Stocker pod for storing a semiconductor fabrication article, the stocker pod including at least two components with at least one fixator, integrally formed with at least one of the at least two components of the stocker pod, the fixator being configured to immobilize the two or more components of the stocker pod relative to one another.
G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
2.
CONTAINER FOR STORING AND/OR TRANSPORTING A SEMICONDUCTOR FABRICATION ARTICLE
The invention relates to a container (100) for storing and/or transporting a semiconductor fabrication article (190), particularly one or more of a wafer, a chip, a substrate and a photolithography mask, particularly an EUV reticle, the container (100) comprising an upper component (110) and a lower component (120), wherein the upper component (110) is reversibly attachable to the lower component (120), the container (100) further comprising an article support (140) provided within at least one of the upper (110) and the lower (120) components, wherein the article support (140) is configured to support one article (190) to be stored and/or transported in the container (100) and to restrict movement of the article (190) relative to the container (100), wherein the article support (140) is configured to elastically retract upon the article (190) being pushed towards the article support (140) by a pushing force (192), wherein the elastic retraction produces a counter force biasing the article (190) in a direction opposite the direction of the pushing force (192). The invention further provides a dual pod for storing and/or transporting a semiconductor fabrication article (190) using such a container (100) as an inner pod and an article support (140) for such a container (100).
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
3.
CONTAINER, METHOD AND STOCKER FOR STORING AND/OR TRANSPORTING A SEMICONDUCTOR FABRICATION ARTICLE
The invention relates to a container (100) for storing and/or transporting a semiconductor fabrication article (190), particularly one or more of a wafer, a chip, a substrate and a photolithography mask, particularly an EUV reticle, the container (100) comprising an upper component (110) and a lower component (120), wherein the upper component (110) is reversibly attachable to the lower component (120), the container (100) further comprising a locking mechanism (140, 160), integrally formed within the upper component (110) and the lower component (120) and configured to restrict movement of the upper component (110) and the lower component (120) relative to one another, wherein the locking mechanism (140, 160) comprises a pin (112), which in a state in which the upper component (110) is attached to the lower component (120), extends from a first one of the upper (110) and lower (120) components into a second one of the upper (110) and lower (120) components, wherein the locking mechanism (140, 160) further comprises an engagement member (122, 162) accommodated within the second one of the upper (110) and lower (120) components, the engagement member (122, 162) being configured to selectively restrict movement of the pin (112) relative to the second one of the upper (110) and lower (120) components, wherein the pin (112) comprises a recess (114) and the engagement member (122, 162) is configured to engage with the recess (114). The invention further provides a method (200) for storing and/or transporting a semiconductor fabrication article (190) using such a container (100) and a stocker configured to perform such a method (200) and to hold a number of such containers (100).
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
Stocker system for storage of a plurality of reticles, especially EUV reticles, comprising a plurality of storage pods (110), each storage pod (110) comprising a base plate (112) and a cover (114) defining an interior space (111) and each configured and adapted to hold one of said reticles in the interior space (111), the storage pods (110) further being adapted to be stacked vertically one above the other to provide a stacked configuration (80), each storage pod being provided with alignment features (130,132) in its base plate and its cover, the alignment features being configured and adapted to enable mechanical alignment of a storage pod with adjacent storage pods in the stacked configuration (80), wherein at least some of the alignment features (130,132) are configured and adapted to allow a flow of purge gas therethrough.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A model for defect recognition on a surface under inspection comprises a first supervised machine learning classifier configured for classifying image units of an image into at least defective and defect-free image units; multiple sets of convolution filters perform feature extraction, wherein each such set comprises one or more convolution filters defined by a set of individual filter parameters; said convolution filters are applied to one or more labelled reference images of a surface to obtain multiple groups of feature maps; multiple trained first machine learning classifiers are obtained using said feature maps; each trained first machine learning classifier is provided with an input test set and a respective quality parameter is obtained; an optimized set of convolution filters is applied to one or more labelled training images in order to train a copy of said first machine learning classifier.
STOCKER SYSTEM FOR STORAGE OF RETICLES, CORRESPONDING STORAGE STOCKER AND METHODS AND DEVICES FOR RETRIEVING RETICLE PODS OR RETICLES FROM A STACK OF RETICLE PODS OR FOR STORING THEM THEREIN
The invention relates to a stocker system (100) for storage of a plurality of reticles (150), especially EUV reticles. The stocker system (100) comprises a plurality of storage pods (111, 112, 113) each adapted to hold one of said reticles (150) in their interior, and to be stacked in a vertical direction (V) one above the other to provide a stack (110), each of the storage pods (111, 112, 113) being provided with two handling members (120) arranged on opposite sides of the storage pod (111, 112, 113) in a first horizontal direction (H1) and each of the handling members (120) being provided with a handling member engagement features (121). The stocker system (100) further comprises two holding structures (200) being provided with a plurality of holding members (210), each of the holding members (210) being provided with a holding member engagement element (211) adapted to engage with a corresponding handling member engagement feature (121), wherein the holding structures (200) are arranged such that, when the holding structures (200) are engaged with the plurality of storage pods (111, 112, 113), movement of the plurality of storage pods (111, 112, 113) in the first horizontal direction is prevented by the holding structures (200) and movement of the plurality of storage pods (111, 112, 113) in a second horizontal direction essentially perpendicular to the first horizontal direction (H1) is prevented by engagement of the handling member engagement features (121) with the holding member engagement elements (211). The invention further relates to storage stocker, a method and a device for retrieving a first storage pod (111) from a stack (110) comprising a plurality of storage pods, a method and a device for retrieving a reticle (150) from a stack (110) comprising a plurality of storage pods and a storage pod (111, 112, 113).
The invention provides a stocker (100) for storing a semiconductor fabrication article, particularly a reticle, with a motorized storage unit (120), particularly a rotatable storage carousel, with a plurality of storage positions, wherein the storage unit comprises at least one handling device (112, 114) configured to access the at least two storage positions and to place an article therein for storage or to retrieve an article therefrom, at least two storage portions (121, 122, 123, 124, 125, 126), wherein each one of the storage portions (121, 122, 123, 124, 125, 126) comprises a motor (131, 132, 133, 134, 135, 136) configured to displace the respective storage portion (121, 122, 123, 124, 125, 126) independently of any of the remaining storage portions (121, 122, 123, 124, 125, 126). Additionally, the at least one handling device may comprise at least two handling devices (112, 114) wherein the at least two handling devices (112, 114) are arranged at mutually different positions with respect to the storage unit (120) and are configured to access storage positions within the storage unit (120) independently from one another. Further, a method for operating such a stocker (100) is provided.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
8.
METHODS FOR CLEANING SEMICONDUCTOR CARRIER DEVICES
Provided are a method for cleaning a semiconductor carrier device (100), comprising a first step (120) of exposing the semiconductor carrier device (100) to a warm gas (110) a second step (140) of exposing the semiconductor carrier device (100) to a cleaning fluid (112); and a third step (160) of exposing the semiconductor carrier device (100) to a warm gas (114), and method for cleaning a semiconductor carrier device (100), comprising a first step (220) of exposing the semiconductor carrier device (100) to a vacuum (222), a second step (240) of exposing the semiconductor carrier device (100) to a venting gas (224), and a third step (260) of exposing the semiconductor carrier device (100) to a vacuum (226) and a method of combination of them.
B08B 9/093 - Cleaning of containers, e.g. tanks by the force of jets or sprays
F26B 3/04 - Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour circulating over, or surrounding, the materials or objects to be dried
F26B 5/12 - Drying solid materials or objects by processes not involving the application of heat by suction
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
9.
