Improved conductive ink compositions and methods of making and using the conductive ink compositions are provided. The improved conductive ink compositions include a silver complex formed by mixing a silver carboxylate, specifically a silver decanoate isomer, and at least one dissolving agent, in particular where the at least one dissolving agent comprises a terpene, a terpenoid, or a combination thereof. The silver carboxylate of the subject ink compositions is decarboxylated at a temperature of 250 °C or less. The conductive ink compositions preferably further comprise a non-acid stabilizer and optionally further comprise an acid stabilizer and/or an adhesion promoter. Methods of making conductive structures, including methods wherein the disclosed compositions are applied to a suitable substrate by various techniques, are also provided.
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
C09D 11/36 - Inkjet printing inks based on non-aqueous solvents
C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of metallic material
Disclosed herein are ink compositions for making a conductive palladium structure. For example, the ink composition can comprise a palladium salt and a complex of a complexing agent and a short chain carboxylic acid or salt thereof. In some embodiments, a second or third metal salt is included in the compositions. Also disclosed herein are methods for making and using such conductive ink compositions.
C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of metallic material
4.
PLATINUM INK COMPOSITIONS AND METHODS FOR LOW TEMPERATURE CONDUCTIVE COATING
Conductive metal-organic decomposition (MOD) ink compositions comprising platinum are provided. Also provided are methods of preparing the conductive ink compositions, methods of forming conductive structures from the conductive ink compositions, and conductive structures formed from the conductive ink compositions, including dense conductive platinum films. The conductive ink compositions preferably comprise a platinum metal, a first bidentate complexing agent, and a solvent. Conductive platinum films can be formed from the ink compositions at low temperatures and are therefore suitable for use on a variety of substrates, including substrates of choice for electronic applications.
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H05K 1/09 - Use of materials for the metallic pattern
Conductive ink compositions comprising gold complexes are provided. Also provided are methods of preparing the conductive ink compositions, methods of forming conductive structures from the conductive ink compositions, and structures formed from the conductive ink compositions. The conductive ink compositions preferably comprise a gold metal, an organophosphite ligand, and a solvent and are preferably particle-free. The conductive ink compositions can be used to form conductive structures comprising gold, for example by inkjet or other printing methods, at temperatures of 400 °C or less. Such conductive structures can be formed on a variety of substrates.
Conductive ink compositions comprising gold complexes are provided. Also provided are methods of preparing the conductive ink compositions, methods of forming conductive structures from the conductive ink compositions, and structures formed from the conductive ink compositions. The conductive ink compositions preferably comprise a gold metal, an alkylamine ligand, and a solvent. The conductive ink compositions can be used to form conductive structures comprising gold, for example by inkjet or other printing methods, at temperatures of 300 °C or less. Such conductive structures can be formed on a variety of substrates.
Improved conductive ink compositions are provided. The improved conductive ink compositions include a silver complex formed by mixing a silver carboxylate, specifically a silver decanoate isomer, and at least one dissolving agent, in particular where the at least one dissolving agent comprises a terpene, a terpenoid; or a combination thereof. The silver carboxylate of the subject ink compositions is decarboxylated at a temperature of 250 °C or less, optionally in the presence of an adhesion promoter and/or an acid stabilizer, to form a conductive structure. Methods of making conductive structures, including methods wherein the disclosed compositions are applied to a substrate by various techniques, are also provided.
C23C 18/02 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H05K 1/09 - Use of materials for the metallic pattern
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of metallic material
9.
Copper based conductive ink composition and method of making the same
Disclosed herein are ink compositions for making a conductive copper structure. The ink composition comprise a copper metal precursor compound, a chelating agent, and a reducing agent. In some embodiments, the redox potential of the reducing agent is adjusted for controlled reduction of copper ion in the copper metal precursor to metal copper metal. Also disclosed herein are methods for making the ink compositions and methods for using the same.
