A method for forming a resist pattern, includes: forming a metal-containing resist film directly or indirectly on a substrate; laminating a protective film on the metal-containing resist film by applying a composition for forming a protective film; exposing to light the metal-containing resist film on which the protective film is laminated; and removing a portion of the exposed metal-containing resist film to form a pattern.
G03F 7/09 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
G03F 7/32 - Liquid compositions therefor, e.g. developers
A method for producing a geopolymer foam, comprising obtaining a reaction slurry containing aluminosilicate, alkali metal silicate, aggregate, and water, adding a foaming agent to the reaction slurry to form a foaming slurry, and heating the foaming slurry, wherein the aggregate used is mica with an average particle size of 50 to 500 μm and a volume fraction (X) of particles with a particle size of 10 μm or less of 3% or less, and wherein the viscosity of the reaction slurry at 23° C. is 3000 to 15000 mPa·s.
C04B 28/00 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
A polymer containing a structural unit represented by formula (1) is included in this radiation-sensitive composition. In formula (1), R1is a hydrogen atom, a fluoro group, a methyl group, or a trifluoromethyl group. Ar1is a group obtained by removing (a+2) hydrogen atoms from an aromatic ring. R233 -or COO-. Provided that, R2is bonded to an atom adjacent to the bonding site with the main chain or is bonded to an atom also adjacent to an atom adjacent to the bonding site with the main chain among the atoms constituting the aromatic ring in Ar1. R3is a substituent. Mb+ is a b-valent cation.
An expanded bead containing a linear low-density polyethylene as a base resin, wherein the linear low-density polyethylene has a biomass degree of 40% or more as measured according to ASTM D 6866; the expanded bead has a crystal structure where a melting peak intrinsic to the linear low-density polyethylene (intrinsic peak) and at least one melting peak on a higher temperature side than the intrinsic peak (high-temperature peak) appear on a DSC curve drawn by heating the expanded bead from 23° C. to 200° C. at a heating rate of 10° C./min; a total heat of fusion of the expanded bead is 70 J/g or more and 100 J/g or less; and a heat of fusion at the high-temperature peak is 10 J/g or more and 50 J/g or less.
Provided are: a radiation-sensitive composition capable of exhibiting sensitivity, CDU, LWR, water repellency, and development defect suppression at sufficient levels during pattern formation, while reducing fluorine in a surface modifier; a pattern forming method; and a compound. This radiation-sensitive composition comprises: a first polymer including a structural unit (I) having an acid dissociable group; a second polymer including a structural unit (i) derived from a compound represented by formula (F1); and a solvent. (In formula (F1): W is a polymerizable group; L is a single bond or an (n+1)-valent linking group; R1is a divalent hydrocarbon group having 1-10 carbon atoms; X1, X2, and X3are each independently a hydrogen atom or a fluorine atom, provided that at least one selected from the group consisting of X1, X2, and X3is a fluorine atom; n is an integer from 1 to 3, provided that when L is a single bond, n is 1; and when n is 2 or more, each of the multiple R1s, X1s, X2s, and X3s are the same or different from one another.)
The purpose of the present invention is to provide: a radiation-sensitive composition capable of forming a resist film that can exhibit sensitivity, LWR, DOF, EL, PED, CDU, and pattern circularity at sufficient levels; and a pattern formation method. The purpose of the present invention is also to provide a radiation-sensitive acid generator that can be applied to said radiation-sensitive composition. The radiation-sensitive composition comprises a polymer (A) containing a structural unit (I) having an acid-dissociable group, and a solvent (E), wherein at least the radiation-sensitive composition contains a radiation-sensitive acid generator (B) containing a partial structure represented by formula (a), or the polymer (A) contains a structural unit (VII) containing a partial structure represented by formula (a). (In formula (a): R1is a hydrogen atom, a nitro group, a hydroxy group, a cyano group, a carboxy group, a thiol group, or a monovalent fluorine-free organic group; when there are multiple R1s, the multiple R1s are the same or different from one another; R2and R3are each independently a hydrogen atom, a nitro group, a hydroxy group, a cyano group, a carboxy group, a thiol group, a halogen atom, or a monovalent organic group, or form a divalent alicyclic group which has 3 to 20 carbon atoms and which is formed from R2and R3combined with each other together with carbon atoms binding thereto; when there are multiple R2s and multiple R3s, the multiple R2s and the multiple R3s are the same or different from one another; L is *-C(=O)O-, *-C(=O)NR5-, or *-OC(=O)O-; R5is a hydrogen atom or a monovalent hydrocarbon group having 1-10 carbon atoms; * represents a bonding site on the R41side; R41is a divalent organic group having a cyclic structure and having a hetero atom; m is an integer of 1-5; n is an integer of 0-4; ** is a bonding site with the other moiety of the corresponding polymer (A) or radiation-sensitive acid generator (B); and M+ is a monovalent onium cation.)
C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
C07D 209/42 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
C07D 211/62 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals attached in position 4
C07D 295/15 - Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals with the ring nitrogen atoms and the carbon atoms with three bonds to hetero atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
C07D 305/06 - Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to the ring atoms
C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
C07D 317/08 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3
C07D 321/10 - Seven-membered rings condensed with carbocyclic rings or ring systems
C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
C07D 333/38 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
C07D 333/46 - Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings substituted on the ring sulfur atom
C07D 333/54 - Benzo [b] thiophenesHydrogenated benzo [b] thiophenes with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to carbon atoms of the hetero ring
C07D 335/02 - Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings
C07D 407/12 - Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group containing two hetero rings linked by a chain containing hetero atoms as chain links
The purpose of the present invention is to provide a radiation-sensitive composition whereby it is possible to form a resist film capable of exhibiting sensitivity, LWR, MEEF, CDU, development defect performance, pattern rectangularity, and pattern circularity at adequate levels, and a pattern formation method. Another purpose of the present invention is to provide a radiation-sensitive acid generation agent that can be applied to the radiation-sensitive composition. This radiation-sensitive composition contains: a polymer (A) including a structural unit (I) with an acid-dissociable group; a radiation-sensitive acid generation agent (B) represented by formula (1); and a solvent (E). Chemical Formula 1 (In formula (1), R1is a hydrogen atom, a nitro group, a hydroxyl group, a cyano group, a carboxy group, a methyl group, or an ethyl group. When there are a plurality of R1, the plurality of R1are each the same or different from each other. R2and R3are each independently a hydrogen atom, a nitro group, a hydroxyl group, a cyano group, a carboxy group, a thiol group, a halogen atom, a monovalent organic group, or a divalent alicyclic group that has 3 to 20 carbon atoms and is formed together with carbon atoms bonding together R2and R3when combined. When there are a plurality of R2and R3, the plurality of R2and R3are the same or different from each other. L is a divalent linking group. R4is a monovalent linear organic group having 3 or more carbon atoms or a monovalent branched organic group having 5 or more carbon atoms. m is an integer of 1 to 5. n is an integer of 0 to 4. M+ is a monovalent onium cation.)
C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
C07D 333/46 - Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings substituted on the ring sulfur atom
C07D 333/54 - Benzo [b] thiophenesHydrogenated benzo [b] thiophenes with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to carbon atoms of the hetero ring
C07D 335/02 - Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings
A method for producing polypropylene-based resin expanded beads includes dispersion, blowing agent impregnation, and foaming steps. Beads used in the dispersion step include a core layer having a polypropylene-based resin as a base material resin, and a fusion-bonding layer covering core layer; the beads fusion-bonding layer includes carbon black and a NOR-type hindered amine; a carbon black blending ratio is adjusted to 0.5 wt % or more and 5 wt % or less; and an amine blending ratio of the beads is adjusted to 0.03 wt % or more and 0.5 wt % or less; the polypropylene-based resin expanded beads have a surface on which a fusion-bonding layer is located; the fusion-bonding layer includes the carbon black and hindered amine; a carbon black blending ratio is 0.5 wt % or more and 5 wt % or less; and a blending ratio of the hindered amine is 0.03 wt % or more and 0.5 wt % or less.
The present invention provides a radiation-sensitive composition that makes it possible to exhibit satisfactory levels of sensitivity, CDU, LWR, water repellency, and development defect suppression performance in pattern formation while achieving reduction in fluorine in a surface modifier, a pattern formation method, and a compound. This radiation-sensitive composition contains: a first polymer including a structural unit (I) having an acid-dissociable group; a second polymer including a structural unit (i) derived from a compound represented by formula (F1); and a solvent. (In formula (F1), W is a polymerizable group. L111+1)-valent linking group. When L122H is –COO-*22H side. Note that L111 is an integer from 1 to 3.)
Provided are a radiation-sensitive composition, a pattern formation method, and a compound, which are capable of exhibiting sufficient levels of development defect suppression, water repellency, LWR, CDU, and sensitivity when forming a pattern, while reducing fluorine in a surface modifier. This radiation-sensitive composition contains: a first polymer including a structural unit (I) having an acid dissociable group; a second polymer including a structural unit (i) derived from a compound represented by formula (F1); and a solvent. (In formula (F1), W represents a polymerizable group. n represents 0 or 1. When n represents 0, L represents a linking group having a valance of (m+1) and having one or more carbon atoms. When n represents 1, L represents a linking group having a valance of (m+1) and having three or more carbon atoms. m represents an integer of 1-3. When m represents 2, L represents a trivalent linking group having four or more carbon atoms.)
To provide a radiation-sensitive composition and a pattern forming method capable of exhibiting sensitivity, pattern rectangularity, pattern circularity, exposure margin, focal depth, development defect suppression property, LWR and CDU at sufficient levels when forming a resist pattern, and having good storage stability. A radiation-sensitive composition contains an onium salt compound represented by formula (1), a polymer, and a solvent. In formula (1), Rfis a halogen atom or a cyano group. n is an integer of 0 to 4. When n is 2 or more, multiple Rfgroups are the same or different from each other. R1is a monovalent organic group having 1 to 20 carbon atoms, a hydrogen atom, a halogen atom, a cyano group or a fluorinated alkyl group that binds to a carbon atom to which R1is bonded via *-COO-, *-OCO-, *22-, *-S-, *-CO-, *-O-CO-O-, *-CONR'- or *-NR'CO-. Each R' independently is a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. *is a bond with a carbon atom to which R1is bonded. Provided that, when n is 0, R1is a halogen atom or a cyano group. R2is a hydroxy group, a nitro group, an amino group, a carboxy group, or a monovalent organic group having 1 to 20 carbon atoms. m is an integer of 0 to 4. When m is 2 or more, multiple R222-. Provided that when X is a methylene group, the aromatic ring of Ar is directly bonded to S+in the formula, and R1does not include a polymerizable group. R41, R42, R43, R44, R45and R48are each independently a hydrogen atom, a hydroxy group, a halogen atom or a monovalent organic group having 1 to 20 carbon atoms. R46and R47are each independently a hydrogen atom, a hydroxy group, a halogen atom, or a monovalent organic group having 1 to 20 carbon atoms, or R46and R47 are combined to represent a ring structure having 3 to 10 ring members together with two carbon atoms to which they are bonded.