STORAGE SYSTEM FOR SEMICONDUCTOR PRODUCTION OBJECTS AND STORAGE MODULE
Provided is a storage system for semiconductor production objects, especially reticles, comprising a plurality of storage modules (2), each storage module having a housing (6) and configured to accommodate at least one semiconductor production object in an interior of the housing; and a stocker comprising a compartment (40), which includes a plurality of storage shelves each configured to receive one or more of the storage modules (2); characterised in that each of the storage modules (2) includes a monitoring device (4) arranged at the housing, the monitoring device having one or more sensors (22, 24, 26), configured to measure one or more parameters in the interior of the housing (6) to determine measurement values, and a communication assembly (12, 14), configured to transmit measurement data including one or more of the measurement values and/or including values derived from the measurement values to an exterior of the housing using a determined data communication method.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
10.
STOCKER FOR SEMICONDUCTOR FABRICATION ARTICLES AND METHOD FOR OPERATING SUCH A STOCKER
Stocker (100) for storing semiconductor fabrication articles, particularly reticles, with a plurality of storage positions for semiconductor fabrication articles, wherein the plurality of storage positions is divided into a plurality of purge zones, each purge zone being provided with an individual purge level setting, which is different from a purge level setting of each other purge zone, such that a semiconductor fabrication article can be subjected to a specific purge level in dependence on a location of its storage position within the plurality of purge zones.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A method for cleaning a plastic's surface so as to effect removing metallic particulate contaminants from the plastic's surface, including rinsing the plastic's surface with electrolyzed water, anodic water, cathodic water, or ozone, so as to remove positive charges left on the plastic's surface by the anodic water, and then rinsing the plastic's surface with deionized water; wherein the rinsing of the plastic's surface with the electrolyzed water, anodic water, cathodic water, or ozone, and then the deionized water effects cleansing of the plastic's surface to a predetermined cleanliness value.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
12.
A CLEANING SYSTEM AND A METHOD FOR CLEANING A CARRIER FOR SEMICONDUCTOR SUBSTRATES OR AT LEAST A SURFACE OF THE CARRIER
The present invention refers to a cleaning system (100) for cleaning a carrier (105) for semi-conductor substrates or at least a surface of the carrier (105), comprising: a first chamber (110) and a second chamber (120), wherein the first chamber (110) and the second chamber (120) are in fluid-communication with each other, wherein the second chamber (120) is con- figured to accommodate the carrier (105); an input fluid supply (130) configured to provide an input fluid (135) to the first chamber (110); a radiation source (140) configured to provide ra- diation of at least one predetermined wavelength within the first chamber (110) and config- ured to create a cleaning fluid (145) comprising a plasma and/or ozone and/or atomic oxygen by means of exposing the input fluid (135) in the first chamber (110) to the radiation; a clean- ing fluid transfer unit (150) configured to transfer the cleaning fluid from the first chamber (110) to the second chamber (120) for cleaning the carrier (105) or at least the surface of the carrier (105) provided in the second chamber (120) and configured to subject the carrier (105) or at least the surface of the carrier (105) to the cleaning fluid in the second chamber (120).
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The present invention relates to a container (100) configured and adapted for storage and/or transport of a substrate, provided with a cylinder-piston-mechanism (200) comprising a piston (210) reciprocatingly movable within a cylinder (220), the cylinder-piston-mechanism being configured and adapted to secure a substrate within the container (100) by engaging the substrate with an engagement member (210b) attached to the piston (210).
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
Stocker compartment for storage of EUV pod components, comprising a plurality of sub-compartments (120a to 120e), each of which sub-compartments being adapted to store one EUV pod component, the sub-compartments being arranged in a vertically stacked order, each sub-compartment of the plurality of sub-compartments defining a vertically extending front side and a vertically expending rear side, wherein a plurality of shutters (128a to 128e) is provided such that the front side of each of the plurality of sub-compartments (120a to 120e) is provided with an associated shutter out of the plurality of shutters (128a to 128e), each associated shutter being movable in a vertical direction in order to provide an open and a closed state of the sub-compartment (120a to 120e) to which it is associated, wherein each shutter of the plurality of shutters (128a to 128e) is movable independently of any other of the plurality of shutters.
G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
The invention relates to a method for cleaning a synthetic surface, in particular to remove metal dirt and/or particles therefrom, said method being characterized by the following steps: a) the synthetic surface is rinsed with deionized water; b) the synthetic surface is rinsed with electrolyzed water; and c) the synthetic surface is rinsed with deionized water.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
16.
METHOD AND SYSTEM FOR INSPECTION OF AN INNER POD OR AN OUTER POD OF AN EUV POD
Method for inspection of an inner pod EIP and/or an outer pod EOP of an EUV pod, respectively including a base member and a cover member. The method includes acquiring inspection data sets using a line scan camera and an area scan camera, inspecting the cover member in a first inspection unit using the line scan camera, inspecting the base member in a second inspection unit using the area scan camera, inspecting the cover member in the second inspection unit using the area scan camera, and inspecting the base member in the first inspection unit using the line scan camera.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G01N 21/88 - Investigating the presence of flaws, defects or contamination
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
17.
EUV RETICLE STOCKER AND METHOD OF OPERATING THE SAME
A one-piece clamping device, a storage system and an operating method for an EUV reticle stocker are provided. The required space for storing EUV reticles is significantly reduced while ensuring a high quality storage environment for the stored EUV reticles. A further aspect provides a stocker for storing EUV reticles.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
18.
STOCKER POD, METHOD AND STOCKER FOR STORING A SEMICONDUCTOR FABRICATION ARTICLE
Stocker pod (100) for storing a semiconductor fabrication article, the stocker pod (100) comprising at least two components (110, 120) with at least one fixator (130), integrally formed with at least one of the at least two components (110) of the stocker pod (100), the fixator (130) being configured to immobilize the two or more components (110, 120) of the stocker pod (100) relative to one another.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A buffer station for automatic material handling system can provide throughput improvement. Further, by storing to-be-accessed workpieces in the buffer stations of an equipment, the operation of the facility is not interrupted when the equipment is down. The buffer station can be incorporated in a stocker, such as bare wafer stocker.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Stocker system for storage of a plurality of reticles, especially EUV reticles, comprising a plurality of storage pods (110) each adapted to hold one of said reticles in their interior, and to be stacked vertically one above the other to provide a stack (80), each of the storage pods (110) comprising a passageway (211) with an inlet (210), an outlet (220) and a first opening (230), wherein inlets and outlets of adjacent passageways (211) are arranged such that a duct (90) extending through the stack (80) is provided, through which a purge gas can be blown, and the purge gas blown through the duct (90) can enter the interior (110a) of each storage pod (110) through its respective first opening (230).
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
21.
CLEANING SYSTEMS AND METHODS FOR SEMICONDUCTOR SUBSTRATE STORAGE ARTICLES
Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.
B08B 3/02 - Cleaning by the force of jets or sprays
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
B08B 5/02 - Cleaning by the force of jets, e.g. blowing-out cavities
B08B 9/28 - Cleaning of containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans, are brought the apparatus cleaning by splash, spray or jet application, with or without soaking
Methods and apparatuses for integrated cleaning of objects comprising a sequence of wet cleaning and vacuum drying in a same process chamber. The present integrated cleaning process can eliminate moving parts, improving the system reliability. Vacuum decontamination can be included for degassing and decontaminating the cleaned objects. In an embodiment, a cleaner system combines various movements into an integrated movement to be handled by a robot, for example, to improve the throughput. For example, an integrated robot movement comprising picking up a closed container from the input load port, moving both the lid and body together, and then depositing the body and lid separately into the appropriate positions in the cleaner to be cleaned.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 5/02 - Cleaning by the force of jets, e.g. blowing-out cavities
B08B 9/093 - Cleaning of containers, e.g. tanks by the force of jets or sprays
B08B 3/02 - Cleaning by the force of jets or sprays
In an embodiment, the present invention discloses cleaned storage processes and systems for high level cleanliness articles, such as extreme ultraviolet (EUV) reticle carriers. A decontamination chamber can be used to clean the stored workpieces. A purge gas system can be used to prevent contamination of the articles stored within the workpieces. A robot can be used to detect the condition of the storage compartment before delivering the workpiece. A monitor device can be used to monitor the conditions of the stocker.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B25J 13/08 - Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
24.
