SYSTEM WITH AT LEAST ONE PRODUCT CARRIER AND AT LEAST ONE DATA MEDIUM, METHOD FOR PROVIDING A SYSTEM, AND METHOD FOR DETERMINING A CHARACTERISTIC DATA RECORD STORED ON A DATA MEDIUM OF A SYSTEM
In an embodiment a system includes at least one product carrier and at least one data medium, wherein a plurality of electronic components are arranged on the product carrier, wherein each of the electronic components has a unique position on the product carrier, wherein each of the electronic components is removable from the product carrier by a user manually or by a machine, wherein the product carrier has a unique identifier, wherein an individually assigned characteristic data record is stored on the data medium for each of the electronic components, and wherein the individually assigned characteristic data record stored on the data medium is obtainable for each of the electronic components with the unique identifier of the product carrier and the unique position on the product carrier.
In an embodiment an electrode includes a sintered portion having merged or sintered particles, wherein the particles include a valve metal or a metal from the boron group, and wherein the sintered portion and/or the particles include an oxide portion that includes phosphorus.
In an embodiment a sensor includes a ceramic substrate and two metallization layers deposited on opposite surfaces of the ceramic substrate, wherein each of the two metallization layers includes an adhesive layer deposited directly on the ceramic substrate, and wherein each of the two metallization layers comprises a gold layer deposited on a respective adhesive layer.
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
H01C 1/02 - HousingEnclosingEmbeddingFilling the housing or enclosure
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
The present invention concerns a capacitor comprising at least four winding elements arranged in a stack, wherein each winding element has a top face and a bottom face, a first busbar and a second busbar, wherein, in a stacking direction of the stack, the first busbar is connected to the top face of the first winding element, to the top face of the last winding element and to the bottom faces of the other winding elements (2-5), and wherein, in the stacking direction of the stack, the second busbar is connected to the bottom face of the first winding element to the bottom face of the last winding element and the top faces of the other winding elements.
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
A sensor element for measuring a temperature includes at least one carrier with a top side and a bottom side with an insulating layer formed on the top side of the carrier, at least two electrodes formed on the carrier at a distance from one another, at least one functional layer comprising a material with a temperature-dependent electrical resistance and arranged at least partially between the electrodes, at least two intermediate layers comprising an insulating material, and at least two contact pads for electrical contacting of the sensor element. The sensor element is adapted to be integrated directly into an electrical system as a discrete component. The sensor element has a small deviation range from a nominal resistance. At least one of the at least two electrodes is structured for setting the resistance value.
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 17/22 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
In embodiments a housing includes a first housing component and a second housing component having a first guide groove, the first guide groove having an undercut shape, wherein the first housing component comprises a first complementary element, and wherein the first complementary element and the first guide groove are designed such that the housing components are connectable to form the housing by sliding one inside the other along a guide direction.
The present disclosure refers to a temperature sensor with encapsulation and to a method of manufacturing a temperature sensor (1), comprising the steps: providing the temperature sensor (1) comprising the thermistor element (2) and two electrical lead elements (3,6) connected to the thermistor element (2), arranging the sensor head in a transfer mold, encapsulating the sensor head by transfer molding.
H01C 1/028 - HousingEnclosingEmbeddingFilling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
H01C 1/034 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
H01C 1/04 - Arrangements of distinguishing marks, e.g. colour coding
8.
SENSOR ELEMENT AND METHOD OF MANUFACTURING A SENSOR ELEMENT
Sensor element and method of manufacturing a sensor element The present invention concerns a sensor element (1) for measuring a temperature comprising a carrier (2), a temperature dependent resistor (10) arranged on a top side (2a) of the carrier (2), and a shunt resistor (20) arranged on the top side (2a) of the carrier (2), wherein the temperature dependent resistor (10) comprises a first electrode (12), a second electrode (13) and a functional layer (11) comprising a material having a temperature dependent electrical resistance, wherein the first and the second electrodes (12, 13) are thin film electrodes and the functional layer (11) is a thin film, wherein the shunt resistor (20) is electrically connected to at least one of the electrodes (12, 13) of the temperature dependent resistor (10), and wherein the shunt resistor (20) is formed by a thin film. Another aspect concerns a method of manufacturing the sensor element.
The application relates to an electronic component having a first outer electrode. Said electronic component has a relief layer which is designed to reduce mechanical or thermomechanical loads on a functional body located below the outer electrode. Furthermore, the outer electrode has a terminating outer layer which is thinner than the relief layer.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 1/148 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
10.
TEMPERATURE SENSOR, SENSOR ELEMENT AND MANUFACTURING METHOD OF TEMPERATURE SENSOR
A temperature sensor is provided that comprises a sensor element, a mounting component, and at least two coatings, a first coating and a second coating. The sensor element comprises a thermosensitive body, converting a temperature change into a measurable change of an electrical quantity and at least one wire electrically connected to the thermosensitive body. The first coating covers the thermosensitive body, a part of the wire close to its connection with the thermosensitive body and their connection. The second coating covers the first coating and is attached to the mounting component. A method of manufacturing of a temperature sensor is provided as well.
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
G01K 1/143 - SupportsFastening devicesArrangements for mounting thermometers in particular locations for measuring surface temperatures
A Temperature sensor assembly is provided that comprises a probe component and an attachment component. The probe component is configured to measure a temperature. The attachment component has a holding portion and an attachment portion. Further, the attachment portion is configured such that the temperature sensor assembly can be attached to an object whose temperature is to be measured via the attachment portion. Furthermore, the holding portion exerts a holding force on the probe component at least in a first direction, and the probe component has an engagement portion that engages such with the holding portion that movement of the probe component in a direction different to the first direction is hindered or fully restricted.
An inductive component (1) is specified which comprises a core element (2) and at least two wires (31, 32) twisted together and wound around the core element (2) in at least two winding blocks (41, 42). Each winding block (41, 42) has an inner winding section (411, 421) in which at least one turn of the wires (31, 32) is directly wound around the core element (2) and an outer winding section (412, 422) in which at least one turn of the wires (31, 32) is directly wound around the corresponding inner winding section (411, 421). The outer winding section (412, 422) of one winding block (41, 42) is connected to the inner winding section (411, 421) of a directly adjacent winding block (41, 42).
A controlling device (1) for an ultrasonic transducer (100) comprises and actuating element (2) and a feedback element (3). The actuating element (2) is configured to apply a burst signal (11) to the transducer (100) for generating and sending an ultrasonic signal (105). The actuating element (2) is further configured to apply a damping signal (12) to the transducer (100) for damping a periodic membrane displacement (4) after sending the ultrasonic signal (105). The feedback element (3) is configured to generate the damping signal (12) by determining peak point positions (41) of a membrane displacement (4) after termination of exciting the membrane. The feedback element (3) is further configured to generate the damping signal (12) comprising a sequence of pulses such that each pulse is centered around one peak point position (41). Furthermore, an ultrasonic transducer (100), a method for operating an ultrasonic transducer (100), a method for using an ultrasonic transducer (100), an electronic component, a computer-implemented method for operating a controlling device, a data processing device, a computer program, and a computer-readable storage media are specified.
