A chuck includes a chuck surface, a plurality of vacuum ports being distributed over the chuck surface. Each of the vacuum ports is open to a conduit that is connectable to a suction source that is operable to apply suction to that vacuum port. A flow restrictor is located within each conduit and is characterized by a flow resistance. The flow resistance of the flow restrictor in at least one conduit is less than the flow resistance of the flow restrictor in at least one other conduit.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B23B 31/30 - Chucks characterised by features relating primarily to remote control of the gripping means using fluid-pressure means in the chuck
B25B 11/00 - Work holders or positioners not covered by groups , e.g. magnetic work holders, vacuum work holders
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
2.
CONFIGURABLE CHUCK APPARATUS FOR CHEMICAL MECHANICAL PLANARIZATION AND COOPERATING RING
A chuck and a method for chemical mechanical planarization processing that provides different pressure levels at different radii of the chuck's bottom surface. Embodiments may include a vacuum ring that keeps a workpiece attached to the chuck bottom surface without touching it and a chuck ring that cooperates with the chuck for removing excess material during processing.
B24B 49/16 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
B24B 57/02 - Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
B24B 41/06 - Work supports, e.g. adjustable steadies
B23B 31/30 - Chucks characterised by features relating primarily to remote control of the gripping means using fluid-pressure means in the chuck
A chuck and a method for chemical and mechanical planarization processing that provides different pressure levels at different radii of the chuck's bottom surface. The chuck may include a vacuum ring that keeps a workpiece attached to the chuck bottom surface without touching it and a chuck ring that cooperates with the chuck for removing excess material during processing.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
4.
CHUCK FOR ACQUIRING A WARPED WORKPIECE BY AMPLIFIED SUCTION
A chuck for holding a workpiece, includes one or more first compartments, each defining a first space and having a wall that forms a chuck surface with a plurality of vacuum ports on the chuck surface; a second compartment defining a second space for temporarily maintaining vacuum; one or a plurality of conduits fluidically connecting between the second compartment and each of the one or a plurality of first compartments, each of the conduits having a valve which when opens allows flow through that conduit and when closed prevents flow through that conduit; and a controller, for controlling the valves, wherein vacuum within the second compartment when the valve of each of said one or more conduits is closed is used on the vacuum ports when the valve of each of said one or more conduits is opened.
A chuck includes a chuck surface and extendible port assemblies that are distributed over the chuck surface. Each extendible port assembly includes a conduit that is connectable to a suction source and a tube that distally extends from the chuck surface, whose distal end forms a seal when in contact with a workpiece, and is collapsible by suction that is applied by the suction source after formation of the seal. A plurality of non-extendible vacuum ports are interspersed with the extendible port assemblies. At least one areal seal extends from the chuck surface and bounds a region of the chuck surface that includes at least one of the non-extendible vacuum ports, and that is configured to form an airtight seal when the areal seal is in contact with the workpiece.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
B65H 3/08 - Separating articles from piles using pneumatic force
A chuck includes a chuck surface, a plurality of vacuum ports being distributed over the chuck surface. Each of the vacuum ports is open to a conduit that is connectable to a suction source that is operable to apply suction to that vacuum port. A flow restrictor is located within each conduit and is characterized by a flow resistance. The flow resistance of the flow restrictor in at least one conduit is less than the flow resistance of the flow restrictor in at least one other conduit.
A chuck includes a chuck surface, a plurality of vacuum ports being distributed over the chuck surface. Each of the vacuum ports is open to a conduit that is connectable to a suction source that is operable to apply suction to that vacuum port. A flow restrictor is located within each conduit and is characterized by a flow resistance. The flow resistance of the flow restrictor in at least one conduit is less than the flow resistance of the flow restrictor in at least one other conduit.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B23B 31/30 - Chucks characterised by features relating primarily to remote control of the gripping means using fluid-pressure means in the chuck
F25B 9/14 - Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
A chuck includes a chuck surface, a plurality of vacuum ports being distributed over the chuck surface. Each of the vacuum ports is open to a conduit that is connectable to a suction source that is operable to apply suction to that vacuum port. A flow restrictor is located within each conduit and is characterized by a flow resistance. The flow resistance of the flow restrictor in at least one conduit is less than the flow resistance of the flow restrictor in at least one other conduit.
