting start and end temperature is 30° C. or more.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
  • C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
  • C08L 23/12 - Polypropene

90.

RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN AND ONIUM SALT COMPOUND

      
Application Number 19395014
Status Pending
Filing Date 2025-11-20
First Publication Date 2026-03-19
Owner JSR CORPORATION (Japan)
Inventor
  • Egawa, Fuyuki
  • Nemoto, Ryuichi
  • Oshiro, Taku
  • Miyao, Kensuke
  • Inami, Hajime

Abstract

A radiation-sensitive composition includes: an onium salt compound represented by formula (1); a polymer including a structural unit which includes an acid-dissociable group; and a solvent. A is a monovalent organic group having 1 to 40 carbon atoms; R1 and R2 are each independently a hydrogen atom, a monovalent fluorine-free organic group having 1 to 20 carbon atoms, a cyano group, a nitro group, a hydroxy group, or an amino group, when there are a plurality of R1s and R2s, the plurality of R1s and R2s are the same or different from each other; m1 is an integer of 1 to 8; and Z+ is a monovalent radiation-sensitive onium cation. A radiation-sensitive composition includes: an onium salt compound represented by formula (1); a polymer including a structural unit which includes an acid-dissociable group; and a solvent. A is a monovalent organic group having 1 to 40 carbon atoms; R1 and R2 are each independently a hydrogen atom, a monovalent fluorine-free organic group having 1 to 20 carbon atoms, a cyano group, a nitro group, a hydroxy group, or an amino group, when there are a plurality of R1s and R2s, the plurality of R1s and R2s are the same or different from each other; m1 is an integer of 1 to 8; and Z+ is a monovalent radiation-sensitive onium cation.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 309/05 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing at least two sulfo groups bound to the carbon skeleton
  • C07C 309/24 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of a carbon skeleton containing six-membered aromatic rings
  • C07C 317/24 - SulfonesSulfoxides having sulfone or sulfoxide groups and doubly-bound oxygen atoms bound to the same carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 295/185 - Radicals derived from carboxylic acids from aliphatic carboxylic acids
  • C07D 321/10 - Seven-membered rings condensed with carbocyclic rings or ring systems
  • C08F 20/22 - Esters containing halogen
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

91.

FOAM PARTICLE, AND FOAM PARTICLE MOLDED ARTICLE

      
Application Number 19105736
Status Pending
Filing Date 2023-08-18
First Publication Date 2026-03-12
Owner JSP Corporation (Japan)
Inventor
  • Yamasaki, Shobu
  • Ito, Yosuke

Abstract

An expanded bead comprising a polypropylene-based resin as a base resin and a hindered amine-based compound, in which the polypropylene-based resin has a degree of crystallinity of 45% or less, the hindered amine-based compound has a structure represented by the following formula (I), and a content of the hindered amine-based compound in the expanded bead is 0.01% by mass or more and 4% by mass or less, in which X represents an alkylene group, and Y1 and Y2 each independently represent a hydrocarbon group or a hydrocarbon group bonded via an oxygen atom. An expanded bead comprising a polypropylene-based resin as a base resin and a hindered amine-based compound, in which the polypropylene-based resin has a degree of crystallinity of 45% or less, the hindered amine-based compound has a structure represented by the following formula (I), and a content of the hindered amine-based compound in the expanded bead is 0.01% by mass or more and 4% by mass or less, in which X represents an alkylene group, and Y1 and Y2 each independently represent a hydrocarbon group or a hydrocarbon group bonded via an oxygen atom.

IPC Classes  ?

  • C08K 5/3435 - Piperidines
  • C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/232 - Forming foamed products by sintering expandable particles

92.

RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMING METHOD, RADIATION-SENSITIVE ACID GENERATOR, AND COMPOUND

      
Application Number JP2025029777
Publication Number 2026/053783
Status In Force
Filing Date 2025-08-25
Publication Date 2026-03-12
Owner JSR CORPORATION (Japan)
Inventor Hachiya, Asuka