In an embodiment a capacitor includes at least one capacitor unit having at least two winding elements, a first busbar, a second busbar, a third busbar and a fourth busbar, wherein all winding elements are arranged in a single stack, wherein the first busbar and the second busbar are arranged such that they overlap each other, wherein the first busbar and the second busbar are arranged at a first lateral face of the stack, which has a surface normal perpendicular to a stacking direction of the stack, wherein, in the stacking direction, alternatingly either the first busbar or the second busbar is connected to a top face of the winding elements, wherein the third busbar and the fourth busbar are arranged such that they overlap each other, and wherein the third busbar and the fourth busbar are arranged on a second lateral face of the stack opposite to the first lateral face.
The invention relates to an overvoltage protection circuit (100) for a DC network having a phase conductor (P), a neutral conductor (N) and a ground conductor (M), which overvoltage protection circuit has a first protection element (1) with a main arrester element (10), a first additional arrester element (11) and a second additional arrester element (12), wherein the main arrester element (10) can be connected to the phase conductor (P) and, via the first additional arrester element (11), to the neutral conductor (N) and, via the second additional arrester element (12), to the ground conductor (M), such that, in the connected state, the main arrester element (10) and the first additional arrester element (11) connect the phase conductor (P) to the neutral conductor (N), and the main arrester element (10) and the second additional arrester element (12) connect the phase conductor (P) to the ground conductor (M).
H01T 15/00 - Circuits specially adapted for spark gaps, e.g. ignition circuits
H02H 9/06 - Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage using spark-gap arresters
H02H 3/20 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection responsive to excess voltage
H01T 2/02 - Spark gaps comprising auxiliary triggering means comprising a trigger electrode or an auxiliary spark gap
H01T 4/16 - Overvoltage arresters using spark gaps having a plurality of gaps arranged in series
H01T 4/06 - Mounting arrangements for a plurality of overvoltage arresters
H01T 4/10 - Overvoltage arresters using spark gaps having a single gap or a plurality of gaps in parallel
16.
ELECTRICAL COMPONENT AND A METHOD FOR PRODUCING AN ELECTRICAL COMPONENT
The invention relates to an electrical component (1) comprising a main body (2), at least one contact structure (3), and a stabilizing structure (4). The at least one contact structure (3) is arranged at least on a main surface (20) of the main body (2). The stabilizing structure (4) is arranged at least on the main surface (20) of the main body (2). The stabilizing structure (4) is designed to increase the mechanical stability of the contact structure (3).
17.
DEVICE AND METHOD FOR GENERATING A DIELECTRIC BARRIER DISCHARGE
In an embodiment a device includes a thermoelectric component, an electrode arranged opposite the thermoelectric component, a high voltage source configured to generate a high voltage between the thermoelectric component and the electrode sufficient to ignite a dielectric barrier discharge, wherein the thermoelectric component includes two or more thermoelectric elements and metal bridges connecting the thermoelectric elements, and a weakly conductive layer directly contacting the metal bridges and a first ceramic plate.
The invention relates to a sensor element (100) for measuring a temperature, the sensor element comprising: - a carrier (2) having an upper side (11) and a lower side (12), the upper side (11) being electrically insulating, - at least one functional layer (7) comprising a material having a temperature-dependent electrical resistance, - a plurality of first and second electrodes (4a, 4b) for electrically contacting the functional layer (7), and - at least three contact pads (10a to 10f) for electrically contacting the sensor element (100), wherein the sensor element (100) has a variable nominal resistance, and wherein the at least one functional layer (7) comprises a plurality of regions (70) which are contacted separately such that the nominal resistance of the sensor element (100) depends on the contacted regions (70) of the functional layer (7). The invention also relates to a method for manufacturing a sensor element (100) and to a use of the sensor element (100).
A sensor element for measuring a temperature has a carrier and at least one functional layer which has a material with a temperature-dependent electrical resistance. The functional layer is arranged on the carrier. The sensor element has at least two electrodes with electrode fingers and at least two contact pads for electrically contacting the sensor element. One contact pad is arranged directly on a partial area of one of the electrodes in each case. The sensor element is designed to be integrated into an electronic system as a discrete component. The sensor element has a narrow resistance tolerance. The functional layer and/or at least one of the at least two electrodes are structured to adjust the resistance value.
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 17/242 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
20.
METHOD FOR APPLYING A COATING TO AT LEAST ONE ELECTRONIC COMPONENT AND COATING ARRANGEMENT
A method for applying a coating to at least one electronic component is described comprising the following steps:
A method for applying a coating to at least one electronic component is described comprising the following steps:
A) Providing a coating arrangement (1) comprising a coating roller (2), wherein the coating roller (2) is rotatable around a rotation axis (R);
A method for applying a coating to at least one electronic component is described comprising the following steps:
A) Providing a coating arrangement (1) comprising a coating roller (2), wherein the coating roller (2) is rotatable around a rotation axis (R);
B) Providing a coating material (3) on the coating roller (2);
A method for applying a coating to at least one electronic component is described comprising the following steps:
A) Providing a coating arrangement (1) comprising a coating roller (2), wherein the coating roller (2) is rotatable around a rotation axis (R);
B) Providing a coating material (3) on the coating roller (2);
C) Providing at least one electronic component (10);
A method for applying a coating to at least one electronic component is described comprising the following steps:
A) Providing a coating arrangement (1) comprising a coating roller (2), wherein the coating roller (2) is rotatable around a rotation axis (R);
B) Providing a coating material (3) on the coating roller (2);
C) Providing at least one electronic component (10);
D) Moving the at least one electronic component (10) along the rotating coating roller (3) to obtain a coating (12) of at least a part of the electronic component (10).
A method for applying a coating to at least one electronic component is described comprising the following steps:
A) Providing a coating arrangement (1) comprising a coating roller (2), wherein the coating roller (2) is rotatable around a rotation axis (R);
B) Providing a coating material (3) on the coating roller (2);
C) Providing at least one electronic component (10);
D) Moving the at least one electronic component (10) along the rotating coating roller (3) to obtain a coating (12) of at least a part of the electronic component (10).
Moreover, a coating arrangement (1) for applying a coating (12) to at least one electronic component (10) is described.
B05C 1/02 - Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
H01C 17/06 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
The invention relates to a sensor device (100) for detecting hydrogen, comprising a substrate (10) having a flexural body (11) and a functional layer stack (20) on a surface of the flexural body (11), the functional layer stack (20) comprising at least one sensor layer (21) and an adhesion promoter layer (22) between the surface and the sensor layer (21), and the sensor layer (21) being provided and designed to have a volume which is dependent on the hydrogen concentration.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
22.
CORE ELEMENT FOR AN INDUCTIVE COMPONENT, AND INDUCTIVE COMPONENT
A core element (1) for an inductive component (10) comprises at least one winding leg (2) configured to receive at least one winding (11), and at least one through-hole (3) through the winding leg (2). The through-hole (3) at least partially penetrates the winding leg (2) in a first direction (100) parallel to a main extension direction of the winding leg (2). An interface between an internal space of the through-hole (3) and the core element (2) is configured as part of a cooling surface of the core element (1). Furthermore, an inductive component (10) is specified.