B23B 31/30 - Chucks characterised by features relating primarily to remote control of the gripping means using fluid-pressure means in the chuck
B23Q 3/08 - Work-clamping means other than mechanically-actuated
B25B 11/00 - Work holders or positioners not covered by groups , e.g. magnetic work holders, vacuum work holders
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A gripper to grip a workpiece includes a body with a flat gripper surface. The gripper surface includes a plurality of openings that are distributed over the gripper surface, each of the openings connectable to a source of suction. At least one flow restrictor is located between the plurality of openings and a connector of the gripper to the source of suction to restrict the inflow through each opening of the plurality of openings. When the suction is applied to the plurality of openings and a part of the workpiece surface covers at least one opening of the plurality of openings and another of the openings remains uncovered, the suction force at the covered opening is sufficiently strong to grip the workpiece surface.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
A wafer positioning device includes at least one fixed stop that is positioned at a periphery of a clamped position on a surface of a chuck and an extendible finger. A finger extension mechanism extends the finger outward toward a center of the chuck surface, and retracts the finger away from the center of the chuck surface. The finger is configured, when a wafer is placed on the chuck surface and the finger extension mechanism is operated to extend the finger outward, to push the wafer laterally toward the fixed stop until an edge of the wafer contacts the fixed stop when a distal end of the finger is at the periphery of the clamped position.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
11.
Fluid flow web tension device for roll-to-roll processing
A web tension device includes a pressure source and a stationary housing. A translatable unit is translatable into and out of a cavity of the housing and includes an inlet that is connectable to the pressure source. A distal end of the translatable unit includes a tensioning surface with openings to enable outflow of pressurized fluid to apply a pushing force to a web in a roll-to-roll process. Proximal openings enable outflow of the fluid into a gap between the housing and the translatable unit. When tension of the web is reduced, an outward force that is exerted by pressure in the gap pushes the translatable unit outward, pushing the web outward until an inward force that is exerted by the web balances the outward force. When tension of the web increases, the inward force pushes the translatable unit inward until the inward force is balanced by the outward force.
Methods of coating an aluminum object, comprising: anodizing a portion of a surface of the aluminum object to form an anodized layer, introducing nano tubes into pores in the anodized layer using an ultrasonic bath; and sealing the anodized layer thereby producing a coated aluminum object.
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
C23C 14/04 - Coating on selected surface areas, e.g. using masks
C25D 15/00 - Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
H01B 1/18 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
Methods and systems for determination of warpage in a workpiece supported by a non-contact support platform, including a surface with a plurality of pressure ports and a plurality of fluid evacuation ports on the surface, a supply system with a pressure supply connected to the plurality of pressure ports on the surface and configured to supply pressure at a substantially constant level and cause a fluid to flow out of the plurality of pressure ports, so as to support a workpiece by fluid-bearing formed under the workpiece, and at least one flowmeter, coupled to a controller and configured to measure the flowrate at the surface, wherein the workpiece is determined to be warped when the measured flowrate is outside a predefined flowrate range.
G01B 21/20 - Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring contours or curvatures, e.g. determining profile
G01B 11/24 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
G01B 11/30 - Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
14.
System and method of measuring warpage of a workpiece on a noncontact support platform
Methods and systems for determination of warpage in a workpiece supported by a non-contact support platform, including a surface with a plurality of pressure ports and a plurality of fluid evacuation ports on the surface, a supply system with a pressure supply connected to the plurality of pressure ports on the surface and configured to supply pressure at a substantially constant level and cause a fluid to flow out of the plurality of pressure ports, so as to support a workpiece by fluid-bearing formed under the workpiece, and at least one flowmeter, coupled to a controller and configured to measure the flowrate at the surface, wherein the workpiece is determined to be warped when the measured flowrate is outside a predefined flowrate range.
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
B65G 43/00 - Control devices, e.g. for safety, warning or fault-correcting
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
15.
Non-contact support platform with open-loop control
A non-contact support platform with open-loop control, including: a surface, to support a workpiece by fluid-bearing of fluid flowing through a plurality of nozzles, a supply system, connected to the surface and configured to maintain the fluid-bearing by applying pressure to cause flow of the fluid out of a subset of the plurality of nozzles, and a controller, to control fluid flow in the supply system with an open-loop circuit to support the workpiece while it moves over the non-contact support platform, wherein the fluid flow is controlled based on at least parameter of a group of workpiece parameters consisting of a position of the workpiece, dimensions of the workpiece and a velocity of the workpiece while supported by the surface.
B65G 43/08 - Control devices operated by article or material being fed, conveyed, or discharged
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
G05D 7/06 - Control of flow characterised by the use of electric means
A gripper to grip a workpiece includes a body with a flat gripper surface. The gripper surface includes a plurality of openings that are distributed over the gripper surface, each of the openings connectable to a source of suction. At least one flow restrictor is located between the plurality of openings and a connector of the gripper to the source of suction to restrict the inflow through each opening of the plurality of openings. When the suction is applied to the plurality of openings and a part of the workpiece surface covers at least one opening of the plurality of openings and another of the openings remains uncovered, the suction force at the covered opening is sufficiently strong to grip the workpiece surface.