C07C 309/39 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing halogen atoms bound to the carbon skeleton
C07C 309/42 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing singly-bound oxygen atoms bound to the carbon skeleton having the sulfo groups bound to carbon atoms of non-condensed six-membered aromatic rings
C07C 309/48 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing nitrogen atoms, not being part of nitro or nitroso groups, bound to the carbon skeleton the carbon skeleton being further substituted by halogen atoms
C07C 309/58 - Carboxylic acid groups or esters thereof
C07C 317/14 - SulfonesSulfoxides having sulfone or sulfoxide groups bound to carbon atoms of six-membered aromatic rings
C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
C07D 307/33 - Oxygen atoms in position 2, the oxygen atom being in its keto or unsubstituted enol form
C07D 317/18 - Radicals substituted by singly bound oxygen or sulfur atoms
C07D 409/04 - Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings directly linked by a ring-member-to-ring- member bond
C07D 409/06 - Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings linked by a carbon chain containing only aliphatic carbon atoms
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
The purpose of the present invention is to provide: a radiation-sensitive composition with which it is possible to form a resist film capable of exhibiting sensitivity, LWR, pattern rectangularity, CDU, pattern circularity, and development defect performance at sufficient levels; and a pattern formation method. Additionally, the purpose of the present invention is to provide a radiation-sensitive acid generator that can be applied to the radiation-sensitive composition. This radiation-sensitive composition contains a polymer (A) that contains a structural unit (I) having an acid-dissociable group, a radiation-sensitive acid generator (B) that is represented by formula (1), and a solvent (E). Formula (1) (In formula (1), R1is a hydrogen atom, a nitro group, a hydroxyl group, a cyano group, a carboxy group, a thiol group, a halogen atom, or a monovalent organic group. When there are multiple R1, the R1are each the same or different. R2is a C1-40 monovalent organic group. m1 is an integer from 1 to 5. M+ is a monovalent onium cation.)
C07C 309/03 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
C07D 327/08 - [b, e]-condensed with two six-membered carbocyclic rings
C07D 333/46 - Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings substituted on the ring sulfur atom
Provided are polyolefin-based resin foamed particles with which it is possible to easily mold a polyolefin-based resin foamed particle molded article exhibiting high flame retardancy as well as exceptional fusion properties and surface properties. These polyolefin-based resin foamed particles comprise a foam layer. The foam layer contains a base material resin, a phosphonic-acid-ester-based compound, and a NOR-type hindered-amine-based compound. The base material resin is configured from a polyolefin-based resin. The blending amount of the phosphonic-acid-ester-based compound in the foam layer is 5-25 parts by mass per 100 parts by mass of the base material resin. The blending amount of the NOR-type hindered-amine-based compound in the foam layer is 0.3-5 parts by mass per 100 parts by mass of the base material resin. The closed cell ratio of the foamed particles is 60% or greater.
A method for producing foamable polyamide-based resin particles according to the present invention includes impregnating polyamide-based resin particles with an inorganic physical foaming agent in a gas phase, wherein the polyamide-based resin particles have a water content of at least 2.5 mass % and contain 0.5-10 mass % of carbon black. Foamed polyamide-based resin particles are obtained by heating and foaming the foamable polyamide resin particles.
The present invention provides a method for easily producing a chromatographic carrier that has a high dynamic binding capacity to antibodies or fragments thereof, inhibits the leakage of protein ligands during isolation, and inhibits the aggregation of carriers. Provided is a production method for a chromatographic carrier comprising the ligand binding step, ligand-bound carrier bed forming step, ligand-bound carrier flushing and cleaning step, and ligand-bound carrier stirring and cleaning step described hereafter. Ligand binding step: a step in which a protein ligand is bound to a solid phase carrier. Ligand-bound carrier bed forming step: a step in which a container is filled with the ligand-bound carrier obtained in the ligand binding step to form a ligand-bound carrier bed. Ligand-bound carrier flushing and cleaning step: a step in which the ligand-bound carrier bed formed in the ligand-bound carrier bed forming step is cleaned one or more times by flushing the bed with a cleaning liquid. Ligand-bound carrier stirring and cleaning step: a step in which the ligand-bound carrier after the ligand-bound carrier flushing and cleaning step is cleaned one or more times by stirring in a cleaning liquid.
Provided are a radiation-sensitive composition capable of exhibiting sufficient levels of sensitivity, CDU performance, and development defect suppression property during pattern formation while achieving a reduction of fluorine in a surface modifier, and a pattern formation method. The radiation-sensitive composition comprises: a first polymer having a structural unit containing an acid-dissociable group; a second polymer different from the first polymer; at least one selected from the group consisting of a radiation-sensitive acid generator containing an iodine group, and an acid diffusion control agent containing an iodine group; and a solvent. The content ratio of the second polymer to the total mass of the first polymer and the second polymer is 0.1-20 mass% inclusive. The second polymer includes a partial structure represented by formula (i), and has a structural unit (B1) not containing a fluorine atom. (In formula (i), R1, R2, and R3 are each independently an alkyl group having 1 to 10 carbon atoms, and * is a bond to a structure other than the partial structure in the structural unit (B1).)
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C08F 12/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
The purpose of the present invention is to provide: a radiation-sensitive composition capable of forming a resist film that can exhibit sensitivity and CDU at satisfactory levels when next-generation technology is applied and can suppress development defects; and a pattern formation method. The purpose of the present invention is also to provide a radiation-sensitive acid generator that can be applied to said radiation-sensitive composition. The present invention relates to a radiation-sensitive composition containing: a polymer (A) containing a structural unit (I) having an acid-dissociable group; a radiation-sensitive acid generator (B) represented by formula (1); and a solvent (C). (In formula (1): A is an (n1+n2+n3+1)-valent aromatic ring; R1is a nitro group, a cyano group, a hydroxy group, an amino group, or a monovalent organic group; when there are multiple R1s, the multiple R1s are the same or different from one another; n1 is an integer of 1-5; n2 is an integer of 1-5; n3 is an integer of 0-5; m2 is an integer of 1-3; L is a single bond or an (m2+1)-valent linking group; Rf1and Rf2are each independently a fluorine atom or a monovalent fluorinated hydrocarbon group having 1-20 carbon atoms; Rf3and Rf4are each independently a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group having 1-20 carbon atoms, or a monovalent fluorinated hydrocarbon group having 1-20 carbon atoms; when there are multiple Rf3s and multiple Rf4s, the multiple Rf3s and the multiple Rf4s may each be the same or different from one another; m1 is an integer of 0-10; and M+ is a monovalent onium cation.
C07C 309/11 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing etherified hydroxy groups bound to the carbon skeleton with the oxygen atom of at least one of the etherified hydroxy groups further bound to a carbon atom of a six-membered aromatic ring
C07D 317/70 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 ortho- or peri-condensed with carbocyclic rings or ring systems condensed with ring systems containing two or more relevant rings
The present invention provides a method for easily producing a chromatographic carrier that has a high dynamic binding capacity to antibodies or fragments thereof, inhibits the leakage of protein ligands during isolation, and inhibits the aggregation of carriers. Provided is a production method for a chromatographic carrier comprising the solid phase carrier cleaning step, ligand binding step, and ligand-bound carrier cleaning step described hereafter. Solid phase carrier cleaning step: a step in which a solid phase carrier is cleaned using at least one cleaning liquid selected from cleaning liquids containing hydrogen peroxide, cleaning liquids containing peracetic acid, and cleaning liquids (other than cleaning liquids containing hydrogen peroxide and cleaning liquids containing peracetic acid) having a pH of 0-3 or a pH of higher than 12.5 to 14, and the surface of the solid phase carrier is made hydrophilic. Ligand binding step: a step in which a protein ligand is bound to the solid phase carrier cleaned in the solid phase carrier cleaning step. Ligand-bound carrier cleaning step: a step in which the carrier obtained in the ligand binding step is cleaned.
What is provided is a therapeutic agent that is effective for the treatment of ovarian clear cell carcinoma. A therapeutic agent for ovarian clear cell carcinoma includes, as an active ingredient, a proteasome inhibitor. Furthermore, in the therapeutic agent for ovarian clear cell carcinoma, the proteasome inhibitor is a substance that reversibly or irreversibly binds to a 20s proteasome-β5 subunit and inhibits a chymotrypsin-like activity. Moreover, in the therapeutic agent for ovarian clear cell carcinoma, the proteasome is a 26s proteasome. In addition, in the therapeutic agent for ovarian clear cell carcinoma, a content proportion of the proteasome inhibitor is 80% by mass or more, 90% by mass or more, or 100% by mass.
Provided are a radiation-sensitive composition which has excellent sensitivity and CDU and good storage stability, and a pattern formation method. This radiation-sensitive composition comprises a polymer which contains a structural unit (I) that has an acid-dissociable group, an acid diffusion control agent which includes a third organic acid anion and a third onium cation and which, when exposed to light, generates an acid that does not dissociate the acid-dissociable group, and a solvent, wherein at least: the polymer includes a structural unit (II) which has a first organic acid anion and an iodonium cation and which includes an acid generation structure that, when exposed to light, generates an acid that dissociates the acid-dissociable group; the radiation-sensitive composition contains a radiation-sensitive acid generation agent which contains a second organic acid anion and an iodonium cation and which, when exposed to light, generates an acid that dissociates the acid-dissociable group; or the third onium cation is an iodonium cation, the third organic acid anion of the acid diffusion control agent includes an aromatic ring, -COO-is bound to one of the ring-forming atoms of the aromatic ring, -OH is bound to each of two ring-forming atoms which are adjacent to the one ring-forming atom, and the solvent includes a compound represented by formula (H). (In formula (H), R1to R3 are each independently a substituted or unsubstituted C1-20 monovalent aliphatic hydrocarbon group.)
One embodiment of the present invention pertains to a resin composition, a cured object, or an electronic component. The resin composition contains: a polymer (A) having a structural unit represented by formula (a1-1); and a hydrogenated styrene-based thermoplastic elastomer (B). In formula (a1-1), Ra1represents a divalent group represented by formula (a2), and Ra2represents a substituted or unsubstituted divalent aromatic heterocyclic group. In formula (a2), Ara1and Ara2each independently represent a substituted or unsubstituted aromatic hydrocarbon group, L represents a single bond, -O-, -S-, -N(R822-, -P(O)-, or a divalent organic group, y represents an integer of 0-5, and Ra6and Ra7 each independently represent a single bond, a methylene group, or an alkylene group having 2-4 carbon atoms.