In embodiments a method for providing a contacting for a functional ceramic element includes providing a functional ceramic, applying a metal paste to two opposing surfaces of the functional ceramic, laminating ceramic substrate green films on the metal paste on the two opposite surfaces of the functional ceramic, and jointly sintering the functional ceramic, the ceramic substrate green films forming electrically insulating ceramic layers and the metal paste forming electrically conductive metal structures.
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
The invention relates to a ring-tab sensor (1) comprising a sensor element (2) and a first fastening element (4) which has a first ring tab (6) and is suitable for fixing the sensor element on a surface (10) to be measured, wherein the first fastening element comprises a fixing portion (9), by way of which the first fastening element is fixed on the sensor element, and wherein the first ring tab is fixed by a fixing means (20) on the surface to be measured, and also comprising a second fastening element (5), which has a spring portion (8), which is suitable for pressing the sensor element against the surface to be measured, wherein the first and second fastening elements are preferably formed as a one-piece element.
G01K 1/14 - SupportsFastening devicesArrangements for mounting thermometers in particular locations
G01K 1/143 - SupportsFastening devicesArrangements for mounting thermometers in particular locations for measuring surface temperatures
G01D 11/30 - Supports specially adapted for an instrumentSupports specially adapted for a set of instruments
F16B 2/24 - Clips, i.e. with gripping action effected solely by the inherent resistance to deformation of the material of the fastening of resilient material, e.g. rubbery material of metal
F16B 5/02 - Joining sheets or plates to one another or to strips or bars parallel to them by means of fastening members using screw-thread
F16B 5/06 - Joining sheets or plates to one another or to strips or bars parallel to them by means of clamps or clips
F16B 5/12 - Fastening strips or bars to sheets or plates, e.g. rubber strips, decorative strips for motor vehicles, by means of clips
F16B 43/00 - Washers or equivalent devicesOther devices for supporting bolt-heads or nuts
B60R 13/02 - Trim mouldingsLedgesWall linersRoof liners
25.
SYSTEM ASSEMBLY, PRESSURE SENSOR ASSEMBLY AND METHOD FOR PRODUCING A SYSTEM ASSEMBLY
The invention relates to a system assembly. The system assembly has a printed circuit board which is fastened to a support structure by means of a closed adhesive contour. The support structure has a means of ventilation which is designed to discharge gases from the space between the printed circuit board and the support structure that is enclosed by the adhesive contour.
H05K 5/02 - Casings, cabinets or drawers for electric apparatus Details
G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
An enclosure with a first region and a second region is provided, wherein the enclosure has an outer opening in relation to the first region, an intermediate opening or a labyrinth seal is formed between the first region and the second region, and wherein, in the case of the intermediate opening, the outer opening has a larger cross section than the intermediate opening.
In an embodiment a sensor arrangement for measuring a temperature includes at least one double-sided printed circuit board, wherein the circuit board has a top side and a bottom side, at least one first solder pad and at least one second solder pad being arranged on the top side and on the bottom side, respectively, at least one sensor device mechanically and electrically connected directly to the top side of the circuit board, and an insulation enveloping at least the sensor device on the top side of the circuit board completely.
The invention relates to a resistor layout (1) for a Wheatstone measuring bridge, which comprises four electrical resistor elements (2, 3), wherein the structures of the four resistor elements are arranged concentrically about a common centre point (M) and extend in a radial and a tangential direction with respect to the centre point, wherein the first resistor elements extend tangentially about the centre point at a defined angle α and the second resistor elements extend tangentially about the centre point at a defined angle β.
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
G01L 9/06 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers of piezo-resistive devices
In an embodiment a method for producing a coil includes providing a tube having a tube wall composed of an electrically conductive material, creating a coil string by creating a plurality of inductive portions along the tube in the tube wall, wherein each inductive portion is shaped by a gap so that each inductive portion comprises a helix and partially removing the tube wall between neighboring inductive portions thereby forming contact connection portions, singulating the coil string by separating the contact connection portions thereby forming individual coils, each individual coil having an inductive portion with two contact portions and forming electrical terminals from the two contact portions.
H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
H01F 41/064 - Winding non-flat conductive wires, e.g. rods, cables or cords
H01F 41/076 - Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
A sensor element (1) for measuring a temperature is described comprising - a carrier (2), - at least one functional layer (3) arranged on a top side (2a) of the carrier, the functional layer (3) comprising a material having a temperature dependent electrical resistance, - at least one bottom electrode (4), a contact area (c2) being established between the at least one bottom electrode (4) and the functional layer (3), - at least one top electrode (5), a contact area (c1) being established between the at least one top electrode (5) and the functional layer (3), wherein the functional layer (3) is at least partly sandwiched between the at least one bottom electrode (4) and the at least one top electrode (5) and wherein the functional layer (3), the at least one top electrode (5) and the at least one bottom electrode (4) are designed and arranged to achieve a specific electrical resistance of the sensor element (1). Furthermore a use of the sensor element (1) is described.
G01J 5/06 - Arrangements for eliminating effects of disturbing radiationArrangements for compensating changes in sensitivity
G01J 5/20 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
G01J 5/70 - Passive compensation of pyrometer measurements, e.g. using ambient temperature sensing or sensing of temperature within housing
The invention relates to an inductive component (1), which comprises a base (2) and a top (3). The inductive component (1) further comprises at least two winding legs (4). The winding legs (4) comprise a first material. Each of the winding legs (4) is connected to the base (2) and the top (3). Each of the winding legs (4) is arranged between the base (2) and the top (3). The inductive component (1) further comprises at least one center leg (5). The center leg (5) comprises a second material. The center leg (5) is positioned between the winding legs (4). A first gap (6) is provided between the center leg (5) and the base (2). Further, a second gap (7) is provided between the center leg (5) and the top (3). The first material has a first magnetic flux density, which is lower than a second magnetic flux density of the second material.
In an embodiment a substrate includes a ceramic main body including first volume regions and second volume regions, each of the first volume regions and the second volume regions containing a ceramic material, wherein the first volume regions contain less sintering aid than the second volume regions, and wherein some of the first volume regions terminate the substrate in a stacking direction.
According to the application, an electrode is provided having a substrate and a sintered body on a first main surface of said substrate. The substrate comprises a first valve metal. The sintered body comprises merged or sintered particles that comprise a second valve metal. The first main surface of the substrate is surface-modified
According to the application, an electrode is provided having a substrate and a sintered body on a first main surface of said substrate. The substrate comprises a first valve metal. The sintered body comprises merged or sintered particles that comprise a second valve metal. The first main surface of the substrate is surface-modified
According to the application, an electrode is provided having a substrate and a sintered body on a first main surface of said substrate. The substrate comprises a first valve metal. The sintered body comprises merged or sintered particles that comprise a second valve metal. The first main surface of the substrate is surface-modified.