A web tension device includes a pressure source and a stationary housing. A translatable unit is translatable into and out of a cavity of the housing and includes an inlet that is connectable to the pressure source. A distal end of the translatable unit includes a tensioning surface with openings to enable outflow of pressurized fluid to apply a pushing force to a web in a roll-to-roll process. Proximal openings enable outflow of the fluid into a gap between the housing and the translatable unit. When tension of the web is reduced, an outward force that is exerted by pressure in the gap pushes the translatable unit outward, pushing the web outward until an inward force that is exerted by the web balances the outward force. When tension of the web increases, the inward force pushes the translatable unit inward until the inward force is balanced by the outward force.
A wafer positioning device includes at least one fixed stop that is positioned at a periphery of a clamped position on a surface of a chuck and an extendible finger. A finger extension mechanism extends the finger outward toward a center of the chuck surface, and retracts the finger away from the center of the chuck surface. The finger is configured, when a wafer is placed on the chuck surface and the finger extension mechanism is operated to extend the finger outward, to push the wafer laterally toward the fixed stop until an edge of the wafer contacts the fixed stop when a distal end of the finger is at the periphery of the clamped position.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A noncontact support platform system is configured to support a workpiece and includes pressure ports and vacuum ports that are interspersed on a top surface of a table. The ports are arranged along columns such that a pressure port alternates with a vacuum port along each column. The columns include at least one longitudinal column that is oriented substantially parallel to a direction of motion of the workpiece. Mutually parallel rotated columns are each oriented at an oblique angle to the direction of motion. At least one transition column is located between a longitudinal column and its proximal rotated column and has an orientation that is intermediate between the two columns that are adjacent to that transition column. Each vacuum port and pressure port is located at an intersection of a column with a row that is oriented substantially perpendicular to the direction of motion.
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
A noncontact support platform system is configured to support a workpiece and includes pressure ports and vacuum ports that are interspersed on a top surface of a table. The ports are arranged along columns such that a pressure port alternates with a vacuum port along each column. The columns include at least one longitudinal column that is oriented substantially parallel to a direction of motion of the workpiece. Mutually parallel rotated columns are each oriented at an oblique angle to the direction of motion. At least one transition column is located between a longitudinal column and its proximal rotated column and has an orientation that is intermediate between the two columns that are adjacent to that transition column. Each vacuum port and pressure port is located at an intersection of a column with a row that is oriented substantially perpendicular to the direction of motion.
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
21.
NON-CONTACT SUPPORT PLATFORM WITH OPEN-LOOP CONTROL
A non-contact support platform with open-loop control, including: a surface, to support a workpiece by fluid-bearing of fluid flowing through a plurality of nozzles, a supply system, connected to the surface and configured to maintain the fluid-bearing by applying pressure to cause flow of the fluid out of a subset of the plurality of nozzles, and a controller, to control fluid flow in the supply system with an open-loop circuit to support the workpiece while it moves over the non-contact support platform, wherein the fluid flow is controlled based on at least parameter of a group of workpiece parameters consisting of a position of the workpiece, dimensions of the workpiece and a velocity of the workpiece while supported by the surface.
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
22.
Noncontact support platform with blockage detection
A noncontact support platform includes a plurality of pressure nozzles on an outer surface of a PV stage of the noncontact support platform. The pressure nozzles connected to a pressure source for creating an outflow of fluid through the pressure nozzles. A plurality of vacuum nozzles are interspersed with the pressure nozzles on the outer surface and are connected to a vacuum manifold via one or a plurality of hoses to create an inflow of the fluid through the vacuum nozzles. At least one flowmeter is configured to generate a signal that is indicative of a measured inflow via at least one hose of the hoses. A controller is configured to analyze the signal to determine whether the measured inflow is indicative of blockage of a vacuum nozzle and to generate a response when blockage is indicated.
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
B25B 11/00 - Work holders or positioners not covered by groups , e.g. magnetic work holders, vacuum work holders
A noncontact support platform includes pressure ports distributed on a surface of a table, each connected to a pressure source. Vacuum ports are distributed on the surface of the table, each connected to a vacuum source. Outward flow through the pressure ports and inward flow through the vacuum ports form a fluid cushion to support a workpiece at a nonzero distance from the table. A plurality of channels each connect at least two of the vacuum ports to enable flow of fluid between the connected vacuum ports. When one of the connected vacuum ports is covered by an edge of the workpiece and the other is not, a suction force that is exerted by the connected vacuum ports on the edge is weaker than the suction force that is exerted on a part of the workpiece where both of the connected vacuum ports are covered.