Core module for semiconductor production facility machinery
The invention relates to an apparatus (200, 200A, 300, 400) for a semiconductor production facility handling an object, the apparatus comprising a core module (100) and at least one functionality module (M . . . ). A core module (100) as well as an operating method for such an apparatus are further aspects of the invention.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
25.
EUV RETICLE STOCKER AND METHOD OF OPERATING THE SAME
A clamping device, a storage system and an operating method for an EUV reticle stocker are provided. The required space for storing EUV reticles is significantly reduced while ensuring a high quality storage environment for the stored EUV reticles. A stocker for storing EUV reticles is also provided.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A substrate processing apparatus including a frame, a first SCARA arm connected to the frame, including an end effector, configured to extend and retract along a first radial axis; a second SCARA arm connected to the frame, including an end effector, configured to extend and retract along a second radial axis, the SCARA arms having a common shoulder axis of rotation; and a drive section coupled to the SCARA arms is configured to independently extend each SCARA arm along a respective radial axis and rotate each SCARA arm about the common shoulder axis of rotation where the first radial axis is angled relative to the second radial axis and the end effector of a respective arm is aligned with a respective radial axis, wherein each end effector is configured to hold at least one substrate and the end effectors are located on a common transfer plane.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B25J 9/04 - Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian co-ordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical co-ordinate type or polar co-ordinate type
B25J 11/00 - Manipulators not otherwise provided for
A one-piece clamping device (200, 500), a storage system (300, 600) and an operating method (400, 410) for an EUV reticle stocker are provided. The required space for storing EUV reticles is significantly reduced while ensuring a high quality storage environment for the stored EUV reticles. A further aspect of the invention provides a stocker (700) for storing EUV reticles.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
28.
METHOD AND SYSTEM FOR INSPECTION OF AN INNER POD OR AN OUTER POD OF AN EUV POD
Method for inspection of an inner pod EIP and/or an outer pod EOP of an EUV pod, respectively including a base member and a cover member, the method comprising acquiring inspection data sets using a line scan camera and an area scan camera, characterized by the following steps: 1. Inspecting the cover member in a first inspection unit using the at least one line scan camera, 2. Inspecting the base member in a second inspection unit using the at least one area scan camera, 3. Inspecting the cover member in the second inspection unit using the at least one area scan camera, and 4. Inspecting the base member in the first inspection unit using the at least one line scan camera.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
29.
AUTOMATIC TEACH APPARATUS FOR ROBOTIC SYSTEMS AND METHOD THEREFOR
An automatic teaching system for a substrate processing apparatus, the automatic teaching system comprising a frame having a workpiece load station with a predetermined load station reference location, a robot transport mounted to the frame and having a movable transport arm with an end effector having a predetermined end effector reference location, and a drive section driving the movable transport arm in at least one degree of freedom motion relative to the frame, a machine vision system including both at least one fixed imaging sensor and at least one movable imaging sensor removably connected to the frame and configured to image at least one target of the machine vision system, a load jig disposed for removable engagement with the workpiece load station, with both the at least one fixed imaging sensor and the at least one movable imaging sensor mounted to the load jig, the fixed imaging sensor.
G01B 11/02 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G05B 19/18 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
G06T 7/70 - Determining position or orientation of objects or cameras
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
A semiconductor wafer mapping apparatus comprising a frame forming a wafer load opening communicating with a load station for a substrate carrier disposed to hold more than one wafers vertically distributed in the substrate carrier for loading through the wafer load opening, a movable arm movably mounted to the frame so as to move relative to the wafer load opening and having at least one end effector movably mounted to the movable arm to load wafers from the substrate carrier through the wafer load opening, an image acquisition system including an array of cameras arranged on a common support and each camera fixed with respect to the common support that is static with respect to each camera of the array of cameras, wherein each respective camera is positioned with a field of view disposed to view through the wafer load opening with the common support positioned by the movable arm.
The present invention relates to apparatuses and methods to store and transfer objects, and more particularly to workpiece stocker configurations such as stacker for semiconductor wafers, reticles or carrier boxes.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A linear electrical machine comprising a frame with a level reference plane and an array of electromagnets, connected to the frame to form a drive plane at a predetermined height relative to the reference plane. The array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets being coupled to an alternating current power source energizing each electromagnet. At least one reaction platen of paramagnetic, diamagnetic, or non-magnetic conductive material disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets with alternating current generates levitation and propulsion forces against the reaction platen that controllably levitate and propel the reaction platen along at least one drive line, in a controlled attitude relative to the drive plane.
B60L 13/00 - Electric propulsion for monorail vehicles, suspension vehicles or rack railwaysMagnetic suspension or levitation for vehicles
B60L 13/04 - Magnetic suspension or levitation for vehicles
B60L 13/10 - Combination of electric propulsion and magnetic suspension or levitation
H02K 41/00 - Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
A substrate transport apparatus comprising a support frame an articulated arm connected to the support frame, having at least one movable arm link and an end effector connected to the movable arm link, with a substrate holding station located thereon. Wherein the movable arm link is a reconfigurable arm link having a modular composite arm link casing, formed of link case modules rigidly coupled to each other, and a pulley system cased in and extending through the rigidly coupled link case modules substantially end to end of the modular composite arm link casing, wherein the rigidly coupled link case modules include link case end modules connected by at least one interchangeable link case extension module having a predetermined characteristic determining a length of the movable arm link, wherein at least one interchangeable link case extension module is selectable for connection to link case end modules forming the reconfigurable arm link.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B25J 9/12 - Programme-controlled manipulators characterised by positioning means for manipulator elements electric
B25J 11/00 - Manipulators not otherwise provided for
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A substrate transport apparatus comprising a frame, a drive section connected to the frame, and an articulated arm having at least one articulated arm link operably connected to the drive section so that the articulated arm rotates about a pivot axis relative to the frame and extends and retracts relative to the pivot axis. The articulated arm has an end effector pivotally mounted to at least one articulated arm link forming a joint between the end effector and the articulated arm link, with an arm joint pivot axis disposed so that the end effector rotates relative to at least one articulated arm link about the arm joint pivot axis, The articulated arm has a drive band transmission with drive and driven pulleys where the driven pulley is connected to the articulated wrist.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B25J 9/04 - Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian co-ordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical co-ordinate type or polar co-ordinate type
A substrate transport apparatus comprising a frame, a drive section connected to the frame, and an articulated arm having at least one articulated arm link operably connected to the drive section so that the articulated arm rotates about a pivot axis relative to the frame and extends and retracts relative to the pivot axis. The articulated arm has an end effector pivotally mounted to at least one articulated arm link forming a joint between the end effector and the articulated arm link, with an arm joint pivot axis disposed so that the end effector rotates relative to at least one articulated arm link about the arm joint pivot axis. The articulated arm has a drive band transmission with drive and driven pulleys where the driven pulley is connected to the articulated wrist.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
B65G 47/90 - Devices for picking-up and depositing articles or materials
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A gripper provides for gripping labware having a variety of diameters and shapes. The gripper includes a support structure having a center axis, a motor, and a gripper stage. The gripper stage includes a plurality of blades, each of the blades having a) a first end through which a blade rotation axis extends, the blade rotation axis being fixed relative to the support structure and offset from the center axis, b) a second end that is circumferentially and radially moveable to rotate the blade about the blade rotation axis, and c) a center portion. The gripper stage also includes a ring structure coupled to the motor to rotate the ring structure around the center axis. The ring structure, as it rotates, moves the second end of each blade to rotate the blade about the blade rotation axis of the blade to shift the center portion towards the center axis to contact an outer portion of a vessel extending along the center axis.