In an embodiment a magnetic component includes a magnetic core, a coil having a winding wound around the magnetic core, a main magnetic flux path within the magnetic core, and a stray magnetic flux area outside the magnetic core, wherein the stray magnetic flux area is at least partially embedded in or guided by a first material, and wherein the first material is a thermally conductive filler or potting material.
The present invention relates to a surface-mountable temperature sensor (1) of flip-chip design for mounting on a printed circuit board (10), the temperature sensor comprising: a sensor element (2), the electrical properties of which vary depending on the temperature; and an outer metallisation (3) for contacting the printed circuit board (10), the outer metallisation (3) extending both over a surface (2A, 3A) which faces the printed circuit board (10) in the mounted state, and, in the form of a solder-wettable side flank (3B), over a side surface (2B) which is perpendicular to the surface (3A). The invention also relates to a sensor device comprising the sensor (1) and a printed circuit board (10) on which the sensor (1) is mounted by means of the flip-chip method.
G01K 1/16 - Special arrangements for conducting heat from the object to the sensitive element
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
H01L 23/00 - Details of semiconductor or other solid state devices
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
38.
Electrolyte, Capacitor And Method Of Measuring Oxide Creation Capability
An electrolyte for an electrolytic capacitor and a capacitor having said electrolyte are provided. The electrolyte has an oxide creation capability (OCC) value of at least 1.3 V/s or a refractive index of at least 1.42 at 20° C.
A bobbin (100) for a transformer (1000) with a primary coil element (101) and a secondary coil element (102) is specified, the bobbin (100) comprising at least two primary compartments (10) configured for accommodating the primary coil element (101) formed by windings of a wire (110) that is wound around a winding axis (99), the winding axis (99) defining a longitudinal direction (91), at least one secondary compartment (20) located between the at least two primary compartments (10) along the longitudinal direction (91) and configured for accommodating a secondary winding element (120) of the secondary coil element (102), wherein the bobbin (100) is formed as a single piece, and the at least one secondary compartment (20) is configured as a slot into which the secondary winding element (120) can be mounted by sliding the secondary winding element (120) into the at least one secondary compartment (20) along a mounting direction (92) that is perpendicular to the longitudinal direction (91). Furthermore, a transformer (1000) and a method for manufacturing a transformer (1000) are specified. Significant Figure: Fig. 15
The invention relates to an electrical device (100) which has a generator unit (1) for generating an electrical current in a power line (2) having a plurality of phases, a frequency converter unit (3) based on SiC technology, and a filter unit (4) between the generator unit (1) and the frequency converter unit (3), which filter unit is designed for current limitation and voltage increase damping and has precisely one inductive element (41), which is designed as a current limiting element and which forms a voltage increase damping element together with a capacitive element (42) which has at least one capacitor per phase.
H02M 7/5387 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
H02M 1/44 - Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
H02M 1/12 - Arrangements for reducing harmonics from AC input or output
a-yy3b3abcde33, wherein the molar ratios a, b, c, d and e fulfill 0.600 ≤ a ≤ 0.780, 0.245 ≤ b ≤ 0.410, 0.590 ≤ c ≤ 0.752, 0.0003 ≤ e ≤ 0.0153 and c+d+e = 1.
C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
The invention relates to a capacitor comprising a capacitive element arranged in a housing, wherein in or on the housing a gas dissipation element is arranged and/or wherein the capacitor has an electrolyte that comprises an organic acid having a pKa of 4.1 or higher and/or wherein the capacitor has an OMS of 20% or higher.
A capacitor includes a capacitive element arranged in a housing, wherein in or on the housing a gas dissipation element is arranged and/or wherein the capacitor has an electrolyte that comprises an organic acid having a pka of 4.1 or higher and/or wherein the capacitor has an OMS of 20% or higher.
In an embodiment a positive temperature coefficient (PTC) heater includes a main-body having a length L, a width B, and a height H made of a PTC material, a first electrode and a second electrode made of an electrically conductive material and a dielectric layer arranged on a lateral surface of the main body, wherein the following is true for L, B, and H: L≥B≥H, wherein the electrodes are connected to the main body so that the following is true for a spacing d between the electrodes: d>H, and wherein the dielectric layer comprises an oxidic ceramic.
H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
A multilayer structure is provided that comprises a metal substrate and an electrode above the metal substrate. An adhesion layer is arranged between a main surface of said metal substrate and said electrode.
H10N 30/078 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
H10N 30/079 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
In this application a multilayer structure is provided. This multilayer structure comprises a semiconductor or insulator substrate. Said substrate has a main surface. An electrode comprising a noble metal or a conductive oxide is arranged above this main surface. Above the electrode, an electroceramic layer is arranged. In the multilayer structure, an adhesion layer is arranged between the main surface of the substrate and the electrode.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
H01G 4/012 - Form of non-self-supporting electrodes
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
H10N 15/10 - Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
H01C 7/18 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
H10D 1/68 - Capacitors having no potential barriers
H10D 84/00 - Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
H10D 86/85 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals
H10N 30/05 - Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
H10N 30/00 - Piezoelectric or electrostrictive devices
H10N 30/50 - Piezoelectric or electrostrictive devices having a stacked or multilayer structure
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
H10N 30/079 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
H10N 30/078 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
H01G 7/06 - Capacitors in which the capacitance is varied by non-mechanical meansProcesses of their manufacture having a dielectric selected for the variation of its permitivity with applied voltage, i.e. ferroelectric capacitors
47.
THIN-FILM DEVICE, ELECTROCERAMIC THIN FILM, USE OF BFO-BTO, PIEZOELECTRIC MATERIAL, PRECURSOR SOLUTION, PROCESS OF FORMING A THIN FILM
H10N 30/078 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
H10N 30/079 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
A sensor (1) comprises a measuring element (2), at least one connection cable (3) for contacting the measuring element (2), a first potting (4), and a second potting (5). The connection cable (3) is provided at a first end (11) of the sensor (1) and is in direct contact with the first potting (4), and the measuring element (2) is provided at a second end (12) of the sensor (1), is at least partly surrounded by the second potting (5), and is in direct contact with the second potting (5). In a transition region (13) between the first end (11) and the second end (12), the first potting (4) is in direct contact with the second potting (5). The sensor (1) is designed, for example, to detect the temperature of a motor, an electric motor or a component of an electric motor vehicle. The invention also relates to a method for producing a sensor.
The invention relates to a housing (2) for a measuring element (3) of a sensor (1) for detecting a temperature, wherein the height (21) of the housing (2) decreases strictly monotonically towards a first end (11) of the housing (2) along the entire length (22) of the housing (2), and the sensor (1) comprises the housing (2) in particular. The sensor (1) can be designed to detect the temperature of an object (100) to be measured, and the object (100) to be measured is, for example, part of an electric motor vehicle, an electric motor, or a control device.