C08L 71/10 - Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
C08G 65/40 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols and other compounds
POLYOLEFIN-BASED RESIN FOAM PARTICLE, FOAM PARTICLE MOLDED BODY OBTAINED BY IN-MOLD MOLDING OF SAID FOAM PARTICLE, METHOD FOR PRODUCING SAID FOAM PARTICLE, AND METHOD FOR ASSESSING FLAME RETARDANCY OF SAID FOAM PARTICLE
215235215tot215235 to t to t is a numerical value that indicates the mass percentage of phosphorus in the foam particle, and falls within the range 0.001-0.06.
A method for producing a molded article of thermoplastic resin expanded beads that includes cracking filling and in-mold molding. The expanded beads have a columnar shape and a defective portion that is a through hole and/or a groove. A ratio Ca/A of an average cross-sectional area Ca per defective portion to an average cross-sectional area A of a cut surface of the expanded bead obtained by cutting the expanded bead at a center in an axial direction along a plane perpendicular to the axial direction is 0.01 or more and 0.20 or less, and a ratio Ct/A of a total cross-sectional area Ct of the defective portion to the average cross-sectional area A of the expanded bead is 0.02 or more and 0.20 or less. When the mold is completely closed, a filling rate F of the expanded beads is 125% or more and 220% or less.
B29C 44/34 - Component parts, details or accessoriesAuxiliary operations
B29C 44/02 - Shaping by internal pressure generated in the material, e.g. swelling or foaming for articles of definite length, i.e. discrete articles
B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads
A method for producing a molded article of thermoplastic resin expanded beads includes a cracking filling step and an in-mold molding step. Expanded beads to be used in the cracking filling step each have a columnar shape and each have one or more defective portions of one or two kinds, the defective portions being selected from the group consisting of through holes and grooves. A molding cavity of a mold has a first portion having a length in an opening/closing direction of the mold greater than an average length LA and a second portion shorter than the average length LA. In the cracking filling step, a difference P2max−P1min between a minimum value P1min of the compression rate of the first portion and a maximum value P2max of the compression rate of the second portion is 5% or more and 100% or less.
B29C 39/00 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor
B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), L1 represents a group having a (thio)acetal ring or the like. W1 represents a single bond or a (b+1)-valent organic group having 1 to 40 carbon atoms. R1, R2, and R3 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, a fluorine atom, or a fluoroalkyl group. Rf represents a fluorine atom or a fluoroalkyl group. a represents an integer of 0 to 8. b represents an integer of 1 to 4. d represents 1 or 2. When a represents 2 or more, a plurality of R1 are the same or different, and a plurality of R2 are the same or different. M+ represents a monovalent cation.
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), L1 represents a group having a (thio)acetal ring or the like. W1 represents a single bond or a (b+1)-valent organic group having 1 to 40 carbon atoms. R1, R2, and R3 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, a fluorine atom, or a fluoroalkyl group. Rf represents a fluorine atom or a fluoroalkyl group. a represents an integer of 0 to 8. b represents an integer of 1 to 4. d represents 1 or 2. When a represents 2 or more, a plurality of R1 are the same or different, and a plurality of R2 are the same or different. M+ represents a monovalent cation.
A radiation-sensitive composition includes: a first polymer comprising a structural unit (I) having an acid-dissociable group; a second polymer comprising a structural unit (i) represented by formula (f1); and a solvent. The acid-dissociable group has an iodo group. RK1 is a hydrogen atom, a fluorine atom, or the like; LY1 is a divalent hydrocarbon group having 1 to 10 carbon atoms; LY2 is —COO—* or —OCO—*, *is a bond on an Rf1 side; Rf1 is a monovalent hydrocarbon group having 1 to 10 carbon atoms or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms; Rf2 and Rf3 are each independently a fluorine atom or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms; s is an integer of 0 to 3, and when Rf1 is the monovalent hydrocarbon group having 1 to 10 carbon atoms, s is an integer of 1 to 3.
A radiation-sensitive composition includes: a first polymer comprising a structural unit (I) having an acid-dissociable group; a second polymer comprising a structural unit (i) represented by formula (f1); and a solvent. The acid-dissociable group has an iodo group. RK1 is a hydrogen atom, a fluorine atom, or the like; LY1 is a divalent hydrocarbon group having 1 to 10 carbon atoms; LY2 is —COO—* or —OCO—*, *is a bond on an Rf1 side; Rf1 is a monovalent hydrocarbon group having 1 to 10 carbon atoms or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms; Rf2 and Rf3 are each independently a fluorine atom or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms; s is an integer of 0 to 3, and when Rf1 is the monovalent hydrocarbon group having 1 to 10 carbon atoms, s is an integer of 1 to 3.
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C08L 25/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
C08L 33/16 - Homopolymers or copolymers of esters containing halogen atoms
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An inorganic foam comprising an inorganic polymer having leucite crystal structure as a base material, the area of the peak derived from leucite crystal in the X-ray diffraction spectrum of the inorganic foam satisfies the following formula (1): D(geo)/D(pur)≥0.5 (1). In formula (1), D(geo) represents the area of the peak located at 2θ=27.3° derived from leucite crystal in the X-ray diffraction spectrum of the inorganic foam, and D(pur) represents the area of the peak located at 2θ=27.3° derived from leucite crystal in the X-ray diffraction spectrum of leucite pure material.
C04B 38/10 - Porous mortars, concrete, artificial stone or ceramic warePreparation thereof by using foaming agents
C04B 35/18 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay rich in aluminium oxide
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japan)
JSR CORPORATION (Japan)
Inventor
Sato, Kazuhide
Shimada, Mibuko
Abstract
This complex for use in tumor chemodynamic therapy comprises: nanoparticles that enclose iron oxide and include a hydrophilic polymer in a surface layer thereof; and target recognition molecules that bind to the nanoparticles and can bind to target molecules of the tumor cells.
A61K 39/395 - AntibodiesImmunoglobulinsImmune serum, e.g. antilymphocytic serum
A61K 47/36 - PolysaccharidesDerivatives thereof, e.g. gums, starch, alginate, dextrin, hyaluronic acid, chitosan, inulin, agar or pectin
A61K 47/68 - Medicinal preparations characterised by the non-active ingredients used, e.g. carriers or inert additivesTargeting or modifying agents chemically bound to the active ingredient the non-active ingredient being chemically bound to the active ingredient, e.g. polymer-drug conjugates the non-active ingredient being a modifying agent the modifying agent being an antibody, an immunoglobulin or a fragment thereof, e.g. an Fc-fragment
A61K 49/18 - Nuclear magnetic resonance [NMR] contrast preparationsMagnetic resonance imaging [MRI] contrast preparations characterised by a special physical form, e.g. emulsions, microcapsules, liposomes
The present invention provides: a composition for chemical mechanical polishing, a polishing method which uses this composition for chemical mechanical polishing, and a method for producing abrasive grains which are used therein. The present invention also provides: a composition for chemical mechanical polishing, the composition being capable of polishing a silicon oxide film at a high polishing rate, while having excellent storage stability; a polishing method which uses this composition for chemical mechanical polishing; and a method for producing abrasive grains which are used therein. A method for producing abrasive grains according to the present invention comprises a step in which particles each having a surface to which a hydroxyl group (—OH) is immobilized via a covalent bond, an alkoxysilane having an epoxy group, and a basic compound are mixed and heated.
A radiation-sensitive composition contains: (A) a polymer, and (B) a radiation-sensitive acid-generator formed of an onium cation and an organic anion having 4 or more iodine atoms, the onium cation having at least one group Rf1 selected from the group consisting of a fluoroalkyl group and a fluoro group (excluding a fluoro group in the fluoroalkyl group).
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
32.
COMPOSITION, FOOD/BEVERAGE ITEM, AND METHOD FOR ASSISTING EXAMINATION AND DIAGNOSIS OF DISEASE CAUSED BY PATHOGENIC BACTERIUM OR PATHOGENIC FUNGUS
The present invention provides: a composition and a food/beverage item which can promote the elongation of pili of an intestinal bacterium and exhibits an anti-bacterial activity; and a method for assisting the examination and diagnosis of a disease caused by a pathogenic bacterium or a pathogenic fungus. The present invention provides a composition containing a bacterium capable of producing 3-phenylpropionic acid (PPA) or 3-(4-hydroxyphenyl)propionic acid (4OHPPA). The present invention also provides a food/beverage item containing PPA or 4OHPPA. The present invention further provides a method for assisting the examination and diagnosis of a disease caused by a pathogenic bacterium or a pathogenic fungus. The method comprises: quantifying the amount of PPA or the amount of 4OHPPA in feces from a subject by using 2-nitrophenylhydrazine; and comparing a value obtained by the quantification of the amount of PPA or the amount of 4OHPPA with a reference value. When the value obtained by the quantification of the amount of PPA or the amount of 4OHPPA is smaller than the reference value, it is determined that the subject is possibly affected by the disease.
A photosensitive resin composition includes a polymer (A), a photoacid generator (B), and an organic solvent (C). The polymer (A) includes: a structural unit having a phenolic hydroxy group; and a (meth)acrylate-derived structural unit having an acid-dissociable group. The organic solvent (C) includes 3-ethoxyethyl propionate. A solid content concentration of the photosensitive resin composition is 30 mass % or more.
C08K 5/45 - Heterocyclic compounds having sulfur in the ring
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
C09D 161/18 - Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or their halogen derivatives only
C25D 5/02 - Electroplating of selected surface areas
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
34.
RADIATION-SENSITIVE COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
A radiation-sensitive composition contains: (A) a polymer including a structural unit (U) represented by the following formula (1); and (B) a radiation-sensitive acid-generator formed of an onium cation having at least one group Rf1 selected from the group consisting of a fluoroalkyl group and a fluoro group (excepting a fluoro group in the fluoroalkyl group) and an organic anion having an iodine atom. In formula (1), R1 represents a hydrogen atom, a methyl group, or the like. X1 represents a single bond, an ether bond, an ester bond, or the like. Ar1 represents a cyclic group bound to X1 via an aromatic ring. A hydroxy group or group —ORY is bound to an atom adjacent to the atom bound to X1, among the atoms forming the aromatic group in Ar1. RY represents an acid-releasable group.
A radiation-sensitive composition contains: (A) a polymer including a structural unit (U) represented by the following formula (1); and (B) a radiation-sensitive acid-generator formed of an onium cation having at least one group Rf1 selected from the group consisting of a fluoroalkyl group and a fluoro group (excepting a fluoro group in the fluoroalkyl group) and an organic anion having an iodine atom. In formula (1), R1 represents a hydrogen atom, a methyl group, or the like. X1 represents a single bond, an ether bond, an ester bond, or the like. Ar1 represents a cyclic group bound to X1 via an aromatic ring. A hydroxy group or group —ORY is bound to an atom adjacent to the atom bound to X1, among the atoms forming the aromatic group in Ar1. RY represents an acid-releasable group.