The invention relates to an apparatus (200, 200A, 300, 400) for a semiconductor production facility handling an object, the apparatus comprising a core module (100) and at least one functionality module (M...). A core module (100) as well as an operating method for such an apparatus are further aspects of the invention.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A substrate transport apparatus having a drive section and at least one articulated multi-link arm having an upper arm joined at one end to the drive section and a forearm joined to the upper arm. The upper arm being a substantially rigid unarticulated link. Dual end effector links that are separate and distinct from each other are each rotatably and separately joined to a common end of the forearm about a common axis of rotation. Each end effector link has at least one holding station. The holding station of at least one end effector link includes one holding station at opposite ends of the at least one end effector link that is substantially rigid and unarticulated between the opposite ends, and the holding station at one of the opposite ends is substantially coplanar with the holding station of each other end effector link.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B25J 9/04 - Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian co-ordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical co-ordinate type or polar co-ordinate type
B25J 9/06 - Programme-controlled manipulators characterised by multi-articulated arms
B65G 47/90 - Devices for picking-up and depositing articles or materials
B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
39.
EUV RETICLE STOCKER AND METHOD OF OPERATING THE SAME
A clamping device (200, 500), a storage system (300, 600) and an operating method (400, 410) for an EUV reticle stocker are provided. The required space for storing EUV reticles is significantly reduced while ensuring a high quality storage environment for the stored EUV reticles. A Further aspect of the invention provides a stocker (700) for storing EUV reticles.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
G03F 1/66 - Containers specially adapted for masks, mask blanks or pelliclesPreparation thereof
A buffer station for automatic material handling system can provide throughput improvement. Further, by storing to-be-accessed workpieces in the buffer stations of an equipment, the operation of the facility is not interrupted when the equipment is down. The buffer station can be incorporated in a stocker, such as bare wafer stocker.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The invention relates to an inspection system adapted for determining a state and/or content of a wafer or reticle container or at least a part of a wafer or reticle container, comprising a detection device or a multitude of detection devices (102, 104, 152, 154, 156, 158, 160, 164) adapted to receive detection data from a surface and/or interior of the wafer or reticle container or the part of a wafer or reticle container indicative of the state and/or content of the wafer or reticle container or the part of a wafer or reticle container.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H04N 23/56 - Cameras or camera modules comprising electronic image sensorsControl thereof provided with illuminating means
H04N 23/90 - Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
A substrate transport apparatus includes a transport chamber, a drive section, a robot arm, an imaging system with a camera mounted through a mounting interface of the drive section in a predetermined location with respect to the transport chamber and disposed to image part of the arm, and a controller connected to the imaging system and configured to image, with the camera, the arm moving to or in the predetermined location, the controller effecting capture of a first image of the arm on registry of the arm proximate to or in the predetermined location, the controller is configured to calculate a positional variance of the arm from comparison of the first image with a calibration image of the arm, and determine a motion compensation factor changing an extended position of the arm. Each camera effecting capture of the first image is disposed inside the perimeter of the mounting interface.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
A substrate transport apparatus includes a transport chamber, a drive section, a robot arm, an imaging system with a camera mounted through a mounting interface of the drive section in a predetermined location with respect to the transport chamber and disposed to image part of the arm, and a controller connected to the imaging system and configured to image, with the camera, the arm moving to or in the predetermined location, the controller effecting capture of a first image of the arm on registry of the arm proximate to or in the predetermined location, the controller is configured to calculate a positional variance of the arm from comparison of the first image with a calibration image of the arm, and determine a motion compensation factor changing an extended position of the arm. Each camera effecting capture of the first image is disposed inside the perimeter of the mounting interface.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
A process apparatus including a front end with a load opening for loading production workpieces into the apparatus; a process section being offset at a distance from and coupled to the front end via an interior transport path configured for transport of the workpieces between the front end and process section; a load lock between the front end and process section with the transport path extending through the load lock, the load lock having an intermediate entry with an opening shunting the transport path to the exterior separate from the front end; and a predetermined interchangeable transport carrier cassette configured to be entered within the load lock from the exterior through the intermediate entry opening, the entry and removal of the cassette through the opening loads and unloads the load lock with a transport path interface that interfaces, the transport path coincident with the cassette loaded in the load lock.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A reticle compartment defining an enclosed interior adapted to store at least two reticles in a resticle storage portion, including an inlet port, through which a purge gas can enter the enclosed enterior, and an outlet port, through which the purge gas can exit the enclosed interior, wherein the reticle compartment further includes a first diffusor plate arranged in the enclosed interior between the inlet port and the reticle storage portion, wherein the first diffusor plate is provided with openings, through which the purge gas can flow, the openings in a central section of the first diffusor plate being provided with a larger individual opening area and/or providing a large total opening area per unit area than openings in a peripheral section of the first diffusor plate.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
46.
Automated system for storing, retrieving and managing samples
An automated storage system for storing large quantities of samples in trays includes a storage compartment, a tray shuttle compartment abutting the storage compartment on one side and a plurality of independent modules on the other side. The modules perform processing of samples that are retrieved from the storage compartment by a tray shuttle, including extraction of selected samples from retrieved source trays and transfer of the selected samples into a separate, destination tray that can be further processed or removed from the system for use. The independent operation of the modules permits handling and processing to be performed simultaneously by different modules while the tray shuttle accesses additional samples within the storage compartment. In one embodiment, a vertical carousel is used to vertically align a desired tray with the tray shuttle, while the tray shuttle operates within a horizontal plane.
The present disclosure relates to a method for inspecting a container body adapted and configured to hold substrates, comprising the steps of directing light from a light source onto a reflector element positioned within an interior space of the container body, such that the light is reflected to illuminate at least one interior surface of the container body, wherein the light is reflected by the reflector element in a diffuse manner and generating at least one image of the at least one interior surface by means of at least one camera, and evaluating the state of the container body on the basis of the at least one image.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate loading device including a frame adapted to connect to a substrate processing apparatus, the frame having a transport opening through which substrates are transported to the processing apparatus, a cassette support connected to the frame for holding at least one substrate cassette container proximate the transport opening, the support configured so that a sealed internal atmosphere of the container is accessed from the support at predetermined access locations of the container, and the cassette support has a predetermined continuous steady state differential pressure plenum region, determined at least in part by boundaries of fluid flow generating differential pressure, so that the predetermined continuous steady state differential pressure plenum region defines a continuously steady state fluidic flow isolation barrier disposed on the support between the predetermined access locations of the container and another predetermined section of the support isolating the other predetermined section from the predetermined access locations.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
Substrate loading device including a frame adapted to connect the substrate loading device to a substrate processing apparatus, the frame having a transport opening through which substrates are transported between the loading device and processing apparatus, a cassette support for holding at least one substrate cassette container, and cassette support purge ports with purge port nozzle locations disposed on the cassette support, each nozzle location being configured so that a nozzle at the nozzle location couples to at least one purge port of the substrate cassette container, wherein each nozzle location defines an interchangeable purge port nozzle interface so that different interchangeable purge port nozzles are removably mounted to respective nozzle interfaces of the nozzle locations that correspond to the different nozzle configurations of the interchangeable purge port nozzle modules, in conformance with and effecting coupling to different ports of different substrate cassette containers having different purge port characteristics.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
The present disclosure relates to a method for controlling a PLC using a PC program, wherein a source code of a PLC program includes a data section, the data section including data indicating services to be exposed by the PLC when running the PLC program, wherein a source code of the PC program is automatically generated using the data included in the data section and a PC program template, wherein the PLC is controlled using the PC program generated from the automatically generated source code of the PC program.