The invention relates to a sensor assembly (1) having a sensor element (1) and a casing (2) which surrounds the sensor element (1), wherein the casing (2) has a bearing surface (3), and the casing (2) has a tapering region (8) in which the casing (2) tapers along the surface normal (FN) of the bearing surface (3). The invention also relates to a method for producing a sensor assembly (1).
A device for generating a haptic signal. The device includes a haptic module for generating a vibration, a base plate and a cover plate arranged parallel to each other. The cover plate has an abutment surface facing towards the base plate and a top side facing away from the base plate. The haptic module is arranged between the base cover plates, a first partial area of the haptic module abuts the abutment surface of the cover plate and a second partial area of the haptic module abuts the base plate. A spring-loaded suspension mechanically connects the base plate and the cover plate. The spring-loaded suspension is designed so that the abutment surface of the cover plate is moved towards the base plate when the cover plate is in a neutral position and a force is exerted in the direction of the base plate on any point on the top side of the cover plate.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
H10N 30/00 - Piezoelectric or electrostrictive devices
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
H10N 30/50 - Piezoelectric or electrostrictive devices having a stacked or multilayer structure
In an embodiment a temperature controller circuit includes an evaluation circuit and two or more sensor stages, wherein each sensor stage includes a sensor element and a sensor element controller and wherein the sensor stages are electrically connected in parallel.
G01K 7/24 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
G01K 1/02 - Means for indicating or recording specially adapted for thermometers
53.
METHOD FOR PRODUCING A MULTILAYER VARISTOR, USE OF METAL PASTE FOR FORMING METAL LAYERS, GREEN BODY FOR PRODUCING A MULTILAYER VARISTOR, AND MULTILAYER VARISTOR
Summary
Summary
The present invention relates to a method of manufacturing a multilayer varistor (1) comprising the steps of:
Preparing a metal paste (103) comprising silver and nickel, wherein the mass fraction of nickel in the metals of the metal paste (103) is at most 25%,
Applying of the metal paste (103) to a ceramic green film (102),
Applying of a further ceramic green film (102) to the metal paste (103) to produce a sandwich-like structure and Sintering of the green films (102) with the applied metal paste (103), whereby the green films (102) are converted into ceramic layers (2) and the metal paste (103) is converted into an inner electrode (3).
The invention relates to a component having a main part (1) with at least a first and a second electrode, wherein a first electrical contact surface (4), which is electrically connected to the first electrode, and a second electrical contact surface (5), which is electrically connected to the second electrode, are provided on the lower face (2) of the main part. At least one purely mechanical contact surface (7), which is electrically floating, and/or at least one sensor contact surface (101), which is connected to a third electrode of the main part, is provided on the lower face of the main part, or one of the electrical contact surfaces (5) has a flat contact region (10) and a strip-shaped region (11) adjoining the flat contact region. The component can particularly be a ceramic piezoelectricl multilayer component for a bending actuator and/or bending sensor.
The invention concerns fuse system and an electric device (1) comprising an electric element (3,5), an electrical conductor (7) which is held in a constant distance to the electric element (3,5) by a holding element (2), and which is electrically connected to the electric element (3,5) by a link element (6, 10), wherein at least a part of the link element (6, 10) is configured to melt into a molten material when the electric element (3,5) overheats, whereby the electrical conductor (7) and the electric element (3,5) are electrically disconnected by a void gap since the distance between the electrical conductor (7) and the electric element (3,5) is held constant.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
H01C 7/10 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
Here is provided a process of forming a cover, by providing an electronically functional component, covering the electronically functional component by applying a molten polymer or molten polymer precursor to the outside of the electronically functional component, or placing the electronically functional component into a pre-form comprising a polymer forming means, wherein the pre-form encloses the electronically functional component from more than one side, or placing the electronically functional component into an injection mold and filling at least part of the mold by a polymer forming means, or placing the electronically functional component into the concave portion of a cap and at least partially filling the volume between the inner concave side of the cap and electronically functional component by a polymer forming means.
H01C 1/028 - HousingEnclosingEmbeddingFilling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
57.
SENSOR, PROCESS OF MANUFACTURING A SENSOR, AND USE OF CERTAIN POLYMERS FOR COVERING A THERMISTOR COMPONENT
The present application addresses having a thermistor component and a cover covering the thermistor component at least partially. The material of the cover comprises a polyaryletherketone, a polyphenylene sulfide, an aromatic thermosetting copolyester, a liquid crystal polymer, a polyamide, a polyimide, a polyamide imide, or a polybenzimidazole.
H01C 1/028 - HousingEnclosingEmbeddingFilling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
58.
PEN-SHAPED INPUT AND/OR OUTPUT DEVICE AND METHOD FOR GENERATING A HAPTIC SIGNAL
In an embodiment a device includes an actuator unit including a piezoelectric actuator, wherein the actuator unit has a mechanical amplification element, which is attached to the piezoelectric actuator, wherein the mechanical amplification element is configured to deform in a first direction as a result of a change in an extension of the piezoelectric actuator such that a sub-region of the mechanical amplification element is moved relative to the piezoelectric actuator in a second direction, the second direction being perpendicular to the first direction, and wherein the device is a pen-shaped input and/or output device.
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
G01L 1/16 - Measuring force or stress, in general using properties of piezoelectric devices
G01P 15/09 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by piezoelectric pick-up
G01R 19/165 - Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
G06F 3/0346 - Pointing devices displaced or positioned by the userAccessories therefor with detection of the device orientation or free movement in a 3D space, e.g. 3D mice, 6-DOF [six degrees of freedom] pointers using gyroscopes, accelerometers or tilt-sensors
G06F 3/0354 - Pointing devices displaced or positioned by the userAccessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
G06F 3/038 - Control and interface arrangements therefor, e.g. drivers or device-embedded control circuitry
An inductive component comprises a core element from a magnetic material, a conductor, and a mold body. The conductor is arranged at least partially around the core element. The mold body comprises metallic particles in a matrix material. The mold body surrounds the core element and the conductor at least partially.
The invention relates to a switching device which has two stationary contacts and a movable contact in a switching chamber. The stationary contacts are arranged next to each other along a longitudinal direction, and the switching chamber has a switching chamber wall with opposing transversal lateral wall parts and opposing longitudinal lateral wall parts. Each of the two stationary contacts is arranged at a distance to one of the transversal lateral wall parts, said distance being shorter than the respective distance to the longitudinal lateral wall parts.
In an embodiment a switching device includes at least one fixed contact and a movable contact in a switching chamber, a contact element outside the switching chamber, a mechanical drive with a shaft, wherein the mechanical drive is configured for moving the movable contact and the contact element; and at least two auxiliary contacts outside the switching chamber on a side of the shaft facing away from the movable contact, wherein the contact element is configured to contact the at least two auxiliary contacts in a first switching state of the switching device and be spaced apart from the at least two auxiliary contacts in a second switching state of the switching device, or be spaced apart from the at least two auxiliary contacts in a first switching state of the switching device and contact the at least two auxiliary contacts in a second switching state of the switching device.