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
35.
INFORMATION PROCESSING SYSTEM, PROGRAM, AND INFORMATION PROCESSING METHOD
NATIONAL CEREBRAL AND CARDIOVASCULAR CENTER (Japan)
Inventor
Takahashi, Shouadnas
Sawada, Katsutoshi
Fujioka, Masayasu
Kobayashi, Nobutoshi
Nakaoka, Yoshikazu
Asano, Ryotaro
Moriuchi, Kenji
Abstract
An information processing system (1) according to an embodiment comprises a determination unit (102) that inputs pulse information relating to the heartbeat of a subject and attribute information pertaining to the subject to a trained model and thereby generates a determination result indicating the presence/absence and the degree of heart disease in the subject. The trained model is trained using, for a plurality of providers who provide training data, pulse information relating to the heartbeat of the provider, attribute information pertaining to the provider, and diagnosis information indicating the state of cardiac function of the provider.
A61B 5/352 - Detecting R peaks, e.g. for synchronising diagnostic apparatusEstimating R-R interval
G16H 50/20 - ICT specially adapted for medical diagnosis, medical simulation or medical data miningICT specially adapted for detecting, monitoring or modelling epidemics or pandemics for computer-aided diagnosis, e.g. based on medical expert systems
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals for use in industry; industrial chemicals for use
in the manufacture of semiconductors; photoresists; chemical
compositions for developing photographs; chemical
preparations for use in photography; photographic
sensitizers; photographic developers.
37.
CRYSTALLINE THERMOPLASTIC RESIN EXPANDED BEAD, MOLDED ARTICLE OF CRYSTALLINE THERMOPLASTIC RESIN EXPANDED BEADS, AND METHOD FOR PRODUCING SAME
A molded article of expanded beads is obtained by mutual fusion-bonding of columnar crystalline thermoplastic resin expanded beads each having no through-hole. The molded article ratio of the molded article of crystalline thermoplastic resin expanded beads is 15 times or more and 90 times or less. The molded article of crystalline thermoplastic resin expanded beads has a closed cell content of 90% or more. The molded article of crystalline thermoplastic resin expanded beads has an open cell content of 2% or more and 12% or less.
The purpose of the present invention is to provide: a radiation sensitive composition which exhibits sensitivity and CDU at satisfactory levels when next generation techniques are used and which can form a resist film in which developing defects are suppressed; and a pattern formation method. Another purpose of the present invention is to provide a polymer and a compound able to be used in the radiation-sensitive composition. The present invention relates to a radiation-sensitive composition which contains: a polymer (A) including a structural unit (I) represented by general formula (1); and a solvent (B). The polymer (A) includes a radiation-sensitive acid-generating structural unit (IV): and/or a radiation-sensitive acid generator (C) is contained in a component other than the polymer (A). An iodo group is contained in at least one component selected from the group consisting of the polymer (A) and the radiation-sensitive acid generator (C). In formula (1), R1is a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group. L1is a single bond or a divalent linking group. Ar denotes a furan ring, a thiophene ring, or a 9- to 20-membered aromatic heterocyclic ring having a furan ring or a thiophene ring. R2is a hydrogen atom or a monovalent organic group having 1-20 carbon atoms. R3is a halogen atom, a hydroxyl group, a cyano group, a nitro group, an amino group, a thiol group or a monovalent organic group having 1-20 carbon atoms. n is an integer between 0 and 4. If the value of n is 2 or more, multiple R3 moieties may be the same as, or different from, each other.
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C07D 307/68 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen
C07D 307/85 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen attached in position 2
C07D 333/38 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
C07D 333/70 - Carbon atoms having three bonds to hetero atoms with at the most one bond to halogen attached in position 2
C07D 407/12 - Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group containing two hetero rings linked by a chain containing hetero atoms as chain links
C07D 409/12 - Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings linked by a chain containing hetero atoms as chain links
C08F 24/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen
C08F 28/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic ring containing sulfur
12 - Land, air and water vehicles; parts of land vehicles
17 - Rubber and plastic; packing and insulating materials
Goods & Services
structural parts for automobiles; vehicle running boards; body panels for vehicles; roof panels for land vehicles semi-processed thermoplastics; plastic wallboards; semi-processed plastics; plastic padding for shipping containers; Thermoplastic foam in the form of cores for use in the manufacture of insulation; Thermoplastic foam in the form of boards for use in the manufacture of insulation; Fiber-reinforced plastic boards being raw material for use in manufacture
40.
METHOD FOR PRODUCING GENE-MODIFIED T CELL POPULATION
Provided is a method of producing a gene-modified T cell population, including mixing a cell population containing T cells with beads each having bound thereto a virus containing a target gene to introduce the target gene into each of the cells of the cell population, wherein the cell population containing the T cells is cultured in a solution containing a CD3 signal activator that is present without being immobilized on a solid phase.
Provided is a method for manufacturing a semiconductor substrate that has excellent embedding properties, in which a composition for forming a metal-containing film is embedded in a substrate pattern. The method for manufacturing the semiconductor substrate comprises: a step for coating a substrate with a film-forming composition; and a step for performing, on the coating film formed in the film-forming composition coating step, at least one process selected from the group consisting of exposure to radiation and exposure to plasma. The film-forming composition contains a metal compound composed of at least a metal atom and an organic acid, and a solvent.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemical source material for the deposition of thin films
upon semiconductor wafers for the manufacture of
semiconductors; industrial chemicals for use in the
manufacture of semiconductors; industrial chemicals;
adhesives for industrial purposes; chemical preparations for
use in photography; photoresists; unprocessed artificial
resins as raw materials in the form of powders, liquids or
pastes; unprocessed plastics in primary form.
43.
POLYMER, COMPOSITION, CURED PRODUCT, LAMINATED BODY, AND ELECTRONIC COMPONENT
A composition includes a polymer containing a repeating unit represented by Formula (1). —N(R′)—R3—N(R′)— is a structure derived from a dimer diamine that is unsubstituted or substituted by a substituent, R′, R1, and R2 each are independently a hydrogen atom, a halogen atom, a hydrocarbon group that is unsubstituted or substituted by a substituent and has 1 to 20 carbon atoms, a heterocyclic aliphatic group that is unsubstituted or substituted by a substituent and has 3 to 20 carbon atoms, or a heterocyclic aromatic group that is unsubstituted or substituted by a substituent and has 3 to 20 carbon atoms, and —NR1R2 may be a nitrogen-containing heterocyclic group which has 5 to 20 ring-constituting atoms and in which R1 and R2 are bonded to each other.
A composition includes a polymer containing a repeating unit represented by Formula (1). —N(R′)—R3—N(R′)— is a structure derived from a dimer diamine that is unsubstituted or substituted by a substituent, R′, R1, and R2 each are independently a hydrogen atom, a halogen atom, a hydrocarbon group that is unsubstituted or substituted by a substituent and has 1 to 20 carbon atoms, a heterocyclic aliphatic group that is unsubstituted or substituted by a substituent and has 3 to 20 carbon atoms, or a heterocyclic aromatic group that is unsubstituted or substituted by a substituent and has 3 to 20 carbon atoms, and —NR1R2 may be a nitrogen-containing heterocyclic group which has 5 to 20 ring-constituting atoms and in which R1 and R2 are bonded to each other.
C09D 151/08 - Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCoating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
C09D 183/10 - Block or graft copolymers containing polysiloxane sequences
44.
RESIST UNDERLAYER FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
Provided are a resist underlayer film-forming composition with which it is possible to form a resist underlayer film having excellent solvent resistance and excellent resist pattern rectangularity, and a method for manufacturing a semiconductor substrate. The resist underlayer film-forming composition contains a polymer having a repeating unit represented by formula (1), and a solvent. (In formula (1), R1represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms. L1represents a 1+n-valent linking group. Ar1represents a monovalent group having an aromatic ring having 6 to 20 ring members. The aromatic ring has at least one halogen atom. n represents an integer of 1 to 3. When n is 2 or more, a plurality of the Ar1s are the same as or different from one another. L1has at least one group (A) selected from the group consisting of a group represented by formula (2-1), a group represented by formula (2-2), a group represented by formula (2-3), a group represented by formula (2-4), a group represented by formula (2-5), a group represented by formula (2-6), a group represented by formula (2-7), and a group represented by formula (2-8).) (In formulae (2-1) to (2-8), R7each independently represent a divalent organic group having 1 to 20 carbon atoms or a single bond. R8, R9, R10, and R13each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms. Cy represents a ring structure constituted together with two carbon atoms in formula (2-2) and having 3 to 20 ring members. R11represents a hydrogen atom, a monovalent organic group having 1 to 20 carbon atoms, or a single bond. R12represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms. ** represents a bond with an atom constituting Cy. Note that if R11is a single bond, R11is combined with **. * represents a bond with an atom constituting L1.)
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C08F 12/32 - Monomers containing only one unsaturated aliphatic radical containing two or more rings
Provided are a radiation-sensitive composition and a pattern formation method that can exhibit, at the time of pattern formation, a sufficient level of sensitivity, LWR performance, pattern rectangularity, development defect suppression, CDU performance, and pattern circularity. This radiation-sensitive composition includes: a polymer that includes a structural unit (I) represented by formula (1); an onium salt that includes an organic acid anion including a cyclic structure, and an onium cation; and a solvent. (In formula (1), R1is a hydrogen atom or a C1-20 monovalent organic group, L is a single bond or a divalent linking group, R2is a C1-5 substituted or unsubstituted monovalent hydrocarbon group, R3is a C1-10 monovalent organic group, a hydroxy group, a nitro group, a cyano group, an amino group, a halogen atom, or a sulfanyl group, in cases in which there are a plurality of R3s present, the plurality of R3s may be the same as or different from each other, and n is an integer from 0 to 10.)
A radiation-sensitive resin composition includes: a first polymer and a compound. A solubility of the first polymer in a developer solution is capable of being altered by an action of an acid. The first polymer includes: a first structural unit containing a partial structure obtained by substituting a hydrogen atom of a carboxy group, a phenolic hydroxy group, or an amide group with a group represented by the following formula (1); and a second structural unit containing a phenolic hydroxy group. The compound includes: a monovalent radiation-sensitive onium cation containing an aromatic ring obtained by substituting at least one hydrogen atom with a fluorine atom or a fluorine atom-containing group; and a monovalent organic acid anion.
A radiation-sensitive resin composition includes: a first polymer and a compound. A solubility of the first polymer in a developer solution is capable of being altered by an action of an acid. The first polymer includes: a first structural unit containing a partial structure obtained by substituting a hydrogen atom of a carboxy group, a phenolic hydroxy group, or an amide group with a group represented by the following formula (1); and a second structural unit containing a phenolic hydroxy group. The compound includes: a monovalent radiation-sensitive onium cation containing an aromatic ring obtained by substituting at least one hydrogen atom with a fluorine atom or a fluorine atom-containing group; and a monovalent organic acid anion.