A vacuum substrate transport apparatus including a frame, a drive section having a drive axis, at least one arm, having an end effector for holding a substrate, having at least one degree of freedom axis effecting extension and retraction, and a bearing defining a guideway that defines the axis, the bearing including at least one rolling load bearing element disposed in a bearing case, interfacing between a bearing raceway and bearing rail to support arm loads, and effecting sliding of the case along the rail, and at least one rolling, substantially non-load bearing, spacer element disposed in the case, intervening between each of the load bearing elements, wherein the spacer element is a sacrificial buffer material compatible with sustained substantially unrestricted service commensurate with a predetermined service duty of the apparatus in a vacuum environment at temperatures over 260°C for a specified predetermined service period.
B25J 11/00 - Manipulators not otherwise provided for
B65G 47/90 - Devices for picking-up and depositing articles or materials
F16C 29/06 - Ball or roller bearings in which the rolling bodies circulate partly without carrying load
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
52.
Container storage add-on for bare workpiece stocker
The present invention relates to apparatuses and methods to store and transfer objects, and more particularly to workpiece stocker configurations such as stacker for semiconductor wafers, reticles or carrier boxes.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A substrate processing apparatus including a frame, a SCARA arm mounted to the frame at a shoulder joint having two links with at least one end effector dependent therefrom, the links defining an upper arm and a forearm, each end effector pivotally joined to the forearm at a wrist to rotate about a wrist axis, and a drive section with at least one degree of freedom operably coupled to the arm to rotate the arm about a shoulder axis articulating extension and retraction, wherein the end effector is coupled to a wrist joint pulley so that extension and retraction effects rotation of the pulley and end effector as a unit about the wrist axis, and wherein a height of the end effector is within a stack height profile of the wrist joint so that a total stack height is sized to conform with and pass through a pass-through of a slot valve.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B25J 9/06 - Programme-controlled manipulators characterised by multi-articulated arms
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
54.
Automated sample storage system having storage consumable with sub-optimal storage density
An automated sample specimen storage system including a tube holding microplate including a plate frame, a predetermined array of tube holding receptacles formed in the plate frame, the receptacles having a SBS standard pitch corresponding to the predetermined array, and being configured for holding therein sample store and transport tubes, each disposed so as to contain sample specimen in a sample storage of the storage system and to effect, with the sample tube, delivery from the sample storage to a workstation, the predetermined array of receptacles defining a volume capacity of the tube holding microplate, and each of the receptacles being shaped to conformally engage walls of the sample tubes and hold a respective one of the sample store and transport tubes, wherein the receptacles are arranged so that the tube holding microplate volume capacity defined by the predetermined array is an under optimum volume capacity.
G01N 35/02 - Automatic analysis not limited to methods or materials provided for in any single one of groups Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
Automatic generation of documentation and software for an equipment or tool, together with an automatic synchronization between the corresponding documentation and software can be preformed with a tool model representation. The tool model can include a textual, graphical, symbolic, and program representation of the tool. Default components, derived components, and standard components can be added to the tool model.
In an embodiment, the present invention discloses cleaned storage processes and systems for high level cleanliness articles, such as extreme ultraviolet (EUV) reticle carriers. A decontamination chamber can be used to clean the stored workpieces. A purge gas system can be used to prevent contamination of the articles stored within the workpieces. A robot can be used to detect the condition of the storage compartment before delivering the workpiece. A monitor device can be used to monitor the conditions of the stocker.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65B 5/08 - Packaging groups of articles, the articles being individually gripped or guided for transfer to the containers or receptacles
B65B 31/04 - Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied
B65B 35/16 - Feeding, e.g. conveying, single articles by grippers
B65B 63/08 - Auxiliary devices, not otherwise provided for, for operating on articles or materials to be packaged for heating or cooling articles or materials to facilitate packaging
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
The invention relates to a method for cleaning a synthetic surface, in particular to remove metal dirt and/or particles therefrom, said method being characterized by the following steps: a) the synthetic surface is rinsed with deionized water; b) the synthetic surface is rinsed with electrolyzed water; and c) the synthetic surface is rinsed with deionized water.
C11D 11/00 - Special methods for preparing compositions containing mixtures of detergents
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate transport apparatus auto-teach system for auto-teaching a substrate station location, the system including a frame, a substrate transport connected to the frame, the substrate transport having an end effector configured to support a substrate, and a controller configured to move the substrate transport so that the substrate transport biases the substrate supported on the end effector against a substrate station feature causing a change in eccentricity between the substrate and the end effector, determine the change in eccentricity, and determine the substrate station location based on at least the change in eccentricity between the substrate and the end effector.
H01L 21/06 - Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A substrate processing apparatus includes a frame and a transport apparatus connected to the frame. The transport apparatus has an upper arm link, a forearm link rotatably coupled to the upper arm link about an elbow axis, at least a third arm link rotatably coupled to the forearm about a wrist axis, and an end effector rotatably coupled to the third arm link about a knuckle axis. A two degree of freedom drive system is operably connected to at least one of the upper arm link, the forearm link, and the third arm link for effecting extension and retraction of the end effector wherein a height of the end effector is within the stack height profile of the wrist axis so that a total stack height of the end effector and wrist axis is sized to conform within a pass through of a slot valve.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
A Gifford-McMahon cryogenic refrigerator comprises a reciprocating displacer within a refrigeration volume. The displacer is pneumatically driven by a drive piston within a pneumatic drive volume. Pressure in the pneumatic drive volume is controlled by valving that causes the drive piston to follow a programmed displacement profile through stroke of the drive piston. The drive valving may include a proportional valve that provides continuously variable supply and exhaust of drive fluid. In a proportionally controlled feedback system, the valve into the drive volume is controlled to minimize error between a displacement signal and a programmed displacement profile. Valving to the warm end of the refrigeration volume may also be proportional. A passive force generator such as a mechanical spring or magnets may apply force to the piston in opposition to the driving force applied by the drive fluid.
F25B 9/14 - Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
A cryogenic storage system (100) includes a transfer module (101) configured to service one or more cryogenic storage freezers (105a). The transfer module (101) includes a working chamber (120) that maintains a cryogenic environment for the transfer of sample tubes between different sample boxes. One or more freezer ports (108a) enable the transfer module (101) to receive a sample box extracted from a respective freezer (105a). An input/output (I/O) port (125) enables external access to samples. A box transport robot (130) operates to transport sample boxes between the freezer ports (108a), the working chamber (120), and the I/O port (125). A picker robot (140) operates to transfer sample tubes between sample boxes within the working chamber (120).
A substrate transport apparatus including, a torsional motion driver member having an exterior perimeter circumscribing an axis of rotation of the torsional motion driver member, and a torsional motion follower member including a body portion and a bearing collar rotatably coupled to the body portion, the torsional motion follower member being coupled to the torsional motion driver member with a dimensionally substantially invariant interface, wherein the bearing collar is decoupled from the exterior perimeter of the torsional motion driver member so that the exterior perimeter, as a whole, is free of the bearing collar.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
F16D 1/06 - Couplings for rigidly connecting two coaxial shafts or other movable machine elements for attachment of a member on a shaft or on a shaft-end
B25J 11/00 - Manipulators not otherwise provided for
B25J 19/00 - Accessories fitted to manipulators, e.g. for monitoring, for viewingSafety devices combined with or specially adapted for use in connection with manipulators
A substrate transport apparatus including a transport chamber, a drive section, a robot arm having an end effector at a distal end configured to support a substrate and being connected to the drive section generating at least arm motion in a radial direction extending and retracting the arm, an imaging system with a camera mounted in a predetermined location to image at least part of the robot arm, and a controller connected to the imaging system to image the arm moving to a predetermined repeatable position, the controller effecting capture of a first image of the robot arm proximate to the repeatable position decoupled from encoder data of the drive axis, wherein the controller calculates a positional variance of the robot arm from comparison of the first image with a calibration image, and from the positional variance determines a motion compensation factor changing the extended position of the robot arm.