The invention relates to an electrical resonator (1) comprising a plurality of stacked conductors (21, 22). The conductors (21, 22) are arranged in at least two windings. A dielectric (23) is arranged between an nth conductor layer of the stacked conductors (21, 22) and an (n+1)th conductor layer of the stacked conductors (21, 22). The resonator is designed such that, during operation, at at least one point of the resonator (1), a shortest electrical connection path from the nth conductor layer to the (n+1)th conductor layer includes more than one winding of the conductors (21, 22), wherein a portion of the electrical connection path located within the resonator (1) extends exclusively along conductive structures.
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
The invention relates to a micromirror comprising a mirror element (1) with a reflective surface, a first arm (2), a second arm (3) and a frame (4), wherein a first end (2a) of the first arm (2) is connected to the frame (4), a second end (2b) of the first arm (2) is connected to the mirror element (1), a first end (3a) of the second arm (3) is connected to the frame (4) and a second end (3b) of the second arm (3) is connected to the mirror element (1), wherein drive elements (8a-8c, 11a) are arranged on the first arm (2) and on the second arm (3) and are designed to bend the first arm (2) and the second arm (3), and wherein the mirror element (1) is arranged and connected to the second ends (2b, 3b) of the first and the second arms (2, 3) in such a way that the bending of the first and the second arms (2, 3) brings about a tilting movement of the mirror element (1) about an axis of rotation.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
64.
ELECTROACOUSTIC MODULE AND ELECTROACOUSTIC COMMUNICATIONS SYSTEM
The invention specifies an electroacoustic module (100), which has a cap-like housing body (1) with a plate element (10) having a first side (11) and a second side (12) situated opposite the first side (11) and with a sleeve element (13) arranged on the second side (12), has a piezoelectric component (2) which is fastened to the plate element (10) on the second side (12) and is surrounded by the sleeve element (13), and has an electrical connection element (4) on a side of the piezoelectric component (2) facing away from the plate element (10), the piezoelectric component (2) being electrically connected to the electrical connection element, wherein an intermediate space, which is filled with an acoustic decoupling material (5), is formed between at least part of the piezoelectric component (2) and the electrical connection element (4) directly adjacent to the piezoelectric component (2). The invention also specifies an electroacoustic communications system (1000).
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
G10K 9/122 - Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated using piezoelectric driving means
A method for producing a plurality of sensor elements (100) is described, the method comprising the following steps: A) Determining resistance changes of a functional layer (7) over a wafer (200) and providing a wafer (200); B) Forming a plurality of electrode pairs (4a, 4b) on the wafer (200); C) Applying a functional material to a partial region of each electrode pair (4a, 4b) to form a plurality of functional layers (7); D) Sintering of the functional layers (7); E) Applying a protective layer (8) to a top side (11) of the wafer (200), the protective layer (8) completely covering the top side (11) except for partial regions to which contact pads (10a, 10b) are applied in the subsequent process step; F) Forming contact pads (10a, 10b) in the partial regions free of the protective layer (8); G) Singulation; wherein the resistance changes over the wafer (200) are compensated by a specific design of each electrode pair (4a, 4b) and / or by a specific design of each functional layer (7). Moreover, a sensor element (100) produced by the method and a plurality of sensor elements (100) as intermediate products are described.
G01K 7/18 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
G01K 7/21 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer in a specially-adapted circuit, e.g. bridge circuit for modifying the output characteristic, e.g. linearising
G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
G01K 7/25 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit for modifying the output characteristic, e.g. linearising
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
The invention refers to a fuse system and an electric device (1) with assembling method, comprising an electric element (2) comprising a body (2A) and a terminal (3), an electrical conductor (5) being electrically connected to the terminal (3) by a fusible joint, an arc shield (6), at least one conductive spring (7) and a conductive connection element (8), wherein connection terminals of the at least one conductive spring (7) and the conductive connection element (8) are in electrical contact, wherein the at least one conductive spring (7) is pre-stressed and is configured to push the arc shield (6) between the terminal (3) and the electrical conductor (5), wherein by pushing the arc shield (6) the connection terminals of the at least one conductive spring (7) and the conductive connection element (8) are electrically disconnected.
H01H 9/32 - Insulating body insertable between contacts
H01H 85/02 - Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive Details
H01H 85/30 - Means for indicating condition of fuse structurally associated with the fuse
H01C 7/10 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
67.
INDUCTIVE COMPONENT, MAGNETIC CORE STRUCTURE AND METHOD FOR PRODUCING AN INDUCTIVE COMPONENT
The invention relates to an inductive component (1) comprising a magnetic core structure (4) having a first core part (5), around which a first winding (9) of a first conductor is arranged, having a second core part (6), around which a second winding (10) of a second conductor (3) is arranged, and having a third core part (7) and a fourth core part (8), through which the first conductor (2) and the second conductor (3) extend.
The invention relates to a sensor element (100) for measuring a temperature, comprising a carrier (2) and at least one functional layer (7), which comprises a material having a temperature-dependent electrical resistance. The sensor element (100) also has at least two electrodes (4a, 4b) for making electrical contact with the functional layer (7), each electrode (4a, 4b) being spiral-shaped and the electrodes (4a, 4b) being spirally guided one inside the other, wherein in each case a contact pad (10a, 10b) is arranged directly on a sub-region of one of the electrodes (4a, 4b). The sensor element (1) is designed to be directly integrated into an electrical system as a discrete component. The invention also relates to a method for producing a sensor element (100).
The invention relates to a core component (100) for a sensor assembly (1000), comprising: a circuit carrier (102) having an upper face (102a) and a lower face (102b) opposite from the upper face (102a); a pressure sensor element (104); and a temperature sensor element (105), wherein the circuit carrier (102) has a central region (113) and an edge region (114) surrounding the central region (113), the central region (113) has a sealing region (113a) which adjoins the edge region (114), the pressure sensor element (104) and the temperature sensor element (105) are mounted on the circuit carrier (102) in the central region (113), at least the temperature sensor element (105) is mounted on the lower face (102b) in the central region (113) and is electrically connected to first connection points (101a) on the lower face (102b), and the circuit carrier (102) is free of electrical feedthroughs which lead from the lower face (102b) in the central region (113) to the upper face (102a) in the central region (113). The invention also relates to a sensor assembly (1000) comprising the core component (100).
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
The invention relates to a drive unit (2) for moving a magnet armature (5) for a switching device (100), which drive unit has a coil assembly (20) and a coil-connection element (21), the coil-connection element (21) having a lead frame (210) comprising at least two lead-frame parts (211, 212) which are fastened to the coil assembly (20) and electrically conductively connected to the coil assembly (20). The invention also relates to a switching device (100) comprising the drive unit (2).
42 - Scientific, technological and industrial services, research and design
Goods & Services
Machines for surface conditioning; electric apparatus for
surface conditioning. Hand tools for surface conditioning. Industrial analysis and technological services for surface
conditioning.
72.
INDUCTIVE COMPONENT, MOLD TOOL AND METHOD FOR EMBEDDING
In an embodiment an inductive component includes an electrical conductor having a first terminal, a second terminal and a central region, which is electrically arranged between the first terminal and the second terminal, and a body in which the central region is arranged, wherein the central region is centered in the body, and wherein the body has a first one or more outwardly open recesses.