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
47.
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN
A radiation-sensitive resin composition includes a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a first structural unit represented by the following formula (1); a radiation-sensitive acid generating agent; and an acid diffusion control agent having a monovalent radiation-sensitive onium cation and a monovalent organic acid anion.
A radiation-sensitive resin composition includes a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a first structural unit represented by the following formula (1); a radiation-sensitive acid generating agent; and an acid diffusion control agent having a monovalent radiation-sensitive onium cation and a monovalent organic acid anion.
A method for manufacturing a semiconductor substrate includes: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film; applying a composition for forming a resist film to the resist underlayer film to form a resist film; exposing the resist film to radiation; and developing at least the exposed resist film. The composition for forming a resist underlayer film includes a polymer and a solvent. The polymer includes a repeating unit (1) which includes an organic sulfonic acid anion moiety and an onium cation moiety.
C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Provided are: thermoplastic polymer foamed particles in which it is possible to identify the foamed particles themselves; and a thermoplastic polymer foamed particle molded body that, by being formed from the identifiable thermoplastic polymer foamed particles, can be identified without ruining the aesthetics thereof. Further provided is an identification method for the thermoplastic polymer foamed particles and/or the thermoplastic polymer foamed particle molded body. Thermoplastic polymer foamed particles (100) exhibit a light emission reaction derived from a light-emitting rare-earth element (10) through irradiation with electromagnetic waves. This thermoplastic polymer foamed particle molded body is formed through in-mold molding using the thermoplastic polymer foamed particles (100) and thereby exhibits a light emission reaction. This identification method for the thermoplastic polymer foamed particles or the thermoplastic polymer foamed particle molded body comprises: i) an electromagnetic wave irradiation step for irradiating the surfaces of the thermoplastic polymer foamed particles or the thermoplastic polymer foamed particle molded body with electromagnetic waves; and ii) a detection step for detecting, by using a detection device, a light emission reaction that is derived from a light-emitting rare-earth element and that occurs through the irradiating with the electromagnetic waves to obtain a light emission spectrum. A first method of the identification method further comprises iii-1) an identification step for observing the contrast between the light emission spectrum and a blank spectrum in which the light emission reaction derived from the light-emitting rare-earth element is not exhibited. A second method of the identification method further comprises iii-2) an identification step for comparing the light emission spectrum with a preset standard light emission spectrum in which the light emission reaction derived from the light-emitting rare-earth element is exhibited.
C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
B29C 44/00 - Shaping by internal pressure generated in the material, e.g. swelling or foaming
B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads
50.
RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, AND ONIUM SALT COMPOUND
The present invention provides a radiation-sensitive composition with which it is possible to from a resist film capable of exhibiting sensitivity, LWR performance, pattern rectangularity, CDU, pattern circularity, MEEF, and DOF at sufficient levels, and a pattern formation method. The radiation-sensitive composition contains: a first onium salt compound represented by formula (1); at least one type of second onium salt compound selected from the group consisting of a carboxylate compound represented by formula (2) and a carboxylic acid intramolecular salt compound represented by formula (3); a polymer including a structure unit having an acid dissociable group; and a solvent. (In formula (1), A is a (1+n)-valent organic group having 1 to 40 carbon atoms. Rf1and Rf2are each independently a hydrogen atom, a monovalent organic group, a fluorine atom, or a monovalent fluorinated hydrocarbon group. If a plurality of Rf1s and a plurality of Rf2s are present, the plurality of Rf1s and the plurality of Rf211 +is a radiation-sensitive onium cation.) (In formula (2), R122 +is an organic cation.) (In formula (3), R233 + is a monovalent organic onium cation.)
This radiation-sensitive composition contains: a polymer whose solubility with respect to a developer changes due to the action of an acid; and a compound having an anion and a radiation-sensitive onium cation, wherein the polymer has a structural unit including a group that generates sulfonic acid due to the action of radiation, the polymer includes an iodine group, and at least one of the anion and the radiation-sensitive onium cation includes an acid-dissociable group.
Provided are: a resin composition comprising a compound (A) that comprises at least one compound selected from the group consisting of a compound (A1) having two or more partial structures represented by formula (1) and a compound (A2) represented by formula (2) and a polymer (B) having a group crosslinkable with the compound (A) and an aromatic ring; a cured article; a prepreg; a copper-clad laminate board; an interlayer insulation film; and a compound. The explanation for each substituent in the formulae is as described in the description.
C08G 65/40 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols and other compounds
C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
Provided are a radiation-sensitive composition, a pattern formation method, and an onium salt compound that make it possible to achieve sufficient sensitivity, CDU performance, pattern circularity, development defect suppression, depth of focus, LWR performance, pattern rectangularity, and exposure latitude when a pattern is formed. A radiation-sensitive composition according to the present invention includes: an onium salt compound represented by formula (1); a polymer that includes a structural unit (I) represented by formula (2); and a solvent. (In formula (1), A is a C3–40 (1+n)-valent organic group that includes a cyclic structure. When A includes a straight-chain alkanediyl group, the number of carbons in the straight-chain alkanediyl group is 1 or 2. A does not include a cyclohexylcarbonyloxy structure. Rf1and Rf2are each independently a hydrogen atom, a C1–20 monovalent organic group, a fluorine atom, or a monovalent fluorinated hydrocarbon group. When there are multiple Rf1and Rf2, the Rf1and Rf2are each the same or different. At least one of Rf1and Rf2is a fluorine atom or a monovalent fluorinated hydrocarbon group. m1 is an integer from 1 to 4, inclusive. m2 is 0 or 1. n is an integer from 1 to 3, inclusive. Z+is a monovalent radiation-sensitive onium cation. The number of fluorine atoms in Z+is no more than 8.) (In formula (2), RAis a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. L is a single bond or a divalent linking group. W is a monocyclic lactone structure, a monocyclic carbonate structure, a monocyclic sultone structure, a monocyclic sulfone structure, or a monocyclic ether structure. R11is a C1–10 monovalent organic group, a cyano group, a nitro group, a hydroxy group, or an amino group. When there are multiple R11, the R11 are each the same or different. p is an integer from 0 to 3, inclusive. q is 0 or 1.)
Provided is a radiation-sensitive composition and a pattern formation method with which sensitivity, LWR performance, pattern rectangularity, CDU performance, pattern circularity, MEEF, and exposure margin can be exhibited at a sufficient level when a pattern is formed. This radiation-sensitive resin composition comprises: a first onium salt compound represented by formula (1), a second onium salt compound represented by formula (2), a polymer containing structural units having an acid-dissociable group, and a solvent. (In formula (1), A is a C1–C40 (1+n)-valent organic group. Rf1and Rf2are each independently a hydrogen atom, a C1–C20 monovalent organic group, a fluorine atom, or a monovalent fluorinated hydrocarbon group. When both Rf1and Rf2are present in pluralities, the plurality of Rf1and Rf2are the same as or different from each other. At least one of Rf1and Rf2is a fluorine atom or a monovalent fluorinated hydrocarbon group. R1and R2are each independently a hydrogen atom, a fluorine atom, or a C1–C20 monovalent organic group. When both R1and R2are present in pluralities, the plurality of R1and R211 +11 +.) (In formula (2), R433 −22 + is a monovalent organic cation.)
The present invention addresses the problem of providing: a radiation-sensitive composition and a pattern formation method with which it is possible to achieve sufficient levels of sensitivity, development contrast, development residue suppression property, and limit resolution property during formation of a pattern; and a polymer which can be used suitably for the radiation-sensitive composition. The radiation-sensitive composition contains: a polymer (A) containing a structural unit that has an acid-dissociable group, a structural unit that has a first organic acid anion (b1) and a first onium cation (c1) and includes a first acid-generating structure capable of generating, when exposed, an acid that induces the dissociation of the acid-dissociable group, and a structural unit that has a second organic acid anion (b2) and a second onium cation (c2) and includes a second acid-generating structure capable of generating, when exposed, an acid that does not induce the dissociation of the acid-dissociable group; and a solvent (B). The polymer (A) includes a partial structure represented by formula (i). (In formula (i), Ar represents a 5- to 20-membered aromatic ring having a valency of (m1 + m2 + m3 +1); X1represents a hydroxy group, a carboxy group, a sulfonic acid group, or a mercapto group, wherein, when there are a plurality of X1's, the plurality of X1's are the same as or different from each other; R1represents an acid-dissociable group or a non-acid-dissociable group, wherein, when there is one R1, the R1represents an acid-dissociable group, and when there are a plurality of R1's, at least one of the plurality of R1's represents an acid-dissociable group, and when there are a plurality of R1's, the plurality of R1's are the same as or different from each other; R2represents a halogen atom, a cyano group, a nitro group, or a monovalent organic group (excluding -COOR1), wherein, when there are a plurality of R2's, the plurality of R2's are the same as or different from each other; m1 represents an integer of 1-5, m2 represents an integer of 0-5, and m3 represents an integer of 0-6, wherein 2 ≤ m1 + m2; and "*" represents a bond to another structure in the polymer (A).)
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals for use in industry; industrial chemicals for use in the manufacture of semiconductors; photoresists; chemical compositions for developing photographs; chemical preparations for use in photography; photographic sensitizers; photographic developers.
57.
RADIATION-SENSITIVE COMPOSITION, PATTERN FORMATION METHOD, AND POLYMER
Provided are a radiation-sensitive composition and pattern formation method that can exhibit satisfactory levels of sensitivity, CDU, and development defect suppression during pattern formation; and a polymer that can be advantageously used in said radiation-sensitive composition. This radiation-sensitive composition contains: a polymer (A) comprising a structural unit (I) having an acid-dissociable group, a structural unit (II) that has a first organic acid anion (b1) and a first onium cation (c1) and that contains a first acid-generating structure that upon exposure generates an acid that induces dissociation of the acid-dissociable group, and a structural unit (III) that has a second organic acid anion (b2) and a second onium cation (c2) and that contains a second acid-generating structure that upon exposure generates an acid that does not induce dissociation of the acid-dissociable group; and a solvent (B). The polymer (A) has at least one alcoholic hydroxyl group, and the second onium cation (c2) is a radiation-sensitive onium cation.
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
Provided are an organic resin material that makes it possible to uniformly fix an electroconductive carbon material over the entirety of an electroconductive film formation region, a method for manufacturing an electroconductive film using the organic resin material, and a touch panel and a display panel each comprising an electroconductive film manufactured by means of the manufacturing method. The method comprises: a step (A) for applying an organic resin material containing a polymer obtained by reacting an aliphatic tetracarboxylic acid dianhydride with an aliphatic diamine onto a base material to form an organic resin layer; a step (B) for applying a dispersion liquid containing a dispersant and carbon nanotubes onto the organic resin layer after the step (A) to form a coating film; a step (C) for drying the coating film after the step (B); and a step (D) for depositing a dispersant extraction liquid after the step (C), thereby removing the dispersant from the coating film.