Abstract

This radiation-sensitive composition comprises a polymer having an acid dissociable group and a compound represented by formula (1). In formula (1), X1is *122-NH- or *122-. *1denotes an atomic bond with R1. With respect to R1and A1, R1is a monovalent organic group and A1is a divalent organic group, or alternatively, R1and A122-NH- in the ring skeleton. M+is a substituted or unsubstituted iodonium cation or a sulfonium cation that has at least one group selected from the group consisting of a fluoro group, a bromo group, an iodo group, a haloalkyl group, a cyano group, a carbonyl group and a sulfonyl group. However, in cases where M+is an unsubstituted iodonium cation, A1 has an aromatic ring.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 311/08 - Sulfonamides having sulfur atoms of sulfonamide groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton having the nitrogen atom of at least one of the sulfonamide groups bound to a carbon atom of a six-membered aromatic ring
  • C07C 311/11 - Sulfonamides having sulfur atoms of sulfonamide groups bound to acyclic carbon atoms of an acyclic unsaturated carbon skeleton
  • C07C 311/48 - Amides of sulfonic acids, i.e. compounds having singly-bound oxygen atoms of sulfo groups replaced by nitrogen atoms, not being part of nitro or nitroso groups having nitrogen atoms of sulfonamide groups further bound to another hetero atom
  • C07C 311/51 - Y being a hydrogen or a carbon atom
  • C07C 381/12 - Sulfonium compounds
  • C07D 275/06 - Heterocyclic compounds containing 1, 2-thiazole or hydrogenated 1,2-thiazole rings condensed with carbocyclic rings or ring systems with hetero atoms directly attached to the ring sulfur atom
  • C07D 317/24 - Radicals substituted by singly bound oxygen or sulfur atoms esterified
  • C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
  • G03F 7/20 - ExposureApparatus therefor
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

93.

RADIATION-SENSITIVE COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING POLYMER

      
Application Number JP2025031497
Publication Number 2026/054060
Status In Force
Filing Date 2025-09-05
Publication Date 2026-03-12
Owner JSR CORPORATION (Japan)
Inventor
  • Shimada, Yuta
  • Motoyama, Kazuki
  • Nonoyama, Yoshiki

Abstract

The present invention provides: a radiation-sensitive composition which is capable of exhibiting sensitivity, CDU, overexposure CDU, and underexposure CDU at levels equal to or higher than conventional levels when forming a pattern; and a pattern forming method. This radiation-sensitive composition contains a first polymer and a solvent, wherein the first polymer comprises a structural unit (I) that has an acid dissociable group, a structural unit (II) that has an organic acid anion and an onium cation and comprises an acid-generating structure which generates an acid upon exposure to light, and a partial structure (a) that is represented by formula (a). (In formula (a), Z represents a hydrogen atom, a halogen atom, a nitro group, or a monovalent organic group having 1-20 carbon atoms, and * is an atomic bond with another structure of the polymer.)

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
  • C08F 220/16 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - ExposureApparatus therefor

94.

POLYOLEFIN-BASED RESIN EXPANDED BEADS AND METHOD FOR PRODUCING SAME

      
Application Number 18868299
Status Pending
Filing Date 2023-05-19
First Publication Date 2026-03-12
Owner JSP CORPORATION (Japan)
Inventor Nohara, Tokunobu

Abstract

A method for producing polyolefin-based resin expanded beads includes dispersing polyolefin-based resin particles in an aqueous medium, adding a physical blowing agent into a sealed container, and expanding the resin particles by impregnating the resin particles with the physical blowing agent in the sealed container, then releasing the resin particles from the sealed container together with the aqueous medium to produce expanded beads having an apparent density of 10 to 80 kg/m3. The physical blowing agent includes a hydrofluoroolefin. An addition amount of the hydrofluoroolefin is 10 to 30 parts by mass with respect to 100 parts by mass of the resin particles.

IPC Classes  ?

  • C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
  • C08J 9/14 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic

95.

RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMER, AND COMPOUND

      
Application Number JP2025027909
Publication Number 2026/053667
Status In Force
Filing Date 2025-08-06
Publication Date 2026-03-12
Owner JSR CORPORATION (Japan)
Inventor
  • Shiratani, Motohiro
  • Rozhanskii, Igor
  • Kishida, Takanori
  • Mori, Shuto

Abstract

This radiation-sensitive composition comprises a polymer (A) containing a structural unit represented by formula (1) and satisfies at least one among requirement 1 and requirement 2, wherein at least one selected from the group consisting of the polymer (A) contained in said composition and a radiation-sensitive onium salt (B) of a non-polymer has an iodine atom. Requirement 1: The polymer (A) further contains a structural unit derived from a radiation-sensitive onium salt. Requirement 2: The radiation-sensitive onium salt (B) of the non-polymer is further contained. In formula (1), L1is a single bond or a divalent organic group. P1 is an acid-dissociable group.