B25J 19/00 - Accessories fitted to manipulators, e.g. for monitoring, for viewingSafety devices combined with or specially adapted for use in connection with manipulators
G05B 1/04 - Comparing elements, i.e. elements for effecting comparison directly or indirectly between a desired value and existing or anticipated values electric with sensing of the position of the pointer of a measuring instrument
G05B 6/02 - Internal feedback arrangements for obtaining particular characteristics, e.g. proportional, integral or differential electric
A reticle compartment defining an enclosed interior adapted to store at least two reticles in a reticle storage portion, including an inlet port, through which a purge gas can enter the enclosed interior, and an outlet port, through which the purge gas can exit the enclosed interior, wherein the reticle compartment further includes a first diffusor plate arranged in the enclosed interior between the inlet port and the reticle storage portion, wherein the first diffusor plate is provided with openings, through which the purge gas can flow, the openings in a central section of the first diffusor plate being provided with a larger individual opening area and/or providing a larger total opening area per unit area than openings in a peripheral section of the first diffusor plate.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
65.
CRYOPUMP WITH PERIPHERAL FIRST AND SECOND STAGE ARRAYS
In a cryopump, a primary cryopumping array having adsorbent and cooled by a second refrigerator stage extends along radiation shield sides. That array is shielded by a condensing cryopumping array that extends along the primary cryopumping array. The primary cryopumping array may be a cylinder with adsorbent on an inwardly facing surface, and the condensing cryopumping array may comprise an array of baffles having surfaces facing the frontal opening. A raised surface such as a conical surface at the base of the radiation shield redirects molecules received from the frontal opening toward the primary cryopumping array. The refrigerator cold finger may extend tangentially relative to the radiation shield or connect to the base of the radiation shield.
F25B 9/10 - Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point with several cooling stages
F04B 37/02 - Pumps specially adapted for elastic fluids and having pertinent characteristics not provided for in, or of interest apart from, groups for evacuating by absorption or adsorption
F04B 37/08 - Pumps specially adapted for elastic fluids and having pertinent characteristics not provided for in, or of interest apart from, groups for evacuating by thermal means by condensing or freezing, e.g. cryogenic pumps
F25D 19/00 - Arrangement or mounting of refrigeration units with respect to devices
66.
Method and apparatus for health assessment of a transport apparatus
pkBase) for each of the dynamic performance variable output by the transport apparatus respectively corresponding to the predetermined motion base set and the other predetermined motion set.
An EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty and cleaned environments, separate cleaning chambers for different components of the double container carrier, gripper arms for picking and placing different components using a same robot handler, gripper arms for holding different components at different locations, horizontal spin cleaning and drying for outer container, hot water and hot air (70C) cleaning process, vertical nozzles and rasterizing megasonic nozzles for cleaning inner container with hot air nozzles for drying, separate vacuum decontamination chambers for outgassing different components, for example, one for inner and one for outer container with high vacuum (e.g., <10−6 Torr) with purge gas, heaters and RGA sensors inside the vacuum chamber, purge gas assembling station, and purge gas loading and unloading station.
B08B 9/42 - Cleaning of containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans, are brought the apparatus being characterised by means for conveying or carrying containers therethrough
B08B 7/04 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
In an embodiment, the present invention discloses cleaned storage processes and systems for high level cleanliness articles, such as extreme ultraviolet (EUV) reticle carriers. A decontamination chamber can be used to clean the stored workpieces. A purge gas system can be used to prevent contamination of the articles stored within the workpieces. A robot can be used to detect the condition of the storage compartment before delivering the workpiece. A monitor device can be used to monitor the conditions of the stocker.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B65B 5/08 - Packaging groups of articles, the articles being individually gripped or guided for transfer to the containers or receptacles
B65B 31/04 - Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied
B65B 35/16 - Feeding, e.g. conveying, single articles by grippers
B65B 63/08 - Auxiliary devices, not otherwise provided for, for operating on articles or materials to be packaged for heating or cooling articles or materials to facilitate packaging
Semiconductor device manufacturing machines; semiconductor wafer processing equipment; semiconductor substrate manufacturing machines; semiconductor wafer processing machines; semiconductor wafer processing equipment, namely, enclosures for containing industrial robots used in transporting semiconductor wafers and devices; semiconductor wafer processing equipment, namely, pressure vessels for containing industrial robots used in transporting semiconductor wafers and devices; semiconductor wafer processing equipment, namely, industrial robots and enclosures used in transporting semiconductor wafers and devices; machines for manufacturing semiconductor devices; machines for transporting semiconductor wafers for use in manufacturing automation; cluster-tool integration platforms used in the manufacture of integrated circuits and semiconductor devices
70.
SUBSTRATE TRANSPORT APPARATUS WITH INDEPENDENT ACCESSORY FEEDTHROUGH
A substrate transport apparatus including a frame, a substrate transport arm connected to the frame, the substrate transport arm having an end effector and a drive section having at least one motor coupled to the substrate transport arm, wherein the at least one motor defines a kinematic portion of the drive section configured to effect kinematic motion of the substrate transport arm, and the drive section includes an accessory portion adjacent the kinematic portion, wherein the accessory portion has another motor, different and distinct from the at least one motor, the another motor of the accessory portion is operably coupled to and configured to drive one or more accessory devices independent of the kinematic motion of the substrate transport arm.
B25J 9/04 - Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian co-ordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical co-ordinate type or polar co-ordinate type
B25J 9/08 - Programme-controlled manipulators characterised by modular constructions
B25J 9/10 - Programme-controlled manipulators characterised by positioning means for manipulator elements
B25J 11/00 - Manipulators not otherwise provided for
G05B 19/04 - Programme control other than numerical control, i.e. in sequence controllers or logic controllers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A substrate transport apparatus auto-teach system for auto-teaching a substrate station location, the system including a frame, a substrate transport connected to the frame, the substrate transport having an end effector configured to support a substrate, and a controller configured to move the substrate transport so that the substrate transport biases the substrate supported on the end effector against a substrate station feature causing a change in eccentricity between the substrate and the end effector, determine the change in eccentricity, and determine the substrate station location based on at least the change in eccentricity between the substrate and the end effector.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A semiconductor process transport apparatus including a drive section with at least one motor, an articulated arm coupled to the drive section for driving articulation motion, a machine controller coupled to the drive section to control the at least one motor moving the articulated arm from one location to a different location, and an adapter pendant having a machine controller interface coupling the adapter pendant for input/output with the machine controller, the adapter pendant having another interface, configured for connecting a fungible smart mobile device having predetermined resident user operable device functionality characteristics, wherein the other interface has a connectivity configuration so mating of the fungible smart mobile device with the other interface automatically enables configuration of at least one of the resident user operable device functionality characteristics to define an input/output to the machine controller effecting input commands and output signals for motion control of the articulated arm.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
An improved stocker configuration for storing workpieces in a fabrication facility is disclosed, employing workpiece compartments arranged stationarily around a robot handling assembly. The robot handler can be designed with three degrees of freedom, to improve speed, throughput and minimum particle generation. In addition, the stocker storage area is stationary with the movable components are the robot assembly, thus further contributing to the cleanliness of the storage stocker. The stocker configuration can be open storage area for fast access, space saving and ease of clean air purging. The stocker configuration can provide highly dense workpiece storage, utilizing a circumferential edge gripper robot handling assembly.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
74.
Cleaning systems and methods for semiconductor substrate storage articles
Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.
B08B 3/02 - Cleaning by the force of jets or sprays
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
B08B 5/02 - Cleaning by the force of jets, e.g. blowing-out cavities
B08B 9/28 - Cleaning of containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans, are brought the apparatus cleaning by splash, spray or jet application, with or without soaking
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
75.