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
B05D 1/36 - Successively applying liquids or other fluent materials, e.g. without intermediate treatment
B05D 3/10 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
59.
SUBSTRATE FOR SEMICONDUCTOR PRODUCTION, METHOD FOR PRODUCING SUBSTRATE FOR SEMICONDUCTOR PRODUCTION, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE
The present invention provides: a substrate for semiconductor production which is excellent in suppression of collapse of a resist pattern; a method for producing a substrate for semiconductor production; and a method for producing a semiconductor substrate. Provided is a substrate for semiconductor production comprising a substrate that has a thin film, wherein the thin film has a group derived from a compound represented by formula (1). (In formula (1), R1 is an C1-40 n-valent organic group. n is an integer of 1-4.)
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1), a resin including a structural unit having an acid-dissociable group, and an alcohol-based solvent having a boiling point of 90° C. or higher. R1 is a substituted or unsubstituted monovalent hydrocarbon group or a group including a divalent hetero atom-containing group between two adjacent carbon atoms of the hydrocarbon group; R2 and R3 are each independently a hydrogen atom or a monovalent hydrocarbon group, one of Rf11 and Rf12 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group, m1 is an integer of 1 to 3; m2 is an integer of 0 to 8; and Z1+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1), a resin including a structural unit having an acid-dissociable group, and an alcohol-based solvent having a boiling point of 90° C. or higher. R1 is a substituted or unsubstituted monovalent hydrocarbon group or a group including a divalent hetero atom-containing group between two adjacent carbon atoms of the hydrocarbon group; R2 and R3 are each independently a hydrogen atom or a monovalent hydrocarbon group, one of Rf11 and Rf12 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group, m1 is an integer of 1 to 3; m2 is an integer of 0 to 8; and Z1+ represents a monovalent radiation-sensitive onium cation.
A method for manufacturing a surface-treated substrate according to the present invention includes a step for applying a composition to the surface of a substrate including a first region and a second region different in material from the first region to selectively modify the surface of the substrate. The composition contains: compound (A) that is at least one compound selected from the group consisting of a compound represented by formula (1), a compound represented by formula (2), and a compound represented by formula (3); and 1 mass% or more of water with respect to the total amount of the composition. R1, R4, and R8 are each independently a monovalent chain group having 9 or more carbon atoms.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or the like; R2 and R3 are each independently a hydrogen atom or a monovalent hydrocarbon group; one of Rf11 and Rf12 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group; and Z1+ represents a monovalent radiation-sensitive onium cation. R4 is a monovalent organic group including a cyclic structure; Rf21 and Rf22 each independently represent a fluorine atom or a monovalent fluorinated hydrocarbon group; and Z2+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or the like; R2 and R3 are each independently a hydrogen atom or a monovalent hydrocarbon group; one of Rf11 and Rf12 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group; and Z1+ represents a monovalent radiation-sensitive onium cation. R4 is a monovalent organic group including a cyclic structure; Rf21 and Rf22 each independently represent a fluorine atom or a monovalent fluorinated hydrocarbon group; and Z2+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or the like; R2 and R3 are each independently a hydrogen atom, a fluorine atom, or the like; and Z+ represents a monovalent radiation-sensitive onium cation. R4 is a monovalent organic group; one of Rf21 and Rf22 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group; Ar is a monovalent organic group including an aromatic ring; R5, R6, R7, and R8 each independently represent a hydrogen atom, a hydroxy group, a halogen atom, or a monovalent organic group; and X is a single bond or a divalent hetero atom-containing group.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or the like; R2 and R3 are each independently a hydrogen atom, a fluorine atom, or the like; and Z+ represents a monovalent radiation-sensitive onium cation. R4 is a monovalent organic group; one of Rf21 and Rf22 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group; Ar is a monovalent organic group including an aromatic ring; R5, R6, R7, and R8 each independently represent a hydrogen atom, a hydroxy group, a halogen atom, or a monovalent organic group; and X is a single bond or a divalent hetero atom-containing group.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or a group including a divalent hetero atom-containing group between two adjacent carbon atoms of the hydrocarbon group; R2 and R3 are each independently a hydrogen atom, a fluorine atom, or the like; and one of Rf11 and Rf12 is a fluorine atom, and the other is a hydrogen atom, a fluorine atom, or a monovalent fluorinated hydrocarbon group. R4 is a monovalent organic group in which neither a fluorine atom nor a fluorinated hydrocarbon group is bonded to an atom adjacent to the sulfur atom.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or a group including a divalent hetero atom-containing group between two adjacent carbon atoms of the hydrocarbon group; R2 and R3 are each independently a hydrogen atom, a fluorine atom, or the like; and one of Rf11 and Rf12 is a fluorine atom, and the other is a hydrogen atom, a fluorine atom, or a monovalent fluorinated hydrocarbon group. R4 is a monovalent organic group in which neither a fluorine atom nor a fluorinated hydrocarbon group is bonded to an atom adjacent to the sulfur atom.
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
C08F 220/36 - Esters containing nitrogen containing oxygen in addition to the carboxy oxygen
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
65.
PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE AND COMPOSITION FOR RESIST UNDERLAYER FORMATION
The present invention provides: a production method for a semiconductor substrate that makes it possible to form a resist underlayer having excellent pattern rectangularity; and a composition for resist underlayer formation. Provided is a production method for a semiconductor substrate, said method comprising: a step for applying a composition for resist underlayer formation directly or indirectly onto a substrate; a step for applying a composition resist film formation directly or indirectly onto a resist underlayer formed in the step for applying the composition for resist underlayer formation; a step for exposing a resist film formed in the step for applying the composition resist film formation; and a step for developing at least the exposed resist film. The composition for resist underlayer formation contains a compound and a solvent. The compound comprises -ORA, where RAis a hydrogen atom, a C1-10 monovalent heteroatom-containing group, or a C1-10 monovalent organic group (excluding C1-10 monovalent heteroatom-containing groups). Among the structures constituting RA, when the proportion of hydrogen atoms is represented as x, the proportion of the C1-10 monovalent heteroatom-containing group is represented as y, and the proportion of the C1-10 monovalent organic group is represented as z, in the entirety of the compound, x+y+z=100, and the relations 20≤x≤95 and 5≤y≤80 are satisfied. The compound is a polymer which has a repeating unit represented by formula (1), an aromatic-ring-containing compound which has a molecular weight of 750-3,000 and which comprises -ORA, or a combination of these. (In formula (1), Ar1is a divalent group having a 5- to 40-membered aromatic ring. R0is a hydrogen atom or a C1-40 monovalent organic group. R1is a C1-40 monovalent organic group. At least one selected from the group consisting of Ar1, R0, and R1has -ORA.)
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C08G 61/10 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aromatic carbon atoms, e.g. polyphenylenes
66.
PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING SAME, LIQUID CRYSTAL DEVICE, SEMICONDUCTOR DEVICE, POLYMER, AND COMPOUND
This photosensitive composition contains: a polymer derived from a monomer having a C1-C3 halogenated alkyl group containing at least one hydrogen atom, and including a structural unit (a1) having a hydroxyl group; and a photosensitive compound.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals for use in industry; industrial chemicals for use
in the manufacture of semiconductors; photoresists; chemical
compositions for developing photographs; chemical
preparations for use in photography; photographic
sensitizers; photographic developers.
68.
CELL ADHESIVE PARTICLE AND PARTICLE PRODUCTION METHOD
The present invention provides particles having excellent cell adhesiveness. Cell adhesive particles according to the present invention each contain, in a molecule, a structural unit having at least one selected from groups represented by formula (1) and groups represented by formula (2). [In formula (1), R1represents an alkanediyl group having 2-10 carbon atoms, R2and R3each independently represent a hydrogen atom or an alkyl group having 1-10 carbon atoms, and * represents a binding site.] [In formula (2), R4represents an alkanediyl group having 2-10 carbon atoms, R5-R7each independently represent a hydrogen atom or an alkyl group having 1-10 carbon atoms, X- represents a counter anion, and * represents a binding site.]
Provided are a radiation-sensitive composition and a pattern formation method capable of exhibiting, at sufficient levels, sensitivity, development contrast, development defect suppression property, and limit resolution when forming patterns. This radiation-sensitive composition contains a polymer and a solvent. The polymer includes: a structural unit (I) that has an iodo group and that also has an acid-dissociable group; a structural unit (II) that has a first organic acid anion and a first onium cation and that includes a first acid-generating structure for generating, through exposure to light, an acid that induces dissociation of the acid-dissociable group; and a structural unit (III) that has a second organic acid anion and a second onium cation, and that includes a second acid-generating structure for generating, through exposure to light, an acid that does not induce dissociation of the acid-dissociable group.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals for use in industry; industrial chemicals for use
in the manufacture of semiconductors; photoresists; chemical
compositions for developing photographs; chemical
preparations for use in photography; photographic
sensitizers; photographic developers.
71.
SEMICONDUCTOR SUBSTRATE PRODUCTION METHOD AND FILM-FORMING COMPOSITION
Provided are: a semiconductor substrate production method that uses a metal-containing resist underlayer film capable of imparting favorable rectangularity to a metal resist pattern; and an underlayer film-forming composition for a first metal-containing resist. This semiconductor substrate production method includes a step for coating a substrate with a film-forming composition. The film-forming composition contains a solvent and a metal compound comprising at least a metal atom and an organic acid. The organic acid is a compound represented by formula (1). (In formula (1), R1is a hydroxy group, a nitro group, a halogen atom or a C1-20 monovalent organic group (excluding the structure corresponding to -L1-COOH and the structure corresponding to X in the formula). Ar1is a C3-30 r+s+t-valent aromatic ring structure. X is a crosslinkable group. L1represents a single bond or a divalent linking group. t is an integer of 0-2. When t is 2, the two R1are the same or different. r is an integer of 1-4. When r is 2 or more, the plurality of X are the same or different. s is an integer of 1-4. When s is 2 or more, the plurality of L1 are the same or different.)
C09D 149/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more carbon-to-carbon triple bondsCoating compositions based on derivatives of such polymers
C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemical source material for the deposition of thin films upon semiconductor wafers for the manufacture of semiconductors; industrial chemicals for use in the manufacture of semiconductors; industrial chemicals; adhesives for industrial purposes; chemical preparations for use in photography; photoresists; unprocessed artificial resins as raw materials in the form of powders, liquids or pastes; unprocessed plastics in primary form.
73.
PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCING PLATED MOLDED ARTICLE, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE
An embodiment of the present invention relates to a photosensitive resin composition for producing a plated molded article, a method for producing a resist pattern film, and a method for producing a plated molded article. Said composition contains: a (meth)acrylic polymer (A1) having an acid dissociable group; a photoacid generator (B); at least one compound (C) selected from the group consisting of an organic carboxylic acid compound (C1) having a pKa of 4.5 or less, an organic carboxylic acid anhydride (C2) having a pKa of 4.5 or less, and a polyhydric phenol compound (C3) having a CLogP of 4.5 or less; and a solvent (G).
One embodiment of the present invention relates to a photosensitive resin composition, a method for producing a resist pattern film, or a method for producing a plated shaped article. The photosensitive resin composition contains a polymer (A1) that is selected from among an alkali-soluble polymer and a polymer having an acid dissociable group, a polymer (A2) that is selected from among an alkali-soluble polymer and a polymer having an acid dissociable group, a photoacid generator (B), and a solvent (C). The glass transition temperature (Tg) of the polymer (A2) is -45°C to 25°C, and the glass transition temperature (Tg) of the polymer (A1) is higher than the Tg of the polymer (A2) by 55°C to 120°C.
This radiation-sensitive composition comprises a polymer which contains, in the same molecule, a first structural unit having an acid-dissociable group, a second structural unit having a radiation-sensitive onium cation and a sulfonic acid anion, and a third structural unit having a radiation-sensitive onium cation and a carboxylic acid anion, and in which the content ratio of the first structural unit is at least 55 mol% with respect to all the structural units.
This radiation-sensitive composition contains a polymer containing: a first structural unit having a radiation-sensitive onium cation and a sulfonic acid anion; a second structural unit having a radiation-sensitive onium cation and a carboxylic acid anion; and a third structural unit represented by formula (1). In formula (1), R1represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. B1is a single bond or a divalent hydrocarbon group. L1is a divalent organic group. R2 is an acid-decomposable group.
Provided are a method for manufacturing a semiconductor substrate with which it is possible to form an underlayer film for a metal-containing resist capable of achieving excellent rectangularity in a resist pattern, and a composition for forming an underlayer film for a metal-containing resist. This method for manufacturing a semiconductor substrate comprises: a step for directly or indirectly applying, to a substrate, a composition for forming an underlayer film for a metal-containing resist; a step for forming a metal-containing resist film on an underlayer film for a metal-containing resist, the underlayer film being formed by means of the step for applying the composition for forming an underlayer film for a metal-containing resist; a step for exposing the metal-containing resist film to extreme ultraviolet rays; and a step for developing at least the exposed metal-containing resist film. The composition for forming an underlayer film for a metal-containing resist contains a solvent and a compound having a structural unit (α) represented by formula (1-1). (In formula (1-1), a is an integer of 1-3. R1is a C1-20 monovalent organic group, a hydroxy group, or a halogen atom. b is an integer of 0-2. When b is 2, the two R1 are the same as each other or are different from one another. However, a + b is 3 or less.)
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
C08G 77/24 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen halogen-containing groups
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
78.
RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, AND POLYMER
This radiation-sensitive composition contains a polymer containing: a first structural unit having a radiation-sensitive onium cation and a sulfonic acid anion; a second structural unit having a radiation-sensitive onium cation and a carboxylic acid anion; and a third structural unit represented by formula (1). In formula (1), Ar1is a group obtained by removing (s+t+1) hydrogen atoms from an aromatic hydrocarbon ring. s is an integer of 1 or higher. t is an integer of 1 or higher. R2is a hydroxy group, an alkyl group, an alkoxy group or -OX1. X1 is an acid-decomposable group.
Provided are: a radiation-sensitive composition capable of exhibiting excellent sensitivity, CDU performance, DOF performance, pattern circularity, LWR performance, pattern rectangularity, and development defect suppression when forming a pattern; a pattern formation method; and an onium salt. This radiation-sensitive composition contains an onium salt represented by formula (1) (hereinafter, also referred to as an "onium salt (1)"), a polymer containing a structural unit (I) having an acid-dissociable group, and a solvent. (In formula (1), Ar1is an (a1 + b1 +1)-valent aromatic ring. Ar2is an (a2 + b2 +1)-valent aromatic ring. X1and X2are each independently a monovalent organic group having 1-20 carbon atoms, a cyano group, a nitro group, or a halogen atom. When multiple X1and multiple X2are present, the multiple X1and the multiple X2are each identical to or different from each other. Y1is a monovalent organic group having 4-20 carbon atoms and bonded via Ar122-, or a monovalent perfluoroalkyl group having 1-20 carbon atoms. When multiple Y1are present, the multiple Y1are identical to or different from each other. Y2is a monovalent organic group having 4-20 carbon atoms and bonded via Ar222-, or a monovalent perfluoroalkyl group having 1-20 carbon atoms. When multiple Y2are present, the multiple Y2are identical to or different from each other. L is a single bond or a divalent linking group having 1-5 carbon atoms. a1, a2, b1, and b2 are each independently an integer of 0-5. When the aromatic ring of Ar2 is a benzene ring, b1 + b2 ≥ 1.)
C07C 65/21 - Compounds having carboxyl groups bound to carbon atoms of six-membered aromatic rings and containing any of the groups OH, O-metal, —CHO, keto, ether, groups, groups, or groups containing ether groups, groups, groups, or groups
C07C 255/56 - Carboxylic acid nitriles having cyano groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing cyano groups and doubly-bound oxygen atoms bound to the carbon skeleton
C07C 317/14 - SulfonesSulfoxides having sulfone or sulfoxide groups bound to carbon atoms of six-membered aromatic rings
C07D 207/34 - Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having two double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
C07D 209/30 - IndolesHydrogenated indoles with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, directly attached to carbon atoms of the hetero ring
C07D 209/88 - CarbazolesHydrogenated carbazoles with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to carbon atoms of the ring system
C07D 307/56 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
C07D 307/79 - Benzo [b] furansHydrogenated benzo [b] furans with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to carbon atoms of the hetero ring
C07D 307/88 - Benzo [c] furansHydrogenated benzo [c] furans with one oxygen atom directly attached in position 1 or 3
C07D 317/22 - Radicals substituted by singly bound oxygen or sulfur atoms etherified
C07D 317/62 - Methylenedioxybenzenes or hydrogenated methylenedioxybenzenes, unsubstituted on the hetero ring with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to atoms of the carbocyclic ring
C07D 317/72 - Heterocyclic compounds containing five-membered rings having two oxygen atoms as the only ring hetero atoms having the hetero atoms in positions 1 and 3 spiro-condensed with carbocyclic rings
C07D 333/62 - Benzo [b] thiophenesHydrogenated benzo [b] thiophenes with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to carbon atoms of the hetero ring
Disclosed is a photosensitive composition which contains the components (A) and (B) described below. (A): One or more Si-containing compounds selected from among (A1) and (A2) described below (A1): An Si-containing compound that has a structural unit a1 having an alkali-soluble group and a polymerizable group, and a structural unit a2 having a polymerizable group or a structural unit a3 having an alkali-soluble group (A2): An Si-containing compound that has a structural unit a2 having a polymerizable group and a structural unit a3 having an alkali-soluble group (B): Photopolymerization initiator
C08F 299/08 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
C08G 77/38 - Polysiloxanes modified by chemical after-treatment
G02B 1/111 - Anti-reflection coatings using layers comprising organic materials
A polyamide-based resin melt obtained by melt-kneading a base resin, an organic compound-based additive (A), and an iodide-based additive (X) is granulated to prepare polyamide-based resin particles. The polyamide-based resin particles are expanded by using a physical blowing agent to produce polyamide-based resin expanded beads. The polyamide-based resin expanded beads are in-mold molded to produce a polyamide-based resin expanded molded article. The organic compound-based additive (A) is made of a hindered phenol-based compound and/or an organophosphorus-based compound. The iodide-based additive (X) is made of copper iodide, or copper iodide and potassium iodide.
C08J 3/20 - Compounding polymers with additives, e.g. colouring
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
82.
POLYAMIDE RESIN FOAMED PARTICLES AND METHOD FOR PRODUCING SAME
A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.
A method for producing a semiconductor substrate includes: applying a silicon-containing composition directly or indirectly to a substrate to form a silicon-containing film; applying a composition for forming a resist film to the silicon-containing film to form a resist film; exposing the resist film to radiation; and developing at least the exposed resist film. The silicon-containing composition includes: a silicon-containing compound; a polymer including a structural unit represented by formula (1); and a solvent. A content of the silicon-containing compound in the silicon-containing composition relative to 100% by mass of components other than the solvent in the silicon-containing composition is from 50% to 99.9% by mass. RA1 is a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and RA2 is a monovalent organic group having 1 to 20 carbon atoms.
A method for producing a semiconductor substrate includes: applying a silicon-containing composition directly or indirectly to a substrate to form a silicon-containing film; applying a composition for forming a resist film to the silicon-containing film to form a resist film; exposing the resist film to radiation; and developing at least the exposed resist film. The silicon-containing composition includes: a silicon-containing compound; a polymer including a structural unit represented by formula (1); and a solvent. A content of the silicon-containing compound in the silicon-containing composition relative to 100% by mass of components other than the solvent in the silicon-containing composition is from 50% to 99.9% by mass. RA1 is a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and RA2 is a monovalent organic group having 1 to 20 carbon atoms.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
C08K 5/5419 - Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
Provided are: a resist underlayer film-forming composition that is capable of forming a resist underlayer film that can impart excellent pattern rectangularity to a resist pattern; and a method for producing a semiconductor substrate. The method for producing a semiconductor substrate comprises: a step for directly or indirectly coating a substrate with a resist underlayer film-forming composition; a step for forming a resist film on the resist underlayer film formed by the aforementioned step for coating a resist underlayer film-forming composition; a step for exposing the resist film to radiation; and a step for developing at least the exposed resist film. The resist underlayer film-forming composition contains a polymer and a solvent. The polymer contains a repeating unit (1) having an organosulfonate anion moiety and an onium cation moiety, a repeating unit (2) represented by formula (2), and a repeating unit (3) represented by formula (3). (In formula (2), R4is a group selected from the group consisting of groups represented by any of formulas (2-1) to (2-8).) (In formula (3), R6is a group that contains a substructure represented by formula (3-1) or (3-2).) (In formulas (3-1) and (3-2), X1and X2 are each independently an oxygen atom, a sulfur atom, or a nitrogen atom. A formula in which a solid line and a broken line are combined indicates a single bond or a double bond each independently.)
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C08F 228/02 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a bond to sulfur or by a heterocyclic ring containing sulfur by a bond to sulfur
G03F 7/095 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
H01L 21/027 - Making masks on semiconductor bodies for further photolithographic processing, not provided for in group or
These polypropylene resin foam particles each have a foam core layer composed of a polypropylene resin, and a coating layer covering the foam core layer. The coating layer is composed of linear low-density polyethylene. The mass ratio of the coating layer to the foam core layer is 0.005-0.05. The polypropylene resin constituting the foam core layer satisfies a prescribed condition (i) or (ii). Said foam particles can remarkably reduce the steam pressure at the time of in-mold molding, can shorten the curing time, and furthermore makes it possible to obtain a foam particle molded article that has a desired shape and is excellent in appearance even when the curing time is shortened.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals for use in industry; industrial chemicals for use in the manufacture of semiconductors; photoresists; chemical compositions for developing photographs; chemical preparations for use in photography; photographic sensitizers; photographic developers.