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C07D 207/452 - Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide with hydrocarbon radicals, substituted by hetero atoms, directly attached to the ring nitrogen atom
  • C08F 22/40 - Imides, e.g. cyclic imides
  • G03F 7/004 - Photosensitive materials
  • G03F 7/20 - ExposureApparatus therefor

96.

COMPOSITION, CONTAINER FILLED WITH COMPOSITION, METHOD FOR STORING COMPOSITION, AND COMPOUND

      
Application Number JP2025039155
Publication Number 2026/054120
Status In Force
Filing Date 2025-11-07
Publication Date 2026-03-12
Owner JSR CORPORATION (Japan)
Inventor
  • Shimizu Makoto
  • Ichinohe Daigo
  • Kimura Naoto

Abstract

Provided is a composition which uses an aqueous solvent and is excellent in both solubility and storage stability of a metal complex. The composition contains an aqueous solvent and a first compound represented by formula (1).

IPC Classes  ?

  • C07F 11/00 - Compounds containing elements of Groups 6 or 16 of the Periodic Table
  • C23C 16/18 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds

97.

RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING PATTERN AND ONIUM SALT COMPOUND

      
Application Number 19377148
Status Pending
Filing Date 2025-11-03
First Publication Date 2026-03-05
Owner JSR CORPORATION (Japan)
Inventor
  • Inami, Hajime
  • Egawa, Fuyuki
  • Nemoto, Ryuichi
  • Miyake, Masayuki
  • Miyao, Kensuke

Abstract

A radiation-sensitive composition includes: an onium salt compound represented by formula (1); a polymer including a structural unit (I) which includes an acid-dissociable group; and a solvent. W is a cyclic structure having 3 to 40 ring members formed together with the two carbon atoms; a formula between the two carbon atoms below represents a single bond or a double bond, , A is one of groups represented by formulae (A-1) to (A-7); R1 is a monovalent organic group having 1 to 20 carbon atoms, a cyano group, a nitro group, a carboxy group, a hydroxy group, an amino group, a halogen atom, or a thiol group, when there are a plurality of R1s, the plurality of R1s are same as or different from each other; m1 is an integer of 0 to 4; and Z+ is a monovalent radiation-sensitive onium cation. A radiation-sensitive composition includes: an onium salt compound represented by formula (1); a polymer including a structural unit (I) which includes an acid-dissociable group; and a solvent. W is a cyclic structure having 3 to 40 ring members formed together with the two carbon atoms; a formula between the two carbon atoms below represents a single bond or a double bond, , A is one of groups represented by formulae (A-1) to (A-7); R1 is a monovalent organic group having 1 to 20 carbon atoms, a cyano group, a nitro group, a carboxy group, a hydroxy group, an amino group, a halogen atom, or a thiol group, when there are a plurality of R1s, the plurality of R1s are same as or different from each other; m1 is an integer of 0 to 4; and Z+ is a monovalent radiation-sensitive onium cation.

IPC Classes  ?