A conductive structure is provided. The conductive ink composition includes a silver complex formed by mixing a silver carboxylate, at least one dissolving agent that dissolves the silver carboxylate, and a catalyst. The catalyst includes an amine that decarboxylates the silver carboxylate to make the conductive ink composition. The catalyst decarboxylates the silver carboxylate at a temperature of 100° C. or less. An ink composition comprising a metallic salt with a sterically bulky counter ion and a ligand is also provided. An ink composition for making a conductive structure, comprising a reducible metal complex formed by mixing: a reducing agent, wherein the reducing agent is dissolved in a dissolving agent; and at least one metal salt or metal complex comprising a Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal, wherein the reducing agent reduces the metal to forms the conductive structure is further provided.
C23C 18/06 - Coating on selected surface areas, e.g. using masks
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of metallic material
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
Disclosed herein are ink compositions for making a conductive palladium structure. For example, the ink composition can comprise a palladium salt and a complex of a complexing agent and a short chain carboxylic acid or salt thereof. In some embodiments, a second or third metal salt is included in the compositions. Also disclosed herein are methods for making and using such conductive ink compositions.
C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of metallic material
09 - Scientific and electric apparatus and instruments
Goods & Services
Electrically conductive films for use in the further
manufacture of display screens for computers, mobile phones,
tablets, televisions and other electronic devices (term
considered too vague by the International Bureau - Rule 13
(2) (b) of the Regulations).
15.
CONDUCTIVE MATERIALS AND THEIR METHODS OF PREPARATION BY METALLIZATION WITH METAL COMPLEX CONDUCTIVE INK COMPOSITIONS
This disclosure provides electrically conductive materials, including electrically conductive textile materials, such as woven or knitted fabric textiles, individual fibers, and woven fibers and yarns. The conductive materials comprise a substrate material, such as a textile or other suitable material, and a metal embedded in the substrate material, in particular where the metal is embedded into and below the surface of the material. Also provided are methods of making the electrically conductive materials.
Provided is an electrically conductive cloth which does not undergo the increase in an electrical resistance value when the cloth is stretched. An electrically conductive woven/knitted material of the present disclosure has an electrically conductive portion that comprises a multifilament yarn and is made electrically conductive by a metal, wherein the metal is held mainly among single yarns constituting the multifilament yarn in the electrically conductive portion. The amount of the metal held may be 0.40 to 35.0 g/m2 relative to the area of the electrically conductive portion. The metal may be silver, copper, gold, aluminum, nickel, iron, stainless-steel, or a combination thereof.
D03D 15/20 - Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
D04B 1/14 - Other fabrics or articles characterised primarily by the use of particular thread materials
A particle-free gold-complex based ink is described wherein a gold carboxylate is complexed with an amine. Upon heating the solution, the gold cation catalyzes the oxidative amidation of the amine with the carboxylate to form a short chain or polymeric amide while simultaneously reducing the gold cation to metallic gold. This method is extremely versatile and allows for both the preparation of pure metallic gold films as well as polymer gold composites with unique properties.
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
This disclosure provides electrically conductive materials, including electrically conductive textile materials, such as woven or knitted fabric textiles, individual fibers, and woven fibers and yarns. The conductive materials comprise a substrate material, such as a textile or other suitable material, and a metal embedded in the substrate material, in particular where the metal is embedded into and below the surface of the material. Also provided are methods of making the electrically conductive materials.
D06M 11/83 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with metalsTreating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with metal-generating compounds, e.g. metal carbonylsReduction of metal compounds on textiles
H01B 1/20 - Conductive material dispersed in non-conductive organic material
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
19.
Copper based conductive ink composition and method of making the same
Disclosed herein are ink compositions for making a conductive copper structure. The ink composition comprise a copper metal precursor compound, a chelating agent, and a reducing agent. In some embodiments, the redox potential of the reducing agent is adjusted for controlled reduction of copper ion in the copper metal precursor to metal copper metal. Also disclosed herein are methods for making the ink compositions and methods for using the same.