An enzyme sensor may be configured to measure a measurement target substance included in a secretion of a living body. The enzyme sensor may include a layered structure including, in this order, (a) an absorber layer configured to absorb the secretion, (b) an enzyme layer containing an enzyme, (c) a mediator layer, and (d) an electrode part. The absorber layer may include a polymeric material having a chemically bound crosslinked structure.
A61B 5/1486 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value using chemical or electrochemical methods, e.g. by polarographic means using enzyme electrodes, e.g. with immobilised oxidase
A61B 5/145 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value
C12Q 1/00 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions
G06F 9/06 - Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
G06F 15/00 - Digital computers in generalData processing equipment in general
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals for use in industry; industrial chemicals for use in the manufacture of semiconductors; photoresists; chemical compositions for developing photographs; chemical preparations for use in photography; photographic sensitizers; photographic developers.
90.
METHOD FOR MANUFACTURING MAGNETIC TUNNEL JUNCTION ELEMENT
Provided is a method for manufacturing a magnetic tunnel junction element provided with a magnetic tunnel junction layer and a metal layer in the stated order directly or indirectly on a substrate, the method comprising: a step for applying, to the metal layer, a resist composition containing a polymer that has a structural unit containing an aromatic ring; a step for exposing a resist film formed through the application step; a step for developing the exposed resist film; and a step for etching the magnetic tunnel junction layer and the metal layer using, as a mask, a resist pattern formed through the development step.
A method for manufacturing a magnetic tunnel junction element comprising a magnetic tunnel junction layer and a metal layer directly or indirectly on a substrate in this order, the method comprising: a step for forming a resist underlayer film on the metal layer; a step for forming a silicon oxide film on the resist underlayer film; and a step for forming a resist film on the silicon oxide film, wherein the resist underlayer film is formed from a resist underlayer film-forming composition containing a compound having an aromatic ring and a solvent.
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
G03F 7/40 - Treatment after imagewise removal, e.g. baking
H10B 61/00 - Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
Provided are: a method for manufacturing a semiconductor substrate that uses an underlayer film for a metal-containing resist, the underlayer film capable of imparting good rectangularity to a metal resist pattern; and an underlayer film-forming composition for a first metal-containing resist. This method for manufacturing a semiconductor substrate includes: a step for directly or indirectly coating a substrate with an underlayer film-forming composition for a first metal-containing resist; a step for forming a metal-containing resist film, which is made of a second metal-containing resist forming material, on an underlayer film for a metal-containing resist, the underlayer film having been formed by the underlayer film-forming composition coating step for the first metal-containing resist; a step for exposing the metal-containing resist film to extreme ultraviolet rays; and a step for developing the exposed metal-containing resist film. The underlayer film-forming composition for the first metal-containing resist contains a solvent and a metal compound composed of at least a metal atom and an organic acid.
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.
Provided are: a method for producing an organic compound, the method simply and economically rationally enabling a reaction by a mechanochemical method; and a mechanochemical reactor. Provided is a method for producing an organic compound, the method comprising a step for carrying out a reaction in a reactor, wherein the reactor comprises a non-metal reaction container and a plurality of stirring media having been charged into the reaction container, at least the surfaces of the stirring media being non-metal, and the reaction is carried out by a mechanochemical method by means of relative movement between the reaction container and the stirring media. In this method, the acceleration of the movement of the stirring media caused by the movement of the reaction container is 9.83 m/s2 or less.
C07C 1/32 - Preparation of hydrocarbons from one or more compounds, none of them being a hydrocarbon starting from compounds containing hetero atoms other than, or in addition to, oxygen or halogen
C07C 5/44 - Preparation of hydrocarbons from hydrocarbons containing the same number of carbon atoms by dehydrogenation with a hydrogen acceptor with a halogen or a halogen-containing compound as an acceptor
C07C 13/62 - Polycyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with condensed rings with more than three condensed rings
C07C 15/24 - Polycyclic condensed hydrocarbons containing two rings
C07C 29/40 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring increasing the number of carbon atoms by reactions with formation of hydroxy groups, which may occur via intermediates being derivatives of hydroxy groups, e.g. O-metal by reaction with aldehydes or ketones with compounds containing carbon-to-metal bonds
C07C 29/143 - Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by reduction of an oxygen-containing functional group of C=O containing groups, e.g. —COOH of ketones
C07C 33/24 - Monohydroxylic alcohols containing only six-membered aromatic rings as cyclic part polycyclic without condensed ring systems
C07C 33/26 - Polyhydroxylic alcohols containing only six-membered aromatic rings as cyclic part
C07C 49/784 - Ketones containing a keto group bound to a six-membered aromatic ring polycyclic with all keto groups bound to a non-condensed ring
C07C 231/02 - Preparation of carboxylic acid amides from carboxylic acids or from esters, anhydrides, or halides thereof by reaction with ammonia or amines
C07C 233/15 - Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by halogen atoms or by nitro or nitroso groups with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by a carbon atom of a six-membered aromatic ring
95.
RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMER AND METHOD FOR PRODUCING SAME, AND COMPOUND
This radiation-sensitive composition contains a polymer represented by formula (1). In formula (1), A1and A2each independently represent a group represented by formula (a-1), formula (a-2), formula (a-3), or formula (a-4). B1represents a divalent group having a partial structure by which the bond between A1and A2mediated by B1can be cut by the action of an acid. P1and P2 are each independently a molecule chain.
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 20/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide, or nitrile thereof
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound (Q) represented by formula (1). In the formula (1), L1 represents an ester group, —CO—NR3—, a (thio)ether group, or a sulfonyl group. R4 represents a hydrogen atom, a substituted or unsubstituted C1 to C20 monovalent hydrocarbon group, a halogen atom, a hydroxy group, or a nitro group. R5 represents a C1 to C20 monovalent hydrocarbon group, a C1 to C20 monovalent halogenated hydrocarbon group, or a halogen atom, and optionally two R5s taken together represent an alicyclic structure together with the carbon atom(s) between the two R5s. L2 represents a single bond or a divalent linking group.
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound (Q) represented by formula (1). In the formula (1), L1 represents an ester group, —CO—NR3—, a (thio)ether group, or a sulfonyl group. R4 represents a hydrogen atom, a substituted or unsubstituted C1 to C20 monovalent hydrocarbon group, a halogen atom, a hydroxy group, or a nitro group. R5 represents a C1 to C20 monovalent hydrocarbon group, a C1 to C20 monovalent halogenated hydrocarbon group, or a halogen atom, and optionally two R5s taken together represent an alicyclic structure together with the carbon atom(s) between the two R5s. L2 represents a single bond or a divalent linking group.
C07C 69/75 - Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring of acids with a six-membered ring
C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
C07C 309/27 - Sulfonic acids having sulfo groups bound to carbon atoms of rings other than six-membered aromatic rings of a carbon skeleton containing carboxyl groups bound to the carbon skeleton
C07D 207/416 - 2,5-Pyrrolidine-diones with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to other ring carbon atoms
C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
C07D 307/94 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom spiro-condensed with carbocyclic rings or ring systems, e.g. griseofulvins
C07D 311/00 - Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
C07D 313/06 - Seven-membered rings condensed with carbocyclic rings or ring systems
Provided are: a semiconductor substrate manufacturing method with which it is possible to improve the etching resistance of a reversal pattern of a metal-containing resist pattern and the rectangularity of the reversal pattern; and a reversal pattern forming material. This semiconductor substrate manufacturing method comprises: a step for forming a metal-containing resist film directly or indirectly on a substrate with use of a metal-containing resist forming material; a step for subjecting the metal-containing resist film to light exposure by means of extreme ultraviolet light; a step for developing the light-exposed metal-containing resist film; a step for forming, on the metal-containing resist pattern that is formed in the development step, a film for reversal pattern formation with use of a reversal pattern forming material; and a step for removing the metal-containing resist pattern so as to form a reversal pattern that is formed of the film for reversal pattern formation. The metal-containing resist forming material contains tin atoms, and the reversal pattern forming material contains silicon atoms.
The purpose of the present invention is to manufacture a fine-patterned magnetic storage element with high precision. A magnetic storage element (1) includes: a magnetic tunnel junction layer (30) having a structure in which an insulating layer (32) is sandwiched between two magnetic layers (31) and (33), and in which the resistance state changes in accordance with the magnetization direction of one of the magnetic layer (31) and the magnetic layer (33); and a metal layer (40) provided on the magnetic tunnel junction layer (30). A method for manufacturing the magnetic storage element (1) includes a step for forming a resist film (50) having an opening (50a) on a substrate (10) on which an electrode layer (20) is formed, a step for forming a magnetic tunnel junction layer (30) on the electrode layer (20) exposed in the opening (50a), a step for forming a metal layer (40) on the magnetic tunnel junction layer (30), and a step for removing the resist film (50).
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), A1 represents a (m+n+2)-valent aromatic ring group. Both —OH and —COO− are bound to a common benzene ring in A1. Atom to which —OH is bound is located next to an atom to which —COO31 is bound. R1 represents a monovalent group comprising a cyclic (thio)acetal structure. m is an integer of ≥0. n is an integer of ≥0. M+ represents a monovalent organic cation.
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), A1 represents a (m+n+2)-valent aromatic ring group. Both —OH and —COO− are bound to a common benzene ring in A1. Atom to which —OH is bound is located next to an atom to which —COO31 is bound. R1 represents a monovalent group comprising a cyclic (thio)acetal structure. m is an integer of ≥0. n is an integer of ≥0. M+ represents a monovalent organic cation.
Provided are a radiation-sensitive composition and a pattern formation method capable of exhibiting sensitivity, CDU performance, and LWR performance at a sufficient level when a resist pattern is formed using next-generation technology. In the present invention, a radiation-sensitive composition contains: a polymer including structural units having an acid-dissociable group; a radiation-sensitive acid generator containing a first organic acid anion and a first onium cation; an acid diffusion control agent that contains a second organic acid anion and a second onium cation, and generates an acid having a higher pKa than an acid generated from the radiation-sensitive acid generator under exposure to radiation; and a solvent. The first organic acid anion contains an acid anion moiety and an aromatic ring having at least both a first substituent and a second substituent. The first substituent and the second substituent are each independently a hydroxy group, a sulfo group, or a sulfanyl group. At least one selected from the group consisting of the polymer, the radiation-sensitive acid generator, and the acid diffusion control agent contains an iodo group.