INSPECTION SYSTEM AND METHOD OF INSPECTION FOR SUBSTRATE CONTAINERS
The present invention relates to an inspection system configured and adapted for inspecting a substrate container or a component of a substrate container, the container or the component comprising a plurality of surfaces, the system comprising at least one mirror (110) arranged and configured to provide a simultaneous view of at least a first one and a second one of the plurality of surfaces.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The present invention relates to a method for controlling a PLC using a PC program (220), wherein a source code of a PLC program includes a data section (100), the data section (100) including data indicating services to be exposed by the PLC when running the PLC program, wherein a source code (210) of the PC program is automatically generated using the data included in the data section (100) and a PC program template (200), wherein the PLC is controlled using the PC program (220) generated from the automatically generated source code (210) of the PC program.
The present invention relates to a method for inspecting a container body adapted and configured to hold substrates, comprising the steps of directing light from a light source (100) onto a reflector element (120) positioned within an interior space (30) of the container body (20), such that the light is reflected to illuminate at least one interior surface (21a, 22a) of the container body (20), wherein the light is reflected by the reflector element (120) in a diffuse manner and generating at least one image of the at least one interior surface by means of at least one camera (140), and evaluating the state of the container body (20) on the basis of the at least one image.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
In an embodiment, the present invention discloses a EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty and cleaned environments, separate cleaning chambers for different components of the double container carrier, gripper arms for picking and placing different components using a same robot handler, gripper arms for holding different components at different locations, horizontal spin cleaning and drying for outer container, hot water and hot air (70 C) cleaning process, vertical nozzles and rasterizing megasonic nozzles for cleaning inner container with hot air nozzles for drying, separate vacuum decontamination chambers for outgassing different components, for example, one for inner and one for outer container with high vacuum (e.g., <10−6 Torr) with purge gas, heaters and RGA sensors inside the vacuum chamber, purge gas assembling station, and purge gas loading and unloading station.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
80.
METHOD AND APPARATUS FOR HEALTH ASSESSMENT OF A TRANSPORT APPARATUS
A method for health assessment of a system including a transport apparatus including registering predetermined operating data embodying at least one dynamic performance variable output by the transport apparatus, determining a base value (CpkBase) characterized by a probability density function of each of the dynamic performance variable output, resolving from the transport apparatus in situ process motion commands of the apparatus controller and defining another predetermined motion set of the transport apparatus, registering predetermined operating data embodying the at least one dynamic performance variable output by the transport apparatus and determining with the processor another value (CpkOther) characterized by the probability density function of each of the dynamic performance variable output by the transport apparatus, and comparing the other value and the base value (CpkBase) for each of the dynamic performance variable output by the transport apparatus respectively corresponding to the predetermined motion base set and the other predetermined motion set.
Method for forming a clean environment for semiconductor substrates with low humidity level including the steps of measuring a humidity level in the environment using a humidity sensor to keep the environment within a predetermined interval around a humidity set point or at a humidity set point and providing a gas to the environment, until the humidity level reduces to a value within the predetermined interval around the set point or to the set point.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A substrate processing apparatus includes a linearly elongated substantially hexahedron shaped substrate transport chamber having linearly elongated sides of the hexahedron and at least one end wall of the hexahedron substantially orthogonal to the linearly elongated sides. A plurality of process modules are linearly arrayed along the at least one of the linearly elongated sides. A substrate transport arm is pivotally mounted within the substrate transport chamber so that a pivot axis of the substrate transport arm is mounted, fixed relative to the substrate transport chamber. The substrate transport arm has a three link - three joint SCARA configuration, of which one link is an end effector with at least one substrate holder, that is articulate to transport the substrate, and held by the at least one substrate holder, in and out of the substrate transport chamber through the end and side substrate transport openings.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
83.
A CAPPING AND DE-CAPPING APPARATUS AND A METHOD OF OPERATING SUCH AN APPARATUS
A capping and de-capping apparatus (100) for capping and de- capping tubes (112) disposed in a tube holding rack (111) having a two-dimensional array of apertures (114) for holding the tubes (112). The apparatus (100) comprises a rack support (110) for supporting the tube holding rack (111), a head unit (120) adapted for carrying a cartridge (152) comprising at least one capping and de-capping gripper (122), a drive system (130) for moving the rack support (110) and the head unit (120) relatively towards and away from one another, in order to cause engagement or disengagement of the capping and de- capping gripper (122) with or from a cap (113) of at least one tube (112), and a drive system (140) for rotating the capping and de-capping gripper (122), wherein rotation in one direction causes attachment of the cap (113) to the tube (112) and rotation in the opposite direction causes detachment of the cap (113) from said tube (112).
A substrate transport empiric arm droop mapping apparatus for a substrate transport system of a processing tool, the mapping apparatus including: a frame, an interface disposed on the frame forming datum features representative of a substrate transport space in the processing tool defined by the substrate transport system, a substrate transport arm, that is articulated and has a substrate holder, mounted to the frame in a predetermined relation to at least one of the datum features, and a registration system disposed with respect to the substrate transport arm and at least one datum feature so that the registration system registers, in an arm droop distance register, empiric arm droop distance, due to arm droop changes, between a first arm position and a second arm position different than the first arm position and in which the substrate holder is moved in the transport space along at least one axis of motion.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A sample tube includes a barcode split into components at the bottom of the sample tube. Each barcode component stores less than the full data output from the barcode, but the components combine to full data output. Redundant diagonal components provide for error checking. A center region between the barcode components supports an electrical circuit or an optical or acoustic window. The sample tube may have a sidewall with a substantially cylindrical open end and non-cylindrical end closed with a bottom, the non-cylindrical end orienting the sample tube in a rack. Additional non-cylindrical surfaces are provided to orient the sample tube relative to complementary surfaces at a gripper. The sample tube of a particular application is positioned in an acoustic dispensing system where acoustic waves are transmitted through a center window for surveying and dispensing.
B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers
B05B 17/06 - Apparatus for spraying or atomising liquids or other fluent materials, not covered by any other group of this subclass operating with special methods using ultrasonic vibrations
G01N 35/00 - Automatic analysis not limited to methods or materials provided for in any single one of groups Handling materials therefor
In accordance with one or more aspects of the disclosed embodiment an apparatus is provided. The apparatus includes a pick head configured to transfer sample containers to and from a sample group holder, at least one sensor connected to the pick head and configured to detect at least one predetermined feature of the sample group holder, and a controller configured to receive a detection signal from the at least one sensor corresponding to detection of the at least one predetermined feature, determine a change in a predetermined characteristic of the sample group holder based on a detected position of the at least one predetermined feature, and determine a location of one or more samples in the sample group holder to allow for the transfer of the one or more sample containers to and from the sample group holder based on the edge detection signal.
A substrate processing apparatus including a frame and at least one substrate transport arm having at least one end effector, each end effector having a base portion, a first and second substrate support tines mounted to and dependent from the base portion where at least one of the first and second substrate support tines is movable relative to the base portion, each of the first and second substrate support tines having respective substrate contacts configured to contact and support a substrate held by the end effector between the respective contacts of the first and second substrate support tines at a substrate support seat dimension span between the substrate contacts of the first and second substrate support tines, and an end effector drive section configured to vary a distance between the first and second substrate support tines relative to each other on the fly.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
The invention relates to a reticle compartment defining an enclosed interior (12) adapted to store at least two reticles (22) in a reticle storage portion (14), comprising an inlet port (16), through which a purge gas can enter the enclosed interior (12), and an outlet port (18), through which the purge gas can exit the enclosed interior, wherein the reticle compartment further comprises a first diffusor plate (24) arranged in the enclosed interior between the inlet port (16) and the reticle storage portion (14), wherein the first diffusor plate (24) is provided with openings (25a, 25b), through which the purge gas can flow, the openings (25a) in a central section of the first diffusor plate (24) being provided with a larger individual opening area and/or providing a larger total opening area per unit area than openings (25b) in a peripheral section of the first diffusor plate (24).