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A noncontact support system includes a table with a port layer having a pattern of interspersed pressure ports and vacuum ports. A pressure conduit layer includes a grid pattern of pressure conduits, connectable to a pressure source, each of the pressure ports being located on an axis passing through an intersection of at least two of the pressure conduits and substantially orthogonal to the grid pattern of pressure conduits. A vacuum conduit layer includes a grid pattern of vacuum conduits, connectable to a suction source, each of the vacuum ports being located on an axis passing through an intersection of at least two of the vacuum conduits and substantially orthogonal to the grid pattern of vacuum conduits. The grid pattern of vacuum conduits is laterally offset from the grid pattern of pressure conduits such that each intersection of pressure conduits is laterally offset from all intersections of the vacuum conduits.
B65G 47/00 - Article or material-handling devices associated with conveyorsMethods employing such devices
B65G 49/00 - Conveying systems characterised by their application for specified purposes not otherwise provided for
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
B65G 51/10 - Controlling or conditioning the operating medium at section junctions of pneumatic systems
A noncontact support system includes a table with a port layer having a pattern of interspersed pressure ports and vacuum ports. A pressure conduit layer includes a grid pattern of pressure conduits, connectable to a pressure source, each of the pressure ports being located on an axis passing through an intersection of at least two of the pressure conduits and substantially orthogonal to the grid pattern of pressure conduits. A vacuum conduit layer includes a grid pattern of vacuum conduits, connectable to a suction source, each of the vacuum ports being located on an axis passing through an intersection of at least two of the vacuum conduits and substantially orthogonal to the grid pattern of vacuum conduits. The grid pattern of vacuum conduits is laterally offset from the grid pattern of pressure conduits such that each intersection of pressure conduits is laterally offset from all intersections of the vacuum conduits.
A vacuum wheel for transporting a substrate includes a fixed conduit that is connectable to a suction source. A vacuum surface on a circumference of the vacuum wheel includes vacuum openings that are distributed around the circumference, such that rotation of the wheel causes the vacuum openings to successively fluidically connect to the fixed conduit. When suction is applied to the fixed conduit, suction is applied to one or more of the vacuum openings that are currently fluidically connected to the fixed conduit. At least one contact surface on the circumference of the vacuum wheel is adjacent to, and extends outward beyond, the vacuum surface. When suction is applied to the vacuum openings, the substrate is drawn toward the vacuum surface so as to contact the contact surface without contacting the vacuum surface, creating a friction force that enables transport of the substrate when the wheel rotates.
B65G 47/84 - Star-shaped wheels or devices having endless travelling belts or chains, the wheels or devices being equipped with article-engaging elements
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
27.
Vacuum wheel with separate contact and vacuum surfaces
A vacuum wheel for transporting a substrate includes a fixed conduit that is connectable to a suction source. A vacuum surface on a circumference of the vacuum wheel includes vacuum openings that are distributed around the circumference, such that rotation of the wheel causes the vacuum openings to successively fluidically connect to the fixed conduit. When suction is applied to the fixed conduit, suction is applied to one or more of the vacuum openings that are currently fluidically connected to the fixed conduit. At least one contact surface on the circumference of the vacuum wheel is adjacent to, and extends outward beyond, the vacuum surface. When suction is applied to the vacuum openings, the substrate is drawn toward the vacuum surface so as to contact the contact surface without contacting the vacuum surface, creating a friction force that enables transport of the substrate when the wheel rotates.
A noncontact support platform includes a plurality of pressure nozzles on an outer surface of a PV stage of the noncontact support platform. The pressure nozzles connected to a pressure source for creating an outflow of fluid through the pressure nozzles. A plurality of vacuum nozzles are interspersed with the pressure nozzles on the outer surface and are connected to a vacuum manifold via one or a plurality of hoses to create an inflow of the fluid through the vacuum nozzles. At least one flowmeter is configured to generate a signal that is indicative of a measured inflow via at least one hose of the hoses. A controller is configured to analyze the signal to determine whether the measured inflow is indicative of blockage of a vacuum nozzle and to generate a response when blockage is indicated.
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
B65G 49/00 - Conveying systems characterised by their application for specified purposes not otherwise provided for
29.