  • G03F 7/004 - Photosensitive materials
  • C07C 25/18 - Polycyclic aromatic halogenated hydrocarbons
  • C07C 309/25 - Sulfonic acids having sulfo groups bound to carbon atoms of rings other than six-membered aromatic rings of a carbon skeleton
  • C07C 309/27 - Sulfonic acids having sulfo groups bound to carbon atoms of rings other than six-membered aromatic rings of a carbon skeleton containing carboxyl groups bound to the carbon skeleton
  • C07C 309/42 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing singly-bound oxygen atoms bound to the carbon skeleton having the sulfo groups bound to carbon atoms of non-condensed six-membered aromatic rings
  • C07C 309/43 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing singly-bound oxygen atoms bound to the carbon skeleton having at least one of the sulfo groups bound to a carbon atom of a six-membered aromatic ring being part of a condensed ring system
  • C07C 309/44 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing doubly-bound oxygen atoms bound to the carbon skeleton
  • C07C 309/51 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing nitrogen atoms, not being part of nitro or nitroso groups, bound to the carbon skeleton at least one of the nitrogen atoms being part of any of the groups X being a hetero atom, Y being any atom
  • C07C 309/58 - Carboxylic acid groups or esters thereof
  • C07C 309/59 - Nitrogen analogues of carboxyl groups
  • C07C 323/66 - Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and sulfur atoms, not being part of thio groups, bound to the same carbon skeleton containing sulfur atoms of sulfo, esterified sulfo or halosulfonyl groups, bound to the carbon skeleton
  • C07C 381/12 - Sulfonium compounds
  • C07D 307/64 - Sulfur atoms
  • C07D 307/68 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen
  • C07D 327/06 - Six-membered rings
  • C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
  • C07D 333/34 - Sulfur atoms
  • C07D 333/40 - Thiophene-2-carboxylic acid
  • C07D 333/46 - Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings substituted on the ring sulfur atom
  • C07D 333/76 - Dibenzothiophenes
  • C07D 335/02 - Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings
  • C07D 335/12 - Thioxanthenes
  • C08F 20/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F 20/22 - Esters containing halogen
  • C08F 20/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
  • C08F 20/38 - Esters containing sulfur
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists

98.

TRANSFER STAMP MATERIAL, TEMPERATURE-SENSITIVE ADHESIVE MATERIAL COMPOSITION, MICRO-TRANSFER PRINTING DEVICE, AND TRANSFER PRINTING METHOD

      
Application Number JP2025027012
Publication Number 2026/048391
Status In Force
Filing Date 2025-07-30
Publication Date 2026-03-05
Owner
  • JSR CORPORATION (Japan)
  • KEIO UNIVERSITY (Japan)
Inventor
  • Yasuike, Nobuo
  • Okada, Takashi
  • Nishimura, Tatsuya
  • Ota, Yasutomo
  • Akahoshi, Soma
  • Sato, Takumi

Abstract

A transfer stamp material according to the present invention contains a polymer (A) having, in a side chain, at least one specific group selected from the group consisting of an alkyl group having at least 10 carbon atoms and a group in which some methylene groups in an alkyl group having at least 10 or more carbon atoms have been substituted with -O-, -S-, -CO-, -COO-, -OCO-, -NR1A-, -CO-NR1A-, -NR1A-CO-, -NR1A-CO-NR1B-, -NR1A-CO-O-, or -O-CO-NR1A-. R1Aand R1B are each independently a hydrogen atom or an alkyl group having one to three carbon atoms.

IPC Classes  ?

  • H01L 21/52 - Mounting semiconductor bodies in containers
  • C08J 5/18 - Manufacture of films or sheets
  • C08L 83/04 - Polysiloxanes
  • C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups
  • H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation

99.

RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMER, AND MONOMER

      
Application Number JP2025028016
Publication Number 2026/048459
Status In Force
Filing Date 2025-08-06
Publication Date 2026-03-05
Owner JSR CORPORATION (Japan)
Inventor
  • Terada Nozomi
  • Nishikori Katsuaki

Abstract

Provided is a radiation-sensitive composition comprising a polymer having structural monomer A that contains a moiety in which a hydrogen atom of a carboxy group is substituted by an acid dissociable group represented by formula (z).

IPC Classes  ?

  • G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • C08F 212/02 - Monomers containing only one unsaturated aliphatic radical
  • C08F 220/10 - Esters
  • G03F 7/20 - ExposureApparatus therefor

100.

DIFFRACTIVE OPTICAL ELEMENT

      
Application Number JP2025028776
Publication Number 2026/048555
Status In Force
Filing Date 2025-08-15
Publication Date 2026-03-05
Owner JSR CORPORATION (Japan)
Inventor
  • Kishida,hiroyuki
  • Ooishi,youhei

Abstract

Provided is a diffractive optical element which can separate incident light for each wavelength, focus the light of each wavelength to different positions, and be manufactured relatively easily. The present invention includes: a substrate which transmits light; and a plurality of diffraction patterns including a first diffraction pattern and a second diffraction pattern which are formed so as to have different center positions on the same main surface of the substrate. Each of the first diffraction pattern and the second diffraction pattern exhibits a pattern shape selected from the group consisting of a Fresnel zone plate pattern, a fractal zone plate pattern, and a photon sieve plate pattern.

IPC Classes  ?

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