H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
73.
CAPACITOR COMPONENT, USE OF A CAPACITOR COMPONENT AND METHOD OF MANUFACTURING
In an embodiment a capacitor component includes a first winding element and a heat sink, wherein the first winding element is in direct thermal contact with the heat sink.
An inductive filter element is specified that comprises a core element comprising a first end region, a central region, and a second end region arranged along a longitudinal direction. The central region is arranged between the first end region and the second end region. A wire comprising a winding part is formed as a winding on the central region of the core element. The central region of the core element has a length lc in the longitudinal direction and a rectangular cross-section, which is perpendicular to the longitudinal direction and has a width wc in a transversal direction and a height hc in a vertical direction (93), and wherein lc>wc and lc>hc.
In an embodiment a switching device includes at least one fixed contact projecting into a switching chamber, wherein the at least one fixed contact has a mounting part and a connection part, and wherein the mounting part is attached to the switching chamber.
The invention relates to a switching device (100) which has at least one stationary contact (2, 3), a movable contact (4) and a switching state detection device (18), wherein the switching state detection device (18) has a permanent magnet (17), a magnetic switch (19) and a passive electronic unit (20) connected to the magnetic switch (19); the movable contact (4) and the permanent magnet (17) can be moved together; the magnetic switch (19) is a Hall switch having a Hall sensor (190); and the passive electronic unit (20) is made of one or more passive electrical components. The invention also relates to an operating device (1000) comprising the switching device (100).
H01H 47/00 - Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current
H01H 71/04 - Means for indicating condition of the switching device
77.
ADDITIVE MANUFACTURING METHOD, METHOD FOR DESIGNING A COMPONENT, AND COMPONENT
The present application relates to an additive manufacturing method in which a first material and a second material different therefrom are used to produce a component.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
The invention relates to a device and a production method for producing haptic feedback, the device comprising two components which are movable relative to one another and an actuator component (1) which can be installed and which is fixed between the two components (20, 30), wherein the actuator component (1) has a piezoelectric actuator (2) which is mechanically coupled to the two components, has a mechanical reinforcing element (3), the mechanical reinforcing element (3) being fastened to the piezoelectric actuator (2), and has an interface element (4).
The invention relates to a haptic device (100) which has a piezoelectric actuator (1) comprising a main body (10) and at least one reinforcing element (30) on a first main surface (11) of the piezoelectric actuator (1), the at least one reinforcing element (30) having at least one fastening region (39) via which the at least one reinforcing element (30) is fastened to the main body (10), and a lifting region (31) which is arranged at a distance from and above the first main surface (11), and a connecting layer (20) being arranged between the at least one fastening region (39) and the first main surface (11).
In an embodiment a coupled inductor includes a body having a first material, a first winding and a second winding magnetically coupled to the first winding and electrically isolated from the first winding, wherein the first winding and the second winding are embedded in the first material of the body, wherein the first material provides a magnetic surrounding of the first winding and the second winding, wherein the first winding has m turns with m>1, and wherein the second winding has n turns with n>1.
H01F 27/32 - Insulating of coils, windings, or parts thereof
G05F 1/33 - Regulating voltage or current wherein the variable is actually regulated by the final control device is AC using magnetic devices having a controllable degree of saturation as final control devices with plural windings through which current to be controlled is conducted
In an embodiment a sensor structure for arrangement on a body includes a substrate in which at least one emitter and at least one receiver are integrated such that the substrate at least partially encloses the emitter and the receiver and only one emission surface of the emitter and only one detection surface of the receiver are free of the substrate.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
The invention relates to an electrical capacitor (100), such as an aluminum electrolytic capacitor (100), and a temperature sensor (12) or a sensor system and an assembly method. The temperature sensor (12) installed in the capacitor housing (8, 10) is suitable for contactlessly exchanging electrical signals with a reader (5) in the vicinity of the electrical capacitor (100), which electrical signals reproduce information about the temperature in the interior of the capacitor housing (8, 10).
H01G 9/14 - Structural combinations for modifying, or compensating for, electric characteristics of electrolytic capacitors
G01K 1/14 - SupportsFastening devicesArrangements for mounting thermometers in particular locations
H01G 9/26 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
H01G 9/28 - Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass
G01K 13/00 - Thermometers specially adapted for specific purposes
H01G 11/18 - Arrangements or processes for adjusting or protecting hybrid or EDL capacitors against thermal overloads, e.g. heating, cooling or ventilating
H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
83.
DEVICE FOR GENERATING A HAPTIC SIGNAL, APPARATUS COMPRISING THE DEVICE, AND METHOD FOR MANUFACTURING THE DEVICE
A device (1) for generating a haptic signal has one or more piezoelectric elements (3) and at least one connection element (4, 4a, 4b) for electrical connection of the piezoelectric element (3).
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Machines for surface conditioning; electric apparatus for surface conditioning.
(2) Hand tools for surface conditioning. (1) Industrial analysis and technological services for surface conditioning.
42 - Scientific, technological and industrial services, research and design
Goods & Services
Machines for surface conditioning; electric industrial surface treatment apparatus in the nature of cold-plasma treatment systems comprising plasma generators, treating nozzles, and control units being structural parts therefor for industrial surface processing Hand-operated materials treatment tools for surface conditioning, namely, for use in cold-plasma treatment for surface activation, cleaning, and preparation Scientific industrial analysis and technological services namely, the development, testing, calibration, and application engineering of cold plasma surface-treatment systems for industrial use, technological consulting in the technology field of atmospheric-pressure plasma generation and its use for surface activation, cleaning, and modification, industrial analysis in the field of cold-plasma devices, nozzles, and process parameters for material processing, providing research laboratory services for evaluating surface properties treated with cold atmospheric plasma
86.
ADDITIVE MANUFACTURING METHOD WITH MODIFICATION OF PARTIAL LAYERS
The invention relates to an additive manufacturing method comprising the steps:
additive application of a layer of material (1), and
modifying a part of the applied material layer (1) in a property so that a partial layer (3) in the material layer (1) is structured, the partial layer (3) differing from the remaining material layer at least in the modified property. The invention also relates to a correspondingly manufactured component and a suitable manufacturing apparatus.
B22F 10/50 - Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up
B22F 10/60 - Treatment of workpieces or articles after build-up
B29C 64/188 - Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
In an embodiment balls include a ferrite material, wherein a diameter of the balls is 3 mm≤D≤15 mm, wherein a density of the respective ball is ≤4200 kg/m3, and wherein the density is ≥3000 kg/m3.
H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
88.
OPTICAL ARRANGEMENT AND METHOD FOR OPERATING AN OPTICAL ARRANGEMENT
The optical arrangement (1) comprises a radiation-permeable disc (2) and a piezoelectric excitation element (3). The excitation element (3) is arranged on a first main side (21) of the disc (2). The radiation-permeable disc (2) has a central region (4) and a border region (5) surrounding the central region. The excitation element (3) is configured to excite at least one rotationally symmetrical bending mode in the central region (4) of the radiation-permeable disc (2). The excitation element (3) is further configured to excite at least one non-rotationally-symmetrical bending mode in the border region (5) of the radiation-permeable disc (2), said bending mode generating a travelling wave in the border region (5).