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
The invention relates to an inspection system adapted for determining a state and/or content of a wafer or reticle container or at least a part of a wafer or reticle container, comprising a detection device or a multitude of detection devices (102, 104, 152, 154, 156, 158, 160, 164) adapted to receive detection data from a surface and/or interior of the wafer or reticle container or the part of a wafer or reticle container indicative of the state and/or content of the wafer or reticle container or the part of a wafer or reticle container.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/66 - Testing or measuring during manufacture or treatment
A modular sample store including a storage area; a service area; a transfer area; a motorized robot with a lifting device and at least one platform; and a controller. The sample store service area includes one integrally formed cubic vat module and the sample store storage area includes at least one integrally formed cubic vat module. Each one of the aforementioned vat modules includes an essentially horizontal vat floor and four joining vat walls that are connected to the vat floor and that are leaving an open vat space. The modular sample store also includes upper side walls and a cover plate to close the sample store. Each vat floor and vat wall includes an outside liner and an inside liner, which outside and inside liners in each case are separated by a clearance. This clearance is essentially filled with a polymer foam material that provides fixation of the outside and inside liners to each other as well as thermal insulation of and reinforcement to the thus integrally formed cubic vat module sandwich construction.
A substrate processing apparatus including a frame (106), a first SCARA arm (110) having an end effector (110E) and being configured to extend and retract along a first axis, a second SCARA arm (120) having an end effector (120E) and being configured to extend and retract along a second axis, a drive section including a splitting drive pulley (606, 906) rotatably mounted to rotate at an axis of rotation of the drive section that is shared by the first and second SCARA arms, the splitting drive pulley being coupled to at least two idler pulleys (600, 601) by respective segmented transmission loops of separate band segments (701, 702, 711, 712) so that the splitting drive pulley is a common pulley splitting one degree of freedom of the drive section between the at least two idler pulleys so as to commonly drive the at least two idler pulleys, wherein at least one band of each respective transmission loop share a common band interface level.
B25J 9/04 - Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian co-ordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical co-ordinate type or polar co-ordinate type
B25J 9/10 - Programme-controlled manipulators characterised by positioning means for manipulator elements
F16H 19/00 - Gearings comprising essentially only toothed gears or friction members and not capable of conveying indefinitely-continuing rotary motion
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
92.
Automated system for storing, retrieving and managing samples
An automated storage system for storing large quantities of samples in trays includes a storage compartment, a tray shuttle compartment abutting the storage compartment on one side and a plurality of independent modules on the other side. The modules perform processing of samples that are retrieved from the storage compartment by a tray shuttle, including extraction of selected samples from retrieved source trays and transfer of the selected samples into a separate, destination tray that can be further processed or removed from the system for use. The independent operation of the modules permits handling and processing to be performed simultaneously by different modules while the tray shuttle accesses additional samples within the storage compartment. In one embodiment, a vertical carousel is used to vertically align a desired tray with the tray shuttle, while the tray shuttle operates within a horizontal plane.
The invention relates to a method for cleaning a synthetic surface, in particular to remove metal dirt and/or particles therefrom, said method being characterized by the following steps: a) the synthetic surface is rinsed with deionized water; b) the synthetic surface is rinsed with electrolyzed water; and c) the synthetic surface is rinsed with deionized water.
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
C02F 1/461 - Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
A buffer station for automatic material handling system can provide throughput improvement. Further, by storing to-be-accessed workpieces the buffer stations of an equipment, the operation of the facility is not interrupted when the equipment is down. The buffer station can be incorporated in a stocker, such as bare wafer stocker.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
An apparatus includes a frame configured to hold sample holders in an array, a longitudinal axis of the sample holder extending outward of an array plane; a drive section connected to the frame; at least one transfer arm rotatably connected to the drive section so that each transfer arm rotates about a rotation axis oriented substantially parallel with the longitudinal axis and includes a sample holder gripper; and at least one push member movably connected to the drive section and being distinct from the sample holder gripper and configured for linear movement along the longitudinal axis, the at least one push member being configured so that engagement with at least a bottom or top surface of the sample holder effects longitudinal translation of the sample holder for one or more of capture and release of the sample holder by the respective transfer arm in the longitudinal direction.
G01N 35/02 - Automatic analysis not limited to methods or materials provided for in any single one of groups Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
G01N 35/00 - Automatic analysis not limited to methods or materials provided for in any single one of groups Handling materials therefor
B65G 1/137 - Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
An automated sample specimen storage system including a tube holding microplate including a plate frame, a predetermined array of tube holding receptacles formed in the plate frame, the receptacles having a SBS standard pitch corresponding to the predetermined array, and being configured for holding therein sample store and transport tubes, each disposed so as to contain sample specimen in a sample storage of the storage system and to effect, with the sample tube, delivery from the sample storage to a workstation, the predetermined array of receptacles defining a volume capacity of the tube holding microplate, and each of the receptacles being shaped to conformally engage walls of the sample tubes and hold a respective one of the sample store and transport tubes, wherein the receptacles are arranged so that the tube holding microplate volume capacity defined by the predetermined array is an under optimum volume capacity.
G01N 35/02 - Automatic analysis not limited to methods or materials provided for in any single one of groups Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers
In an embodiment, the present invention discloses cleaned storage processes and systems for high level cleanliness articles, such as extreme ultraviolet (EUV) reticle carriers. A decontamination chamber can be used to clean the stored workpieces. A purge gas system can be used to prevent contamination of the articles stored within the workpieces. A robot can be used to detect the condition of the storage compartment before delivering the workpiece. A monitor device can be used to monitor the conditions of the stocker.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B65B 5/08 - Packaging groups of articles, the articles being individually gripped or guided for transfer to the containers or receptacles
B65B 31/04 - Evacuating, pressurising or gasifying filled containers or wrappers by means of nozzles through which air or other gas, e.g. an inert gas, is withdrawn or supplied
B65B 35/16 - Feeding, e.g. conveying, single articles by grippers
B65B 63/08 - Auxiliary devices, not otherwise provided for, for operating on articles or materials to be packaged for heating or cooling articles or materials to facilitate packaging
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B08B 3/08 - Cleaning involving contact with liquid the liquid having chemical or dissolving effect
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
Cryogenic storage system provides automated storage and retrieval of samples in a cryogenic environment, as well as automated transfer of individual samples between cryogenic environments. Stored samples are maintained under a cryogenic temperature threshold, while also enabling access to the samples. The samples may be organized and tracked by scanning a barcode of each sample. Embodiments may also comprise multiple storage vaults and provide for transfer of individual samples between the storage vaults, as well as between a storage vault and a removable cryogenic storage device.
G01N 1/42 - Low-temperature sample treatment, e.g. cryofixation
G01N 35/00 - Automatic analysis not limited to methods or materials provided for in any single one of groups Handling materials therefor
G01N 35/02 - Automatic analysis not limited to methods or materials provided for in any single one of groups Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
A transport apparatus including a drive section connected to a frame and including a multi-drive shaft spindle, with at least one coaxial shaft spindle, more than one different interchangeable motor module arranged in a stack, each havinq a motor operably coupled thereto and defining a corresponding independent drive axis, and a can seal disposed between the stator and rotor of each motor module and hermetically sealing the stator and rotor from each other, at least one of the motor modules is selectable for placement in the stack from other different interchangeable motor modules, each having a different predetermined characteristic, independent of placement in the stack, that defines a different predetermined drive characteristic of the corresponding drive axis, independent of shaft spindle location, so that selection of the at least one motor module determines the different predetermined drive characteristic of the corresponding axis different from another of the independent drive axis.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
B25J 21/00 - Chambers provided with manipulation devices
B25J 9/12 - Programme-controlled manipulators characterised by positioning means for manipulator elements electric
B25J 9/04 - Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian co-ordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical co-ordinate type or polar co-ordinate type