Noncontact support platform with blockage detection
A noncontact support platform includes a plurality of pressure nozzles on an outer surface of a PV stage of the noncontact support platform. The pressure nozzles connected to a pressure source for creating an outflow of fluid through the pressure nozzles. A plurality of vacuum nozzles are interspersed with the pressure nozzles on the outer surface and are connected to a vacuum manifold via one or a plurality of hoses to create an inflow of the fluid through the vacuum nozzles. At least one flowmeter is configured to generate a signal that is indicative of a measured inflow via at least one hose of the hoses. A controller is configured to analyze the signal to determine whether the measured inflow is indicative of blockage of a vacuum nozzle and to generate a response when blockage is indicated.
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
A noncontact support platform includes pressure ports distributed on a surface of a table, each connected to a pressure source. Vacuum ports are distributed on the surface of the table, each connected to a vacuum source. Outward flow through the pressure ports and inward flow through the vacuum ports form a fluid cushion to support a workpiece at a nonzero distance from the table. A plurality of channels each connect at least two of the vacuum ports to enable flow of fluid between the connected vacuum ports. When one of the connected vacuum ports is covered by an edge of the workpiece and the other is not, a suction force that is exerted by the connected vacuum ports on the edge is weaker than the suction force that is exerted on a part of the workpiece where both of the connected vacuum ports are covered.
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A system for conveying a substrate includes a noncontact support platform for supporting the substrate. A vacuum wheel is located adjacent to the support platform. A rim of the vacuum wheel includes perforations that open between an exterior of the rim and an interior of the vacuum wheel. A fixed suction surface is interior to the vacuum wheel and includes an opening of a conduit that is connectable to a suction source. A chamber is formed by the suction surface, walls of the vacuum wheel, and a section of the peripheral rim that is adjacent to the suction surface and that extends outward from the support platform. When suction is applied to the conduit, the suction is applied via the chamber to the perforations in the rim section so as to exert a pull on the substrate toward the rim such that rotation of the vacuum wheel conveys the substrate.
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
A system for conveying a substrate includes a noncontact support platform for supporting the substrate. A vacuum wheel is located adjacent to the support platform. A rim of the vacuum wheel includes perforations that open between an exterior of the rim and an interior of the vacuum wheel. A fixed suction surface is interior to the vacuum wheel and includes an opening of a conduit that is connectable to a suction source. A chamber is formed by the suction surface, walls of the vacuum wheel, and a section of the peripheral rim that is adjacent to the suction surface and that extends outward from the support platform. When suction is applied to the conduit, the suction is applied via the chamber to the perforations in the rim section so as to exert a pull on the substrate toward the rim such that rotation of the vacuum wheel conveys the substrate.
B65G 47/84 - Star-shaped wheels or devices having endless travelling belts or chains, the wheels or devices being equipped with article-engaging elements
B65G 51/03 - Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A wafer transport system includes a substantially horizontal non-contact support platform for supporting a wafer substantially horizontally at a substantially fixed vertical distance from the platform. A wafer gripping device includes wafer grippers to grip a surface of the wafer that is opposite the non-contact support platform. Each of the wafer grippers is mounted on a vertically flexible holder to enable the wafer gripper to adapt to a height of the wafer above the wafer gripping device while maintaining a substantial horizontal rigidity of the vertically flexible holder so as to prevent horizontal motion of the wafer relative to the wafer gripping device.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
An apparatus for separating a front wafer from a stack of wafers is disclosed. The apparatus includes a chuck for gripping the front wafer, coupled to a mechanical arm and rotatable about at least one axis with respect to the arm, so as to allow the chuck to align substantially parallel to the front wafer. A fixing mechanism is provided for fixing the chuck in a desired orientation. The apparatus also includes a drive for moving the arm in at least in two directions, one direction to bring the chuck to the front wafer and in another direction substantially parallel to the fixed orientation of the chuck to separate the wafer from the stack of wafers. A stopper mechanism is provided for preventing other wafers from separating from the stack while the front wafer is being separated.
An apparatus for separating a front wafer from a stack of wafers with internal gaps between the wafers is disclosed. The apparatus includes a chuck for gripping the front wafer, coupled to a mechanical arm and a drive for moving the arm to bring the chuck to the front wafer and to separate the wafer from the stack of wafers. Further included is a heater for heating the front wafer so as to raise the temperature within the internal gap between the front wafer and the adjacent wafer of the stack of wafers above the temperature of more distant internal gaps within the stack.
A non-contact support platform system is provided for supporting a substantially flat object. The system includes a platform with a first plurality of pressure ports and a first plurality of vacuum ports for inducing a fluid cushion to support the object at a distance from the platform. The system further includes a second plurality of pressure ports located at a predetermined zone of the platform for increasing the distance of the object from the platform at the predetermined zone.
patents