C09D 11/36 - Inkjet printing inks based on non-aqueous solvents
C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
C09D 1/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
A conductive structure is provided. The conductive ink composition includes a silver complex formed by mixing a silver carboxylate, at least one dissolving agent that dissolves the silver carboxylate, and a catalyst. The catalyst includes an amine that decarboxylates the silver carboxylate to make the conductive ink composition. The catalyst decarboxylates the silver carboxylate at a temperature of 100° C. or less. An ink composition comprising a metallic salt with a sterically bulky counter ion and a ligand is also provided. An ink composition for milking a conductive structure, comprising a reducible metal complex formed by mixing: a reducing agent, wherein the reducing agent is dissolved in a dissolving agent; and at least one metal salt or metal complex comprising a Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal, wherein the reducing agent reduces the metal to form the conductive structures farther provided.
C23C 18/06 - Coating on selected surface areas, e.g. using masks
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of metallic material
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H05K 1/09 - Use of materials for the metallic pattern
C09D 1/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
A particle-free gold-complex based ink is described wherein a gold carboxylate is complexed with an amine. Upon heating the solution, the gold cation catalyzes the oxidative amidation of the amine with the carboxylate to form a short chain or polymeric amide while simultaneously reducing the gold cation to metallic gold. This method is extremely versatile and allows for both the preparation of pure metallic gold films as well as polymer gold composites with unique properties.
Disclosed herein are ink compositions for making a conductive palladium structure. For example, the ink composition can comprise a palladium salt and a complex of a complexing agent and a short chain carboxylic acid or salt thereof. In some embodiments, a second or third metal salt is included in the compositions. Also disclosed herein are methods for making and using such conductive ink compositions.
Disclosed herein are ink compositions for making a conductive copper structure. The ink composition comprise a copper metal precursor compound, a chelating agent, and a reducing agent. In some embodiments, the redox potential of the reducing agent is adjusted for controlled reduction of copper ion in the copper metal precursor to metal copper metal. Also disclosed herein are methods for making the ink compositions and methods for using the same.
A conductive structure is provided. The conductive ink composition includes a silver complex formed by mixing a silver carboxylate, at least one dissolving agent that dissolves the silver carboxylate, and a catalyst. The catalyst includes an amine that decarboxylates the silver carboxylate to make the conductive ink composition. The catalyst decarboxylates the silver carboxylate at a temperature of 100° C. or less. An ink composition comprising a metallic salt with a sterically bulky counter ion and a ligand is also provided. An ink composition for making a conductive structure, comprising a reducible metal complex formed by mixing: a reducing agent, wherein the reducing agent is dissolved in a dissolving agent; and at least one metal salt or metal complex comprising a Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal, wherein the reducing agent reduces the metal to form the conductive structure is further provided.
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of metallic material
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
C23C 18/06 - Coating on selected surface areas, e.g. using masks
The present invention provides an ink composition. The composition comprises a metal ion and a ligand. The ink composition is in a form of solid at a temperature of less than about 30° C. and in a form of liquid at temperature of above about 40 to about 80° C.
A conductive structure is provided. The conductive ink composition includes a silver complex formed by mixing a silver carboxylate, at least one dissolving agent that dissolves the silver carboxylate, and a catalyst. The catalyst includes an amine that decarboxylates the silver carboxylate to make the conductive ink composition. The catalyst decarboxylates the silver carboxylate at a temperature of 100 °C or less. An ink composition comprising a metallic salt with a sterically bulky counter ion and a ligand is also provided. An ink composition for making a conductive structure, comprising a reducible metal complex formed by mixing: a reducing agent, wherein the reducing agent is dissolved in a dissolving agent; and at least one metal salt or metal complex comprising a Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal, wherein the reducing agent reduces the metal to form the conductive structure is further provided.
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
4), is then mixed with the metal/amine complex through titration or through a continuous flow process. The resulting nanoparticles are then precipitated through the addition of methanol and centrifugation and decanted. The decanted nanoparticles can then be suspended in a solvent for storage.
B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