G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
B08B 7/02 - Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
B60S 1/56 - Cleaning windscreens, windows, or optical devices specially adapted for cleaning other parts or devices than front windows or windscreens
89.
ASSEMBLY FOR ELECTRICAL CONDUCTION BETWEEN A PLATE AND A PIN
The present invention relates to a plate (1), which is electrically conductive, comprising a hole (2) surrounded by a neck (3) configured for insertion of an electrically conductive terminal and an assembly configured for electrical conduction between the plate (1) and a conductive pin (5), wherein the pin (5) is inserted into the hole (2) and electrically connected to the neck (3). The invention also relates to a corresponding manufacturing method.
H01R 4/10 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
90.
LASER DIODE ARRANGEMENT AND METHOD FOR MANUFACTURING A LASER DIODE ARRANGEMENT
A laser diode arrangement (1) comprises a laser diode chip (2) and a thin-film sensor element (3) for measuring a temperature, wherein the laser diode chip (2) is mounted on the sensor element (3).
In an embodiment a switching chamber for a switching device includes at least a switching chamber base having, on an inner side facing an interior of the switching chamber, a bottom surface with a web structure, which projects out of the bottom surface into the interior.
In an embodiment a method for manufacturing a coil includes providing a tube having a tube wall of an electrically conductive material, creating a gap in an inductive portion of the tube, and deforming a first part of the contact sections into at least one terminal region in each case, wherein a second part of the contact sections retains a shape of the tube wall and forms a connection region, the connection region electrically connecting the terminal region to the inductive portion.
The invention relates to a sensor element (100) for contactlessly measuring a temperature, the sensor element comprising - at least one carrier (2), - at least one first functional layer (7a) for contactlessly measuring the temperature of an object, and at least one second functional layer (7b) for contact-based measurement of an ambient temperature, - at least one upper electrode (50), wherein a first contact region (c1) is formed between the upper electrode (50) and one of the two functional layers (7a, 7b), - at least one lower electrode (40), wherein a second contact region (c2) is formed between the lower electrode (40) and the functional layer (7a, 7b) that is in contact with the upper electrode (50), wherein said functional layer (7a, 7b), the at least one upper electrode (50), and the at least one lower electrode (40) are designed and positioned such that a specific electrical resistance of the sensor element (100) is achieved. The invention also relates to the use of the sensor element (100).
G01J 5/06 - Arrangements for eliminating effects of disturbing radiationArrangements for compensating changes in sensitivity
G01J 5/20 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
G01J 5/70 - Passive compensation of pyrometer measurements, e.g. using ambient temperature sensing or sensing of temperature within housing
94.
SENSOR ELEMENT AND METHOD FOR PRODUCING A SENSOR ELEMENT
The invention relates to a sensor element (100) for contactlessly measuring a temperature, the sensor element comprising - at least one carrier (2) having an upper face (11) and a lower face (12), - an insulating layer (3) which is formed directly on the upper face (11) of the carrier (2), - at least a first functional layer (7a) for contactlessly measuring the temperature of an object and at least a second functional layer (7b) for the contact-based measurement of an ambient temperature, wherein each functional layer (7a, 7b) comprises a material with a temperature-dependent electrical resistance and the functional layers (7a, 7b) are arranged separately from one another on the carrier (2), - at least two electrodes (4) for electrically contacting the functional layers (7a, 7b), - at least two contact pads (10) for electrically contacting the sensor element (100), wherein each one of the contact pads (10) is arranged directly on a respective partial area of one of the electrodes (4), wherein the sensor element (100) is designed to be directly integrated, as a discrete component, into an electrical system. The invention also relates to a method for producing a sensor element (100).
G01J 5/06 - Arrangements for eliminating effects of disturbing radiationArrangements for compensating changes in sensitivity
G01J 5/20 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
G01J 5/70 - Passive compensation of pyrometer measurements, e.g. using ambient temperature sensing or sensing of temperature within housing
95.
NTC COMPOSITION, THERMISTOR, MULTILAYER THERMISTOR, MULTILAYER THIN-FILM THERMISTOR, USE OF A FORMULA FOR DETERMINING MATERIAL PROPERTIES AND FOR MATERIAL OPTIMISATION, AND METHOD FOR MATERIAL PROPERTY OPTIMISATION OF NTCS IN CERAMICS
C04B 35/01 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides
C04B 35/44 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on aluminates
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
The present invention relates to a package comprising a substrate (11) and a MEMS chip (1), the MEMS chip (1) being attached to the substrate (11). A further aspect of the invention relates to a method for producing a package.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
97.
MICROELECTROMECHANICAL MIRROR, METHOD FOR OPERATING A MICROELECTROMECHANICAL MIRROR, PROJECTION DEVICE AND METHOD FOR PRODUCING A MICROMECHANICAL MIRROR
The invention relates to a microelectromechanical mirror (1) which comprises a mirror element (2) with a planar top side (21) and an underside (22) arranged opposite the planar top side (21), with the mirror element (2) comprising a support structure (4) arranged on the underside (22) of the mirror element (2). Further aspects relate to a method for operating a microelectromechanical mirror, a projection device and a method for producing a micromechanical mirror.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
98.
MICROELECTROMECHANICAL MIRROR, METHOD FOR PRODUCING A MICROELECTROMECHANICAL MIRROR, METHOD FOR OPERATING A MICROELECTROMECHANICAL MIRROR, PROJECTION APPARATUS, AND USE OF A MICROELECTROMECHANICAL MIRROR
The invention relates to a microelectromechanical mirror (1) comprising: - a mirror element (2); and - at least one tuning element (7), which is designed for adjusting at least one resonant frequency of the mirror element (2). The invention also relates to: a method for producing a microelectromechanical mirror; a method for operating a microelectromechanical mirror; a projection apparatus; and the use of a microelectromechanical mirror.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
In an embodiment a piezoelectric component includes a piezoelectric layer having a polycrystalline piezoelectric ceramic material with a coercive field strength of at least 1.8 kV/mm and a carrier element to which the piezoelectric layer is arranged and with which the piezoelectric layer is mechanically coupled.
C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
C04B 35/468 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
H10N 30/097 - Forming inorganic materials by sintering
100.
SENSOR SYSTEM, METHOD FOR ANALYZING AN INTERACTION WITH A SURFACE BY MACHINE-LEARNING, METHOD FOR GENERATING A TRAINING DATA SET AND COMPUTER PROGRAM PRODUCT
A sensor system (1) comprises one or more sensor elements (2) for providing data in response to an interaction (13) with a surface (4) of a surface element (3), wherein the system (1) is configured for analyzing the data by a machine-learning classification model and/or a machine-learning localization algorithm.
G01L 5/00 - Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
G01L 5/167 - Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using piezoelectric means
